MX25L802MC-50

MX25L802 8M-BIT [8M x 1] CMOS SERIAL FLASH EEPROM FEATURES GENERAL • 8,388,608 x 1 bit structure • 128 Equal Sectors with 8K-byte each - Any sector can be erased • 2048 Equal Segments with 512-byte each - Provides sequential output within any segment • Single Power Supply Operation - 3.0 to 3.6 volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V • Low Vcc write inhibit is equal to or less than 2.5V PERFORMANCE • High Performance - Fast access time: 20MHz serial clock (50pF + 1TTL Load) - Fast program time: 5ms/page (typical, 128-byte per page) - Fast erase time: 300ms/sector (typical, 8K-byte per sector) • Low Power Consumption - Low active read current: 10mA (typical) at 17MHz - Low active programming current: 10mA (typical) - Low active erase current: 10mA (typical) - Low standby current: 30uA (typical, CMOS) • Minimum 100,000 erase/program cycle SOFTWARE FEATURES • Input Data Format - 1-byte Command code, 3-byte address, 1-byte byte address • 512-byte Sequential Read Operation • Built in 9-bit (A0 to A8) pre-settable address counter to support the 512-byte sequential read operation • Auto Erase and Auto Program Algorithm - Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algroithm that automatically times the program pulse widths (Any page to be programed should have page in the erased state first) • Status Register Feature - Provides detection of program and erase operation completion. - Provides auto erase/ program error report HARDWARE FEATURES • SCLK Input - Serial clock input • SI Input - Serial Data Input • SO Output - Serial Data Output • PACKAGE - 28-pin SOP (330mil) P/N: PM0837 REV. 1.1, APR. 13, 2005 1 MX25L802 GENERAL DESCRIPTION The MX25L802 is a CMOS 8,388,608 bit serial Flash EEPROM, which is configured as 1,048,576 x 8 internally. The MX25L802 features a serial peripheral interface and software protocol allowing operation on a simple 3- wire bus. The three bus signals are a clock input (SCLK), a serial data input (SI), and a serial data output (SO). SPI access to the device is enabled by CS input. The MX25L802 provide sequential read operation on whole chip. The sequential read operation is executed on a segment (512 byte) basis. User may start to read from any byte of the segment. While the end of the segment is reached, the device will wrap around to the beginning of the segment and continuously outputs data until CS goes high. After program/erase command is issued, auto program/ erase algorithms which program/erase and verify the specified page locations will be executed. Program command is executed on a page (128 bytes) basis, and erase command is executed on both chip and sector (8K bytes) basis. To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion and error flag status of a program or erase operation. When the device is not in operation and CS is high, it is put in standby mode and draws less than 30uA DC current. The MX25L802 utilizes MXIC's proprietary memory cell which reliably stores memory contents even after 100,000 program and erase cycles. PIN CONFIGURATIONS 28-PIN SOP (330 mil) PIN DESCRIPTION SYMBOL CS TEST(1) DESCRIPTION Chip Select Test Mode Select Serial Data Input Serial Data Output Clock Input + 3.3V Power Supply Ground Do Not Use(for Test Mode only) No Internal Connection NC TEST DU NC NC NC NC NC NC NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 NC GND VCC NC NC NC SI SO CS SCLK NC NC NC NC SI SO SCLK VCC GND DU(2) NC MX25L802 Note: 1.TEST input is used for in-house testing and must be tied to ground during normal user operation. 