MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
1. Features and Benefits
LIN 2.x/SAE J2602 and ISO17987-4 compliant
Dual/Quad - enhanced master transceiver function for each channel
Backward compatible to quad-channel master transceiver MLX80001
Small footprint QFN4x4 package (wettable flanks) and minimum external component count
Dual/Quad versions with same package and footprint for cost/space optimized design
Slew rate selection and High Speed Flash mode
Wide operating voltage range VS = 5 to 27 V
Fully compatible to 3.3V and 5V devices
Very low standby current consumption of (typ) 10µA in sleep mode
WAKE input for local wake-up capability
Remote and local wake-up source recognition
Control output INH for external components
Integrated termination (resistor & decoupling diode) for both LIN master & slave nodes
TxD dominant time out function in slave configuration
RxD dominant time out function in master configuration
Sleep timer
Low EME (emission) and high EMI (immunity) level
High impedance LIN pin in case of loss of ground or battery
Enhanced ESD robustness
o +/- 10kV according to IEC 61000-4-2 for pins LIN, Vs and WAKE
2. Ordering Information
Product Code
MLX80002
MLX80004
Legend:
Temperature Code:
Package Code:
Option Code:
Packing Form:
Ordering example:
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3901080004
Temperature
Code
K
K
Package Code
Option Code
LW
LW
CAA-101
BAA-101
Packing Form
Code
RE
RE
K = -40 to 125°C
LW = Quad Flat Package (QFN), wettable flanks
BAA-101 = Design Revision
RE = Reel
MLX80004 KLW-BAA-101-RE
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
3. General Description
The MLX80004(2) is a quad/dual LIN transceiver physical layer device for a single wire data link capable of operating in
applications using baud rates up to 20kBd. It is compliant to LIN2.x as well as to the SAE J2602 specifications. The IC
furthermore can be used in ISO9141 systems. The MLX80004 is functionally compatible to the MLX80001 quad master
LIN transceiver.
The device is flexible for use in LIN – master applications and slave applications as well.
Due to the integrated master termination and the high ESD/EMC robustness of the device a minimum space and
number of external components is required.
The number of LIN – channels can be easily adapted on the application requirements by combinations of quad and dual
channel devices within the same foot print.
Because of the very low power consumption of the MLX80004 while being in sleep mode it’s suitable for ECU
applications with hard standby current requirements. The implemented high resistive LIN - termination in sleep mode as
well as the RxD dominant time-out feature allows a comfortable handling of LIN short circuits to GND.
In order to reduce the power consumption in case of failure modes, the integrated sleep timer takes care for switching
the IC into the most power saving sleep mode after Power-On or Wake-Up events are not followed by a mode change
response of the microcontroller.
The MLX80004/2 has an improved EMI performance and ESD robustness according to the OEM Common Hardware
Requirements for LIN in Automotive Applications Rev.1.2.
By using the MODE0/1 pins the application can be easily adapted on the required baud rate in order to optimize the
EMC emissions. A high speed Flash Mode with disabled slew rate control is available as well.
To fulfill different OEM requirements, the integrated master termination can be disabled and external master resistors
and decoupling diodes can be used. In this mode the MLX80004/2 can be used in slave applications as well.
