SICW080N120Y4
Features
•
•
•
•
•
•
SiC MOSFET technology
High blocking voltage with low on-resistance
High-speed switching with low capacitances
Halogen Free. “Green” Device (Note 1)
Epoxy Meets UL 94 V-0 Flammability Rating
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
N-CHANNEL
MOSFET
Maximum Ratings
•
Operating Junction Temperature Range : -55°C to +175°C
•
Storage Temperature Range: -55°C to +175°C
•
Thermal Resistance: 0.67°C/W Junction to Case
TO-247-4
Applications
•
Solar Inverters
•
Switch Mode Power Supplies
•
High Voltage DC/DC Converters
•
Battery Chargers
•
Motor Drives
Parameter
Symbol
Rating
Unit
Drain-Source Voltage
VDS
1200
V
Gate-Source Voltage
VGSmax
-8/+22
V
Gate-Source Voltage
VGSop
-4/+18
V
ID
39
A
IDM
80
A
DIM
Total Power Dissipation,Tc=25oC
PD
223
W
Total Power Dissipation,Tc=110oC
PD
97
W
A
A1
A2
b
b1
b2
c
D
D1
E
E1
E2
e
L
L1
P
Q
S
Continuous Drain Current
Pulsed Drain Current
(1)
Note:
1. Pulse Test: Pulse Width≤10µs,Duty Cycle ≤1%.
Internal Structure
Drain (Pin 1)
MCC
SICW
080N120Y4
YYWW
Gate
(Pin 4)
Driver Source
(Pin 3)
1
2
3
4
DIMENSIONS
INCHES
MM
NOTE
MIN
MAX
MIN
MAX
0.190 0.205 4.80
5.20
0.090 0.100 2.29
2.50
0.075 0.08 1.88
2.08
0.042 0.052 1.10
1.30
0.09 0.1 2.35
2.75
0.094 0.112 2.39
2.84
0.022 0.027 0.55
0.68
0.917 0.929 23.30 23.60
0.640 0.6 16.25 1
0.620 0.63 15.75 16.
0.5 0.55 13.0 14.
0.1 0.201
5.10
0.100
2.54
0.68 0. 17.3 17.
0.15 0.1
4.3
0.138 0.144 3.51
3.65
Φ
0.2 0.236 5.
6.00
0.238 0.248 6.04
6.30
Power Source
(Pin 2)
1
Rev.3-1-10092022
2
4
3
1/7
MCCSEMI.COM
SICW080N120Y4
Electrical Characteristics @ 25°C (Unless Otherwise Specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Static Characteristics
V(BR)DSS
VGS=0V, ID=100uA
Gate-Source Leakage Current
IGSS
VDS=0V, VGS =18V
Zero Gate Voltage Drain Current
IDSS
VDS=1200V, VGS=0V
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
VGS(th)
Drain-Source On-Resistance
RDS(on)
Internal Gate Resistance
Rg
Transconductance
gFS
VDS=VGS, ID=5mA
1200
2.3
V
100
nA
1
10
µA
2.9
3.6
V
VDS=VGS, ID=5mA, Tj =175oC
2.2
VGS=18V, ID=20A
77
V
85
mΩ
VGS=18V, ID=20A,Tj =175oC
122
mΩ
f=1MHz
3.1
Ω
VDS=16V, ID=20A
10
VGS=16V, ID=20A,Tj =175oC
9.2
S
Diode Characteristics
Continuous Body Diode Current
IS
Diode Forward Voltage
VSD
Reverse Recovery Time
trr
Reverse Recovery Charge
Qrr
Peak Reverse Recovery Current
Irrm
39
A
VGS=-4V, IS=10A
3.9
V
VDS=0V, ISD=10A, Tj =175oC
3.2
V
28.24
ns
190
nC
30.08
A
VGS=-4V, ISD=20A,
dIF/dt=2095A/μs
Dynamic Characteristics
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Coss Stored Energy
Eoss
890
