MLX91207
High Speed Hall Sensor IC
Datasheet
Not recommended for new designs. Similar
functionality provided by the MLX91209, MLX91217
or MLX91219
2. Application Examples
1. Features and Benefits
▪
▪
▪
▪
▪
▪
▪
▪
▪
▪
Programmable high speed Hall sensor
Wide bandwidth, short response time 8µs
Programmable linear transfer characteristic
Selectable analog ratiometric output
Measurement range from ±15mT to ±400mT
Thermometer output
17 bit ID number
Single die SOIC8 package RoHS compliant
Lead free component, suitable for lead free
soldering profile 260 °C
Low thermal Drift (Gain and Offset)
▪
Current sensor applications
- Over current detection circuit
- Inverter Application HEV &EV
- AC/DC converters
- Battery management
▪
Position sensor application
Ordering Code
Product
Temperature Code
Package Code
Code
MLX91207
L (-40°C to 150°C)
DC (SOIC)
MLX91207
L (-40°C to 150°C)
DC (SOIC)
MLX91207
L (-40°C to 150°C)
DC (SOIC)
MLX91207
L (-40°C to 150°C)
DC (SOIC)
MLX91207
L (-40°C to 150°C)
DC (SOIC)
MLX91207
L (-40°C to 150°C)
DC (SOIC)
(1) Ratiometry is disabled by default for this version
Ordering Option
Code
CAA-005
CAA-005
CAA-007
CAA-007
CAA-015(1)
CAA-015(1)
Packing
form Code
TU (Tube)
RE (Reel)
TU
RE
TU
RE
Comment
15-45mV/mT (25mV/mT)
15-45mV/mT (25mV/mT)
5-20mV/mT (10mV/mT)
5-20mV/mT (10mV/mT)
15-45mV/mT (25mV/mT)
15-45mV/mT (25mV/mT)
Ordering example : MLX91207-LDC-CAA-007-TU
3. Functional Diagram
3.3V core
TEMPOUT
Thermometer
3.3V
ana
Voltage
Regulator
&
Rev.Pol.
protection
3.3V
dig
VDIG
VDD
VSS
Oscillator
Clock
1 MHz
Generator
fs = 1MHz
Input data rate
fs = 1MHz
4Phase
Switch
Box
Integrating
P2P
DIDO
G = 15 … 239
fi = 250kHz or 25kHz
Intermediate data rate
G = 0.4 … 1
fo = 250 kHz or 25 kHz
Output data rate
S&H
RG[2:0]
10 bits
2 bits
PLATEPOL
FG[9:0]
TC2ND_COLD[4:0]
OFFSETDRIFT_HOT[5:0]
TC2ND_HOT[4:0]
OFFSETDRIFT_COLD[5:0]
Sensitivity
trimming
OUT
DAC
3 bits
HallSensors
selection
Output
Buffer
G=4
Hall
Bias
TC1ST[6:0]
Clamping
LPF
5V ratiometric
output
12 bits
6 bits
Digital
Ratiometry
FILTCODE[1:0] XA[11:0] CLAMPLOW[2:0]
CLAMPHIGH[2:0]
DIGITAL + EEPROM
Rough Gain
Fine Gain
Offset
Compensation
Polarity
selection
Bandwidth
Voq adjust
Figure 1: Block diagram
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MLX91207
High Speed Hall Sensor IC
Datasheet
4. General Description
The MLX91207 is a monolithic programmable hall sensor IC, which provides a high speed analog output signal
proportional to the external applied flux density. The sensor is ideally suitable for current sensing application and
features an additional thermometer output. Moreover, the sensor can be integrated in position sensing applications
where fast response time is required.
The transfer characteristics of the MLX91207 are fully programmable (offset, gain, clamping levels, diagnostic
functions…). The full analog chain features a fast response time and allows use of the sensor for applications where a
very fast response time < 10 sec is required.
In the typical application the sensor is used in combination with a ring shaped soft ferromagnetic core. The Hall-IC is
placed in a small air gap and the current conductor is passed through the inner part of the ferromagnetic ring. The
ferromagnetic ring concentrates and amplifies the magnetic flux on the Hall-Sensor IC which generates an output
voltage proportional to the current. Figure 2 shows a typical sensor application for a contact-less current
measurement.
