MX23L12824XI-12G

MX23L12824 128M-BIT MASK ROM FEATURES • Bit organization - 16Mb x 8 (byte mode) - 8Mb x 16 (word mode) • Fast access time - Random access:120/25ns(max.) in 3.0~3.6V 120/30ns(max.) in 2.7~3.6V • Page size - 8 words per page • Current - Operating:50mA - Standby:15uA(max.) • Supply voltage - VCC : 2.7 ~ 3.6V - VCCQ : 2.7 ~ 3.6V • Package - 64 ball mini BGA (10.0mm X 13.0mm, ball pitch 1.0mm), Pb-free, RoHS compliant • Temperature - -25~85° C PIN DESCRIPTION Symbol A0~A23 D0~D15 OE# BYTE# VCC VCCQ GND NC Pin Function Address Inputs, A0 not used in word mode Data Outputs Output Enable Input Word/Byte mode Selection Power Supply Pin Output VCC Pin Ground Pin No Connection CE0#,CE1#,CE2# Chip Enable Input MODE SELECTION CE# Disabled Enabled Enabled Enabled OE# X H L L BYTE# X X L H D0~D15 High Z High Z D0~D7 D0~D7 D8~D15 HighZ HighZ HighZ D8~D15 Power Stand-by Active Active Active Chip Enable Truth Table CE2# L L L L H H H H CE1# L L H H L L H H CE0# L H L H L H L H DEVICE Enabled Disabled Disabled Disabled Enabled Enabled Enabled Disabled Note: For single-chip applications, CE2#, CE1# can be strapped to GND. P/N:PM1063 REV. 1.3, NOV. 15, 2005 1 MX23L12824 PIN CONFIGURATION 64 Mini BGA (Top View, Ball Down) A1 A1 B1 A2 C1 A3 D1 A4 E1 D8 F1 BYTE# G1 A23 H1 CE2# A2 A6 B2 GND C2 A7 D2 A5 E2 D1 F2 D0 G2 A0 H2 NC A3 A8 B3 A9 C3 A10 D3 A11 E3 D9 F3 D10 G3 D2 H3 VCC A4 NC B4 CE0# C4 A12 D4 NC E4 D3 F4 D11 G4 VCCQ H4 GND A5 A13 B5 A14 C5 A15 D5 NC E5 D4 F5 D12 G5 D5 H5 D13 A6 VCC B6 NC C6 NC D6 NC E6 NC F6 NC G6 D6 H6 GND A7 A18 B7 A19 C7 A20 D7 A16 E7 D15 F7 NC G7 D14 H7 D7 A8 A22 B8 CE1# C8 A21 D8 A17 E8 NC F8 OE# G8 NC H8 NC 13.0 mm 10.0 mm P/N:PM1063 REV. 1.3, NOV. 15, 2005 2 MX23L12824 ORDER INFORMATION Part No. MX23L12824XI-12G Speed 120ns Package 64 ball mini BGA Grade Industrial Remark Pb-free, RoHS compliant ABSOLUTE MAXIMUM RATINGS Item Voltage on any Pin Relative to VSS Ambient Operating Temperature Storage Temperature Symbol VIN Topr Tstg Ratings -0.3V to 3.9V -25° C to 85° C -65° C to 125° C DC CHARACTERISTICS (Ta = -25° C ~ 85° C, VCC = 2.7V~3.6V) Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Standby Current (CMOS) Input Capacitance Output Capacitance Symbol VOH VOL VIH VIL ILI ILO ICC ISTB CIN COUT MIN. 2.4V 2.2V -0.5V MAX. 0.4V VCCQ+0.5V 0.8V 5uA 5uA 50mA 15uA 10pF 10pF Conditions IOH = -400uA IOL = 1.6mA 0V, VCC 0V, VCC f=5MHz, CE#=VIL, OE#=VIH all output open CE#>VCC-0.2V Ta = 25° C, f = 1MHZ Ta = 25° C, f = 1MHZ AC CHARACTERISTICS (Ta = -25° C ~ 85° C, VCC = 2.7V~3.6V) Item Read Cycle Time Address Access Time Chip Enable Access Time Page Access Time Output Enable Time Output Hold After Address Output High Z Delay Symbol tRC tAA tACE tPA tOE tOH tHZ 23L12824-12 MIN. MAX. 120ns 120ns 120ns 30ns (VCC=2.7~3.6V) 25ns (VCC=3.0~3.6V) 30ns 0ns 20ns Note:Output high-impedance delay (tHZ) is measured from OE# or CE# going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested. P/N:PM1063 REV. 1.3, NOV. 15, 2005 3 MX23L12824 AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load 0.4V~2.4V 5ns 1.5V 1.5V See Figure 100pF output load capacitance IOH (load)=-400uA DOUT IOL (load)=1.6mA C