MX29LV400CTXBI-70

MX29LV400C T/B 4M-BIT [512K x 8 / 256K x 16] CMOS SINGLE VOLTAGE 3V ONLY FLASH MEMORY FEATURES • Extended single - supply voltage range 2.7V to 3.6V • 524,288 x 8/262,144 x 16 switchable • Single power supply operation - 3.0V only operation for read, erase and program operation • Fully compatible with MX29LV400T/B device • Fast access time: 55R/70/90ns • Low power consumption - 30mA maximum active current - 0.2uA typical standby current • Command register architecture - Byte/word Programming (9us/11us typical) - Sector Erase (Sector structure 16K-Byte x 1, 8K-Byte x 2, 32K-Byte x1, and 64K-Byte x7) • Auto Erase (chip & sector) and Auto Program - Automatically erase any combination of sectors with Erase Suspend capability - Automatically program and verify data at specified address • Erase suspend/Erase Resume - Suspends sector erase operation to read data from, or program data to, any sector that is not being erased, then resumes the erase • Status Reply - Data# Polling & Toggle bit for detection of program and erase operation completion • Ready/Busy# pin (RY/BY#) - Provides a hardware method of detecting program or erase operation completion • Sector protection - Hardware method to disable any combination of sectors from program or erase operations - Temporary sector unprotect allows code changes in previously locked sectors • CFI (Common Flash Interface) compliant - Flash device parameters stored on the device and provide the host system to access • 100,000 minimum erase/program cycles • Latch-up protected to 100mA from -1V to VCC+1V • Boot Sector Architecture - T = Top Boot Sector - B = Bottom Boot Sector • Package type: - 44-pin SOP - 48-pin TSOP - 48-ball CSP (6 x 8mm) - 48-ball CSP (4 x 6mm) - All Pb-free devices are RoHS Compliant • Compatibility with JEDEC standard - Pinout and software compatible with single-power supply Flash • 20 years data retention GENERAL DESCRIPTION The MX29LV400C T/B is a 4-mega bit Flash memory organized as 512K bytes of 8 bits or 256K words of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX29LV400C T/B is packaged in 44-pin SOP, 48-pin TSOP and 48-ball CSP. It is designed to be reprogrammed and erased in system or in standard EPROM programmers. The standard MX29LV400C T/B offers access time as fast as 55ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention, the MX29LV400C T/B has separate chip enable (CE#) and output enable (OE#) controls. MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and programming. The MX29LV400C T/B uses a command register to manage this functionality. The command register allows for 100% P/N:PM1155 TTL level control inputs and fixed power supply levels during erase and programming, while maintaining maximum EPROM compatibility. MXIC Flash technology reliably stores memory contents even after 100,000 erase and program cycles. The MXIC cell is designed to optimize the erase and programming mechanisms. In addition, the combination of advanced tunnel oxide processing and low internal electric fields for erase and program operations produces reliable cycling. The MX29LV400C T/B uses a 2.7V~3.6V VCC supply to perform the High Reliability Erase and auto Program/Erase algorithms. The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process. Latch-up protection is proved for stresses up to 100 milliamps on address and data pin from -1V to VCC + 1V. REV. 1.5, APR. 24, 2006 1 MX29LV400C T/B PIN CONFIGURATIONS 44 SOP(500 mil) NC RY/BY# A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RESET# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC PIN DESCRIPTION SYMBOL A0~A17 Q0~Q14 Q15/A-1 CE# WE# BYTE# RESET# OE# RY/BY# VCC GND NC PIN NAME Address Input Data Input/Output Q15 (Word mode)/LSB addr(Byte mode) Chip Enable Input Write Enable Input Word/Byte Selection input Hardware Reset Pin/Sector Protect Unlock Output Enable Input Ready/Busy Output Power Supply Pin (2.7V~3.6V) Ground Pin Pin Not Connected Internally 48 TSOP (Standard Type) (12mm x 20mm) A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# NC A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 MX29LV400C T/B MX29LV400C T/B P/N:PM1155 REV. 1.5, APR. 24, 2006 2 MX29LV400C T/B 48-Ball CSP (Ball Pitch = 0.8 mm, Top View, Balls Facing Down, 6 x 8 mm) 6 A13 A12 A14 A15 A16 BYTE# Q15/ A-1 GND 5 A9 A8 A10 A11 Q7 Q14 Q13 Q6 4 WE# RESET# NC NC Q5 Q12 VCC Q4 3 RY/ BY# A7 NC NC NC Q2 Q10 Q11 Q3 2 A17 A6 A5 Q0 Q8 Q9 Q1 1 A3 A4 A2 A1 A0 CE# OE# GND A B C D E F G H 48-Ball CSP (Balls Facing Down, 4 x 6 mm) 6 A2 A4 A6 A17 NC NC WE# NC A9 A11 5 A1 A3 A7 NC NC A10 A13 A14 4 A0 A5 A18 A8 A12 A15 3 CE# Q8 Q10 Q4 Q11 A16 2 GND OE# Q9 NC NC Q5 Q6 Q7 1 Q0 Q1 Q2 Q3 VCC Q12 Q13 Q14 Q15 GND A B C D E F G H J K L P/N:PM1155 REV. 1.5, APR. 24, 2006 3 MX29LV400C T/B BLOCK STRUCTURE Table 1: MX29LV400CT SECTOR ARCHITECTURE Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 Sector Size Byte Mode Word Mode 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 32Kbytes 8Kbytes 8Kbytes 16Kbytes 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 16Kwords 4Kwords 4Kwords 8Kwords Address range Byte Mode (x8) 00000-0FFFF 10000-1FFFF 20000-2FFFF 30000-3FFFF 40000-4FFFF 50000-5FFFF 60000-6FFFF 70000-77FFF 78000-79FFF 7A000-7BFFF 7C000-7FFFF Word Mode (x16) 00000-07FFF 08000-0FFFF 10000-17FFF 18000-1FFFF 20000-27FFF 28000-2FFFF 30000-37FFF 38000-3BFFF 3C000-3CFFF 3D000-3DFFF 3E000-3FFFF A17 A16 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1 0 0 1 1 1 1 1 Sector Address A15 0 1 0 1 0 1 0 1 1 1 1 A14 X X X X X X X 0 1 1 1 A13 X X X X X X X X 0 0 1 A12 X X X X X X X X 0 1 X Note: Byte mode:address range A17:A-1, word mode:address range A17:A0. Table 2: MX29LV400CB SECTOR ARCHITECTURE Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 Sector Size Byte Mode Word Mode 16Kbytes 8Kbytes 8Kbytes 32Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 8Kwords 4Kwords 4Kwords 16Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords Address range Byte Mode (x8) 00000-03FFF 04000-05FFF 06000-07FFF 08000-0FFFF 10000-1FFFF 20000-2FFFF 30000-3FFFF 40000-4FFFF 50000-5FFFF 60000-6FFFF 70000-7FFFF Word Mode (x16) 00000-01FFF 02000-02FFF 03000-03FFF 04000-07FFF 08000-0FFFF 10000-17FFF 18000-1FFFF 20000-27FFF 28000-2FFFF 30000-37FFF 38000-3FFFF A17 A16 0 0 0 0 0 0 0 1 1 1 1 0 0 0 0 0 1 1 0 0 1 1 Sector Address A15 0 0 0 0 1 0 1 0 1 0 1 A14 0 0 0 1 X X X X X X X A13 0 1 1 X X X X X X X X A12 X 0 1 X X X X X X X X Note: Byte mode:address range A17:A-1, word mode:address range A17:A0. P/N:PM1155 REV. 1.5, APR. 24, 2006 4 MX29LV400C T/B BLOCK DIAGRAM CE# OE# WE# RESET# CONTROL INPUT LOGIC PROGRAM/ERASE HIGH VOLTAGE WRITE STATE MACHINE (WSM) STATE REGISTER FLASH ARRAY ARRAY SOURCE HV Y-PASS GATE X-DECODER ADDRESS LATCH A0-A17 AND BUFFER COMMAND DATA DECODER Y-DECODER SENSE AMPLIFIER PGM DATA HV COMMAND DATA LATCH PROGRAM DATA LATCH Q0-Q15/A-1 I/O BUFFER P/N:PM1155 REV. 1.5, APR. 24, 2006 5 MX29LV400C T/B AUTOMATIC PROGRAMMING The MX29LV400C T/B is byte programmable using the Automatic Programming algorithm. The Automatic Programming algorithm makes the external system do not need to have time out sequence nor to verify the data programmed. The typical chip programming time at room temperature of the MX29LV400C T/B is less than 10 seconds. dard microprocessor write timings. The device will automatically pre-program and verify the entire array. Then the device automatically times the erase pulse width, provides the erase verification, and counts the number of sequences. A status bit toggling between consecutive read cycles provides feedback to the user as to the status of the erasing operation. Register contents serve as inputs to an internal statemachine which controls the erase and programming circuitry. During write cycles, the command register internally latches address and data needed for the programming and erase operations. During a system write cycle, addresses are latched on the falling edge, and data are latched on the rising edge of WE# or CE#, whichever happens first. MXIC's Flash technology combines years of EPROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX29LV400C T/B electrically erases all bits simultaneously using FowlerNordheim tunneling. The bytes are programmed by using the EPROM programming mechanism of hot electron injection. During a program cycle, the state-machine will control the program sequences and command register will not respond to any command set. During a Sector Erase cycle, the command register will only respond to Erase Suspend command. After Erase Suspend is completed, the device stays in read mode. After the state machine has completed its task, it will allow the command register to respond to its full command set. AUTOMATIC CHIP ERASE The entire chip is bulk erased using 10 ms erase pulses according to MXIC's Automatic Chip Erase algorithm. Typical erasure