MLX75030CLQ-AAA-000-RE

MLX75030 Universal ActiveLight Sensor Interface Datasheet Features & Benefits   Two independent simultaneously operating active light measurement channels Integrated DC light cancellation circuitry for active light channel DC light suppression  Two logarithmic ambient light channels  High input capacitance tolerant input current terminals  Extremely high degree of adaptability for different optical systems  Stand-by and sleep modes  Integrated 16bit ADC  Integrated temperature sensor  Digital communication interface via SPI  Integrated watchdog timer  High safety design by comprehensive diagnostic and monitoring functions  Minimum amount of external components  Small-size SMD package QFN24 4x4 mm Ordering Information Temperature Code R C 20 21 GNDA GNDAMB DIAGAMB 15 14 13 75030 A 12345 1025 12 Ambient PDD 11 Ambient PDC 10 ActiveLight PDB ` CEXT 22 VCCD 23 GNDD 24 1 2 3 4 5 6 \CS REVISION 008 - AUG 2018 3901075030 Drive LED B Drive LED A 16 MOSI Touch Screen Wake-up on Proximity 19 17 MISO Driver/passenger discrimination Shunt R- 18 AOUT Touch-less gesture recognition VCCA  SCLK Optical proximity sensing & display dimming Pin Description Shunt R GND   Packing Form Code RE or TU RE or TU R = -40 to 105°C, C = 0°C to 70°C LW = = Quad Flat Package (QFN) with wettable flanks BAA-000 = Design Revision RE = Reel, TU = Tube MLX75030RLW-BAA-000-RE Application Examples  Option Code BAA-000 BAA-000 \WT Legend: Temperature Code: Package Code: Option Code: Packing Form: Ordering example: Package Code LW LW \MR Product Code MLX75030 MLX75030 9 ActiveLight PDA 8 \WAKE-UP 7 DR 1 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 1. General Description The MLX75030 Universal ActiveLight Sensor Interface has been designed to allow easy and robust dual-channel optical reflection and dual channel ambient light measurement. Therefore it is ideally suited for the design of responsive human-machine interfaces (HMI) that require proximity or gesture detection in environments subject to wide background light level variations, possibly in combination with display dimming. The MLX75030 IC consists of two optical sensor interface parts. Part one is optimized for active light measurements and is designed to control up to 2 external LEDs and to sense modulated light current from up to 2 external photodiodes on independent channels A and B. The ActiveLight detection is virtually independent from background light by means of integrated hardware-level ambient light suppression. Part two consists of two logarithmic current sensors C and D, which measure the photocurrent of externally connected photodiodes. Simple and programmable operation is ensured by internal control logic, configurable user registers and SPI communication. 2. Functional Block Diagram Figure 1 : MLX75030 Functional Block Diagram REVISION 008 - AUG 2018 3901075030 2 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 3. Application Diagram Beam shaping optics SUN NIR LED A Photodiode A scene NIR LED B MLX75030 or MLX75031 Photodiode B NIR transparent face place Figure 2 : Application diagram of a dual channel active reflection detector with 2 photodiodes and 2 LEDs. The measured signal is virtually independent of background light from the sun or other sources. REVISION 008 - AUG 2018 3901075030 3 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Table of Contents 1. General Description ............................................................................................................................... 2 2. Functional Block Diagram ...................................................................................................................... 2 3. Application Diagram .............................................................................................................................. 3 Table of Contents ...................................................................................................................................... 4 4. Glossary of Terms .................................................................................................................................. 6 5. Absolute Maximum Ratings ................................................................................................................... 7 6. Pin Definitions & Descriptions ............................................................................................................... 8 7. General Electrical Specifications .......................................................................................................... 10 8. Sensor Specific Specifications .............................................................................................................. 11 9. Detailed Description ............................................................................................................................ 16 9.1. Analog Sensor Functions .................................................................................................................. 16 9.1.1. Active Light Sensor ..................................................................................................................... 16 9.1.1.1. Active Light Channel DC Light Measurement.................................................................... 17 9.1.2. ActiveLight Channel DC Light compensation ............................................................................ 17 9.1.3. Ambient Light Sensor ................................................................................................................. 19 9.1.3.1. Normal Operation ............................................................................................................... 19 9.1.3.2. Calibration and temperature compensation .................................................................... 20 9.1.3.3. Diagnostics Mode Operation ............................................................................................. 21 9.1.4. Temperature Sensor ................................................................................................................... 21 9.1.5. DAC .............................................................................................................................................. 22 9.1.6. LED Driver.................................................................................................................................... 23 9.1.7. POR .............................................................................................................................................. 23 9.2. SPI ...................................................................................................................................................... 23 9.2.1. General Description of SPI Interface ......................................................................................... 23 9.2.2. Detailed Explanation of SPI Instruction Words ......................................................................... 27 9.2.2.1. NOP – Idle Command ......................................................................................................... 27 9.2.2.2. CR – Chip Reset Command ................................................................................................. 27 9.2.2.3. RSLP/CSLP – Request Sleep/Confirm Sleep ....................................................................... 27 9.2.2.4. RSTBY/CSTBY - Request Standby/Confirm Standby .......................................................... 28 9.2.2.5. NRM – Normal Running Mode ........................................................................................... 28 9.2.2.6. SM – Start Measurement ................................................................................................... 28 9.2.2.7. RO – Start Read-Out ........................................................................................................... 30 9.2.2.8. SM+RO - Start Measurement combined with Read-Out .................................................. 33 9.2.2.9. WR/RR – Write/Read Register ........................................................................................... 34 9.2.2.10. SD – Start Diagnostics....................................................................................................... 35 9.3. Internal Status Flags ......................................................................................................................... 37 9.4. User Registers Overview................................................................................................................... 39 9.4.1. SetAna register ........................................................................................................................... 40 9.4.2. SetAH register ............................................................................................................................. 41 9.4.3. SetAL register .............................................................................................................................. 41 9.4.4. SetBH register ............................................................................................................................. 42 9.4.5. SetBL register .............................................................................................................................. 42 REVISION 008 - AUG 2018 3901075030 4 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4.6. SetPF register .............................................................................................................................. 43 9.4.7. Err register .................................................................................................................................. 44 9.4.8. Rst register .................................................................................................................................. 45 9.4.9. DCComp register ......................................................................................................................... 45 9.4.10. GainBuf register ........................................................................................................................ 46 9.4.11. Calib1/Calib2 register ............................................................................................................... 47 9.4.12. EnChan register ........................................................................................................................ 51 9.4.13. Tamb register ............................................................................................................................ 52 9.5. Window Watchdog Timer ................................................................................................................ 53 9.6. Reset Behaviour ................................................................................................................................ 55 9.7. Wake-up from Sleep or Standby ...................................................................................................... 56 9.8. CRC Calculation ................................................................................................................................. 57 9.9. Global Timing Diagrams.................................................................................................................... 58 10. Performance Graphs.......................................................................................................................... 59 10.1. ActiveLight Channel DC Measurement .......................................................................................... 59 10.2. Temperature Sensor Characteristics ............................................................................................. 59 10.3. Ambient Light Channel C ................................................................................................................ 59 10.4. Ambient Light Channel D................................................................................................................ 59 11. Application Information..................................................................................................................... 60 11.1. Application circuit for 2 ActiveLight channels and 2 ambient light channels .............................. 60 12. Application Comments ...................................................................................................................... 61 13. Tape and Reel Specification ............................................................................................................... 62 14. Standard information regarding manufacturability of Melexis products with different soldering processes............................................................................................................................................ 65 15. ESD Precautions................................................................................................................................. 66 16. Package Information.......................................................................................................................... 66 17. Marking Information ......................................................................................................................... 67 18. Disclaimer .......................................................................................................................................... 