Figure 2: Typical application of MLX91207
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MLX91207
High Speed Hall Sensor IC
Datasheet
Table of Contents
1. Features and Benefits.......................................................................................................................................1
2. Application Examples .......................................................................................................................................1
3. Functional Diagram ..........................................................................................................................................1
4. General Description..........................................................................................................................................2
Table of Contents .................................................................................................................................................3
5. Glossary of Terms .............................................................................................................................................4
6. Absolute Maximum Ratings ..............................................................................................................................4
7. Pin Definitions and Descriptions .......................................................................................................................4
8. General Electrical Specifications .......................................................................................................................5
9. Magnetic specification .....................................................................................................................................6
10. Output specification .......................................................................................................................................6
10.1. Timing specification ................................................................................................................................6
10.2. Accuracy Specification ............................................................................................................................7
10.3. Remarks to the achievable accuracy ......................................................................................................7
11. Thermometer Output .....................................................................................................................................7
12. Programmable Items ......................................................................................................................................8
12.1. Customer Parameter Table.....................................................................................................................8
12.2. Description of Programmable Items.......................................................................................................9
12.2.1. Output Mode Configuration (OUTMODE) .......................................................................................9
12.2.2. Output impedance mode (DIAGINFAULT) .......................................................................................9
12.2.3. Sensitivity Programming (ROUGHGAIN and FINEGAIN) ..................................................................9
12.2.4. Offset Compensation VOQ (XA) .......................................................................................................9
12.2.5. Sensitivity polarity (PLATEPOL) ......................................................................................................10
12.2.6. Clamping Level Programming (CLAMPLOW, CLAMPHIGH) ...........................................................10
12.2.7. Bandwidth and Filter Programming (FILTER) .................................................................................11
12.2.8. Power Limitation (OUTSLOPE) .......................................................................................................11
12.2.9. Output Ratiometry (RATIODIS) ......................................................................................................12
12.2.10. Sensitivity Temperature Drift Programming (TC1ST, TC2ND_COLD, TC2ND_HOT).....................12
12.2.11. Offset Temperature Drift Programming (OFFDRIFT_COLD, OFFDRIFT_HOT) ..............................12
12.2.12. Product Identification (MLXID, CSTID) .........................................................................................12
13. Self-Diagnostic.............................................................................................................................................. 13
14. Applications Information .............................................................................................................................. 14
14.1. Current Measurement ..........................................................................................................................14
14.2. Linear Position ......................................................................................................................................14
15. Recommended Application Diagrams ........................................................................................................... 15
15.1. Resistor and Capacitor Values ..............................................................................................................15
15.2. Pull down resistor for diagnostic low ...................................................................................................15
15.3. Pull up resistor for diagnostic high .......................................................................................................15
16. Standard information regarding manufacturability of Melexis products with different soldering processes. 16
17. ESD Precautions ........................................................................................................................................... 16
18. Package Information .................................................................................................................................... 17
18.1. SOIC8 Package Dimensions...................................................................................................................17
18.2. SOIC8 Pin Out and Marking ..................................................................................................................17
19. Related documents and toolsPackage Information....................................................................................... 19
19.1. Related documents ...............................................................................................................................19
19.2. Related software ..................................................................................................................................19
19.3. Related hardware .................................................................................................................................19
20. Contact......................................................................................................................................................... 20
21. Disclaimer..................................................................................................................................................... 20
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High Speed Hall Sensor IC
Datasheet
5. Glossary of Terms
Tesla
TC
NC
ADC
DAC
LSB
MSB
DNL
INL
ASP
DSP
PTC
Units for the magnetic flux density, 1 mT = 10 Gauss
Temperature Coefficient in ppm/deg C
Not Connected
Analog-to-Digital Converter
Digital-to-Analog Converter
Least Significant Bit
Most Significant Bit
Differential Non Linearity
Integral Non Linearity
Analog Signal Processing
Digital Signal Processing
Programming Through Connector
6. Absolute Maximum Ratings
Parameter
Positive Supply Voltage (overvoltage)
Value
+20
Units
V
Reverse Supply Voltage Protection
-10
V
Positive Output Voltage
+10
+14 (200 s max, TA = +25°C)
±300
-0.3
V
mA
°C
Output Current
Reverse Output Voltage
Symbol
Vdd
Iout
mA
V
Reverse Output Current
Operating Ambient Temperature Range
TA
-50
-40 to +125
Storage Temperature Range
TS
-55 to +150
°C
±2
T
Magnetic Flux Density
Table 1: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum rated
conditions for extended periods may affect device reliability.
