MCC
Features
• • • •
omponents 21201 Itasca Street Chatsworth !"# $
% !"#
S1A THRU S1M
For Surface Mount Applications Extremely Low Thermal Resistance Easy Pick And Place High Temp Soldering: 250 °C for 10 Seconds At Terminals
1 Amp Silicon Rectifier 50 to 1000 Volts
DO-214AA (SMBJ) (Round Lead)
H Cathode Band
• • •
Maximum Ratings
Operating Temperature: -55 °C to +150°C Storage Temperature: -55°C to +150°C Maximum Thermal Resistance; 30°C/W Junction To Lead Device Marking S1A S1B S1D S1G S1J S1K S1M Maximum Recurrent Peak Reverse Voltage 50V 100V 200V 400V 600V 800V 1000V Maximum RMS Voltage 35V 70V 140V 280V 420V 560V 700V Maximum DC Blocking Voltage 50V 100V 200V 400V 600V 800V 1000V
DIM A B C D E F G H J
MCC Catalog Number S1A S1B S1D S1G S1J S1K S1M
J
A
C
E F G
D
B
DIMENSIONS INCHES MIN .078 .075 .002 ----.035 .065 .205 .160 .130 MM MIN 1.98 1.90 .05 ----.90 1.65 5.21 4.06 3.30
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward current Peak Forward Surge Current Maximum Instantaneous Forward Voltage Maximum DC Reverse Current At Rated DC Blocking Voltage Typical Junction Capacitance IF(AV) IFSM VF IR CJ 1.0A 30A 1.1V 5µA 50µA 12pF TJ = 100°C 8.3ms, half sine, IFM = 1.0A; TJ = 25°C* TJ = 25°C TJ = 125°C Measured at 1.0MHz, VR=4.0V
MAX .116 .089 .008 .02 .055 .091 .224 .180 .155
MAX 2.95 2.25 .20 .51 1.40 2.32 5.69 4.57 3.94
NOTE
SUGGESTED SOLDER PAD LAYOUT
0.090"
0.085”
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
0.070”
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S1A thru S1M
Figure 1 Typical Forward Characteristics 20 10 6 4 2 Amps 1 .6 .4 .2 .1 .06 .04 .02 .01 .4 .6 .8 Volts Instantaneous Forward Current - Amperesversus Instantaneous Forward Voltage - Volts 1.0 1.2 1.4 Amps 1.4 1.2 1.0 .8 .6 .4 Resistive or .2 Inductive Load 0 0 20 40 60 25°C 1 10 Cycles Amps 36 30 24 18 12 6
Figure 3 Maximum Overload Surge Current
MCC
100
Peak Forward Current - Amperesversus Number of Cycles at 60Hz Figure 4 Forward Derating Curve
80 100 120 140 160 180 200
Figure 2 Junction Capacitance
°C Average Forward Rectified Current - Amperes ersus v Ambient Temperature - °C
100 60 40 20 pF 10 6 4 2 1 .1 .2 .4 1 Volts 2 4 10 20 40 100 200 400 1000 Median Typical Distribution
Junction Capacitance - pFversus Reverse Junction Potential (Applied V + 0.7 Volts) - Volts
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S1A thru S1M
Figure 5 Peak Forward Surge Current 1000 600 400 200 Amps 100 60 40 20 10 .01 .02 .06 .1 .2 mS Peak Forward Surge Current - Amperesversus Pulse Duration - Milliseconds (mS) .6 1 2 6 10
MCC
Figure 6 New SMB Assembly
Round Lead Process
www.mccsemi.com
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