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BCW66H

BCW66H

  • 厂商:

    MCC(美微科)

  • 封装:

  • 描述:

    BCW66H - NPN Small Signal Transistor 330mW - Micro Commercial Components

  • 详情介绍
  • 数据手册
  • 价格&库存
BCW66H 数据手册
MCC Features   omponents 21201 Itasca Street Chatsworth    !"# $ %    !"# BCW66H NPN Small Signal Transistor 330mW SOT-23 A D l Ideally Suited for Automatic Insertion l 150oC Junction Temperature l Low Current, Low Voltage l Epitaxial Planar Die Construction Mechanical Data l Case: SOT-23, Molded Plastic l Terminals: Solderable per MIL-STD-202, Method 208 l Marking: EH l Weight: 0.008 grams ( approx.) Maximum Ratings @ 25oC Unless Otherwise Specified F E C B Charateristic Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current(DC) Peak Collector Current Base Current(DC) Peak Base Current Power Dissipation@T s=79oC Thermal Resistance, Junction to Ambient Air Thermal Resistance, Junction to Soldering Point Operating & Storage Temperature Symbol VCEO VCBO VEBO IC ICM IB IBM Pd RθJA RθJS Value 45 75 5 800 1000 100 200 330 285(1) 215 Unit V V V mA mA mA mA mW o DIM A B C D E F G H J K INCHES MIN .110 .083 .047 .035 .070 .018 .0005 .035 .003 .015 G H J K DIMENSIONS MM MIN 2.80 2.10 1.20 .89 1.78 .45 .013 .89 .085 .37 C/W C/W o MAX .120 .098 .055 .041 .081 .024 .0039 .044 .007 .020 MAX 3.04 2.64 1.40 1.03 2.05 .60 .100 1.12 .180 .51 NOTE o Suggested Solder Pad Layout .031 .800 .035 .900 .079 2.000 inches mm Tj, TSTG -55~150 C Notes: (1) Mounted on FR-4 printed-circuit board .037 .950 .037 .950 www.mccsemi.com BCW66H Electrical Characteristics Parameter DC Current Gain(1) at VCE = 10V, IC = 100µA at VCE = 1V, IC = 10mA at VCE = 1V, IC = 100mA at VCE = 2V, IC = 500mA Collector-Emitter Saturation Voltage at IC = 100mA, IB = 10mA at IC = 500mA, IB = 50mA Base-Emitter Saturation Voltage(1) at IC = 100mA, IB = 10mA at IC = 500mA, IB = 50mA Collector-Emitter Breakdown Voltage at IC = 10mA, IB = 0 Collector-Base Breakdown Voltage at IC = 10µA, IB = 0 Emitter-Base Breakdown Voltage at IE = 10µA, IC = 0 Collector-Base Cut-off Current at VCB = 45V, IE = 0 at VCB = 45V, IE = 0, TA = 150°C Emitter-Base Cut-off Current at VEB = 4V, IC = 0 Gain-Bandwidth Product at VCE = 10V, IC = 20mA, f = 100MHz Collector-Base Capacitance at VCB = 10V, f = 1MHz Emitter-Base Capacitance at VEB = 0.5V, f = 1MHz Note: (1) Pulse test: t ≤ 300µs, D = 2% (1) MCC Ratings at 25°C ambient temperature unless otherwise specified. Symbol Min. TYP. Max. Unit hFE hFE hFE hFE VCEsat VCEsat VBEsat VBEsat V(BR)CEO V(BR)CBO V(BR)EBO ICBO ICBO IEBO 80 180 250 100 – – – – 630 – – – – – – – 45 75 5 – – – – – – – 0.3 0.7 1.25 2 – – – V V V V V V V – – – – – – 20 20 20 nA µA nA fT CCB CEB – – – 100 6 60 – – – MHZ pF pF www.mccsemi.com
BCW66H
1. 物料型号:BCW66H

2. 器件简介: - NPN小信号晶体管,适合自动插入 - 150°C结温 - 低电流、低电压外延平面芯片结构

3. 引脚分配:SOT-23封装,塑封,可焊性符合MIL-STD-202方法208,标记为EH

4. 参数特性: - 集电极-发射极电压(VCEO):45V - 集电极-基极电压(VCBO):75V - 发射极-基极电压(VEBO):5V - 集电极电流(DC):800mA - 峰值集电极电流(CM):1000mA - 基极电流(DC):100mA - 峰值基极电流(BM):200mA - 功率耗散@T = 79°C:330mW - 热阻,结到环境空气:285°C/W - 热阻,结到焊接点:215°C/W - 工作和存储温度:-55~150°C

5. 功能详解: - DC电流增益(hFE)在不同条件下的变化范围:80到630 - 集电极-发射极饱和电压(VCEsat)在不同条件下的变化范围:0.3到0.7V - 基极-发射极饱和电压(VBEsat)在不同条件下的变化范围:1.25到2V - 集电极-基极击穿电压(V(BR)CBO):75V - 发射极-基极击穿电压(V(BR)EBO):5V - 截止频率增益积(fr):100MHz - 集电极-基极电容(CCB):6pF - 发射极-基极电容(CEB):60pF

6. 应用信息:适用于需要NPN小信号晶体管的应用场合,特别是在需要自动插入工艺和高结温应用中。

7. 封装信息:SOT-23,塑封,重量约为0.008克。
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