at room temperature is accomplished in less than 4 second. The Automatic Erase algorithm automatically programs the entire array prior to electrical erase. The timing and verification of electrical erase are controlled internally within the device. AUTOMATIC SECTOR ERASE The MX29LV400C T/B is sector(s) erasable using MXIC's Auto Sector Erase algorithm. The Automatic Sector Erase algorithm automatically programs the specified sector(s) prior to electrical erase. The timing and verification of electrical erase are controlled internally within the device. An erase operation can erase one sector, multiple sectors, or the entire device. AUTOMATIC PROGRAMMING ALGORITHM MXIC's Automatic Programming algorithm requires the user to only write program set-up commands (including 2 unlock write cycle and A0H) and a program command (program data and address). The device automatically times the programming pulse width, provides the program verification, and counts the number of sequences. A status bit similar to Data# Polling and a status bit toggling between consecutive read cycles, provide feedback to the user as to the status of the programming operation. Refer to write operation status, table7, for more information on these status bits. AUTOMATIC SELECT The automatic select mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on Q7~Q0. This mode is mainly adapted for programming equipment on the device to be programmed with its programming algorithm. When programming by high voltage method, automatic select mode requires VID (11.5V to 12.5V) on address pin A9 and other address pin A6, A1 as referring to Table 3. In addition, to access the automatic select codes insystem, the host can issue the automatic select command through the command register without requiring VID, as shown in table4. To verify whether or not sector being protected, the sector address must appear on the appropriate highest order REV. 1.5, APR. 24, 2006 AUTOMATIC ERASE ALGORITHM MXIC's Automatic Erase algorithm requires the user to write commands to the command register using stanP/N:PM1155 6 MX29LV400C T/B address bit (see Table 1 and Table 2). The rest of address bits, as shown in table3, are don't care. Once all necessary bits have been set as required, the programming equipment may read the corresponding identifier code on Q7~Q0. TABLE 3. MX29LV400C T/B AUTO SELECT MODE OPERATION A17 A11 Description Manufacture Code Read Silicon ID Device ID (Top Boot Block) Device ID (Bottom Boot Block) Sector Protection Verification Word Byte Word Byte L L L L L L L L L L H H H H H H H H H H X X X X SA X VID X X VID X X VID X X VID X X VID X L L L L L X X X X X L L L L H H H H H L 22B9H XXB9H 22BAH XXBAH XX01H (protected) XX00H (unprotected) NOTE:SA=Sector Address, X=Don't Care, L=Logic Low, H=Logic High Mode CE# OE# WE# REL L H H | X | A9 SET# A12 A10 A8 | A6 A7 L A5 | A2 X L L C2H A1 A0 Q15~Q0 X VID X P/N:PM1155 REV. 1.5, APR. 24, 2006 7 MX29LV400C T/B TABLE 4. MX29LV400C T/B COMMAND DEFINITIONS Command Bus First Bus Cycle Second Bus Cycle Third Bus Cycle Fourth Bus Cycle Data Fifth Bus Cycle Addr Sixth Bus Cycle Data Addr Data Cycle Addr Reset Read Read Silicon ID Word Byte Sector Protect Verify Byte 4 Word 1 1 4 4 4 Data Addr Data Addr Data Addr XXXH F0H RA RD 55H 55H 55H 555H AAAH 555H 90H ADI 90H ADI 90H (SA) x02H AAAH AAH 555H 55H AAAH 90H (SA) x04H DDI DDI XX00H XX01H 00H 01H PD PD 2AAH 55H 555H 55H 2AAH 55H 555H 55H 555H 10H AAAH 10H SA SA 30H 30H 555H AAH 2AAH AAAH AAH 555H 555H AAH 2AAH Program Word Byte 4 4 6 6 6 6 1 1 1 1 555H AAH 2AAH AAAH AAH 555H 555H AAH 2AAH AAAH AAH 555H 555H AAH 2AAH AAAH AAH 555H XXXH B0H XXXH 30H 55H AAH 98 98 55H 55H 55H 55H 55H 55H 555H AAAH 555H AAAH 555H AAAH A0H PA A0H PA Chip Erase Word Byte 80H 555H AAH 80H AAAH AAH 80H 555H AAH 80H AAAH AAH Sector Erase Word Byte Sector Erase Suspend Sector Erase Resume CFI Query Word Byte Note: 1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacturer code,A1=0, A0 = 1 for device code. A2-A17=do not care. (Refer to table 3) DDI = Data of Device identifier : C2H for manufacture code, B9H/BAH (x8) and 22B9H/22BAH (x16) for device code. X = X can be VIL or VIH RA=Address of memory location to be read. RD=Data to be read at location RA. 2. PA = Address of memory location to be programmed. PD = Data to be programmed at location PA. SA = Address of the sector to be erased. 3. The system should generate the following address patterns: 555H or 2AAH to Address A10~A0 in word mode/AAAH or 555H to Address A10~A-1 in byte mode. Address bit A11~A17=X=Don't care for all address commands except for Program Address (PA) and Sector Address (SA). Write Sequence may be initiated with A11~A17 in either state. 4. For Sector Protect Verify operation: If read out data is 01H, it means the sector has been protected. If read out data is 00H, it means the sector is still not being protected. 5. Any number of CFI data read cycle are permitted. P/N:PM1155 REV. 1.5, APR. 24, 2006 8 MX29LV400C T/B COMMAND DEFINITIONS Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode. Table 4 defines the valid register command TABLE 5. MX29LV400C T/B BUS OPERATION ADDRESS DESCRIPTION CE# OE# WE# REA17 A10 A9 A8 A7 AIN A6 A5 A1 A2 Dout A0 Q0~Q7 Q8~Q15 BYTE =VIH Dout BYTE =VIL Q8~Q14=High Z Q15=A-1 Write L H L H AIN DIN(3) DIN Q8~Q14=High Z Q15=A-1 Reset Temporary sector unlock Output Disable Standby X X L Vcc ± 0.3V Sector Protect Chip Unprotect Sector Protection Verify L L L H H L L L H X X H X X X H X L VID H Vcc ± 0.3V VID VID H SA X SA X X X X X X L H L X X X H H H L L L DIN DIN CODE(5) X X X X X X X AIN X X High Z DIN High Z High Z High Z DIN High Z High Z High Z High Z High Z High Z sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress. SET# A11 Read L L H H X VID X NOTES: 1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 4. 2. VID is the Silicon-ID-Read high voltage, 11.5V to 12.5V. 3. Refer to Table 4 for valid Data-In during a write operation. 4. X can be VIL or VIH. 5. Code=00H/XX00H means unprotected. Code=01H/XX01H means protected. 6. A17~A12=Sector address for sector protect. 7. The sector protect and chip unprotect functions may also be implemented via programming equipment. P/N:PM1155 REV. 1.5, APR. 24, 2006 9 MX29LV400C T/B REQUIREMENTS FOR READING ARRAY DATA To read array data from the outputs, the system must drive the CE# and OE# pins to VIL. CE# is the power control and selects the device. OE# is the output control and gates array data to the output pins. WE# should remain at VIH. The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid address on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered. STANDBY MODE When using both pins of CE# and RESET#, the device enter CMOS Standby with both pins held at Vcc ± 0.3V. If CE# and RESET# are held at VIH, but not within the range of VCC ± 0.3V, the device will still be in the standby mode, but the standby current will be larger. During Auto Algorithm operation, Vcc active current (Icc2) is required even CE# = "H" until the operation is completed. The device can be read with standard access time (tCE) from either of these standby modes, before it is ready to read data. OUTPUT DISABLE With the OE# input at a logic high level (VIH), output from the devices are disabled. This will cause the output pins to be in a high impedance state. WRITE COMMANDS/COMMAND SEQUENCES To program data to the device or erase sectors of memory , the system must drive WE# and CE# to VIL, and OE# to VIH. An erase operation can erase one sector, multiple sectors , or the entire device. Table indicates the address space that each sector occupies. A "sector address" consists of the address bits required to uniquely select a sector. The "Writing specific address and data commands or sequences into the command register initiates device operations. Table 1 defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data. Section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation. After the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on Q7Q0. Standard read cycle timings apply in this mode. Refer to the Autoselect Mode and Autoselect Command Sequence section for more information. