MCC
Features
omponents 21201 Itasca Street Chatsworth !"# $
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FR1A THRU FR1M
1 Amp Fast Recovery Silicon Rectifier 50 to 1000 Volts
DO-214AA (SMBJ) (Round Lead)
H Cathode Band
• • • • •
For Surface Mount Applications Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250 °C for 10 Seconds At Terminals Superfast Recovery Times For High Efficiency
Maximum Ratings
• • •
Operating Temperature: -50 °C to +150°C Storage Temperature: -50°C to +150°C Maximum Thermal Resistance; 15 °C/W Junction To Lead MCC Device Maximum Maximum Maximum Catalog Marking Recurrent RMS DC Number Peak Reverse Voltage Blocking Voltage Voltage FR1A FR1A 50V 35V 50V FR1B FR1B 100V 70V 100V FR1D FR1D 200V 140V 200V FR1G FR1G 400V 280V 400V FR1J FR1J 600V 420V 600V FR1K FR1K 800V 560V 800V FR1M FR1M 1000V 700V 1000V
J
A
C
E F G
D
B
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward IF(AV) 1.0A TJ = 90°C current Peak Forward Surge IFSM 30A 8.3ms, half sine Current IFM = 1.0A; Maximum 1.30V Instantaneous VF TJ = 25°C* Forward Voltage Maximum DC Reverse Current At IR 5µA TJ = 25°C Rated DC Blocking 200µA TJ = 125°C Voltage Maximum Reverse Recovery Time 150ns FR1A-G IF=0.5A, IR=1.0A, Trr 250ns Irr=0.25A FR1J 500ns FR1K-M Typical Junction CJ 12pF Measured at Capacitance 1.0MHz, VR=4.0V *Pulse test: Pulse width 200 µsec, Duty cycle 2%
DIM A B C D E F G H J INCHES MIN .078 .075 .002 ----.035 .065 .205 .160 .130 MAX .116 .089 .008 .02 .055 .091 .224 .180 .155
DIMENSIONS MM MIN 1.98 1.90 .05 ----.90 1.65 5.21 4.06 3.30
MAX 2.95 2.25 .20 .51 1.40 2.32 5.69 4.57 3.94
NOTE
SUGGESTED SOLDER PAD LAYOUT
0.090"
0.085”
0.070”
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FR1A thru FR1M
Figure 1 Typical Forward Characteristics 20 10 6 4 2 Amps 1 .6 .4 .2 .1 .06 .04 .02 .01 .6 .8 10 Volts Instantaneous Forward Current - Amperesversus Instantaneous Forward Voltage - Volts 1.2 1.4 1.6 Amps 2.4 2.2 2.0 1.8 25°C 1.6 1.4 1.2 1.0 .8 .6 .4 Figure 2 Forward Derating Curve
MCC
Single Phase, Half Wave .2 60Hz Resistive or Inductive Load 0 0 25 50 75 °C Average Forward Rectified Current - Amperes ersus v Ambient Temperature - °C 100 125 150
Figure 3 Junction Capacitance
100 60 40 20 pF 10 6 4 2 1 .1 .2 .4 1 Volts 2 4 10 20 40 100 200 400 1000 TJ=25°C
Junction Capacitance - pFversus Reverse Voltage - Volts
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FR1A thru FR1M
Figure 4 Peak Forward Surge Current 36 30 24 18 Amps 12 6 0 1 4 6 8 10 Cycles Peak Forward Surge Current - Amperesversus Number Of Cycles At 60Hz - Cycles 20 40 60 80 100
MCC
Figure 5 New SMB Assembly
Round Lead Process
2
Figure 6 Reverse Recovery Time Characteristic And Test Circuit Diagram 50Ω 10Ω trr +0.5A
0 25Vdc Pulse Generator Note 2 1Ω Oscilloscope Note 1 -0.25
-1.0 1cm Set Time Base for 20/100ns/cm
Notes: 1. Rise Time = 7ns max. Input impedance = 1 megohm, 22pF 2. Rise Time = 10ns max. Source impedance = 50 ohms 3. Resistors are non-inductive
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