MX25L25673G
MX25L25673G
3V, 256M-BIT [x 1/x 2/x 4]
CMOS MXSMIO® (SERIAL MULTI I/O)
FLASH MEMORY
Key Features
• Protocol Support - Single I/O, Dual I/O and Quad I/O
• Supports DTR (Double Transfer Rate) Mode
• Supports clock frequencies up to 133MHz
• Quad I/O mode is permanently enabled
P/N: PM2323
Macronix Proprietary
1
Rev. 1.7, April 15, 2021
MX25L25673G
Contents
1. FEATURES............................................................................................................................................................... 4
2. GENERAL DESCRIPTION...................................................................................................................................... 5
Table 1. Read performance Comparison.....................................................................................................5
3. PIN CONFIGURATIONS .......................................................................................................................................... 6
4. PIN DESCRIPTION................................................................................................................................................... 6
5. BLOCK DIAGRAM.................................................................................................................................................... 7
6. DATA PROTECTION................................................................................................................................................. 8
Table 2. Protected Area Sizes......................................................................................................................9
Table 3. 4K-bit Secured OTP Definition.....................................................................................................10
7. Memory Organization............................................................................................................................................ 11
Table 4. Memory Organization................................................................................................................... 11
8. DEVICE OPERATION............................................................................................................................................. 12
8-1. 256Mb Address Protocol........................................................................................................................... 15
8-2. Quad Peripheral Interface (QPI) Read Mode........................................................................................... 16
9. COMMAND DESCRIPTION.................................................................................................................................... 17
9-1.
9-2.
9-3.
9-4.
9-5.
9-6.
9-7.
9-8.
9-9.
9-10.
9-11.
9-12.
9-13.
9-14.
9-15.
9-16.
9-17.
9-18.
9-19.
9-20.
9-21.
9-22.
9-23.
9-24.
9-25.
P/N: PM2323
Table 5. Command Set...............................................................................................................................17
Write Enable (WREN)............................................................................................................................... 22
Write Disable (WRDI)................................................................................................................................ 23
Factory Mode Enable (FMEN).................................................................................................................. 24
Read Identification (RDID)........................................................................................................................ 25
Release from Deep Power-down (RDP), Read Electronic Signature (RES)............................................ 26
Read Electronic Manufacturer ID & Device ID (REMS)............................................................................ 28
QPI ID Read (QPIID)................................................................................................................................ 29
Table 6. ID Definitions ...............................................................................................................................29
Read Status Register (RDSR).................................................................................................................. 30
Read Configuration Register (RDCR)....................................................................................................... 31
Table 7. Status Register.............................................................................................................................34
Table 8. Configuration Register..................................................................................................................35
Table 9. Output Driver Strength Table........................................................................................................36
Table 10. Dummy Cycle and Frequency Table (MHz)................................................................................36
Write Status Register (WRSR).................................................................................................................. 37
Table 11. Protection Modes........................................................................................................................38
Enter 4-byte mode (EN4B)....................................................................................................................... 40
Exit 4-byte mode (EX4B).......................................................................................................................... 40
Read Data Bytes (READ)......................................................................................................................... 41
Read Data Bytes at Higher Speed (FAST_READ)................................................................................... 42
Dual Output Read Mode (DREAD)........................................................................................................... 44
2 x I/O Read Mode (2READ).................................................................................................................... 45
Quad Read Mode (QREAD)..................................................................................................................... 46
4 x I/O Read Mode (4READ).................................................................................................................... 47
4 x I/O Double Transfer Rate Read Mode (4DTRD)................................................................................. 49
Preamble Bit ............................................................................................................................................ 51
4 Byte Address Command Set.................................................................................................................. 55
Burst Read................................................................................................................................................ 58
Performance Enhance Mode - XIP (execute-in-place)............................................................................. 59
Sector Erase (SE)..................................................................................................................................... 62
Block Erase (BE32K)................................................................................................................................ 63
Macronix Proprietary
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Rev. 1.7, April 15, 2021
MX25L25673G
9-26.
9-27.
9-28.
9-29.
9-30.
9-31.
9-32.
9-33.
9-34.
Block Erase (BE)...................................................................................................................................... 64
Chip Erase (CE)........................................................................................................................................ 65
Page Program (PP).................................................................................................................................. 66
4 x I/O Page Program (4PP)..................................................................................................................... 68
Deep Power-down (DP)............................................................................................................................ 69
Write Security Register (WRSCUR).......................................................................................................... 70
Read Security Register (RDSCUR).......................................................................................................... 71
Enter Secured OTP (ENSO)..................................................................................................................... 72
Exit Secured OTP (EXSO)........................................................................................................................ 72
Table 12. Security Register Definition........................................................................................................73
9-35. Write Protection Selection (WPSEL)......................................................................................................... 74
9-36. Advanced Sector Protection..................................................................................................................... 76
Table 13. Lock Register..............................................................................................................................77
Table 14. SPB Register..............................................................................................................................78
Table 15. DPB Register .............................................................................................................................80
9-37. Program/Erase Suspend/Resume............................................................................................................ 82
9-38. Erase Suspend......................................................................................................................................... 82
9-39. Program Suspend..................................................................................................................................... 82
9-40. Write-Resume........................................................................................................................................... 84
9-41. No Operation (NOP)................................................................................................................................. 84
9-42. Software Reset (Reset-Enable (RSTEN) and Reset (RST)).................................................................... 84
9-43. Read SFDP Mode (RDSFDP)................................................................................................................... 86
10. RESET.................................................................................................................................................................. 87
Table 16. Reset Timing-(Power On)...........................................................................................................87
Table 17. Reset Timing-(Other Operation).................................................................................................87
11. POWER-ON STATE.............................................................................................................................................. 88
12. ELECTRICAL SPECIFICATIONS......................................................................................................................... 89
Table 18. ABSOLUTE MAXIMUM RATINGS.............................................................................................89
Table 19. CAPACITANCE TA = 25°C, f = 1.0 MHz.....................................................................................89
Table 20. DC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V) .........................91
Table 21. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V) .........................92
13. OPERATING CONDITIONS.................................................................................................................................. 94
Table 22. Power-Up/Down Voltage and Timing .........................................................................................96
13-1. INITIAL DELIVERY STATE....................................................................................................................... 96
14. ERASE AND PROGRAMMING PERFORMANCE............................................................................................... 97
15. ERASE AND PROGRAMMING PERFORMANCE (Factory Mode).................................................................... 97
16. DATA RETENTION............................................................................................................................................... 98
17. LATCH-UP CHARACTERISTICS......................................................................................................................... 98
18. ORDERING INFORMATION................................................................................................................................. 99
19. PART NAME DESCRIPTION.............................................................................................................................. 100
20. PACKAGE INFORMATION................................................................................................................................. 101
20-1. 16-pin SOP (300mil)............................................................................................................................... 101
20-2. 8-pins SOP (200mil)................................................................................................................................ 102
20-3. 8-land WSON (6x5mm).......................................................................................................................... 103
20-4. 8-land WSON (8x6mm 3.4 x 4.3EP)....................................................................................................... 104
21. REVISION HISTORY .......................................................................................................................................... 105
P/N: PM2323
Macronix Proprietary
3
Rev. 1.7, April 15, 2021
MX25L25673G
3V 256M-BIT [x 1/x 2/x 4] CMOS MXSMIO® (SERIAL MULTI I/O)
FLASH MEMORY
1. FEATURES
SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Advanced Security Features
- Block lock protection
The BP0-BP3 and T/B status bits define the size
of the area to be protected against program and
erase instructions
- Individual sector protection function (Solid
Protect)
• Additional 4K bit secure OTP
- Features unique identifier
- Factory locked identifiable, and customer
lockable
• Command Reset
• Program/Erase Suspend and Resume operation
• Electronic Identification
- JEDEC 1-byte manufacturer ID and 2-byte
device ID
- RES command for 1-byte Device ID
- REMS command for 1-byte manufacturer ID and
1-byte device ID
• Supports Serial Flash Discoverable Parameters
(SFDP) mode
GENERAL
• Supports Serial Peripheral Interface -- Mode 0 and
Mode 3
• Single Power Supply Operation
- 2.7 to 3.6 volts for read, erase, and program
operations
• 268,435,456 x 1 bit structure
or 134,217,728 x 2 bits (two I/O mode) structure
or 67,108,864 x 4 bits (four I/O mode) structure
• Protocol Support
- Single I/O, Dual I/O and Quad I/O
• Latch-up protected to 100mA from -1V to Vcc +1V
• Low Vcc write inhibit is from 1.5V to 2.5V
• Fast read for SPI mode
- Supports clock frequencies up to 133MHz for all
protocols
- Supports Fast Read, 2READ, DREAD, 4READ,
QREAD instructions
- Supports DTR (Double Transfer Rate) Mode
- Configurable dummy cycle number for fast read
operation
• Default Quad I/O enable (QE bit=1), and can not be
changed
• Supports Performance Enhance Mode - XIP
(execute-in-place)
• Quad Peripheral Interface (QPI) available
• Equal 4K byte Sectors, or Equal Blocks with 32K
byte or 64K byte each
- Any Block can be erased individually
• Programming :
- 256byte page buffer
- Quad Input/Output page program(4PP) to enhance
program performance
• Typical 100,000 erase/program cycles
• 20 years data retention
P/N: PM2323
HARDWARE FEATURES
• SCLK Input
- Serial clock input
• SI/SIO0
- Serial Data Input or Serial Data Input/Output for
2 x I/O read mode and 4 x I/O read mode
• SO/SIO1
- Serial Data Output or Serial Data Input/Output
for 2 x I/O read mode and 4 x I/O read mode
• SIO2
- Serial data Input & Output for 4 x I/O read mode
• SIO3
- Serial data Input & Output for 4 x I/O read mode
• RESET#
- Hardware Reset pin
• PACKAGE
- 16-pin SOP (300mil)
- 8-pins SOP (200mil)
- 8-land WSON (6x5mm)
- 8-land WSON (8x6mm 3.4 x 4.3EP)
- All devices are RoHS Compliant and
Halogen-free
Macronix Proprietary
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Rev. 1.7, April 15, 2021
MX25L25673G
2. GENERAL DESCRIPTION
MX25L25673G is 256Mb bits Serial NOR Flash memory, which is configured as 33,554,432 x 8 internally. When it
is in two or four I/O mode, the structure becomes 134,217,728 bits x 2 or 67,108,864 bits x 4.
MX25L25673G features a serial peripheral interface and software protocol allowing operation on a simple 3-wire
bus while it is in single I/O mode. The three bus signals are a clock input (SCLK), a serial data input (SI), and a
serial data output (SO). Serial access to the device is enabled by CS# input.
When it is in two I/O read mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits
input and data output. When it is in four I/O read mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for
address/dummy bits input and data output.
The MX25L25673G MXSMIO® (Serial Multi I/O) provides sequential read operation on the whole chip.
After program/erase command is issued, auto program/erase algorithms which program/erase and verify the
specified page or sector/block locations will be executed. Program command is executed on byte basis, or page (256
bytes) basis, or word basis. Erase command is executed on 4K-byte sector, 32K-byte block, or 64K-byte block, or
whole chip basis.
To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read
command can be issued to detect completion status of a program or erase operation via WIP bit.
Advanced security features enhance the protection and security functions, please refer to the security features
section for more details.
When the device is not in operation and CS# is high, it will remain in standby mode.
The MX25L25673G utilizes Macronix's proprietary memory cell, which reliably stores memory contents even after
100,000 program and erase cycles.
Table 1. Read performance Comparison
Numbers
Dual Output
Fast Read
of Dummy
Fast Read
(MHz)
Cycles
(MHz)
Quad Output
Fast Read
(MHz)
Dual IO
Fast Read
(MHz)
Quad IO
Fast Read
(MHz)
Quad I/O DT
Read
(MHz)
4
-
-
-
80*
54
-
6
-
-
-
-
80*
54*
8
120*/133R
120*/133R
120*/133R
120/133R
84/104R
70/80R
10
-
-
-
-
120/133R
84/100R
Notes:
1. * mean default status.
2. R mean VCC range = 3.0V-3.6V.
P/N: PM2323
Macronix Proprietary
5
Rev. 1.7, April 15, 2021
MX25L25673G
4. PIN DESCRIPTION
3. PIN CONFIGURATIONS
8-PIN SOP (200mil)
1
2
3
4
CS#
SO/SIO1
SIO2
GND
SYMBOL
CS#
8
7
6
5
VCC
SIO3
SCLK
SI/SIO0
SI/SIO0
SO/SIO1
SCLK
SIO2
8-WSON (8x6mm, 6x5mm)
CS#
SO/SIO1
SIO2
GND
1
2
3
4
8
7
6
5
SIO3
VCC
SIO3
SCLK
SI/SIO0
RESET#*
VCC
GND
NC
Note*: The pin of RESET# will remain internal pull
up function while this pin is not physically
connected in system configuration.
However, the internal pull up function will be
disabled if the system has physical connection
to RESET# pin.
16-PIN SOP (300mil)
SIO3
VCC
RESET#
NC
NC
NC
CS#
SO/SIO1
P/N: PM2323
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
DESCRIPTION
Chip Select
Serial Data Input (for 1 x I/O)/ Serial
Data Input & Output (for 2xI/O or 4xI/
O read mode)
Serial Data Output (for 1 x I/O)/ Serial
Data Input & Output (for 2xI/O or 4xI/
O read mode)
Clock Input
Serial Data Input & Output (for 4xI/O
read mode)
Serial Data Input & Output (for 4xI/O
read mode)
Hardware Reset Pin Active low
+ 3V Power Supply
Ground
No Connection
SCLK
SI/SIO0
NC
NC
NC
NC
GND
SIO2
Macronix Proprietary
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Rev. 1.7, April 15, 2021
MX25L25673G
5. BLOCK DIAGRAM
X-Decoder
Address
Generator
SI/SIO0
SO/SIO1
SIO2 *
SIO3 *
WP# *
HOLD# *
RESET# *
CS#
SCLK
Memory Array
Y-Decoder
Data
Register
Sense
Amplifier
SRAM
Buffer
Mode
Logic
State
Machine
HV
Generator
Clock Generator
Output
Buffer
* Depends on part number options.
P/N: PM2323
Macronix Proprietary
7
Rev. 1.7, April 15, 2021
MX25L25673G
6. DATA PROTECTION
During power transition, there may be some false system level signals which result in inadvertent erasure or
programming. The device is designed to protect itself from these accidental write cycles.
The state machine will be reset as standby mode automatically during power up. In addition, the control register
architecture of the device constrains that the memory contents can only be changed after specific command
sequences have completed successfully.
In the following, there are several features to protect the system from the accidental write cycles during VCC powerup and power-down or from system noise.
• Valid command length checking: The command length will be checked whether it is at byte base and completed
on byte boundary.
• Write Enable (WREN) command: WREN command is required to set the Write Enable Latch bit (WEL) before
other commands to change data.
• Deep Power Down Mode: By entering deep power down mode, the flash device also is under protected from
writing all commands except Release from deep power down mode command (RDP) and Read Electronic
Signature command (RES), and softreset command.
• Advanced Security Features: there are some protection and security features which protect content from
inadvertent write and hostile access.
P/N: PM2323
Macronix Proprietary
8
Rev. 1.7, April 15, 2021
MX25L25673G
I. Block lock protection
- The Software Protected Mode (SPM) use (BP3, BP2, BP1, BP0 and T/B) bits to allow part of memory to be
protected as read only. The protected area definition is shown as Table 2 Protected Area Sizes, the protected
areas are more flexible which may protect various area by setting value of BP0-BP3 bits.
Table 2. Protected Area Sizes
Protected Area Sizes (T/B bit = 0)
Status bit
BP3
BP2
BP1
BP0
0
0
0
0
0
0
0
1
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
Protect Level
256Mb
0 (none)
1 (1 block, protected block 511th)
2 (2 blocks, protected block 510th-511th)
3 (4 blocks, protected block 508th-511th)
4 (8 blocks, protected block 504th-511th)
5 (16 blocks, protected block 496th-511th)
6 (32 blocks, protected block 480th-511th)
7 (64 blocks, protected block 448th-511th)
8 (128 blocks, protected block 384th-511th)
9 (256 blocks, protected block 256th-511th)
10 (512 blocks, protected all)
11 (512 blocks, protected all)
12 (512 blocks, protected all)
13 (512 blocks, protected all)
14 (512 blocks, protected all)
15 (512 blocks, protected all)
Protected Area Sizes (T/B bit = 1)
BP3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
P/N: PM2323
Status bit
BP2
BP1
0
0
0
0
0
1
0
1
1
0
1
0
1
1
1
1
0
0
0
0
0
1
0
1
1
0
1
0
1
1
1
1
BP0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Protect Level
256Mb
0 (none)
1 (1 block, protected block 0th)
2 (2 blocks, protected block 0th-1st)
3 (4 blocks, protected block 0th-3rd)
4 (8 blocks, protected block 0th-7th)
5 (16 blocks, protected block 0th-15th)
6 (32 blocks, protected block 0th-31st)
7 (64 blocks, protected block 0th-63rd)
8 (128 blocks, protected block 0th-127th)
9 (256 blocks, protected block 0th-255th)
10 (512 blocks, protected all)
11 (512 blocks, protected all)
12 (512 blocks, protected all)
13 (512 blocks, protected all)
14 (512 blocks, protected all)
15 (512 blocks, protected all)
Macronix Proprietary
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Rev. 1.7, April 15, 2021
MX25L25673G
II. Additional 4K-bit secured OTP for an unique identifier to provide an 4K-bit one-time program area for setting
a device unique serial number. This may be accomplished in the factory or by an end systems customer.
- Security register bit 0 indicates whether the Secured OTP area is locked by factory or not.
- The 4K-bit secured OTP area is programmed by entering secured OTP mode (with the Enter Security OTP
command), and going through a normal program procedure. Exiting secured OTP mode is done by issuing the
Exit Security OTP command.
- Customer may lock-down the customer lockable secured OTP by writing WRSCUR(write security register)
command to set customer lock-down bit1 as "1". Please refer to "Table 12. Security Register Definition" for security
register bit definition and "Table 3. 4K-bit Secured OTP Definition" for address range definition.
- Note: Once lock-down whatever by factory or customer, it cannot be changed any more. While in 4K-bit secured
OTP mode, array access is not allowed.