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
4. Table of Contents
1. Features and Benefits .......................................................................................................................................................... 1
2. Ordering Information ........................................................................................................................................................... 1
3. General Description ............................................................................................................................................................. 2
4. Table of Contents ................................................................................................................................................................. 3
5. Block Diagram ...................................................................................................................................................................... 5
6. Pin Description ..................................................................................................................................................................... 6
7. Electrical Specification ......................................................................................................................................................... 7
7.1. Operating Conditions .......................................................................................................................................................................7
7.2. Absolute Maximum Ratings .............................................................................................................................................................8
7.3. Static Characteristics ........................................................................................................................................................................9
7.4. Dynamic Characteristics .................................................................................................................................................................12
7.4.1. Duty Cycle Calculation ....................................................................................................................................................... 13
8. Functional Description ....................................................................................................................................................... 15
8.1. Operating Modes ...........................................................................................................................................................................16
8.2. Initialization and Standby mode ....................................................................................................................................................16
8.3. Active Modes..................................................................................................................................................................................16
8.3.1. High Speed mode .............................................................................................................................................................. 17
8.3.2. Low speed mode ............................................................................................................................................................... 17
8.3.3. Normal speed mode .......................................................................................................................................................... 17
8.4. Sleep Mode ....................................................................................................................................................................................17
8.5. Wake Up .........................................................................................................................................................................................18
8.6. Wake Up Source Recognition.........................................................................................................................................................18
8.7. Master / Slave configuration ..........................................................................................................................................................21
9. Fail-safe Features ............................................................................................................................................................... 22
9.1. Loss of battery ................................................................................................................................................................................22
9.2. Loss of Ground ...............................................................................................................................................................................22
9.3. Short circuit to battery ...................................................................................................................................................................22
9.4. Ground shift and short circuit to ground .......................................................................................................................................22
9.5. Thermal overload ...........................................................................................................................................................................22
9.6. Undervoltage lock out ....................................................................................................................................................................22
9.7. Open Circuit protection .................................................................................................................................................................22
9.8. TxDx faulty start protection ...........................................................................................................................................................23
9.9. RxDx dominant time-out ................................................................................................................................................................23
9.10. TxDx dominant time-out ..............................................................................................................................................................23
10. Application Example ........................................................................................................................................................ 24
10.1. Enhanced Master Mode...............................................................................................................................................................24
10.2. Standard Transceiver Mode .........................................................................................................................................................25
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
10.3. Application Circuitry for EMC.......................................................................................................................................................26
10.3.1. External Circuitry on Supply Lines ................................................................................................................................... 27
10.3.2. External Circuitry on LIN Lines ......................................................................................................................................... 27
10.3.3. External Circuitry on Signal Lines .................................................................................................................................... 27
11. Package Mechanical Specification ................................................................................................................................... 28
12. Package Marking Information .......................................................................................................................................... 29
13. Tape and Reel Specification ............................................................................................................................................. 30
14. ESD and EMC.................................................................................................................................................................... 33
14.1. Automotive Qualification Test Pulses ..........................................................................................................................................33
14.2. Test Pulses On supply Lines .........................................................................................................................................................33
14.3. Test pulses on Pin LIN ..................................................................................................................................................................34
14.4. Test pulses on signal lines ............................................................................................................................................................34
14.5. Test circuitry for automotive transients ......................................................................................................................................35
14.6. EMC Test pulse definition ............................................................................................................................................................36
15. Standard information regarding manufacturability of Melexis products with different soldering processes ................. 38
16. Disclaimer ........................................................................................................................................................................ 39
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
5. Block Diagram
MLX80004
MLX80002
VS
INH
3.3V
Supply
Vs
Temp.
Protection
Vs
monitor/
POR
Mode
Control
MODE0
RCO
Sleep timer
Wake-up
Control
P3
P2
fuse
fuse
fuse
P0
P1
WAKE
fuse
RxDx time out
TxDx time out
MODE1
Bias
Calibration
& Control
Slew
rate
DIS_MAS
Master
Pull up
50uA
Vs
WakeFilter
RxD1
Rec-Filter
30K
1K
Receiver
LIN1
Filter
TxD1
TxTo
TSD
Driver
control
Local
WU
Vs
WakeFilter
RxD2
Rec-Filter
30K
1K
Receiver
LIN2
TxD2
Filter
TxTo
TSD
RxD3
Driver
control
channel3
LIN3
channel4
LIN4
TxD3
RxD4
TxD4
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
Figure 1: Block Diagram MLX80004/2.
6. Pin Description
Figure 2: Pinout MLX80004 QFN4x4 24L
Figure 3: Pinout MLX80002 QFN4x4 24L
Table 1: Pin List
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
EPad
MLX80004
MLX80002
RxD1
TxD1
MODE0
MODE1
TxD4
N.C.
RxD4
N.C.
DIS_MAS
N.C.
LIN4
N.C.
GNDL
LIN3
N.C.
WAKE
RxD3
N.C.
TxD3
N.C.
GND
TxD2
RxD2
N.C.
INH
VS
LIN2
GNDL
LIN1
N.C.
GND / GNDL
I/O-Type
O
I
I
I
I
O
I
Description
Receive Data LIN Ch1, open drain
Transmit Data LIN Ch1 (+ local WU-Flag)
Operating Mode Selection Input 1
Operating Mode Selection Input 2
Transmit Data LIN Ch4
Receive Data LIN Ch4, open drain
disable integrated master resistor
I/O
G
I/O
I
O
I
G
I
O
LIN Bus Ch4
Ground LIN
LIN Bus Ch3
local wake up input, low active
Receive Data LIN Ch3, open drain
Transmit Data LIN Ch3
Ground
Transmit Data LIN Ch2
Receive Data LIN Ch2, open drain
O
P
I/O
G
I/O
HV High Side Control Pin
Battery Voltage
LIN Bus Ch2
Ground LIN
LIN Bus Ch1
G
Exposed Pad of Package (grounded heatsink) 1
1
For enhanced thermal and electrical performance, the exposed pad of the QFN package should be soldered
to the board ground plane (and not to any other voltage level).
