GS2MHE3-LTP

GS2AHE3-L THRU GS2MHE3-L Features • Halogen Free. “Green” Device (Note 1) • AEC-Q101 Qualified • Lead Free Finish/RoHS Compliant (Note2) ("P"Suffix Designates Compliant. See Ordering Information) • For Surface Mount Applications • Extremely Low Thermal Resistance • Epoxy Meets UL 94 V-0 Flammability Rating • Moisture Sensitivity Level 1 2.0 Amp Glass Passivated Rectifier 50 to 1000 Volts Maximum Ratings • Operating Junction Temperature Range: -55⁰C to +150⁰C • Storage Temperature Range: -55⁰C to +150⁰C SMA (DO-214AC) • Typical Thermal Resistance: 20°C/W Junction to Lead • Typical Thermal Resistance: 53°C/W Junction to Ambient MCC Part Number Device Marking GS2AHE3-L GS2BHE3-L GS2DHE3-L GS2GHE3-L GS2JHE3-L GS2KHE3-L GS2MHE3-L Maximum Maximum DC Recurrent Maximum Blocking Peak Reverse RMS Voltage Voltage Voltage GS2A GS2B GS2D GS2G GS2J GS2K GS2M 50V 100V 200V 400V 600V 800V 1000V 35V 70V 140V 280V 420V 560V 700V H J 50V 100V 200V 400V 600V 800V 1000V Electrical Characteristics @ 25°C Unless Otherwise Specified Cathode Mark C E D F B G DIM DIMENSIONS INCHES MM MIN MAX MIN MAX 0.075 0.096 1.90 2.44 0.050 0.064 1.27 1.63 0.002 0.008 0.051 0.203 --- 0.020 --0.51 0.030 0.060 0.76 1.52 0.065 0.091 1.65 2.32 0.189 0.220 4.80 5.59 0.157 0.187 4.00 4.75 0.090 0.115 2.25 2.92 NOTE Average Forward Current IF(AV) 2.0A TL=110⁰C Peak Forward Surge Current IFSM 50A 8.3ms,Half Sine Maximum Instantaneous Forward Voltage VF 1.1V Maximum DC Reverse Current At Rated DC Blocking Voltage IR 5.0μA 0.1μA(Typ.) TJ=25⁰C; 50μA 4.5μA(Typ.) 125μA TJ=100⁰C SUGGESTED SOLDER PAD LAYOUT TJ=125⁰C 2.27mm Typical Junction Capacitance CJ Maximum Reverse Recovery Time trr Avalanche Energy EAS 20pF 2.1µs(Typ) IFM=2.0A; TJ=25⁰C* A A B C D E F G H J Measured at 1.0MHz VR=4.0V 4µs(Max) IF=0.5A; IR=1.0A; Irr=0.25A 20mJ LH:40mH,TJ=150°C 2.16mm 1.78mm *Pulse Test: Pulse Width 300 μsec, Duty Cycle 2% Note :1. Halogen free "Green” products are defined as those which contain