MX27L2000TC-20

INDEX MX27L2000 2M-BIT [256Kx8] CMOS EPROM FEATURES • • • • • • • 256Kx 8 organization Wide power supply range, 2.7V DC to 3.6V DC +12.5V programming voltage Fast access time: 120/150/200/250 ns Totally static operation Completely TTL compatible Operating current:20mA @ 3.6V, 5MHz • Standby current: 20uA • Package type: 32 pin ceramic DIP, plastic DIP 32 pin SOP 8x20mm 32-lead TSOP(I) 8x14mm 32-lead TSOP(I) 8x13.4mm 32-lead TSOP(I) GENERAL DESCRIPTION The MX27L2000 is a 3V only, 2M-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 256K words by 8 bits per word, operates from a single + 3 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27L2000 supports a intelligent fast programming algorithm which can result in programming time of less than one minute. This EPROM is packaged in industry standard 32 pin dual-in-line packages, 32 lead SOP and 32 lead TSOP(I) packages. PIN CONFIGURATIONS 32 CDIP/PDIP/SOP VPP A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC PGM A17 A14 A13 A8 A9 A11 OE A10 CE Q7 Q6 Q5 Q4 Q3 BLOCK DIAGRAM CE PGM OE CONTROL LOGIC OUTPUT BUFFERS Q0~Q7 MX27L2000 . . A0~A17 ADDRESS INPUTS . . . . . . VCC VSS Y-DECODER . . . . . . . . Y-SELECT 2M BIT CELL MAXTRIX X-DECODER 32 TSOP(I) (8x20mm,8x14mm,8x13.4mm) A11 A9 A8 A13 A14 A17 PGM VCC VPP A16 A15 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 A3 PIN DESCRIPTION SYMBOL A0~A17 Q0~Q7 CE OE PGM VPP NC VCC GND PIN NAME Address Input Data Input/Output Chip Enable Input Output Enable Input Programmable Enable Input Program Supply Voltage No Internal Connection Power Supply Pin (+5V) Ground Pin REV.2.5, APR 09,1998 MX27L2000 P/N: PM0372 1 INDEX MX27L2000 FUNCTIONAL DESCRIPTION THE ERASURE OF THE MX27L2000 The MX27L2000 is erased by exposing the chip to an ultraviolet light source. A dosage of 15 W seconds/cm2 is required to completely erase a MX27L2000. This dosage can be obtained by exposure to an ultraviolet lamp wavelength of 2537 Angstroms (A) - with intensity of 12,000 uW/cm2 for 15 to 20 minutes. The MX27L2000 should be directly under and about one inch from the source and all filters should be removed from the UV light source prior to erasure. It is important to note that the MX27L2000, and similar devices, will be cleared for all bits of their programmed states with light sources having wavelengths shorter than 4000 A. Although erasure times will be much longer than that with UV sources at 2537 A, nevertheless the exposure to fluorescent light and sunlight will eventually erase the MX27L2000 and exposure to them should be prevented to realize maximum system reliability. If used in such an environment, the package window should be covered by an opaque label or substance. through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. PROGRAM INHIBIT MODE Programming of multiple MX27L2000s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27L2000 may be common. A TTL low-level program pulse applied to an MX27L2000 CE input with VPP = 12.5 ± 0.5 V and PGM LOW will program that MX27L2000. A high-level CE input inhibits the other MX27L2000s from being programmed. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE and CE, at VIL, PGM at VIH, and VPP at its programming voltage. AUTO IDENTIFY MODE The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25° ± 5°C ambient temperature range C that is required when programming the MX27L2000. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27L2000, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit. THE PROGRAMMING OF THE MX27L2000 When the MX27L2000 is delivered, or it is erased, the chip has all 2M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27L2000 through the procedure of programming. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and PGM = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the PGM input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing P/N: PM0372 REV.2.5, APR 09,1998 2 INDEX MX27L2000 READ MODE The MX27L2000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tQE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tQE. STANDBY MODE The MX27L2000 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27L2000 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTLstandby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between Vcc and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. MODE SELECT TABLE PINS MODE Read Output Disable Standby (TTL) Standby (CMOS) Program Program Verify Program Inhibit Manufacturer Code(3) Device Code(3) CE VIL VIL VIH VCC±0.3V VIL VIL VIH VIL VIL OE VIL VIH X X VIH VIL X VIL VIL PGM X X X X VIL VIH X X X A0 X X X X X X X VIL VIH A9 X X X X X X X VH VH VPP VCC VCC VCC VCC VPP VPP VPP VCC VCC OUTPUTS DOUT High Z High Z High Z DIN DOUT High Z C2H 20H NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL 3. A1 - A8 = A10 - A17 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. P/N: PM0372 REV.2.5, APR 09,1998 3 INDEX MX27L2000 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INTERACTIVE SECTION INCREMENT X YES X = 25? NO FAIL VERIFY BYTE ? PASS NO INCREMENT ADDRESS LAST ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM0372 REV.2.5, APR 09,1998 4 INDEX MX27L2000 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V CL 6.2K ohm DIODES = IN3064 OR EQUIVALENT CL = 100 pF including jig capacitance (30pF for MX27L2000-120, 150ns) SWITCHING TEST WAVEFORMS 2.0V AC driving levels 2.0V TEST POINTS 0.8V OUTPUT 0.8V INPUT AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. AC driving levels 1.5V TEST POINTS OUTPUT 1.5V INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27L2000-12/15. P/N: PM0372 REV.2.5, APR 09,1998 5 INDEX MX27L2000 ABSOLUTE MAXIMUM RATINGS RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage VCC to Ground Potential V9 & VPP VALUE -40oC to 85oC -65oC to 125oC -0.5V to 7.0V -0.5V to VCC + 0.5V -0.5V to 7.0V -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27L2000 -12 Operating Temperature Commercial Industrial Vcc Power Supply 0°C to 70°C 2.7V to 3.6V -15 0°C to 70° C 2.7V to 3.6V -20 0°C to 70°C -40°C to 85° C 2.7V to 3.6V -25 0° to 70°C C -40°C to 85°C 2.7V to 3.6V DC CHARACTERISTICS SYMBOL VOH VOL VIH VIL ILI ILO ICC3 ICC2 ICC1 IPP PARAMETER Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current VCC Power-Down Current VCC Standby Current VCC Active Current VPP Supply Current Read 2.0 -0.3 -10 -10 MIN. 2.4 0.4 VCC + 0.5 0.8 10 10 20 0.25 20 10 MAX. UNIT V V V V uA uA uA mA mA uA 2.7V < VCC < 3.6V VIN = 0 to 3.6V VOUT = 0 to 5.5V CE = VCC ± 0.3V CE = VIH CE = VIL, f=5MHz, Iout = 0mA, VCC=3.6V CE = OE = VIL, VPP = VCC CONDITIONS IOH = -0.4mA, VCC=3.0V IOL = 2.1mA, VCC=3.0V CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL CIN COUT CVPP PARAMETER Input Capacitance Output Capacitance VPP Capacitance TYP. 8 8 18 MAX. 12 12 25 UNIT pF pF pF CONDITIONS VIN = 0V VOUT = 0V VPP = 0V P/N: PM0372 REV.2.5, APR 