68 REVISION 008 - AUG 2018 3901075030 5 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 4. Glossary of Terms ADC CR CRC CS CSLP CSTBY CTRL DAC DC DR EMC GNDA GNDD IR LED LPF LSB MISO MOSI MR MSB MUX NOP NP NRM OSC OTP OTR PD POR RCO RO RR RSLP RSTBY S&H SCLK SC-LPF SM SNR SPI TIA VBATT_30 VCCA VCCD VDD_30 VSENSE WDT WR WT uC Analog-Digital converter Chip Reset Cyclic Redundancy Check Chip Select Confirm Sleep Confirm Standby Control Signal Digital to Analog Converter Direct Current Device Ready Electromagnetic Compatibility Ground for analog Blocks of MLX7530 Ground for digital Blocks of MLX75030 Infrared Light emitting diode Low-pass filter Least Significant Bit Master In Slave Out Master Out Slave In Master Reset Most Significant Bit Multiplexer No Operation Number of Pulses Normal Running Mode Oscillator One time programmable Optical transfer ratio Photodiode Power on reset RC-Oscillator Read-Out Read Register Request Sleep Request Standby Sample and Hold SPI Shift Clock Switched Capacitor biquad Low-pass filter Start Measurement Signal-to-Noise Ratio Serial Peripheral Interface Transimpedance Amplifier VBATT which is supplied from connection 30 of the car Supply Voltage for the analog blocks Supply Voltage for the digital blocks VDD which is supplied from connection 30 of the car Voltage across the shunt resistor Watchdog Timer Write Register Watchdog Trigger Microcontroller REVISION 008 - AUG 2018 3901075030 6 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 5. Absolute Maximum Ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Parameter Symbol Condition Supply voltage range VDD -0.3 5.0 V Terminal current Iterminal per bondpad -20 +20 mA Vterminal Pins 1-8, 14-24 -0.3 VDD+0.3 V -0.3 VDD+0.3 V -40 +150 °C +150 °C 320 mW Terminal voltage 1 Pins 9-13 Storage temperature Tstg Junction temperature Tj Power dissipation 2 Min Max Units Ptot For max ambient temperature of 100°C and Teta_ja = 154K/W ESDHBM Human body model, acc. to AEC-Q100-002 -2 2 kV Pins 9-13 -1 1 kV ESD capability of any pin (Human Body Model) ESD capability of any pin (Charge device model) ESDCDM Charge device model acc. to AEC- Q100-011 -750 +750 V Maximum latch–up free current at any pin ILATCH JEDEC- Standard EIA / JESD78 -100 +100 mA Table 1 : Absolute Maximum Ratings 1 Pins 9-13 require special care with regard to the used ESD protection devices, since these nodes of the design are very sensitive to substrate noise and/or leakage currents. 2 The Power dissipation is valid for JA values for the 24 Pin QFN 4x4 package according to Table 27. REVISION 008 - AUG 2018 3901075030 7 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 6. Pin Definitions & Descriptions Pin № Name Functional Schematic Type Function VCCD PAD 1 \MR Digital Output Master Reset VCCD 2 PAD \WT Digital Input Watchdog Trigger Digital Input SPI Shift Clock VCCD 3 PAD SCLK VCCD EN 4 PAD MISO Digital Output SPI Data Output VCCD 5 PAD MOSI Digital Input SPI Data Input Digital Input Chip Select VCCD PAD 6 \CS VCCD PAD 7 DR Digital Output Device Ready Digital Input Normal Mode Analog Input IR Photo Diode A Analog Input IR Photo Diode B Analog Input Ambient Light Photo Diode C Analog Input Ambient Light Photo Diode D VCCD PAD 8 \WAKE-UP 9 ActiveLight Detect PDA 10 ActiveLight Detect PDB 11 Ambient PDC VCCA PAD VCCA PAD VCCA PAD VCCA 12 Ambient PDD REVISION 008 - AUG 2018 3901075030 PAD 8 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet VCCA 13 DIAGAMB PAD Analog Input Ambient channel diagnostic VCCA PAD 14 GNDAMB Analog I/O Ground Ambient Light Channels 15 GNDA Ground Ground 16 VCCA Supply Regulated Power Supply 17 AOUT Analog I/O Analog Test Output, connect to VCCA VCCA 18 Shunt R GND PAD Shunt R- PAD Analog Input Shunt resistor feedback to Ground Analog Input Shunt resistor feedback VCCA 19 VCCA 20 PAD Drive LED B Analog Output Drives FET gate for IR LED Emitter B Analog Output Drives FET gate for IR LED Emitter A VCCA PAD 21 Drive LED A 22 CEXT 23 VCCD Supply Regulated external power supply 24 GNDD Ground Ground VCCA PAD Analog Input External blocking Cap, connected to GNDA Table 2 : Pin definitions and descriptions REVISION 008 - AUG 2018 3901075030 9 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 7. General Electrical Specifications DC Operating Parameters TA = -40°C to 105°C (R version), TA = 0°C to 70°C (C version), VDD = 3.0V to 3.6V (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Supply Voltage range VDD 3.0 3.3 3.6 V Supply Current (active Mode) IDD without photodiode dc current 6 mA Standby Current ISBY @ Vcc=3.6V, T=30°C 500 uA Sleep Current ISleep @ Vcc=3.6V, T=30°C Operation Temperature Range Pull-up resistor Pull-down resistor TA Rpu Rpd 50 uA 105 °C High-level Input Voltage VIH 0.7 VDD VDD V Low-level Input Voltage VIL 0 0.3 VDD V Hysteresis on Digital Inputs VHYST High Output Voltage (not on pin MR) VOH CL=30pF 0.8 VDD VDD V Low Output Voltage (not on pin MR) VOL CL=30pF 0 0.2 VDD V Input leakage ILK -10 10 µA Tri-state Output Leakage Current IOZ -10 10 µA Input Capacitance, per Pin CIN Output voltage Low, Pin MR VOutL -40 for SCLK and \CS for MOSI 50k 50k Ohm Ohm 0.28 V 10 IODC=2mA pF 0.1 Table 3 : Electrical specifications REVISION 008 - AUG 2018 3901075030 10 of 68 V MLX75030 Universal ActiveLight Sensor Interface Datasheet 8. Sensor Specific Specifications DC Operating Parameters TA = -40°C to 105°C, TA = 0°C to 70°C (C version), VDD = 3.0V to 3.6V (unless otherwise specified) ActiveLight Channels (Detectors A & B) Parameter Symbol Active light signal optical transfer ratio OTR  dc sunlight signal fast full scale transition at Isunmax Test Conditions I LED I PDAB Min Typ Max 30 80000 ISun 140 900 tsunrise 3.5 min. relative active light modulation (referred to received IR signal) I PDAB Carrier frequency range for ActiveLight measurement signal Input capacitance PDA, PDB f0 selectable via “SetPF” register, see also 9.4.6 CPDA,B At 1.0 V reverse bias DC light measurement range DC light measurement offset DC light measurement slope DC light measurement linearity error DC light measurement word length DC light measurement resolution TIA Test pulse IDC range IDC offset IDC sens At IDC = 0uA Temperature coefficient of TIA Test pulse TC ADCTIA_test_00 TIA Test pulse step width ADCTIA_test_step Temperature coefficient of TIA Test pulse step width TIA Test pulse step width variation TC ADCTIA_test_step Idc range: 0uA -> 275uA ADCTIA_test_00  ADC _ TIA _ TEST _ STEP for averaging of 8 measurements T=27°C, DACA6=0, DACA7=0 Gain Anti-alias Filter=2 ADC Buffer bypassed DACA6=0, DACA7=0 Gain Anti-alias Filter=2 ADC Buffer bypassed T=27°C, Gain Anti-alias Filter=2 ADC Buffer bypassed Gain Anti-alias Filter=2 ADC Buffer bypassed Gain Anitalias Filter=2 ADC Buffer bypassed uA ms - 400Hz BW, - max LED current of 1000mA - 25°C - dc sun constant - ActiveLight response time per channel 2.5ms I PDAB _ min Units 0.3 45.7 0 4096 115 7168 150 5 16 13 35035 36182 109.4 kHz 10 pF 275 10240 184 12 uA LSB LSB/uA % Bit Bit LSB 37570 -2.78 4458 5932 LSB/K 7770 -4.8 5 % LSB LSB/K 10 % Error condition Err6 Critical error detected on TIA output, is TIA output outside 1.1V+/- (0.65 … 0.75V) Note:  Critical error may occur if the referring active light Channel is disabled and the according diagnostic function is enabled (see EnChan register).  Critical error may occur after enabling of the referring active light Channel due to analog settling time. Table 4 : ActiveLight sensor channels specifications REVISION 008 - AUG 2018 3901075030 11 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet ActiveLight Channel DC-Light Compensation Parameter Symbol Test Conditions Maximum ActiveLight Signal DC-Light compensation range RSCOMP_max in percent of LED current DC_COMP_IC1,2,3,4,5=15 DAC=255 ActiveLight Signal Compensation Offset RSCOMP_Offset in percent of LED current @ Idc = 0uA Range of segment 1 Range of segment 2 Range of segment 3 Range of segment 4 Full compensation level @ segment 1 Iamb_1 Iamb_2 Iamb_3 Iamb_4 Icomp_1 Full compensation level @ segment 2 Icomp_2 Full compensation level @ segment 3 Icomp_3 Full compensation level @ segment 4 rst 1 corner dc current nd 2 corner dc current rd 3 corner dc current th 4 corner dc current DC_COMP_IC1,2,3,4,5 = 15 DAC=255 in percent of LED current Min Typ 15 20 Max Units % 0.8 % 7.2 10.0 12.0 uA 40.0 45.0 50.0 uA 135.0 150.0 165.0 uA 440.0 500.0 560.0 uA 1.5 3.5 4.7 % 5.1 7.7 10.3 % 9.5 13.7 17.9 % Icomp_4 13.6 18.8 24.0 % Full compensation level @ 900uA (max DC sunlight) Icomp_5 15.0 20.7 25.8 % Full compensation level @ segment 1 Full compensation level @ segment 2 Full compensation level @ segment 3 Full compensation level @ segment 4 Full compensation level @ 900uA (max DC sunlight) DC_COMP_IC1 = 15, other =0 DC_COMP_IC2 = 15, other =0 DC_COMP_IC3 = 15, other =0 DC_COMP_IC4 = 15, other =0 DC_COMP_IC5 = 15, other =0 Icomp_1 Icomp_2 Icomp_3 Icomp_4 Icomp_5 DC_COMP_IC1,2,3,4,5 = 7 DAC=255 in percent of LED current 0.65 2.4 4.4 6.3 7.1 1.6 3.6 6.4 8.85 9.6 2.2 4.8 8.4 11.4 12.1 % % % % % IC_1 IC_2 IC_3 IC_4 IC_5 in percent of LED current in percent of LED current in percent of LED current in percent of LED current in percent of LED current 1.4 2.1 5.0 4.4 2.0 2.3 2.9 6.6 5.9 3.0 2.8 3.6 8.2 7.3 4.1 % % % % % Table 5: DC light compensation specifications REVISION 008 - AUG 2018 3901075030 12 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Ambient Light Channels (detectors C, D) Parameter Input current range for detectors C Input current range for detectors D input current threshold level C input current threshold level D Input capacity on ambient PDC Input capacity on ambient PDD Transfer function logarithmic Symbol Test Conditions Min Iambc Typ Max Units 0.01 1040 uA Iambd 0.0005 20 uA Iambc_detect Iambd_detect Cambc Cambd 333 5.5 1 100 nA nA nF pF at 0.6V at 0.6V See section 10.3 and 10.4 Vamb Output Ambient Channel C At VCC=3,3V, Iin=100uA 29464 32768 36072 LSB Output Ambient Channel D At VCC=3,3V, Iin=10uA 32768 36072 LSB Slope Ambient Channel C At VCC=3,3V and 105°C 5300 5900 6500 LSB/dec Slope Ambient Channel D At VCC=3,3V and 105°C 5300 5900 6500 LSB/dec Ambient Channels Linearity Error for Iin ≥ Iambx_detect including temperature compensation 3 5 % 29464 Ambient light word length Ambient light channel resolution for averaging of 16 measurements See section 9.1.3 for a detailed explanation of this parameter. for Iin ≥ Iambx_detect Ambient light response time Ambient PDC voltage Ambient PDD voltage Vambc Vambd At VCC=3,3V, Iin=100uA 0.4 At VCC=3,3V, Iin=10uA 0.4 16 bits 13 bits 0.6 0.6 3 ms 0.9 0.9 V V Error condition Err3 Note:  Err3 is set if output voltage OUTN or OUTP of the ambient channel SC filter is out of range (meaning: 60% of VCCA). Critical error may occur after enabling of the referring Ambient Light Channel due to analog settling time. Table 6 : Ambient light channel specifications REVISION 008 - AUG 2018 3901075030 13 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Temperature Sensor Parameter Symbol Temp. sensor range  Test Conditions Temp. sensor transfer 3 function V @ VDD=3,3V Temp. sensor error error@0…105°C @ VDD=3,3V, o Tamb = 0…105 C Temp. response time tresp_ Min Typ -40 -82 -67 Max Units 105 °C -51 LSB/K ±5 °C 1 Temp. sensor word length for averaging of 16 measurements Temp. sensor resolution s 16 bits 13 bits Table 7 : Temperature sensor specifications LED Driver Parameter Symbol Test Conditions Min Max Units Shunt = 1 Ω 1.05 993 mA Shunt resistor values 1 10 Ohm Shunt voltage 1.05 993 mV 420 us mV us LED current Rising and falling time DC offset level Time before pulse Typ 3 1 See section 9.4.1 Tdc_pulse 47.5 External important transistor parameter Max gate source voltage VGS VDD=3V 2 V Max Gate/Basis current IG/B VDD=3V 400 uA Error condition Err5 Err5 difference between Vdac and Vsense. Detection level larger 100mV Table 8 : LED driver specifications POR Parameter Symbol POR on threshold voltage POR off threshold voltage VPOR-ON VPOR-OFF POR hysteresis voltage VHYS Test Conditions Min Typ Max Units 1.58 1.68 2.75 2.85 V V 60 130 mV Table 9: Power on Reset specifications 3 This value is stored in the Calib1 Register REVISION 008 - AUG 2018 3901075030 14 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet SPI and Timing Parameter Symbol Test Conditions Min Typ 8 bit 0.5 1 5 MHz 2.5 ±7.5% MHz SPI word length Max Units SPI Clock Frequency fSCLK = 1/tSCLK Frequency of Internal RC Oscillator fRCO = 1/TRCO CS low prior to first SCLK edge tcs_sclk 50 CS high after last SCLK edge tsclk_cs 50 ns CS high time between transmissions tcs_inter 50 ns Time between CS high and DR low tcs_dr 0 Min low time on WAKE_UP pin twu_l 100 µs Min low time on WT pin twt_l 10 µs WDT initial active window time twdt_init WDT open window time WDT closed window time MR low time during reset tMR Start-up time after power-on tstartup Start-up time after power-on for SPI tstartup_SPI Start-up time after wake-up from sleep Start-up time after wake-up from standby After POR, Watchdog Reset and Wake-Up ns 21.84 4 (232us) µs 140 ±7.5% ms twdt_open 70 ±7.5% ms twdt_closed 70 ±7.5% ms 2 ±7.5% ms 50 ±7.5% ms 15 µs twakeup_slp 50 ±7.5% ms twakeup_stby 50 ±7.5% ms After Watchdog Reset Error condition Err2 RCO stuck at High or Low Error condition Err4 Internal voltage regulator : err4 is set if the regulator does not start (detection threshold in the range [1V;2V] Table 10 : Serial peripheral interface specifications 4 with random measurement start, the max time can be up to 232us, if an autozeroing phase of the IC is executed. REVISION 008 - AUG 2018 3901075030 15 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9. Detailed Description 9.1. Analog Sensor Functions 9.1.1. Active Light Sensor The MLX75030 works with two separate transmit- and receive-channels A and B. In order to perform an active light measurement, carrier modulated light signal bursts are transmitted by the LED(s) and received by the ActiveLight channel detectors connected to the pins 9 and 10. Both receive-channels can work separate or in parallel. The measured ActiveLight signal current is amplified and converted to digital numbers by the on-board ADC by following formula: AActiveLightADC  I ActiveLightPD 4.10 4 * K DEMOD * GAIN _ ADJ _ AA * GAIN _ BUF  215 V 50,3 LSB Where      is the ActiveLight signal value in DN is the ActiveLight signal current in uA is a correlation gain value between 0.25 and 0.5, depending on the setting of Tdem bits in register SetAna is the Anti-aliasing filter gain, set by SetAL and SetBL registers, defaulting to value 2 is the ADC input buffer gain, set by SetAna and GainBuf registers, defaulting to value 1 It is recommended to use the default values of . REVISION 008 - AUG 2018 3901075030 and . It is recommended to optimize the value of 16 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.1.1.1. Active Light Channel DC Light Measurement The input DC current compensation circuitry of the transimpedance amplifier is able to supply and measure the dc current supplied to the photodetector. Both active light channels are identical in structure. In order to reach a feasible resolution in the current range of interest (low currents in the range up to 275uA), the measurement characteristic will saturate for currents above the IDC current range, however the compensation circuit is nevertheless able to supply the specified current levels up to 900uA to the detector. The given ADC word length for the active light channel dc light data is 16Bit. The DC light measurement can be used to estimate ambient light conditions and compensate DC light dependent parameters (see next section). MLX75308BA DC light measurement at rain channels 60000 55000 50000 45000 PDA ADC out [LSB] 40000 PDB 35000 30000 25000 20000 15000 10000 5000 0 0 50 100 150 200 250 300 350 400 450 500 Idc [uA] Figure 3: Typical ActiveLight channel