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The "AC Characteristics" section contains timing specification table and timing diagrams for write operations. RESET# OPERATION The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3V, the device draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS±0.3V, the standby current will be greater. The RESET# pin may be tied to system reset circuitry. A system reset would that also reset the Flash memory, enabling the system to read the boot-up firm-ware from the Flash memory. If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a "0" (busy) until the internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a pro- P/N:PM1155 REV. 1.5, APR. 24, 2006 10 MX29LV400C T/B gram or erase operation is completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the RESET# pin returns to VIH. Refer to the AC Characteristics tables for RESET# parameters and to Figure 24 for the timing diagram. sector erase command 30H. The Automatic Chip Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Chip Erase. Upon executing the Automatic Chip Erase, the device will automatically program and verify the entire memory for an all-zero data pattern. When the device is automatically verified to contain an all-zero pattern, a self-timed chip erase and verify begin. The erase and verify operations are completed when the data on Q7 is "1" at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. When using the Automatic Chip Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array (no erase verification command is required). If the Erase operation was unsuccessful, the data on Q5 is "1"(see Table 7), indicating the erase operation exceed internal timing limit. The automatic erase begins on the rising edge of the last WE# or CE# pulse, whichever happens first in the command sequence and terminates when the data on Q7 is "1" at which time the device returns to the Read mode, or the data on Q6 stops toggling for two consecutive read cycles at which time the device returns to the Read mode. READ/RESET COMMAND The read or reset operation is initiated by writing the read/ reset command sequence into the command register. Microprocessor read cycles retrieve array data. The device remains enabled for reads until the command register contents are altered. If program-fail or erase-fail happen, the write of F0H will reset the device to abort the operation. A valid command must then be written to place the device in the desired state. SILICON-ID READ COMMAND Flash memories are intended for use in applications where the local CPU alters memory contents. As such, manufacturer and device codes must be accessible while the device resides in the target system. PROM programmers typically access signature codes by raising A9 to a high voltage (VID). However, multiplexing high voltage onto address lines is not generally desired system design practice. The MX29LV400C T/B contains a Silicon-ID-Read operation to supple traditional PROM programming methodology. The operation is initiated by writing the read silicon ID command sequence into the command register. Following the command write, a read cycle with A1=VIL, A0=VIL retrieves the manufacturer code of C2H/ 00C2H. A read cycle with A1=VIL, A0=VIH returns the device code of B9H/22B9H for MX29LV400CT, BAH/ 22BAH for MX29LV400CB. SET-UP AUTOMATIC CHIP/SECTOR ERASE COMMANDS Chip erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the "set-up" command 80H. Two more "unlock" write cycles are then followed by the chip erase command 10H or P/N:PM1155 REV. 1.5, APR. 24, 2006 11 MX29LV400C T/B TABLE 6. EXPANDED SILICON ID CODE Pins Manufacture code Device code for MX29LV400CT Device code for MX29LV400CB Sector Protection Verification Word Byte Word Byte Word Byte A0 VIL VIL VIH VIH VIH VIH X X A1 VIL VIL VIL VIL VIL VIL VIH VIH Q15~Q8 Q7 00H X 22H X 22H X X X 1 1 1 1 1 1 0 0 Q6 1 1 0 0 0 0 0 0 Q5 0 0 1 1 1 1 0 0 Q4 0 0 1 1 1 1 0 0 Q3 0 0 1 1 1 1 0 0 Q2 Q1 0 0 0 0 0 0 0 0 1 1 0 0 1 1 0 0 Q0 0 0 1 1 0 0 1 0 Code(Hex) 00C2H C2H 22B9H B9H 22BAH BAH 01H (Protected) 00H (Unprotected) READING ARRAY DATA The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Automatic Program or Automatic Erase algorithm. After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erasesuspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See "Erase Suspend/Erase Resume Commands" for more infor-mation on this mode. The system must issue the reset command to re-enable the device for reading array data if Q5 goes high, or while in the autoselect mode. See the "Reset Command" section, next. RESET COMMAND Writing the reset command to the device resets the device to reading array data. Address bits are don't care for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence be-fore programming begins. This resets the device to reading array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an SILICON ID READ command sequence. Once in the SILICON ID READ mode, the reset command must be written to return to reading array data (also applies to SILICON ID READ during Erase Suspend). If Q5 goes high during a program or erase operation, writing the reset command returns the device to read-ing array data (also applies during Erase Suspend). P/N:PM1155 REV. 1.5, APR. 24, 2006 12 MX29LV400C T/B SECTOR ERASE COMMANDS The Automatic Sector Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Sector Erase Set-up command and Automatic Sector Erase command. Upon executing the Automatic Sector Erase command, the device will automatically program and verify the sector(s) memory for an all-zero data pattern. The system is not required to provide any control or timing during these operations. When the sector(s) is automatically verified to contain an all-zero pattern, a self-timed sector erase and verify begin. The erase and verify operations are complete when either the data on Q7 is "1" at which time the device returns to the Read mode, or the data on Q6 stops toggling for two consecutive read cycles at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. When using the Automatic sector Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array (no erase verification command is required). Sector erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the setup command 80H. Two more "unlock" write cycles are then followed by the sector erase command 30H. The sector address is latched on the falling edge of WE# or CE#, whichever happens later, while the command (data) is latched on the rising edge of WE# or CE#, whichever happens first. Sector addresses selected are loaded into internal register on the sixth falling edge of WE# or CE#, whichever happens later. Each successive sector load cycle started by the falling edge of WE# or CE#, whichever happens later must begin within 50us from the rising edge of the preceding WE# or CE#, whichever happens first. Otherwise, the loading period ends and internal auto sector erase cycle starts. (Monitor Q3 to determine if the sector erase timer window is still open, see section Q3, Sector Erase Timer.) Any command other than Sector Erase(30H) or Erase Suspend(B0H) during the time-out period resets the device to read mode. Table 7. Write Operation Status Status Byte Program in Auto Program Algorithm Auto Erase Algorithm Erase Suspend Read (Erase Suspended Sector) In Progress Erase Suspended Mode Erase Suspend Read (Non-Erase Suspended Sector) Erase Suspend Program Byte Program in Auto Program Algorithm Exceeded Time Limits Auto Erase Algorithm Erase Suspend Program Data Q7# Q7# 0 Q7# Data Toggle Toggle Toggle Toggle Data Data Data 0 1 1 1 N/A N/A 1 N/A N/A No Toggle Toggle N/A 1 0 0 0 0 Q7 (Note1) Q7# 0 1 Q6 Toggle Toggle No Toggle Q5 Q3 (Note2) 0 0 0 N/A 1 Q2 No Toggle Toggle RY/ BY# 0 0 1 N/A Toggle Note: 1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits. See "Q5:Exceeded Timing Limits " for more information. P/N:PM1155 REV. 1.5, APR. 24, 2006 13 MX29LV400C T/B ERASE SUSPEND This command only has meaning while the state machine is executing Automatic Sector Erase operation, and therefore will only be responded during Automatic Sector Erase operation. When the Erase Suspend command is written during a sector erase operation, the device requires a maximum of 20us to suspend the erase operations. However, When the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After this command has been executed, the command register will initiate erase suspend mode. The state machine will return to read mode automatically after suspend is ready. At this time, state machine only allows the command register to respond to the Read Memory Array, Erase Resume and program commands. The system can determine the status of the program operation using the Q7 or Q6 status bits, just as in the standard program operation. After an erase-suspend program operation is complete, the system can once again read array data within non-suspended sectors. also begins the programming operation. The system is not required to provide further controls or timings. The device will automatically provide an adequate internally generated program pulse and verify margin. The device provides Q2, Q3, Q5, Q6, Q7, and RY/BY# to determine the status of a write operation. If the program operation was unsuccessful, the data on Q5 is "1"(see Table 7), indicating the program operation exceed internal timing limit. The automatic programming operation is completed when the data read on Q6 stops toggling for two consecutive read cycles and the data on Q7 and Q6 are equivalent to data written to these two bits, at which time the device returns to the Read mode (no program verify command is required). WORD/BYTE PROGRAM COMMAND SEQUENCE The device programs one byte of data for each program operation. The command sequence requires four bus cycles, and is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically generates the program pulses and verifies the programmed cell margin. Table 1 shows the address and data requirements for the byte program command sequence. When the Embedded Program algorithm is complete, the device then returns to reading array data and addresses are no longer latched. The system can determine the status of the program operation by using Q7, Q6, or RY/BY#. See "Write Operation Status" for information on these status bits. Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a hardware reset immediately terminates the programming operation. The Byte Program command sequence should be reinitiated once the device has reset to reading array data, to ensure data integrity. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from a "0" back to a "1". Attempting to do so may halt the operation and set Q5 to "1", or cause the Data# Polling algorithm to indicate the operation was successful. However, a succeeding read will show that the data is still "0". Only erase operations can convert a "0" to a "1". ERASE RESUME This command will cause the command register to clear the suspend state and return back to Sector Erase mode but only if an Erase Suspend command was previously issued. Erase Resume will not have any effect in all other conditions. Another Erase Suspend command can be written after the chip has resumed erasing. The minimum time from Erase Resume to next Erase Suspend is 400us. Repeatedly suspending the device more often may have undetermined effects. AUTOMATIC PROGRAM COMMANDS To initiate Automatic Program mode, A three-cycle command sequence is required. There are two "unlock" write cycles. These are followed by writing the Automatic Program command A0H. Once the Automatic Program command is initiated, the next WE# pulse causes a transition to an active programming operation. Addresses are latched on the falling edge, and data are internally latched on the rising edge of the WE# or CE#, whichever happens first. The rising edge of WE# or CE#, whichever happens first, P/N:PM1155 REV. 1.5, APR. 24, 2006 14 MX29LV400C T/B WRITE OPERATION STATUS The device provides several bits to determine the status of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/ BY#. Table 10 and the following subsections describe the functions of these bits. Q7, RY/BY#, and DQ6 each offer a method for determining whether a program or erase operation is complete or in progress. These three bits are discussed first. complement to true data, it can read valid data at Q7-Q0 on the following read cycles. This is because Q7 may change asynchronously with Q0-Q6 while Output Enable (OE#) is asserted low. RY/BY#:Ready/Busy The RY/BY# is a dedicated, open-drain output pin that indicates whether an Automatic Erase/Program algorithm is in progress or complete. The RY/BY# status is valid after the rising edge of the final WE# or CE#, whichever happens first, in the command sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to Vcc. If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is ready to read array data (including during the Erase Suspend mode), or is in the standby mode. Table 7 shows the outputs for RY/BY# during write operation. Q7: Data# Polling The Data# Polling bit, Q7, indicates to the host sys-tem whether an Automatic Algorithm is in progress or completed, or whether the device is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the program or erase command sequence. During the Automatic Program algorithm, the device outputs on Q7 the complement of the datum programmed to Q7. This Q7 status also applies to programming during Erase Suspend. When the Automatic Program algorithm is complete, the device outputs the datum programmed to Q7. The system must provide the program address to read valid status information on Q7. If a program address falls within a protected sector, Data# Polling on Q7 is active for approximately 1 us, then the device returns to reading array data. During the Automatic Erase algorithm, Data# Polling produces a "0" on Q7. When the Automatic Erase algorithm is complete, or if the device enters the Erase Suspend mode, Data# Polling produces a "1" on Q7. This is analogous to the complement/true datum output described for the Automatic Program algorithm: the erase function changes all the bits in a sector to "1" prior to this, the device outputs the "complement," or "0". The system must provide an address within any of the sectors selected for erasure to read valid status information on Q7. After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling on Q7 is active for approximately 100 us, then the device returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. When the system detects Q7 has changed from the Q6:Toggle BIT I Toggle Bit I on Q6 indicates whether an Automatic Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE# or CE#, whichever happens first, in the command sequence (prior to the program or erase operation), and during the sector timeout. During an Automatic Program or Erase algorithm operation, successive read cycles to any address cause Q6 to toggle. The system may use either OE# or CE# to control the read cycles. When the operation is complete, Q6 stops toggling. After an erase command sequence is written, if all sectors selected for erasing are protected, Q6 toggles and returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use Q6 and Q2 together to determine P/N:PM1155 REV. 1.5, APR. 24, 2006 15 MX29LV400C T/B whether a sector is actively erasing or is erase suspended. When the device is actively erasing (that is, the Automatic Erase algorithm is in progress), Q6 toggling. When the device enters the Erase Suspend mode, Q6 stops toggling. However, the system must also use Q2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use Q7. If a program address falls within a protected sector, Q6 toggles for approximately 2 us after the program command sequence is written, then returns to reading array data. Q6 also toggles during the erase-suspend-program mode, and stops toggling once the Automatic Program algorithm is complete. Table 7 shows the outputs for Toggle Bit I on Q6. pleted the program or erase operation. The system can read array data on Q7-Q0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of Q5 is high (see the section on Q5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as Q5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that system initially determines that the toggle bit is toggling and Q5 has not gone high. The system may continue to monitor the toggle bit and Q5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation. Q2:Toggle Bit II The "Toggle Bit II" on Q2, when used with Q6, indicates whether a particular sector is actively erasing (that is, the Automatic Erase alorithm is in process), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE# or CE#, whichever happens first, in the command sequence. Q2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE# or CE# to control the read cycles.) But Q2 cannot distinguish whether the sector is actively erasing or is erase-suspended. Q6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sectors and mode information. Refer to Table 7 to compare outputs for Q2 and Q6. Q5 Exceeded Timing Limits Q5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under these conditions Q5 will produce a "1". This time-out condition indicates that the program or erase cycle was not successfully completed. Data# Polling and Toggle Bit are the only operating functions of the device under this condition. If this time-out condition occurs during sector erase operation, it specifies that a particular sector is bad and it may not be reused. However, other sectors are still functional and may be used for the program or erase operation. The device must be reset to use other sectors. Write the Reset command sequence to the device, and then execute program or erase command sequence. This allows the system to continue to use the other active sectors in the device. If this time-out condition occurs during the chip erase operation, it specifies that the entire chip is bad or combination of sectors are bad. Reading Toggle Bits Q6/ Q2 Whenever the system initially begins reading toggle bit status, it must read Q7-Q0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has com- P/N:PM1155 REV. 1.5, APR. 24, 2006 16 MX29LV400C T/B If this time-out condition occurs during the byte programming operation, it specifies that the entire sector containing that byte is bad and this sector maynot be reused, (other sectors