09,1998 6 INDEX MX27L2000 AC CHARACTERISTICS 27L2000-12 SYMBOL tACC tCE tOE tDF tOH PARAMETER Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay OE High to Output Float, or CE High to Output Floa Output Hold from Address, CE or OE which ever occurred first MIN MAX. 120 120 50 35 27L2000-15 MIN. MAX. 150 150 65 50 0 27L2000-20 MIN. MAX. 200 200 100 0 27L2000-25 MIN. MAX. 250 250 120 0 UNIT ns ns ns 70 ns CONDITIONS CE = OE =VIL OE = VIL CE = VIL ns 0 0 0 0 60 0 DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL VOH VOL VIH VIL ILI VH ICC3 IPP2 VCC1 VPP1 PARAMETER Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current A9 Auto Select Voltage VCC Supply Current (Program & Verify) VPP Supply Current(Program) Fast Programming Supply Voltage Fast Programming Voltage 6.00 12.5 2.0 -0.3 -10 11.5 MIN. 2.4 0.4 VCC + 0.5 0.8 10 12.5 50 30 6.50 13.0 MAX. UNIT V V V V uA V mA mA V V CE=PGM=VIL,OE=VIH VIN = 0 to 3.6V CONDITIONS IOH = -0.40mA IOL = 2.1mA AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL tAS tOES tDS tAH tDH tDFP tVPS tPW tVCS tCES tOE PARAMETER Address Setup Time OE Setup Time Data Setup Time Address Hold Time Data Hold Time Output Enable to Output Float Delay VPP Setup Time PGM Program Pulse Width VCC Setup Time CE Setup Time Data valid from OE MIN. 2.0 2.0 2.0 0 2.0 0 2.0 95 2.0 2 150 105 130 MAX. UNIT us us us us us ns us us us us ns CONDITIONS P/N: PM0372 REV.2.5, APR 09,1998 7 INDEX MX27L2000 WAVEFORMS READ CYCLE ADDRESS INPUTS tACC DATA ADDRESS CE tCE OE tDF DATA OUT tOE VALID DATA tOH FAST PROGRAMMING ALGORITHM WAVEFORM PROGRAM VIH PROGRAM VERIFY Addresses VIL tAS Hi-z DATA IN STABLE DATA OUT VALID tAH DATA tDS VPP1 tDH tDFP VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tCES VIH PGM VIL tPW VIH tOES tOE Max OE VIL P/N: PM0372 REV.2.5, APR 09,1998 8 INDEX MX27L2000 ORDERING INFORMATION CERAMIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27L2000DC-12 MX27L2000DC-15 MX27L2000DC-20 MX27L2000DC-25 MX27L2000DI-12 MX27L2000DI-15 MX27L2000DI-20 MX27L2000DI-25 120 150 200 250 120 150 200 250 20 20 20 20 20 20 20 20 STANDBY CURRENT MAX.(uA) 20 20 20 20 20 20 20 20 OPERATING TEMPERATURE 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP 32 Pin DIP PACKAGE PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27L2000PC-12 MX27L2000MC-12 MX27L2000TC-12 MX27L2000PC-15 MX27L2000MC-15 MX27L2000TC-15 MX27L2000PC-20 MX27L2000MC-20 MX27L2000TC-20 MX27L2000PC-25 MX27L2000MC-25 MX27L2000TC-25 MX27L2000PI-12 MX27L2000MI-12 MX27L2000TI-12 MX27L2000PI-15 MX27L2000MI-15 MX27L2000TI-15 MX27L2000PI-20 MX27L2000MI-20 MX27L2000TI-20 MX27L2000PI-25 MX27L2000MI-25 MX27L2000TI-25 120 120 120 150 150 150 200 200 200 250 250 250 120 120 120 150 150 150 200 200 200 250 250 250 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 STANDBY CURRENT MAX.(uA) 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 OPERATING TEMPERATURE 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C 0° to 70°C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C -40° to 85° C C 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) 32 Pin DIP 32 Pin SOP 8x20mm 32 Pin TSOP(I) PACKAGE P/N: PM0372 REV.2.5, APR 09,1998 9 INDEX MX27L2000 PLASTIC PACKAGE PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27L2000T2C-12 MX27L2000T2C-15 MX27L2000T2C-20 MX27L2000T2C-25 MX27L2000T2I-12 MX27L2000T2I-15 MX27L2000T2I-20 MX27L2000T2I-25 MX27L2000T3C-12 MX27L2000T3C-15 MX27L2000T3C-20 MX27L2000T3C-25 MX27L2000T3I-12 MX27L2000T3I-15 MX27L2000T3I-20 MX27L2000T3I-25 120 150 200 250 120 150 200 250 120 150 200 250 120 150 200 250 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 STANDBY CURRENT MAX.