VDS=1000V,VGS=0V,f=1MHz
58
4
34
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
11
Turn-On Delay Time
td(on)
21
Turn-On Rise Time
tr
17
Turn-Off Delay Time
td(off)
Turn-Off Fall Time
tf
VDS=800V,VGS=-4/+18V
ID=20A
VDS=800V, VGS=-4/+15V,
RG=0Ω, IDS=20A
12
14
nC
ns
8
Eon
377
Turn-Off switching energy
Eoff
14
2/7
uJ
41
Turn-On switching energy
Rev.3-1-10092022
pF
uJ
MCCSEMI.COM
SICW080N120Y4
Curve Characteristics
Fig. 1 - Typical Output Characteristics
80
Fig. 2 - Typical Output Characteristics
60
Tj = 25oC
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
Tj= -40oC
VGS = 18V
60
VGS = 15V
VGS = 13V
40
VGS = 11V
20
VGS = 9V
0
2
4
6
8
VGS = 15V
30
VGS = 11V
20
VGS = 9V
10
VGS = 7V
0
10
0
ID, Drain Source Current (A)
ID, Drain-to-Source Current (A)
VGS = 11V
VGS = 13V
VGS = 15V
VGS = 9V
VGS = 18V
20
VGS = 7V
10
0
4
2
6
8
40
30
20
10
0
10
Tj = -40 ℃
Tj = 25 ℃
Tj = 175 ℃
0
2
4
6
8
12
10
14
VGS, Gate-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
600
10
Fig. 4 - Transfer Characteristics for various junction temperature
50
0
8
50
Tj = 175oC
30
6
VDS, Drain-to-Source Voltage (V)
Fig. 3 - Typical Output Characteristics
40
4
2
VDS, Drain-to-Source Voltage (V)
60
VGS = 13V
40
VGS = 7V
0
VGS = 18V
50
Fig. 5 - On-resistance vs.temperature for various gate voltage
Fig. 6 - Normalized on-resistance vs.temperature
2.0
1.8
RDS ON, On Resistance (P.U.)
RDS ON, On Resistance (mΩ)
500
400
VGS=11V
300
200
VGS=13V
100
VGS=18V
0
-50
-25
25
50
75
100
125
150
1.2
1.0
0.8
0.6
0.4
0.0
-50
175
-25
0
25
50
75
100
125
150
175
Tj, Junction Temperature (℃)
Tj, Junction temperature (℃)
Rev.3-1-10092022
1.4
0.2
VGS=15V
0
1.6
3/7
MCCSEMI.COM
SICW080N120Y4
Curve Characteristics
Fig. 7 - On-resistance vs. drain current
180
o
VGS=18V
IDS, Source Drain Current (A)
RDS ON, On Resistance (mΩ)
Tj=175 ℃
140
120
100
Tj=25 ℃
80
40
Tj=-40 ℃
0
30
40
50
-40
-50
-60
-9
-8
Tj = -40℃
Tj = 25℃
Tj = 175℃
-50
-60
-70
-4
-3
-2
-1
0
-20
-30
VGS=0V
-40
VGS=5V
-50
VGS=15V
VGS=10V
VGS=18V
-60
-70
-9
-8
-7
-6
-5
-4
-3
-2
-1
-80
-10
0
-9
-8
VDS, Drain Source Voltage (V)
-7
-6
-5
-4
-3
-2
-1
0
35
40
45
VDS, Drain to Source Voltage (V)
Fig. 11 - Threshold voltage vs.temperature
4.0
Fig. 12 - Gate charge characteristic
18
VGS=VDS
ID =5mA
VDS=800V
ID =20A
16
VGS, Gate to Source Voltage (V)
3.5
VGS(th), Threshold Voltage(V)
-5
-10
-40
3.0
2.5
2.0
1.5
14
12
10
8
6
4
2
0
-25
0
25
50
75
100
125
150
175
0
5
10
15
20
25
30
Qg, Gate charge (nC)
Tj, Junction Temperature(℃)
Rev.3-1-10092022
-6
0
VGS=0V
-30
1.0
-50
-7
Fig. 10 - 3rd quadrant characteristic at Tj=25oC