are still functional and can be reused). The time-out condition will not appear if a user tries to program a non blank location without erasing. Please note that this is not a device failure condition since the device was incorrectly used. LOW VCC WRITE INHIBIT When VCC is less than VLKO the device does not accept any write cycles. This protects data during VCC power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent unintentional write when VCC is greater than VLKO. WRITE PULSE "GLITCH" PROTECTION Q3 Sector Erase Timer After the completion of the initial sector erase command sequence, the sector erase time-out will begin. Q3 will remain low until the time-out is complete. Data# Polling and Toggle Bit are valid after the initial sector erase command sequence. If Data# Polling or the Toggle Bit indicates the device has been written with a valid erase command, Q3 may be used to determine if the sector erase timer window is still open. If Q3 is high ("1") the internally controlled erase cycle has begun; attempts to write subsequent commands to the device will be ignored until the erase operation is completed as indicated by Data# Polling or Toggle Bit. If Q3 is low ("0"), the device will accept additional sector erase commands. To insure the command has been accepted, the system software should check the status of Q3 prior to and following each subsequent sector erase command. If Q3 were high on the second status check, the command may not have been accepted. Noise pulses of less than 5ns(typical) on CE# or WE# will not initiate a write cycle. LOGICAL INHIBIT Writing is inhibited by holding any one of OE# = VIL, CE# = VIH or WE# = VIH. To initiate a write cycle CE# and WE# must be a logical zero while OE# is a logical one. POWER SUPPLY DECOUPLING In order to reduce power switching effect, each device should have a 0.1uF ceramic capacitor connected between its VCC and GND. POWER-UP SEQUENCE The MX29LV400C T/B powers up in the Read only mode. In addition, the memory contents may only be altered after successful completion of the predefined command sequences. DATA PROTECTION The MX29LV400C T/B is designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transition. During power up the device automatically resets the state machine in the Read mode. In addition, with its control register architecture, alteration of the memory contents only occurs after successful completion of specific command sequences. The device also incorporates several features to prevent inadvertent write cycles resulting from VCC power-up and power-down transition or system noise. TEMPORARY SECTOR UNPROTECT This feature allows temporary unprotection of previously protected sector to change data in-system. The Temporary Sector Unprotect mode is activated by setting the RESET# pin to VID(11.5V-12.5V). During this mode, formerly protected sectors can be programmed or erased as un-protected sector. Once VID is remove from the RESET# pin, all the previously protected sectors are protected again. P/N:PM1155 REV. 1.5, APR. 24, 2006 17 MX29LV400C T/B SECTOR PROTECTION The MX29LV400C T/B features hardware sector protection. This feature will disable both program and erase operations for these sectors protected. To activate this mode, the programming equipment must force VID on address pin A9 and OE# (suggest VID = 12V). Programming of the protection circuitry begins on the falling edge of the WE# pulse and is terminated on the rising edge. Please refer to sector protect algorithm and waveform. To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9 ( with CE# and OE# at VIL and WE# at VIH). When A1=VIH, A0=VIL, A6=VIL, it will produce a logical "1" code at device output Q0 for a protected sector. Otherwise the device will produce 00H for the unprotected sector. In this mode, the addresses, except for A1, are don't care. Address locations with A1 = VIL are reserved to read manufacturer and device codes. (Read Silicon ID) It is also possible to determine if the sector is protected in the system by writing a Read Silicon ID command. Performing a read operation with A1=VIH, it will produce a logical "1" at Q0 for the protected sector. CHIP UNPROTECT The MX29LV400C T/B also features the chip unprotect mode, so that all sectors are unprotected after chip unprotect is completed to incorporate any changes in the code. It is recommended to protect all sectors before activating chip unprotect mode. To activate this mode, the programming equipment must force VID on control pin OE# and address pin A9. The CE# pins must be set at VIL. Pins A6 must be set to VIH.(see Table 2) Refer to chip unprotect algorithm and waveform for the chip unprotect algorithm. The unprotection mechanism begins on the falling edge of the WE# pulse and is terminated on the rising edge. It is also possible to determine if the chip is unprotected in the system by writing the Read Silicon ID command. Performing a read operation with A1=VIH, it will produce 00H at data outputs(Q0-Q7) for an unprotected sector. It is noted that all sectors are unprotected after the chip unprotect algorithm is completed. P/N:PM1155 REV. 1.5, APR. 24, 2006 18 MX29LV400C T/B ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages . . . . . . . . . . . . . ..... -65oC to +150oC Ambient Temperature with Power Applied. . . . . . . . . . . . . .... -65oC to +125oC Voltage with Respect to Ground VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V A9, OE#, and RESET# (Note 2) . . . . . . . . . . . ....-0.5 V to +12.5 V All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V Output Short Circuit Current (Note 3) . . . . . . 200 mA Notes: 1. Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to -2.0 V for periods of up to 20 ns. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. 2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#, and RESET# may overshoot VSS to -2.0 V for periods of up to 20 ns. Maximum DC input voltage on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns. 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. OPERATING RATINGS Commercial (C) Devices Ambient Temperature (TA ). . . . . . . . . . . . 0°C to +70°C Industrial (I) Devices Ambient Temperature (TA ). . . . . . . . . . -40°C to +85°C VCC Supply Voltages VCC for regulated voltage range. . . . . . +3.0 V to 3.6 V VCC for full voltage range. . . . . . . . . . . +2.7 V to 3.6 V Operating ranges define those limits between which the functionality of the device is guaranteed. P/N:PM1155 REV. 1.5, APR. 24, 2006 19 MX29LV400C T/B Table 8. CAPACITANCE TA = 25oC, f = 1.0 MHz SYMBOL CIN1 CIN2 COUT PARAMETER Input Capacitance Control Pin Capacitance Output Capacitance MIN. TYP MAX. 8 12 12 UNIT pF pF pF CONDITIONS VIN = 0V VIN = 0V VOUT = 0V Table 9. DC CHARACTERISTICS TA = -40oC to 85oC, VCC = 2.7V to 3.6V Symbol ILI ILIT ILO ICC1 PARAMETER Input Leakage Current A9 Input Leakage Current Output Leakage Current VCC Active Read Current 7 2 7 2 ICC2 ICC3 ICC4 VCC Active write Currect VCC Standby Currect VCC Standby Currect During Reset ICC5 VIL VIH Automatic sleep mode Input Low Voltage(Note 1) Input High Voltage -0.5 0.7xVCC (Note 4) VID Voltage for Automative Select and Temporary Chip Unprotect VOL VOH1 VOH2 Output Low Voltage Output High Voltage(TTL) Output High Voltage (CMOS) VLKO Low VCC Lock-Out Voltage (Note 5) NOTES: 1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns. VIL min. = -2.0V for pulse width is equal to or less than 20 ns. 2. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns If VIH is over the specified maximum value, read operation cannot be guaranteed. 3. Automatic sleep mode enable the low power mode when addresses remain stable for tACC +30ns. 4. VIH min.=0.7xVCC. The VIH min. voltage is less than 2.4V. 5. Not 100% tested. P/N:PM1155 REV. 1.5, APR. 24, 2006 MIN. TYP MAX. ±1 35 ±1 12 4 12 4 30 5 5 UNIT uA uA uA mA mA mA mA mA uA uA CONDITIONS VIN = VSS to VCC VCC=VCC max; A9=12.5V VOUT= VSS to VCC, VCC=VCC max CE#=VIL, OE#=VIH @5MHz (Byte Mode) @1MHz CE#=VIL, OE#=VIH @5MHz (Word Mode) CE#=VIL, OE#=VIH CE#; RESET#=VCC ± 0.3V RESET#=VSS ± 0.3V VIH=VCC ± 0.3V;VIL=VSS ± 0.3V @1MHz 15 0.2 0.2 0.2 5 0.8 VCC+ 0.3 uA V V 11.5 12.5 V VCC=3.3V 0.45 0.85xVCC VCC-0.4 V IOL = 4.0mA, VCC= VCC min IOH = -2mA, VCC=VCC min IOH = -100uA, VCC min 1.4 2.1 V 20 MX29LV400C T/B AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 2.7V~3.6V Table 10. READ OPERATIONS 29LV400C-55R 29LV400C-70 SYMBOL PARAMETER tRC tACC tCE tOE tDF tOEH Read Cycle Time (Note 1) Address to Output Delay CE# to Output Delay OE# to Output Delay OE# High to Output Float (Note1) Output Enable Read Hold Time Toggle and Data# Polling tOH Address to Output hold 0 0 0 ns CE#=OE#=VIL 0 0 10 MIN. 55 55 55 30 25 0 0 10 MAX. MIN. 70 70 70 30 25 0 0 10 MAX. 29LV400C-90 MIN. 90 90 90 35 30 MAX. UNIT ns ns ns ns ns ns ns CE#=OE#=VIL OE#=VIL CE#=VIL CE#=VIL CONDITIONS TEST CONDITIONS: • Input pulse levels: 0V/3.0V. • Input rise and fall times is equal to or less than 5ns. • Output load: 1 TTL gate + 100pF (Including scope and jig), for 29LV400CT/B-90. 