DC measurement characteristics for both channels A and B 9.1.2. ActiveLight Channel DC Light compensation Under certain operating conditions, the spectral sensitivity of some photodiodes is not constant and varies with the amount of (infrared) dc-light received. For the ActiveLight measurements this means that the ActiveLight signal can change rapidly if the sensor experiences highly changing sunlight conditions, even if all other conditions are constant. This results in reduced ActiveLight signal sensitivity of the system under changing dc-light conditions. The variation of the ActiveLight signals as a function of DC-light can be partially compensated by automatically adapting the amplitude of the sensors’ transmitted infrared light pulses for ActiveLight measurement. In order to make the system as flexible as possible, the compensation can be adapted to different photodiode types by definition of the compensation characteristics as a piecewise linear curve like described in Figure 4. The values of the 5 corner points of the curve can be defined by the corresponding 4-Bit words PD_COMP_ICx (x = 1..5) in the register maps, see section 9.4. The PD light compensation can be enabled by setting the EN_PDCOMP bit to “1”. In order to calculate the decimal values PD_COMP_ICx (x = 1..5) for a certain photodiode, one has to measure the relative ActiveLight signal levels px at 5 different DC light levels Iamb_x while the EN_PDCOMP is set to "0" (a calculation example is given below, where is the measured ActiveLight signal at DC light signal ): p0 = pulse level at (Iamb_0 = 0) = 1 (this is the 100% reference) REVISION 008 - AUG 2018 3901075030 17 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet p1 = pulse level at (Iamb_1 = 10uA) = e.g. 0.97440 = A @ Iamb _ 0  215 A @ Iamb _ 1  215 p2 = pulse level at (Iamb_2 = 45uA) = e.g. 0.94224 = A @ Iamb _ 0  215 A @ Iamb _ 2  215 p3 = pulse level at (Iamb_3 = 150uA) = e.g. 0.91556 = … p4 = pulse level at (Iamb_4 = 500uA) = e.g. 0.89858 = … p5 = pulse level at (Iamb_5 = 900uA) = e.g. 0.89477 = … Based on these relative ActiveLight pulse levels, one can calculate the following parameters (x = 1..5): rcomp _ i  3  105 1  px  ycomp_1 ycomp_2 ycomp_3 ycomp_4 ycomp_5 = 1.285714 -0.28571 0 0 0 -1.28571 1.714286 -0.42857 -1.8E-17 1.78E-17 0 -1.42857 1.857143 -0.42857 -7.9E-17 0 0 -1.42857 2.678571 -1.25 0 0 0 -2.25 2.25 • rcomp_1 rcomp_2 rcomp_3 rcomp_4 rcomp_5 For the calculation example, we get the following values: rcomp_1 rcomp_2 rcomp_3 rcomp_4 rcomp_5 = 7.68E-07 1.73E-06 2.53E-06 3.04E-06 3.16E-06 The settings PD_COMP_ICx (x = 1..5) can be derived from the y comp_x (x = 1..5) as follows: PD_COMP_IC1[3:0] = round ( PD_COMP_IC2[3:0] = round ( PD_COMP_IC3[3:0] = round ( PD_COMP_IC4[3:0] = round ( PD_COMP_IC5[3:0] = round ( ycomp _ 1 0.4  0.132 10 6 ycomp _ 2 0.4  0.165 10 6 ycomp _ 3 0.4  0.334 10 6 ycomp _ 4 0.4  0.334 10 6 ycomp _ 5 0.4  0.180 10 6 , 0) , 0) , 0) , 0) , 0) For the calculation example, this means: PD_COMP_IC1[3:0] = 9dec PD_COMP_IC2[3:0] = 14dec PD_COMP_IC3[3:0] = 7dec PD_COMP_IC4[3:0] = 5dec PD_COMP_IC5[3:0] = 3dec REVISION 008 - AUG 2018 3901075030 18 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet These values can be written inside the corresponding registers, see section 9.4. When the PD compensation is enabled (EN_PDCOMP = "1"), the compensation will modulate the LED current of the ActiveLight channels. ICOMP [in % of LED current] For IC_5 = 0 -> Icomp_4 = Icomp_5 Icomp_4 Icomp_3 Icomp_2 Icomp_1 IC_1 IC_2 IC_3 IC_4 Iamb_0 Iamb_1 Iamb_2 Iamb_3 Iamb_4 Iamb_5 Idc Figure 4: Example of a compensation curve I COMP for IC_5=0. The dc-currents of the corner points are fixed in the design and cannot be influenced. The compensation components I C_1…IC_5 are defined by the registers DC_COMP_IC1…5 with 4 bits each. The resulting compensation characteristics are shown in the black graph. 9.1.3. Ambient Light Sensor 9.1.3.1. Normal Operation The ambient light detection system of the MLX75030 consists of two independent channels C and D and an on-chip controllable dedicated ground pin GNDAMB. GNDAMB should not be directly connected to GND. An external photodiode is connected in between each channel and GNDAMB. The ambient light signal is low pass filtered on chip. The signal of a 1ms switched-capacitor filters is sampled by the ADC (on request by an SPI command, each 2.5ms), where it is converted into a 16bit digital word. The total input stage, this means from the external diode up to the 1ms filter, has a cut-off frequency at ~160Hz. Sampling this output every 2.5ms, commanded by SPI, would make a sample rate of 400Hz, which well above the Nyquist frequency of the present frequency content of 160Hz. Within the specified input current range the ambient input stages bias the external photodiodes with > 0V in normal operation. REVISION 008 - AUG 2018 3901075030 19 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.1.3.2. Calibration and temperature compensation The output of each ambient channel has a strong temperature dependence and a slight process dependence that can be compensated at run time. This is shown in following equation (channel x, where x = C or D):   O   I x  1  TCIref T 1   x 2 T  300        Ix: amboutx: TCIref: Ox: αx, βx:  ambout x  215    T     e (1) calculated input light value 16-bit ADC converted value of the ambient channel temperature coefficient of the reference current (typ. Value = +375ppm/K) offset of the measurement (digital value) calibration values for channel x (see below) During calibration at least 2 light levels (Ix1 and Ix2) have to be supplied to the target ambient channel (x) with its photodiode at the same known temperature T. The closer these values are chosen to the range used in application, the more accurate the final result will be. During the setting of these light levels, the output of ambient channel x: ambout x1 and amboutx2 are measured. This results in 2 equations and 2 unknowns: αx and βx. Both unknowns can be calculated from following formulas: I  T ln  1   ambout1  215  I   I2   and   ln  1       ambout1  ambout 2 T 1   (2) Note that these 2 values automatically correct any gain error of the connected photodiode and used lens system. REVISION 008 - AUG 2018 3901075030 20 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.1.3.3. Diagnostics Mode Operation In diagnostics mode, the status of the external photodiodes is checked. The following checks are performed for each ambient light channel X where X is C or D:        X disconnected GNDAMB disconnected X shorted to GNDA/GNDD/GNDAMB X shorted to VCCA/VCCD GNDAMB shorted to GNDA/GNDD GNDAMB shorted to VCCA/VCCD X shorted to other ambient light channel Note that in spite of the ability to detect any error by the ambient diagnostics, an error on an ambient pin might still have other unwanted effects.  Shorting any channel to GNDA/GNDD/GNDAMB will make the readout of the whole ambient block useless. At this time a maximum current of 14mA might be constantly pulled from the supply, independent of the amount of channels that is shorted to GNDA/GNDD/GNDAMB.  During normal operation, node GNDAMB should be considered a ground pin. Shorting this pin to any other voltage might result in a short current of max 800mA!  Because of such unwanted effects, a detection of an error in diagnostics mode should be followed by a disabling of the ambient channels in order to avoid disturbing the operation of other blocks in the system.  Note that unused channels should be connected with an external resistance (~60kOhm) to GNDAMB. Doing so will avoid disturbing the other channels, but will give a constant error on the channel connected to GNDAMB. 9.1.4. Temperature Sensor The on-chip temperature sensor measures the IC temperature. The output voltage of the sensor is converted by the 16-bit ADC. The sensor will be trimmed for the best result during the production. This trimming value is not applied to the temperature sensor internally, but is available to the customer through two on-chip registers Calib1 and Calib2, see 9.4.11. The Calib1 register contains the slope of the temperature curve in LSB/K. The Calib2 register contains the offset of the curve at a defined temperature at which the chip is tested in production. The temperature is calculated from the temperature readout (tempout) and the gain and offset calibration data (calibration data measured at 30°C) according to the formula: TK  303.15K  11775  67 (calib2  32)  tempout 67  (calib1  16) K or in °C: T  30C  11775  67 (calib2  32)  tempout 67  (calib1  16) °C Where:    tempout: digital temperature readout (16 Bit) calib1: contents of calib1 register (5 Bit) calib2: contents of calib2 register (6 Bit) REVISION 008 - AUG 2018 3901075030 21 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.1.5. DAC For active light sensor applications, the MLX75030 DAC has been designed to have the following features: To generate a pulse voltage signal from 1mV to 1V, so that LED current driven by LED driver can be 1mA to 1A if a 1Ω shunt resistor is used between pins 18 and 19. After controlling and slewing circuitry, the final output voltage over external shunt resistor is like in Figure 6. DAC piece (2MSBs B[7:6] ) 00 01 10 11 Steps each piece (6LSBs B[5:0] ) 64 64 64 64 step size for 1 bit (V) 1.00E-04 5.00E-04 2.50E-03 1.25E-02 Range covered (V) 6.40E-03 3.20E-02 1.60E-01 8.00E-01 Range start (V) Range end (V) 1.05E-03 7.65E-03 4.07E-02 2.06E-01 7.35E-03 3.92E-02 1.98E-01 9.93E-01 Table 11 : The DAC voltage values based DAC codes (B[7:6]) can refer to the following table 1.20E+00 1.00E+00 8.00E-01 6.00E-01 4.00E-01 2.00E-01 0.00E+00 0 50 100 150 200 250 300 Figure 5 : Piece Wise Linear DAC voltage VS DAC codes Trising = 3u 1mV...1V 1mV Tdc_pulse ( max 400us) tpulse_on Figure 6: Vshunt waveform REVISION 008 - AUG 2018 3901075030 22 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.1.6. LED Driver LED driver will set the DAC voltage on external shunt resistor by a closed regulation loop. 9.1.7. POR The Power On Reset (POR) is connected to voltage supply. The POR cell generates a reset signal (high level) before the supply voltage exceeds a level from 2.7V. The cell contains a hysteresis of 100mV. Figure 7: POR sequence 9.2. SPI 9.2.1. General Description of SPI Interface After power-on, the sensor enters a reset state (invoked by the internal power-on-reset circuit). A start-up time tstartup after power-on, the internal reference voltages have become stable and a first measurement cycle can start. To indicate that the start-up phase is complete, the DR pin will go high (DR is low during the start-up phase). The control of this sensor is completely SPI driven. For each task to be executed, the proper command must be uploaded via the SPI. The SPI uses a four-wire communication protocol. The following pins are used:     CS: when CS pin is low, transmission and reception are enabled and the MISO pin is driven. When the CS pin goes high, the MISO pin is no longer driven and becomes a floating output. This makes it possible that one micro -processor takes control over multiple sensors by setting the CS pin of the appropriate sensor low while sending commands. The idle state of the chip select is high. SCLK: clock input for the sensor. The clock input must be running only during the upload of a new command or during a read-out cycle. The idle state of the clock input is high. MOSI: data input for uploading the different commands and the data that needs to be written into some regi sters. The idle state of the data input is low. MISO: data output of the sensor. A SPI timing diagram is given in Figure 8. This is the general format for sending a command. First the CS pin must be set low so that the sensor can accept data. The low level on the CS pin in combination with the first rising clock edge is used to start an internal synchronization counter that counts the incoming bits. Data on the MOSI pin is clocked in at the rising clock edge. Data on the MISO pin is shifted out during the falling clock edge. Note that the tri-state of the MISO pin is controlled by the state of CS. After uploading a command, the CS pin must be set high for a minimum time of t cs_inter in order to reset the internal synchronization counter and to allow new commands to be interpreted. REVISION 008 - AUG 2018 3901075030 23 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet tcs_sclk tsclk_cs tcs_inter CS SCLK 7 MOSI 6 5 4 3 2 1 0 7 6 5 4 3 2 Control1 Byte Control2 Byte Data1 Byte Data2 Byte 1 0 MISO Tri state Tri state Figure 8 : SPI Timing Diagram for 2 byte instructions The basic structure of a command consists of 2 bytes: the Control1 Byte and the Control2 Byte that are uploaded to the device and the Data1 Byte and the Data2 Byte that are downloaded to the micro-controller. Exceptions are the commands needed to read and write the user registers (WR/RR). These commands need 3 bytes. The timing diagram is given in Figure 9. All data transfer happens with MSB first, LSB last. Referring to Figure 8 and Figure 9 : within a byte, bit 7 is always defined as the MSB, bit 0 is the LSB. This applies to all data transfers from master to slave and vice versa. tcs_sclk tsclk_cs tcs_inter CS SCLK MOSI 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 Control1 Byte Control2 Byte Control3 Byte Data1 Byte Data2 Byte Data3 Byte 1 0 MISO Tri state Tri state Figure 9 : SPI Timing Diagram for 3 byte instructions The MSB of the Control1 Byte (bit 7) is a command token: setting this bit to 1 means that the Control1 Byte will be interpreted as a new command. If the MSB is 0, the next bits are ignored and no command will be accepted. The idle command has a Control1 Byte of 0x00. The command type (chip reset, power mode change, start measurements, start read-out, read/write register) is selected with the next bits 6..0 of the Control1 Byte. The Control2 Byte consists of 0x00, to allow clocking out the Data2 Byte. The Data2 Byte contains always the Ctrl1 Byte that was uploaded. Thus the micro-controller can check that the Data2 Byte is an exact replica of the Ctrl1 Byte, to verify that the right command is uploaded to the device. The Data1 Byte contains some internal status flags to allow checking the internal state of the device. The internal status flags are defined in the table below. See section 9.3 for more information concerning the operation of the status flags. REVISION 008 - AUG 2018 3901075030 24 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Status flag Status when bit is set Status when bit is clear Bit 7 (MSB) Previous Command was valid Bit 4 Previous Command was invalid Power State: 11 = (reserved) 10 = Normal Running Mode 01 = Stand-by State 00 = Sleep State Sleep Request was sent Bit 3 Standby Request was sent No Standby Request available Bit 2 Device is in TestMode Internal Oscillator is enabled (Standby Mode or Normal Running Mode) Critical Error occurred Device is not in TestMode Internal Oscillator is shut down (Sleep Mode) No Error is detected Bit 6..5 Bit 1 Bit 0 (LSB) No Sleep Request available Table 12 : Internal Status Flags as given in the Data1 Byte Table 13 : Instruction set of the Active light sensor summarizes the instruction set of the sensor. A detailed explanation of these different commands is given in Section 9.2.2. Symbol Command Description Control1 Byte Control2 Byte Control3 Byte NOP Idle Command 0000 0000 0000 0000 N/A CR Chip Reset 1111 0000 0000 0000 N/A RSLP Request Sleep 1110 0001 0000 0000 N/A CSLP Confirm Sleep 1010 0011 0000 0000 N/A RSTBY Request Standby 1110 0010 0000 0000 N/A CSTBY Confirm Standby 1010 0110 0000 0000 N/A NRM Normal Running Mode 1110 0100 0000 0000 N/A SM Start Measurement 1101 R2R1R0T M6..M3 M2M1M0P N/A SD Start Diagnostics 1011 0000 M6..M3 M2M1M0P N/A RO Start Read-Out 1100 0011 0000 0000 N/A WR Write Register 1000 0111 D7..D0 A3..A0 P1P000 RR Read Register 1000 1110 A3..A0 0000 0000 0000 Table 13 : Instruction set of the Active light sensor Besides the above instruction set, there are some test commands available for production test purposes. To prevent unintentional access into these test modes, it requires multiple commands before the actual test mode is entered. REVISION 008 - AUG 2018 3901075030 25 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet State Diagram MLX75308BA An overview of modes in which the device can operate is shown in Figure 10 : State Diagram of the MLX75030below. It also indicates which commands are available in the different operation modes. Set Flag 7 Set Flag 7 RSTBY, RSLP, CSTBY, CSLP, RO only Clear Flag 7 RSTBY, RSLP, CSTBY, CSLP, RO only NOP, WR, RR, SM, SD, RO after SM or SD WD Disable Clear Flag 4 Clear Flag 7 Standby Mode Flag 2+6 = 0 Flag 1+5 = 1 Sleep Mode Flag 1+2+5+6 = 0 CSLP & Flag 4=1 CR NOP, WR, RR, SM, SD, RO after SM or SD Low level on WAKE_UP pin Low level on WAKE_UP pin NRM WD Initialized Clear Flag 3 Clear Flag 7 Set Flag 7 NRM RO only, RO when DR=0 CSTBY & Flag 3=1 Clear Flag 7 CR WD Initialized POR Clear Flag 3 Clear Flag 4 Clear Flag 7 Low level on WAKE_UP pin Clear Flag 7 CR DR low for 50ms NOP, WR, RR, RO after SM or SD when DR=1, CSTBY & Flag 3=0, CSLP & Flag 4=0 Test Mode Flag 2 = 1 Normal Running Mode (Idle State) Flag 2+5 = 0 Flag 1+6 = 1 NRM CR Clear Flag 3 Clear Flag 4 Clear Flag 7 RSLP RSTBY Set Flag 3 Clear Flag 7 SM, SD, SM+RO, SD+RO Clear Flag 7 Set Flag 4 Clear Flag 7 CR DR = 1 DR = 0 Measurement Sequence or Diagnostic Measurement Sequence Figure 10 : State Diagram of the MLX75030 REVISION 008 - AUG 2018 3901075030 26 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.2.2. Detailed Explanation of SPI Instruction Words 9.2.2.1. NOP – Idle Command The Idle Command can be used to read back the internal status flags that appear in the Data1 Byte. The state of the device is not changed after the NOP command is uploaded. 9.2.2.2. CR – Chip Reset Command After upload of a Chip Reset command, the sensor returns to a state as it is after power-up (Normal Running Mode) except for the watchdog counter, the state of the MR line and the contents of the 'Rst' register. The watchdog counter, the 'Rst' register and the state of the MR line will not be influenced by a CR command. The CR command can be uploaded at any time, even during a measurement or a read-out cycle, provided that the internal synchronization counter is reset. This is done by setting the CS pin high for at least a time tcs_inter. When a CR command is uploaded during sleep mode resp. standby mode, the device goes automatically into normal running mode. Note that this requires a time t wakeup_slp resp. twakeup_stby before the internal analog circuitry is fully set up again. Right after upload of a CR command, the DR pin will go low during a time tstartup. Once the wake-up/reset phase is complete, the DR pin will go high. 9.2.2.3. RSLP/CSLP – Request Sleep/Confirm Sleep To avoid that the slave device goes unintentionally into sleep mode, the master has to upload two commands. First a RSLP (Request Sleep) shall be uploaded, then the slave sets bit 4 of the internal status flag byte high. The master has to confirm the sleep request by uploading a CSLP (Confirm Sleep). Afterwards the slave will go into Sleep Mode, hereby reducing the current consumption. The status flag can be cleared by uploading a CR command or a NRM command. Note that uploading a Chip Reset makes the device switching into normal running mode. When the device is operating in Sleep Mode, the WAKE_UP pin will be monitored. A falling edge on WAKE_UP will wake up the device and will switch it into Normal Running Mode. When the device is operating in Sleep Mode, the WT pin will be monitored. If a falling edge is detected, the Critical Error flag in the Internal Status Flag Byte will be set high and the corresponding bit in the 'Err' register will be set high (refer also to Sections 9.3 and 9.4.7). Note that no pull-up or pull-down resistor is foreseen on the WAKE_UP pin. To avoid that parasitic spikes can wake up the device, the WAKE_UP input is debounced (typical debounce time is in the range of 2µs). The low time on the WAKE_UP pin should be at least a time twu_l. The state of the DR pin will not be changed when going into Sleep Mode. However, after a wake-up event the DR pin is set low during a time twakeup_slp. REVISION 008 - AUG 2018 3901075030 27 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.2.2.4. RSTBY/CSTBY - Request Standby/Confirm Standby To put the device in Standby Mode, a similar system is used: the master shall send the RSTBY command, requesting the slave to go into Standby Mode. The slave device sets bit 3 of the internal status flag byte high, indicating that it wants to go into standby. The master has to confirm this by sending the CSTBY byte. The status flag can be cleared by uploading a CR command or a NRM command. Uploading a Chip Reset makes the device switching into normal running mode. When the device is operating in Standby Mode, the WAKE_UP pin will be monitored. A falling edge on WAKE_UP will wake up the device and will switch it into Normal Running Mode. Note that no pull-up or pull-down resistor is foreseen on the WAKE_UP pin. To avoid that parasitic spikes can wake up the device, the WAKE_UP input is debounced (typical debounce time is in the range of 2µs). The low time on the WAKE_UP pin should be at least a time twu_l. The state of the DR pin will not be changed when going into Standby Mode. However, after a wake-up event the DR pin is set low during a time twakeup_stby. 9.2.2.5. NRM – Normal Running Mode The NRM command shall be used to wake up the device from Sleep Mode, or to go from Standby into Normal Running Mode. This requires a time twakeup_slp resp. twakeup_stby before the internal analog circuitry is fully set up again. The NRM will also clear the Sleep Request or Standby Request flag. When the NRM command is uploaded during normal running mode, the state of the device will not be influenced, except when the Sleep Request or Standby Request flag was set high due to a RSLP or RSTBY command. In this case, the Sleep Request or Standby Request flag will be cleared; the state of the DR pin will not change. 9.2.2.6. SM – Start Measurement The SM command is used to start up measurement cycles. Several types of measurements can be selected with the measurement selection bits M6..M0 in the Control2 Byte:  M6: setting this bit high enables the temperature measurement  M5: setting this bit high enables the read-out of the two ambient light channels  M4: setting this bit high enables the DC light measurement in the active light channel(s)  M3: setting this bit high fires LED A  M2: setting this bit high fires LED B  M1: setting this bit high enables the active light measurement in channel A  M0: setting this bit high enables the active light measurement in channel B A typical timing diagram is given in Figure 11. After uploading the SM command, the measurement cycle is started as soon as the CS pin is set high. The ADC starts converting all the needed analog voltages and stores the digital values in registers. A time tcs_dr after CS is set high, the state of the DR pin goes low. A time tdr after DR was set low, the state of the DR pin becomes high, indicating that all measurements are completed and that the resulted data is available for read-out (readback of the stored data in the registers). This time can be up to 231.84us, if an internal autozeroing process is under execution and needs to be finished. Table 14 : Example measurement execution times tdr gives an overview of some execution times t dr for the basic types of measurements. REVISION 008 - AUG 2018 3901075030 28 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Measurement Type Temperature measurement Ambient light measurements on all channels C and D Active light measurements on channels A & B, with 32 pulses, pulse frequency of 48.1kHz, Tdem=6us, Tdc_pulse=400us DC + Active light measurements on channels A & B, with 32 pulses, pulse frequency of 48.1kHz, Tdem=6us, Tdc_pulse=400us Temperature measurement + Ambient light measurements on all channels C & D + DC + Active light measurements on channels A & B, with 32 pulses, pulse frequency of 48.1kHz, Tdem=6us, Tdc_pulse=400us Min. tdr (µs) Max. tdr (µs) 269 388 298 430 1513 1673 1811 2002 2079 2299 Table 14 : Example measurement execution times t dr Note that the DR pin can be used as an interrupt for the master device as it indicates when a read-out cycle can be started. Note that measurement execution of ActiveLight measurement only is not allowed. ActiveLight measurements must always be done with Ambient Light measurements. CS SCLK tcs_dr MOSI MISO tdr SM/SD Command Tri state Status Flags/Ctrl 1 Tri state DR Internal State Idle State Measurement Cycle SM/SD Idle State Figure 11 : Timing Diagram of a Measurement Cycle The SM command contains 3 option bits R2R1R0. These bits set the polarity of the anti-aliasing filters, the switched capacitors low pass filters and the ADC input buffer in active light channels A & B:  R2: this bit inverts the op-amp in the anti-aliasing filter. The output will change from (Signal + Offset_opamp_aa) to (Signal - offset_opamp_aa). In this way, by processing 2 measurements with inverted R2 bits, the offset of the AA filter can be cancelled.  R1: Inversion of the offset of active light_sclp_filter. The output will change from (Signal + Offset_opamp_sclp) to (Signal - offset_opamp_sclp). In this way, by processing 2 measurements with inverted R1 bits, the offset of the SCLP filter can be cancelled.  R0: Inversion of the offset of the ADC_buffer. The output will change from (Signal + Offset_opamp_buf) to (Signal offset_opamp_buf). In this way, by processing 2 measurements with inverted R0 bits, the offset of the SCLP filter can be cancelled.  T: this bit replaces the light pulses by internal current pulses during the active light measurements. REVISION 008 - AUG 2018 3901075030 29 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet The SM command contains an option bit T. If this bit is set to 0, normal active light measurements are performed (i.e. the external LEDs are fired and the active light channels A and/or B are measured). If this bit is set to 1, no LEDs are fired, but internal test pulses are applied to channels A and/or B. The internal test pulses can be influenced in amplitude by the bits DACA7 and DACA6. Limits for ADC outputs of the TIA test pulses are shown in Table 15 : Current levels for active light test mode. DACA7 DACA6 I_Testpulse [uA] 0 0 1 1 0 1 0 1 5 13 21 29 Table 15 : Current levels for active light test mode In the Control2 byte an even parity bit P is foreseen. The parity bits calculation is based on the measurement selection bits M6..M0. If the number of ones in the given data set [M6..M0] is odd, the even parity bit P shall be set to 1, making the total number of ones in the set [M6..M0, P] even. The SPI invalid flag will be set when the parity bit does not correspond to the calculated parity bit. After upload of a SM/SD command, no other commands will be accepted till DR is high. This is done to avoid too much disturbances in the analog part. Once DR is high, the next command will be accepted. An exception however is the Chip Reset command. This will always be accepted. Note that none of the SM/SD commands are available in Standby Mode. 9.2.2.7. RO – Start Read-Out When the state of the DR pin changed into a high state, the measurement data is available for read-out. The RO command shall be uploaded to start a read-out cycle and to start reading out the data that was stored in the internal registers. To make sure that no memory effects can occur, all data registers are cleared at the end of each read-out cycle. A typical timing diagram is given in Figure 12 below: CS tcs_dr 8tsclk 8tsclk RO-Ctrl1 RO-Ctrl2 X*8tsclk SCLK tdr MOSI MISO SM1x/SM2/SM3x Command Tri state Status Flags 1 byte Ctrl1 1 byte Output Data Frame Tri state X bytes DR Figure 12 : Timing diagram for Read-Out The data that appears on the MISO pin depends on the type of measurement that was done (i.e. it depends on the command that was uploaded: SM/SD and the selected measurement bits M 6..M0). REVISION 008 - AUG 2018 3901075030 30 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet The table below shows the Output Data Frame when all measurements are selected : Data Byte Number Output Data Frame Contents Comments Byte 3 Byte 4 Temperature (8 MSB) Temperature (8 LSB) Byte 5 Ambient light channel C measurement (8 MSB) Byte 6 Ambient light channel C measurement (8 LSB) Byte 7 Ambient light channel D measurement (8 MSB) Byte 8 Ambient light channel D measurement (8 LSB) Depends on M6 Depends on M6 Depends on M5 + on EN_CH_C Depends on M5 + on EN_CH_C Depends on M5 + on EN_CH_D Depends on M5 + on EN_CH_D Byte 9 Byte 10 not used not used DC measurement of IR channel A, before the active light burst measurement (8 MSB) DC measurement of IR channel A, before the active light burst measurement (8 LSB) DC measurement of IR channel B, before the active light burst measurement (8 MSB) DC measurement of IR channel B, before the active light burst measurement (8 LSB) Byte 11 Byte 12 Byte 13 Byte 14 Byte 15 Active light burst measurement of IR channel A (8 MSB) Byte 16 Active light burst measurement of IR channel A (8 