SMD34LHE1-TP

SMD34LHE1 Features • Halogen Free Available Upon Request By Adding Suffix "-HF" • High Current Capability • Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix Designates Compliant. See Ordering Information) • Guardring For Overvoltage Protection. • Silicon Epitaxial Planar Chip, Metal Silicon Junction • Epoxy Meets UL 94 V-0 Flammability Rating • Moisture Sensitivity Level 1 3 Amp Low VF Schottky Rectifier 40 Volts Maximum Ratings • Operating Junction Temperature Range: -55⁰C to +150⁰C • • • • Storage Temperature Range: -55⁰C to +150⁰C Typical Thermal Resistance: 6°C/W Junction to Lead(Note 2) Typical Thermal Resistance: 28°C/W Junction to Case(Note 3) Typical Thermal Resistance: 60°C/W Junction to Ambient(Note 2) MCC Part Number Device Marking SMD34LHE1 T4 SOD-123HE1 HE E Maximum Maximum DC Recurrent Maximum Blocking Peak Reverse RMS Voltage Voltage Voltage 40V 28V B D Cathode Mark 40V A C Electrical Characteristics @ 25°C Unless Otherwise Specified L3 Average Forward Current IF(AV) Peak Forward Surge Current IFSM 80A Instantaneous Forward Voltage VF 0.45V(Max) 0.41V(Typ) DC Reverse Current at Rated DC Blocking Voltage IR Typical Junction Capacitance CJ 3.0A B1 TL = 125°C L2 L1 120µA(Max) 30µA(Typ) 210pF 8.3ms,Half Sine DIM IFM=3.0A; VR=40V;TJ=25⁰C VR=4V, f=1MHZ A B B1 C D E L1 L2 L3 HE DIMENSIONS INCHES MM MIN MAX MIN MAX 0.030 0.035 0.75 0.90 0.033 0.041 0.85 1.05 0.033 0.041 0.85 1.05 0.004 0.010 0.10 0.25 0.075 0.083 1.90 2.10 0.114 0.122 2.90 3.10 0.079 0.096 2.00 2.45 0.016 0.033 0.40 0.85 0.051 0.067 1.30 1.70 0.138 0.154 3.50 3.90 NOTE Suggested Solder Pad Layout Note : 1. High Temperature Solder Exemption Applied, see EU Directive Annex 7a. 2.The Thermal Resistance From Junction to Ambient or Lead, Mounted on P.C.B With 5×5mm Copper Pads, 2 OZ, FR4 PCB. 3.The Thermal Resistance From Junction to Case, Mounted on P.C.B With Recommended Copper Pads, 2 OZ, FR4 PCB. mm 2.54 0.96 1.88 1.35 4.10 Rev.3-4-12012020 1/3 MCCSEMI.COM SMD34LHE1 Curve Characteristics Curve Characteristics Fig. 1 - Forward Current Derating Curve Fig. 2 - Maximum Non-Repetitive Peak Forward Surge Current 3.5 100 Peak Forward Surge Current (A) Average Forward Current (A) 3.0 2.5 2.0 1.5 1.0 80 60 40 20 0.5 8.3 ms Single Half Sine-Wave 0.0 0 25 50 75 100 125 0 150 10 1 100 Number of Cycles at 60 Hz Lead Temperature (°C) Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 4 - Typical Reverse Leakage Characteristics 20 10000 Instantaneous Reverse Current (μA) Instantaneous Forward Current (A) 10 TJ=125 C 1 TJ=75 C O 0.1 0.01 0.0 TJ=25 C O 0.2 0.4 0.6 0.8 TJ=75°C 100 10 1 20 1.0 Instantaneous Forward Voltage (V) Rev.3-4-12012020 TJ=125°C 1000 O TJ=25°C 40 60 100 80 Percent of Rated Peak Reverse Voltage (%) 2/3 MCCSEMI.COM SMD34LHE1 Ordering Information Device Packing Part Number-TP Tape&Reel: 3Kpcs/Reel Note : Adding "-HF" Suffix For Halogen Free, eg. Part Number-TP-HF ***IMPORTANT NOTICE*** Micro Commercial Components Corp UHVHUYHV WKH ULJKW WR PDNH FKDQJHV ZLWKRXW IXUWKHU QRWLFH WR DQ\ SURGXFW KHUHLQ WR PDNH FRUUHFWLRQV PRGLILFDWLRQV  HQKDQFHPHQWV  LPSURYHPHQWV  RU RWKHU FKDQJHV  Micro Commercial Components Corp  GRHV QRW DVVXPH DQ\ OLDELOLW\ DULVLQJ RXW RI WKH DSSOLFDWLRQ RU XVH RI DQ\ SURGXFW GHVFULEHG KHUHLQ QHLWKHU GRHV LW FRQYH\DQ\OLFHQVHXQGHULWVSDWHQWULJKWVQRUWKHULJKWVRIRWKHUV7KHXVHURISURGXFWVLQVXFKDSSOLFDWLRQVVKDOODVVXPHDOO ULVNVRIVXFKXVHDQGZLOODJUHHWRKROGMicro Commercial Components Corp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ev.3-4-12012020 3/3 MCCSEMI.COM