2.DU pin is used for in-house testing and can be tied to VCC, GND or open for normal operation. P/N: PM0837 2 REV. 1.1, APR. 13, 2005 MX25L802 BLOCK DIAGRAM Address Generator X-Decoder Memory Array (2048 x 4096) Page Buffer Data Register Y-Decoder SI CS Mode Logic State Machine Sense Amplifier HV Generator Output Buffer SO SCLK Clock Generator P/N: PM0837 3 REV. 1.1, APR. 13, 2005 MX25L802 COMMAND DEFINITION Command (byte) 1st 2nd 3rd 4th 5th 6th 7th 8th 9th Action 52H AD1 AD2 AD3 BA X X X X n bytes read out until CS goes high Output status byte until CS goes high Clear status byte Output vendor code until CS goes high Start to erase at CS rising edge Start to erase at CS rising edge Load n bytes data to buffer until CS goes high & start to program 83H X 89H 85H X F1H AD1 AD2 F4H X X F2H AD1 AD2 AD3 BA Read Array Status Read Clear Status Read ID Sector Erase Chip Erase Page Program Note: 1.X is dummy cycle and is necessary 2.AD1 to AD3 are address input data 3.BA is byte address 1-byte command code Bit7(MSB) Bit6 3-byte address(0 to 0FFFH) AD1: X X AD2: A16 A15 AD3: X X 1-byte byte address(0 to 7FH) BA: X A6 Note: A19 to A13=Sector address A19 to A9=Segment address Bit5 X A14 X A5 Bit4 X A13 X A4 Bit3 X A12 X A3 Bit2 A19 A11 X A2 Bit1 A18 A10 A8 A1 Bit0 A17 A9 A7 A0 P/N: PM0837 4 REV. 1.1, APR. 13, 2005 MX25L802 DEVICE OPERATION 1.Before a command is issued, status register should be checked to ensure device is ready for the intended operation. 2.When incorrect command is inputted to this LSI, this LSI becomes standby mode and keeps the standby mode until next CS falling edge. In standby mode, SO pin of this LSI should be High-Z. 3.When correct command is inputted to this LSI, this LSI becomes active mode and keeps the active mode until next CSB rising edge. COMMAND DESCRIPTION (1) Read Array This command is sent with the 4-byte address (command included), and the byte address, followed by four dummy bytes sent to give the device time to stabilize. The device will then send out data starting at the byte address until CS goes high. The clock to clock out the data is supplied by the master SPI. The read operation is executed on a segment (512 bytes) basis. If the end of the segment is reached then the device will wrap around to the beginning of the segment. (2) Read Status Register When this command is sent, the device will continuously send out the status register contents starting at bit7. The clock to clock out the data is supplied by the master SPI. bit7 program/erase bit6 NA bit5 NA completion Note1 bit4 erase error 1=error bit3 program error 1=error bit2 NA bit1 NA bit0 ready/busy 1=ready 0=busy Bit 6,5,2,1 = Reserve for future use. Bit 4 = "1" -----> There is an error occurred in last erase operation. = "0" -----> There is no error occurred in last erase operation. Bit 3 = "1" -----> There is an error occurred in last program operation. = "0" -----> There is no error occurred in last program operation. Bit 0 ="1" -----> Device is in ready mode. ="0" -----> Device is in busy mode. Note 1:The initial value of Bit7 is "1". Bit7 will have "1" to "0" transit only after program/erase operation is completed. Bit7 will shift from "0" to "1" only after issued program/erase/Clear status register command. (3) Clear Status Register This command only resets erase error bit (bit 4) and program error bit (bit 3) . These two bits are set by on-chip state machine during program/erase operation, and can only be reset by issuing a clear status register command or by powering down VCC . If status register indicates that error occurred in the last program/erase operation, any further program/erase operation will be prohibited until status register is cleared. (4) Read ID This command is sent with an extra dummy byte( a 2-byte command). The device will clock out manufacturer code (C2H) and device code (35H) when this command is issued. The clock to clock out the data is supplied by the master SPI. P/N: PM0837 5 REV. 1.1, APR. 13, 2005 MX25L802 (5) Sector/Chip Erase This command is sent with the sector address(A19~A13) when operating Sector Erase. The device will start the erase sequence after CS goes high without any further input. A sector should be erased in a typical of 300ms. The average current