Table 3. 4K-bit Secured OTP Definition
Address range
Size
Standard Factory Lock
xxx000-xxx00F
128-bit
ESN (electrical serial number)
xxx010-xxx1FF
3968-bit
N/A
P/N: PM2323
Macronix Proprietary
10
Customer Lock
Determined by customer
Rev. 1.7, April 15, 2021
MX25L25673G
7. Memory Organization
Table 4. Memory Organization
Sector
…
8183
1FF7000h
1FF7FFFh
509
1018
…
…
…
…
1FEFFFFh
1FE8000h
1FE8FFFh
8167
1FE7000h
1FE7FFFh
…
…
8168
1FE0000h
1FE0FFFh
8159
1FDF000h
1FDFFFFh
…
8160
8152
1FD8000h
1FD8FFFh
8151
1FD7000h
1FD7FFFh
…
1019
1FF0FFFh
1FEF000h
…
1020
individual block
lock/unlock unit:64K-byte
1FF0000h
8175
…
510
8176
…
1021
individual 16 sectors
lock/unlock unit:4K-byte
…
…
1FF8FFFh
…
1FF8000h
…
1022
1FFFFFFh
8184
1023
511
Address Range
1FFF000h
…
8191
…
Block(64K-byte) Block(32K-byte)
8144
1FD0000h
1FD0FFFh
47
002F000h
002FFFFh
0020FFFh
001F000h
001FFFFh
24
0018000h
0018FFFh
23
0017000h
0017FFFh
…
2
8
0008000h
0008FFFh
7
0007000h
0007FFFh
…
…
000FFFFh
…
0010FFFh
000F000h
…
0
0010000h
15
…
0
16
…
1
0
0000000h
0000FFFh
Macronix Proprietary
11
…
0020000h
31
…
32
…
1
…
0027FFFh
…
0028FFFh
027000h
…
3
P/N: PM2323
0028000h
39
…
4
individual block
lock/unlock unit:64K-byte
40
…
2
…
…
5
…
individual block
lock/unlock unit:64K-byte
individual 16 sectors
lock/unlock unit:4K-byte
Rev. 1.7, April 15, 2021
MX25L25673G
8. DEVICE OPERATION
1. Before a command is issued, status register should be checked to ensure device is ready for the intended
operation.
2. When an incorrect command is written to this device, it enters standby mode and stays in standby mode until the
next CS# falling edge. In standby mode, This device's SO pin should be High-Z.
3. When a correct command is written to this device, it enters active mode and stays in active mode until the next
CS# rising edge.
4. Input data is latched on the rising edge of Serial Clock (SCLK) and data shifts out on the falling edge of SCLK.
The difference of Serial mode 0 and mode 3 is shown as "Figure 1. Serial Modes Supported".
5. For the following instructions: RDID, RDSR, RDSCUR, READ/READ4B, FAST_READ/FAST_READ4B,
2READ/2READ4B, DREAD/DREAD4B, 4READ/4READ4B, QREAD/QREAD4B, RDSFDP, RES, REMS,
QPIID, RDDPB, RDSPB, RDLR, RDEAR, RDCR, the shifted-in instruction sequence is followed by a dataout sequence. After any bit of data being shifted out, the CS# can be high. For the following instructions:
WREN, WRDI, WRSR, SE/SE4B, BE32K/BE32K4B, BE/BE4B, CE, PP/PP4B, 4PP/4PP4B, DP, ENSO, EXSO,
WRSCUR, EN4B, EX4B, WPSEL, GBLK, GBULK, SUSPEND, RESUME, NOP, RSTEN, RST, EQIO, RSTQIO
the CS# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed.
6. While a Write Status Register, Program, or Erase operation is in progress, access to the memory array is
ignored and will not affect the current operation of Write Status Register, Program, or Erase.
Figure 1. Serial Modes Supported
CPOL
CPHA
shift in
(Serial mode 0)
0
0
SCLK
(Serial mode 3)
1
1
SCLK
SI
shift out
MSB
SO
MSB
Note:
CPOL indicates clock polarity of Serial master, CPOL=1 for SCLK high while idle, CPOL=0 for SCLK low while not
transmitting. CPHA indicates clock phase. The combination of CPOL bit and CPHA bit decides which Serial mode is
supported.
P/N: PM2323
Macronix Proprietary
12
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 2. Serial Input Timing
tSHSL
CS#
tCHSL
tSLCH
tCHSH
tSHCH
SCLK
tDVCH
tCHCL
tCHDX
tCLCH
LSB
MSB
SI
SO
High-Z
Figure 3. Serial Input Timing (DTR mode)
tSHSL
CS#
tCHSL
tSLCH
tSHCH
SCLK
tDVCH
tCHDX
SIO[3:0]
P/N: PM2323
tCHCL
tCLDX
tDVCL
MSB
tCLCH
LSB
Macronix Proprietary
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Rev. 1.7, April 15, 2021
MX25L25673G
Figure 4. Output Timing (STR mode)
CS#
tCH
SCLK
tCLQV
tCLQX
tCL
tCLQV
tSHQZ
tCLQX
LSB
SO
SI
ADDR.LSB IN
Figure 5. Output Timing (DTR mode)
CS#
tCH
SCLK
tCLQV
tCLQV
tCLQX
tCL
tSHQZ
tCLQX
SIO0
SIO1
SIO2
SIO3
tQVD
P/N: PM2323
Macronix Proprietary
14
Rev. 1.7, April 15, 2021
MX25L25673G
8-1. 256Mb Address Protocol
The original 24 bit address protocol of Serial NOR Flash can only access density size below 128Mb. For the
memory device of 256Mb and above, the 32bit address is requested for access higher memory size. The
MX25L25673G provides three different methods to access the whole 256Mb density:
(1)Command entry 4-byte address mode: Issue Enter 4-Byte mode command to set up the 4BYTE bit in
Configuration Register bit. After 4BYTE bit has been set, the number of address cycle become 32-bit.
(2)Extended Address Register (EAR): configure the memory device into two 128Mb segments to select which one
is active through the EAR bit “0”.
(3)4-byte Address Command Set: When issuing 4-byte address command set, 4-byte address (A31-A0) is
requested after the instruction code. Please note that it is not necessary to issue EN4B command before issuing
any of 4-byte command set.
Enter 4-Byte Address Mode
In 4-byte Address mode, all instructions are 32-bits address clock cycles. By using EN4B and EX4B to enable and
disable the 4-byte address mode.
When 4-byte address mode is enabled, the EAR becomes "don't care" for all instructions requiring 4-byte
address. The EAR function will be disabled when 4-byte mode is enabled.
Extended Address Register (Configurable)
The device provides an 8-bit volatile register for extended Address Register: it identifies the extended address (A31~A24)
above 128Mb density by using original 3-byte address.
Extended Address Register (EAR)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
A31
A30
A29
A28
A27
A26
A25
A24
For the MX25L25673G the A31 to A25 are Don't Care. During EAR, reading these bits will read as 0. The bit 0 is
default as "0".
Figure 6. Top and Bottom 128M bits
Top 128Mb
01FFFFFFh
EAR= 1
01000000h
Bottom 128Mb
00FFFFFFh
00000000h
EAR= 0 (default)
When under EAR mode, Read, Program, Erase operates in the selected segment by using 3-byte address mode.
For the read operation, the whole array data can be continually read out with one command. Data output starts from
the selected top or bottom 128Mb, but it can cross the boundary. When the last byte of the segment is reached,
the next byte (in a continuous reading) is the first byte of the next segment. However, the EAR (Extended Address
Register) value does not change. The random access reading can only be operated in the selected segment.
The Chip erase command will erase the whole chip and is not limited by EAR selected segment.
P/N: PM2323
Macronix Proprietary
15
Rev. 1.7, April 15, 2021
MX25L25673G
8-2. Quad Peripheral Interface (QPI) Read Mode
QPI protocol enables user to take full advantage of Quad I/O Serial NOR Flash by providing the Quad I/O interface
in command cycles, address cycles and as well as data output cycles.
Enable QPI mode
By issuing command EQIO(35h), the QPI mode is enabled. After QPI mode is enabled, the device enters quad
mode (4-4-4).
Figure 7. Enable QPI Sequence
CS#
MODE 3
SCLK
0
1
2
3
4
5
6
7
MODE 0
SIO0
35h
SIO[3:1]
Reset QPI (RSTQIO)
To reset the QPI mode, the RSTQIO (F5h) command is required. After the RSTQIO command is issued, the device
returns from QPI mode (4 I/O interface in command cycles) to SPI mode (1 I/O interface in command cycles).
Note:
For EQIO and RSTQIO commands, CS# high width has to follow "From Write/Erase/Program to Read Status
Register" specification of tSHSL (defined in "Table 21. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V
- 3.6V)") for next instruction.
Figure 8. Reset QPI Mode
CS#
SCLK
SIO[3:0]
P/N: PM2323
F5h
Macronix Proprietary
16
Rev. 1.7, April 15, 2021
MX25L25673G
9. COMMAND DESCRIPTION
Table 5. Command Set
Read/Write Array Commands
Command
(byte)
Mode
READ
FAST READ
(normal read) (fast read data)
2READ
DREAD
(1I 2O read)
(2 x I/O read
command)
4READ
QREAD
(1I 4O read)
4DTRD (Quad
I/O DT Read)
(4 x I/O read
command)
1st byte
SPI
3/4
03 (hex)
SPI
3/4
0B (hex)
SPI
3/4
BB (hex)
SPI
3/4
3B (hex)
SPI/QPI
3/4
EB (hex)
SPI
3/4
6B (hex)
SPI/QPI
3/4
ED (hex)
2nd byte
ADD1
ADD1
ADD1
ADD1
ADD1
ADD1
ADD1
3rd byte
ADD2
ADD2
ADD2
ADD2
ADD2
ADD2
ADD2
4th byte
ADD3
ADD3
ADD3
ADD3
ADD3
ADD3
ADD3
Dummy*
Dummy*
Dummy*
Dummy*
Dummy*
Dummy*
Address Bytes
5th byte
Data Cycles
Action
n bytes read
out until CS#
goes high
Command
(byte)
PP
(page program)
Mode
SPI/QPI
n bytes read
n bytes read
n bytes read
n bytes read
n bytes read
n bytes read
out until CS# out by 2 x I/O
out by Dual
out by 4 x I/O out by Quad
out (Double
goes high
until CS# goes output until until CS# goes output until Transfer Rate)
high
CS# goes high
high
CS# goes high by 4xI/O until
CS# goes high
4PP
(quad page
program)
SPI
SE
(sector erase)
SPI/QPI
BE 32K
(block erase
32KB)
SPI/QPI
BE
(block erase
64KB)
SPI/QPI
CE
(chip erase)
SPI/QPI
Address Bytes
3/4
3/4
3/4
3/4
3/4
0
1st byte
02 (hex)
38 (hex)
20 (hex)
52 (hex)
D8 (hex)
60 or C7 (hex)
2nd byte
ADD1
ADD1
ADD1
ADD1
3rd byte
ADD2
ADD2
ADD2
ADD2
4th byte
ADD3
ADD3
ADD3
ADD3
5th byte
Data Cycles
Action
1-256
1-256
to program the quad input to
to erase the
to erase the
selected page program the selected sector selected 32K
selected page
block
to erase the to erase whole
selected block
chip
* Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in configuration register.
P/N: PM2323
Macronix Proprietary
17
Rev. 1.7, April 15, 2021
MX25L25673G
Read/Write Array Commands (4 Byte Address Command Set)
Command
(byte)
Mode
READ4B
FAST READ4B
2READ4B
DREAD4B
4READ4B
QREAD4B
Address Bytes
SPI
4
SPI
4
SPI
4
SPI
4
SPI/QPI
4
SPI
4
1st byte
13 (hex)
0C (hex)
BC (hex)
3C (hex)
EC (hex)
6C (hex)
2nd byte
ADD1
ADD1
ADD1
ADD1
ADD1
ADD1
3rd byte
ADD2
ADD2
ADD2
ADD2
ADD2
ADD2
4th byte
ADD3
ADD3
ADD3
ADD3
ADD3
ADD3
5th byte
ADD4
6th byte
ADD4
ADD4
ADD4
ADD4
ADD4
Dummy
Dummy
Dummy
Dummy
Dummy
Data Cycles
Action
read data byte by read data byte by read data byte by Read data byte by read data byte by Read data byte by
4 byte address
4 byte address 2 x I/O with 4 byte Dual Output with 4 x I/O with 4 byte Quad Output with
address
4 byte address
address
4 byte address
PP4B
4PP4B
Address Bytes
4DTRD4B
(Quad I/O DT
Read)
SPI/QPI
3/4
SPI/QPI
4
1st byte
EE (hex)
2nd byte
ADD1
Command
(byte)
Mode
SPI
4
BE4B
(block erase
64KB)
SPI/QPI
4
BE32K4B
(block erase
32KB)
SPI/QPI
4
SE4B
(Sector erase
4KB)
SPI/QPI
4
12 (hex)
3E (hex)
DC (hex)
5C (hex)
21 (hex)
ADD1
ADD1
ADD1
ADD1
ADD1
3rd byte
ADD2
ADD2
ADD2
ADD2
ADD2
ADD2
4th byte
ADD3
ADD3
ADD3
ADD3
ADD3
ADD3
5th byte
ADD4
ADD4
ADD4
ADD4
ADD4
ADD4
6th byte
Dummy*
1-256
to program the
selected page
with 4byte
address
1-256
Quad input to
program the
selected page
with 4byte
address
to erase the
selected (64KB)
block with 4byte
address
to erase the
selected (32KB)
block with 4byte
address
to erase the
selected (4KB)
sector with 4byte
address
Data Cycles
Action
P/N: PM2323
n bytes read out
(Double Transfer
Rate) by 4xI/O
until CS# goes
high
Macronix Proprietary
18
Rev. 1.7, April 15, 2021
MX25L25673G
Register/Setting Commands
Mode
SPI/QPI
SPI/QPI
SPI/QPI
SPI/QPI
RDCR
(read
configuration
register)
SPI/QPI
1st byte
06 (hex)
04 (hex)
41 (hex)
05 (hex)
15 (hex)
Command
(byte)
FMEN
WREN
WRDI
(factory mode
(write enable) (write disable)
enable)
RDSR
(read status
register)
WRSR
RDEAR
(write status/ (read extended
configuration
address
register)
register)
SPI/QPI
SPI/QPI
01 (hex)
2nd byte
Values
3rd byte
Values
C8 (hex)
4th byte
5th byte
Data Cycles
Action
Command
(byte)
Mode
1st byte
sets the (WEL)
resets the
enable factory to read out the to read out the
write enable
(WEL) write
mode
values of the values of the
latch bit
enable latch bit
status register configuration
register
WREAR
WPSEL
(write extended
(Write Protect
address
Selection)
register)
SPI/QPI
C5 (hex)
SPI
68 (hex)
EQIO
(Enable QPI)
RSTQIO
(Reset QPI)
EN4B
(enter 4-byte
mode)
SPI
35 (hex)
QPI
F5 (hex)
SPI/QPI
B7 (hex)
1-2
to write new
values of the
status/
configuration
register
EX4B
(exit 4-byte
mode)
SPI/QPI
E9 (hex)
read extended
address
register
PGM/ERS
Suspend
(Suspends
Program/
Erase)
SPI/QPI
B0 (hex)
2nd byte
3rd byte
4th byte
5th byte
Data Cycles
Action
Command
(byte)
Mode
1st byte
1
write extended to enter and
address
enable individal
register
block protect
mode
PGM/ERS
Resume
(Resumes
Program/
Erase)
SPI/QPI
30 (hex)
Entering the
QPI mode
Exiting the QPI to enter 4-byte to exit 4-byte
mode
mode and set mode and clear
4BYTE bit as 4BYTE bit to
"1"
be "0"
DP (Deep
power down)
RDP (Release
from deep
power down)
SBL
(Set Burst
Length)
SPI/QPI
B9 (hex)
SPI/QPI
AB (hex)
SPI/QPI
C0 (hex)
enters deep
power down
mode
release from
deep power
down mode
to set Burst
length
2nd byte
3rd byte
4th byte
5th byte
Data Cycles
Action
P/N: PM2323
Macronix Proprietary
19
Rev. 1.7, April 15, 2021
MX25L25673G
ID/Security Commands
REMS
RDID
RES
(read electronic
QPIID
(read identific- (read electronic
manufacturer & (QPI ID Read)
ation)
ID)
device ID)
Mode
SPI
SPI/QPI
SPI
QPI
Address Bytes
0
0
0
0
1st byte
9F (hex)
AB (hex)
90 (hex)
AF (hex)
Command
(byte)
2nd byte
x
3rd byte
x
4th byte
x
RDSCUR
WRSCUR
(read security (write security
register)
register)
Mode
SPI/QPI
SPI/QPI
Address Bytes
0
0
1st byte
2B (hex)
2F (hex)
EXSO
(exit secured
OTP)
SPI/QPI
3
5A (hex)
SPI/QPI
0
B1 (hex)
SPI/QPI
0
C1 (hex)
x
ADD2
ADD1 (Note 1)
ADD3
ID in QPI
interface
Dummy (8)
Read SFDP
mode
WRSPB
(SPB bit
program)
SPI
4
ESSPB
(all SPB bit
erase)
SPI
0
RDSPB
(read SPB
status)
SPI
4
GBLK
(gang block
lock)
SPI
0
GBULK
(gang block
unlock)
SPI
0
E3 (hex)
E4 (hex)
E2 (hex)
7E (hex)
98 (hex)
whole chip
write protect
whole chip
unprotect
outputs JEDEC to read out
output the
ID: 1-byte
1-byte Device Manufacturer
Manufacturer
ID
ID & Device ID
ID & 2-byte
(Note 2)
Device ID
Command
(byte)
ENSO
(enter secured
OTP)
ADD1
5th byte
Action
RDSFDP
2nd byte
ADD1
ADD1
3rd byte
ADD2
ADD2
4th byte
ADD3
ADD3
5th byte
ADD4
ADD4
Data Cycles
Action
1
to read value to set the lockof security
down bit as
register
"1" (once lockdown, cannot
be updated)
Mode
Address Bytes
WRLR
(write lock
register)
SPI
0
RDLR
(read lock
register)
SPI
0
WRDPB
(write DPB
register)
SPI
4
RDDPB
(read DPB
register)
SPI
4
1st byte
2C (hex)
2D (hex)
Command
(byte)
E1 (hex)
E0 (hex)
2nd byte
ADD1
ADD1
3rd byte
ADD2
ADD2
4th byte
ADD3
ADD3
5th byte
ADD4
ADD4
1
1
Data Cycles
to enter the
to exit the
4K-bit secured 4K-bit secured
OTP mode
OTP mode
2
2
Action
P/N: PM2323
Macronix Proprietary
20
Rev. 1.7, April 15, 2021
MX25L25673G
Reset Commands
Mode
SPI/QPI
SPI/QPI
RST
(Reset
Memory)
SPI/QPI
1st byte
00 (hex)
66 (hex)
99 (hex)
Command
(byte)
NOP
RSTEN
(No Operation) (Reset Enable)
2nd byte
3rd byte
4th byte
5th byte
Action
Note 1: The count base is 4-bit for ADD(2) and Dummy(2) because of 2 x I/O. And the MSB is on SO/SIO1 which is different from 1 x I/O condition.
