SK154-TP

NOT RECOMMENDED FOR NEW DESIGNS USE MBR15100ULPS to replace SK1510 MCC TM Micro Commercial Components SK152 THRU SK1510
  omponents 20736 Marilla Street Chatsworth    !"# $ %    !"# Features • • • • • • • • Halogen free available upon request by adding suffix "-HF" Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates Compliant. See ordering information) For Surface Mount Applications Extremely Low Thermal Resistance High Current Capability With Low Forward Voltage High Temp Soldering: 260°C for 10 Seconds At Terminals Epoxy meets UL 94 V-0 flammability rating Moisture Sensitivity Level 1 15 Amp Schottky Rectifier 20 to 100 Volts Maximum Ratings • • • DO-214AB (HSMC) (Round Lead) Operating Temperature: -55°C to +125°C Storage Temperature: -55°C to +150°C Typical Thermal Resistance; 20°C/W Junction To Lead MST Part Number SK152 SK153 SK1535 SK154 SK1545 SK155 SK156 SK158 SK1510 Device Marking SK152 SK153 SK1535 SK154 SK1545 SK155 SK156 SK158 SK1510 Maximum Recurrent Peak Reverse Voltage 20V 30V 35V 40V 45V 50V 60V 80V 100V Maximum RMS Voltage 14V 21V 24.5V 28V 31.5V 35V 42V 56V 70V H Cathode Band Maximum DC Blocking Voltage 20V 30V 35V 40V 45V 50V 60V 80V 100V Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current Peak Forward Surge Current Maximum Instantaneous Forward Voltage SK152-1545 SK155-1510 Maximum DC Reverse Current At Rated DC Blocking Voltage Typical Junction Capacitance Note: IF(AV) 15.0A IFSM 275A TL = 95°C 8.3ms, half sine J A E C D B F G DIMENSIONS DIM A B C D E F G H J INCHES MIN .200 .177 .002 --.047 .168 .309 .239 .234 MM MIN 5.08 4.70 .05 --1.20 4.27 7.85 6.08 5.95 MAX .214 .203 .005 .02 .056 .179 .322 .243 .240 MAX 5.43 5.30 .13 .51 1.42 4.55 8.18 6.18 6.10 NOTE SUGGESTED SOLDER PAD LAYOUT 0.190’ VF .55V .85V IFM = 15.0A; TJ = 25°C* IR 1mA 20mA TJ = 25°C TJ = 100°C CJ 500pF Measured at 1.0MHz, VR=4.0V 0.200” 0.070” 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7. www.mccsemi.com Revision: B 1 of 4 2013/01/01 MCC
 
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