GS2D-LTP

GS2A-L THRU GS2M-L Features • Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates Compliant. See Ordering Information) • For Surface Mount Applications • Extremely Low Thermal Resistance • Epoxy Meets UL 94 V-0 Flammability Rating • Moisture Sensitivity Level 1 • Halogen Free. “Green” Device (Note 2) 2.0 Amp Glass Passivated Rectifier 50 to 1000 Volts Maximum Ratings • Operating Junction Temperature Range: -55⁰C to +150⁰C • Storage Temperature Range: -55⁰C to +150⁰C • Typical Thermal Resistance: 20°C/W Junction to Lead SMA (DO-214AC) • Typical Thermal Resistance: 53°C/W Junction to Ambient MCC Part Number Device Marking GS2A-L GS2B-L GS2D-L GS2G-L GS2J-L GS2K-L GS2M-L GS2A GS2B GS2D GS2G GS2J GS2K GS2M Maximum Maximum DC Recurrent Maximum Blocking Peak Reverse RMS Voltage Voltage Voltage 50V 100V 200V 400V 600V 800V 1000V 35V 70V 140V 280V 420V 560V 700V H J 50V 100V 200V 400V 600V 800V 1000V Cathode Mark C E IF(AV) 2.0A TL=110⁰C Peak Forward Surge Current IFSM 50A 8.3ms,Half Sine VF 1.1V IR 5.0μA 0.1μA(Typ.) TJ=25⁰C; 50μA 4.5μA(Typ.) 125μA TJ=100⁰C Maximum Instantaneous Forward Voltage Maximum DC Reverse Current At Rated DC Blocking Voltage Typical Junction Capacitance CJ Maximum Reverse Recovery Time trr Avalanche Energy EAS 20pF 2.1µs(Typ) IFM=2.0A; TJ=25⁰C* TJ=125⁰C B G Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current D F A DIM A B C D E F G H J DIMENSIONS INCHES MM MIN MAX MIN MAX 0.075 0.096 1.90 2.44 0.050 0.064 1.27 1.63 0.002 0.008 0.051 0.203 --- 0.020 --0.51 0.030 0.060 0.76 1.52 0.065 0.091 1.65 2.32 0.189 0.220 4.80 5.59 0.157 0.187 4.00 4.75 0.090 0.115 2.25 2.92 NOTE SUGGESTED SOLDER PAD LAYOUT 2.27mm Measured at 1.0MHz VR=4.0V 4µs(Max) IF=0.5A; IR=1.0A; Irr=0.25A 20mJ LH:40mH,TJ=150°C 2.16mm 1.78mm *Pulse Test: Pulse Width 300 μsec, Duty Cycle 2% Note :1. High Temperature Solder Exemption Applied, See EU Directive Annex 7a. 2. Halogen free "Green” products are defined as those which contain