7. Pin Definitions and Descriptions
Pin №
1
2
3
4
5
6
7
8
Name
VDD
VSS
VDIG
MUST1
OUT
TESTOUT
MUST0
TEMPOUT
Type
Supply
Ground
Supply
Digital
Analog
Digital
Digital
Analog
Function
Supply Voltage
Supply Voltage
Digital supply voltage, 3.3 V, internal regulated
Test pin
Sensor output signal
Test pin
Test pin
Temperature sensor output
Table 2: Pin definition and description
It is recommended to connect the unused pins to the Ground (see section 14) for optimal EMC results.
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MLX91207
High Speed Hall Sensor IC
Datasheet
8. General Electrical Specifications
Operating Parameters TA = -40oC to 125oC, Vdd = 5.0 V, Iout = +/-2mA, recommended application diagram in section 14
used, unless otherwise specified.
Parameter
Nominal Supply Voltage
Symbol
Vdd
Test Conditions
Supply Current
Idd
Without output load
TA = -40oC to 150oC
Output Current
Output Resistance
Output Capacitive Load
Output Short Circuit Current
Iout
-2
Vout = 50% Vdd, RL = 5kΩ
Cload
Ishort
5
Output shorted to Vdd Permanent
Output shorted to Vss Permanent
Leakage current
Ileak
High impedance mode (1)
Output Voltage Swing (Linear
Range)
Vout_pd
pull down ≥ 10 kΩ
Vout_pu
High-impedance mode levels
BrokenVss Output Levels
Min
4.5
(1)
(1)
Under-voltage detection (1) (4)
Max
5.5
Units
V
9
12
mA
2
1
5
10
50
Not Destroyed
mA
nF
Not Destroyed
5
uA
5
95
%Vdd
pull up ≥ 10 kΩ
5
95
%Vdd
Vout_HiZ_pu
pull-up RL ≤ 30 kΩ
97
Vout_HiZ_pd
pull-down RL ≤ 30 kΩ
OUT with pull-down RL ≤ 10 kΩ
OUT with pull-up RL ≤ 30 kΩ (2)
OUT with pull-down RL ≤ 30 kΩ (2)
OUT with pull-up RL ≤ 30 kΩ (2)
Vdd_uvd
Detected Voltage (L to H)
BrokenVdd Output Levels(1)
Typ
5
Vdd_uvh
Over-voltage detection mode1 (1) Vdd_ovd1
%Vdd
3
%Vdd
3
3.3
3.45
%Vdd
%Vdd
%Vdd
%Vdd
V
0.3
0.4
9.5
V
V
97
3
97
3.15
Hysteresis
Detected Voltage (L to H)
0.25
7.9
Vdd_ovh1
Vdd_ovd2
Hysteresis
Detected Voltage (L to H)
0.8
6.7
1.6
7.6
V
V
Vdd_ovh2
Clamp_lo
Hysteresis
Trimming Range
0.05
5 (3)
0.5
10
V
%Vdd
Clamp_hi
Trimming Range
90
95 (3)
%Vdd
(4)
Over-voltage detection mode 2
(1) (4)
Clamped Output Level
Table 3: General electrical parameters
(1)
(2)
(3)
(4)
Refer to chapter 13 Self-diagnostic, table 15.
Valid for TEMPOUT with pull-up (min. 30kΩ), pull-down (min. 30kΩ) or not connected
Factory programmed clamping level
According to the figure below
Vout
Hysteresis
Detected
Voltage
Vdd
Figure 3: Detected voltage and hysteresis definitions
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High Speed Hall Sensor IC
Datasheet
9. Magnetic specification
Operating Parameters TA = -40oC to 125oC, Vdd = 5.0 V, unless otherwise specified.