Note 2: ADD=00H will output the manufacturer ID first and ADD=01H will output device ID first.
Note 3: It is not recommended to adopt any other code not in the command definition table, which will potentially enter
the hidden mode.
Note 4: The RSTEN command must be executed before executing the RST command. If any other command is issued
in-between RSTEN and RST, the RST command will be ignored.
Note 5: The number in parentheses after "Dummy" stands for how many clock cycles it has.
P/N: PM2323
Macronix Proprietary
21
Rev. 1.7, April 15, 2021
MX25L25673G
9-1. Write Enable (WREN)
The Write Enable (WREN) instruction sets the Write Enable Latch (WEL) bit. Instructions like PP/PP4B, 4PP/4PP4B,
SE/SE4B, BE32K/BE32K4B, BE/BE4B, CE, and WRSR that are intended to change the device content, should be
preceded by the WREN instruction.
The sequence of issuing WREN instruction is: CS# goes low→send WREN instruction code→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can be accepted by this instruction. The SIO[3:1] are don't
care in SPI mode.
Figure 9. Write Enable (WREN) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
06h
High-Z
SO
Figure 10. Write Enable (WREN) Sequence (QPI Mode)
CS#
0
Mode 3
1
SCLK
Mode 0
Command
06h
SIO[3:0]
P/N: PM2323
Macronix Proprietary
22
Rev. 1.7, April 15, 2021
MX25L25673G
9-2. Write Disable (WRDI)
The Write Disable (WRDI) instruction resets the Write Enable Latch (WEL) bit.
The sequence of issuing WRDI instruction is: CS# goes low→send WRDI instruction code→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can be accepted by this instruction. The SIO[3:1] are don't
care in SPI mode.
The WEL bit is reset in the following situations:
- Power-up
- Reset# pin driven low
- WRDI command completion
- WRSR command completion
- PP/PP4B command completion
- 4PP/4PP4B command completion
- SE/SE4B command completion
- BE32K/BE32K4B command completion
- BE/BE4B command completion
- CE command completion
- PGM/ERS Suspend command completion
- Softreset command completion
- WRSCUR command completion
- WPSEL command completion
- GBLK command completion
- GBULK command completion
- WREAR command completion
- WRLR command completion
- WRSPB command completion
- WRDPB command completion
- ESSPB command completion
Figure 11. Write Disable (WRDI) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
SI
SO
P/N: PM2323
Command
04h
High-Z
Macronix Proprietary
23
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 12. Write Disable (WRDI) Sequence (QPI Mode)
CS#
0
Mode 3
1
SCLK
Mode 0
Command
04h
SIO[3:0]
9-3. Factory Mode Enable (FMEN)
The Factory Mode Enable (FMEN) instruction enhances Program and Erase performance to increase factory
production throughput. The FMEN instruction needs to be combined with the instructions which are intended to
change the device content, like PP/PP4B, 4PP/4PP4B, SE/SE4B, BE32K/BE32K4B, BE/BE4B, and CE.
The sequence of issuing FMEN instruction is: CS# goes low→send FMEN instruction code→ CS# goes high. A valid
factory mode operation needs to be included three sequences: WREN instruction → FMEN instruction→ Program or
Erase instruction.
Suspend command is not acceptable under factory mode.
The FMEN is reset in the following situations
- Power-up
- Reset# pin driven low
- PP/PP4B command completion
- 4PP/4PP4B command completion
- SE/SE4B command completion
- BE32K/BE32K4B command completion
- BE/BE4B command completion
- CE command completion
- Softreset command completion
Both SPI (8 clocks) and QPI (2 clocks) command cycle can be accepted by this instruction. The SIO[3:1] are don't
care in SPI mode.
Figure 13. Factory Mode Enable (FMEN) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
SO
P/N: PM2323
41h
High-Z
Macronix Proprietary
24
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 14. Factory Mode Enable (FMEN) Sequence (QPI Mode)
CS#
0
Mode 3
1
SCLK
Mode 0
Command
41h
SIO[3:0]
9-4. Read Identification (RDID)
The RDID instruction is for reading the 1-byte manufacturer ID and the 2-byte Device ID that follows. The Macronix
Manufacturer ID and Device ID are listed as Table 6 ID Definitions.
The sequence of issuing RDID instruction is: CS# goes low→ send RDID instruction code→24-bits ID data out on
SO→ to end RDID operation can drive CS# to high at any time during data out.
While Program/Erase operation is in progress, it will not decode the RDID instruction, therefore there's no effect on
the cycle of program/erase operation which is currently in progress. When CS# goes high, the device is at standby
stage.
Figure 15. Read Identification (RDID) Sequence (SPI mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
13 14 15 16 17 18
28 29 30 31
SCLK
Mode 0
Command
SI
9Fh
Manufacturer Identification
SO
High-Z
7
6
5
2
1
MSB
P/N: PM2323
Device Identification
0 15 14 13
3
2
1
0
MSB
Macronix Proprietary
25
Rev. 1.7, April 15, 2021
MX25L25673G
9-5. Release from Deep Power-down (RDP), Read Electronic Signature (RES)
The Release from Deep Power-down (RDP) instruction is completed by driving Chip Select (CS#) High. When Chip
Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device was not previously in the
Deep Power-down mode, the transition to the Stand-by Power mode is immediate. If the device was previously in
the Deep Power-down mode, though, the transition to the Stand-by Power mode is delayed by tRES1, and Chip
Select (CS#) must remain High for at least tRES1(max), as specified in "Table 21. AC CHARACTERISTICS (Temperature
= -40°C to 85°C, VCC = 2.7V - 3.6V)". Once in the Stand-by Power mode, the device waits to be selected, so that it can
receive, decode and execute instructions. The RDP instruction is only for releasing from Deep Power Down Mode.
Reset# pin goes low will release the Flash from deep power down mode.
RES instruction is for reading out the old style of 8-bit Electronic Signature ID, whose values are shown as "Table
6. ID Definitions". This is not the same as RDID instruction. It is not recommended to use for new design. For new
design, please use RDID instruction.
The RDP and RES are allowed to execute in Deep power-down mode, except if the device is in progress of
program/erase/write cycle; In this case, there is no effect on the current program/erase/write cycle that is in
progress.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
The RES instruction ends when CS# goes high, after the ID been read out at least once. The ID outputs repeatedly
if continuously send the additional clock cycles on SCLK while CS# is at low. If the device was not previously in
Deep Power-down mode, the device transition to standby mode is immediate. If the device was previously in Deep
Power-down mode, there's a delay of tRES2 to transit to standby mode, and CS# must remain to high at least
tRES2(max). Once in the standby mode, the device waits to be selected, so it can be receive, decode, and execute
instruction.
Figure 16. Read Electronic Signature (RES) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38
SCLK
Mode 0
Command
SI
ABh
tRES2
3 Dummy Bytes
23 22 21
3
2
1
0
MSB
SO
Electronic Signature ID
High-Z
7
6
5
4
3
2
1
0
MSB
Deep Power-down Mode
P/N: PM2323
Macronix Proprietary
26
Stand-by Mode
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 17. Read Electronic Signature (RES) Sequence (QPI Mode)
CS#
MODE 3
0
1
2
3
4
5
6
7
SCLK
tRES2
MODE 0
3 Dummy Bytes
Command
SIO[3:0]
X
ABh
X
X
X
X
X
H0
L0
MSB LSB
Data In
Electronic
Signature ID
Stand-by Mode
Deep Power-down Mode
Figure 18. Release from Deep Power-down (RDP) Sequence (SPI Mode)
CS#
0
Mode 3
1
2
3
4
5
6
tRES1
7
SCLK
Mode 0
Command
SI
ABh
High-Z
SO
Deep Power-down Mode
Stand-by Mode
Figure 19. Release from Deep Power-down (RDP) Sequence (QPI Mode)
CS#
Mode 3
tRES1
0
1
SCLK
Mode 0
Command
SIO[3:0]
ABh
Deep Power-down Mode
P/N: PM2323
Macronix Proprietary
27
Stand-by Mode
Rev. 1.7, April 15, 2021
MX25L25673G
9-6. Read Electronic Manufacturer ID & Device ID (REMS)
The REMS instruction returns both the JEDEC assigned manufacturer ID and the device ID. The Device ID values
are listed in "Table 6. ID Definitions".
The REMS instruction is initiated by driving the CS# pin low and sending the instruction code "90h" followed by two
dummy bytes and one address byte (A7-A0). After which the manufacturer ID for Macronix (C2h) and the device
ID are shifted out on the falling edge of SCLK with the most significant bit (MSB) first. If the address byte is 00h,
the manufacturer ID will be output first, followed by the device ID. If the address byte is 01h, then the device ID will
be output first, followed by the manufacturer ID. While CS# is low, the manufacturer and device IDs can be read
continuously, alternating from one to the other. The instruction is completed by driving CS# high.
Figure 20. Read Electronic Manufacturer & Device ID (REMS) Sequence (SPI Mode only)
CS#
SCLK
Mode 3
0
1
2
Mode 0
3
4
5
6
7
8
Command
SI
9 10
2 Dummy Bytes
15 14 13
90h
3
2
1
0
High-Z
SO
CS#
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCLK
ADD (1)
SI
7
6
5
4
3
2
1
0
Manufacturer ID
SO
7
6
5
4
3
2
1
Device ID
0
7
6
5
4
3
2
MSB
MSB
1
0
7
MSB
Notes:
(1) ADD=00H will output the manufacturer's ID first and ADD=01H will output device ID first.
P/N: PM2323
Macronix Proprietary
28
Rev. 1.7, April 15, 2021
MX25L25673G
9-7. QPI ID Read (QPIID)
The QPIID Read instruction can be used to identify the Device ID and Manufacturer ID. The sequence of issuing
the QPIID instruction is as follows: CS# goes low→send QPI ID instruction→Data out on SO→CS# goes high. Most
significant bit (MSB) first.
After the command cycle, the device will immediately output data on the falling edge of SCLK. The Manufacturer ID,
Memory Type, and Memory density data byte will be output continuously, until the CS# goes high.
Table 6. ID Definitions
Command Type
RDID
9Fh
RES
ABh
REMS
90h
QPIID
AFh
P/N: PM2323
MX25L25673G
Manufacturer ID
C2
Memory type
Memory density
20
19
Electronic Signature ID
18
Manufacturer ID
Device ID
C2
18
Manufacturer ID
Memory type
Memory density
C2
20
19
Macronix Proprietary
29
Rev. 1.7, April 15, 2021
MX25L25673G
9-8. Read Status Register (RDSR)
The RDSR instruction is for reading Status Register Bits. The Read Status Register can be read at any time (even
in program/erase/write status register condition). It is recommended to check the Write in Progress (WIP) bit before
sending a new instruction when a program, erase, or write status register operation is in progress.
The sequence of issuing RDSR instruction is: CS# goes low→ send RDSR instruction code→ Status Register data
out on SO.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
Figure 21. Read Status Register (RDSR) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
SCLK
Mode 0
command
05h
SI
SO
Status Register Out
High-Z
7
6
5
4
3
2
1
Status Register Out
0
7
6
5
4
3
2
1
0
7
MSB
MSB
Figure 22. Read Status Register (RDSR) Sequence (QPI Mode)
CS#
Mode 3 0
1
2
3
4
5
6
7
N
SCLK
Mode 0
SIO[3:0]
05h H0 L0 H0 L0 H0 L0
H0 L0
MSB LSB
Status Byte Status Byte Status Byte
P/N: PM2323
Macronix Proprietary
30
Status Byte
Rev. 1.7, April 15, 2021
MX25L25673G
9-9. Read Configuration Register (RDCR)
The RDCR instruction is for reading Configuration Register Bits. The Read Configuration Register can be read at
any time (even in program/erase/write configuration register condition). It is recommended to check the Write in
Progress (WIP) bit before sending a new instruction when a program, erase, or write configuration register operation
is in progress.
The sequence of issuing RDCR instruction is: CS# goes low→ send RDCR instruction code→ Configuration Register
data out on SO.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
Figure 23. Read Configuration Register (RDCR) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
SCLK
Mode 0
command
15h
SI
SO
Configuration register Out
High-Z
7
6
5
4
3
2
1
0
Configuration register Out
7
6
5
4
3
2
1
0
7
MSB
MSB
Figure 24. Read Configuration Register (RDCR) Sequence (QPI Mode)
CS#
Mode 3 0
1
2
3
4
5
6
7
N
SCLK
Mode 0
SIO[3:0]
15h H0 L0 H0 L0 H0 L0
H0 L0
MSB LSB
Config. Byte Config. Byte Config. Byte
P/N: PM2323
Macronix Proprietary
31
Config. Byte
Rev. 1.7, April 15, 2021
MX25L25673G
For user to check if Program/Erase operation is finished or not, RDSR instruction flow are shown as follows:
Figure 25. Program/Erase flow with read array data
start
WREN command
RDSR command*
WEL=1?
No
Yes
Program/erase command
Write program data/address
(Write erase address)
RDSR command
WIP=0?
No
Yes
RDSR command
Read WEL=0, BP[3:0],
and QE data
Read array data
(same address of PGM/ERS)
No
Verify OK?
Yes
Program/erase successfully
Program/erase
another block?
No
Program/erase fail
Yes
* Issue RDSR to check BP[3:0].
* If WPSEL = 1, issue RDSPB to check the block status.
Program/erase completed
P/N: PM2323
Macronix Proprietary
32
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 26. Program/Erase flow without read array data (read P_FAIL/E_FAIL flag)
start
WREN command
RDSR command*
WEL=1?
No
Yes
Program/erase command
Write program data/address
(Write erase address)
RDSR command
WIP=0?
No
Yes
RDSR command
Read WEL=0, BP[3:0],
and QE data
RDSCUR command
Yes
P_FAIL/E_FAIL =1 ?
No
Program/erase fail
Program/erase successfully
Program/erase
another block?
No
Yes
* Issue RDSR to check BP[3:0].
* If WPSEL = 1, issue RDSPB to check the block status.
Program/erase completed
P/N: PM2323
Macronix Proprietary
33
Rev. 1.7, April 15, 2021
MX25L25673G
Status Register
The definition of the status register bits is as below:
WIP bit. The Write in Progress (WIP) bit, a volatile bit, indicates whether the device is busy in program/erase/write
status register progress. When WIP bit sets to 1, which means the device is busy in program/erase/write status
register progress. When WIP bit sets to 0, which means the device is not in progress of program/erase/write status
register cycle.
WEL bit. The Write Enable Latch (WEL) bit is a volatile bit that is set to “1” by the WREN instruction. WEL needs to be
set to “1” before the device can accept program and erase instructions, otherwise the program and erase instructions
are ignored. WEL automatically clears to “0” when a program or erase operation completes. To ensure that both WIP
and WEL are “0” and the device is ready for the next program or erase operation, it is recommended that WIP be
confirmed to be “0” before checking that WEL is also “0” (Please refer to "Figure 29. WRSR flow"). If a program or
erase instruction is applied to a protected memory area, the instruction will be ignored and WEL will clear to “0”.
BP3, BP2, BP1, BP0 bits. The Block Protect (BP3, BP2, BP1, BP0) bits, non-volatile bits, indicate the protected area
(as defined in "Table 2. Protected Area Sizes") of the device to against the program/erase instruction without hardware
protection mode being set. To write the Block Protect (BP3, BP2, BP1, BP0) bits requires the Write Status Register (WRSR)
instruction to be executed. Those bits define the protected area of the memory to against Page Program (PP), Sector
Erase (SE), Block Erase 32KB (BE32K), Block Erase (BE) and Chip Erase (CE) instructions (only if Block Protect bits
(BP3:BP0) set to 0, the CE instruction can be executed). The BP3, BP2, BP1, BP0 bits are "0" as default. Which is unprotected.
QE bit. The Quad Enable (QE) bit is permanently set to "1". When QE is "1", Quad mode is enabled and Quad mode
commands are supported along with Single and Dual mode commands.
Table 7. Status Register
bit7
bit6
Reserved
QE
(Quad
Enable)
Reserved
1=Quad
Enable
bit5
BP3
(level of
protected
block)
bit4
BP2
(level of
protected
block)
bit3
BP1
(level of
protected
block)
bit2
BP0
(level of
protected
block)
(note 1)
(note 1)
(note 1)
(note 1)
Non-volatile
bit
Non-volatile
bit
Non-volatile Non-volatile Non-volatile
bit
bit
bit
Table
2
"Protected
Area
Size".
Note 1: Please refer to the
Reserved
P/N: PM2323
Macronix Proprietary
34
bit1
bit0
WEL
WIP
(write enable
(write in
latch)
progress bit)
1=write
1=write
enable
operation
0=not write 0=not in write
enable
operation
volatile bit
volatile bit
Rev. 1.7, April 15, 2021
MX25L25673G
Configuration Register
The Configuration Register is able to change the default status of Flash memory. Flash memory will be configured
after the CR bit is set.
ODS bit
The output driver strength (ODS1, ODS0) bits are volatile bits, which indicate the output driver level (as defined in "Table 9.
Output Driver Strength Table") of the device. The Output Driver Strength is defaulted as 30 Ohms when delivered from
factory. To write the ODS bits requires the Write Status Register (WRSR) instruction to be executed.
TB bit
The Top/Bottom (TB) bit is a non-volatile OTP bit. The Top/Bottom (TB) bit is used to configure the Block Protect
area by BP bit (BP3, BP2, BP1, BP0), starting from TOP or Bottom of the memory array. The TB bit is defaulted as
“0”, which means Top area protect. When it is set as “1”, the protect area will change to Bottom area of the memory
device. To write the TB bits requires the Write Status Register (WRSR) instruction to be executed.
PBE bit
The Preamble Bit Enable (PBE) bit is a volatile bit. It is used to enable or disable the preamble bit data pattern
output on dummy cycles. The PBE bit is defaulted as “0”, which means preamble bit is disabled. When it is set as “1”,
the preamble bit will be enabled, and inputted into dummy cycles. To write the PBE bits requires the Write Status
Register (WRSR) instruction to be executed.
4BYTE Indicator bit
By writing EN4B instruction, the 4BYTE bit may be set as "1" to access the address length of 32-bit for memory area
of higher density (large than 128Mb). The default state is "0" as the 24-bit address mode. The 4BYTE bit may be
cleared by power-off or writing EX4B instruction to reset the state to be "0".
