DVK91209

MLX91209 Datasheet Hall Current Sensor IC in VA package 1. Features and Benefits 2. Application Examples Programmable high speed current sensor Programmable linear transfer characteristic Selectable analog ratiometric output Measurement range from 15 to 450mT Single die VA package RoHS compliant Wideband: DC to 250kHz Short response time 2µsec Lead free component, suitable for lead free soldering profile 260°C (target), MSL1 AEC-Q100 Automotive Qualified Inverter applications in HEV and EV BLDC motor current monitoring AC/DC converters Over current detection circuit Figure 1: Typical Current Sensing Application 3. General Description The MLX91209 is a monolithic programmable Hall sensor IC featuring the planar Hall technology, which is sensitive to the flux density applied orthogonally to the IC surface. The sensor provides an output signal proportional to the applied magnetic flux density and is preferably suited for current measurement. The transfer characteristic of the MLX91209 is programmable (offset, gain). The linear analog output is designed for applications where a very fast response is required, such as inverter applications. In a typical application, the sensor is used in combination with a ring shaped soft ferromagnetic core. The Hall IC is placed in a small air gap and the current conductor is passed through the inner part of the ferromagnetic ring. The ring concentrates and amplifies the magnetic flux on the Hall sensor IC, which generates an output voltage proportional to the current flowing in the conductor. 4. Ordering Information Product Temperature Package Option Code Packing Form Default Sensitivity MLX91209 L (-40°C to 150°C) VA CAA - 000 BU/CR 50 mV/mT (prog: 5..150mV/mT) MLX91209 L (-40°C to 150°C) VA CAA - 001 BU/CR 15 mV/mT (prog: 5..150mV/mT) MLX91209 L (-40°C to 150°C) VA CAA - 002 BU/CR 7.3 mV/mT (prog: 5..150mV/mT) MLX91209 L (-40°C to 150°C) VA CAA - 003 BU/CR 19 mV/mT (prog: 5..150mV/mT) MLX91209 L (-40°C to 150°C) VA CAA - 005 BU/CR 8.78mV/mT (prog: 5..150mV/mT) MLX91209 L (-40°C to 150°C) VA CAA - 006 BU/CR 6.9 mV/mT (prog: 5..150mV/mT) Table 1: Ordering Information 390109120901 Rev.013 Page 1 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package Legend: Temperature Code: Package Code: Option Code: L from -40°C to 150°C ambient temperature VA SIP4-VA package, refer to Chapter 19 for detailed drawings CAx-000 for factory trimmed sensitivity 50mV/mT (prog: 5..150mV/mT) CAx-001 for factory trimmed sensitivity 15mV/mT (prog: 5..150mV/mT) CAx-002 for factory trimmed sensitivity 7.3mV/mT (prog: 5..150mV/mT) CAx-003 for factory trimmed sensitivity 19mV/mT (prog: 5..150mV/mT) CAx-005 for factory trimmed sensitivity 8.78mV/mT (prog: 5..150mV/mT) for factory trimmed sensitivity 6.9mV/mT (prog: 5..150mV/mT) CAx-006 CAA-xxx default straight leads (see chapter 19) CAR-xxx Trim and Form shape: 90ᵒ 2x2x91.3 (h=5.34mm) Bending-STD2 (see chapter 19) CAZ-xxx Trim and Form shape: SMD style TFT4K1 (see chapter 19) Packing Form: BU for Bulk, CR for Carton Reel - Radial taping – available for straight leads only CA for Carton Reel – Ammopack – available for straight leads only RE for Plastic Reel – available for selected Trim & Form options only Ordering Example: “MLX91209LVA-CAA-003-RE” MLX91209 Conventional Hall current sensor in SIP4 VA package, temperature range -40°C to 150°C. Sensitivity 19mV/mT. Parts delivered in Carton Reel (Radial Taping) Table 2: Legend for Ordering Information 5. Functional Diagram Figure 2: Block Diagram 390109120901 Rev.013 Page 2 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package Contents 1. Features and Benefits................................................................ ................................................................................................ ................................................................................................ ....................................................................... .......................................1 2. Application Application Examples ................................................................ ................................................................................................ ................................................................................................ ....................................................................... .......................................1 3. General Description................................................................ ................................................................................................ ................................................................................................ .......................................................................... ..........................................1 4. Ordering Information ................................................................ ................................................................................................ ................................................................................................ ....................................................................... .......................................1 5. Functional Diagram ................................................................ ................................................................................................ ................................................................................................ .......................................................................... ..........................................2 6. Glossary of Terms ................................................................ ................................................................................................ ................................................................................................ ............................................................................. .............................................4 7. Absolute Maximum Ratings ................................................................ ................................................................................................ .............................................................................................. ..............................................................5 8. Pin Definitions and Descriptions ................................................................ ................................................................................................ ....................................................................................... .......................................................5 9. General Electrical Electrical Specifications ................................................................ ................................................................................................ ....................................................................................... .......................................................6 10. Magnetic specification ................................................................ ................................................................................................ ................................................................................................ ................................................................... ...................................6 10.1. Sensor active measurement direction....................................................................................................7 11. Analog output specification ................................................................ ................................................................................................ ............................................................................................ ............................................................7 11.1. Timing specification ................................................................................................................................7 11.2. Accuracy specification ............................................................................................................................ 8 11.3. Remarks to the achievable accuracy ......................................................................................................8 12. Programmable items ................................................................ ................................................................................................ ................................................................................................ ...................................................................... ......................................9 12.1. Parameter table ......................................................................................................................................9 12.2. Sensitivity programming (RG, FG) ..........................................................................................................9 12.3. Offset / output quiescent voltage programming (VOQ) ........................................................................9 12.4. Output ratiometry (ENRATIO) ................................................................................................................9 12.5. Sensitivity temperature drift programming (TC1, TC2COLD, TC2HOT) ................................................10 12.6. Offset temperature drift programming (OFFDR2C, OFFDR2H) ............................................................10 12.7. Noise filter (NOISEFILT)......................................................................................................................... 10 12.8. Identification code (ID) ......................................................................................................................... 10 13. SelfSelf-diagnostic ................................................................ ................................................................................................ ................................................................................................ .............................................................................. .............................................. 11 14. Recommended Application Diagrams ................................................................ ................................................................................................ ........................................................................... ........................................... 12 14.1. Resistor and capacitor values ...............................................................................................................12 14.2. Pull down resistor for diagnostic low ...................................................................................................12 15. Typical performance................................................................ ................................................................................................ ................................................................................................ ..................................................................... ..................................... 13 16. Standard Standard information regarding manufacturability of Melexis products with different soldering processes. processes. 14 17. ESD Precautions ................................................................ ................................................................................................ ................................................................................................ ........................................................................... ........................................... 15 18. FAQ ................................................................ ................................................................................................ ................................................................................................ .............................................................................................. ..............................................................15 Package Information ................................................................ ................................................................................................ ................................................................................................ ......................................................................... ......................................... 15 19. ................................................................ ................................................................................................ ................................................................................................ ................................................................................................ ...................................................................... ...................................... 15 19.1. Package Marking & Hall Plate Position .................................................................................................15 19.2. VA / SIP 4L (single in-line package) .......................................................................................................16 19.3. Trim and form type: 90° 2x2x91.3 (h=5.34mm); Bending-STD2 (CAR-xxx) ..........................................17 19.4. Trim and form type: SMD style TFT4K1 (CAZ-xxx) ................................................................................18 20. Contact................................................................ ................................................................................................ ................................................................................................ ......................................................................................... .........................................................19 21. Disclaimer................................ Disclaimer................................................................ ................................................................................................ ................................................................................................ ..................................................................................... ..................................................... 19 390109120901 Rev.013 Page 3 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 6. Glossary of Terms Terms Definition Tesla Units for the magnetic flux density, 1 mT = 10 Gauss TC Temperature Coefficient in ppm/deg C NC Not Connected ADC Analog to Digital Converter DAC Digital to Analog Converter LSB Least Significant Bit MSB Most Significant Bit DNL Differential Non Linearity INL Integral Non Linearity IMC Integrated Magneto Concentrator (IMC-Hall) PTC Programming Through Connector Table 3: Glossary of Terms 390109120901 Rev.013 Page 4 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 7. Absolute Maximum Ratings Parameter Symbol Value Units Vdd +10 V Reverse Supply Voltage Protection -0.3 V Positive Output Voltage(1) +10 V ±70 mA Reverse Output Voltage -0.3 V Reverse Output Current -50 mA Positive Supply Voltage (overvoltage) Output Current Iout Package Thermal Resistance (junction-to-ambient) θja is defined according JEDEC 1s0p board Operating Ambient Temperature Range θja 205 °C/W TA -40 to +150 °C Storage Temperature Range TS -55 to +165 °C ±3 T -55 to 155 °C 2 kV Magnetic Flux Density Maximum Junction Temperature ESD – Human Body Model (applicable for all pins) Table 4: Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (1) Valid for supply=10V or supply-pin floating. 8. Pin Definitions and Descriptions Pin № Name Type Function 1 VDD Supply Supply Voltage 2 OUT Analog Current Sensor Output 3 TEST/MUST Digital Test and Factory Calibration 4 GND Ground Supply Voltage Table 5: Pin definitions and descriptions It is recommended to connect the TEST/MUST pin to the Ground for optimal EMC performance. 390109120901 Rev.013 Page 5 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 9. General Electrical Specifications Operating Parameters: TA = -40°C to 125°C, Vdd = 4.5V to 5.5V, Iout = -2mA to 2mA, recommended application diagram, unless otherwise specified. Parameter Nominal Supply Voltage Supply Current Symbol Vdd Idd DC Load Current Maximum Output Current (driving capability) Output Resistance Output Capacitive Load Iout Imax Cload Output Resistive Load (pull-down resistor) Output Short Circuit Current (Permanent) Output Leakage current Rload Ishort Ratiometry enable detection Over-voltage detection (2) No output load, application mode, TA = -40°C to 150°C Rload in range [6kΩ, 100kΩ] Inside this range, output voltage reaches 3 and 97%Vdd Vout = 50% Vdd, RL = 6kΩ Output amplifier is optimized for the capacitive load range. Output resistive load for high linearity Vout_pd Output shorted permanent to Vdd Output shorted permanent to GND (1) High impedance mode TA = 150°C pull-down ≥ 10 kΩ Vout_HiZ_pd Vdd_uvd Vdd_uvh Vratio_d Vratio_h Vdd_ovd Vdd_ovh pull-down RL ≤ 25 kΩ, T≤125°C Low to High Voltage Hysteresis Low to