Parameter
Magnetic field range
Symbol
B
Test Conditions
Linearity Error
NL
B = ± 45 mT (TA = 25 °C)
Programmable Sensitivity
S
Sensitivity programming
Resolution
Table 4: Magnetic specification
Sres
Min
±15
Typ
±45
Max
±450
Units
mT
15(2)
5(3)
0.1
25(2)
10(3)
0.1
0.25
40(2)
20(3)
±%FS(1)
mV/mT
mVm/T
%
Typ
8
Max
10
Units
μs
(1) By design
(2) MLX91207LDC-CAA-005 / MLX91207LDC-CAA-015
(3) MLX91207LDC-CAA-007
10. Output specification
10.1. Timing specification
Operating Parameters TA = -40oC to 125oC, Vdd = 5.0 V, unless otherwise specified
Parameter
Step Response Time(1)
Symbol
Tresp
Bandwidth
BW
Power on Delay
TPOD
Test Conditions
Voq ± 2 V
BW =Range
100 kHz
– No filterto
Full
(referenced
externally applied field)
Vout =100% of FS
(BW = 100 Hz)
(BW = 1000 Hz)
(BW = 10 kHz)
(BW = 60 kHz – No filter)
Ratiometry Cut-off
Fratio
Frequency
Table 5: Timing specification of the analog output
Min
60
kHz
100
10
0.35
0.25
ms
ms
ms
ms
250
Hz
(1) Time interval between when the applied magnetic field reaches 90% of it’s maximum value and when the
sensor’s output reaches 90% corresponding to this magnetic field
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High Speed Hall Sensor IC
Datasheet
10.2. Accuracy Specification
Operating Parameters TA = -40oC to 125oC, Vdd = 5.0 V, S = 50 mV/mT, unless otherwise specified.
Specifications are defined for final test conditions: PLATEPOL=0 and RATIODIS=0.
Parameter
Thermal Offset Drift
Symbol
ΔTVoq
Thermal Sensitivity Drift
RMS Output noise
TC
Nrms
Voq Ratiometry
ΔVoq
Sensitivity Ratiometry
ΔS
Test Conditions
Min
-0.4
Typ
Max
+0.4
Units
%Vdd
-150
+150
0.02
ppm/°C
%Vdd
Voq = 50% Vdd
ΔVdd = 10% Vdd
9.8
10.2
%
ΔVdd = 10% Vdd
B = ± 45 mT
9.8
10.2
%
S = 1 %Vdd/mT
(= 300 mV/mT @ Vdd=5V)
Table 6: Accuracy specific parameters
10.3. Remarks to the achievable accuracy
The achievable target accuracy is dependent on the user’s end of line calibration. The resolution for the offset and
offset drift calibration is better than 0.1%Vdd. The trimming capability is higher than the measurement accuracy. An
end user calibration can increase the accuracy of the system.
11. Thermometer Output
The thermometer output voltage is in the range from 367mV to 2930mV for temperatures ranging from -40°C to
125°C. The pin shall be able to sustain a low impedance connection to maximum 14V. The output is not ratiometric.
Parameter
Symbol
Test Conditions
Min
Output voltage with T = 35degC
3-bit adjustment
Offset
T35
Slope
Tslope
Accuracy
Tacc
Load capacitor
CloadTherm External through bonding wire
Output current
Iouttherm
Typ
Units
1.38
V
13.5
mV/degC
-5
1
-0.1
Max
5
degC
50
nF
+0.1
mA
Table 7: Thermometer output specifications
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High Speed Hall Sensor IC
Datasheet
12. Programmable Items
12.1. Customer Parameter Table
Customers can re-program the parameters described in the table below by using the Melexis PTC-04 hardware and the
Product Specific Functions (PSF) libraries provided by Melexis. We recommend using the latest version of the PSF and
the latest version of the firmware with a communication speed of 10kbps (limited by a maximum output capacitor of
50nF). Software and fimrware are available on the softdist platform (see contact details on page 20 to request an
account).
Parameter
Bits
Comment
1
1
3
10
12
1
Factory
Setting
1
0
Trimmed
Trimmed
Trimmed
0
OUTMODE
DIAGINFAULT
ROUGHGAIN
FINEGAIN
XA
PLATEPOL(1)
CLAMPLOW
3
Trimmed
Clamping low level
CLAMPHIGH
3
Trimmed
Clamping high level
FILTCODE
3
0
OUTSLOPE
RATIODIS(1)
TC1ST
TC2ND_COLD
2
1
7
5
3
0(2) / 1(2)
Trimmed
Trimmed
Power limitation of the output driver on high frequencies
Disable ratiometry between output signal and supply
Sensitivity temperature drift correction first order
Sensitivity temperature drift correction second order for cold
temperatures
TC2ND_HOT
5
Trimmed
Sensitivity temperature drift correction second order for hot
temperatures
OFFDRIFT_COLD
OFFDRIFT_HOT
MLXID
CSTID
6
6
48
17
Trimmed
Trimmed
Programmed
N/A
Capacitive load selection
Output impedance setting
Rough gain preamplifier
Fine gain amplifier from 0.4 to 1.0
Offset compensation VOQ
Change of sensitivity sign
Analog filter
Offset temperature drift correction for cold temperatures
Offset temperature drift correction for hot temperatures
MLX ID
Customer ID
Table 8: Customer programmable parameters
(1) Changing these parameters has an impact on temperature calibration.
