MX23L8103XI-70

MX23L8103 8M-BIT MASK ROM FEATURES • Bit organization - 1M x 8 (byte mode) - 512K x 16 (word mode) • Fast access time - Random access:70ns(max.) • Current - Operating:15mA - Standby:5uA • Supply voltage - 2.7V ~ 3.6V • Package - 48 pin TSOP(12mm x 20mm) - 48 ball mini BGA (6mm x 8mm, ball pitch 0.8mm, ball size 0.3mm) • Temperature - -40 ~ 85° C PIN DESCRIPTION Symbol A0~A18 D0~D14 D15/A-1 CE# OE# Byte# VCC VSS NC Pin Function Address Inputs Data Outputs D15 (Word Mode)/ LSB Address (Byte Mode) Chip Enable Input Output Enable Input Word/ Byte Mode Selection Power Supply Pin Ground Pin No Connection PIN CONFIGURATION 48 TSOP (Top View) A15 A14 A13 A12 A11 A10 A9 A8 NC NC NC NC NC NC NC A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# VSS D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC D11 D3 D10 D2 D9 D1 D8 D0 OE# VSS CE# A0 MX23L8103 (Normal Type) P/N:PM0622 REV. 1.7, MAY 03, 2004 1 MX23L8103 48 mini BGA (Top View, Ball Down) A1 A3 B1 A4 C1 A2 D1 A1 E1 A0 F1 CE# G1 OE# H1 Vss A2 A7 B2 A17 C2 A6 D2 A5 E2 D0 F2 D8 G2 D9 H2 D1 A3 NC B3 NC C3 A18 D3 NC E3 D2 F3 D10 G3 D11 H3 D3 A4 NC B4 NC C4 NC D4 NC E4 D5 F4 D12 G4 Vcc H4 D4 A5 A9 B5 A8 C5 A10 D5 A11 E5 D7 F5 D14 G5 D13 H5 D6 A6 A13 B6 A12 C6 A14 D6 A15 8.0 mm E6 A16 F6 BYTE# G6 D15/A-1 H6 Vss 6.0 mm ORDER INFORMATION Part No. MX23L8103TC-70 MX23L8103TC-90 MX23L8103TC-12 MX23L8103TI-70 MX23L8103TI-90 MX23L8103TI-12 MX23L8103XI-70 MX23L8103XI-90 MX23L8103XI-12 Speed 70ns 90ns 120ns 70ns 90ns 120ns 70ns 90ns 120ns Package 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 pin TSOP 48 ball mini BGA 48 ball mini BGA 48 ball mini BGA Grade Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Note: Industrial grade temperature: -40 ~ 85° C Commercial grade temperature: 0 ~ 70° C MODE SELECTION CE# H L L L P/N:PM0622 OE# X H L L Byte# X X H L D15/A-1 X X Output Input D0~D7 High Z High Z D0~D7 D0~D7 D8~D15 High Z High Z D8~D15 High Z Mode Word Byte Power Stand-by Active Active Active REV. 1.7, MAY 03, 2004 2 MX23L8103 ABSOLUTE MAXIMUM RATINGS Item Supply Voltage Relative to VSS Voltage on any Pin Relative to VSS Ambient Operating Temperature Storage Temperature Symbol VCC VIN Topr Tstg Ratings -0.3V to 4.3V -0.3V to 3.9V -40° C to 85° C -65° C to 125° C DC CHARACTERISTICS (Ta = -40° C ~ 85° C, VCC = 2.7V~3.6V) Item Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Current Standby Current (CMOS) Input Capacitance Output Capacitance Symbol VOH VOL VIH VIL ILI ILO ICC ISTB CIN COUT MIN. 2.4V 2.1V -0.3V MAX. 0.4V VCC+0.3V 0.8V 5uA 5uA 15mA 5uA 10pF 10pF Conditions IOH = -400uA IOL = 1.6mA 0V, VCC 0V, VCC f=5MHz, CE#=VIL, OE#=VIH all output open CE#>VCC-0.2V Ta = 25° C, f = 1MHZ Ta = 25° C, f = 1MHZ AC CHARACTERISTICS (Ta = -40° C ~ 85° C, VCC = 2.7V~3.6V) Item Read Cycle Time Address Access Time Chip Enable Access Time Output Enable Time Output Hold After Address Output High Z Delay Symbol tRC tAA tACE tOE tOH tHZ 23L8103-70 MIN. MAX. 70ns 70ns 70ns 30ns 0ns 20ns 23L8103-90 MIN. MAX. 90ns 90ns 90ns 35ns 0ns 20ns 23L8103-12 MIN. MAX. 120ns 120ns 120ns 50ns 0ns 20ns Note:Output high-impedance delay (tHZ) is measured from OE# or CE# going high, and this parameter guaranteed by design over the full voltage and temperature operating range - not tested. P/N:PM0622 REV. 1.7, MAY 03, 2004 3 MX23L8103 AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Level Output Timing Level Output Load Note: 0V~ 3.0V 5ns 1.5V 1.5V See Figure IOH (load)=-0.4mA DOUT IOL (load)=1.6mA C