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
7. Electrical Specification
All voltages are referenced to ground (GND). Positive currents flow into the IC.
The absolute maximum ratings (in accordance with IEC 60 134) given in the table below are limiting values that do not
lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting
values may affect the reliability of the device.
7.1. Operating Conditions
Table 2: Operating Conditions
[1]
[2]
Nr.
Parameter
101
Battery supply voltage
102
Extended battery supply voltage
103
Operating ambient temperature
104
Voltage on low voltage I/Os (RxDx, TxDx,
MODEx
[1] [2]
Symbol
Min
Max
Unit
VS
5
27
V
Vs_NON_OP
5
40
V
Tamb
-40
+125
°C
RxDx, TxDx,
MODEx
-0.3
5.5
V
Remark
Parameter deviations
allowed
Vs is the IC supply voltage including voltage drop of reverse battery protection diode, VDROP = 0.4 to 1V,
Operating voltage range of the LIN2.x/SAE J2602 plug & play specification is 7V…18V
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
7.2. Absolute Maximum Ratings
Table 3: Absolute Maximum Ratings
Nr.
Parameter
Symbol
Condition
Min
Max
Unit
201
Battery Supply Voltage
VS
Respective to GND
-0.3
40
V
202
Transients at battery supply voltage
VVS.tr1
ISO 7637/2 pulse 1[1]
-100
203
Transients at battery supply voltage
VVS.tr2
ISO 7637/2 pulse 2[1]
204
Transients at high voltage signal pins
VLIN..tr1
ISO 7637/3 pulses 1[2]
205
Transients at high voltage signal pins
VLIN..tr2
ISO 7637/3 pulses 2[2]
206
Transients at high voltage signal and power supply pins
VHV..tr3
ISO 7637/2 pulses 3A, 3B [3]
207
DC voltage LINx
VLIN_DC
208
DC voltage WAKE
VWAKE_DC
209
DC voltage INH, DIS_MAS
VINH_DC
VDISMAS_DC
Respective to GND and VS
Loss of Ground( VGND=VS )
Respective to GND and VS
Loss of Ground( VGND=VS )
210
DC voltage low voltage I/O’s (RxDx,TxDx,MODEx)
Vlv_DC
211
ESD voltage, IEC 61000-4-2 [4]
VESD
212
ESD voltage, HBM (CDF-AEC-Q100-002)
VESD
213
ESD voltage, CDM (CDF-AEC-Q100-011)
214
V
75
V
-30
V
30
V
-150
100
V
-20
-30
-20
-30
40
40
40
40
-0.3
VS + 0.3
V
-0.3
7
V
Pin LIN, VS, WAKE
-10
10
kV
Pin LIN, VS, WAKE, INH
vs GND
-8
8
kV
All other pins
-3
3
kV
VESD
-1000
1000
V
Maximum latch - up free current at any Pin
ILATCH
-500
500
mA
215
Thermal impedance
ΘJA
50
K/W
216
Storage temperature
Tstg
-55
150
°C
217
Junction temperature
Tvj
-40
150
°C
[1]
[2]
[3]
[4]
JEDEC 1s2p board
V
V
ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor.
ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF.
ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a reverse polarity
diode and >10uF blocking capacitor
IEC 61000-4-2 validated by external Lab during product qualification (see application examples)
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
7.3. Static Characteristics
Table 4: Static Characteristics
Unless otherwise specified all values in the following tables are valid for VS = 5 to 27V and Tj= -40 to 150°C. All voltages
are referenced to ground (GND), positive currents flow into the IC.
Nr.