(2) 0 for CAA-005/CAA-007 and 1 for CAA-015
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High Speed Hall Sensor IC
Datasheet
12.2. Description of Programmable Items
12.2.1. Output Mode Configuration (OUTMODE)
OUTMODE configures the output driver. For standalone applications (output of the sensor directly connected to a
cable) we recommend using OUTMODE 1 because of better EMC robustness.
If the sensor is integrated on a PCB a smaller load capacitor can be applied. The output capacitor has to be considered
in reference to OUTMODE.
OUTMODE
0
1
Output Driver
Integrated PCB mode,CL = 1..10nF (1) (2)
Standalone mode, CL = 5nF..50nF (1) (2)
Table 9: Output driver configurationmax.
(1) See section 14, CL = C4
(2) Factory setting: OUTMODE=1
12.2.2. Output impedance mode (DIAGINFAULT)
DIAGINFAULT sets the output impedance mode.
DIAGINFAULT
0
1
Output impedance
Low impedance mode (normal mode)
High impedance mode (diagnostic level)
12.2.3. Sensitivity Programming (ROUGHGAIN and FINEGAIN)
The sensitivity is programmable with 3 bits for ROUGHGAIN and 10 bits for FINEGAIN from 5 to 45 mV/mT.
Different option codes correspond to different sensitivity ranges:
Ordering
Option Code
CAA-005 / CAA-015
CAA-007
Typical
Rough Gain
3
1
Typical
Sensitivity [mV/mT]
25
10
Minimum
Sensitivity [mV/mT]
15
5
Maximum
Sensitivity [mV/mT]
45
20
In order to have a safety margin regarding mechanical tolerances Melexis recommends designing the application in
such a way that the typical sensitivity can be used with. If the target sensitivity of the module is out of the defined
range (see table above), the hardware and software tools provided by Melexis will not be able to properly calibrate the
sensor.
12.2.4. Offset Compensation VOQ (XA)
The offset is programmable with 12 bits in 1.25 mV steps over the full output range. This corresponds to a calibration
resolution of 0.025 %VDD.
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High Speed Hall Sensor IC
Datasheet
12.2.5. Sensitivity polarity (PLATEPOL)
The polarity of the sensitivity can be programmed by changing the value of the PLATEPOL bit
PLATEPOL
0
1
Polarity
Positive
Negative
Please note that the factory calibration is done with PLATEPOL=0 . Melexis cannot guarantee the magnetic
specification if this parameter is changed during customer calibration.
12.2.6. Clamping Level Programming (CLAMPLOW, CLAMPHIGH)
The clamping levels limit the maximum and minimum output levels. The clamping levels are ratiometric (if RATIODIS =
0). The CLAMPLOW parameter adjusts the minimum out put voltage level from 5%...10%Vdd. The CLAMPHIGH
parameter sets the maximum output voltage level from 90...95%Vdd.
100 %
90 %
97 %
95 %
90 %
Diagnostic Band (High)
Clamping High
80 %
Output Level
70 %
60 %
50 %
Linear Range
40 %
30 %
20 %
10 %
10 %
5%
3%
Clamping Low
0%
CLAMPLOW
0
1
2
3
4
5
6
7
Diagnostic Band (Low)
Minimal output
[%Vdd]
4.8
5.7
6.6
7.5
84
9.3
10.2
11.2
Table 11: Clamping low level table (typical values)
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High Speed Hall Sensor IC
Datasheet
CLAMPHIGH
0
1
2
3
4
5
6
7
Maximal output
[%Vdd]
90.6
91.4
92.4
93.3
94.3
95.2
96.1
97
Table 12: Clamp high level table (typical values)
The clamping functionality can be disabled by programming CLAMPLOW=CLAMPHIGH=7.