1 TTL gate + 30pF (Including scope and jig) for 29LV400CT/B-70 and 29LV400C T/ B-55R. • Reference levels for measuring timing: 1.5V. Notes : 1. Not 100% tested. 2. tDF is defined as the time at which the output achieves the open circuit condition and data is no longer driven. P/N:PM1155 REV. 1.5, APR. 24, 2006 21 MX29LV400C T/B Figure 1. SWITCHING TEST CIRCUITS DEVICE UNDER TEST 2.7K ohm +3.3V CL 6.2K ohm DIODES=IN3064 OR EQUIVALENT CL=100pF for MX29LV400C T/B-90 CL=30pF for MX29LV400C T/B-70 and MX29LV400C T/B-55R Figure 2. SWITCHING TEST WAVEFORMS 3.0V 1.5V TEST POINTS 1.5V 0V INPUT OUTPUT AC TESTING: Inputs are driven at 3.0V for a logic "1" and 0V for a logic "0". Input pulse rise and fall times are < 5ns. P/N:PM1155 REV. 1.5, APR. 24, 2006 22 MX29LV400C T/B Figure 3. READ TIMING WAVEFORMS tRC VIH Addresses VIL ADD Valid tACC tCE CE# VIH VIL WE# VIH VIL tOEH VIH tOE tDF OE# VIL tACC tOH Outputs VOH VOL HIGH Z DATA Valid HIGH Z VIH RESET# VIL P/N:PM1155 REV. 1.5, APR. 24, 2006 23 MX29LV400C T/B AC CHARACTERISTICSTA = -40oC to 85oC, VCC = 2.7V~3.6V Table 11. Erase/Program Operations 29LV400C-55R SYMBOL PARAMETER tWC tAS tAH tDS tDH tOES tGHWL tCS tCH tWP tWPH Write Cycle Time (Note 1) Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Write (OE# High to WE# Low) CE# Setup Time CE# Hold Time Write Pulse Width Write Pulse Width High (Byte/Word program time) tWHWH2 Sector Erase Operation (Note 2) tVCS tRB tBUSY tWPP1 tWPP2 tBAL NOTES: 29LV400C-70 MIN. 70 0 45 35 0 0 0 0 0 35 30 9/11 (Typ.) 0.7 (Typ.) 50 0 MAX. 29LV400C-90 MIN. 90 0 45 45 0 0 0 0 0 35 30 9/11 (Typ.) 0.7 (Typ.) 50 0 us ns 90 100ns 100ns 10us (Typ.) 12ms (Typ.) 50 us ns sec MAX. UNIT ns ns ns ns ns ns ns ns ns ns ns us MIN. 55 0 45 35 0 0 0 0 0 35 30 9/11 (Typ.) 0.7 (Typ.) 50 0 MAX. tWHWH1 Programming Operation (Note 2) VCC Setup Time (Note 1) Recovery Time from RY/BY# Program/Erase Vaild to RY/BY# Delay Write Pulse Width for Sector Protect (A9, OE# Control) Write Pulse Width for Sector Unprotect (A9, OE# Control) Sector Address Load Time 90 100ns 100ns 10us (Typ.) 12ms (Typ.) 50 100ns 100ns 90 10us (Typ.) 12ms (Typ.) 50 1. Not 100% tested. 2. See the "Erase and Programming Performance" section for more information. P/N:PM1155 REV. 1.5, APR. 24, 2006 24 MX29LV400C T/B AC CHARACTERISTICSTA = -40oC to 85oC, VCC = 2.7V~3.6V Table 12. Alternate CE# Controlled Erase/Program Operations 29LV400C-55R SYMBOL PARAMETER tWC tCWC tAS tAH tDS tDH tOES tGHEL tWS tWH tCP tCPH Write Cycle Time (Note 1) Command Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Write WE# Setup Time WE# Hold Time CE# Pulse Width CE# Pulse Width High Byte Word Operation(note2) tVLHT tOESP NOTE: 29LV400C-70 MIN. 70 70 0 45 35 0 0 0 0 0 35 30 9(Typ.) 11(Typ.) 0.7(Typ.) 4 4 MAX. 29LV400C-90 MIN. 90 90 0 45 45 0 0 0 0 0 35 30 9(Typ.) 11(Typ.) 0.7(Typ.) 4 4 MAX. UNIT ns ns ns ns ns ns ns ns ns ns ns ns us us sec us us MIN. 55 55 0 45 35 0 0 0 0 0 35 30 9(Typ.) 11(Typ.) 0.7(Typ.) 4 4 MAX. tWHWH1 Programming tWHWH2 Sector Erase Operation (note2) Voltage Transition Time OE# Setup Time to WE# Active 1. Not 100% tested. 2. See the "Erase and Programming Performance" section for more information. P/N:PM1155 REV. 1.5, APR. 24, 2006 25 MX29LV400C T/B Figure 4. COMMAND WRITE TIMING WAVEFORM VCC 3V Addresses VIH ADD Valid VIL tAS tAH WE# VIH VIL tOES tWPH tCWC tWP CE# VIH VIL tCS tCH OE# VIH VIL VIH tDS tDH Data VIL DIN P/N:PM1155 REV. 1.5, APR. 24, 2006 26 MX29LV400C T/B AUTOMATIC PROGRAMMING TIMING WAVEFORM One byte data is programmed. Verify in fast algorithm and additional verification by external control are not required because these operations are executed automatically by internal control circuit. Programming completion can be verified by Data# Polling and toggle bit checking after automatic programming starts. Device outputs DATA# during programming and DATA# after programming on Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling, timing waveform) Figure 5. AUTOMATIC PROGRAMMING TIMING WAVEFORM Program Command Sequence(last two cycle) tWC tAS Read Status Data (last two cycle) Address 555h PA tAH PA PA CE# tCH tGHWL OE# tWP tWHWH1 WE# tCS tDS tDH tWPH A0h Data PD Status DOUT tBUSY tRB RY/BY# tVCS VCC NOTES: 1.PA=Program Address, PD=Program Data, DOUT is the true data the program address P/N:PM1155 REV. 1.5, APR. 24, 2006 27 MX29LV400C T/B Figure 6. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data A0H Address 555H Write Program Data/Address Increment Address Data Poll from system No Verify Word Ok ? YES No Last Address ? YES Auto Program Completed P/N:PM1155 REV. 1.5, APR. 24, 2006 28 MX29LV400C T/B Figure 7. CE# CONTROLLED PROGRAM TIMING WAVEFORM 555 for program 2AA for erase PA for program SA for sector erase 555 for chip erase Data# Polling Address tWC tWH tAS tAH PA WE# tGHEL OE# tCP tWHWH1 or 2 CE# tWS tDS tDH tCPH tBUSY Q7 DOUT Data tRH A0 for program 55 for erase PD for program 30 for sector erase 10 for chip erase RESET# RY/BY# NOTES: 1.PA=Program Address, PD=Program Data, DOUT=Data Out, Q7=complement of data written to device. 2.Figure indicates the last two bus cycles of the command sequence. P/N:PM1155 REV. 1.5, APR. 24, 2006 29 MX29LV400C T/B AUTOMATIC CHIP ERASE TIMING WAVEFORM All data in chip are erased. External erase verification is not required because data is verified automatically by internal control circuit. Erasure completion can be verified by Data# Polling and toggle bit checking after autoFigure 8. AUTOMATIC CHIP ERASE TIMING WAVEFORM matic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling, timing waveform) Erase Command Sequence(last two cycle) tWC tAS Read Status Data Address 2AAh 555h tAH VA VA CE# tCH tGHWL OE# tWP tWHWH2 WE# tCS tDS tDH tWPH 55h Data 10h In Progress Complete tBUSY tRB RY/BY# tVCS VCC NOTES: SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status"). P/N:PM1155 REV. 1.5, APR. 24, 2006 30 MX29LV400C T/B Figure 9. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 80H Address 555H Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 10H Address 555H Data Pall from System NO Data=FFh ? YES Auto Chip Erase Completed P/N:PM1155 REV. 1.5, APR. 24, 2006 31 MX29LV400C T/B AUTOMATIC SECTOR ERASE TIMING WAVEFORM Sector indicated by A12 to A17 are erased. External erase verify is not required because data are verified automatically by internal control circuit. Erasure completion can be verified by Data# Polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling, timing waveform) Figure 10. AUTOMATIC SECTOR ERASE TIMING WAVEFORM Erase Command Sequence(last two cycle) tWC tAS Read Status Data Address 2AAh Sector Address 0 tAH Sector Address 1 Sector Address n VA VA CE# tCH tGHWL OE# tBAL tWHWH2 tWP WE# tCS tDS tDH tWPH 55h Data 30h 30h 30h In Progress Complete tBUSY tRB RY/BY# tVCS VCC NOTES: SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status"). P/N:PM1155 REV. 1.5, APR. 24, 2006 32 MX29LV400C T/B Figure 11. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 80H Address 555H Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 30H Sector Address Last Sector to Erase YES Data Poll from System NO Data=FFh NO YES Auto Sector Erase Completed P/N:PM1155 REV. 1.5, APR. 24, 2006 33 MX29LV400C T/B Figure 12. ERASE SUSPEND/ERASE RESUME FLOWCHART START Write Data B0H ERASE SUSPEND Toggle Bit checking Q6 not toggled YES Read Array or Program NO Reading or Programming End YES Write Data 30H NO Delay at least 400us (note) ERASE RESUME Continue Erase Another Erase Suspend ? YES NO Note: Repeatedly suspending the device more often may have undetermined effects. P/N:PM1155 REV. 1.5, APR. 24, 2006 34 MX29LV400C T/B Figure 13. IN-SYSTEM SECTOR PROTECT/UNPROTECT TIMING WAVEFORM (RESET# Control) VID VIH RESET# SA, A6 A1, A0 Valid* Valid* Valid* Sector Protect or Sector Unprotect Data 1us Verify 40h Status 60h 60h Sector Protect =150us Sector Unprotect =15ms CE# WE# OE# Note: When sector protect, A6=0, A1=1, A0=0. When sector unprotect, A6=1, A1=1, A0=0. P/N:PM1155 REV. 1.5, APR. 24, 2006 35 MX29LV400C T/B Figure 14. SECTOR PROTECT TIMING WAVEFORM (A9, OE# Control) A1 A6 12V 3V A9 tVLHT Verify 12V 3V OE# tVLHT tWPP 1 tVLHT WE# tOESP CE# Data tOE 01H F0H A18-A12 Sector Address P/N:PM1155 REV. 1.5, APR. 24, 2006 36 MX29LV400C T/B Figure 15. SECTOR PROTECTION ALGORITHM (A9, OE# Control) START Set Up Sector Addr PLSCNT=1 OE#=VID, A9=VID, CE#=VIL A6=VIL Activate WE# Pulse Time Out 150us Set WE#=VIH, CE#=OE#=VIL A9 should remain VID No Read from Sector Addr=SA, A1=1 PLSCNT=32? No Data=01H? Yes Device Failed Yes Protect Another Sector? No Remove VID from A9 Write Reset Command Yes Sector Protection Complete P/N:PM1155 REV. 1.5, APR. 24, 2006 37 MX29LV400C T/B