Table 8. Configuration Register
bit7
DC1
(Dummy
cycle 1)
bit6
DC0
(Dummy
cycle 0)
(Note 2)
(Note 2)
volatile bit
volatile bit
bit5
4 BYTE
0=3-byte
address
mode
1=4-byte
address
mode
(Default=0)
volatile bit
bit4
bit3
PBE
TB
(Preamble bit (top/bottom
Enable)
selected)
0=Disable
1=Enable
volatile bit
bit2
Reserved
bit1
bit0
ODS 1
ODS 0
(output driver (output driver
strength)
strength)
0=Top area
protect
1=Bottom
area protect
(Default=0)
x
(Note 1)
(Note 1)
OTP
x
volatile bit
volatile bit
Note 1: Please refer to "Table 9. Output Driver Strength Table"
Note 2: Please refer to "Table 10. Dummy Cycle and Frequency Table (MHz)"
P/N: PM2323
Macronix Proprietary
35
Rev. 1.7, April 15, 2021
MX25L25673G
Table 9. Output Driver Strength Table
ODS1
ODS0
0
0
1
1
0
1
0
1
Output Driver Strength
Resistance (Ohm)
%
30 Ohms (Default)
75% (Default)
45 Ohms
60%
90 Ohms
45%
15 Ohms
100%
Table 10. Dummy Cycle and Frequency Table (MHz)
(STR Mode)
Numbers of Dummy
DC[1:0]
Fast Read
clock cycles
00 (default)
8
120/133R
01
8
120/133R
10
8
120/133R
11
8
120/133R
DC[1:0]
00 (default)
01
10
11
DC[1:0]
00 (default)
01
10
11
Numbers of Dummy
clock cycles
4
8
4
8
Note
Impedance at VCC/2
Dual Output Fast
Read
120/133R
120/133R
120/133R
120/133R
Quad Output Fast
Read
120/133R
120/133R
120/133R
120/133R
Dual IO Fast Read
80
120/133R
80
120/133R
Numbers of Dummy
Quad IO Fast Read
clock cycles
6
80
4
54
8
84/104R
10
120/133R
(DTR Mode)
DC[1:0]
00 (default)
01
10
11
Numbers of Dummy
Quad IO DTR Read
clock cycles
6
54
6
54
8
70/80R
10
84/100R
Note: "R" mean VCC range= 3.0V-3.6V.
P/N: PM2323
Macronix Proprietary
36
Rev. 1.7, April 15, 2021
MX25L25673G
9-10. Write Status Register (WRSR)
The WRSR instruction is for changing the values of Status Register Bits and Configuration Register Bits. Before
sending WRSR instruction, the Write Enable (WREN) instruction must be decoded and executed to set the Write
Enable Latch (WEL) bit in advance. The WRSR instruction can change the value of Block Protect (BP3, BP2, BP1,
BP0) bits to define the protected area of memory (as shown in Table 2), but has no effect on bit1(WEL) and bit0 (WIP)
of the status register.
The sequence of issuing WRSR instruction is: CS# goes low→ send WRSR instruction code→ Status Register data
on SI→Configuration Register data on SI→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) commands cycle can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
The CS# must go high exactly at the 8 bits or 16 bits data boundary; otherwise, the instruction will be rejected and
not executed. The self-timed Write Status Register cycle time (tW) is initiated as soon as Chip Select (CS#) goes
high. The Write in Progress (WIP) bit still can be check out during the Write Status Register cycle is in progress.
The WIP sets 1 during the tW timing, and sets 0 when Write Status Register Cycle is completed, and the Write
Enable Latch (WEL) bit is reset.
Figure 27. Write Status Register (WRSR) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Mode 0
SI
SO
command
01h
Status
Register In
7
6
4
5
Configuration
Register In
2
3
0 15 14 13 12 11 10 9
1
8
MSB
High-Z
Note: The CS# must go high exactly at 8 bits or 16 bits data boundary to completed the write register command.
Figure 28. Write Status Register (WRSR) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
Mode 3
SCLK
Mode 0
Mode 0
Command
SIO[3:0]
P/N: PM2323
SR in
H0
01h
L0
CR in
H1
Macronix Proprietary
37
L1
Rev. 1.7, April 15, 2021
MX25L25673G
Software Protected Mode (SPM):
- The WREN instruction may set the WEL bit and can change the values of BP3, BP2, BP1, BP0. The protected
area, which is defined by BP3, BP2, BP1, BP0 and T/B bit, is at software protected mode (SPM).
Table 11. Protection Modes
Mode
Status register condition
Memory
Software protection
mode (SPM)
Status register can be written
in (WEL bit is set to "1") and
the BP0-BP3 bits can be changed
The protected area cannot
be programmed or erased.
Note:
1. As defined by the values in the Block Protect (BP3, BP2, BP1, BP0) bits of the Status Register, as shown in
"Table 2. Protected Area Sizes".
P/N: PM2323
Macronix Proprietary
38
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 29. WRSR flow
start
WREN command
RDSR command
No
WEL=1?
Yes
WRSR command
Write status register data
RDSR command
No
WIP=0?
Yes
RDSR command
Read WEL=0, BP[3:0],
and QE data
No
Verify OK?
Yes
WRSR successfully
P/N: PM2323
WRSR fail
Macronix Proprietary
39
Rev. 1.7, April 15, 2021
MX25L25673G
9-11. Enter 4-byte mode (EN4B)
The EN4B instruction enables accessing the address length of 32-bit for the memory area of higher density (larger
than 128Mb). The device default is in 24-bit address mode; after sending out the EN4B instruction, the bit5 (4BYTE
bit) of Configuration Register will be automatically set to "1" to indicate the 4-byte address mode has been enabled.
Once the 4-byte address mode is enabled, the address length becomes 32-bit instead of the default 24-bit. There
are three methods to exit the 4-byte mode: writing exit 4-byte mode (EX4B) instruction, Reset or power-off.
All instructions are accepted normally, and just the address bit is changed from 24-bit to 32-bit.
The following commands don't support 4-byte address: RDSFDP, RES and REMS.
The sequence of issuing EN4B instruction is: CS# goes low → send EN4B instruction to enter 4-byte mode (automatically
set 4BYTE bit as "1") → CS# goes high.
9-12. Exit 4-byte mode (EX4B)
The EX4B instruction is executed to exit the 4-byte address mode and return to the default 3-bytes address mode.
After sending out the EX4B instruction, the bit5 (4BYTE bit) of Configuration Register will be cleared to be "0" to
indicate the exit of the 4-byte address mode. Once exiting the 4-byte address mode, the address length will return to
24-bit.
The sequence of issuing EX4B instruction is: CS# goes low → send EX4B instruction to exit 4-byte mode (automatically
clear the 4BYTE bit to be "0") → CS# goes high.
P/N: PM2323
Macronix Proprietary
40
Rev. 1.7, April 15, 2021
MX25L25673G
9-13. Read Data Bytes (READ)
The read instruction is for reading data out. The address is latched on rising edge of SCLK, and data shifts out on
the falling edge of SCLK at a maximum frequency fR. The first address byte can be at any location. The address
is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can
be read out at a single READ instruction. The address counter rolls over to 0 when the highest address has been
reached.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte mode, please refer to the "9-11. Enter 4-byte mode
(EN4B)" section.
The sequence of issuing READ instruction is: CS# goes low→sending READ instruction code→ 3-byte or 4-byte
address on SI→ data out on SO→to end READ operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, READ instruction is rejected without any impact on
the Program/Erase/Write Status Register current cycle.
Figure 30. Read Data Bytes (READ) Sequence (SPI Mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
SCLK
Mode 0
SI
command
03h
24-Bit Address
(Note)
23 22 21
3
2
1
0
MSB
SO
Data Out 1
High-Z
7
6
5
4
3
2
Data Out 2
1
0
7
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
P/N: PM2323
Macronix Proprietary
41
Rev. 1.7, April 15, 2021
MX25L25673G
9-14. Read Data Bytes at Higher Speed (FAST_READ)
The FAST_READ instruction is for quickly reading data out. The address is latched on rising edge of SCLK, and
data of each bit shifts out on the falling edge of SCLK at a maximum frequency fC. The first address byte can be at
any location. The address is automatically increased to the next higher address after each byte data is shifted out,
so the whole memory can be read out at a single FAST_READ instruction. The address counter rolls over to 0 when
the highest address has been reached.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte mode, please refer to the "9-11. Enter 4-byte mode
(EN4B)" section.
Read on SPI Mode The sequence of issuing FAST_READ instruction is: CS# goes low→ send FAST_READ
instruction code→ 3-byte or 4-byte address on SI→ 8 dummy cycles (default)→ data out on SO→ to end FAST_
READ operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, FAST_READ instruction is rejected without any
impact on the Program/Erase/Write Status Register current cycle.
P/N: PM2323
Macronix Proprietary
42
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 31. Read at Higher Speed (FAST_READ) Sequence (SPI Mode)
CS#
SCLK
Mode 3
0
1
2
Mode 0
3
5
6
7
8
9 10
Command
SI
SO
4
28 29 30 31
24-Bit Address
(Note 1)
23 22 21
0Bh
3
2
1
0
High-Z
CS#
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCLK
Configurable
Dummy Cycles
(Note 2)
SI
7
6
5
4
3
2
1
0
DATA OUT 2
DATA OUT 1
SO
7
6
5
4
3
2
1
0
7
MSB
MSB
6
5
4
3
2
1
0
7
MSB
Notes:
1. Please note the above address cycles are base on 3-byte address mode, for 4-byte address mode, the address
cycles will be increased.
2. Configuration Dummy cycle numbers will be different depending on the bit6 & bit7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
43
Rev. 1.7, April 15, 2021
MX25L25673G
9-15. Dual Output Read Mode (DREAD)
The DREAD instruction enables double throughput of the Serial NOR Flash in read mode. The address is latched
on rising edge of SCLK, and data of every two bits (interleave on 2 I/O pins) shift out on the falling edge of SCLK
at a maximum frequency fT. The first address byte can be at any location. The address is automatically increased
to the next higher address after each byte data is shifted out, so the whole memory can be read out at a single
DREAD instruction. The address counter rolls over to 0 when the highest address has been reached. Once writing
DREAD instruction, the following data out will perform as 2-bit instead of previous 1-bit.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte mode, please refer to the "9-11. Enter 4-byte mode
(EN4B)" section.
The sequence of issuing DREAD instruction is: CS# goes low→ send DREAD instruction→3-byte or 4-byte
address on SIO0→ 8 dummy cycles (default) on SIO0→ data out interleave on SIO1 & SIO0→ to end DREAD
operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, DREAD instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
Figure 32. Dual Read Mode Sequence (SPI Mode only)
CS#
0
1
2
3
4
5
6
7
8
…
Command
SI/SIO0
SO/SIO1
30 31 32
9
SCLK
3B
…
24 ADD Cycles
(Note 1)
A23 A22
…
39 40 41 42 43 44 45
Configurable
Dummy Cycles
A1 A0
High Impedance
(Note 2)
Data Out
1
Data Out
2
D6 D4 D2 D0 D6 D4
D7 D5 D3 D1 D7 D5
Notes:
1. Please note the above address cycles are base on 3-byte address mode, for 4-byte address mode, the address
cycles will be increased.
2. Configuration Dummy cycle numbers will be different depending on the bit6 & bit7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
44
Rev. 1.7, April 15, 2021
MX25L25673G
9-16. 2 x I/O Read Mode (2READ)
The 2READ instruction enables double throughput of the Serial NOR Flash in read mode. The address is latched
on rising edge of SCLK, and data of every two bits (interleave on 2 I/O pins) shift out on the falling edge of SCLK at
a maximum frequency fT. The first address byte can be at any location. The address is automatically increased to
the next higher address after each byte data is shifted out, so the whole memory can be read out at a single 2READ
instruction. The address counter rolls over to 0 when the highest address has been reached. Once writing 2READ
instruction, the following address/dummy/data out will perform as 2-bit instead of previous 1-bit.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte mode, please refer to "9-11. Enter 4-byte mode (EN4B)"
section.
The sequence of issuing 2READ instruction is: CS# goes low→ send 2READ instruction→ 3-byte or 4-byte address
interleave on SIO1 & SIO0→ 4 dummy cycles (default) on SIO1 & SIO0→ data out interleave on SIO1 & SIO0→ to
end 2READ operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, 2READ instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
Figure 33. 2 x I/O Read Mode Sequence (SPI Mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
17 18 19 20 21 22 23 24 25 26 27 28 29 30
Mode 3
SCLK
Mode 0
Command
SI/SIO0
SO/SIO1
BBh
12 ADD Cycles
(Note 1)
Configurable
Dummy Cycles
(Note 2)
Data
Out 1
Data
Out 2
A22 A20 A18
A4 A2 A0
D6 D4 D2 D0 D6 D4 D2 D0
A23 A21 A19
A5 A3 A1
D7 D5 D3 D1 D7 D5 D3 D1
Mode 0
Notes:
1. Please note the above address cycles are base on 3-byte address mode, for 4-byte address mode, the address
cycles will be increased.
2. Configuration Dummy cycle numbers will be different depending on the bit6 & bit7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
45
Rev. 1.7, April 15, 2021
MX25L25673G
9-17. Quad Read Mode (QREAD)
The QREAD instruction enables quad throughput of the Serial NOR Flash in read mode. The address is latched on
rising edge of SCLK, and data of every four bits (interleave on 4 I/O pins) shift out on the falling edge of SCLK at a
maximum frequency fQ. The first address byte can be at any location. The address is automatically increased to the
next higher address after each byte data is shifted out, so the whole memory can be read out at a single QREAD
instruction. The address counter rolls over to 0 when the highest address has been reached. Once writing QREAD
instruction, the following data out will perform as 4-bit instead of previous 1-bit.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte mode, please refer to "9-11. Enter 4-byte mode (EN4B)"
section.
The sequence of issuing QREAD instruction is: CS# goes low→ send QREAD instruction → 3-byte or 4-byte
address on SI → 8 dummy cycle (Default) → data out interleave on SIO3, SIO2, SIO1 & SIO0→ to end QREAD
operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, QREAD instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
Figure 34. Quad Read Mode Sequence (SPI Mode only)
CS#
0
1
2
3
4
5
6
7
8
…
Command
SIO0
SIO1
SIO2
SIO3
29 30 31 32 33
9
SCLK
6B
…
24 ADD Cycles
(Note 1)
A23 A22
…
38 39 40 41 42
A2 A1 A0
High Impedance
Configurable
dummy cycles
(Note 2)
Data Data Data
Out 1 Out 2 Out 3
D4 D0 D4 D0 D4
D5 D1 D5 D1 D5
High Impedance
D6 D2 D6 D2 D6
High Impedance
D7 D3 D7 D3 D7
Notes:
1. Please note the above address cycles are base on 3-byte address mode, for 4-byte address mode, the address
cycles will be increased.
2. Configuration Dummy cycle numbers will be different depending on the bit6 & bit7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
46
Rev. 1.7, April 15, 2021
MX25L25673G
9-18. 4 x I/O Read Mode (4READ)
The 4READ instruction enables quad throughput of the Serial NOR Flash in read mode. The address is latched on
rising edge of SCLK, and data of every four bits (interleave on 4 I/O pins) shift out on the falling edge of SCLK at a
maximum frequency fQ. The first address byte can be at any location. The address is automatically increased to the
next higher address after each byte data is shifted out, so the whole memory can be read out at a single 4READ
instruction. The address counter rolls over to 0 when the highest address has been reached. Once writing 4READ
instruction, the following address/dummy/data out will perform as 4-bit instead of previous 1-bit.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte mode, please refer to "9-11. Enter 4-byte mode (EN4B)"
section.
Both SPI (8 clocks) and QPI (2 clocks) commands cycle can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
4 x I/O Read on SPI Mode (4READ) The sequence of issuing 4READ instruction is: CS# goes low→ send 4READ
instruction→ 3-byte or 4-byte address interleave on SIO3, SIO2, SIO1 & SIO0→ 6 dummy cycles (Default) →data
out interleave on SIO3, SIO2, SIO1 & SIO0→ to end 4READ operation can use CS# to high at any time during data
out.
4 x I/O Read on QPI Mode (4READ) The 4READ instruction also support on QPI command mode. The sequence
of issuing 4READ instruction QPI mode is: CS# goes low→ send 4READ instruction→ 3-byte or 4-byte address
interleave on SIO3, SIO2, SIO1 & SIO0→ 6 dummy cycles (Default) →data out interleave on SIO3, SIO2, SIO1 &
SIO0→ to end 4READ operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, 4READ instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
P/N: PM2323
Macronix Proprietary
47
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 35. 4 x I/O Read Mode Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
Mode 3
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
SCLK
Mode 0
Command
6 ADD Cycles
Data
Out 1
Performance
enhance
indicator (Note 1 & 2)
(Note 4)
Data
Out 2
Mode 0
Data
Out 3
Configurable
Dummy Cycles (Note 3)
EBh
A20 A16 A12 A8 A4 A0 P4 P0
D4 D0 D4 D0 D4 D0
SIO1
A21 A17 A13 A9 A5 A1 P5 P1
D5 D1 D5 D1 D5 D1
SIO2
A22 A18 A14 A10 A6 A2 P6 P2
D6 D2 D6 D2 D6 D2
SIO3
A23 A19 A15 A11 A7 A3 P7 P3
D7 D3 D7 D3 D7 D3
SIO0
Notes:
1. Hi-impedance is inhibited for the two clock cycles.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) is inhibited.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
4. Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
Figure 36. 4 x I/O Read Mode Sequence (QPI Mode)
CS#
MODE 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
MODE 3
SCLK
MODE 0
SIO[3:0]
MODE 0
EBh
Data In
A5
A4
A3
A2
A1
24-bit Address
(Note 4)
X
A0
P(7:4)
P(3:0)
Performance
X
X
enhance
indicator (Note 1 & 2)
X
H0
L0
H1
L1
H2
L2
H3
L3
MSB
Data Out
Configurable Dummy Cycles
(Note 3)
Notes:
1. Hi-impedance is inhibited for the two clock cycles.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) is inhibited.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
4. Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the address
cycles will be increased.
P/N: PM2323
Macronix Proprietary
48
Rev. 1.7, April 15, 2021
MX25L25673G
9-19. 4 x I/O Double Transfer Rate Read Mode (4DTRD)
The 4DTRD instruction enables Double Transfer Rate throughput on quad I/O of the Serial NOR Flash in read
mode. A Quad Enable (QE) bit of status Register must be set to "1" before sending the 4DTRD instruction. The
address (interleave on 4 I/O pins) is latched on both rising and falling edge of SCLK, and data (interleave on 4 I/O
pins) shift out on both rising and falling edge of SCLK. The 8-bit address can be latched-in at one clock, and 8-bit
data can be read out at one clock, which means four bits at rising edge of clock, the other four bits at falling edge
of clock. The first address byte can be at any location. The address is automatically increased to the next higher
address after each byte data is shifted out, so the whole memory can be read out at a single 4DTRD instruction.