(uA) 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 OPERATING TEMPERATURE 0°C to 70° C 0°C to 70° C 0°C to 70° C 0°C to 70° C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 0°C to 70° C 0°C to 70° C 0°C to 70° C 0°C to 70° C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 8x14mm 32 Pin TSOP(I) 8x14mm 32 Pin TSOP(I) 8x14mm 32 Pin TSOP(I) 8x14mm 32 Pin TSOP(I) 8x14mm 32 Pin TSOP(I) 8x14mm 32 Pin TSOP(I) 8x14mm 32 Pin TSOP(I) 8x14mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) 8x13.4mm 32 Pin TSOP(I) PACKAGE P/N: PM0372 REV.2.5, APR 09,1998 10 INDEX MX27L2000 PACKAGE INFORMATION 32-PIN CERDIP(MSI) WITH WINDOW (600mil) ITEM A B C D E F G H I J K L M N NOTE: MILLIMETERS 42.26 max 1.90 ± .38 2.54 [TP] .46 [REF] 38.07 1.42 [REF] 3.43 ± .38 .96 ± .43 4.06 5.00 15.58 ± .13 13.20 ± .38 .25 [REF] ø8.12 INCHES 1.665 max .075 ± .015 .100 [TP] .018 [REF] 1.500 .056 [REF] .135 ± .015 .038 ± .017 .160 .203 .614 ± .005 .520 ± .015 .010 [REF] ø.320 F D E C B M 0.15¡ HG I J 1 A 16 K L 32 N 17 Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32-PIN PLASTIC DIP(600 mil) ITEM A B C D E F G H I J K L M NOTE: MILLIMETERS 42.13 max. 1.90 [REF] 2.54 [TP] .46 [Typ.] 38.07 1.27 [Typ.] 3.30 ± .25 .51 [REF] 3.94 ± .25 5.33 max. 15.22 ± .25 13.97 ± .25 .25 [Typ.] INCHES 1.660 max. .075 [REF] .100 [TP] .018 [Typ.] 1.500 .050 [Typ.] .130 ± .010 .020 [REF] .155 ± .010 .210 max. .600 ± .010 .550 ±.010 .010 [Typ.] F D E C B M 0~15¡ H G I J 1 A 16 K L 32 17 Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. P/N: PM0372 REV.2.5, APR 09,1998 11 INDEX MX27L2000 PACKAGE INFORMATION(Continued) 32-PIN PLASTIC SOP (450 mil) 32 17 ITEM A B C D E F G H I J K L NOTE: MILLIMETERS 20.95 max. 1.00 [REF] 1.27 [TP] .40 [Typ.] .05 min. 3.05 max. 2.69 ± .13 14.12 ± .25 11.30 ± .13 1.42 .20 [Typ.] .79 INCHES .825 max. .039 [REF] .050 [TP] .016 [Typ.] .002 min. .120 max. .106 ±.005 .556 ± .010 .445 ± .005 .056 .008 [Typ.] .031 E D C B L G F K 1 A 16 H I J Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. 32-PIN PLASTIC TSOP ITEM A B C D E F G H I J K L M N NOTE: MILLIMETERS 20.0 ± .20 18.40 ± .10 8.20 max. 0.15 [Typ.] .80 [Typ.] .20 ± .10 .30 ± .10 .50 [Typ.] .45 max. 0 ~ .20 1.00 ±.10 1.27 max. .50 0 ~ 5° INCHES .078 ±.006 .724 ± .004 .323 max. .006 [Typ.] .031 [Typ.] .008 ± .004 .012 ±.004 .020 [Typ.] .018 max. 0 ~ .008 .039 ±.004 .050 max. .020 .500 D E F G H I J K L M O N C A B Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition. P/N: PM0372 REV.2.5, APR 09,1998 12 INDEX MX27L2000 Revision History Revision No. Description 2.0 Eliminate Interactive Programming Mode. AC driving levels changed from 2.4V/0.4V to 3V/0V. 2.1 IPP 100uA --> 10uA 2.2 Add 120/150ns speed grades. 2.3 Corrected errors in the DC/AC Operating Conditions for Read Operation 2.4 Add 8x14mm and 8x13.4mm 32-TSOP(I) Packages 2.5 Change TSOP Orientation Date 5/29/1997 8/07/1997 12/24/1997 2/5/1998 2/24/1998 4/09/1998 P/N: PM0372 REV.2.5, APR 09,1998 13 INDEX MX27L2000 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-8888 FAX:+886-3-578-8887 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-747-2309 FAX:+65-748-4090 TAIPEI OFFICE: TEL:+886-3-509-3300 FAX:+886-3-509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice. 14