MX66C256MC-10

MX66C256 Very Low Power 32k x 8 CMOS SRAM FEATURES Vcc operation voltage : 5.0V Very low power consumption : 50 mA (Max.) write current 40 mA (Max.) read current 0.4uA (Typ.) CMOS standby current High speed access time : - 70 70ns (Max.) - 100 100ns (Max.) Input levels are CMOS-compatible Automatic power down when chip is deselected Three state outputs Fully static operation Data retention supply voltage as low as 2.0V Easy expansion with CE and OE options DESCRIPTION The MX66C256 is a high performance, very low power CMOS Static Random Access Memory organized as 32,768 words by 8 bits and operates at 5.0V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.4uA and maximum access time of 70ns and 100 ns in 5V operation. Easy memory expansion is provided by an active LOW chip enable(CE), and active LOW output enable (OE) and three-state output drivers. The MX66C256 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The MX66C256 is available in the JEDEC standard 28 pin 330mil Plastic SOP, and 8mmx13.4mm TSOP (normal type). PIN CONFIGURATIONS BLOCK DIAGRAM A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 GND 28 1 27 2 26 3 25 4 24 5 23 6 22 7 8 28-SOP 21 20 9 19 10 18 11 17 12 13 16 14 15 VCC WE A13 A8 A9 A11 OE A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 A5 A6 A7 A12 A14 A13 A8 A9 A11 Address Input Buffer 18 Row Decoder 512 Memory Array 512 x 512 512 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 8 Data Input Buffer 8 Column I/O Write Driver Sense Amp 64 Column Decoder 12 CE WE OE Vdd Gnd Control Address Input Buffer 8 OE A11 A9 A8 A13 WE VCC A14 A12 A7 A6 A5 A4 A3 Data Output Buffer 8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-TSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 CE DQ7 DQ6 DQ5 DQ4 DQ3 GND DQ2 DQ1 DQ0 A0 A1 A2 A4 A3 A2 A1 A0 A10 P/N DS0035 1 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 PIN DESCRIPTIONS A0-A14 Address Input CE Chip Enable Input These 15 address input select one of the 32768 x 8-bit words in the RAM CE is active LOW . Chip enable must be active to read from or write to the device. If chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. These 8 bi-directional ports are used to read data from or write data into the RAM. Power Supply Ground WE Write Enable Input OE Output Enable Input DQ0 - DQ7 Data Input/Output Ports Vcc GND TRUTH TABLE MODE Not Selected Output Disabled Read Write WE X H H L CE H L L L OE X H L X I/O Operation High Z High Z DOUT DIN Vcc Current ICCSB, ICCSB1 ICC ICC ICC ABSOLUTE MAXIMUM RATINGS(1) SYMBOL VTERM TBIAS TSTG PT IOUT PARAMETER Terminal Voltage with Respect to GND RATING -0.5 to +7.0 UNITS V OC OC OPERATING RANGE RANGE COMMERCIAL INDUSTRIAL AMBIEN TEMPERATURE 0O C to + 70O C -40O C to + 85O C Vcc 4.5 ~ 5.5V 4.5 ~ 5.5V Temperature Under Bias -40 to +125 Storage Temperature Power Dissipation DC Output Current -60 to +150 1.0 20 W mA CAPACITANCE(1) (TA = 25O C, f = 1.0 MHz) SYMBOL PARAMETER Input Capacitance Input/Output Capacitance CONDITIONS MAX. VIN = 0V VI/O = 0V 6 8 UNIT pF pF 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. P/N DS0035 CIN CDQ 1. This parameter is guaranteed and not tested. 2 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 DC ELECTRICAL CHARACTERISTICS ( TA = 0o to + 70oC ) PARAMETER NAME VIL VIH IIL IOL VOL VOH ICC ICCSB ICCSB1 PARAMETER Guaranteed Input Low Voltage(2) Guaranteed Input High Voltage(2) Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Power Supply Current Power Down Supply Current TEST CONDITIONS MIN. -0.5 0.7VCC TYP.(1) MAX. UNITS 0.3VCC VCC+0.2 1 1 0.4 V V uA uA V V 50 40 1 0.4 3 mA mA mA uA Vcc = Max, VIN = 0V to Vcc Vcc = Max, CE = VIH, or OE = VIH, VI/O = 0V to Vcc Vcc = 5.0V, IOL = 2mA Vcc = 5.0V, IOH = -1mA CE=VIL, IDQ=0mA, F=Fmax(3) CE=VIL, IDQ=0mA, F=1MHZ CE = VIH, IDQ = 0mA, CE ≥ Vcc-0.2V, VIN ≥ Vcc - 0.2V or VIN ≤ 0.2V Vcc = 5.0V Vcc = 5.0V Vcc = 5.0V Vcc = 5.0V 2.4 1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. FMAX = 1/tRC . DATA RETENTION CHARACTERISTICS ( TA = 0oC to + 70oC ) SYMBOL VDR ICCDR tCDR tR PARAMETER Vcc for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time TEST CONDITIONS CE ≥Vcc - 0.2V, VIN ≥ Vcc - 0.2V or VIN ≤0.2V CE ≥ Vcc -0.2V, VIN ≥ Vcc - 0.2V or VIN ≤ 0.2V See Retention Waveform MIN. TYP.