LSB) Byte 17 Active light burst measurement of IR channel B (8 MSB) Byte 18 Active light burst measurement of IR channel B (8 LSB) Byte 19 Byte 20 Byte 21 Byte 22 Byte 23 DC measurement of IR channel A, after the active light burst measurement (8 MSB) DC measurement of IR channel A, after the active light burst measurement (8 LSB) DC measurement of IR channel B, after the active light burst measurement (8 MSB) DC measurement of IR channel B, after the active light burst measurement (8 LSB) CRC (8 bit) Depends on M4 Depends on M4 Depends on M4 Depends on M4 Depends on M1 + LED selection depends on M3/M2 Depends on M1 + LED selection depends on M3/M2 Depends on M0 + LED selection depends on M3/M2 Depends on M0 + LED selection depends on M3/M2 Depends on M4 Depends on M4 Depends on M4 Depends on M4 Output always Table 16 : SM Output Data Frame Note : When certain measurements are disabled, the corresponding data bytes are omitted from the Output Data Frame. REVISION 008 - AUG 2018 3901075030 31 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Cyclic Redundancy Check Calculation In all Output Data Frames, a CRC byte is included as last byte. This byte provides a way to detect transmission errors between slave and master. An easy method to check if there were no transmission errors is to calculate the CRC of the whole read-out frame as defined in previous tables. When the calculated CRC results in 0x00, the transmission was error free. If the resulting CRC is not equal to zero, then an error occurred in the transmission and all the data should be ignored. For more information regarding the CRC calculation, please refer to section 9.8. REVISION 008 - AUG 2018 3901075030 32 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.2.2.8. SM+RO - Start Measurement combined with Read-Out If after upload of the SM command, extra clocks are given (without putting CS high!), the data stored in the internal registers will appear on the MISO pin. At the end of the read-out phase the internal registers will be cleared to avoid memory effects in the next read-outs. The newly uploaded SM command will be executed after the read-out, when the CS pin goes high. The two figures below show the difference between the two modes of operation : - Figure 13 : Separated SM - RO (X value is defined in Figure 6)shows the operation with separate SM and RO commands. After upload of a SM command, the measurement cycle will start and the internal registers will be filled. Once the DR pin is high, the RO command can be uploaded to start the read-out cycle. All data of the internal registers will be transferred and at the end of the read-out the registers will be cleared. - Figure 14 : Combined SM - RO (X value is defined in Figure 6) shows the operation with the combined SM and RO. First one has to upload a SM command to start a measurement. The data is available for read-out when the DR pin goes high. Instead of uploading a RO command, a SM command can be uploaded again to combine read-out and the start of the next measurement cycle. If extra clocks are given after upload of the SM command, the data of the internal registers becomes available on the MISO pin. Note that the CS pin shall not be set high until the read-out is finished. Once CS pin goes high, the DR pin is set low and a new measurement cycle will be started. A time t dr later the DR pin goes high to indicate that the data is available. CS 8tsclk 8tsclk SM/SD 0x00 tcs_dr 8tsclk 8tsclk RO-Ctrl1 RO-Ctrl2 X*8tsclk SCLK MOSI MISO Tri state Status Flags 1 byte Tri state Ctrl1 Status Flags tdr 1 byte 1 byte Ctrl1 1 byte Tri state Output Data Frame X bytes DR Device State Idle Measurement Cycle Idle Internal Registers 0x00 Filling up Data Available Read-out Idle Emptying 0x00 Figure 13 : Separated SM - RO (X value is defined in Figure 6) CS 8tsclk 8tsclk SM/SD 0x00 tcs_dr 8tsclk 8tsclk tcs_dr X*8tsclk SCLK MOSI MISO Tri state Status Flags 1 byte SM/SD Tri state Ctrl1 1 byte tdr Status Flags 1 byte 0x00 Ctrl1 1 byte Tri state Output Data Frame tdr X bytes DR Device State Internal Registers Idle 0x00 Measurement Cycle Filling up Idle Data Available Read-out Emptying 0x 00 Measurement Cycle Idle Filling up Data Available Figure 14 : Combined SM - RO (X value is defined in Figure 6) REVISION 008 - AUG 2018 3901075030 33 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.2.2.9. WR/RR – Write/Read Register The slave contains several user registers that can be read and written by the master. The WR and RR commands are used for that. The WR command writes the contents of an 8-bit register addressed by bits A3..0 with data D7..0. Data is sent to the device over the MOSI pin. Control2 Byte contains the 8 bit data that shall be written into the target register. Control3 Byte contains the address of the target register. The WR command is defined in the table below: Control1 Byte Control2 Byte Control3 Byte 1000 0111 D7D6D5D4 D3D2D1D0 A3A2A1A0 P1P000 D7D6D5D4 D3D2D1D0 A3A2A1A0 P1P0 Data contents of register to be written Address of target register Parity bits (P1 = odd parity bit, P0 = even parity bit) Data1 Byte Data2 Byte Data3 Byte Status Flag Byte 1000 0111 0000 0000 Table 17 : Write Register command In order to detect some transmission errors while writing data towards the slave device, the micro-controller has to compute an odd and an even parity bit of the Control2 and the 4 MSB's of the Control3 byte and send these parity bits to the slave. The slave will check if the parity bits are valid. The data will only be written into the registers if the parity bits are correct. If the parity bits are not correct, bit 7 of the internal Status Flag Byte will be set high, indicating that the command was invalid. This can be seen when uploading a NOP command (when one is only interested in reading back the internal status flags) or during upload of the next command. In case the parity bits were not correct, the data of the registers will not be changed. The parity bits calculation is based on the data D7..D0 and A3..A0. If the number of ones in the given data set [D 7..D0, A3..A0] is odd, the even parity bit P0 shall be set to 1, making the total number of ones in the set [D 7..D0, A3..A0, P0] even. Similar: if the number of ones in the given data set [D7..D0, A3..A0] is even, the odd parity bit P1 shall be set to 1, making the total number of ones in the set [D7..D0, A3..A0, P1] odd. Note that the parity bits can be generated with XOR instructions: P1 = XNOR(D7..D0, A3..A0) and P0 = XOR(D7..D0, A3..A0). The odd parity bit P1 should always be the inverse of the even parity bit P0. The RR command returns the contents of an 8-bit register addressed by bits A3..0. Data is read back over the MISO pin. The Data1 Byte contains the Internal Status Flag byte. Data2 Byte contains the copy of the Control1 Byte. Data3 Byte contains the 8 bits of the target register. The RR command is defined in the table below: REVISION 008 - AUG 2018 3901075030 34 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Control1 Byte Control2 Byte Control3 Byte 1000 1110 A3A2A1A0 0000 0000 0000 A3A2A1A0 Address of target register Data1 Byte Data2 Byte Data3 Byte Status Flag Byte 1000 1110 D7D6D5D4 D3D2D1D0 D7..0 Data contents of register read Table 18 : Read Register command Note that the WR and RR commands are commands that require 3 bytes instead of 2 bytes. An overview of the user registers that can be accessed with WR/RR commands and more general information concerning the user registers can be found in section 9.4 9.2.2.10. SD – Start Diagnostics The SD command will start a measurement cycle in which internal signals will be measured and converted. With this command it is possible to test some circuits in the chip and check if they are functioning as expected. The SD command behaves in much the same way as the SM commands: instead of uploading a SM command, a SD command can be uploaded. This starts the measurement cycle and conversion of some internal signals. The pin DR goes high when the cycle is completed, indicating that a read-out can be started. With the RO command it is possible to read out the data and check if all the data values are within certain ranges. After upload of a SD command, no other commands will be accepted till DR is high. This is done to avoid too much disturbances in the analog part. Once DR is high, the next command will be accepted. An exception however is the Chip Reset command. This will always be accepted. The SD command is not available in Standby Mode. Similar to the SM command, the SD command has some measurement selection bits M 6..M0 in the Control2 Byte. Different measurements can be selected with these bits:  M6: setting this bit high enables the ADC diagnostics  M5: setting this bit high enables the DAC-ADC diagnostics  M4: setting this bit high enables the Ambient Diode checks  M3..M0: (reserved) Table 19 gives an overview of some execution times tdr for the basic types of measurements. Measurement Type ADC Diagnostics DAC-ADC Diagnostics Ambient Diode checks ADC + DAC-ADC + Ambient Diode Diagnostics Min. tdr (µs) Max. tdr (µs) 224 91 370 680 249 102 410 752 Table 19: Basic Measurement Execution Times t dr REVISION 008 - AUG 2018 3901075030 35 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet If all possible measurements are selected, the Output Data Frame is defined in the table below: Data Byte Number Data Byte Contents after SD command Comments Byte 3 ADCtest0 (8 MSB) Depends on M6 Byte 4 ADCtest0 (8 LSB) Depends on M6 Byte 5 ADCtest1 (8 MSB) Depends on M6 Byte 6 ADCtest1 (8 LSB) Depends on M6 Byte 7 ADCtest2 (8 MSB) Depends on M6 Byte 8 ADCtest2 (8 LSB) Depends on M6 Byte 9 ADCtest3 (8 MSB) Depends on M6 Byte 10 ADCtest3 (8 LSB) Depends on M6 Byte 11 ADCtest4 (8 MSB) Depends on M6 Byte 12 ADCtest4 (8 LSB) Depends on M6 Byte 13 DAC-ADC Test (8 MSB) Depends on M5 Byte 14 DAC-ADC Test (8 LSB) Depends on M5 Byte 15 00000 + CDx Ambient Diodes Detection (3 bit) Depends on M4 Byte 16 CRC (8 bit) Output always Table 20 : SD Output Data Frame When certain measurements are disabled, the corresponding data bytes are omitted from the Output Data Frame. ADCtest0/1/2/3/4 These measurements are AD conversions of some internal reference voltages:  ADCtest0 is typically at 1/16 of the ADC range: ADCtest0 = 0x0E00 .. 0x1200.  ADCtest1 is typically at 1/4=4/16 of the ADC range: ADCtest1 = 0x3E00 .. 0x4200.  ADCtest2 is typically at 3/4=12/16 of the ADC range: ADCtest2 = 0xBE00 .. 0xC200.  ADCtest3 is typically at 15/16 of the ADC range: ADCtest3 = 0xEE00 .. 0xF200. ADCtest4 is similar to ADCtest0/1/2/3: an AD conversion of an internal reference voltage is made. However, an independent voltage reference is used as input for the ADC in case of ADCtest4. In the case of ADCtest0/1/2/3, the reference voltages are generated from the references used for the ADC. The typical output for ADCtest4 will be as listed in below table: ADCtest4 values @ Vs=3.0V @ Vs=3.3V @ Vs=3.6V min 33400 30400 27400 typ 35400 32400 29400 max 37400 34400 31400 LSB LSB LSB DAC-ADC test A DAC-ADC test measurement is performed in the following way: the DAC output is connected to the ADC input. The DAC input will be DACA from register 'SetAH'. This DAC-input will be converted to an analog output voltage that will be converted again by the ADC to give a digital value. This digital value is given in the bytes DAC-ADC Test. Ambient Diodes Detection During the Diagnostics measurement, the status of the external photo diodes connected to the ambient light channel inputs is checked. Three bits CDx are output: when the bit C is set high, an error on the photo diode channel C is present. In a similar way, bit D indicate if errors on ambient light channels D is present or not. REVISION 008 - AUG 2018 3901075030 36 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.3. Internal Status Flags Bit 7: Previous Command invalid/valid When an uploaded command is considered invalid, bit 7 will be set high. This bit can be read out when the next command will be uploaded. If the next command is valid, bit 7 will be cleared again. A command is considered invalid in case: - a command is unknown (i.e. all commands that are not mentioned in Table 13) - the parity bit in the SM or SD command is not correct - the parity bits in a WR command are not correct - when a command (except the CR command) was sent during a measurement cycle (i.e. after uploading a SM/SD command, when DR is still low) - when a RO command was sent when DR is low (at any time, i.e. not only after uploading a SM/SD command) - if a '1' is written into one of the bits of the 'Err' register - if an ambient measurement is requested in case all bits EN_CH_C/EN_CH_D/EN_DIAGAMB are zero Bit 6..5: Power State, Bit 4: Sleep request, Bit 3: Standby request The behaviour of the power state and the sleep request bits is explained in Figure 15 : Power State and Sleep Request bits. First a RSLP command is uploaded to the sensor. As a result of that, the sensor will put the status flag bit 4 (sleep request flag) high. The master can read out that flag by uploading a NOP command, or when uploading other commands. The master can confirm to go into sleep mode by uploading a CSLP command. The request flag will be reset and the sensor will switch into sleep state. The status flag bits 6 and 5 will be set accordingly. CS SCLK MOSI RSLP (NOP) CSLP (NOP) NRM MISO Status Flag Bit 4 (Sleep Request) Status Flag Bits 6..5 (Power State) Device State 10 00 10 Normal Running Mode Sleep State Normal Running Mode Figure 15 : Power State and Sleep Request bits To go into standby mode, the same procedure shall be applied: uploading a RSTBY command makes the request standby flag going high. Uploading a CSTBY will make the device going into standby mode, whereby the request standby flag will be cleared and the power state bits will be set accordingly. Bit 2: Device in TestMode/Normal Mode To make the sensor efficiently testable in production, several test modes are foreseen to get easy access to different blocks. The status flag bit 2 indicates if the device is operating in Test Mode or Normal Mode. If the device enters test mode by accident, the application will still work like normal. However, the status flag bit 2 will be set high. The master can take actions to get out of test mode by uploading a CR command. Bit 1: Internal Oscillator is enabled/disabled This bit is high when the internal oscillator is enabled. Once the RCO is shut down the bit will be set low. Bit 0: Critical Error is detected/not detected During each measurement cycle there is a monitoring of the voltage on critical nodes along the analog paths. When the voltage of one of