The clamping levels calibrated during final test are:
- 6%Vdd (+/- 0.5%Vdd) for CLAMPING LOW
- 94%Vdd (+/- 0.5%Vdd) for CLAMPING HIGH
12.2.7. Bandwidth and Filter Programming (FILTER)
FILTCODE allows adjusting the internal bandwidth of the sensor. The power on delays is subjected to the FILTCODE
setting. For a low power consumption applications Melexis recommends FILTCODE=0 in a duty cyle mode.
FILTCODE
0
1
2
3
4
5
6
7
Typical Bandwidth [kHz]
60
9
40
2
9
0.9
4
0.2
Power on delays [ms]
0.25
0.35
0.28
0.73
0.5
1.45
0.82
5.2
Table 13: FILTCODE settings and typical bandwidth
12.2.8. Power Limitation (OUTSLOPE)
OUTSLOPE defines the power limit above which the output driver turns off to prevent damages to the IC. The power
dissipated in the IC output driver is measured by the IC itself. The power is obtained by multiplying continuously the
voltage across the conducting MOS driver by the output current I out. When the power reaches the power limit, the
output driver is switched off and on such that, on average, the measured power is maintained equal to the power
limit. For OUTSLOPE = 3, the output driver is always enabled independently of the measured power.
Value
0
1
2
3
Power limitation [mW]
50
100
200
DISABLED
Table 14: Output power limitation
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High Speed Hall Sensor IC
Datasheet
12.2.9. Output Ratiometry (RATIODIS)
RATIODIS allows enabling and disabling the ratiometry of the output in reference to the supply voltage by setting
respectively 0 and 1 in the EEPROM.
Please note that Melexis can not guarantee the magnetic specifications after changing the ratiometry factory setting.
Different product versions with different ratiometry settings are available:
MLX91207 version
CAA-005
CAA-007
CAA-015
Ratiometry
Default value
0 (Enabled)
1 (Disabled)
12.2.10. Sensitivity Temperature Drift Programming (TC1ST, TC2ND_COLD,
TC2ND_HOT)
First order sensitivity temperature drift can be trimmed from -2000 to 2000 ppm/K with TC1ST. The programming
resolution is 40 ppm/K. Second order sensitivity temperature drift can be trimmed from -6 to 6 ppm/K2 with TC2ND.
The programming resolution is 0.4/ppm/K2. The second order can also be seen as third order correction since cold and
hot sides are independently adjusted. The Linear Temperature Coefficient of the sensitivity will be trimmed to a target
value of 0 ppm/°C with a tolerance of +/- 150 ppm/°C by the 7 bits programming of the TC1ST.
12.2.11. Offset Temperature Drift Programming (OFFDRIFT_COLD, OFFDRIFT_HOT)
Offset temperature drift can be trimmed from -2.25 to +2.25 mV/K. The programming resolution is 0.075 mV/K. This
first order correction is done independently for temperatures over 25C and below 25C. The offset drift corrections are
ratiometric (if RATIODIS = 0). The parameter will be trimmed to 0 mV/°C by Melexis. The end user can adjust this
parameter after the assembly into their product in order to achieve highest accuracy.
12.2.12. Product Identification (MLXID, CSTID)
MLXID
A 48-bit MLX ID is used to guarantee MLX traceability (lotnumber, wafernumber, wafer position & PSF option code)
and is split up into a 3x16 bit register (MLXID1, MLXID2, MLXID3).
The programmed PSF option code is stored in MLXID3[2..0] and defines the gain setting used during the factory
calibration .
PSF Option Code (1)
MLXID3[2..0]
3
Ordering Option Code (2)
XXX-005
3
XXX-015
1
XXX-007
(1) The option code mentioned in all 91207 related documentation (application notes, PSF and User Interface)
refers to the PSF Option Code.
(2) The Ordering Option Code mentioned on the page 1 of this datasheet refers to the Ordering Code, which
defines the Chip version and the sensitivity range of the sensor
CSTID
A 17-bit customer ID is available to create a dedicated traceability system
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High Speed Hall Sensor IC
Datasheet
13. Self-Diagnostic
The MLX91207 provides numerous self diagnostic features. Those features increase the robustness of the IC
functionality as it will prevent the IC from providing an erroneous output signal in case of internal or external failure
modes (“fail-safe”).