is less than 10mA. The chip erase operation does not require the sector address input but two extra dummy bytes are necessary. During this operation, customer can also access Read Status & Read ID operations. (6) Page Program This command is sent with the page number(A19~A7), and byte address(A6~A0), followed by programming data. One to 128 bytes of data can be loaded into the buffer of the device until CS goes high. IF the end of the page is reached, then the device will wrap around to the beginning of the page. The device will program the specified page with buffered data(Until CS goes high) without any further input. The typical page program time is 5ms. The average current is less than 10mA. During this operation, customer can also access Read Status & Read ID operations. (7) Standby Mode When CS is high and there is no operation in progress, the device is put in standby mode. Typical standby current is less than 30uA. POWER-ON STATE After power-up, the device is placed in the standby state with following status: The status register is reset with following status : Bit 7 = "1" -----> Refer to page 5 for detail. Bit 6,5,2,1 = Reserve for future use. Bit 4 = "0" -----> Erase error flag is reset. Bit 3 = "0" -----> Program error flag is reset. Bit 0="1" -----> Device is in ready state. P/N: PM0837 6 REV. 1.1, APR. 13, 2005 MX25L802 DATA SEQUENCE Output data is serially sent out through SO pin, synchronized with the rising edge of SCLK, whereas input data is serially read in through SI pin, synchronized with the rising edge of SCLK. The bit sequence for both input and output data is bit 7 (MSB) first, then bit 6, bit 5, ...., and bit 0.(LSB) ADDRESS SEQUENCE The address assignment is described as follows : BA: Byte address Bit sequence: AD1:First Address Bit sequence: AD2:Second Address Bit sequence: AD3:Thrid Address Bit sequence: X X A16 X A6 X A15 X A5 X A14 X A4 X A13 X A3 X A12 X A2 A19 A11 X A1 A18 A10 A8 A0 A17 A9 A7 P/N: PM0837 7 REV. 1.1, APR. 13, 2005 MX25L802 Auto Page Program Flow Chart Auto Chip Erase Flow Chart START START F2H F4H Set Chip Erase AD1 Dummy Set Page Program Command. Command. AD2 Dummy AD3 83H BA Set Read Status Register Command. Dummy Data are written (Until CS goes high) Read Status Register NO 83H Set Read Status Register Command. Dummy Bit 7= 0? YES Read Status Register Bit 4 = 0? NO YES Bit7 = 0? NO Chip Erase Completed YES Erase Error NO NO Bit3 = 0? YES Operation Done, Device stays at Read Status Register Mode until CS goes high. To Continue Other Operation, Do Clear Status Register Command First Pgae Program Completed Program Error YES Program Another Page NO Operation Done, Device stays at Read Status Register Mode until CS goes high. To Continue Other Operation, Do Clear Status Register Command First. P/N: PM0837 8 REV. 1.1, APR. 13, 2005 MX25L802 Auto Sector Erase Flow Chart START F1H Set Sector Eraes AD1 Command. AD2 83H Set Read Status Register Command. Dummy Read Status Register Bit7 = 0? NO YES NO Bit4 = 0? YES Sector Erase Completed Erase Error YES Erase Another Sector ? To Continue Other Operation, Do Clear Status Register Command First. NO Operation Done, Device stays at Read Status Register Mode until CS goes high. P/N: PM0837 9 REV. 1.1, APR. 13, 2005 MX25L802 ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage VCC to Ground Potential VALUE 0° C to 70° C -55° C to 125° C -0.5V to 4.6V -0.5V to 4.6V -0.5V to 4.6V 3.During voltage transitions, all pins may overshoot to 4.6V or -0.5V for period up to 20ns. 4.All input and output pins may overshoot to VCC+0.5V while VCC+0.5V is smaller than or equal to 4.6V. NOTICE: 1.Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and functional operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. 