these controlled nodes goes out of its normal operating range, the Critical Error Flag will be set high. REVISION 008 - AUG 2018 3901075030 37 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet The Critical Error Flag will also be set high when a falling edge on the WT pin will be detected while the device is in Sleep Mode. Following nodes are monitored: - TIA output: when the output is clipped (either high or low), the Critical Error Flag will be set high - Difference between DAC output and shunt-feedback - An internal reference voltage - Output of the common mode SC-amplifiers of the Ambient Light/Temperature Channels - Frequency on RCO output In case the Critical Error Flag was set high, the 'Err' register indicates which node voltages got out of their normal operating range. More info about the 'Err' register can be found in Section 9.4.7. The Critical Error Flag remains high as long as the 'Err' register is not cleared. Once the 'Err' register is cleared, the Critical Error Flag will be cleared as well. Note: after POR, or after wake-up from Sleep/Standby, some bits in the 'Err' register might be set. As such the Critical Error Flag might be set as well. REVISION 008 - AUG 2018 3901075030 38 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4. User Registers Overview Name Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SetAna 0x0 Tdem3 Tdem2 Tdem1 Tdem0 LEDDRV_HG Tdc_pulse1 Tdc_pulse0 Unity_Gain SetAH 0x1 DACA7 DACA6 DACA5 DACA4 DACA3 DACA2 DACA1 DACA0 SetAL 0x2 GAIN_ADJ_ AA_A2 GAIN_ADJ_ AA_A1 GAIN_ADJ_ AA_A0 BW_ADJ_ AA_A2 BW_ADJ_ AA_A1 BW_ADJ_ AA_A0 BW_SEL_ LP_A1 BW_SEL_ LP_A0 SetBH 0x3 DACB7 DACB6 DACB5 DACB4 DACB3 DACB2 DACB1 DACB0 SetBL 0x4 GAIN_ADJ_ AA_B2 GAIN_ADJ_ AA_B1 GAIN_ADJ_ AA_B0 BW_ADJ_ AA_B2 BW_ADJ_ AA_B1 BW_ADJ_ AA_B0 BW_SEL_ LP_B1 BW_SEL_ LP_B0 SetPF 0x5 NP3 NP2 NP1 NP0 EN_DCCOMP RPF2 RPF1 RPF0 Err 0x6 - Err6 Err5 Err4 Err3 Err2 Err1 - 0x7 DC_COMP_ IC13 DC_COMP_ IC12 DC_COMP_ IC11 DC_COMP_ IC10 Rst TO POR DC_COMP_ IC21 DC_COMP_ IC41 DC_COMP_ IC20 DC_COMP_ IC40 GAIN_BUF2 GAIN_BUF1 GAIN_BUF0 DC_COMP_ IC30 - - GAIN_BUF4 GAIN_BUF3 TRIM_ TC_BGI3 TRIM_ TC_BGI2 TRIM_ TEMP5 TRIM_ TC_BGI1 TRIM_ TEMP4 TRIM_ TC_BGI0 TRIM_ TEMP3 - - - TRIM_ TEMP2 TRIM_ TEMP1 EN_DIAG_B EN_CH_A EN_CH_B EN_CH_C EN_CH_D TRIM_ TEMP0 EN_ DIAGAMB DC_COMP_ IC51 DC_COMP_ IC50 - - Tamb1 0x8 DCComp2 0x9 GainBuf 0xA - Calib1 0xB TRIM_ TC_BGI4 Calib2 0xC - - EnChan 0xD EN_TEMP EN_DIAG_A 0xE DC_COMP_ IC53 DC_COMP_ IC52 Tamb DC_COMP_ IC22 DC_COMP_ IC42 DC_COMP_ IC31 DCComp1 DC_COMP_ IC33 DC_COMP_ IC23 DC_COMP_ IC43 DC_COMP_ IC32 Tamb0 Table 21. User registers overview In the next sections, all the bits of these registers are described. The value of the register at Power-On is indicated in the line 'Init' (0 or 1 or x=unknown) and the read/write access ability is indicated in the line 'Read/Write' (R indicates Read access, W indicates Write access). REVISION 008 - AUG 2018 3901075030 39 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4.1. SetAna register This register contains some settings of the analog chain. Bit SetAna 0x0 Read/Write Init  7 6 5 4 3 Tdem3 Tdem2 Tdem1 Tdem0 LEDDRV_HG R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 2 Tdc_ pulse1 1 Tdc_ pulse0 R/W 1 R/W 0 0 Unity_Gain R/W 1 Tdem: changes the demodulator delay time in the active light channel Tdem3 Tdem2 Tdem1 Tdem0 Delay time (in µs, +/-5%)    0 0 0 0 0 0 0 0 1 0.4 0 0 1 0 0.8 0 0 1 1 1.2 0 1 0 0 1.6 0 1 0 1 2 0 1 1 0 2.4 0 1 1 1 2.8 1 0 0 0 3.2 1 0 0 1 3.6 1 0 1 0 4 1 0 1 1 4.4 1 1 0 0 4.8 1 1 0 1 5.2 1 1 1 0 5.6 1 1 1 1 6 LEDDRV_HG: 1 = selects high gain mode of LED driver, 0 = selects low gain mode Tdc_pulse: defines the time that the DC component in the active light pulse signal is enabled before the actual active light pulses start Tdc_ pulse1 Tdc_ pulse0 Delay time (in µs, +/-5%) 0 0 50 0 1 100 1 0 200 1 1 400 Unity_Gain: only during active light measurements: 1=ADC buffer is bypassed, 0=ADC gain stage is used (gain is set with bits GAIN_BUF in register 'GainBuf') REVISION 008 - AUG 2018 3901075030 40 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4.2. SetAH register This register defines the DAC level for IR channel A. SetAH 0x1 Bit 7 DACA7 6 DACA6 5 DACA5 4 DACA4 3 DACA3 2 DACA2 1 DACA1 0 DACA0 Read/Write Init R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0  DACA: the 8 bits of the DAC level for IR channel A 9.4.3. SetAL register This register defines the gain and cut-off frequency adjustments for IR channel A. Bit SetAL 0x2 Read/Write Init   7 6 5 4 3 2 1 0 GAIN_ ADJ_ AA_A2 GAIN_ ADJ_ AA_A1 GAIN_ ADJ_ AA_A0 BW_ ADJ_ AA_A2 BW_ ADJ_ AA_A1 BW_ ADJ_ AA_A0 BW_ SEL_ LP_A1 BW_ SEL_ LP_A0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 1 R/W 1 R/W 0 R/W 1 GAIN_ADJ_AA_A: gain adjustment of anti-aliasing filter of channel A GAIN_ADJ_ AA_A2 GAIN_ADJ_ AA_A1 GAIN_ADJ_ AA_A0 Gain Gain (dB) 0 0 0 2.00 6.02 0 0 1 4.29 12.64 0 1 0 6.57 16.35 0 1 1 8.86 18.95 1 0 0 11.14 20.94 1 0 1 13.43 22.56 1 1 0 15.71 23.93 1 1 1 18.00 25.11 BW_ADJ_AA_A: cut-off frequency adjustment of anti-aliasing filter of channel A REVISION 008 - AUG 2018 3901075030 BW_ADJ_ AA_A2 BW_ADJ_ AA_A1 BW_ADJ_ AA_A0 3dB Cut-off Frequency (kHz) 0 0 0 18 0 0 1 20 0 1 0 22.5 0 1 1 25 1 0 0 30 1 0 1 35 1 1 0 43 1 1 1 55 41 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet  BW_SEL_LP_A: cut-off frequency selection of low-pass filter of channel A BW_SEL_ BW_SEL_ Cut-off Frequency Cut-off Frequency LP_A1 LP_A0 (%f0) (kHz @ f0=70kHz) 0 0 23.5 16.5 0 1 12 7.8 1 0 5.9 4.2 1 1 3 2.1 9.4.4. SetBH register This register defines the DAC level for IR channel B. SetBH 0x3 Bit 7 DACB7 6 DACB6 5 DACB5 4 DACB4 3 DACB3 2 DACB2 1 DACB1 0 DACB0 Read/Write Init R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0  DACB: the 8 bits of the DAC level for IR channel B 9.4.5. SetBL register This register defines the gain and cut-off frequency adjustments for IR channel B. Bit SetBL 0x4 Read/Write Init   7 6 5 4 3 2 1 0 GAIN_ ADJ_ AA_B2 GAIN_ ADJ_ AA_B1 GAIN_ ADJ_ AA_B0 BW_ ADJ_ AA_B2 BW_ ADJ_ AA_B1 BW_ ADJ_ AA_B0 BW_ SEL_ LP_B1 BW_ SEL_ LP_B0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 1 R/W 1 R/W 0 R/W 1 GAIN_ADJ_AA_B: gain adjustment of anti-aliasing filter of channel B GAIN_ADJ_ GAIN_ADJ_ GAIN_ADJ_ Gain Gain (dB) AA_B2 AA_B1 AA_B0 0 0 0 2.00 6.02 0 0 1 4.29 12.64 0 1 0 6.57 16.35 0 1 1 8.86 18.95 1 0 0 11.14 20.94 1 0 1 13.43 22.56 1 1 0 15.71 23.93 1 1 1 18.00 25.11 BW_ADJ_AA_B: cut-off frequency adjustment of anti-aliasing filter of channel B REVISION 008 - AUG 2018 3901075030 BW_ADJ_ AA_B2 BW_ADJ_ AA_B1 BW_ADJ_ AA_B0 3dB Cut-off Frequency (kHz) 0 0 0 18 0 0 1 20 42 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet  0 1 0 22.5 0 1 1 25 1 0 0 30 1 0 1 35 1 1 0 43 1 1 1 55 BW_SEL_LP_B: cut-off frequency selection of low-pass filter of channel B BW_SEL_ BW_SEL_ Cut-off Freuency Cut-off Frequency LP_B1 LP_B0 (%f0) (kHz @ f0=70kHz) 0 0 23.5 16.5 0 1 12 7.8 1 0 5.9 4.2 1 1 3 2.1 9.4.6. SetPF register This register defines the frequency settings and the number of pulses for the active light measurements. Bit SetPF 0x5 Read/Write Init  7 6 5 4 NP3 NP2 NP1 NP0 R/W 0 R/W 1 R/W 0 R/W 0 3 EN_DC COMP R/W 0 2 1 0 RPF2 RPF1 RPF0 R/W 1 R/W 0 R/W 0 NP: number of pulses for the active light measurements, as defined in the table below: Bit 3 - NP3 Bit 2 - NP2 Bit 1 - NP1 Bit 0 - NP0 Number of Pulses REVISION 008 - AUG 2018 3901075030 0 0 0 0 2 0 0 0 1 4 0 0 1 0 6 0 0 1 1 8 0 1 0 0 10 0 1 0 1 12 0 1 1 0 14 0 1 1 1 16 1 0 0 0 18 1 0 0 1 20 1 0 1 0 22 1 0 1 1 24 1 1 0 0 26 1 1 0 1 28 1 1 1 0 30 1 1 1 1 32 43 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet   EN_DCCOMP: 1 = enables the DC light compensation, 0 = disables the DC light compensation RPF: frequency selection of pulses for the active light measurements, as defined below: Bit 2 - RPF2 Bit 1 - RPF1 Bit 0 - RPF0 0 0 0 Frequency of Pulses (in kHz, +/-5%) 48.1 0 0 1 52.1 0 1 0 56.8 0 1 1 62.5 1 0 0 69.4 1 0 1 78.1 1 1 0 89.3 1 1 1 104.2 9.4.7. Err register As described in Section 9.3 (under section 'Bit 0: Critical Error is detected/not detected'), the voltages on critical nodes are monitored continuously. When a voltage on such a critical node goes outside its operating range, the Critical Error Flag and the appropriate error bit in the 'Err' register will be set high. As such, the source of the error can be found in the 'Err' register. The error bit remains high as long as the error condition is present, or as long as the error bit is not cleared (in case the error condition is not present anymore). Err 0x6 Bit 7 - 6 Err6 5 Err5 4 Err4 3 Err3 2 Err2 1 Err1 0 - Read/Write Init R 0 R/W* 0 R/W* 0 R/W* x** R/W* x** R/W* x** R/W* 0 R 0 The following bits are defined (0= no error detected; 1=error is detected):  Err: not implemented, read as '0'  Err6: critical error detected on TIA output  Err5: critical error detected on the difference between DAC output and shunt-feedback  Err4: critical error detected on internal voltage reference: when the internal voltage reference is below 1V.  Err3: critical error detected on one of the common mode SC-filters of the ambient light/temperature channels  Err2: critical error detected on RCO: either a stuck-at-high or a stuck-at-low condition occurred at the output of the RCO. Note that in SLP, the error flag on the RCO will be set high.  Err1: set to '1' when a falling edge on the WT pin is detected while the device is in Sleep Mode  Err: not implemented, read as '0' *: only writing '0' is allowed. If a '1' is written, the bit value in the register will not be changed, but Bit 7 of the Internal Status Flags will be set high (Previous Command Invalid). **: 'x' indicates that the value after POR is unknown. If the voltages of the nodes are out of range right after POR, it will be immediately reflected in the 'Err' register and the Critical Error Flag will be set. The same is valid after wake-up from Sleep/Standby. REVISION 008 - AUG 2018 3901075030 44 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4.8. Rst register This register allows differentiation of either a POR or a reset due to a watchdog time-out + settings for the DC light compensation circuitry. Bit Rst 0x7 Read/Write Init     7 DC_ COMP_ IC13 6 DC_ COMP_ IC12 5 DC_ COMP_ IC11 4 DC_ COMP_ IC10 3 2 1 0 - - TO POR R/W 0 R/W 0 R/W 0 R/W 0 R 0 R 0 R 0 R/W 1 DC_COMP_IC1: setting of the amplitude of the 1st PWL slope Rst: not implemented, read as '0' TO: 1=a Watchdog time-out and a master reset occurred. 0=no Watchdog time-out occurred, or after Power-On, or after a falling edge at the WT pin POR: 1=a POR occurred, 0=a POR has not occurred. To detect subsequent Power-On-Resets, the POR-bit shall be cleared right after Power-On. 9.4.9. DCComp register This register contains settings for the DC light compensation circuitry. These settings have to be calculated for the individual application (ActiveLight-channel photodiode used). Bit 7 6 5 4 3 DC_ COMP_ IC23 2 DC_ COMP_ IC22 1 DC_ COMP_ IC21 0 DC_ COMP_ IC20 R R R R R/W R/W R/W R/W X X X X 0 0 0 0 DCComp1 0x8 Read/ Write Init  DC_COMP_IC2: setting of the amplitude of the 2nd PWL slope Bit DCComp2 0x9 Read/ Write Init   7 DC_ COMP_ IC33 6 DC_ COMP_ IC32 5 DC_ COMP_ IC31 4 DC_ COMP_ IC30 3 DC_ COMP_ IC43 2 DC_ COMP_ IC42 1 DC_ COMP_ IC41 0 DC_ COMP_ IC40 R/W R/W R/W R/W R/W R/W R/W R/W 0 0 0 0 0 0 0 0 DC_COMP_IC3: setting of the amplitude of the 3rd PWL slope DC_COMP_IC4: setting of the amplitude of the 4th PWL slope REVISION 008 - AUG 2018 3901075030 45 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4.10. GainBuf register This register contains the gain settings of the ADC input buffer. The use of this buffer is depending on bit 'Unity_Gain' in the register 'SetAna'. Bit GainBuf 0xA Read/Write Init   7 6 5 - - - R 0 R 0 R 0 4 GAIN_B UF4 3 GAIN_B UF3 2 GAIN_B UF2 1 GAIN_B UF1 0 GAIN_ BUF0 R/W 1 R/W 1 R/W 0 R/W 1 R/W 0 GainBuf: not implemented, read as '0' GAIN_BUF: defines the gain setting of the ADC input buffer REVISION 008 - AUG 2018 3901075030 GAIN_ BUF4 GAIN_ BUF3 GAIN_ BUF2 GAIN_ BUF1 GAIN_ BUF0 Gain 0 0 0 0 1 2 0 0 0 1 0 1 0 0 0 1 1 0.67 0 0 1 0 0 0.5 0 0 1 0 1 0.4 0 0 1 1 0 0.33 0 0 1 1 1 0.29 0 1 0 0 0 0.25 0 1 0 0 1 0.22 0 1 0 1 0 0.2 1 0 0 0 1 10 1 0 0 1 0 5 1 0 0 1 1 3.33 1 0 1 0 0 2.5 1 0 1 0 1 2 1 0 1 1 0 1.67 1 0 1 1 1 1.43 1 1 0 0 0 1.25 1 1 0 0 1 1.11 1 1 0 1 0 1 46 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4.11. Calib1/Calib2 register These registers contain the gain settings of the bandgap temperature coefficient correction and the temperature sensor. Bit Calib1 0xB Read/Write Init   7 TRIM_ TC_BGI4 6 TRIM_ TC_BGI3 5 TRIM_ TC_BGI2 4 TRIM_ TC_BGI1 3 TRIM_ TC_BGI0 2 1 0 - - - R x R x R x R x R x R 0 R 0 R 0 TRIM_TC_BGI: defines the TC correction of the bandgap current Calib1: not implemented, read as '0' The Calib1 register is used to indicate the slope of the temperature sensor curve in LSB/Kelvin. The slope is calculated out of a 2point measurement of the temperature curve and is permanently programmed in the OTP by means of a 5 -Bit word and accessible via the Calib1 register, see Table 22. Calib1 - TRIM_TC_BGI Dec 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Bin 0 1 10 11 100 101 110 111 1000 1001 1010 1011 1100 1101 1110 1111 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 11010 11011 11100 11101 11110 11111 Slope (LSB/Kelvin) -51 -52 -53 -54 -55 -56 -57 -58 -59 -60 -61 -62 -63 -64 -65 -66 -67 -68 -69 -70 -71 -72 -73 -74 -75 -76 -77 -78 -79 -80 -81 -82 Table 22 : 5-Bit temperature sensor slope information as it is stored in the calib1 register. REVISION 008 - AUG 2018 3901075030 47 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Bit Calib2 0xC Read/Write Init   7 6 - - R 0 R 0 5 TRIM_T EMP5 4 TRIM_T EMP4 3 TRIM_T EMP3 2 TRIM_T EMP2 1 TRIM_T EMP1 0 TRIM_T EMP0 R x R x R x R x R x R x Calib2: not implemented, read as '0' TRIM_TEMP: defines the calibration settings of the temperature sensor The offset of the temperature curve is measured at one temperature (preferably 30deg. C) and permanently stored in the zenerzap OTP with 6 bit word length. This information is accessible via the Calib2 register, see Table 23. Slope: -67 LSB/K Calib2 - TRIM_TEMP 25degC 30degC Dec Bin Offset (degC) LSL expected USL LSL expected USL 1 2 1 10 -31 -30 10003.07 10069.95 10036.51 10103.39 10069.95 10136.83 9668.67 9735.55 9702.11 9768.99 9735.55 9802.43 3 4 11 100 -29 -28 10136.83 10203.71 10170.27 10237.15 10203.71 10270.59 9802.43 9869.31 9835.87 9902.75 9869.31 9936.19 5 6 101 110 -27 -26 10270.59 10337.47 10304.03 10370.91 10337.47 10404.35 9936.19 10003.07 9969.63 10036.51 10003.07 10069.95 7 8 111 1000 -25 -24 10404.35 10471.23 10437.79 10504.67 10471.23 10538.11 10069.95 