The address counter rolls over to 0 when the highest address has been reached. Once writing 4DTRD instruction,
the following address/dummy/data out will perform as 8-bit instead of previous 1-bit.
Both SPI (8 clocks) and QPI (2 clocks) commands cycles can be accepted by this instruction. The SIO[3:1] are
don't care during SPI mode.
While Program/Erase/Write Status Register cycle is in progress, 4DTRD instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
P/N: PM2323
Macronix Proprietary
49
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 37. Fast Quad I/O DT Read (4DTRD) Sequence (SPI Mode)
CS#
Mode 3
0
7
SCLK
8
9
10
11
16
…
Mode 0
17
18
…
Command
Performance
Enhance Indicator
3 ADD Cycles
Configurable
Dummy Cycle
A20 A16
…
A4 A0
P4 P0
D4 D0 D4 D0 D4
SIO1
A21 A17
…
A5 A1
P5 P1
D5 D1 D5 D1 D5
SIO2
A22 A18
…
A6 A2
P6
P2
D6 D2 D6 D2 D6
SIO3
A23 A19
…
A7 A3
P7
P3
D7 D3 D7 D3 D7
SIO0
EDh
Notes:
1. Hi-impedance is inhibited for this clock cycle.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) will result in entering the performance enhance mode.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
4. Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the address
cycles will be increased.
Figure 38. Fast Quad I/O DT Read (4DTRD) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
11
10
SCLK
12
…
Mode 0
Command
3 ADD Cycles
Performance
Enhance Indicator
Configurable
Dummy Cycle
SIO[3:0]
EDh
A20
|
A23
A16
|
A19
A12
|
A15
A8
|
A11
A4
|
A7
A0
|
A3
P1
P0
H0
L0
H1
L1
H2
Notes:
1. Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the address
cycles will be increased.
2. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
50
Rev. 1.7, April 15, 2021
MX25L25673G
9-20. Preamble Bit
The Preamble Bit data pattern supports system/memory controller to determine valid window of data output more
easily and improve data capture reliability while the flash memory is running in high frequency.
Preamble Bit data pattern can be enabled or disabled by setting the bit4 of Configuration register (Preamble bit
Enable bit). Once the CR is set, the preamble bit is inputted into dummy cycles.
Enabling preamble bit will not affect the function of enhance mode bit. In Dummy cycles, performance enhance
mode bit still operates with the same function. Preamble bit will output after performance enhance mode bit.
The preamble bit is a fixed 8-bit data pattern (00110100). While dummy cycle number reaches 10, the complete
8 bits will start to output right after the performance enhance mode bit. While dummy cycle is not sufficient of 10
cycles, the rest of the preamble bits will be cut. For example, 8 dummy cycles will cause 6 preamble bits to output,
and 6 dummy cycles will cause 4 preamble bits to output.
Figure 39. SDR 1I/O (10DC)
CS#
SCLK
…
…
Dummy cycle
Command
cycle
SI
CMD
Address cycle
An
…
Preamble bits
A0
SO
7
6
5
4
3
2
1
0
D7
D6
D7
D6
…
Figure 40. SDR 1I/O (8DC)
CS#
SCLK
…
…
Dummy cycle
Command
cycle
SI
SO
P/N: PM2323
CMD
Address cycle
An
…
Preamble bits
A0
7
6
5
Macronix Proprietary
51
4
3
2
D5
D4
…
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 41. SDR 2I/O (10DC)
CS#
SCLK
…
…
Dummy cycle
Command
cycle
SIO0
CMD
SIO1
Address cycle
Toggle
bits
Preamble bits
A(n-1)
…
A0
7
6
5
4
3
2
1
0
D6
D4
D2
D0
An
…
A1
7
6
5
4
3
2
1
0
D7
D5
D3
D1
…
…
Figure 42. SDR 2I/O (8DC)
CS#
SCLK
…
…
Dummy cycle
Command
cycle
SIO0
SIO1
P/N: PM2323
CMD
Address cycle
Toggle
bits
Preamble bits
A(n-1)
…
A0
7
6
5
4
3
2
D6
D4
D2
D0
An
…
A1
7
6
5
4
3
2
D7
D5
D3
D1
Macronix Proprietary
52
…
…
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 43. SDR 4I/O (10DC)
CS#
SCLK
…
…
Dummy cycle
Command
cycle
Toggle
bits
Address cycle
Preamble bits
A(n-3)
…
A0
7
6
5
4
3
2
1
0
D4
D0
SIO1
A(n-2)
…
A1
7
6
5
4
3
2
1
0
D5
D1
SIO2
A(n-1)
…
A2
7
6
5
4
3
2
1
0
D6
D2
…
SIO3
An
…
A3
7
6
5
4
3
2
1
0
D7
D3
…
SIO0
CMD
…
…
Figure 44. SDR 4I/O (8DC)
CS#
SCLK
…
…
Dummy cycle
Command
cycle
Address cycle
Toggle
bits
Preamble bits
A(n-3)
…
A0
7
6
5
4
3
2
D4
D0
SIO1
A(n-2)
…
A1
7
6
5
4
3
2
D5
D1
SIO2
A(n-1)
…
A2
7
6
5
4
3
2
D6
D2
SIO3
An
…
A3
7
6
5
4
3
2
D7
D3
SIO0
P/N: PM2323
CMD
Macronix Proprietary
53
…
…
…
…
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 45. DTR4IO (6DC)
CS#
SCLK
…
…
Dummy cycle
Command
cycle
SIO0
Address cycle
CMD
Toggle
Bits
Preamble bits
…
A0
7 6 5 4 3 2 1 0 D4 D0 D4 D0 D4 D0 D4 D0
…
…
A1
7 6 5 4 3 2 1 0 D5 D1 D5 D1 D5 D1 D5 D1
…
…
A2
7 6 5 4 3 2 1 0 D6 D2 D6 D2 D6 D2 D6 D2
…
…
A3
7 6 5 4 3 2 1 0 D7 D3 D7 D3 D7 D3 D7 D3
…
A(n-3)
SIO1
A(n-2)
SIO2
A(n-1)
SIO3
An
P/N: PM2323
Macronix Proprietary
54
Rev. 1.7, April 15, 2021
MX25L25673G
9-21. 4 Byte Address Command Set
The operation of 4-byte address command set was very similar to original 3-byte address command set. The
only different is all the 4-byte command set request 4-byte address (A31-A0) followed by instruction code. The
command set support 4-byte address including: READ4B, Fast_Read4B, DREAD4B, 2READ4B, QREAD4B,
4READ4B, PP4B, 4PP4B, SE4B, BE32K4B, BE4B. Please note that it is not necessary to issue EN4B command
before issuing any of 4-byte command set.
Figure 46. Read Data Bytes using 4 Byte Address Sequence (READ4B)
CS#
0
1
2
3
4
5
6
7
8
36 37 38 39 40 41 42 43 44 45 46 47
9 10
SCLK
Command
32-bit address
31 30 29
13h
SI
3
2
1
0
MSB
Data Out 1
High Impedance
SO
7
6
5
4
3
Data Out 2
2
1
7
0
MSB
Figure 47. Read Data Bytes at Higher Speed using 4 Byte Address Sequence (FASTREAD4B)
CS#
0
1
2
3
4
5
6
7
8
9 10
36 37 38 39
SCLK
Command
32-bit address
31 30 29
0Ch
SI
3
2
1
0
High Impedance
SO
CS#
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
SCLK
Configurable
Dummy cycles
SI
7
6
5
4
3
2
1
0
DATA OUT 2
DATA OUT 1
SO
7
6
5
4
3
2
1
MSB
0
7
6
MSB
5
4
3
2
1
0
7
MSB
Notes: Configuration Dummy cycle numbers will be different depending on the bit6 & bit7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
55
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 48. 2 x I/O Fast Read using 4 Byte Address Sequence (2READ4B)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
21 22 23 24 25 26 27 28 29 30 31 32 33 34
Mode 3
SCLK
Mode 0
BCh
SI/SIO0
SO/SIO1
Data
Out 1
Configurable
Dummy Cycle
16 ADD Cycles
Command
Mode 0
Data
Out 2
A30 A28 A26
A4 A2 A0
D6 D4 D2 D0 D6 D4 D2 D0
A31 A29 A27
A5 A3 A1
D7 D5 D3 D1 D7 D5 D3 D1
Notes: Configuration Dummy cycle numbers will be different depending on the bit6 & bit7 (DC0 & DC1) setting in
configuration register.
Figure 49. 4 I/O Fast Read using 4 Byte Address sequence (4READ4B)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
Mode 3
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
SCLK
Mode 0
Command
8 ADD Cycles
Data
Out 1
Performance
enhance indicator
(Note 1 & 2)
Data
Out 2
Data
Out 3
Mode 0
Configurable
Dummy Cycles
SIO0
ECh
A28 A24 A20 A16 A12 A8 A4 A0 P4 P0
(Note 3)
D4 D0 D4 D0 D4 D0
SIO1
A29 A25 A21 A17 A13 A9 A5 A1 P5 P1
D5 D1 D5 D1 D5 D1
SIO2
A30 A26 A22 A18 A14 A10 A6 A2 P6 P2
D6 D2 D6 D2 D6 D2
SIO3
A31 A27 A23 A19 A15 A11 A7 A3 P7 P3
D7 D3 D7 D3 D7 D3
Notes:
1. Hi-impedance is inhibited for this clock cycle.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) will result in entering the performance enhance mode.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
56
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 50. Fast Quad I/O DT Read (4DTRD4B) Sequence (SPI Mode)
CS#
Mode 3
0
7
SCLK
8
9
10
11
12
17
…
Mode 0
18
19
…
Command
Performance
Enhance Indicator
4 ADD Cycles
(Note 1 & 2)
Configurable
Dummy Cycles
(Note 3)
A28 A24
…
A4
A0
P4
P0
D4 D0 D4 D0 D4
SIO1
A29 A25
…
A5
A1
P5
P1
D5 D1 D5 D1 D5
SIO2
A30 A26
…
A6
A2
P6
P2
D6 D2 D6 D2 D6
SIO3
A31 A27
…
A7
A3
P7
P3
D7 D3 D7 D3 D7
SIO0
EEh
Notes:
1. Hi-impedance is inhibited for this clock cycle.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) will result in entering the performance enhance mode.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
Figure 51. Fast Quad I/O DT Read (4DTRD4B) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
4
3
5
6
12
11
SCLK
13
…
Mode 0
Command
Performance
Enhance Indicator
4 ADD Cycles
(Note 1 & 2)
Configurable
Dummy Cycles (Note 3)
SIO[3:0]
EEh
A28
|
A31
A24
|
A27
A20
|
A23
A16
|
A19
A12
|
A15
A8
|
A11
A4
|
A7
A0
|
A3
P1
P0
H0
L0
H1
L1
H2
Notes:
1. Hi-impedance is inhibited for this clock cycle.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) will result in entering the performance enhance mode.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
P/N: PM2323
Macronix Proprietary
57
Rev. 1.7, April 15, 2021
MX25L25673G
9-22. Burst Read
The Burst Read feature allows applications to fill a cache line with a fixed length of data without using multiple read
commands. Burst Read is disabled by default at power-up or reset. Burst Read is enabled by setting the Burst
Length. When the Burst Length is set, reads will wrap on the selected boundary (8/16/32/64-bytes) containing the
initial target address. For example if an 8-byte Wrap Depth is selected, reads will wrap on the 8-byte-page-aligned
boundary containing the initial read address.
To set the Burst Length, drive CS# low → send SET BURST LENGTH instruction code (C0h) → send WRAP CODE
→drive CS# high. Refer to the table below for valid 8-bit Wrap Codes and their corresponding Wrap Depth.
Data
00h
01h
02h
03h
1xh
Wrap Around
Yes
Yes
Yes
Yes
No
Wrap Depth
8-byte
16-byte
32-byte
64-byte
X
Once Burst Read is enabled, it will remain enabled until the device is power-cycled or reset. The SPI and QPI mode
4READ and 4READ4B read commands support the wrap around feature after Burst Read is enabled. To change
the wrap depth, resend the Burst Read instruction with the appropriate Wrap Code. To disable Burst Read, send the
Burst Read instruction with Wrap Code 1xh. QPI “EBh” "ECh" and SPI “EBh” "ECh" support wrap around feature
after wrap around is enabled. Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this
instruction. The SIO[3:1] are don't care during SPI mode.
Figure 52. Burst Read (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
D7
D6
10
11
12
13
14
15
SCLK
Mode 0
SIO
C0h
D5
D4
D3
D2
D1
D0
Figure 53. Burst Read (QPI Mode)
CS#
Mode 3
0
1
2
3
SCLK
Mode 0
SIO[3:0]
C0h
H0
MSB
L0
LSB
Note: MSB=Most Significant Bit
LSB=Least Significant Bit
P/N: PM2323
Macronix Proprietary
58
Rev. 1.7, April 15, 2021
MX25L25673G
9-23. Performance Enhance Mode - XIP (execute-in-place)
The device could waive the command cycle bits if the two cycle bits after address cycle toggles.
Performance enhance mode is supported in both SPI and QPI mode.
In QPI mode, “EBh” "ECh" "EDh" "EEh" and SPI “EBh” "ECh" "EDh" "EEh" commands support enhance mode. The
performance enhance mode is not supported in dual I/O mode.
To enter performance-enhancing mode, P[7:4] must be toggling with P[3:0]; likewise P[7:0]=A5h, 5Ah, F0h or 0Fh
can make this mode continue and skip the next 4READ instruction. To leave enhance mode, P[7:4] is no longer
toggling with P[3:0]; likewise P[7:0]=FFh, 00h, AAh or 55h along with CS# is afterwards raised and then lowered.
Issuing ”FFh” data cycle can also exit enhance mode. The system then will leave performance enhance mode and
return to normal operation.
To conduct the Performance Enhance Mode Reset operation in SPI mode, FFh data cycle(8 clocks in 3-byte
address mode)/3FFh data cycle(10 clocks in 4-byte address mode), should be issued in 1I/O sequence. In QPI
Mode, FFFFFFFFh data cycle(8 clocks in 3-byte address mode)/FFFFFFFFFFh data cycle (10 clocks in 4-byte
address mode), in 4I/O should be issued. If the system controller is being Reset during operation, the flash device
will return to the standard SPI operation.
After entering enhance mode, following CS# go high, the device will stay in the read mode and treat CS# go low of
the first clock as address instead of command cycle.
Another sequence of issuing 4READ instruction especially useful in random access is: CS# goes low→send 4READ
instruction→3-bytes or 4-bytes address interleave on SIO3, SIO2, SIO1 & SIO0 →performance enhance toggling
bit P[7:0]→ 4 dummy cycles (Default) →data out until CS# goes high → CS# goes low (The following 4READ
instruction is not allowed, hence 8 cycles of 4READ can be saved comparing to normal 4READ mode) → 3-bytes or
4-bytes random access address.
P/N: PM2323
Macronix Proprietary
59
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 54. 4 x I/O Read enhance performance Mode Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22
n
SCLK
Mode 0
Data
Out 2
Data
Out n
A20 A16 A12 A8 A4 A0 P4 P0
D4 D0 D4 D0
D4 D0
SIO1
A21 A17 A13 A9 A5 A1 P5 P1
D5 D1 D5 D1
D5 D1
SIO2
A22 A18 A14 A10 A6 A2 P6 P2
D6 D2 D6 D2
D6 D2
SIO3
A23 A19 A15 A11 A7 A3 P7 P3
D7 D3 D7 D3
D7 D3
Command
6 ADD Cycles
(Note 3)
Data
Out 1
Performance
enhance
indicator (Note 1)
Configurable
Dummy Cycle (Note 2)
EBh
SIO0
CS#
n+1
...........
n+7 ...... n+9
........... n+13
...........
Mode 3
SCLK
6 ADD Cycles
(Note 3)
Data
Out 1
Performance
enhance
indicator (Note 1)
Data
Out 2
Data
Out n
Mode 0
Configurable
Dummy Cycle (Note 2)
SIO0
A20 A16 A12 A8 A4 A0 P4 P0
D4 D0 D4 D0
D4 D0
SIO1
A21 A17 A13 A9 A5 A1 P5 P1
D5 D1 D5 D1
D5 D1
SIO2
A22 A18 A14 A10 A6 A2 P6 P2
D6 D2 D6 D2
D6 D2
SIO3
A23 A19 A15 A11 A7 A3 P7 P3
D7 D3 D7 D3
D7 D3
Notes:
1. If not using performance enhance recommend to keep 1 or 0 in performance enhance indicator.
2. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
3. Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
4. Reset the performance enhance mode, if P7=P3 or P6=P2 or P5=P1 or P4=P0, ex: AA, 00, FF
P/N: PM2323
Macronix Proprietary
60
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 55. 4 x I/O Read enhance performance Mode Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
A1
A0
8
9
10
11
12
13
14
15
16
17
H0
L0
H1
L1
SCLK
Mode 0
SIO[3:0]
EBh
A5
A4
A3
A2
X
X
X
X
MSB LSB MSB LSB
P(7:4) P(3:0)
Data In
Data Out
performance
enhance
indicator
Configurable
Dummy Cycle (Note 1)
CS#
n+1
.............
SCLK
Mode 0
SIO[3:0]
A5
A4
A3
A2
A1
X
A0
X
X
6 Address cycles
X
H0
L0
H1
L1
MSB LSB MSB LSB
P(7:4) P(3:0)
Data Out
performance
enhance
indicator
Configurable
Dummy Cycle (Note 1)
Notes:
1. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
2. Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the address
cycles will be increased.
3. Reset the performance enhance mode, if P7=P3 or P6=P2 or P5=P1 or P4=P0, ex: AA, 00, FF
P/N: PM2323
Macronix Proprietary
61
Rev. 1.7, April 15, 2021
MX25L25673G
9-24. Sector Erase (SE)
The Sector Erase (SE) instruction is for erasing the data of the chosen sector to be "1". The instruction is used for
any 4K-byte sector. A Write Enable (WREN) instruction must be executed to set the Write Enable Latch (WEL) bit
before sending the Sector Erase (SE). Any address of the sector (Please refer to "Table 4. Memory Organization") is
a valid address for Sector Erase (SE) instruction. The CS# must go high exactly at the byte boundary (the least
significant bit of the address byte been latched-in); otherwise, the instruction will be rejected and not executed.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. Address bits [Am-A12] (Am is the most significant address) select
the sector address.
To enter the 4-byte address mode, please refer to "9-11. Enter 4-byte mode (EN4B)" section.
The sequence of issuing SE instruction is: CS# goes low→ send SE instruction code→ 3-byte or 4-byte address on
SI→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
The self-timed Sector Erase Cycle time (tSE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Sector Erase cycle is in progress. The WIP sets 1 during the tSE
timing, and clears when Sector Erase Cycle is completed, and the Write Enable Latch (WEL) bit is cleared. If the
Block is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect Mode),
the Sector Erase (SE) instruction will not be executed on the block.