Figure 16. IN-SYSTEM SECTOR PROTECTION ALGORITHM WITH RESET#=VID START PLSCNT=1 RESET#=VID Wait 1us First Write Cycle=60H Yes Set up sector address No Temporary Sector Unprotect Mode Write 60H to sector address with A6=0, A1=1, A0=0 Wait 150us Increment PLSCNT Verify sector protect : write 40H with A6=0, A1=1, A0=0 Reset PLSCNT=1 Read from sector address No No Data=01H ? PLSCNT=25? Yes Device failed Yes Protect another sector? No Remove VID from RESET# Yes Write reset command Sector protect complete P/N:PM1155 REV. 1.5, APR. 24, 2006 38 MX29LV400C T/B Figure 17. IN-SYSTEM SECTOR UNPROTECTION ALGORITHM WITH RESET#=VID START PLSCNT=1 RESET#=VID Wait 1us First Write Cycle=60H ? Yes No Temporary Sector Unprotect Mode All sector protected? Yes Set up first sector address No Protect all sectors Chip unprotect : write 60H with A6=1, A1=1, A0=0 Wait 50ms Increment PLSCNT Verify chip unprotect write 40H to sector address with A6=1, A1=1, A0=0 Read from sector address with A6=1, A1=1, A0=0 No No Data=00H ? PLSCNT=1000? Set up next sector address Yes Device failed Yes Last sector verified? No Remove VID from RESET# Yes Write reset command Chip unprotect complete P/N:PM1155 REV. 1.5, APR. 24, 2006 39 MX29LV400C T/B Figure 18. TIMING WAVEFORM FOR CHIP UNPROTECTION (A9, OE# Control) A1 12V 3V A9 tVLHT A6 Verify 12V 3V OE# tVLHT tWPP 2 time out 50ms tVLHT WE# tOESP CE# Data tOE 00H F0H A18-A12 Sector Address Notes: tWPP1 (Write pulse width for sector protect)=100ns min, 10us(Typ.) tWPP2 (Write pulse width for sector unprotect)=100ns min, 12ms(Typ.) P/N:PM1155 REV. 1.5, APR. 24, 2006 40 MX29LV400C T/B Figure 19. CHIP UNPROTECTION ALGORITHM (A9, OE# Control) START Protect All Sectors PLSCNT=1 Set OE#=A9=VID CE#=VIL, A6=1 Activate WE# Pulse Time Out 50ms Increment PLSCNT Set OE#=CE#=VIL A9=VID,A1=1 Set Up First Sector Addr Read Data from Device No Increment Sector Addr Data=00H? No PLSCNT=1000? Yes No Yes Device Failed All sectors have been verified? Yes Remove VID from A9 Write Reset Command Chip Unprotect Complete * It is recommended before unprotect whole chip, all sectors should be protected in advance. P/N:PM1155 REV. 1.5, APR. 24, 2006 41 MX29LV400C T/B WRITE OPERATION STATUS Figure 20. DATA# POLLING ALGORITHM Start Read Q7~Q0 Add.=VA(1) Q7 = Data ? Yes No No Q5 = 1 ? Yes Read Q7~Q0 Add.=VA Q7 = Data ? (2) No FAIL Yes Pass NOTE : 1.VA=Valid address for programming 2.Q7 should be re-checked even Q5="1" because Q7 may change simultaneously with Q5. P/N:PM1155 REV. 1.5, APR. 24, 2006 42 MX29LV400C T/B Figure 21. TOGGLE BIT ALGORITHM Start Read Q7-Q0 Read Q7-Q0 (Note 1) T oggle Bit Q6 = T oggle ? NO YES NO Q5= 1? YES Read Q7~Q0 T wice (Note 1,2) T oggle bit Q6= T oggle? NO YES Program/Erase Operation Not Complete,Write Reset Command Program/Erase operation Complete Note:1.Read toggle bit twice to determine whether or not it is toggling. 2. Recheck toggle bit because it may stop toggling as Q5 change to "1". P/N:PM1155 REV. 1.5, APR. 24, 2006 43 MX29LV400C T/B Figure 22. DATA# POLLING TIMINGS (DURING AUTOMATIC ALGORITHMS) tRC Address VA tACC tCE VA VA CE# tCH tOE OE# tOEH tDF WE# tOH Q7 Q0-Q6 tBUSY Complement Complement True Valid Data High Z Status Data Status Data True Valid Data High Z RY/BY# NOTES: 1. VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle. P/N:PM1155 REV. 1.5, APR. 24, 2006 44 MX29LV400C T/B Figure 23. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS) tRC Address VA tACC tCE VA VA VA CE# tCH tOE OE# tOEH tDF WE# tOH Q6/Q2 High Z Valid Status (first read) Valid Status (second read) Valid Data (stops toggling) Valid Data tBUSY RY/BY# NOTES: 1. VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle, and array data read cycle. P/N:PM1155 REV. 1.5, APR. 24, 2006 45 MX29LV400C T/B Table 13. AC CHARACTERISTICS Parameter Std tREADY1 Description RESET# PIN Low (During Automatic Algorithms) to Read or Write (See Note) tREADY2 RESET# PIN Low (NOT During Automatic Algorithms) to Read or Write (See Note) tRP tRH tRB RESET# Pulse Width (During Automatic Algorithms) RESET# High Time Before Read(See Note) RY/BY# Recovery Time(to CE#, OE# go low) MIN MIN MIN 500 50 0 ns ns ns MAX 500 ns Test Setup All Speed Options Unit MAX 20 us Note:Not 100% tested Figure 24. RESET# TIMING WAVEFORM RY/BY# CE#, OE# tRH RESET# tRP tREADY2 Reset Timing NOT during Automatic Algorithms tREADY1 RY/BY# tRB CE#, OE# RESET# tRP Reset Timing during Automatic Algorithms P/N:PM1155 REV. 1.5, APR. 24, 2006 46 MX29LV400C T/B AC CHARACTERISTICS WORD/BYTE CONFIGURATION (BYTE#) Parameter JEDEC Std tELFL/tELFH tFLQZ tFHQV CE# to BYTE# Switching Low or High BYTE# Switching Low to Output HIGH Z BYTE# Switching High to Output Active Max Max Min 25 55 Description Speed Options -55R -70 5 25 70 30 90 -90 ns ns ns Unit Figure 25. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte mode to word mode) CE# OE# tELFH BYTE# Q0~Q14 DOUT (Q0-Q7) DOUT (Q0-Q14) Q15/A-1 VA tFHQV DOUT (Q15) P/N:PM1155 REV. 1.5, APR. 24, 2006 47 MX29LV400C T/B Figure 26. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from word mode to byte mode) CE# OE# tELFH BYTE# Q0~Q14 DOUT (Q0-Q14) DOUT (Q0-Q7) Q15/A-1 DOUT (Q15) tFLQZ VA Figure 27. BYTE# TIMING WAVEFORM FOR PROGRAM OPERATIONS CE# The falling edge of the last WE# signal WE# BYTE# tAS tAH P/N:PM1155 REV. 1.5, APR. 24, 2006 48 MX29LV400C T/B Table 14. TEMPORARY SECTOR UNPROTECT Parameter Std. Description tVIDR tRSP Note: Not 100% tested VID Rise and Fall Time (See Note) RESET# Setup Time for Temporary Sector Unprotect Test Setup All Speed Options Unit Min Min 500 4 ns us Figure 28. TEMPORARY SECTOR UNPROTECT TIMING DIAGRAM 12V RESET# 0 or Vcc Program or Erase Command Sequence 0 or Vcc tVIDR tVIDR CE# WE# tRSP RY/BY# Figure 29. Q6 vs Q2 for Erase and Erase Suspend Operations Enter Embedded Erasing Erase Suspend Erase Enter Erase Suspend Program Erase Suspend Program Erase Suspend Read Erase Resume Erase Erase Complete WE# Q6 Q2 NOTES: The system can use OE# or CE# to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended P/N:PM1155 REV. 1.5, APR. 24, 2006 49 MX29LV400C T/B Figure 30. TEMPORARY SECTOR UNPROTECT ALGORITHM Start RESET# = VID (Note 1) Perform Erase or Program Operation Operation Completed RESET# = VIH Temporary Sector Unprotect Completed(Note 2) Note : 1. All protected sectors are temporary unprotected. VID=11.5V~12.5V 2. All previously protected sectors are protected again. P/N:PM1155 REV. 1.5, APR. 24, 2006 50 MX29LV400C T/B Figure 31. ID CODE READ TIMING WAVEFORM VCC 3V VID VIH VIL VIH VIL tACC VIH tACC ADD A9 ADD A0 A1 VIL ADD A2-A8 A10-A17 CE# VIH VIL VIH VIL WE# VIH VIL tCE OE# VIH VIL tOE tDF tOH tOH VIH DATA Q0-Q15 DATA OUT VIL DATA OUT B9H/BAH (Byte) 22B9H/22BAH (Word) C2H/00C2H P/N:PM1155 REV. 1.5, APR. 24, 2006 51 MX29LV400C T/B RECOMMENDED OPERATING CONDITIONS At Device Power-Up AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at device power-up. If the timing in the figure is ignored, the device may not operate correctly. VCC(min) VCC GND tVR tR or tF tACC tR or tF VIH ADDRESS VIL Valid Address tF tCE tR VIH CE# VIL VIH WE# VIL tF VIH tOE tR OE# VIL VIH WP#/ACC VIL VOH DATA High Z VOL Valid Ouput Figure A. AC Timing at Device Power-Up Symbol tVR tR tF Parameter VCC Rise Time Input Signal Rise Time Input Signal Fall Time Notes 1 1,2 1,2 Min. 20 Max. 500000 20 20 Unit us/V us/V us/V Notes : 1. Sampled, not 100% tested. 2. This specification is applied for not only the device power-up but also the normal operations. P/N:PM1155 REV. 1.5, APR. 24, 2006 52 MX29LV400C T/B ERASE AND PROGRAMMING PERFORMANCE (1) PARAMETER Sector Erase Time Chip Erase Time Byte Programming Time Word Programming Time Chip Programming Time Byte Mode Word Mode Erase/Program Cycles 100,000 MIN. LIMITS TYP.(2) 0.7 4 9 11 4.5 3 MAX.