SMLJ90CA-TP

SMLJ5.0 THRU SMLJ440CA E480232 Features • • • • • • • • • • • • • • For Surface Mount Application in Order to Optimize Board Space Built-in Strain Relief Glass Passivated Junction For Bidirectional Devices Add “C” To The Suffix of The Part Number: i.e.SMLJ5.0CA for 5% Tolerance Excellent Clamping Capability Repetition Rate(duty cycle):0.5% Fast Response Time: Typical Less Than 1ps From 0V to BV Min Typical ID Less than 1μA Above 10V ESD Protected up to 16KV (HBM) High Temperature Soldering: 260°C/10 Seconds at Terminals Halogen Free. “Green” Device (Note 1) Moisture Sensitivity Level 1 Epoxy Meets UL 94 V-0 Flammability Rating 3000 Watt TVS 5.0 to 440 Volts SMC (DO-214AB) (LEAD FRAME) G Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates RoHS Compliant. See Ordering Information) H Mechanical Data Cathode Mark • Polarity: Color Band Denotes Positive End( Cathode) Except Bi-directional Types D A • Weight: 0.007 ounce, 0.21 gram C E • Standard Packaging: 16mm Tape Per ( EIA 481). F • Terminals: Solderable Per MIL-STD-750, Method 2026 Maximum Ratings • • • Operating Junction Temperature Range: -55°C to +175°C Storage Temperature Range: -55°C to +175°C Thermal Resistance: 17.5°C/W Junction to Lead • Thermal Resistance: 75°C/W Junction to Ambient Electrical Characteristics @ 25°C Unless Otherwise Specified Peak Pulse Power Surge Current on 10/1000μs Waveform IPPM See the Table Note 3,Fig3 Peak Pulse Power Dissipation on 10/1000μs Waveform PPPM 3000W(Min) Note 3,4,Fig1 B DIM A B C D E F G H DIMENSIONS INCHES MM MIN MAX MIN MAX 0.079 0.103 2.00 2.62 0.108 0.128 2.75 3.25 0.002 0.008 0.051 0.203 0.006 0.012 0.152 0.305 0.030 0.060 0.76 1.52 0.305 0.320 7.75 8.13 0.260 0.280 6.60 7.11 0.220 0.245 5.59 6.22 NOTE Suggested Solder Pad Layout 4.40mm Note: 1. Halogen free "Green” products are defined as those which contain