Parameter
Symbol
Condition
Min
301
Undervoltage lockout
VS_UV
2.4
302
Undervoltage lockout hysteresis[1]
VS_UV_hys
0.1
Typ
Max
Unit
4.8
V
0.3
0.7
V
9
15
µA
20
µA
200
400
µA
12
15
7
9
100
125
50
65
3
5
mA
30
40
pF
40
100
200
mA
PIN VS
303
Supply current, sleep mode
ISsl
304
Supply current standby mode
ISBY
305
Supply current active mode, dominant
Standard transceiver mode
ISd_slave
306
Supply current active mode, dominant
Enhanced master mode
ISd_master
307
Supply current active mode, recessive
ISr
VM0DEx = 0V, Tj ≤ 85C
VWAKE = VLINx = VS ≤14V
VM0Dex = 0V, Tj ≤ 125C
VWAKE = VLINx = VS ≤ 18V
VM0Dex = 0V,
after POR or WU
VM0Dex = 5V,VTxD1-4 = 0V
DIS_MAS = Vs (80004)
VM0Dex = 5V,VTxD1-2 = 0V
DIS_MAS = Vs (80002)
VM0Dex = 5V,VTxD1-4 = 0V
DIS_MAS = 0V (80004)
VM0Dex = 5V,VTxD1-2 = 0V
DIS_MAS = 0V (80002)
100
VM0Dex = 5V,VTxD1-4 = 5V
mA
mA
PIN LINx – Transmitter
310
Transmitter internal capacitance[1]
CLIN
311
Short circuit bus current
IBUS_LIM
312
313
Pull up resistance bus, normal & standby
mode
Pull up resistance bus, normal & standby
mode
RSLAVE
VDIS_MAS = VS
20
30
60
kΏ
RMaster
VDIS_MAS = 0V
900
1000
1100
Ώ
VLINx = 0V, VS = 12V,
VM0Dex = 0V,VTxDx = 5V
-100
-60
-20
µA
1
V
314
Pull up current bus, sleep mode
ISLAVE_SLEEP
315
Voltage drop at int. diode in pull up path
RSLAVE [1]
VSerDiode
316
Receiver dominant input leakage current
including pull up resistor
IBUS_PAS_dom
317
Receiver recessive input leakage current
IBUS_PAS_rec
318
Bus reverse current loss of battery [2]
IBUS_NO_BAT
319
Bus current during loss of ground [2]
IBUS_NO_GND
320
Transmitter dominant voltage [2]
VolBUS
321
Transmitter recessive voltage [2]
VohBUS
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Capacitance on pins LINx
to GND
VLIN = VS,
VM0Dex = 5V,VTxDx = 0V
0.4
VLINx =0V, VS =12V,
VM0Dex = 5V,VTxDx = 5V,
VDIS_MAS = VS
VLINx=18V, VS =5V,
VM0Dex = 5V,VTxDx = 5V,
Tamb sleep mode
transitions
master > slave transitions
Min
Typ
0.396
0.581
0.417
0.590
15.9
µs
17.28
µs
30
150
µs
10
50
µs
150
500
ms
27
60
ms
27
60
ms
1
2
5
µs
1
2
5
µs
This parameter is tested by applying a square wave signal to the LIN. The minimum slew rate for the LIN rising and falling edges is 50V/us
See Figure 4– LIN timing diagram
Standard loads for duty cycle measurements are 1KΩ/1nF, 660Ω/6.8nF, 500Ω/10nF, internal master termination disabled
in accordance to SAE J2602, see Figure 5
for supply voltage ranges Vs=5…7V and Vs=18…27V parametric deviations are possible
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
7.4.1. Duty Cycle Calculation
Figure 4: LIN timing diagram (reference LIN2.1 specification)
Figure 4: LIN timing diagram, relation between propagation delay and duty cycle
(reference SAE J2602 specification)
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
As shown in Figure 4, both worst case duty cycles can be calculated as follows :
Dwc1 = tBUS_rec(min) / (2 tBit )
Dwc2 = tBUS_rec(max) / (2 tBit )
Thresholds for duty cycle calculation for the plug & play specification in accordance to LIN2.0 / SAE J2602:
Baud rate
20kBd
10.4kBd
TBIT
50µs
96µs
Dwc1
D1
D3
Dwc2
D2
D4
THREC(MAX)
0.744 × VS_TX
0.778 × VS_TX
THDOM(MAX)
0.581 × VS_TX
0.616 × VS_TX
THREC(MIN)
0.422 × VS_TX
0.389 × VS_TX
THDOM(MIN)
0.284 × VS_TX
0.251 × VS_TX
Table 6: Data Transmission Rates
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
8. Functional Description
The MLX80004/2 is the physical layer interface between the master/slave microcontroller and the single wire LIN bus
network.