Figure 56. Sector Erase (SE) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
29 30 31
SCLK
Mode 0
24-Bit Address
(Note)
Command
SI
20h
A23 A22
A2
A1 A0
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
Figure 57. Sector Erase (SE) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
24-Bit Address
(Note)
Command
SIO[3:0]
20h A5 A4 A3 A2 A1 A0
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
P/N: PM2323
Macronix Proprietary
62
Rev. 1.7, April 15, 2021
MX25L25673G
9-25. Block Erase (BE32K)
The Block Erase (BE32K) instruction is for erasing the data of the chosen block to be "1". The instruction is used for
32K-byte block erase operation. A Write Enable (WREN) instruction must be executed to set the Write Enable Latch
(WEL) bit before sending the Block Erase (BE32K). Any address of the block (see "Table 4. Memory Organization") is
a valid address for Block Erase (BE32K) instruction. The CS# must go high exactly at the byte boundary (the least
significant bit of address byte been latched-in); otherwise, the instruction will be rejected and not executed.
Address bits [Am-A15] (Am is the most significant address) select the 32KB block address. The default read mode
is 3-byte address, to access higher address (4-byte address) which requires to enter the 4-byte address read mode
or to define EAR bit. To enter the 4-byte address mode, please refer to "9-11. Enter 4-byte mode (EN4B)" section.
The sequence of issuing BE32K instruction is: CS# goes low→ send BE32K instruction code→ 3-byte or 4-byte
address on SI→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
The self-timed Block Erase Cycle time (tBE32K) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while during the Block Erase cycle is in progress. The WIP sets during the
tBE32K timing, and clears when Block Erase Cycle is completed, and the Write Enable Latch (WEL) bit is cleared.
If the Block is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect
Mode), the Block Erase (BE32K) instruction will not be executed on the block.
Figure 58. Block Erase 32KB (BE32K) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
29 30 31
SCLK
Mode 0
Command
SI
24-Bit Address
(Note)
52h
A23 A22
A2
A1 A0
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
Figure 59. Block Erase 32KB (BE32K) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
24-Bit Address
(Note)
Command
SIO[3:0]
52h
A5 A4 A3 A2 A1 A0
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
P/N: PM2323
Macronix Proprietary
63
Rev. 1.7, April 15, 2021
MX25L25673G
9-26. Block Erase (BE)
The Block Erase (BE) instruction is for erasing the data of the chosen block to be "1". The instruction is used
for 64K-byte block erase operation. A Write Enable (WREN) instruction must be executed to set the Write Enable
Latch (WEL) bit before sending the Block Erase (BE). Any address of the block (Please refer to "Table 4. Memory
Organization") is a valid address for Block Erase (BE) instruction. The CS# must go high exactly at the byte boundary (the
least significant bit of address byte been latched-in); otherwise, the instruction will be rejected and not executed.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte address mode, please refer to the "9-11. Enter
4-byte mode (EN4B)" Mode section.
The sequence of issuing BE instruction is: CS# goes low→ send BE instruction code→ 3-byte or 4-byte address on
SI→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
The self-timed Block Erase Cycle time (tBE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Block Erase cycle is in progress. The WIP sets during the tBE
timing, and clears when Block Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the Block
is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect Mode), the
Block Erase (BE) instruction will not be executed on the block.
Figure 60. Block Erase (BE) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
29 30 31
SCLK
Mode 0
Command
SI
24-Bit Address
(Note)
D8h
A23 A22
A2 A1 A0
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
Figure 61. Block Erase (BE) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
SIO[3:0]
Command
24-Bit Address
(Note)
D8h
A5 A4 A3 A2 A1 A0
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
P/N: PM2323
Macronix Proprietary
64
Rev. 1.7, April 15, 2021
MX25L25673G
9-27. Chip Erase (CE)
The Chip Erase (CE) instruction is for erasing the data of the whole chip to be "1". A Write Enable (WREN)
instruction must be executed to set the Write Enable Latch (WEL) bit before sending the Chip Erase (CE). The CS#
must go high exactly at the byte boundary, otherwise the instruction will be rejected and not executed.
The sequence of issuing CE instruction is: CS# goes low→send CE instruction code→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
The self-timed Chip Erase Cycle time (tCE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Chip Erase cycle is in progress. The WIP sets during the tCE
timing, and clears when Chip Erase Cycle is completed, and the Write Enable Latch (WEL) bit is cleared.
When the chip is under "Block protect (BP) Mode" (WPSEL=0). The Chip Erase (CE) instruction will not be
executed, if one (or more) sector is protected by BP3-BP0 bits. It will be only executed when BP3-BP0 all set to "0".
When the chip is under "Individual Sector Protect Mode" (WPSEL=1). The Chip Erase (CE) instruction will be
executed on unprotected block. The protected Block will be skipped. If one (or more) 4K byte sector was protected
in top or bottom 64K byte block, the protected block will also skip the chip erase command.
Figure 62. Chip Erase (CE) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
60h or C7h
Figure 63. Chip Erase (CE) Sequence (QPI Mode)
CS#
Mode 3
0
1
SCLK
Mode 0
Command
SIO[3:0]
P/N: PM2323
60h or C7h
Macronix Proprietary
65
Rev. 1.7, April 15, 2021
MX25L25673G
9-28. Page Program (PP)
The Page Program (PP) instruction is for programming memory bits to "0". One to 256 bytes can be sent to the
device to be programmed. A Write Enable (WREN) instruction must be executed to set the Write Enable Latch (WEL)
bit before sending the Page Program (PP). If more than 256 data bytes are sent to the device, only the last 256
data bytes will be accepted and the previous data bytes will be disregarded. The Page Program instruction requires
that all the data bytes fall within the same 256-byte page. The low order address byte A[7:0] specifies the starting
address within the selected page. Bytes that will cross a page boundary will wrap to the beginning of the selected
page. The device can accept (256 minus A[7:0]) data bytes without wrapping. If 256 data bytes are going to be
programmed, A[7:0] should be set to 0.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte address mode, please refer to the "9-11. Enter
4-byte mode (EN4B)" section.
The sequence of issuing PP instruction is: CS# goes low→ send PP instruction code→ 3-byte or 4-byte address on
SI→ at least 1-byte on data on SI→ CS# goes high.
The CS# must be kept to low during the whole Page Program cycle; The CS# must go high exactly at the byte
boundary( the latest eighth bit of data being latched in), otherwise the instruction will be rejected and will not be
executed.
The self-timed Page Program Cycle time (tPP) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Page Program cycle is in progress. The WIP sets during the tPP
timing, and clears when Page Program Cycle is completed, and the Write Enable Latch (WEL) bit is cleared. If the
page is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect Mode),
the Page Program (PP) instruction will not be executed.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
P/N: PM2323
Macronix Proprietary
66
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 64. Page Program (PP) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
SCLK
1
0
7
6
5
3
2
1
0
2079
2
2078
3
2077
23 22 21
02h
SI
Data Byte 1
24-Bit Address
(Note)
2076
Command
2075
Mode 0
4
1
0
MSB
MSB
2074
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
2073
2072
CS#
SCLK
Data Byte 2
7
SI
6
5
4
3
2
Data Byte 3
1
MSB
0
7
6
5
4
3
2
Data Byte 256
1
7
0
MSB
6
5
4
3
2
MSB
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
Figure 65. Page Program (PP) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
SCLK
Mode 0
Command
SIO[3:0]
02h
Data In
24-Bit Address
(Note)
A5
A4
A3
A2
A1
A0
H0
L0
H1
L1
H2
L2
H3
L3
Data Byte Data Byte Data Byte Data Byte
1
2
3
4
H255 L255
......
Data Byte
256
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
P/N: PM2323
Macronix Proprietary
67
Rev. 1.7, April 15, 2021
MX25L25673G
9-29. 4 x I/O Page Program (4PP)
The Quad Page Program (4PP) instruction is for programming the memory to be "0". A Write Enable (WREN)
instruction must be executed to set the Write Enable Latch (WEL) bit before sending the Quad Page Program (4PP).
The Quad Page Programming takes four pins: SIO0, SIO1, SIO2, and SIO3 as address and data input, which can
improve programmer performance and the effectiveness of application. The other function descriptions are as same
as standard page program.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte address mode, please refer to the "9-11. Enter
4-byte mode (EN4B)" section.
The sequence of issuing 4PP instruction is: CS# goes low→ send 4PP instruction code→ 3-byte or 4-byte address
on SIO[3:0]→ at least 1-byte on data on SIO[3:0]→CS# goes high.
If the page is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect
Mode), the Quad Page Program (4PP) instruction will not be executed.
Figure 66. 4 x I/O Page Program (4PP) Sequence (SPI Mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21
SCLK
Mode 0
Command
Data Data Data Data
Byte 1 Byte 2 Byte 3 Byte 4
6 Address cycle
A0
4
0
4
0
4
0
4
0
SIO1
A21 A17 A13 A9 A5 A1
5
1
5
1
5
1
5
1
SIO2
A22 A18 A14 A10 A6 A2
6
2
6
2
6
2
6
2
SIO3
A23 A19 A15 A11 A7 A3
7
3
7
3
7
3
7
3
SIO0
38h
A20 A16 A12 A8 A4
Note: Please note the address cycles above are based on 3-byte address mode. For 4-byte address mode, the
address cycles will be increased.
P/N: PM2323
Macronix Proprietary
68
Rev. 1.7, April 15, 2021
MX25L25673G
9-30. Deep Power-down (DP)
The Deep Power-down (DP) instruction places the device into a minimum power consumption state, Deep Powerdown mode, in which the quiescent current is reduced from ISB1 to ISB2.
The sequence of issuing DP instruction: CS# goes low→ send DP instruction code→ CS# goes high. The CS# must
go high at the byte boundary (after exactly eighth bits of the instruction code have been latched-in); otherwise the
instruction will not be executed. Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this
instruction. SIO[3:1] are "don't care".
After CS# goes high there is a delay of tDP before the device transitions from Stand-by mode to Deep Power-down
mode and before the current reduces from ISB1 to ISB2. Once in Deep Power-down mode, all instructions will be
ignored except Release from Deep Power-down (RDP).
The device exits Deep Power-down mode and returns to Stand-by mode if it receives a Release from Deep
Powerdown (RDP) instruction, power-cycle, or reset. Please refer to "Figure 18. Release from Deep Power-down (RDP)
Sequence (SPI Mode)" and "Figure 19. Release from Deep Power-down (RDP) Sequence (QPI Mode)".
Figure 67. Deep Power-down (DP) Sequence (SPI Mode)
CS#
0
Mode 3
1
2
3
4
5
6
tDP
7
SCLK
Mode 0
Command
B9h
SI
Stand-by Mode
Deep Power-down Mode
Figure 68. Deep Power-down (DP) Sequence (QPI Mode)
CS#
Mode 3
0
tDP
1
SCLK
Mode 0
Command
SIO[3:0]
B9h
Stand-by Mode
P/N: PM2323
Deep Power-down Mode
Macronix Proprietary
69
Rev. 1.7, April 15, 2021
MX25L25673G
9-31. Write Security Register (WRSCUR)
The WRSCUR instruction is for changing the values of Security Register Bits. The WREN (Write Enable) instruction
is required before issuing WRSCUR instruction. The WRSCUR instruction may change the values of bit1 (LDSO
bit) for customer to lock-down the 4K-bit Secured OTP area. Once the LDSO bit is set to "1", the Secured OTP area
cannot be updated any more.
The sequence of issuing WRSCUR instruction is :CS# goes low→ send WRSCUR instruction → CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
The CS# must go high exactly at the boundary; otherwise, the instruction will be rejected and not executed.
Figure 69. Write Security Register (WRSCUR) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
2Fh
High-Z
SO
Figure 70. Write Security Register (WRSCUR) Sequence (QPI Mode)
CS#
Mode 3
0
1
SCLK
Mode 0
Command
SIO[3:0]
P/N: PM2323
2Fh
Macronix Proprietary
70
Rev. 1.7, April 15, 2021
MX25L25673G
9-32. Read Security Register (RDSCUR)
The RDSCUR instruction is for reading the value of Security Register bits. The Read Security Register can be read
at any time (even in program/erase/write status register/write security register condition) and continuously.
The sequence of issuing RDSCUR instruction is : CS# goes low→send RDSCUR instruction→Security Register
data out on SO→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
Figure 71. Read Security Register (RDSCUR) Sequence (SPI Mode)
CS#
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
SCLK
command
2Bh
SI
SO
Security register Out
High-Z
7
6
5
4
3
2
1
Security register Out
0
7
6
5
4
3
2
1
0
7
MSB
MSB
Figure 72. Read Security Register (RDSCUR) Sequence (QPI Mode)
CS#
Mode 3 0
1
2
3
4
5
6
7
N
SCLK
Mode 0
SIO[3:0]
2Bh H0 L0 H0 L0 H0 L0
H0 L0
MSB LSB
Security Byte Security Byte Security Byte
P/N: PM2323
Macronix Proprietary
71
Security Byte
Rev. 1.7, April 15, 2021
MX25L25673G
9-33. Enter Secured OTP (ENSO)
The ENSO instruction is for entering the additional 4K-bit secured OTP mode. While device is in 4K-bit secured
OTPmode, main array access is not available. The additional 4K-bit secured OTP is independent from main array
and may be used to store unique serial number for system identifier. After entering the Secured OTP mode, follow
standard read or program procedure to read out the data or update data. The Secured OTP data cannot be updated
again once it is lock-down.
The sequence of issuing ENSO instruction is: CS# goes low→ send ENSO instruction to enter Secured OTP
mode→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
Please note that after issuing ENSO command user can only access secure OTP region with standard read or
program procedure. Furthermore, once security OTP is lock down, only read related commands are valid.
9-34. Exit Secured OTP (EXSO)
The EXSO instruction is for exiting the additional 4K-bit secured OTP mode.
The sequence of issuing EXSO instruction is: CS# goes low→ send EXSO instruction to exit Secured OTP mode→
CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
P/N: PM2323
Macronix Proprietary
72
Rev. 1.7, April 15, 2021
MX25L25673G
Security Register
The definition of the Security Register bits is as below:
Write Protection Selection bit. Please refer to "9-35. Write Protection Selection (WPSEL)".
Erase Fail bit. The Erase Fail bit indicates the status of last Erase operation. The bit will be set to "1" if the erase
operation failed or the erase region is protected. It will be automatically cleared to "0" if the next erase operation
succeeds. Please note that it does not interrupt or stop any operation in the flash memory.
Program Fail bit. The Program Fail bit indicates the status of last Program operation. The bit will be set to "1" if the
program operation failed or the program region is protected. It will be automatically cleared to "0" if the next program
operation succeeds. Please note that it does not interrupt or stop any operation in the flash memory.
Erase Suspend bit. Erase Suspend Bit (ESB) indicates the status of Erase Suspend operation. Users may use
ESB to identify the state of flash memory. After the flash memory is suspended by Erase Suspend command, ESB
is set to "1". ESB is cleared to "0" after erase operation resumes.
Program Suspend bit. Program Suspend Bit (PSB) indicates the status of Program Suspend operation. Users may
use PSB to identify the state of flash memory. After the flash memory is suspended by Program Suspend command,
PSB is set to "1". PSB is cleared to "0" after program operation resumes.
Secured OTP Indicator bit. The Secured OTP indicator bit shows the Secured OTP area is locked by factory or
not. When it is "0", it indicates non-factory lock; "1" indicates factory-lock.
Lock-down Secured OTP (LDSO) bit. By writing WRSCUR instruction, the LDSO bit may be set to "1" for
customer lock-down purpose. However, once the bit is set to "1" (lock-down), the LDSO bit and the 4K-bit Secured
OTP area cannot be updated any more. While it is in 4K-bit secured OTP mode, main array access is not allowed.
Table 12. Security Register Definition
bit7
bit6
bit5
bit4
WPSEL
E_FAIL
P_FAIL
Reserved
0=Block Lock
0=normal
(BP) protection
Erase
mode
succeed
1=Individual
1=indicate
Sector protection
Erase failed
mode
(default=0)
(default=0)
Non-volatile bit
(OTP)
P/N: PM2323
Volatile bit
bit3
ESB
PSB
(Erase
(Program
Suspend bit) Suspend bit)
0=normal
Program
succeed
1=indicate
Program
failed
(default=0)
-
0=Erase
is not
suspended
1= Erase
suspended
(default=0)
Volatile bit
Volatile bit
Volatile bit
Macronix Proprietary
73
bit2
bit1
bit0
LDSO
Secured OTP
(indicate if
indicator bit
lock-down)
0 = not lock0=Program
down
0 = nonis not
1 = lock-down
factory
suspended
(Secured
lock
1= Program
OTP can no 1 = factory
suspended
longer be
lock
(default=0)
programmed)
Volatile bit
Non-volatile
bit (OTP)
Non-volatile
bit (OTP)
Rev. 1.7, April 15, 2021
MX25L25673G
9-35. Write Protection Selection (WPSEL)
There are two write protection methods provided on this device, (1) Block Protection (BP) mode or (2) Individual
Sector Protection mode. The protection modes are mutually exclusive. The WPSEL bit selects which protection
mode is enabled. If WPSEL=0 (factory default), BP mode is enabled and Individual Sector Protection mode is
disabled. If WPSEL=1, Individual Sector Protection mode is enabled and BP mode is disabled. The WPSEL
command is used to set WPSEL=1. A WREN command must be executed to set the WEL bit before sending
the WPSEL command. Please note that the WPSEL bit is an OTP bit. Once WPSEL is set to “1”, it cannot be
programmed back to “0”.
When WPSEL = 0: Block Lock (BP) protection mode,
The memory array is write protected by the BP3 to BP0 bits.
When WPSEL =1: Individual Sector protection mode,
Blocks are individually protected by their own SPB or DPB. On power-up, all blocks are write protected by the
Dynamic Protection Bits (DPB) by default. The Individual Sector Protection instructions WRLR, RDLR, WRSPB,
ESSPB, WRDPB, RDDPB, GBLK, and GBULK are activated. The BP3 to BP0 bits of the Status Register are
disabled and have no effect.
The sequence of issuing WPSEL instruction is: CS# goes low → send WPSEL instruction to enable the Individual
Sector Protect mode → CS# goes high.
Write Protection Selection
Start
(Default in BP Mode)
WPSEL=1
Set
WPSEL Bit
Individual
Sector Protection
P/N: PM2323
WPSEL=0
Block Protection
(BP)
Macronix Proprietary
74
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 73. WPSEL Flow
start
WREN command
RDSCUR command
Yes
WPSEL=1?
No
WPSEL disable,
block protected by BP[3:0]
WPSEL command
RDSR command
WIP=0?
