UF1D

UF1D

  • 厂商:

    MCC(美微科)

  • 封装:

  • 描述:

    UF1D - 1 Amp Surface Mount Super Fast Rectifier 50 to 800 Volts - Micro Commercial Components

  • 详情介绍
  • 数据手册
  • 价格&库存
UF1D 数据手册
MCC Features   omponents 21201 Itasca Street Chatsworth    !"# $ %    !"# UF1A THRU UF1K 1 Amp Surface Mount Super Fast Rectifier 50 to 800 Volts DO-214AA (SMBJ) (LEAD FRAME) H • • • • • For surface mounted applications Glass passivated junction Easy pick and place High Temp Soldering: 260 °C for 10 Seconds At Terminals Superfast Recovery Times For High Efficiency Operating Temperature: -50 °C to +150°C Storage Temperature: -50°C to +150°C Maximum Thermal Resistance; 30°C/W Junction To Lead MCC Device Maximum Maximum Maximum Catalog Marking Reccurrent RMS DC Number Peak Reverse Voltage Blocking Voltage Voltage UF1A UF1A 50V 35V 50V UF1B UF1B 100V 70V 100V UF1D UF1D 200V 140V 200V UF1G UF1G 400V 280V 400V UF1J UF1J 600V 420V 600V UF1K UF1K 800V 560V 800V Maximum Ratings • • • J A C E F G D B Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current Peak Forward Surge Current Maximum Instantaneous Forward Voltage DIMENSIONS INCHES MIN .083 .075 .002 ----.030 .065 .200 .160 .130 MM MIN 2.11 1.91 .05 ----.76 1.65 5.08 4.06 3.30 IF(AV) IFSM 1.0A 30A TL = 100°C 8.3ms, half sine UF1A-D UF1G UF1J-K Maximum DC Reverse Current At Rated DC Blocking Voltage Maximum Reverse Recovery Time UF1A-G UF1J-K Typical Junction Capacitance VF 1.0V 1.4V 1.7V 10µA 100µA DIM A B C D E F G H J MAX .096 .083 .008 .02 .050 .091 .220 .185 .155 MAX 2.44 2.11 .20 .51 1.27 2.32 5.59 4.70 3.94 NOTE IFM = 1.0A; TJ = 25°C* TA = 25°C TA = 125°C SUGGESTED SOLDER PAD LAYOUT 0.085" IR 0.095” Trr CJ 50ns 100ns 17pF IF=0.5A, IR=1.0A, Irr=0.25A Measured at 1.0MHz, VR=4.0V 0.075” *Pulse test: Pulse width 200 µsec, Duty cycle 2% www.mccsemi.com UF1A thru UF1K t rr +0.5A 0 -0.25 MCC NOTE:1.Rise Time = 7ns max. Input Impedance = 1 megohm. 22pF 2.Rise Time = 10ns max. Source Impedance = 50 Ohms -1.0 SET TIME BASE FOR 50 ns/cm 1cm Fig. 1-REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM 10 TYPICAL TJ = 25 ¢J PEAK FORWARD SURGE CURRENT, AMPERES 100 TJ = 25 ¢J f = 1.0MHz Vsig = 50m Vp-p UF1A IFM, Apk 1.0 UF1G 10 0.1 UF1K 1 0. 1 1 10 100 .01 0 .2 .4 .6 .8 1.0 1.2 1. 4 REVERSE VOLTAGE, VOLTS Fig. 2-FORWARD CHARACTERISTICS PEAK FORWARD SURGE CURRENT, AMPERES Fig. 3- TYPICAL JUNCTION CAPACITANCE 30 25 20 15 10 5 8.3ms SINGLE HALF SINE WAVE JEDEC METHOD 2.0 AVERAGE FORWARD CURRENT AMPERES SINGLE PHASE HALF W AVE RESISTIVE OR INDUCTIVE P.C.B MOUNTED ON 0.315×0.315"(8.0×8.0mm) PAD AREAS 1.0 25 50 75 100 125 150 175 1 2 5 10 20 50 100 LEAD TEMPERATURE, ¢J NUMBER OF CYCLES AT 60Hz Fig. 4- FORWARD CURRENT DERATING CURVE Fig. 5-PEAK FORWARD SURGE CURRENT www.mccsemi.com
UF1D
1. 物料型号: - MCC Catalog Number:UF1A至UF1K

2. 器件简介: - 1A表面贴装超快速整流二极管,适用于表面贴装应用,玻璃钝化结,便于拾放,高温度焊接:260°C持续10秒,超快速回复时间,适用于高效率整流,50至800伏特。

3. 引脚分配: - DO-214AA (SMBJ) (LEAD FRAME),操作温度:-50°C至+150°C,存储温度:-50°C至+150°C,最大热阻:30°C/W结至引脚,存储温度:-50°C至+150°C。

4. 参数特性: - 电气特性在25°C下,除非另有说明。 - 平均正向电流(IF(AV)):1.0A,TL=100°C。 - 正向峰值浪涌电流(IFSM):30A,8.3ms,半正弦波。 - 最大瞬时正向电压(VF):UF1A-D为1.0V,UF1G为1.4V,UF1J-K为1.7V。 - 最大直流反向电流在额定直流阻断电压下(IR):10μA至100A,TA=25°C至125°C。 - 最大反向恢复时间(Trr):UF1A-G为50ns,UF1J-K为100ns,IF=0.5A,IR=1.0A,I=0.25A。 - 典型结电容(CJ):17pF,测量频率1.0MHz,VR=4.0V。

5. 功能详解: - 提供了反向恢复时间特性和测试电路图,正向特性图,典型结电容图,正向电流降额曲线图,以及正向峰值浪涌电流图。

6. 应用信息: - 适用于需要高效率整流的应用,如电源、电机驱动等。

7. 封装信息: - 封装类型为DO-214AA (SMBJ)。

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