10136.83 10103.39 10170.27 10136.83 10203.71 9 10 1001 1010 -23 -22 10538.11 10604.99 10571.55 10638.43 10604.99 10671.87 10203.71 10270.59 10237.15 10304.03 10270.59 10337.47 11 12 1011 1100 -21 -20 10671.87 10738.75 10705.31 10772.19 10738.75 10805.63 10337.47 10404.35 10370.91 10437.79 10404.35 10471.23 13 14 1101 1110 -19 -18 10805.63 10872.51 10839.07 10905.95 10872.51 10939.39 10471.23 10538.11 10504.67 10571.55 10538.11 10604.99 15 16 1111 10000 -17 -16 10939.39 11006.27 10972.83 11039.71 11006.27 11073.15 10604.99 10671.87 10638.43 10705.31 10671.87 10738.75 17 18 10001 10010 -15 -14 11073.15 11140.03 11106.59 11173.47 11140.03 11206.91 10738.75 10805.63 10772.19 10839.07 10805.63 10872.51 19 20 10011 10100 -13 -12 11206.91 11273.79 11240.35 11307.23 11273.79 11340.67 10872.51 10939.39 10905.95 10972.83 10939.39 11006.27 21 22 10101 10110 -11 -10 11340.67 11407.55 11374.11 11440.99 11407.55 11474.43 11006.27 11073.15 11039.71 11106.59 11073.15 11140.03 23 24 10111 11000 -9 -8 11474.43 11541.31 11507.87 11574.75 11541.31 11608.19 11140.03 11206.91 11173.47 11240.35 11206.91 11273.79 25 26 11001 11010 -7 -6 11608.19 11675.07 11641.63 11708.51 11675.07 11741.95 11273.79 11340.67 11307.23 11374.11 11340.67 11407.55 27 28 11011 11100 -5 -4 11741.95 11808.83 11775.39 11842.27 11808.83 11875.71 11407.55 11474.43 11440.99 11507.87 11474.43 11541.31 29 30 11101 11110 -3 -2 11875.71 11942.59 11909.15 11976.03 11942.59 12009.47 11541.31 11608.19 11574.75 11641.63 11608.19 11675.07 31 32 33 34 11111 100000 100001 100010 -1 0 1 2 12009.47 12076.35 12143.23 12210.11 12042.91 12109.79 12176.67 12243.55 12076.35 12143.23 12210.11 12276.99 11675.07 11741.95 11808.83 11875.71 11708.51 11775.39 11842.27 11909.15 11741.95 11808.83 11875.71 11942.59 35 36 100011 100100 3 4 12276.99 12343.87 12310.43 12377.31 12343.87 12410.75 11942.59 12009.47 11976.03 12042.91 12009.47 12076.35 REVISION 008 - AUG 2018 3901075030 48 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 37 38 100101 100110 5 6 12410.75 12477.63 12444.19 12511.07 12477.63 12544.51 12076.35 12143.23 12109.79 12176.67 12143.23 12210.11 39 40 100111 101000 7 8 12544.51 12611.39 12577.95 12644.83 12611.39 12678.27 12210.11 12276.99 12243.55 12310.43 12276.99 12343.87 41 42 101001 101010 9 10 12678.27 12745.15 12711.71 12778.59 12745.15 12812.03 12343.87 12410.75 12377.31 12444.19 12410.75 12477.63 43 44 101011 101100 11 12 12812.03 12878.91 12845.47 12912.35 12878.91 12945.79 12477.63 12544.51 12511.07 12577.95 12544.51 12611.39 45 46 101101 101110 13 14 12945.79 13012.67 12979.23 13046.11 13012.67 13079.55 12611.39 12678.27 12644.83 12711.71 12678.27 12745.15 47 48 101111 110000 15 16 13079.55 13146.43 13112.99 13179.87 13146.43 13213.31 12745.15 12812.03 12778.59 12845.47 12812.03 12878.91 49 50 110001 110010 17 18 13213.31 13280.19 13246.75 13313.63 13280.19 13347.07 12878.91 12945.79 12912.35 12979.23 12945.79 13012.67 51 52 110011 110100 19 20 13347.07 13413.95 13380.51 13447.39 13413.95 13480.83 13012.67 13079.55 13046.11 13112.99 13079.55 13146.43 53 54 110101 110110 21 22 13480.83 13547.71 13514.27 13581.15 13547.71 13614.59 13146.43 13213.31 13179.87 13246.75 13213.31 13280.19 55 56 110111 111000 23 24 13614.59 13681.47 13648.03 13714.91 13681.47 13748.35 13280.19 13347.07 13313.63 13380.51 13347.07 13413.95 57 58 111001 111010 25 26 13748.35 13815.23 13781.79 13848.67 13815.23 13882.11 13413.95 13480.83 13447.39 13514.27 13480.83 13547.71 59 60 111011 111100 27 28 13882.11 13948.99 13915.55 13982.43 13948.99 14015.87 13547.71 13614.59 13581.15 13648.03 13614.59 13681.47 61 62 111101 111110 29 30 14015.87 14082.75 14049.31 14116.19 14082.75 14149.63 13681.47 13748.35 13714.91 13781.79 13748.35 13815.23 63 111111 31 14149.63 14183.07 14216.51 13815.23 13848.67 13882.11 REVISION 008 - AUG 2018 3901075030 49 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet Slope: -67 LSB/K Calib2 - TRIM_TEMP 85degC 105degC Dec Bin Offset (degC) LSL expected USL LSL expected USL 1 2 1 10 -31 -30 5990.27 6057.15 6023.71 6090.59 6057.15 6124.03 4652.67 4719.55 4686.11 4752.99 4719.55 4786.43 3 4 11 100 -29 -28 6124.03 6190.91 6157.47 6224.35 6190.91 6257.79 4786.43 4853.31 4819.87 4886.75 4853.31 4920.19 5 6 101 110 -27 -26 6257.79 6324.67 6291.23 6358.11 6324.67 6391.55 4920.19 4987.07 4953.63 5020.51 4987.07 5053.95 7 8 111 1000 -25 -24 6391.55 6458.43 6424.99 6491.87 6458.43 6525.31 5053.95 5120.83 5087.39 5154.27 5120.83 5187.71 9 10 1001 1010 -23 -22 6525.31 6592.19 6558.75 6625.63 6592.19 6659.07 5187.71 5254.59 5221.15 5288.03 5254.59 5321.47 11 12 1011 1100 -21 -20 6659.07 6725.95 6692.51 6759.39 6725.95 6792.83 5321.47 5388.35 5354.91 5421.79 5388.35 5455.23 13 14 1101 1110 -19 -18 6792.83 6859.71 6826.27 6893.15 6859.71 6926.59 5455.23 5522.11 5488.67 5555.55 5522.11 5588.99 15 16 1111 10000 -17 -16 6926.59 6993.47 6960.03 7026.91 6993.47 7060.35 5588.99 5655.87 5622.43 5689.31 5655.87 5722.75 17 18 10001 10010 -15 -14 7060.35 7127.23 7093.79 7160.67 7127.23 7194.11 5722.75 5789.63 5756.19 5823.07 5789.63 5856.51 19 20 10011 10100 -13 -12 7194.11 7260.99 7227.55 7294.43 7260.99 7327.87 5856.51 5923.39 5889.95 5956.83 5923.39 5990.27 21 22 10101 10110 -11 -10 7327.87 7394.75 7361.31 7428.19 7394.75 7461.63 5990.27 6057.15 6023.71 6090.59 6057.15 6124.03 23 24 10111 11000 -9 -8 7461.63 7528.51 7495.07 7561.95 7528.51 7595.39 6124.03 6190.91 6157.47 6224.35 6190.91 6257.79 25 26 11001 11010 -7 -6 7595.39 7662.27 7628.83 7695.71 7662.27 7729.15 6257.79 6324.67 6291.23 6358.11 6324.67 6391.55 27 28 11011 11100 -5 -4 7729.15 7796.03 7762.59 7829.47 7796.03 7862.91 6391.55 6458.43 6424.99 6491.87 6458.43 6525.31 29 30 11101 11110 -3 -2 7862.91 7929.79 7896.35 7963.23 7929.79 7996.67 6525.31 6592.19 6558.75 6625.63 6592.19 6659.07 31 11111 -1 7996.67 8030.11 8063.55 6659.07 6692.51 6725.95 32 100000 0 8063.55 8096.99 8130.43 6725.95 6759.39 6792.83 33 100001 1 8130.43 8163.87 8197.31 6792.83 6826.27 6859.71 34 35 100010 100011 2 3 8197.31 8264.19 8230.75 8297.63 8264.19 8331.07 6859.71 6926.59 6893.15 6960.03 6926.59 6993.47 36 37 100100 100101 4 5 8331.07 8397.95 8364.51 8431.39 8397.95 8464.83 6993.47 7060.35 7026.91 7093.79 7060.35 7127.23 38 39 100110 100111 6 7 8464.83 8531.71 8498.27 8565.15 8531.71 8598.59 7127.23 7194.11 7160.67 7227.55 7194.11 7260.99 40 41 101000 101001 8 9 8598.59 8665.47 8632.03 8698.91 8665.47 8732.35 7260.99 7327.87 7294.43 7361.31 7327.87 7394.75 42 43 101010 101011 10 11 8732.35 8799.23 8765.79 8832.67 8799.23 8866.11 7394.75 7461.63 7428.19 7495.07 7461.63 7528.51 44 45 101100 101101 12 13 8866.11 8932.99 8899.55 8966.43 8932.99 8999.87 7528.51 7595.39 7561.95 7628.83 7595.39 7662.27 46 47 101110 101111 14 15 8999.87 9066.75 9033.31 9100.19 9066.75 9133.63 7662.27 7729.15 7695.71 7762.59 7729.15 7796.03 48 110000 16 9133.63 9167.07 9200.51 7796.03 7829.47 7862.91 REVISION 008 - AUG 2018 3901075030 50 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 49 50 110001 110010 17 18 9200.51 9267.39 9233.95 9300.83 9267.39 9334.27 7862.91 7929.79 7896.35 7963.23 7929.79 7996.67 51 52 110011 110100 19 20 9334.27 9401.15 9367.71 9434.59 9401.15 9468.03 7996.67 8063.55 8030.11 8096.99 8063.55 8130.43 53 54 110101 110110 21 22 9468.03 9534.91 9501.47 9568.35 9534.91 9601.79 8130.43 8197.31 8163.87 8230.75 8197.31 8264.19 55 56 110111 111000 23 24 9601.79 9668.67 9635.23 9702.11 9668.67 9735.55 8264.19 8331.07 8297.63 8364.51 8331.07 8397.95 57 58 111001 111010 25 26 9735.55 9802.43 9768.99 9835.87 9802.43 9869.31 8397.95 8464.83 8431.39 8498.27 8464.83 8531.71 59 60 111011 111100 27 28 9869.31 9936.19 9902.75 9969.63 9936.19 10003.07 8531.71 8598.59 8565.15 8632.03 8598.59 8665.47 61 62 111101 111110 29 30 10003.07 10069.95 10036.51 10103.39 10069.95 10136.83 8665.47 8732.35 8698.91 8765.79 8732.35 8799.23 63 111111 31 10136.83 10170.27 10203.71 8799.23 8832.67 8866.11 Table 23: 6-Bit Temperature curve offset information for a typical slope of -67 LSB/K. 9.4.12. EnChan register This register contains bit to enable/disable active light and ambient light channels. Bit EnChan 0xD Read/Write Init         7 6 5 4 3 2 1 EN_ TEMP EN_ DIAG_A EN_ DIAG_B EN_ CH_A EN_ CH_B EN_ CH_C EN_ CH_D R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 0 EN_ DIAGA MB R/W 1 EN_TEMP: 1 = temperature channel is in use, 0 = temperature channel is not in use EN_DIAG_A: 1 = enables diagnostics on active light channel A, 0 = disables the diagnostics EN_DIAG_B: 1 = enables diagnostics on active light channel B, 0 = disables the diagnostics EN_CH_A: 1 = active light channel A is enabled (TIA + Demodulator + Anti-Aliasing Filter + SC-LPF), 0 = active light channel A is completely switched off to reduce current consumption EN_CH_B: 1 = active light channel B is enabled (TIA + Demodulator + Anti-Aliasing Filter + SC-LPF), 0 = active light channel B is completely switched off to reduce current consumption EN_CH_C: 1 = ambient light channel C is in use, 0 = ambient light channel C is not in use EN_CH_D: 1 = ambient light channel D is in use, 0 = ambient light channel D is not in use EN_DIAGAMB: 1= ambient diagnosis is possible, 0= ambient diagnosis is not possible The bits EN_CH_A/EN_CH_B/EN_DIAGAMB can be used to switch off channels that are not needed, and thus reducing the current consumption. When going into Sleep or Standby the setting of these bits is ignored, all channels will be switched off independently of EN_CH register contents. The bits EN_TEMP/EN_CH_C/EN_CH_D/EN_DIAGAMB are used to indicate which channels are in use and which channels are not in use. Terminals, which are not connected, must be disabled in the ENChan register. Otherwise error flags might occur. In case all EN_CH_C/D/DIAGAMB bits are set to zero, but an ambient measurement is requested, then the Command Invalid status flag will be set high. The measurement itself will not be executed. REVISION 008 - AUG 2018 3901075030 51 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.4.13. Tamb register This register contains settings for the DC light compensation circuitry + controls the repetition rate of the auto-zero timer. Bit Tamb 0xE Read/Write Init     7 DC_ COMP_ IC53 6 DC_ COMP_ IC52 5 DC_ COMP_ IC51 4 DC_ COMP_ IC50 3 2 1 0 - - Tamb1 Tamb0 R/W 0 R/W 0 R/W 0 R/W 0 R 0 R 0 R/W 1 R/W 0 DC_COMP_IC5: setting of the amplitude of the 5th PWL slope Tamb: not implemented, read as '0' Tamb: controls the repetition rate of the auto-zero timer REVISION 008 - AUG 2018 3901075030 Tamb1 Tamb0 Repetition Rate (ms +/-5%) 0 0 0 1 1.25 2.5 1 0 5 1 1 10 52 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.5. Window Watchdog Timer The internal watchdog timer is a watchdog based on two different windows: an open and a closed window. During the open window the master can restart the watchdog timer. During the closed window, no restarts are accepted. The restart (re-initialisation) of the watchdog timer happens via the WT (Watchdog Trigger) pin: when a falling edge is detected on the WT pin, the watchdog will be restarted. The low time on the WT pin should be at least a time twt_l. After a POR or a reset issued by the watchdog and after a wake-up from Sleep Mode (either by uploading the NRM command, or by using the WAKE_UP pin), the window watchdog will open an active window of a time t wdt_init, during which a watchdog restart must be issued by the µC. If no watchdog restart is received by the end of the open window, the µC will be reset. After this initial period, the window watchdog is programmed to wait a time t wdt_closed during which no watchdog restarts are allowed. If a watchdog restart is sent during the closed window time, the watchdog will reset the master via the MR (Master Reset) pin. After a closed window, an open window of a time twdt_open will follow during which a watchdog restart is expected. If no watchdog restart is received till the end of the open window, the µC will be reset via the MR pin. Changing mode between Normal Running Mode and Standby Mode will not influence the watchdog timing or state. Also a CR command will not change the used window times. The watchdog counter will not be influenced when changing mode between NRM and STBY or when uploading a CR command. The Watch Dog Timer is disabled in Sleep Mode. A falling edge on the WT pin in the Sleep Mode will set an error flag in the register ‘Err’. Coming back from Sleep Mode to Normal Running Mode always restarts the watchdog with the initial timing window. This figure shows what timing windows are used in the different operating modes: POR Device State NRM STBY NRM SLP NRM twdt_init twdt_closed twdt_open twdt_closed twdt_open twdt_closed twdt_open twdt_init twdt_closed twdt_open WDT Window Figure 16 : Window times during different operating modes The two diagrams below show the functionality of the watchdog timer: REVISION 008 - AUG 2018 3901075030 53 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet twdt_closed WatchdogWindow twdt_open twdt_open High = Active Window Missing WT WT (Watchdog Trigger) MR (Master Reset) Initial Period t ms twdt_init twdt_closed WatchdogWindow twdt_open High = Active Window WT (Watchdog Trigger) Premature WT MR (Master Reset) Initial Period t ms twdt_init Figure 17 : Functionality of the window watchdog timer A reset of the µC due to time-out of the watchdog is achieved by setting the MR pin low during a time tMR (default state of the MR pin is high). When the device is operating in Sleep or Standby Mode, the WAKE_UP pin will be monitored. When a falling edge is detected on that pin, the device will switch to Normal Running Mode and, when waking up from Sleep Mode, the Watchdog Timer will be started (with an initial window time of t wdt_init). Note that no pull-up or pull-down resistor is foreseen on the WAKE_UP pin. To avoid that parasitic spikes can wake up the device, the WAKE_UP input is debounced (typical debounce time is in the range of 2µs). The low time on the WAKE_UP pin should be at least a time twu_l. REVISION 008 - AUG 2018 3901075030 54 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.6. Reset Behaviour Power-On Reset After a Power-On Reset, the device is operating in Normal Running Mode. All internal data registers are set to their initial state:  the device state is Normal Running Mode  the Watchdog counter is initialized to generate the initial window time  all registers containing (diagnostic) measurement data are initialized to 0x00  bits 7, 4, 3 of the Internal Status Flags are cleared  the user settings registers are set to their initial values (see Section 9.4)  the 'Err' register will initialize to 0x00. However, as some voltages are continuously measured, it will reflect immediately if an error is