Error
Action
Calibration Data CRC Error (at power
up and in normal working mode)
Fault mode
Power On delay
Effect on Outputs
Remarks
High Impedance mode Pull down resistive load => Diag
(1)
Low
resistive
=> Diag High
High Impedance mode Pull
1 msup
max
in highload
impedance
(1)
High Impedance mode
followed by settling
Undervoltage Mode (2)
IC reset (3)
Overvoltage detection Mode 1 (4)
(Threshold : min 7.9 V – max 9.5 V)
Overvoltage detection Mode 2 (5)
(Threshold : min 6.8V – max 7.5V)
IC is switched
off (internal
supply)
IC reset (3)
Broken Vss
IC is switched
off
High Impedance (6)
With some restrictions on pullup/pull-down resistors on OUT and
TEMPOUT, see Chapter 8, page 5,
Table 3
Broken Vdd
IC is switched
off
High Impedance (7)
With some restrictions on pullup/pull-down resistors on OUT, see
Chapter 8, page 5, Table 3
(1)
300mV Hysteresis
High Impedance mode Idd < 1mA
(1)
500mV to 1500mV Hysteresis
High Impedance mode
(1)
100mV Hysteresis
Table 15: Self diagnostic
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Refer to Table 3: General electrical parameter, parameter High-impedance modes levels
Refer to Table 3: General electrical parameter, parameter Under-voltage detection
The internal supply is regulated but the digital sequencer (hall element spinning) is stopped
Refer to Table 3: General electrical parameter, parameter Over-voltage detection mode 1
Refer to Table 3: General electrical parameter, parameter Over-voltage detection mode 2
Refer to Table 3: General electrical parameter, parameter BrokenVss Output Level
Refer to Table 3: General electrical parameter, parameter BrokenVdd Output Level
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High Speed Hall Sensor IC
Datasheet
14. Applications Information
14.1. Current Measurement
As a typical application the MLX91207 can be used as a non
intrusive current sensor. A current flowing through a
conductor generates a magnetic field around it, which is
direct proportional to the amount of current flow. The field
generated is rather small and hard to measure accurately
compared to the current, therefore other approaches are
needed in order to reach good solutions.
An easy and well established principle is the use of a ring
shaped concentrator (or core) made of soft ferromagnetic
material with a small gap. The current conductor is passed
through the ring and generates a magnetic field, which is
concentrated and directed through the gap. The sensor is
placed in the gap of the core and is able to measure the
increased magnetic flux density more reliably.
Figure 4: Current Measurement Application
14.2. Linear Position
An additional application suitable for the MLX91207 is the
detection of a relative linear position of a magnet-sensor
system. A permanent magnet generates a magnetic field in its
surrounding dependent on the magnetization type, the
magnet material and geometry. The MLX91207 should be
placed close to the magnet and the movement axis should be
chosen in a way to get a linear function between flux density
and movement. A possible solution would be a cylindrically
shaped, axially magnetized magnet with the movement axis
parallel to the sensor surface. The magnet provides a
magnetic field, which is linear for a certain movement range,
positive in one direction and negative in the other direction.
The output signal of the sensor is directly proportional to the
magnet position.
+Xpos
-Xpos
Zpos
Z
Y
X
Figure 5: Linear Position Application
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High Speed Hall Sensor IC
Datasheet
15. Recommended Application Diagrams
15.1. Resistor and Capacitor Values
Part
C1
Description
Supply capacitor, EMI, ESD
Value
10 - 220
Unit
nF
C2
C3
Regulator buffer capacitor, decoupling, EMI,
ESD
Decoupling, EMI, ESD
10 - 220
5 - 50
nF
nF
C4
R1
Decoupling, EMI, ESD
Pull up or pull down resistor
5 – 50 (1)
10 - 30
nF
kΩ
Table16: Resistor and capacitor value
(1) When OUTMODE=0 (not recommended in the application), capacitor C4 should be 1nF or less.