Figure 5: State Diagram of the MLX80004/2
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
8.1. Operating Modes
Table 7: Operating Modes
Mode
MODE0
MODE1
Standby
0
0
Active
1
1
0
Sleep
0
[1]
[2]
[3]
[4]
[5]
TxDx
weak pulldown/ active low
RxDx
active low
INH
[2]
[1]
floating/
Vs
1
0
1
weak pulldown/ input
for transmit data stream
output for LIN data stream
Vs
0
weak pull down
floating
floating
LIN transceiver
Off
On
[3] [4] [5]
Off
Indicates the wake up flag in case of local wake up
After power on RxDx is floating. If any wake up(local or remote) occurs it will be indicated by active low
Active low interrupt at pin RxD will be removed when entering normal mode
Wake up source flag at pin TxD1 will be removed when entering normal mode
Active modes will be entered by a low -> high transition on pin MODEx. When recessive level (high) on pin TxDx is present the transmit path
will be enabled
8.2. Initialization and Standby mode
When the battery supply voltage Vs exceeds the specified threshold VS_UV, the MLX80004/2 automatically enters an
intermediate standby mode. The INH output becomes HIGH (Vs) and can be used for a battery driven interrupt or to
switch on an external ECU – voltage regulator. The pins RxDx are floating and the integrated master (slave) pull up
resistor with decoupling diode pulls the pin LIN. The transmitter and the receiver are disabled.
If no mode change occurs to any active mode via a MODE0/1 LOW to HIGH transition within the time stated (typically
350ms), the IC enters the most power saving sleep mode and the INH output will become floating (logic 0).
Furthermore the standby mode will be entered after a valid local or remote wake up event, when the MLX80004/2 is
in sleep mode. The entering of the standby mode after wake up will be indicated by an active LOW interrupt on pin
RxDx.
The MLX80004/2 enters the standby mode as well in case of a battery under-voltage condition. That happens while
being in sleep mode or any active mode.
8.3. Active Modes
By entering the active modes the MLX80004/2 can be used as interface between the single wire LIN bus and the
microcontroller. The incoming bus traffic is detected by the receiver and transferred via the RxDx output pin to the
microcontroller. (see Figure 4, LIN timing diagram)
The active modes can be entered being in sleep or standby mode, when the pin(s) MODE0/1 are driven HIGH.
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
MODE0
MODE1
Mode
L
L
Sleep Mode
H
L
High Speed Mode (slew rate control
disabled)
L
H
Low speed mode
H
H
Normal Mode
Table 8: Mode Selection Table
8.3.1. High Speed mode
This mode allows high speed data download up to 100Kbit/s. The slew rate control is disabled. The falling edge is the
active driven edge, the speed of the rising edge is determined by the network time constant.
8.3.2. Low speed mode
This mode is the recommended operating mode for J2602 applications with a maximum baud rate of 10.4kBd. The
slew rate control of any channel is optimized for minimum radiated noise, especially in the AM band.
8.3.3. Normal speed mode
Transmission bit rate in normal mode is up to 20kbps. The slew rate control of any channel is optimized for maximum
allowed bit rate in the LIN specification package 2.x.
8.4. Sleep Mode
The most power saving mode of the MLX80004/2 is the sleep mode. The mode change into sleep mode is possible
regardless of the voltage levels on the LINx bus, pins WAKE or TxDx. The MLX80004/2 offers two procedures to enter
the sleep mode:
•
The sleep mode will be entered if both the pins MODE0 and MODE1 are being driven LOW for longer than the
specified filter time (tMODE_deb) when in active modes.
•
If the MLX80004/2 is in standby mode after power-on or wake-up, a sleep counter is started and switches the
transceiver into sleep mode after the specified time (typ. 350ms) if the microcontroller of the ECU will not
confirm the active operation by setting MODE0/1 pins to logic HIGH. This feature allows faulty blocked LIN
nodes to reach the most power saving sleep mode anyway.