(1) MAX. UNITS 2.0 0.20 V 0.01 0 TRC(2) uA ns ns 1. V cc = 2.0V, TA = + 25OC 2. tRC = Read Cycle Time LOW VCC DATA RETENTION WAVEFORM (1) (CE Controlled) Data Retention Mode Vcc VIH VCC VDR ≥ 2.0V VCC t CDR CE ≥ Vcc - 0.2V tR VIH CE P/N DS0035 3 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level 5.0/V0V KEY TO SWITCHING WAVEFORMS 5ns 2.5V WAVEFORM INPUTS MUST BE STEADY MAY CHANGE FROM H TO L OUTPUTS MUST BE STEADY WILL BE CHANGE FROM H TO L WILL BE CHANGE FROM L TO H CHANGE : STATE UNKNOWN CENTER LINE IS HIGH IMPEDANCE ¡¨OFF ¡¨STATE AC TEST LOADS AND WAVEFORMS 1923 Ω 1923 Ω 5.0V OUTPUT 100PF INCLUDING JIG AND SCOPE 5.0V OUTPUT 5PF 1020Ω INCLUDING JIG AND SCOPE MAY CHANGE FROM L TO H DON T CARE: ANY CHANGE PERMITTED DOES NOT APPLY , 1020 Ω FIGURE 1A THEVENIN EQUIVALENT 667 Ω FIGURE 1B OUTPUT ALL INPUT PULSES VCC GND 10% 90% 90% 10% 1.73V → ← FIGURE 2 → ← 5ns AC ELECTRICAL CHARACTERISTICS (over the operating range) READ CYCLE JEDEC PARAMETER PARAMETER NAME NAME DESCRIPTION MX66C256-70 MX66C256-10 MIN. TYP. MAX. MIN. TYP. MAX. 70 70 70 50 10 10 0 0 10 35 30 10 10 0 0 10 35 30 100 100 100 50 UNIT tAVAX tAVQV tELQV tGLQV tELQX tGLQX tEHQZ tGHQZ tAZQX tRC tAA tACS tOE tCLZ tOLZ tCHZ tOHZ tOH Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Select to Output Low Z Output Enable to Output in Low Z Chip Deselect to Output in High Z Output Disable to Output in High Z Output Disable to Output Address Change ns ns ns ns ns ns ns ns ns 1. Typical characteristics are at Vcc = 5.0V, TA = 25oC. SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE1 (1,2,4) t ADDRESS RC t t D OUT OH AA t OH P/N DS0035 4 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 READ CYCLE2 (1,3,4) CE t ACS t CLZ D OUT (5) t CHZ (5) READ CYCLE3 (1,4) t ADDRESS RC t AA OE t OE CE t OH t OLZ t ACS t CLZ (5) t OHZ (5) (1,5) t CHZ D OUT NOTES: 1. WE is high for read Cycle. 2. Device is continuously selected when CE = VIL . 3. Address valid prior to or coincident with CE transition low . 4. OE = VIL . 5. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. P/N DS0035 5 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 AC ELECTRICAL CHARACTERISTICS (over the operating range) WRITE CYCLE JEDEC PARAMETER PARAMETER NAME NAME DESCRIPTION MX66C256-70 MIN. TYP. MAX. 70 70 0 70 50 (CE , WE) 0 30 40 0 0 5 30 UNIT tAVAX tE1LWH tAVWL tAVWH tWLWH tWHAX tWLQZ tDVWH tWHDX tGHQZ tWHQX tWC tCW tAS tAW tWP tWR tWHZ tDW tDH tOHZ tOW Write Cycle Time Chip Select to End of Write Address Set up Time Address Valid to End of Write Write Pulse Width Write Recovery Time Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active ns ns ns ns ns ns ns ns ns ns ns 1. Typical characteristics are at Vcc = 5.0V, TA = 25oC. SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE1 (1) t ADDRESS WC t OE (3) WR (5) t t AW (11) CW CE WE t AS (4,10) t WP (2) t OHZ D OUT t t DW DH D IN P/N DS0035 6 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 WRITE CYCLE2 (1,6) t ADDRESS (11) WC t (5) CW CE t WE t AS (4,10) AW t WP (2) t DH t D OUT WHZ (7) (8) t DW t DH (8) D IN NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1b. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE going low to the end of write. P/N DS0035 7 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 ORDERING INFORMATION SPEED (ns) 70 100 70 100 70 100 70 100 ORDERING PART NUMBER MX66C256MC- 70 MX66C256MC-10 MX66C256MI- 70 MX66C256MI-10 MX66C256TC- 70 MX66C256TC- 10 MX66C256TI- 70 MX66C256TI-10 PACKAGE TYPE SOP-28PIN SOP-28PIN SOP-28PIN SOP-28PIN TSOP-28PIN TSOP-28PIN TSOP-28PIN TSOP-28PIN TEMPERATURE RANGE 0O C to + 70O C 0O C to + 70O C -40O C to + 85O C -40O C to + 85O C 0O C to + 70O C 0O C to + 70O C -40O C to + 85O C -40O C to + 85O C n PACKAGE DIMENSIONS P/N DS0035 8 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com MX66C256 n PACKAGE DIMENSIONS (continued) P/N DS0035 9 Rev. 1.1, Jan., 2000 Macronix America Inc. USA 1338 Ridder Park Dr., San Jose, CA 95131 Tel (408)453-8088 Fax (408)451-0876 www.macronix.com