15.2. Pull down resistor for diagnostic low
+5V
1
VDD
TEMPOUT
8
MLX91207
C1
Temperature Output
C3
2
VSS
TEST
7
3
VDIG
TEST
6
4
TEST
OUT
5
C2
Analog Output
C4
R1
GND
Figure 6: Diagnostic low
15.3. Pull up resistor for diagnostic high
+5V
1
VDD
TEMPOUT
8
MLX91207
C1
Temperature Output
C3
2
VSS
TEST
7
3
VDIG
TEST
6
4
TEST
OUT
5
C2
R1
Analog Output
C4
GND
Figure 7: Diagnostic high
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MLX91207
High Speed Hall Sensor IC
Datasheet
16. Standard information regarding manufacturability of Melexis products with
different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
▪
▪
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
▪
▪
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
▪
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
▪
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon
with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive
strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information
on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain
Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
17. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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MLX91207
High Speed Hall Sensor IC
Datasheet
18. Package Information
18.1. SOIC8 Package Dimensions
1.27 TYP
NOTES:
All dimensions are in millimeters (anlges in degrees).
* Dimension does not include mold flash, protrusions or
gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion
(shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition.
Dambar cannot be located on the lower radius of the foot.
3.81
5.84
3.99** 6.20**
4.80
4.98*
1.40
1.55
0.19
0.25
1.55
1.73
0°
8°
0.127
0.250
0.35
0.49***
0.41
0.89
Figure 8: Package dimensions
OUT/PWM
TEST
TEST
TEMP OUT
18.2. SOIC8 Pin Out and Marking
8
Marking :
Part Number MLX91207 (3 digits)
Die Version (2 digits)
5
CA
207
207CA
123456
YYWW
123456
YY
Lot number (6 digits)
WW
Week Date code (2 digits)
Year Date code (2 digits)
TEST
VDIG
VSS
4
VDD
1
Figure 9: Pin out and marking
Note: the option code is not marked on the package. It can be found by reading back the EEPROM (See chapter
11.2.12) and on the tape-on-reel label information
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MLX91207
High Speed Hall Sensor IC
Datasheet
SOIC8 Hall Plate Positioning (preliminary)
0.46 +/- 0.06
1.85
2.15
2.35
2.55
Figure 10: Hall Plate positioning (preliminary)
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MLX91207
High Speed Hall Sensor IC
Datasheet
19. Related documents and toolsPackage Information
19.1. Related documents
▪
▪
▪
User Interface UI MLX91207 Description
Product Specific Functions PSF MLX91207 Description
PTC-04 Daughter Board DB-HALL-03 Data Sheet
The latest version of these documents is available on the Melexis Softdist platform. Please contact your local sales
office to request an account (see contact details on page 20).
▪
▪
▪
▪
Non intrusive current sensing with MLX91207 application note
MLX91207 for PDU solutions application note
Calibrating the MLX91206/MLX91207 application note
Shielding for Triaxis current sensors application note
The latest version of these documents is available on the MLX91207 page on the Melexis website:
http://www.melexis.com/Hall-Effect-Sensor-ICs/Special-Purpose-Hall-ICs/MLX91207-757.aspx
19.2. Related software
▪
▪
▪
▪
▪
MLX91207 Firmware
MLX91207 Product Specific Functions (PSF)
MLX91207 User Interface
MLX PTC-04 Product Specific Functions
MLX PTC-04 User Interface
The latest version of these pieces of software is available on the Melexis Softdist platform. Please contact your local
sales office to request an account (see contact details on page 25).
19.3. Related hardware
▪
▪
PTC-04 Programmer for Melexis PTC devices
PTC-04 Daughter Board DB-HALL-03 for MLX91207
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MLX91207
High Speed Hall Sensor IC
Datasheet
20. Contact
For the latest version of this document, go to our website at www.melexis.com.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa
Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas
Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
21. Disclaimer
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising
out of the furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation,
special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by descriptio n, including warranties of fitness for particular
purpose, non-infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior
to designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon
is current.
Users or any third party must further determine the suitability of the Product for its application, including the level of re liability required and determine whether it is fit for
a particular purpose.
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, ex plicitly or
implicitly, to any party any patent rights, licenses, or any other intellectual property rights.
This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent
authorities.
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted
to be suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support
or life-sustaining equipment are specifically not recommended by Melexis.
The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance,
storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missile s for such
weapons: 2) civil firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any
applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or g oods and that can be used as a means of
violence in an armed conflict or any similar violent situation.
The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/termsand-conditions.
This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)
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