Being in sleep mode the INH pin becomes floating and can be used to switch off the ECU voltage regulator in order to
minimize the current consumption of the complete LIN node (preferred feature in slave applications). The transmitters
are disabled and the pins RxDx are disconnected from the receive path and become floating. The master(slave)
termination resistor (LIN pull up resistor with decoupling diode between pins LIN and Vs) is disconnected, only a weak
LIN pull up current of typically 50uA is applied to the LINx bus (see chapter 9 Fail-safe Features)
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MLX80002/MLX80004
Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
8.5. Wake Up
When in sleep mode the MLX80004/2 offers three wake-up procedures:
•
•
•
In applications with continuously powered ECU a wake up via mode transition to active modes is possible by
setting the MODEx pins to high level. (see chapter 4.3 Active Modes)
Remote wake-up via LINx bus request
After a falling edge on the LINx bus followed by a dominant voltage level for longer than the specified
value(twu_remote) and a rising edge on pin LINx will cause a remote wake up (see Figure 6 at page 19)
Local wake-up via a negative edge on pin WAKE
A negative edge on the pin WAKE and a dominant voltage level for longer than the specified time (twu_local) will
cause a local wake-up. The current for an external switch has to be provided by an external pull up resistor
RWK. For a reverse current limitation in case of a closed external switch and a negative ground shift or an ECU
loss of ground a protection resistor RWK_prot between pin WAKE and the switch is recommended. (see Figure 7
at page 20)
The pin WAKE provides a weak pull up current towards the battery voltage that provides a HIGH level on the
pin in case of open circuit failures or if no local wake up feature is required. In such applications it is
recommended to connect the pin WAKE to pin Vs via a resistor of 10k ohms.
8.6. Wake Up Source Recognition
The device can distinguish between a local wake-up event (pin WAKE) and a remote wake-up event in dependence of
the requesting LINx bus.
Local Wake Up
In case of a local wakeup via WAKE pin, the wake up request is indicated by an active LOW on pin RxD1. The wake-up
source flag is set and is indicated by an active LOW on pin TxD1.
The wake-up source flag can be read if an external pull up resistor at TxD1 towards the microcontroller supply voltage
has been added and the MLX80004/2 is still in standby mode:
When the microcontroller confirms an active mode operation by setting the pin MODE0/1 to HIGH, both the wake-up
request on pin RxD1 as well as the wake-up source flag on pin TxD1 are reset immediately.
Remote Wake Up
In case of a remote wake-up via a LINx bus, the source of the wake-up request will be indicated by the RxDx pin that
belongs to the LINx pin. (example: LOW level on RxD4 and floating RxD1-3 indicate a wake-up request on LIN4).
The wake up source flag at TxD1 remains floating.
This allows following the wake-up request of the requesting LIN bus while remaining the other LIN bus channels in
recessive mode (no wake up occurs in these LIN networks).
After a mode transition into any active mode by setting the pin MODE0/1 to HIGH, the active LOW wake-up request on
pin RxDx is reset immediately.
If the device is not set into an active mode after a wake up request (either local or remote) then it will return into sleep
mode after tdsleep.
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Figure 6: remote wake up and wake-up source recognition
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Enhanced Universal Dual/Quad LIN Transceiver
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Figure 7: local wake up and wake-up source recognition
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8.7. Master / Slave configuration
The target applications of the MLX80004/2 are BCM master modules with multiple LIN channels. In order to be able to
use the same module for a wide variety of applications with different stages of extension, a space efficient and cost
effective adaptation on the number of LIN channels is desired.
The MLX80004/2 device family offers the combination of quad and dual channel LIN transceiver within the same
advanced package and a compatible foot print.
By the integration of the LIN master-termination (decoupling diode and 1K resistor) the external circuitry can be
minimized in terms of space as well as BOM (bill of material). The RxD time-out feature allows the handling of a LIN
short to ground failure without software support by the microcontroller. This application mode is called enhanced
master mode, compatible to the functionality of the quad – LIN transceiver MLX80001.
In case of different BCM requirements it may happen that the external master termination is desired only. To cover
these applications the pin DIS_MAS has been introduced:
DIS_MAS
Mode
GND
Enhanced Master
Mode
LIN termination
Supported fail safe features
Active mode : Diode & 1kΩ
sleep mode :Diode & 60µA
• RxDx time-out, independent disconnect of master
termination in case of LINx short to ground
• TxDx time-out, independent disable of faulty
dominant blocked transmit path
Vs
Standard
Transceiver Mode
Active mode : Diode & 30kΩ
sleep mode :Diode & 60µA
• TxDx time-out, independent disable of faulty
dominant blocked transmit path
Table 9: Time Out Modes
In case of externally mounted master termination (standard transceiver mode), the handling of a LIN short to ground is
not possible. By using the standard transceiver mode, the MLX80004/2 can be used in slave applications as well. To
pull the pin DIS_MAS to high even in case the external ECU regulator is switched off in sleep mode. The pin shall be
connected to Vs via an external resistor. (see Figure 8 at page 24, application example)
In the standard transceiver mode, only the TxDx time-out feature is enabled.