High Voltage Hysteresis Low to High Voltage Hysteresis Ileak Linear Output Voltage Range Vout in [10%Vdd, 90%Vdd] (1) High-impedance mode levels (2) Under-voltage detection Test Conditions Min 4.5 9 Typ 5 12 -2 -2 1 1 Max 5.5 14 Units V mA 2 2 mA mA 5 10 Ω nF 6 kΩ Not destroyed Not destroyed 20 µA 10 90 %Vdd 3.0 0.2 4 0.01 6.5 0.05 5 4.0 0.45 4.5 0.5 7.6 0.7 %Vdd V V V V V V 3.3 0.3 Table 6: General electrical parameters Vout Hysteresis (1) Refer to section Self-diagnostic, Table 11. (2) According to the following diagram: Detected Voltage Vdd 10. Magnetic specification Operating Parameters TA = -40°C to 125°C, Vdd = 4.5V to 5.5V, unless otherwise specified. Parameter Magnetic field range Linearity Error Symbol B NL Programmable Sensitivity S Sensitivity programming Resolution Table 7: Magnetic specification 390109120901 Rev.013 Test Conditions / Comments Vdd in range [4.5V, 5.5V] Vout in [10%Vdd, 90%Vdd] Min ±15 -0.4 Typ 5 Sres 0.1 Page 6 of 19 Max ±450 +0.4 Units mT %FS 150 mV/mT % MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 10.1. Sensor active measurement direction Figure 3: Magnetic Field Direction 11. Analog output specification 11.1. Timing specification Operating Parameters TA = -40°C to 125°C, Vdd = 4.5V to 5.5V (unless otherwise specified). Parameter Refresh rate Step Response Time Symbol Trr Tresp Bandwidth BW Power on Delay TPOD Ratiometry Cut-off Frequency Fratio Test Conditions / Comments Delay between the input signal reaching 90% and the output signal reaching 90%, (2V step at the output, input rise time = 1µs) -Noise filter OFF -Noise filter ON -Noise filter OFF -Noise filter ON Vout =100% of FS Pull-down resistor ≤100kOhm During the Power-on delay, output will remain within the 10% fault band at all time. Min 0.8 Typ 1 Max 2 Units μs 2 5 3 6 μs μs 1 kHz kHz ms 250 70 250 Hz Table 8: Timing specification for high speed analog output in, Vout Response time 100 % 90% time 1 µs Figure 4: Response time definition 390109120901 Rev.013 Page 7 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 11.2. Accuracy specification Operating Parameters TA = -40°C to 125°C, Vdd = 4.5V to 5.5V (unless otherwise specified). Parameter (1) Thermal Offset Drift Symbol T Δ Voq Thermal Sensitivity Drift TC (2) RMS Output noise Nrms Ratiometry Error Offset ΔVoq Ratiometry Error Sensitivity ΔS Test Conditions In ref. to T = 35°C Vdd = 5V Voq = 50 ±0.2 %Vdd In ref. to T= 35°C Vdd = 5V S = 50mV/mT -Noise filter OFF -Noise filter ON S = 7.3mV/mT -Noise filter OFF -Noise filter ON Voq = 50%Vdd ΔVdd = 10%Vdd ΔVdd = 10%Vdd Min -10 Typ. Max 10 Units mV -1.5 0 +1.5 % of S 10 6 mVrms mVrms -0.4 +0.4 mVrms mVrms % of Voq -0.4 +0.4 % of S 2.8 1.9 Table 9: Accuracy specification for high speed analog output (1) Thermal offset drift specification is only valid when ENRATIO and PLATEPOL parameters are kept in their default configuration. (2) The RMS Ouput Noise depends on the factory sensitivity [mV/mT]. 11.3. Remarks to the achievable accuracy The achievable target accuracy depends on end-of-line calibration in the application. Resolution for offset calibration is better than 0.1%Vdd. Trimming capability is higher than measurement accuracy. End-of-line calibration can increase overall system accuracy. 390109120901 Rev.013 Page 8 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 12. Programmable items 12.1. Parameter table Parameter Bits Factory Setting Comment VOQ[11:0] 12 trimmed Quiescent output level (0 Gauss) adjustment RG[2:0] 3 trimmed Rough gain adjustment FG[9:0] 10 trimmed Fine gain adjustment ENRATIO 1 1 TC1[7:0] 8 trimmed Adjustment of the first order temperature compensation of the magnetic sensitivity TC2HOT[4:0] 5 trimmed Adjustment of the extra temperature compensation of the magnetic sensitivity at high temperature TC2COLD[4:0] 5 trimmed Adjustment of the extra temperature compensation of the magnetic sensitivity at low temperature OFFDR2C[5:0] 6 trimmed Adjustment of the offset drift at low temperature after the VGA OFFDR2H[5:0] 6 trimmed Adjustment of the offset drift at high temperature after the VGA NOISEFILT1 1 0 1 ID[47:0] 48 Programmed Ratiometry enablement 0 : Noise filter deactivated 1 : Noise filter enabled Melexis traceability ID Table 10: Customer programmable items 12.2. Sensitivity programming (RG, FG) The sensitivity can be programmed from 5 to 150 mV/mT, with the ROUGHGAIN (3 bits) and FINEGAIN (10 bits) parameters. 12.3. Offset / output output quiescent voltage programming (VOQ) VOQ) The offset is programmable with 12 bits in 1.5 mV steps over the full output range. This corresponds to a calibration resolution of 0.03 %VDD. (The typical step would be 5V/4096 = 1.22 mV, the actual step size can differ from the nominal value because of internal gain tolerance. The maximum step size of 1.5 mV is guaranteed). Note: for optimal performance over temperature, VOQ should be programmed in the range 2 to 3V. 12.4. Output ratiometry (ENRATIO) The ratiometry of the output versus the supply can be disabled by setting this bit to 0. Note: for optimal performance over temperature, ratiometry should always be enabled (ENRATIO=1). 