MCU12P10-TP

MCU12P10 Features • • • • Advanced Trench Process Technology High Density Cell Design for Ultra Low On-Resistance Reliable and Rugged Epoxy Meets UL 94 V-0 Flammability Rating • Moisture Sensitivity Level 1 • • Halogen Free Available Upon Request By Adding Suffix "-HF" Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS Compliant. See Ordering Information) P-CHANNEL MOSFET Maximum Ratings • Operating Junction Temperature Range : -55°C to +150°C • Storage Temperature Range: -55°C to +150°C • Thermal Resistance: 3.13°C/W Junction to Case (Note 1) DPAK(TO-252) J H Parameter Symbol Rating Unit Drain-Source Voltage VDS -100 V Gate-Source Volltage VGS ±20 V -12 A -9.2 A Continuous Drain Current TC=25°C TC=100°C ID Pulsed Drain Current IDM -30 A Single Pulse Avalanche Energy (Note 2) EAS 110 mJ Total Power Dissipation PD 40 W Note: 1.Surface Mounted on FR4 Board, t ≤ 10 sec. 2.EAS Condition:TJ=25°C,VDD=-50V,VG=-10V,L=0.5mH,Rg=25Ω. D G S Rev.3-1-01012019 1/4 O 4 2 I F E 3 V K M Q A G L B D 1. Gate 2,4. Drain 3. Source DIM A B C D E F G H I J K L M O Q V Internal Structure 1 C DIMENSIONS INCHES MM MIN MAX MIN MAX 0.087 0.094 2.20 2.40 0.000 0.005 0.00 0.13 0.026 0.034 0.66 0.86 0.018 0.023 0.46 0.58 0.256 0.264 6.50 6.70 0.201 0.215 5.10 5.46 0.190 4.83 0.236 0.244 6.00 6.20 0.086 0.094 2.18 2.39 0.386 0.409 9.80 10.40 0.114 2.90 0.055 0.067 1.40 1.70 0.063 1.60 0.043 0.051 1.10 1.30 0.000 0.012 0.00 0.30 0.211 5.35 NOTE TYP. TYP. TYP. TYP. MCCSEMI.COM MCU12P10 Electrical Characteristics @ 25°C (Unless Otherwise Specified) Parameter Symbol Test Conditions Min Typ Max Unit Static Characteristics V(BR)DSS VGS=0V, ID=-250µA Gate-Source Leakage Current IGSS VDS=0V, VGS =±20V ±10 µA Zero Gate Voltage Drain Current IDSS VDS=-100V, VGS=0V -1 µA Gate-Threshold Voltage(Note 3) VGS(th) VDS=VGS, ID=-250µA -1.9 -3 V Drain-Source On-Resistance(Note 3) RDS(on) VGS=-10V, ID=-8A 170 200 mΩ gFS VDS=-15V, ID=-5A Drain-Source Breakdown Voltage Forward Tranconductance(Note 3) -100 -1 V 12 S Dynamic Characteristics(Note 4) Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss 41 Total Gate Charge Qg 25 Gate-Source Charge Qgs Gate-Drain Charge Qgd 7 Turn-On Delay Time td(on) 14 Turn-On Rise Time tr Turn-Off Delay Time td(off) Turn-Off Fall Time 1055 VDS=-25V,VGS=0V,f=1MHz VDS=-50V,VGS=-10V,ID=-10A VDD=-50V,ID=-10A VGS=-10V,RGEN=9.1Ω tf pF 65 nC 5 18 ns 50 18 Drain-Source Body Diode Characteristics Continuous Body Diode Current Body Diode Voltage IS VSD Reverse Recovery Time trr Reverse Recovery Charge Qrr Forward Turn-on Time ton TC=25°C -13 A IS=-10A, VGS=0V -1.2 V IF=-10A,di/dt=100A/μs 35 ns 46 nC Intrinsic Turn-On Time is Negligible(Turn-On is Dominated by LS+LD) Note 3. Pulse Test : Pulse Width≤300μs, Duty Cycle ≤2%. 4. Guaranteed by Design, Not Subject to Production Testing. Rev.3-1-01012019 2/4 MCCSEMI.COM MCU12P10 Curve Characteristics Fig. 2 - RDS(ON)—Temperature Fig. 1 - Output Characteristics -15 2.1 TA=25°C Pulsed VGS=-10V,-7V,-5V Normalized On-Resistance Drain Current (A) -12 VGS=-4.0V -9 -6 -3 0 1.7 VGS=-10V ID=-6A 1.3 0.9 VGS=-3.0V 0 -1 -2 -3 0.5 -50 -4 -25 0 25 50 75 100 125 150 Junction Temperature (°C) Drain to Source Voltage (V) Fig. 4 - Gate Charge Fig. 3 - Transfer Characteristics -2.0 -10 VDS= -50V ID=-10A Gate to Source Voltage (V) Drain Current (A) -1.6 -1.2 TA=125°C -0.8 TA=25°C -0.4 0.0 0 -1 -2 -3 -8 -6 -4 -2 0 -4 0 5 10 Fig. 5 - RDS(ON)—ID 20 25 Fig. 6 - IS—VSD 300 -100 TA=25°C Pulsed 250 Source Current (A) Drain-Source On-Resistance (mΩ) 15 Gate Charge (nC) Gate to Source Voltage (V) 200 VGS=-10V -10 TA=150°C -1 TA=25°C 150 100 0 -3 -6 -9 -12 -15 -0.3 -0.6 -0.9 -1.2 Source to Drain Voltage (V) Drain Current (A) Rev.3-1-01012019 -0.1 -0.0 3/4 MCCSEMI.COM MCU12P10 Ordering Information Device Packing Part Number-TP Tape&Reel: 2.5Kpcs/Reel Note : Adding "-HF" Suffix for Halogen Free, eg. Part Number-TP-HF ***IMPORTANT NOTICE*** Micro Commercial Components Corp. reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. ***LIFE SUPPORT*** MCC's products are not authorized for use as critical components in life support devices or systems without the express written approval of Micro Commercial Components Corporation. ***CUSTOMER AWARENESS*** Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. Rev.3-1-01012019 4/4 MCCSEMI.COM