2.Specifications contained within the following tables are subject to change. Maximum Negative Overshoot Waveform 20ns Maximum Positive Overshoot Waveform 0V -0.5V 4.6V 3.6V 20ns CAPACITANCE TA = 25° C, f = 1.0 MHz SYMBOL CIN COUT PARAMETER Input Capacitance Output Capacitance MIN. TYP MAX. 10 10 UNIT pF pF CONDITIONS VIN = 0V VOUT = 0V P/N: PM0837 10 REV. 1.1, APR. 13, 2005 MX25L802 INPUT TEST WAVEFORMS AND MEASURESMENT LEVEL 3.0V 1.5V AC Measurement Level 0V Note:Input pulse rise and fall time are < 10ns OUTPUT LOADING DEVICE UNDER TEST +3.3V CL DIODES=IN3064 OR EQUIVALENT CL=50pF Including jig capacitance P/N: PM0837 11 REV. 1.1, APR. 13, 2005 MX25L802 DC CHARACTERISTICS (Temperature = 0° C to 70° C, VCC = 3.0V ~ 3.6V) SYMBOL PARAMETER IIL ILO ISB1 ISB2 ICC1 ICC2 ICC3 VIL VIH VOL VOH Input Load Current Output Leakage Current VCC Standby Current(CMOS) VCC Standby Current(TTL) VCC Read VCC Program Current VCC Erase Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage 2.4 1 -0.5 2.0 10 30 0.8 VCC+0.5 0.4 mA V V V V IOL = 500uA IOH = -100uA Erase in Progress 1 1 10 10 30 30 mA mA 1 3 mA 1 30 60 uA 1 ±10 uA NOTES MIN. 1 TYP MAX. ±10 UNITS uA TEST CONDITIONS VCC = VCC Max VIN = VCC or GND VCC = VCC Max VIN = VCC or GND VCC = VCC Max CS = VCC ± 0.2V VCC = VCC Max CS = VIH f=20 MHz Program in Progress NOTES: 1. All currents are in RMS unless otherwise noted. Typical values at VCC = 3.3V, T = 25° C. These currents are valid for all product versions (package and speeds). 2. Typical value is calculated by simulation. P/N: PM0837 12 REV. 1.1, APR. 13, 2005 MX25L802 AC CHARACTERISTICS (Temperature = 0° C to 70° C, VCC = 3.0V ~ 3.6V) SYMBOL fSCLK tCYC tSKH tSKL tR tF tCSA tCSB tCSH tDS tDH tAA tDOH tDOZ tECY tPCY PARAMETER Clock Frequency Clock Cycle Time Clock High Time Clock Low Time Clock Rise Time Clock Fall Time CS Lead Clock Time CS Lag Clock Time CS High Time SI Setup Time SI Hold Time Access Time SO Hold Time SO Floating Time Erase Cycle Time Program Cycle Time 5 0 300 5 20 1600 15 50 50 100 5 25 30 50 25 25 6 6 Min. Typ. Max. 20 Units MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ms ms Conditions NOTES: 1. Typical value is calculated by simulation. SERIAL DATA INPUT/OUTPUT TIMING tCSB tCSA tCSH CS tCYC tR tF SCLK tSKH tSKL SI tDS BIT 7 tDH BIT 6 BIT 0 SO tAA BIT 7 tDOH BIT 0 tDOZ P/N: PM0837 13 REV. 1.1, APR. 13, 2005 MX25L802 STANDBY TIMING WAVEFORM CS SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Hi-Z 1st byte When incorrect command is inputted to this LSI, this LSI becomes standby mode and keeps the standby mode until next CS falling edge. In standby mode, SO pin of this LSI should be High-Z. While CS=VIH, current=standby current, while CS=VIL and commands are issuing, or commands are invalid, current=5mA(typ.) to 15mA(max.). P/N: PM0837 14 REV. 1.1, APR. 13, 2005 MX25L802 READ ARRAY TIMING WAVEFORM CS SCLK SI SO Bit 7 Bit 6 Bit 5 Bit4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit5 Bit 4 Hi-Z 1st byte (52h) 2nd byte (AD1) CS SCLK SI SO 9th byte (Dummy) Bit 1 Bit 0 Bit 7 Bit6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit6 Bit 5 1st data output byte 2nd data output byte CS SCLK SI SO Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Hi-Z (N-1)th data output byte Nth data output byte NOTES: 1. 1st Byte='52h' 2. 2nd Byte=Address 1(AD1), A17=BIT 0, A18=BIT1, A19=BIT2. 3. 3rd Byte=Address 2(AD2), A9=BIT0, A10=BIT1,......A16=BIT7 4. 4th Byte=Address 3(AD3), A7=BIT0, A8=BIT1 5. 5th Byte=Byte Address(BA), A0=BIT0, A1=BIT1,......A6=BIT6 6. 6th-9th Bytes for SI ==> Dummy Bytes (Don't care) 7. From Byte 10, SO Would Output Array Data P/N: PM0837 15 REV. 1.1, APR. 13, 2005 MX25L802 READ STATUS REGISTER TIMING WAVEFORM CS SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Hi-Z 1st byte (83h) 2nd byte (Dummy) CS SCLK SI SO 2nd byte (Dummy) Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 1st status output byte 2nd status output byte CS SCLK SI SO Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Hi-Z (N-1)th status output byte Nth status output byte NOTES: 1. BIT 7=0 ==> Program/Erase completed 2. BIT 4=1 ==>Erase Error 3. BIT 3=1 ==>Program Error 4. BIT 1,2,5,6 ==> Reserve for future use 5. Bit 0=1 ==> Device is in ready state P/N: PM0837 16 REV. 1.1, APR. 13, 2005 MX25L802 CLEAR STATUS REGISTER TIMING WAVEFORM CS SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit2 Bit 1 Bit 0 Hi-Z 1st byte (89h) NOTES: 1. 