1 Noise Filter enabled by default (NOISEFILT = 1) in MLX91209LVA-CAA-003. All other option codes use NOISEFILT = 0 in their default configuration 390109120901 Rev.013 Page 9 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 12.5. Sensitivity temperature drift programming (TC1, TC2COLD, TC2HOT) First order sensitivity temperature drift can be trimmed from -2000 to 2000ppm/K with TC1. The programming resolution is 40ppm/K. Second order sensitivity temperature drift can be trimmed from TC2COLD and TC2HOT. The programming resolution is 2ppm/K2 for TC2COLD and 0.6ppm/K2 for TC2HOT.The second order can also be seen as third order correction since cold and hot sides are independently adjusted. Note: for optimal performance over temperature, the first order sensitivity drift compensation (TC1ST) should not exceed ±500ppm/K. 12.6. Offset temperature drift programming programming (OFFDR2C, OFFDR2H) Offset temperature drift caused by the output amplifier can be compensated with these two parameters. This first order correction is done independently for temperatures over and below 25°C. Note: two additional parameters (OFFDR1C, OFFDR1H) are calibrated by Melexis to compensate for the offset temperature drift caused by the Hall element (before the variable gain amplifier). These parameters should not be adjusted on customer-side. 12.7. Noise filter (NOISEFILT) Setting this bit to 1 enables the noise filter, reducing noise and increasing response time. 12.8. Identification code (ID) 48 bits programmable identification code. 390109120901 Rev.013 Page 10 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 13. Self-diagnostic The MLX91209 provides self-diagnostic features to detect internal memory errors and over- / undervoltage conditions. These features increase the robustness of the IC functionality, as they prevent erroneous output signal in case of internal or external failure modes. Error Action Effect on Outputs Remarks Calibration Data CRC Error (at power up and in normal working mode) Fault mode High Impedance mode Pull down resistive load => Diag Low High Impedance mode 5ms max in high impedance followed by settling Power On delay Undervoltage Mode IC is reset High Impedance mode 300mV Hysteresis (typical) Overvoltage detection IC is reset High Impedance mode 500mV Hysteresis (typical) Table 11: Self diagnostic 390109120901 Rev.013 Page 11 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 14. Recommended Application Diagrams 14.1. Resistor and capacitor values Part Description Value Unit 100 nF C1 Supply capacitor, EMI, ESD C2 Decoupling, EMI, ESD 1-10(1) nF R1 Pull-down resistor 6-100 kΩ Table 12: Recommended Resistors and Capacitors Values (1) 10nF is recommended for better EMC and ESD performance. 14.2. Pull down resistor for diagnostic low Figure 5: Diagnostic low 390109120901 Rev.013 Page 12 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 15. Typical performance Figure 6: Thermal sensitivity drift. Figure 7: Thermal offset drift Figure 8: Non-linearity over temperature Figure 9: Phase shift over temperature. shunt shunt MLX91209 MLX91209 ≤3µs Figure 10: Response time with noise filter OFF. 390109120901 Rev.013 ≤6µs Figure 11: Response time with noise filter ON. Page 13 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 16. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile, etc.) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (https://www.melexis.com/en/tech-info/ic-handling-and-assembly/soldering) as well as trim&form recommendations (https://www.melexis.com/en/tech-info/ic-handling-and-assembly/lead-forming). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx 390109120901 Rev.013 Page 14 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 17. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 18. FAQ For which current range can the sensor be used? The magnetic field [mT] seen by the sensor for a given current [A] depends on the design of the enclosing ferromagnetic core (air gap size, material type, etc.). Therefore, the current range is not limited by the sensor itself, but rather by the magnetic properties of the core (saturation, hysteresis, etc.). What is the default sensitivity of the sensor? The sensor is factory calibrated for a typical sensitivity of 50mV/mT. How can I program the sensor? The sensor uses a 3 wires communication protocol (Vdd, GND and Out) and can be programmed using Melexis Universal Programmer (PTC-04), with the dedicated daughter board PTC04-DB-HALL05. For more information, please visit http://www.melexis.com/Hardware-and-Software-Tools/Programming-Tools/PTC-04-568.aspx. 19. Package Information 19.1. Package Marking & Hall Plate Position Figure 12: VA/SIP 4L Package Marking and Hall Plate Position 390109120901 Rev.013 Page 15 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 19.2. VA / SIP 4L (single inin-line package) 390109120901 Rev.013 Page 16 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 19.3. Trim and form type: 90° 2x2x91.3 2x2x91.3 (h=5.34mm); BendingBending-STD2 (CA (CAR CAR-xxx) 390109120901 Rev.013 Page 17 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 19.4. Trim and form type: SMD style TFT4K1 (CA (CAZ CAZ-xxx) 390109120901 Rev.013 Page 18 of 19 MLX91209 March 2021 MLX91209 Datasheet Hall Current Sensor IC in VA package 20. Contact For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our Direct Sales team and get help for your specific needs: Europe, Africa Email : sales_europe@melexis.com Americas Email : sales_usa@melexis.com Asia Email : sales_asia@melexis.com 21. Disclaimer The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. This documentation is in fact provided without warranty, term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability, satisfactory quality, non-infringement, and fitness for purpose. 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The confidentiality obligations set forth in this disclaimer will have indefinite duration and in any case they will be effective for no less than 10 years from the receipt of this document. This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject to the exclusive jurisdiction of the courts of Brussels, Belgium. The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other provisions. The previous versions of this document are repealed. Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2021) IATF 16949 and ISO 14001 Certified 390109120901 Rev.013 Page 19 of 19 MLX91209 March 2021