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9. Fail-safe Features
9.1. Loss of battery
If the ECU is disconnected from the battery, the bus pin is in high impedance state. There is no impact to the bus traffic
and to the ECU itself. Reverse current is limited to < 20µA
9.2. Loss of Ground
In case of an interrupted ECU ground connection there is no influence to the bus lines. The current from the ECU to the
LINx pins is limited by the weak pull up current of the pin LINx, the integrated master termination (DIS_MAS = GND) as
well as the integrated slave termination (DIS_MAS = Vs) is disconnected in order to fulfill the SAE J2602 requirements
for the loss of ground current ( recessive
transition on the LIN bus if the failure disappears.
The RxDx time-out is only active in the Enhanced Master Mode, while the master termination is enabled.
9.10. TxDx dominant time-out
In case of a faulty blocked permanent dominant level on pin TxDx the transmit path will be disabled after the specified
time tTxDx_to (typ. 40ms). The data transmission is released again as soon as the failure disappears by the next rising
edge of TxDx.
The TxDx time-out is active in both, the Standard Transceiver and Enhanced Master Mode.
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10. Application Example
10.1. Enhanced Master Mode
Car Battery Cl30
1N4001
LINx
network
22uF
VBAT_ECU
Master
ECU
Voltage regulator
VBAT
+5V
100nF
4,7K
10K
VS
INH
WAKE
µP
LIN1
LIN2
TxD3
TxD4
LIN3
LIN4
RxD1
RxD2
RxD3
RxD4
1nF
MODE0
Control
LIN
ECU connector
MLX80004
TxD1
TxD2
MODE1
DIS_MAS
1N4001
22uF
VBAT_ECU
Slave
ECU
Voltage regulator
VBAT
INH
+5V
100nF
4,7K
10k
INH
10K
VS
DIS_MAS
WAKE
LIN1
LIN2
µP
MLX80002
RxD1
RxD2
Control
LIN
MODE0
MODE1
180p
ECU connector
TxD1
TxD2
Figure 8:
Application example using enhanced master mode with minimized external components and LIN short to GND feature.
Note: All pins of MLX80004/MLX80002 with „N.C.“ are internally not connected.
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10.2. Standard Transceiver Mode
Car Battery Cl30
1N4001
LINx
network
22uF
VBAT_ECU
Master
ECU
Voltage regulator
VBAT
+5V
100nF
4,7K
10k
10K
VS
DIS_MAS
WAKE
µP
TxD1
TxD2
LIN1
LIN2
TxD3
TxD4
LIN3
LIN4
1K
RxD1
RxD2
RxD3
RxD4
1nF
MODE0
Control
LIN
ECU connector
INH
MODE1
MLX80004
1N4001
22uF
VBAT_ECU
Slave
ECU
Voltage regulator
VBAT
INH
+5V
100nF
4,7K
10K
INH
VS
WAKE
TxD
LIN
MLX80020
180p
RxD
Control
LIN
EN
ECU connector
µP
Figure 9:
Application example using standard transceiver mode without LIN short to GND feature.
Note: All pins of MLX80004/MLX80002 with „N.C.“ are internally not connected.
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10.3. Application Circuitry for EMC
In order to minimize EMC influences, the external application circuitry shall be designed as followed:
D12)
VS
C22) +
Connector
C11)
C32)
VS
R12)
R22)
LINx
LIN
C42)
MLX80004
WAKE
Signal
-line
C51)
D21)
GNDx
GND
1)
2)
optional implemented
mandatory implemented
Figure 10: Typical Application Circuitry for EMC
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Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
10.3.1. External Circuitry on Supply Lines
In order to minimize EMC influences, the external application circuitry shall be designed as followed:
Name
Mounting
Min
Recommended
-
Max
100
-
Dim
Comment
nF
Ceramic SMD: 10%, 0805,
≥50V;
close to the connector
C1
recommended
D1
mandatory
C2
mandatory
1
22
100
μF
Tantal SMD: 10%, 7343, 35V
C3
mandatory
-
100
-
nF
Ceramic SMD: 10%, 0805,
≥50V;
close to the pin
Inverse-polarity protection diode
Table 10: External Components on Supply Lines
10.3.2. External Circuitry on LIN Lines
In order to minimize EMC influences, the external application circuitry shall be designed as followed:
Name
Mounting
Min
Recommended
Max
D2
no
-
PESD1LIN
-
C4
mandatory
-
220/1000
-
Dim
pF
Comment
ESD protection Diode: SOD323
close to the connector;
Ceramic SMD: 10%, 0805, ≥50V;
CSlave≤ CD2+C4+CIC
CSlave≤250pF/ CMaster≤1nF
Table 11: External Components on LIN Lines
10.3.3. External Circuitry on Signal Lines
In order to minimize EMC influences, the external application circuitry shall be designed as followed:
Name
Mounting
Min
Recommended
Max
Dim
Comment
C5
no
0.1
1
100
nF
Ceramic SMD: 10%, 0805, ≥50V;
R2
mandatory
5k
10k
100k
Ω
Serial resistor: 0805
Table 12: External Components on Signal Lines
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Enhanced Universal Dual/Quad LIN Transceiver
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11. Package Mechanical Specification
The devices are assembled in a QFN4x4 24L package with wettable flanks.