1st Byte='89h' ==> CLEAR STATUS REGISTER 2. SO at Hi-Z state P/N: PM0837 17 REV. 1.1, APR. 13, 2005 MX25L802 READ ID TIMING WAVEFORM CS SCLK SI SO Bit 7 Bit 6 Bit0 Bit7 Bit 6 Bit 0 Hi-Z 1st byte (85h) 2nd byte (Dummy) Bit 7 Bit6 Bit 0 Bit 7 Bit 6 1st ID byte (C2h) 2nd ID byte (35h) CS SCLK SI SO Bit 3 Bit 2 Bit1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit3 Bit 2 Bit 1 Bit 0 Hi-Z (N-1) ID byte N ID byte NOTES: 1. 1st Byte:85h. 2. 2nd Byte:Dummy Byte. 3. 3rd Byte:Output Manufacture Code(C2h). 4. 4th Byte:Output Device Code(35H). 5. The 2 bytes ID output will be wrap around. P/N: PM0837 18 REV. 1.1, APR. 13, 2005 MX25L802 AUTO PAGE PROGRAM TIMING WAVEFORM CS SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Hi-Z 1st byte (F2h) 2nd byte (AD1) CS SCLK SI SO 5th byte (BA) 1st write data byte 2nd write data byte Bit 1 Bit0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit0 Bit 7 Bit 6 CS SCLK SI SO (N-1)th write data byte Nth write data byte Bit 3 Bit 2 Bit 1 Bit 0 Bit7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Hi-Z NOTES: 1. 1st Byte:F2h. 2. 2nd Byte:Address AD1. 3. 3rd Byte:Address AD2 4. 4th Byte:Address AD3 5. 5th Byte:Address BA. 6. 6th byte:1st write data byte. 7. When the last byte of the page will be written, the Byte Address will be wrap around to the first byte of the Page. P/N: PM0837 19 REV. 1.1, APR. 13, 2005 MX25L802 AUTO SECTOR/CHIP ERASE TIMING WAVEFORM CS SCLK SI SO Bit 7 Bit 6 Bit 5 Bit 0 Bit 7 Bit 6 Bit 5 Bit 0 Bit7 Bit 6 Bit 0 Hi-Z 1st byte - F1h for Sector Erase - F4h for Chip Erase 2nd byte - AD1 for Sector - Dummy for Chip 3rd byte - AD2 for Sector - Dummy for Chip Hi-Z NOTES: 1. 1st byte:F1h for Sector Erase, F4h for Chip Erase. 2. 2nd byte:Address AD1 for Sector Erase, Dummy byte for Chip erase. 3. 3rd byte:Address AD2 for Sector Erase, Dummy byte for Chip erase. P/N: PM0837 20 REV. 1.1, APR. 13, 2005 MX25L802 ERASE AND PROGRAMMING PERFORMANCE PARAMETER Chip Erase Time Page Programming Time Chip Programming Time TYP.(1) 300 5 48 Max.(2) 1,600 15 240 UNIT ms ms s Excludes system level overhead(3) Comments Note: 1.Typical program and erase time assumes the following conditions: 25° C,3.3V, and checker board pattern. 2.Under worst conditions of 0° C and 3.0V. 3.System-level overhead is the time required to execute the first-bus-cycle sequence for the programming command. 4.The maximum chip programming time is evaluated under the worst conditions of 0° C, VCC=3.0V, and 100K cycle with 90% confidence level. ORDERING INFORMATION PART NO. MX25L802MC-50 MX25L802MC-50G ACCESS TIME 20MHz 20MHz OPERATING CURRENT 10mA 10mA STANDBY CURRENT 30uA 30uA 28 pin SOP (330 mil) 28 pin SOP (330 mil) Pb-free PACKAGE Remark P/N: PM0837 21 REV. 1.1, APR. 13, 2005 MX25L802 PACKAGE IMFORMATION P/N: PM0837 22 REV. 1.1, APR. 13, 2005 MX25L802 REVISION HISTORY Revision No. Description 1.0 1. Remove "Advanced Information" title 1.1 1. Added Pb-free package Page P1 P21 Date MAR/04/2003 APR/13/2005 P/N: PM0837 23 REV. 1.1, APR. 13, 2005 MX25L802 MACRONIX INTERNATIONAL CO., LTD. Headquarters: TEL:+886-3-578-6688 FAX:+886-3-563-2888 Europe Office : TEL:+32-2-456-8020 FAX:+32-2-456-8021 Hong Kong Office : TEL:+86-755-834-335-79 FAX:+86-755-834-380-78 Japan Office : Kawasaki Office : TEL:+81-44-246-9100 FAX:+81-44-246-9105 Osaka Office : TEL:+81-6-4807-5460 FAX:+81-6-4807-5461 Singapore Office : TEL:+65-6346-5505 FAX:+65-6348-8096 Taipei Office : TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-262-8887 FAX:+1-408-262-8810 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.