(3) 15 32 300 360 13.5 9 UNITS sec sec us us sec sec Cycles Note: 1.Not 100% Tested, Excludes external system level over head. 2.Typical values measured at 25°C, 3V. 3.Maximum values measured at 25°C, 2.7V. LATCH-UP CHARACTERISTICS MIN. Input Voltage with respect to GND on all pins except I/O pins Input Voltage with respect to GND on all I/O pins Current Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at a time. -1.0V -1.0V -100mA MAX. 12.5V VCC + 1.0V +100mA DATA RETENTION Parameter Description Test Conditions 150°C Data Retention Time 125°C Min 10 20 Unit Years Years P/N:PM1155 REV. 1.5, APR. 24, 2006 53 MX29LV400C T/B QUERY COMMAND AND COMMON FLASH INTERFACE (CFI) MODE MX29LV400C T/B is capable of operating in the CFI mode. This mode all the host system to determine the manufacturer of the device such as operating parameters and configuration. Two commands are required in CFI mode. Query command of CFI mode is placed first, then the Reset command exits CFI mode. These are described in Table 18. The single cycle Query command is valid only when the device is in the Read mode, including Erase Suspend, Standby mode, and Read ID mode; however, it is ignored otherwise. The Reset command exits from the CFI mode to the Read mode, or Erase Suspend mode, or read ID mode. The command is valid only when the device is in the CFI mode. TABLE 18-1. CFI mode: Identification Data Values (All values in these tables are in hexadecimal) Description Address (Byte Mode) Query-unique ASCII string "QRY" 20 22 24 Primary vendor command set and control interface ID code 26 28 Address for primary algorithm extended query table 2A 2C Alternate vendor command set and control interface ID code (none) 2E 30 Address for secondary algorithm extended query table (none) 32 34 Address (Word Mode) 10 11 12 13 14 15 16 17 18 19 1A Data 0051 0052 0059 0002 0000 0040 0000 0000 0000 0000 0000 TABLE 18-2. CFI Mode: System Interface Data Values (All values in these tables are in hexadecimal) Description VCC supply, minimum (2.7V) VCC supply, maximum (3.6V) VPP supply, minimum (none) VPP supply, maximum (none) Typical timeout for single word/byte write (2N us) Typical timeout for Minimum size buffer write (2N us) Typical timeout for individual block erase (2N ms) Typical timeout for full chip erase (2N ms) Maximum timeout for single word/byte write times (2N X Typ) Maximum timeout for buffer write times (2N X Typ) Maximum timeout for individual block erase times (2N X Typ) Maximum timeout for full chip erase times (not supported) P/N:PM1155 Address (Byte Mode) 36 38 3A 3C 3E 40 42 44 46 48 4A 4C Address (Word Mode) 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 Data 0027 0036 0000 0000 0004 0000 000A 0000 0005 0000 0004 0000 REV. 1.5, APR. 24, 2006 54 MX29LV400C T/B TABLE 18-3. CFI Mode: Device Geometry Data Values (All values in these tables are in hexadecimal) Description Device size (2N bytes) Flash device interface code (refer to the CFI publication 100) Maximum number of bytes in multi-byte write (not supported) Number of erase block regions Erase block region 1 information (refer to the CFI publication 100) Address (Byte Mode) 4E 50 52 54 56 58 5A 5C 5E 60 62 64 66 68 6A 6C 6E 70 72 74 76 78 Address (Word Mode) 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C Data 0013 0002 0000 0000 0000 0004 0000 0000 0040 0000 0001 0000 0020 0000 0000 0000 0080 0000 0006 0000 0000 0001 Erase block region 2 information Erase block region 3 information Erase block region 4 information TABLE 18-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values (All values in these tables are in hexadecimal) Description Query-unique ASCII string "PRI" Address (Byte Mode) 80 82 84 86 88 8A 8C 8E 90 92 94 96 98 Address (Word Mode) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C Data 0050 0052 0049 0031 0030 0000 0002 0001 0001 0004 0000 0000 0000 REV. 1.5, APR. 24, 2006 Major version number, ASCII Minor version number, ASCII Address sensitive unlock (0=required, 1= not required) Erase suspend (2= to read and write) Sector protect (N= # of sectors/group) Temporary sector unprotected (1=supported) Sector protect/unprotected scheme Simultaneous R/W operation (0=not supported) Burst mode type (0=not supported) Page mode type (0=not supported) P/N:PM1155 55 MX29LV400C T/B ORDERING INFORMATION PART NO. MX29LV400CTMC-55R MX29LV400CBMC-55R MX29LV400CTMC-70 MX29LV400CBMC-70 MX29LV400CTMC-90 MX29LV400CBMC-90 MX29LV400CTTC-55R MX29LV400CBTC-55R MX29LV400CTTC-70 MX29LV400CBTC-70 MX29LV400CTTC-90 MX29LV400CBTC-90 MX29LV400CTXBC-55R MX29LV400CBXBC-55R MX29LV400CTXBC-70 MX29LV400CBXBC-70 MX29LV400CTXBC-90 MX29LV400CBXBC-90 MX29LV400CTXEC-55R MX29LV400CBXEC-55R MX29LV400CTXEC-70 MX29LV400CBXEC-70 ACCESS TIME (ns) 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 OPERATING CURRENT STANDBY CURRENT MAX.(mA) MAX.(uA) 30 5 30 5 30 5 30 5 30 5 30 5 30 5 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) REV. 1.5, APR. 24, 2006 P/N:PM1155 56 MX29LV400C T/B PART NO. MX29LV400CTXEC-90 MX29LV400CBXEC-90 MX29LV400CTMI-55R MX29LV400CBMI-55R MX29LV400CTMI-70 MX29LV400CBMI-70 MX29LV400CTMI-90 MX29LV400CBMI-90 MX29LV400CTTI-55R MX29LV400CBTI-55R MX29LV400CTTI-70 MX29LV400CBTI-70 MX29LV400CTTI-90 MX29LV400CBTI-90 MX29LV400CTXBI-55R MX29LV400CBXBI-55R MX29LV400CTXBI-70 MX29LV400CBXBI-70 MX29LV400CTXBI-90 MX29LV400CBXBI-90 MX29LV400CTXEI-55R MX29LV400CBXEI-55R ACCESS TIME (ns) 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 OPERATING CURRENT STANDBY CURRENT PACKAGE MAX.(mA) MAX.(uA) 30 5 48 Ball CSP (ball size=0.4mm) 30 5 48 Ball CSP (ball size=0.4mm) 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 48 Pin TSOP (Normal Type) 30 5 48 Pin TSOP (Normal Type) 30 5 48 Pin TSOP (Normal Type) 30 5 48 Pin TSOP (Normal Type) 30 5 48 Pin TSOP (Normal Type) 30 5 48 Pin TSOP (Normal Type) 30 5 48 Ball CSP (ball size=0.3mm) 30 5 48 Ball CSP (ball size=0.3mm) 30 30 30 30 30 30 5 5 5 5 5 5 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) P/N:PM1155 REV. 1.5, APR. 24, 2006 57 MX29LV400C T/B PART NO. MX29LV400CTXEI-70 MX29LV400CBXEI-70 MX29LV400CTXEI-90 MX29LV400CBXEI-90 MX29LV400CTMC-55Q MX29LV400CBMC-55Q MX29LV400CTMC-70G MX29LV400CBMC-70G MX29LV400CTMC-90G MX29LV400CBMC-90G MX29LV400CTTC-55Q MX29LV400CBTC-55Q MX29LV400CTTC-70G MX29LV400CBTC-70G MX29LV400CTTC-90G MX29LV400CBTC-90G MX29LV400CTXBC-55Q MX29LV400CBXBC-55Q MX29LV400CTXBC-70G MX29LV400CBXBC-70G MX29LV400CTXBC-90G MX29LV400CBXBC-90G ACCESS TIME (ns) 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) Remark PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free P/N:PM1155 REV. 1.5, APR. 24, 2006 58 MX29LV400C T/B PART NO. ACCESS TIME (ns) MX29LV400CTXEC-55Q 55 MX29LV400CBXEC-55Q MX29LV400CTXEC-70G MX29LV400CBXEC-70G MX29LV400CTXEC-90G MX29LV400CBXEC-90G MX29LV400CTMI-55Q MX29LV400CBMI-55Q MX29LV400CTMI-70G MX29LV400CBMI-70G MX29LV400CTMI-90G MX29LV400CBMI-90G MX29LV400CTTI-55Q MX29LV400CBTI-55Q MX29LV400CTTI-70G MX29LV400CBTI-70G MX29LV400CTTI-90G MX29LV400CBTI-90G MX29LV400CTXBI-55Q MX29LV400CBXBI-55Q MX29LV400CTXBI-70G MX29LV400CBXBI-70G 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) Remark PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free P/N:PM1155 REV. 1.5, APR. 24, 2006 59 MX29LV400C T/B PART NO. ACCESS TIME (ns) MX29LV400CTXBI-90G 90 MX29LV400CBXBI-90G MX29LV400CTXEI-55Q MX29LV400CBXEI-55Q MX29LV400CTXEI-70G MX29LV400CBXEI-70G MX29LV400CTXEI-90G MX29LV400CBXEI-90G MX29LV400CTXHI-55Q MX29LV400CBXHI-55Q MX29LV400CTXHI-70Q MX29LV400CBXHI-70Q 90 55 55 70 70 90 90 55 55 70 70 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) Remark PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free P/N:PM1155 REV. 1.5, APR. 24, 2006 60 MX29LV400C T/B PART NAME DESCRIPTION MX 29 LV 400 C T T C 70 G OPTION: G: Lead-free package R: Restricted VCC (3.0V~3.6V) Q: Restricted VCC (3.0V~3.6V) with Lead-free package blank: normal SPEED: 55: 55ns 70: 70ns 90: 90ns TEMPERATURE RANGE: C: Commercial (0˚C to 70˚C) I: Industrial (-40˚C to 85˚C) PACKAGE: M: SOP T: TSOP X: FBGA (CSP) XB - 0.3mm Ball (6x8mm) XE - 0.4mm Ball (6x8mm) XH - 0.32mm Ball (4x6mm) BOOT BLOCK TYPE: T: Top Boot B: Bottom Boot REVISION: C DENSITY & MODE: 400: 4M, x8/x16 Boot Block TYPE: L, LV: 3V DEVICE: 28, 29:Flash P/N:PM1155 REV. 1.5, APR. 24, 2006 61 MX29LV400C T/B PACKAGE INFORMATION P/N:PM1155 REV. 1.5, APR. 24, 2006 62 MX29LV400C T/B P/N:PM1155 REV. 1.5, APR. 24, 2006 63 MX29LV400C T/B 48-Ball CSP (for MX29LV400CTXBC/TXBI/BXBC/BXBI) P/N:PM1155 REV. 1.5, APR. 24, 2006 64 MX29LV400C T/B 48-Ball CSP (for MX29LV400CTXEC/TXEI/BXEC/BXEI) P/N:PM1155 REV. 1.5, APR. 24, 2006 65 MX29LV400C T/B 48-Ball CSP (for MX29LV400CTXHI/CBXHI) P/N:PM1155 REV. 1.5, APR. 24, 2006 66 MX29LV400C T/B REVISION HISTORY Revision No. Description 1.0 1. Removed "Preliminary" 2. Added access time:55ns 1.1 1.2 1.3 1. Added part name description 1. Added Pb-free package (for 44-SOP) 1. Added regulared voltage 2. Test Conditions added condition 3. Added tCWC, tVLHT and tOESP in table 12 4. Added "Recommended Operating Conditions" 5. Added description about Pb-free devices are RoHS Compliant 1. Modified Erase Resume from delay 10ms to delay 400us 1. Added 48-CSP(4x6mm) package 2. Added VLKO description Page Date P1 APR/15/2005 P1,9,20, P23,24,54~57 P59 MAY/12/2005 P56,57 JUL/14/2005 P18 AUG/30/2005 P20 P24 P51 P1 P13,33 JAN/17/2006 P1,3,60, APR/24/2006 P61,66 P17,20 1.4 1.5 P/N:PM1155 REV. 1.5, APR. 24, 2006 67 MX29LV400C T/B MACRONIX INTERNATIONAL CO., LTD. Headquarters: TEL:+886-3-578-6688 FAX:+886-3-563-2888 Europe Office : TEL:+32-2-456-8020 FAX:+32-2-456-8021 Hong Kong Office : TEL:+86-755-834-335-79 FAX:+86-755-834-380-78 Japan Office : Kawasaki Office : TEL:+81-44-246-9100 FAX:+81-44-246-9105 Osaka Office : TEL:+81-6-4807-5460 FAX:+81-6-4807-5461 Singapore Office : TEL:+65-6346-5505 FAX:+65-6348-8096 Taipei Office : TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-262-8887 FAX:+1-408-262-8810 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.