detected or not. The MR pin will be initialized to '1'. The DR pin will be initialized to '0', but after the time tstartup it will switch to '1' to indicate that the device is ready to accept the first command (see also Section 9.9). The output of the MISO pin is depending on the CS state: if CS is high, the MISO pin is in tri-state. If CS is low, the output of the MISO pin is undefined. CR Command At every upload of the CR command, the device returns to the state like it is after a Power-On-Reset, except for the Watchdog counter and the state of the MR line. The Watchdog counter and the state of the MR line will not be influenced by uploading a CR command. Also, the CR command will not change the contents of the 'Rst' register. After a CR command the DR pin will be kept low during a time t startup. Read-out At the end of each read-out, all registers containing (diagnostic) measurement data are cleared to 0x00. Watchdog time-out When a reset occurs due to a watchdog time-out, the MR pin will go low for a time tMR. The Watchdog counter will be initialized with the window time twdt_init. All other states, lines and registers of the ASIC will not be affected. Changing operation mode When changing operation mode (RSLP, CSLP, RSTBY, CSTBY, NRM) the right status flags are set. Changing operation mode will not affect the user settings registers and the (diagnostic) measurement data registers. The DR pin will be set to '0' and after the time twakeup_slp resp. twakeup_stby it will be set to '1', when waking up from Sleep resp. Standby Mode. REVISION 008 - AUG 2018 3901075030 55 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.7. Wake-up from Sleep or Standby The figure below shows what happens when switching operation mode, and the behaviour of the DR pin and the watchdog timer. The WAKE_UP pin is only monitored during Sleep and Standby. When a falling edge is detected during Sleep or Standby, the following will happen: - the DR pin goes low for a time twakeup_stby or twakeup_slp - the watchdog timer is initialised and starts counting, when waking up from Sleep - the device changes to Normal Running Mode, enabling the appropriate blocks POR WAKE-UP NRM Mode STBY Mode SLP Mode Level depending on CR/SM/SD Level depending on CR/SM/SD Watchdog Init tstartup Level depending on CR/SM/SD twakeup_stby Active twakeup_slp Init DR Active Figure 18 : Behaviour of DR and Watchdog when switching mode REVISION 008 - AUG 2018 3901075030 56 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.8. CRC Calculation 8 2 1 0 The 8-bit CRC calculation will be based on the polynomial x + x + x + x . This polynomial is widely used in the industry, it is e.g. used for generating:  the Header Error Correction field in ATM (Asynchronous Transfer Mode) cells  the Packet Error Code in SMBus data packets Some probabilities of detecting errors when using this polynomial:  100% detection of one bit errors  100% detection of double bit errors (adjacent bits)  100% detection of two single-bit errors for frames less than 128 bits in length  100% detection of any odd number of bits in error  100% detection of burst errors up to 8 bits  99.61% detection of any random error A possible hardware implementation using a Linear Feedback Shift Register (LFSR) is shown in the figure below: Figure 14: 8-bit CRC implementation using a LFSR The generation of the CRC requires the following steps:     Reset all flip-flops 0x00 is the initial value, shifting in all zeroes does not affect the CRC Shift in the read-out data bytes. First byte is Data Byte 1 (= Internal Status Flags), last byte is Data Byte (X+1) (with X defined in Figure 12). When the last byte has been shifted in, the flip-flops contain the CRC: CRC=FF[8..1]. An easy method to check if there were no transmission errors is to calculate the CRC of the whole read-out data stream including the CRC Byte. When the calculated CRC results in 0x00, the transmission was most likely error free. If the resulting CRC is not equal to zero, then an error occurred in the transmission and the complete data stream should be ignored. Some CRC results for example messages are given in Table 24. ASCII String messages -None"A" "123456789" a string of 256 upper case "A" characters with no line breaks CRC result 0x00 0xC0 0xF4 0x8E Table 24: CRC examples REVISION 008 - AUG 2018 3901075030 57 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 9.9. Global Timing Diagrams A global timing diagram with separate SM-RO cycles is given in Figure 19. After power-up there is a Power-On-Reset phase (POR) to initialize the sensor into a reset state. When the device is ready to accept the first command, the DR pin goes high. In Figure 19 the first command is the WR command to define the contents of the user registers (optionally). The first measurement cycle is e.g. initiated by uploading a SM command. After completion of the measurement cycle, the DR goes high. This indicates that the read-out cycle can be started. A RO command has to be uploaded to bring the data on the MISO pin. When the read-out is completed, a new measurement cycle can be started. In Figure 19 a SM command is used. This starts a next measurement cycle. Once DR is high, a read-out can be done again. In between different Measurement/Read-Out cycles, the user registers can be changed with WR commands. Optionally those registers can be read back with the RR command to check if the right values were uploaded. POR CS SCLK MOSI (WR) SM RO MISO (WR) SM RO Output Data Output Data DR Device State POR Idle Internal Registers SM Measurement Idle Filling up Data Available 0 Read-out Idle Emptying SM Measurement Idle Filling up Data Available 0 Read-out Idle Emptying 0 Figure 19: Global timing diagram with separate SM-RO Figure 20 shows a timing diagram wherein separate SM-RO cycles are mixed with combined SM-RO cycles. After the PowerOn-Reset phase, a SM measurement cycle is started. Once the DR pin is high, the data can be read out. A SM command with extra clocks is used to combine the read-out and the start of the next measurement cycle. With the extra clocks, the data of the internal registers is transferred to the MISO pin. When the CS pin goes high, the next measurement cycle (SM) will be started. Once the DR pin is high, a normal RO command is uploaded to bring the data to the MISO pin. If needed, the settings in the user registers can be changed with the WR command and optionally the RR command can be used to check if the right values were uploaded. A new measurement cycle can be started with e.g. a normal SM command. When the DR pin is high, the data can be transferred by uploading e.g. a SM command that combines the read-out and the start of a new measurement cycle. POR CS SCLK MOSI (WR) SM SM MISO RO Output Data (WR) SM SM Output Data Output Data DR Device State Internal Registers POR Idle 0 SM Measurement Idle Filling up Data Available Read-out Emptying SM Measurement 0 Filling up Idle Data Available Read-out Emptying Idle 0 SM Measurement Idle Filling up Data Available Read-out Emptying SM Measurement 0 Filling up Figure 20: Global timing diagram with separate SM-RO and combined SM-RO together REVISION 008 - AUG 2018 3901075030 58 of 68 Idle Data Available MLX75030 Universal ActiveLight Sensor Interface Datasheet 10. Performance Graphs 10.1. ActiveLight Channel DC Measurement 10.2. Temperature Sensor Characteristics MLX75030 lightmeasurement measurementatatrain active light channels MLX75308BA DCDClight channels 60000 55000 MLX75030 temperatures [deg.C] vs. ADC out of temperature sensor MLX75308BA (slope and offset depends on Calib1 and Calib2) 50000 45000 PDA 00 0 16 0 32 90 40000 0 48 PDB 80 35000 0 63 70 80 30000 8 16 60 25000 temperature [deg. C] 8 32 20000 15000 10000 50 8 48 40 8 63 30 bold green Calib1 = 16 / Calib2 = 32: no offset at 30 deg. C and slope is -67 LSB/K 20 5000 24 16 24 32 24 48 2800 3300 3800 4300 4800 5300 5800 6300 6800 7300 7800 8300 8800 9300 9800 10300 10800 11300 11800 12250 12750 13250 13750 14250 500 14750 450 15250 400 15750 350 16250 300 16750 250 17250 200 17750 150 18250 100 18750 50 19250 0 -10 19750 0 0 31 48 -40 31 63 ADC output of temperature sensor [LSB] 10.3. Ambient Light Channel C 16 32 10.4. Ambient Light Channel D 50000 detection range channel PDC 40000 max offset (2304LSB) @ 100uA and min slope (5300 LSB/dec) 20000 min offset (-2304LSB) @ 100uA and max slope (6500 LSB/dec) 10000 0 -10000 1.E-12 1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 Ambient Current Channel C [A] REVISION 008 - AUG 2018 3901075030 31 0 31 32 -30 30000 24 63 31 16 -20 Idc [uA] ADC out [LSB] 24 0 10 20250 ADC out [LSB] Calib1 Calib2 100 59 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 11. Application Information 11.1. Application circuit for 2 ActiveLight channels and 2 ambient light channels Component Type Value Description C1 SMD capacitor 47nF Blocking capacitor, connected to analog GND C2 SMD capacitor 68nF Blocking capacitor for int. voltage regulator, connected to analog GND R1 SMD resistor 6.4 Ohms Shunt Resistor R2 SMD resistor 56k Ohms Ambient Light Diagnostic termination resistor M1 LED driver MOSFET M2 LED driver MOSFET LED1/2 Active light channel Infrared LED PDA / PDB Active light channel infrared photodiode, daylight blocking mold PDC V-lambda photodiode PDD Photodiode Table 25: Application circuit components for 2 ActiveLight and 2 ambient light channels REVISION 008 - AUG 2018 3901075030 60 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 12. Application Comments The MLX75030 is featuring very sensitive current inputs on the pins 9 and 10 for active light detection and on the pins 11 and 12 for ambient light measurements in a range over several orders of magnitude. In order to achive optimum results in the application it is recommended to consider the following hints for the design of the PCB: 1. The both supply voltage pins 16 (VDDA for analog circuit parts) and 23 (VDDD for digital circuit parts) shall be starconnected to the local (external) regulator output (3.0V-3.6V) in order to avoid digital disturbance injection into the analog supply. 2. Note that the device works with two separate ground connections: Pin 15 works as analog ground for the sensitive input circuitry whereas pin 24 works as digital ground and as ground connection of the LED path, which carries high pulse currents. 3. The Exposed Pad of the package should be star-connected to the local (external) ground pin of the regulator. 4. The external blocking capacitors C1 and C2 shall be placed as close as possible to the corresponding pins of the device. 5. The external photodiodes on the active light channel inputs as well as on the ambient light inputs shall be placed as close as possible to the corresponding pins of the device. If this is not possible due to constructive reasons, the connections shall be shielded by a noise-free analog ground plane in order to avoid performance-loss due to disturbance coupling. 6. Notice that GNDAMB must not be connected to any GND line on the PCB. This terminal is actively switched to supply voltage during diagnosis mode. 7. Note that not connected input channels (ActiveLight, ambient light) must be disabled in the EnChan register. 8. For diagnosis purposes on pin DIAGAMB a current of 10uA is recommended. For a current in this range the diagnosis result is least sensitive to temperature. REVISION 008 - AUG 2018 3901075030 61 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 13. Tape and Reel Specification REVISION 008 - AUG 2018 3901075030 62 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet REVISION 008 - AUG 2018 3901075030 63 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet REVISION 008 - AUG 2018 3901075030 64 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 14. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices)   IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)   EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices)  EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)  EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.asp REVISION 008 - AUG 2018 3901075030 65 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 15. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 16. Package Information DxE Quad 4x4 N 24 e 0.50 ±0.05 A min max 0.80 1.00 A1 A3 All dimensions in mm 0.00 0.20 REF 0.05 D2 E2 L K b 2.50 2.70 2.50 2.70 0.35 0.45 0.20 – 0.18 0.30 Table 26: Package dimensions Package Θjc [°C/W] Θja [°C/W] (JEDEC 1s0p board) Θja [°C/W] (JEDEC 1s2p board) QFN 4x4 16 154 50 Table 27: JA values REVISION 008 - AUG 2018 3901075030 66 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 17. Marking Information Part Number 18 17 16 15 14 13 75030 A 12345 1025 19 20 21 12 5-digit Lot Number 11 10 ` 22 23 24 1 2 3 4 5 9 8 7 4-digit Date Code Format: YYWW 6 Figure 21: Package marking of the MLX75030 device in QFN24 4x4 SMD package REVISION 008 - AUG 2018 3901075030 67 of 68 MLX75030 Universal ActiveLight Sensor Interface Datasheet 18. Disclaimer The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including with out limitation, special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, noninfringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services. The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prio r to designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current. Users or any third party must further determine the suitability of the Product for its application, including the level of re liability required and determine whether it is fit for a particular purpose. The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the In formation does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights. This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities. The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability app lications, such as medical life-support or lifesustaining equipment are specifically not recommended by Melexis. The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance o r storage of missiles for such weapons: 2) civil firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can b e used as a means of violence in an armed conflict or any similar violent situation. The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-andconditions. This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document. Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016) ISO/TS 16949 and ISO14001 Certified For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: Phone: +32 1367 0495 E-mail: sales_europe@melexis.com America: Phone: +1-248-306-5400 E-mail: sales_usa@melexis.com ISO/TS 16949 and ISO14001 Certified REVISION 008 - AUG 2018 3901075030 68 of 68