Fig. 9 - Body diode characteristic
IDS, Drain to Source Current (A)
IDS, Drain Source Current (A)
VGS=0V
-30
VDS, Source Drain Voltage (V)
-20
-80
-10
VGS=-2V
-20
-80
-10
60
IDS, Drain to source Current (A)
-10
VGS=-4V
-70
20
10
0
Tj=25 C
-10
160
60
Fig. 8 - Body diode characteristic
0
4/7
MCCSEMI.COM
SICW080N120Y4
Curve Characteristics
Fig. 1 - &DSDFLWDQFHVYVGUDLQVRXUFHYROWDJH9
10000
Fig. 1 - &DSDFLWDQFHVYVGUDLQVRXUFHYROWDJH9
10000
o
o
Tj=25 C, f=1MHz
Tj=25 C, f=1MHz
Ciss
100
Coss
10
Crss
1
0
200
400
Coss
100
Crss
10
600
800
1
1000
VDS, Drain-to-source Voltage (V)
0
50
100
150
200
VDS, Drain-to-source Voltage (V)
Fig. 1 - 2XWSXWFDSDFLWRUVWRUHGHQHUJ\
40
Ciss
1000
C, capacitance (pF)
C, capacitance (pF)
1000
Fig. 1 - 5HYHUVHFKDUDFWHULVWLFVYV7M
50
40
25
20
15
10
30
IDSS, Reverse Current(uA)
30
EOSS, Stored Energy (uJ)
35
20
Tj = -55 ℃
Tj = 25 ℃
Tj = 75 ℃
10
Tj = 125 ℃
5
0
Tj = 175 ℃
0
200
400
600
800
0
1000
0
200
400
VDS, Drain to Source Voltage (V)
Fig. 1 - Maximum power dissipation derating vs.
temperature
50
Rev.3-1-10092022
150
100
50
-25
0
25
50
75
100
TC, Case temperature (℃)
125
800
1000
1200
1400
1600
1800
150
40
30
20
10
0
175
Fig. 1 - Coutinuous drain
current derating vs.
temperature
ID, Drain Continuous Current (A)
200
PToT, Powder dissipation (W)
250
0
-50
600
VDS, Drain to Source Voltage(V)
TC, Case temperature (℃)
5/7
MCCSEMI.COM
SICW080N120Y4
Curve Characteristics
0.01
0.6
Etotal
Switching Loss (mJ)
0.1
o
Tj=25 C
VDD=600V
VGS=-4/15V
ID=20A
0.8
0.4
Eon
0.2
6LQJOHSXOVH
1E-6
1E-5
1E-4
1E-3
0.01
Time, tp (S)
0.1
0.0
1
Fig. 21 - Clamped inductive
switching energy vs. Rg
0.8
10
20
25
30
35
o
Tj=25 C
VDD=800V
VGS=-4/15V
ID=20A
Tj=25 C
VDD=800V
VGS=-4/15V
ID=20A
35
Etotal
0.5
Eon
0.4
0.3
0.2
30
td(on)
25
0.6
15
Fig. 22 - Switching times vs. Rg
40
o
0.7
tr
20
td(off)
15
tf
10
0.1
0.0
Eoff
5
ID, Drain to Source Current (A)
Switching time (ns)
Thermal Resistance (℃/W)
1.0
Switching Loss (mJ)
Fig. 20 - Clamped Inductive switching energy vs.
drain current
Fig. 19 - Transient thermal impedance
1
Eoff
0
4
2
6
8
5
10
Rg, Gate Resistance (ohm)
0
2
4
6
8
10
Rg, Gate Resistance (ohm)
Fig. 23 - Drain to Source
Voltage (V)
100
10
Limit by
RDSON
100us
ID, Drain Current (A)
10us
1
PV
o
TC=25 C
D=0
Parameter: tp
0.1
1
PV
DC
10
100
1000
10000
VDS, Drain to Source Voltage (V)
Rev.3-1-10092022
6/7
MCCSEMI.COM
SICW080N120Y4
Ordering Information
Device
Packing
SICW080N120Y4-BP
Tube:30pcs/Tube, 360pcs/Box,1.8K/Ctn;
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Rev.3-1-10092022
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