No
Yes
RDSCUR command
WPSEL=1?
No
Yes
WPSEL set successfully
WPSEL set fail
WPSEL enable.
Block protected by Individual Sector Protection
P/N: PM2323
Macronix Proprietary
75
Rev. 1.7, April 15, 2021
MX25L25673G
9-36. Advanced Sector Protection
Advanced Sector Protection can protect individual 4KB sectors in the bottom and top 64KB of memory and protect
individual 64KB blocks in the rest of memory.
There is one non-volatile Solid Protection Bit (SPB) and one volatile Dynamic Protection Bit (DPB) assigned to each
4KB sector at the bottom and top 64KB of memory and to each 64KB block in the rest of memory. A sector or block
is write-protected from programming or erasing when its associated SPB or DPB is set to “1”. Please refer to "9-365. Sector Protection States Summary Table" for the sector state with the protection status of DPB/SPB bits.
Solid Protection mode permits the SPB bits to be modified after power-on or a reset. The figure below is an overview
of Advanced Sector Protection, which helps describing an overview of these methods. The device is default to the
Solid mode when shipped from factory. The detail algorithm of advanced sector protection is shown as follows:
Figure 74. Advanced Sector Protection Overview
Start
Set
SPB Lock Bit ?
SPBLKDN# = 0
SPB Lock bit locked
All SPB can not be changeable
SPBLKDN# = 1
SPB Lock bit Unlocked
SPB is changeable
SPB Access Register
(SPB)
Dynamic Protect Bit Register
(DPB)
DPB=1 sector protect
Sector Array
SPB=1 Write Protect
SPB=0 Write Unprotect
DPB=0 sector unprotect
P/N: PM2323
DPB 0
SA 0
SPB 0
DPB 1
SA 1
SPB 1
DPB 2
SA 2
SPB 2
:
:
:
:
:
:
DPB N-1
SA N-1
SPB N-1
DPB N
SA N
SPB N
Macronix Proprietary
76
Rev. 1.7, April 15, 2021
MX25L25673G
9-36-1. Lock Register
The Lock Register is a 16-bit one-time programmable register. Lock Register bit [6] is SPB Lock Down Bit (SPBLKDN)
which is an unique bit assigned to control all SPB bit status.
When SPBLKDN is 1, SPB can be changed. When it is locked as 0, all SPB can not be changed anymore, and
SPBLKDN bit itself can not be altered anymore, either.
The Lock Register is programmed using the WRLR (Write Lock Register) command. A WREN command must be
executed to set the WEL bit before sending the WRLR command.
Table 13. Lock Register
Bits
Field Name
Function
Type
Default
State
15 to 7
RFU
Reserved
OTP
1
6
SPBLKDN
SPB Lock Down
OTP
1
5 to 0
RFU
Reserved
OTP
1
Description
Reserved for Future Use
1 = SPB changeable
0 = freeze SPB
Reserved for Future Use
Figure 75. Read Lock Register (RDLR) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
SCLK
Mode 0
command
2Dh
SI
Register Out
High-Z
SO
7
6
5
4
3
2
Register Out
1
0 15 14 13 12 11 10 9
7
8
MSB
MSB
Figure 76. Write Lock Register (WRLR) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Mode 0
SI
SO
P/N: PM2323
Command
2Ch
High-Z
Lock Register In
7
6
5
4
3
2
1
0 15 14 13 12 11 10 9
8
MSB
Macronix Proprietary
77
Rev. 1.7, April 15, 2021
MX25L25673G
9-36-2. Solid Protection Bits
The Solid Protection Bits (SPBs) are nonvolatile bits for enabling or disabling write-protection to sectors and blocks.
The SPB bits have the same endurance as the Flash memory. An SPB is assigned to each 4KB sector in the bottom
and top 64KB of memory and to each 64KB block in the remaining memory. The factory default state of the SPB bits is “0”,
which has the sector/block write-protection disabled.
When an SPB is set to “1”, the associated sector or block is write-protected. Program and erase operations on the
sector or block will be inhibited. SPBs can be individually set to “1” by the WRSPB command. However, the SPBs
cannot be individually cleared to “0”. Issuing the ESSPB command clears all SPBs to “0”. A WREN command must
be executed to set the WEL bit before sending the WRSPB or ESSPB command.
The RDSPB command reads the status of the SPB of a sector or block. The RDSPB command returns 00h if the
SPB is “0”, indicating write-protection is disabled. The RDSPB command returns FFh if the SPB is “1”, indicating
write-protection is enabled.
Note: If SPBLKDN=0, commands to set or clear the SPB bits will be ignored.
Table 14. SPB Register
Bit
Description
7 to 0 SPB (Solid Protection Bit)
P/N: PM2323
Bit Status
00h = Unprotect Sector / Block
FFh = Protect Sector / Block
Macronix Proprietary
78
Default
Type
00h
Non-volatile
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 77. Read SPB Status (RDSPB) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
37 38 39 40 41 42 43 44 45 46 47
9
SCLK
Mode 0
Command
SI
32-Bit Address
E2h
A31 A30
A2 A1 A0
MSB
Data Out
High-Z
SO
7
6
5
4
3
2
1
0
MSB
Figure 78. SPB Erase (ESSPB) Sequence
CS#
1
0
Mode 3
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
E4h
High-Z
SO
Figure 79. SPB Program (WRSPB) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
37 38 39
9
SCLK
Mode 0
SI
Command
32-Bit Address
E3h
A31 A30
A2 A1 A0
MSB
P/N: PM2323
Macronix Proprietary
79
Rev. 1.7, April 15, 2021
MX25L25673G
9-36-3. Dynamic Protection Bits
The Dynamic Protection Bits (DPBs) are volatile bits for quickly and easily enabling or disabling write-protection
to sectors and blocks. A DPB is assigned to each 4KB sector in the bottom and top 64KB of memory and to each
64KB block in the rest of the memory. The DBPs can enable write-protection on a sector or block regardless of the
state of the corresponding SPB. However, the DPB bits can only unprotect sectors or blocks whose SPB bits are “0”
(unprotected).
When a DPB is “1”, the associated sector or block will be write-protected, preventing any program or erase
operation on the sector or block. All DPBs default to “1” after power-on or reset. When a DPB is cleared to “0”, the
associated sector or block will be unprotected if the corresponding SPB is also “0”.
DPB bits can be individually set to “1” or “0” by the WRDPB command. The DBP bits can also be globally cleared to
“0” with the GBULK command or globally set to “1” with the GBLK command. A WREN command must be executed
to set the WEL bit before sending the WRDPB, GBULK, or GBLK command.
The RDDPB command reads the status of the DPB of a sector or block. The RDDPB command returns 00h if the
DPB is “0”, indicating write-protection is disabled. The RDDPB command returns FFh if the DPB is “1”, indicating
write-protection is enabled.
Table 15. DPB Register
Bit
Description
Bit Status
00h = Unprotect Sector / Block
FFh = Protect Sector / Block
7 to 0 DPB (Dynamic Protection Bit)
Default
Type
FFh
Volatile
Figure 80. Read DPB Register (RDDPB) Sequence
CS#
0
Mode 3
1
2
3
4
5
6
7
8
37 38 39 40 41 42 43 44 45 46 47
9
SCLK
Mode 0
Command
SI
32-Bit Address
E0h
A31 A30
A2 A1 A0
MSB
Data Out
High-Z
SO
7
6
5
4
3
2
1
0
MSB
Figure 81. Write DPB Register (WRDPB) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
37 38 39 40 41 42 43 44 45 46 47
9
SCLK
Mode 0
SI
Command
E1h
A31 A30
A2 A1 A0
MSB
P/N: PM2323
Data Byte 1
32-Bit Address
7
6
5
4
3
2
1
0
MSB
Macronix Proprietary
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Rev. 1.7, April 15, 2021
MX25L25673G
9-36-4. Gang Block Lock/Unlock (GBLK/GBULK)
These instructions are only effective if WPSEL=1. The GBLK and GBULK instructions provide a quick method to set
or clear all DPB bits at once.
The WREN (Write Enable) instruction is required before issuing the GBLK/GBULK instruction.
The sequence of issuing GBLK/GBULK instruction is: CS# goes low → send GBLK/GBULK (7Eh/98h) instruction
→CS# goes high.
The CS# must go high exactly at the byte boundary, otherwise, the instruction will be rejected and not be executed.
9-36-5. Sector Protection States Summary Table
Protection Status
DPB
SPB
Sector/Block
Protection State
0
0
1
1
0
1
0
1
Unprotected
Protected
Protected
Protected
P/N: PM2323
Macronix Proprietary
81
Rev. 1.7, April 15, 2021
MX25L25673G
9-37. Program/Erase Suspend/Resume
The device allow the interruption of Sector-Erase, Block-Erase or Page-Program operations and conduct other
operations.
After issue suspend command, the system can determine if the device has entered the Erase-Suspended mode
through Bit2 (PSB) and Bit3 (ESB) of security register. (please refer to "Table 12. Security Register Definition")
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
9-38. Erase Suspend
Erase suspend allow the interruption of all erase operations. After the device has entered Erase-Suspended mode,
the system can read any sector(s) or Block(s) except those being erased by the suspended erase operation.
Reading the sector or Block being erase suspended is invalid.
After erase suspend, WEL bit will be clear, only read related, resume and reset command can be accepted,
including: 03h, 0Bh, 3Bh, 6Bh, BBh, EBh, 5Ah, C0h, 06h, 04h, 2Bh, 9Fh, AFh, 05h, ABh, 90h, B1h, C1h, B0h, 30h,
66h, 99h, 00h, 35h, F5h, 15h, 2Dh, E2h, E0h.
If the system issues an Erase Suspend command after the sector erase operation has already begun, the device
will not enter Erase-Suspended mode until tESL time has elapsed.
Erase Suspend Bit (ESB) indicates the status of Erase Suspend operation. Users may use ESB to identify the state
of flash memory. After the flash memory is suspended by Erase Suspend command, ESB is set to "1". ESB is
cleared to "0" after erase operation resumes.
9-39. Program Suspend
Program suspend allows the interruption of all program operations. After the device has entered ProgramSuspended mode, the system can read any sector(s) or Block(s) except those being programmed by the suspended
program operation. Reading the sector or Block being program suspended is invalid.
After program suspend, WEL bit will be cleared, only read related, resume and reset command can be accepted,
including: 03h, 0Bh, 3Bh, 6Bh, BBh, EBh, 5Ah, C0h, 06h, 04h, 2Bh, 9Fh, AFh, 05h, ABh, 90h, B1h, C1h, B0h, 30h,
66h, 99h, 00h, 35h, F5h, 15h, 2Dh, E2h, E0h.
Program Suspend Bit (PSB) indicates the status of Program Suspend operation. Users may use PSB to identify the
state of flash memory. After the flash memory is suspended by Program Suspend command, PSB is set to "1". PSB
is cleared to "0" after program operation resumes.
P/N: PM2323
Macronix Proprietary
82
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 82. Suspend to Read Latency
tPSL / tESL
CS#
Suspend Command
Read Command
tPSL: Program Latency
tESL: Erase Latency
Figure 83. Resume to Read Latency
CS#
Resume Command
[30]
tSE/tBE/tPP
Read Command
Figure 84. Resume to Suspend Latency
CS#
Resume
Command
tPRS / tERS
Suspend
Command
tPRS: Program Resume to another Suspend
tERS: Erase Resume to another Suspend
P/N: PM2323
Macronix Proprietary
83
Rev. 1.7, April 15, 2021
MX25L25673G
9-40. Write-Resume
The Write operation is being resumed when Write-Resume instruction issued. ESB or PSB (suspend status bit) in
Status register will be changed back to “0”.
The operation of Write-Resume is as follows: CS# drives low → send write resume command cycle (30h) → drive
CS# high. By polling Busy Bit in status register, the internal write operation status could be checked to be completed
or not. The user may also wait the time lag of TSE, TBE, TPP for Sector-erase, Block-erase or Page-programming.
WREN (command "06h") is not required to issue before resume. Resume to another suspend operation requires
latency time of tPRS or tERS, as defined in "Table 21. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V
- 3.6V)".
Please note that, if "performance enhance mode" is executed during suspend operation, the device can not
be resumed. To restart the write command, disable the "performance enhance mode" is required. After the
"performance enhance mode" is disabled, the write-resume command is effective.
9-41. No Operation (NOP)
The “No Operation” command is only able to terminate the Reset Enable (RSTEN) command and will not affect any
other command.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
9-42. Software Reset (Reset-Enable (RSTEN) and Reset (RST))
The Software Reset operation combines two instructions: Reset-Enable (RSTEN) command and Reset (RST)
command. It returns the device to standby mode. All the volatile bits and settings will be cleared then, which makes
the device return to the default status as power on.
To execute Reset command (RST), the Reset-Enable (RSTEN) command must be executed first to perform the
Reset operation. If there is any other command to interrupt after the Reset-Enable command, the Reset-Enable will
be invalid.
Both SPI (8 clocks) and QPI (2 clocks) command cycles can be accepted by this instruction. The SIO[3:1] are don't
care during SPI mode.
If the Reset command is executed during program or erase operation, the operation will be disabled, the data under
processing could be damaged or lost.
The reset time is different depending on the last operation. For details, please refer to "Table 17. Reset Timing-(Other
Operation)" for tREADY2.
P/N: PM2323
Macronix Proprietary
84
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 85. Software Reset Recovery
Stand-by Mode
66
CS#
99
tReady2
Mode
Note: Refer to "Table 17. Reset Timing-(Other Operation)" for tREADY2 data.
Figure 86. Reset Sequence (SPI mode)
TCEH
CS#
SCLK
Mode 3
Mode 3
Mode 0
Mode 0
Command
Command
99h
66h
SIO0
Figure 87. Reset Sequence (QPI mode)
tSHSL
CS#
MODE 3
MODE 3
MODE 3
SCLK
MODE 0
SIO[3:0]
P/N: PM2323
Command
MODE 0
66h
Command
MODE 0
99h
Macronix Proprietary
85
Rev. 1.7, April 15, 2021
MX25L25673G
9-43. Read SFDP Mode (RDSFDP)
The Serial Flash Discoverable Parameter (SFDP) standard provides a consistent method of describing the functional
and feature capabilities of serial flash devices in a standard set of internal parameter tables. These parameter tables
can be interrogated by host system software to enable adjustments needed to accommodate divergent features
from multiple vendors. The concept is similar to the one found in the Introduction of JEDEC Standard, JESD68 on
CFI.
The sequence of issuing RDSFDP instruction is CS# goes low→send RDSFDP instruction (5Ah)→send 3 address
bytes on SI pin→send 1 dummy byte on SI pin→read SFDP code on SO→to end RDSFDP operation can use CS#
to high at any time during data out.
SFDP is a JEDEC standard, JESD216B.
For SFDP register values detail, please contact local Macronix sales channel.
Figure 88. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence
CS#
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31
SCLK
Command
SI
SO
24 BIT ADDRESS
23 22 21
5Ah
3
2
1
0
High-Z
CS#
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCLK
Dummy Cycle
SI
7
6
5
4
3
2
1
0
DATA OUT 2
DATA OUT 1
SO
7
6
5
4
3
2
0
7
MSB
MSB
P/N: PM2323
1
Macronix Proprietary
86
6
5
4
3
2
1
0
7
MSB
Rev. 1.7, April 15, 2021
MX25L25673G
10. RESET
Driving the RESET# pin low for a period of tRLRH or longer will reset the device. After the reset cycle, the device is
in the following states:
- Standby mode
- All the volatile bits such as WEL/WIP/SRAM lock bit will return to the default status as power on.
- 3-byte address mode
If the device is under programming or erasing, driving the RESET# pin low will also terminate the operation and data
could be lost. During the resetting cycle, the SO data becomes high impedance and the current will be reduced to
minimum.
While Reset operation is during erase suspend, no matter what status the flash device is in, its Reset Recovery time
should be referred to the Recovery time of the Erase activity in progress.
Figure 89. RESET Timing
CS#
tRHSL
SCLK
tRH tRS
RESET#
tRLRH
tREADY1 / tREADY2
Table 16. Reset Timing-(Power On)
Symbol Parameter
tRHSL Reset# high before CS# low
tRS
Reset# setup time
tRH
Reset# hold time
tRLRH Reset# low pulse width
tREADY1 Reset Recovery time
Min.
10
15
15
10
35
Table 17. Reset Timing-(Other Operation)
Symbol Parameter
tRHSL Reset# high before CS# low
tRS
Reset# setup time
tRH
Reset# hold time
tRLRH Reset# low pulse width
Reset Recovery time (During instruction decoding)
Reset Recovery time (for read operation)
Reset Recovery time (for program operation)
tREADY2 Reset Recovery time(for SE4KB operation)
Reset Recovery time (for BE64K/BE32KB operation)
Reset Recovery time (for Chip Erase operation)
Reset Recovery time (for WRSR operation)
Note: For the Reset activity during Erase suspend, its tREADY2 timing should
progress.
P/N: PM2323
Macronix Proprietary
87
Typ.
Max.
Unit
us
ns
ns
us
us
Min.
Typ.
Max.
Unit
10
us
15
ns
15
ns
10
us
40
us
35
us
310
us
12
ms
25
ms
100
ms
40
ms
be referred to the Erase activity in
Rev. 1.7, April 15, 2021
MX25L25673G
11. POWER-ON STATE
The device is in the states below when power-up:
- Standby mode (please note it is not deep power-down mode)
- Write Enable Latch (WEL) bit is reset
The device must not be selected during power-up and power-down stage unless the VCC achieves below correct
level:
- VCC minimum at power-up stage and then after a delay of tVSL
- GND at power-down
Please note that a pull-up resistor on CS# may ensure a safe and proper power-up/down level.
An internal power-on reset (POR) circuit may protect the device from data corruption and inadvertent data change
during power up state. When VCC is lower than VWI (POR threshold voltage value), the internal logic is reset and
the flash device has no response to any command.
For further protection on the device, if the VCC does not reach the VCC minimum level, the correct operation is not
guaranteed. The write, erase, and program command should be sent after the below time delay:
- tVSL after VCC reached VCC minimum level
The device can accept read command after VCC reached VCC minimum and a time delay of tVSL.
Please refer to the "Figure 97. Power-up Timing".
Note:
- To stabilize the VCC level, the VCC rail decoupled by a suitable capacitor close to package pins is
recommended. (generally around 0.1uF)
- At power-down stage, the VCC drops below VWI level, all operations are disable and device has no response
to any command. The data corruption might occur during the stage while a write, program, erase cycle is in
progress.
