MCQ4407B

MCQ4407B Features • • • Trench Power LV MOSFET Technology High Speed Switching High Density Cell Desihn for Low RDS(on) • Epoxy Meets UL 94 V-0 Flammability Rating • Moisture Sensitivity Level 1 • • Halogen Free . “Green” Device (Note 1) Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information) P-CHANNEL MOSFET Maximum Ratings • Operating Junction Temperature Range : -55°C to +150°C • Storage Temperature Range: -55°C to +150°C • Thermal Resistance: 39°C/W Junction to Ambient(Note 2) Parameter SOP-8 Symbol Rating Unit Drain-Source Voltage VDS -30 V Gate-Source Volltage VGS ±25 V -12 A -10 A IDM -55 A EAS 105 mJ PD 3.2 W Continuous Drain Current Pulsed Drain Current TA=25°C ID TA=70°C (Note 3) Single Pulse Avalanche Energy (Note 4) Total Power Dissipation (Note 5) 2.The Value of RθJA is Measured with the Device Mounted on 1in2 FR-4 Board with 2oz. Copper, in a Still Air Environment with TA=25°C. The Value in Any Given Application Depends on the User's Specific Board Design. 3.Pulse Test: Pulse Width≤300µs,Duty Cycle ≤2%. 4.Repetitive Rating, Pulse Width Limited by Junction Temperature TJ(MAX)=150°C. Ratings are Based on Low Frequency and Duty Cycles to Keep Initial TJ=25°C. 5.The Power Dissipation PD is Based on TJ(MAX)=150°C, Using≤10s Junction-to-Ambient Thermal Resistance. 8 D 8 D 7 7 6 5 D D F E K H J G DIM A B C D E F G H J K θ DIMENSIONS INCHES MM MIN MAX MIN MAX 0.053 0.069 1.35 1.75 0.004 0.010 0.10 0.25 0.053 0.061 1.35 1.55 0.013 0.020 0.33 0.51 0.007 0.010 0.17 0.25 0.185 0.200 4.70 5.10 0.050 1.270 0.228 0.244 5.80 6.20 0.150 0.157 3.80 4.00 0.016 0.050 0.40 1.27 0° 8° 0° 8° NOTE TYP. Suggested Solder Pad Layout 5 6 A C Note: 1. Halogen free "Green” products are defined as those which contain