P/N: PM2323
Macronix Proprietary
88
Rev. 1.7, April 15, 2021
MX25L25673G
12. ELECTRICAL SPECIFICATIONS
Table 18. ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
Industrial grade
-40°C to 85°C
Storage Temperature
-65°C to 150°C
Applied Input Voltage
-0.5V to VCC+0.5V
Applied Output Voltage
-0.5V to VCC+0.5V
VCC to Ground Potential
-0.5V to 4.0V
NOTICE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage
to the device. This is stress rating only and functional operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended period may affect reliability.
2. Specifications contained within the following tables are subject to change.
3. During voltage transitions, all pins may overshoot Vss to -2.0V and Vcc to +2.0V for periods up to 20ns, see
"Figure 90. Maximum Negative Overshoot Waveform" and "Figure 91. Maximum Positive Overshoot Waveform".
Figure 90. Maximum Negative Overshoot Waveform
20ns
Figure 91. Maximum Positive Overshoot Waveform
20ns
20ns
Vss
Vcc + 2.0V
Vss-2.0V
Vcc
20ns
20ns
20ns
Table 19. CAPACITANCE TA = 25°C, f = 1.0 MHz
Symbol Parameter
CIN
COUT
P/N: PM2323
Min.
Typ.
Max.
Unit
Input Capacitance
8
pF
VIN = 0V
Output Capacitance
10
pF
VOUT = 0V
Macronix Proprietary
89
Conditions
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 92. DATA INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL
Input timing reference level
0.8VCC
Output timing reference level
0.7VCC
AC
Measurement
Level
0.8V
0.2VCC
0.5VCC
Note: Input pulse rise and fall time are 66MHz
(fSCLK/
(1)
tCLH Clock High Time
tCH
≤ 66MHz
fTSCLK)
Normal Read (fRSCLK)
Others
> 66MHz
(fSCLK/
(1)
tCLL Clock Low Time
tCL
≤ 66MHz
fTSCLK)
Normal Read (fRSCLK)
tCLCH(4)
Clock Rise Time (peak to peak)
tCHCL(4)
Clock Fall Time (peak to peak)
tSLCH tCSS CS# Active Setup Time (relative to SCLK)
tCHSL
CS# Not Active Hold Time (relative to SCLK)
tDVCH/
tDSU Data In Setup Time
tDVCL
VCC: 2.7V - 3.6V
tCHDX/
tDH Data In Hold Time
(8)
VCC:
3.0V - 3.6V
tCLDX
(Loading: 15pF/10pF)
tCHSH
CS# Active Hold Time (relative to SCLK)
tSHCH
CS# Not Active Setup Time (relative to SCLK)
From Read to next Read
tSHSL tCSH CS# Deselect Time
From Write/Erase/Program
to Read Status Register
tSHQZ(4) tDIS Output Disable Time
Loading: 30pF
VCC:
Loading: 15pF
2.7V - 3.6V
Loading: 10pF
Clock Low to Output Valid
tCLQV(8)
tV
Loading: 15pF
Loading: 30pF/15pF
ODS (0,0)
VCC:
3.0V - 3.6V(9) Loading: 10pF
ODS (0,0)
tCLQX
tHO Output Hold Time
tDP(4)
CS# High to Deep Power-down Mode
tRES1(4)
CS# High to Standby Mode without Electronic Signature Read
tRES2(4)
CS# High to Standby Mode with Electronic Signature Read
tW
Write Status/Configuration Register Cycle Time
tWREAW
Write Extended Address Register
tBP
Byte-Program
tPP
Page Program Cycle Time
tSE
Sector Erase Cycle Time
tBE32
Block Erase (32KB) Cycle Time
tBE
Block Erase (64KB) Cycle Time
tCE
Chip Erase Cycle Time
tESL(5)
Erase Suspend Latency
tPSL(5)
Program Suspend Latency
tPRS(6)
Latency between Program Resume and next Suspend
tERS(7)
Latency between Erase Resume and next Suspend
tQVD(8)
Data Output Valid Time Difference among all SIO pins
P/N: PM2323
fC
fR
fT
fQ
Macronix Proprietary
92
Min.
D.C.
Typ.
Max.
120
50
Please refer to "Table 10. Dummy
Cycle and Frequency Table (MHz)".
Unit
MHz
MHz
MHz
MHz
45% x (1/fSCLK)
ns
7
ns
7
ns
45% x (1/fSCLK)
ns
7
ns
7
0.1
0.1
3
3
ns
V/ns
V/ns
ns
ns
2
ns
2
ns
1
ns
3
3
7
ns
ns
ns
30
ns
0
40
15
0.25
30
180
380
110
0.3
0.3
100
400
8
8
6
5
ns
ns
ns
ns
5
ns
4.5
ns
10
30
30
40
30
0.75
400
1000
2000
210
25
25
600
ns
us
us
us
ms
ns
us
ms
ms
ms
ms
s
us
us
us
us
ps
Rev. 1.7, April 15, 2021
MX25L25673G
Notes:
1. tCH + tCL must be greater than or equal to 1/ Frequency.
2. Typical values given for TA=25°C. Not 100% tested.
3. Test condition is shown as "Figure 92. DATA INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL" and "Figure 93.
OUTPUT LOADING".
4. The value guaranteed by characterization, not 100% tested in production.
5. Latency time is required to complete Erase/Program Suspend operation until WIP bit is "0".
6. For tPRS, minimum timing must be observed before issuing the next program suspend command. However, a
period equal to or longer than the typical timing is required in order for the program operation to make progress.
7. For tERS, minimum timing must be observed before issuing the next erase suspend command. However, a
period equal to or longer than the typical timing is required in order for the erase operation to make progress.
8. Not 100% tested.
9. For tCLQV, please note that the output driver strength (ODS1, ODS0) bits must be configured correctly according
to "Table 9. Output Driver Strength Table".
P/N: PM2323
Macronix Proprietary
93
Rev. 1.7, April 15, 2021
MX25L25673G
13. OPERATING CONDITIONS
At Device Power-Up and Power-Down
AC timing illustrated in Figure 95 and Figure 96 are for the supply voltages and the control signals at device power-up
and power-down. If the timing in the figures is ignored, the device will not operate correctly.
During power-up and power-down, CS# needs to follow the voltage applied on VCC to keep the device not to be
selected. The CS# can be driven low when VCC reach Vcc(min.) and wait a period of tVSL.
Figure 95. AC Timing at Device Power-Up
VCC
VCC(min)
GND
tVR
tSHSL
CS#
tSLCH
tCHSL
tCHSH
tSHCH
SCLK
RESET#
tCHCL
tDVCH
tCLCH
tCHDX
High Impedance
SO
Symbol
tVR
LSB IN
MSB IN
SI
Parameter
VCC Rise Time
Notes
1
Min.
Max.
500000
Unit
us/V
Notes :
1. Sampled, not 100% tested.
2. For AC spec tCHSL, tSLCH, tDVCH, tCHDX, tSHSL, tCHSH, tSHCH, tCHCL, tCLCH in the figure, please refer to
Table 21. AC CHARACTERISTICS.
P/N: PM2323
Macronix Proprietary
94
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 96. Power-Down Sequence
During power-down, CS# needs to follow the voltage drop on VCC to avoid mis-operation.
VCC
CS#
SCLK
Figure 97. Power-up Timing
VCC
VCC(max)
Chip Selection is Not Allowed
VCC(min)
tVSL
Device is fully accessible
VWI
time
P/N: PM2323
Macronix Proprietary
95
Rev. 1.7, April 15, 2021
MX25L25673G
Figure 98. Power Up/Down and Voltage Drop
When powering down the device, VCC must drop below VPWD for at least tPWD to ensure the device will initialize
correctly during power up. Please refer to "Figure 98. Power Up/Down and Voltage Drop" and "Table 22. Power-Up/Down
Voltage and Timing" below for more details.
VCC
VCC (max.)
Chip Select is not allowed
VCC (min.)
tVSL
Full Device
Access
Allowed
VPWD (max.)
tPWD
Time
Table 22. Power-Up/Down Voltage and Timing
Symbol
tVSL
VWI
VPWD
tPWD
VCC
Parameter
VCC(min.) to device operation
Write Inhibit Voltage
VCC voltage needed to below VPWD for ensuring initialization will occur
The minimum duration for ensuring initialization will occur
VCC Power Supply
Min.
3000
1.5
300
2.7
Max.
2.5
0.9
3.6
Unit
us
V
V
us
V
Note: These parameters are characterized only.
13-1. INITIAL DELIVERY STATE
The device is delivered with the memory array erased: all bits are set to 1 (each byte contains FFh). The Status
Register contains 40h (all Status Register bits are 0 except QE bit: QE=1).
P/N: PM2323
Macronix Proprietary
96
Rev. 1.7, April 15, 2021
MX25L25673G
14. ERASE AND PROGRAMMING PERFORMANCE
Parameter
Min.
Typ. (1)
Write Status Register Cycle Time
Max. (2)
Unit
40
ms
Sector Erase Cycle Time (4KB)
30
400
ms
Block Erase Cycle Time (32KB)
0.18
1
s
Block Erase Cycle Time (64KB)
0.38
2
s
Chip Erase Cycle Time
110
210
s
Byte Program Time (via page program command)
15
30
us
0.25
0.75
ms
Page Program Time
Erase/Program Cycle
100,000
cycles
Notice:
1. Typical program and erase time assumes the following conditions: 25°C, 3.3V, and all zero pattern.
2. Under worst conditions of 2.7V, highest operation temperature, post program/erase cycling.
3. System-level overhead is the time required to execute the first-bus-cycle sequence for the programming
command.
15. ERASE AND PROGRAMMING PERFORMANCE (Factory Mode)
Parameter
Min.
Typ.
Max.
Unit
Sector Erase Cycle Time (4KB)
18
ms
Block Erase Cycle Time (32KB)
100
ms
Block Erase Cycle Time (64KB)
200
ms
Chip Erase Cycle Time
80
s
0.16
ms
Page Program Time
Erase/Program Cycle
50
cycles
Notice:
1. Factory Mode must be operated in 20°C to 45°C and VCC 3.0V-3.6V.
2. In Factory mode, the Erase/Program operation should not exceed 50 cycles, and "ERASE AND PROGRAMMING
PERFORMANCE" 100k cycles will not be affected.
3. During factory mode, Suspend command (B0) cannot be executed.
P/N: PM2323
Macronix Proprietary
97
Rev. 1.7, April 15, 2021
MX25L25673G
16. DATA RETENTION
Parameter
Condition
Min.
Data retention
55˚C
20
Max.
Unit
years
17. LATCH-UP CHARACTERISTICS
Min.
Input Voltage with respect to GND on all power pins
Max.
1.5 VCCmax
Input Current on all non-power pins
-100mA
+100mA
Test conditions: VCC = VCCmax, one pin at a time (compliant to JEDEC JESD78 standard).
P/N: PM2323
Macronix Proprietary
98
Rev. 1.7, April 15, 2021
MX25L25673G
18. ORDERING INFORMATION
Please contact Macronix regional sales for the latest product selection and available form factors.
PART NO.
TEMPERATURE
PACKAGE
MX25L25673GMI-10G
-40°C to 85°C
16-SOP (300mil)
MX25L25673GM2I-10G
-40°C to 85°C
8-SOP(200mil)
MX25L25673GMI-08G
-40°C to 85°C
16-SOP (300mil)
Support Factory Mode
MX25L25673GM2I-08G
-40°C to 85°C
8-SOP(200mil)
Support Factory Mode
MX25L25673GZNI-08G
-40°C to 85°C
8-WSON (6x5mm)
Support Factory Mode
MX25L25673GZ4I-08G
-40°C to 85°C
8-WSON (8x6mm 3.4 x 4.3 EP)
Support Factory Mode
MX25L25673GZNI-10G
-40°C to 85°C
8-WSON (6x5mm)
MX25L25673GZ4I-10G
-40°C to 85°C
8-WSON (8x6mm 3.4 x 4.3 EP)
P/N: PM2323
Macronix Proprietary
99
Remark
Rev. 1.7, April 15, 2021
MX25L25673G
19. PART NAME DESCRIPTION
MX 25 L 25673G M2
I
10 G
OPTION:
G: RoHS Compliant and Halogen-free
Factory Mode:
10: Not support
08: Support
TEMPERATURE RANGE:
I: Industrial (-40°C to 85°C)
PACKAGE:
M: 16-SOP (300mil)
M2: 8-SOP(200mil)
ZN: 8-WSON (6x5mm)
Z4: 8-WSON (8x6mm, 3.4 x 4.3 EP)
DENSITY & MODE:
25673G: 256Mb, default Quad I/O enable, and can not be change
TYPE:
L: 3V
DEVICE:
25: Serial NOR Flash
P/N: PM2323
Macronix Proprietary
100
Rev. 1.7, April 15, 2021
MX25L25673G
20. PACKAGE INFORMATION
20-1. 16-pin SOP (300mil)
P/N: PM2323
Macronix Proprietary
101
Rev. 1.7, April 15, 2021
MX25L25673G
20-2. 8-pins SOP (200mil)
P/N: PM2323
Macronix Proprietary
102
Rev. 1.7, April 15, 2021
MX25L25673G
20-3. 8-land WSON (6x5mm)
P/N: PM2323
Macronix Proprietary
103
Rev. 1.7, April 15, 2021
MX25L25673G
20-4. 8-land WSON (8x6mm 3.4 x 4.3EP)
P/N: PM2323
Macronix Proprietary
104
Rev. 1.7, April 15, 2021
MX25L25673G
21. REVISION HISTORY
Revision No. Description
Page
Date
1.0
1. Removed "Advanced Information" to align with the
All
FEB/18/2016
product status
2. Added MX25L25673GMI-08G & MX25L25673GM2I-08G Part No. P109,110
3. Added Factory Mode information
P18,23,24,107
4. Added a statement for product ordering information
P109
5. Modified ICC1/ICC2/ICC3 value
P101
1.1
1. Updated tCH/tCL/tCE/tPP values
P102,107 SEP/02/2016
2. Revised the descriptions of erase/program cycle in Factory Mode P107
3. Updated tVR descriptions
P104,106
4. Added 8-WSON (6x5mm) package
P4,6,109,110,113
5. Content modification
P50-53,59
1.2
1. Removed the QPI support for WPSEL/GBLK/GBULK
P18,19,78
commands as a typo correction.
2. Added "Figure 94. SCLK TIMING DEFINITION" P100
3. Updated the note for the internal pull up status of RESET#
P6
4. Content correction
P53
MAY/09/2017
1.3 1. Added Key Features on the cover page.
P1 JUN/27/2017
2. Added Resistance values in
P35
"Table 9. Output Driver Strength Table".
3. Modified SRWD bit (Status Register Bit 7) to Reserved
P31-33, 37-38
and modified INITIAL DELIVERY STATE descriptions
P106
4. Updated Min. tVSL to 3000us.
P106
5. Four I/O read mode description correction modification.
P5, 46-47, 58
6. Secured OTP indicator bit description modification
P10, 70
7. EN4B instruction description correction
P39
8. Power Up/Down and Voltage Drop description modification
P106
9. Added a new package: 8-land WSON (8x6mm 3.4 x 4.3EP)
P4, 6, 110, 114
10. Added two part numbers:
P109
MXL25L25673GZ4I-08G & MX25L25673GZNI-10G
11. Modified "19. PART NAME DESCRIPTION". P110
12. Format modification.
P111-114
1.4
1. Updated "20-4. 8-land WSON (8x6mm 3.4 x 4.3EP)" in
Min./Max. D1, E1 and L values.
2. Updated "20-3. 8-land WSON (6x5mm)" in
Min./Max. D1, E1 and L values.
3. Corrected RDP (Release from Deep Power-down) descriptions
4. Revised "9-22. Burst Read" descriptions.
5. Updated "9-28. Page Program (PP)" descriptions.
6. Updated "9-30. Deep Power-down (DP)" descriptions.
7. Added WRSCUR and RDSCUR command figures.
8. Revised the E_FAIL and P_FAIL bits descriptions.
9. Modified the notes descriptions of AC Table.
10. Content modification.
P/N: PM2323
Macronix Proprietary
105
P116
AUG/24/2017
P115
P25
P57
P65
P68
P69-70
P72
P104-105
P15, 35, 104
Rev. 1.7, April 15, 2021
MX25L25673G
Revision No. Description
Page
Date
1.5
1. Added "Macronix Proprietary" footnote.
All
DEC/20/2019
2. 4READ Action description modification.
P17
3. Revised the descriptions of Performance Enhance Mode
P48, 59
and wrap around feature.
4. Figure 91 title modification.
P103
5. Revised the Max. Erase/Program note descriptions
P110
of ERASE AND PROGRAMMING PERFORMANCE Table.
6. Modified Serial Input Timing (STR mode/DTR mode). P13
7. Added tDVCL and tCLDX values.
P13, 105
8. Content correction.
P1, 4, 9, 37,
9. Revised Max. Chip erase time.
P105, 110
10. Added RESET# in "Figure 95. AC Timing at Device Power-Up". P107
11. Modified the descriptions of "17. LATCH-UP CHARACTERISTICS" P111
1.6 1. Added part number: MX25L25673GZ4I-10G
2. Description modification.
3. Update description of SFDP Parameter Table that contact
Macronix for details.
4. Corrected Note descriptions of the AC Table.
5. Removed USPB descriptions.
6. Added "Support Performance Enhance Mode
- XIP (execute-in-place)".
7. Added tCHDX/tCLDX descriptions & tCLQV descriptions for
VCC=3.0V-3.6V.
8. Corrected "Read Electronic Signature (RES) Sequence" figures.
9. Clarified single, dual, and quad I/O mode supporting in QE bit
setting descriptions.
10. Revised Doc. Title of package outline.
P99
SEP/04/2020
P10, 12, 16, 22,
24-26, 29, 37, 41,
43-46, 48, 57-58,
63, 65, 68, 73, 92, 98
P86-99
1.7 1. Added Output Driver Strength percentage information.
2. Description modification.
P36
APR/15/2021
P26-27, 29, 37,
47, 55-56, 73
P/N: PM2323
Macronix Proprietary
106
P92-93
P76, 78, 81
P4, 59
P92-93
P26-27
P34
P102
Rev. 1.7, April 15, 2021
MX25L25673G
Except for customized products which has been expressly identified in the applicable agreement, Macronix's
products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or
household applications only, and not for use in any applications which may, directly or indirectly, cause death,
personal injury, or severe property damages. In the event Macronix products are used in contradicted to their
target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its
actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or
distributors shall be released from any and all liability arisen therefrom.
Copyright© Macronix International Co., Ltd. 2015-2021. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, Nbit,
Macronix NBit, HybridNVM, HybridFlash, HybridXFlash, XtraROM, KH Logo, BE-SONOS, KSMC, Kingtech,
MXSMIO, Macronix vEE, RichBook, Rich TV, OctaBus, FitCAM, ArmorFlash, LybraFlash. The names and
brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
107
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