Figure 11: Package outline drawing and dimensions
Package
QFN4x4
Θja [°C/W]
(JEDEC 1s0p board)
Θjc [°C/W]
16
154
Θja [°C/W]
(JEDEC 1s2p board)
50
Table 13: Thermal resistance values of package
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12. Package Marking Information
5-digit Type Number
18
17
19
16
15
14
13
80004
A
2345D
1025
20
21
22
23
24
1
2
3
4
5
Design revision
12
11
5-digit Lot Number
10
9
8
7
4-digit Date Code
Format: YYWW
6
Figure 12: Package marking, example for MLX80004 in QFN4x4 24L
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13. Tape and Reel Specification
Note: that the above mentioned labels are just examples which represent the label layout!
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14. ESD and EMC
In order to minimize EMC influences, the PCB has to be designed according to EMC guidelines.
The products MLX80004/2 are ESD sensitive devices and have to be handled according to the rules in IEC61340-5-2.
The products MLX80004/2 are evaluated according AEC-Q100-002 (HBM) and AEC-Q100-011 (CDM).
The extended ESD/EMC tests (acc. to IEC 61000-4-2, LIN Conf. Test Specification Package for LIN2.1, OEM hardware
requirements for LIN, CAN and FlexRay Interfaces in automotive applications – Audi, BMW, Daimler, Porsche,
Volkswagen - Rev. 1.3/2012) have been tested by external certificated test houses.
The test reports are available on request.
14.1. Automotive Qualification Test Pulses
Automotive test pulses are applied on the module in the application environment and not on the naked IC. Therefore
attention must be taken, that only protected pins (protection by means of the IC itself or by means of external
components) are wired to a module connector. In the recommended application diagrams, the reverse polarity diode
together with the capacitors on supply pins, the protection resistors in several lines and the load dump protected IC
itself will protect the module against the below listed automotive test pulses. The exact value of the capacitors for the
application has to be figured out during design-in of the product according to the automotive requirements.
For the LIN pin the specification “LIN Physical Layer Spec 2.1 (Nov. 24, 2006)” is valid.
Supply Pin VS is protected via the reverse polarity diode and the supply capacitors. No damage will occur for defined
test pulses. A deviation of characteristics is allowed during pulse 1 and 2; but the module will recover to the normal
function after the pulse without any additional action. During test pulse 3a, 3b, 5 the module will work within
characteristic limits.
14.2. Test Pulses On supply Lines
Parameter
Symbol
Min
Max
Dim
Coupling
test condition,
functional status
Transient test pulses in accordance to ISO7637-2 (supply lines) & , VS=13.5V, TA=(23 ± 5)°C
& (Document: “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi, BMW, Daimler,
Porsche, VW; 2009-12-02)
5000 pulses,
Test pulse #1
vpulse1
-100
V
Direct
functional state C
5000 pulses,
Test pulse #2
vpulse2
75
V
Direct
functional state A
Test pulse #3a
vpulse3a
Test pulse #3b
vpulse3b
-150
100
V
Direct
1h,functional state A
V
Direct
1h,functional state A
Load dump test pulse in accordance to ISO7637-2 (supply lines), VS=13.0V, TA=(23 ± 5)°C
Test pulse #5b
vpulse5b
65
(+13V
(VS))
87
(+13V
(VS))
V
Direct
1 pulse clamped to 27V (+13V
(VS)),
(32V (+13V (VS))for
applications for north America),
functional state C
Table 14: Test pulses Supply Line
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Enhanced Universal Dual/Quad LIN Transceiver
Datasheet
14.3. Test pulses on Pin LIN
Parameter
Symbol
Min
Max
Dim
Coupling
test
condition,
functional
status
Transient test pulses in accordance to ISO7637-3, VS=13.5V, TA=(23 ± 5)°C
& (Document: “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi, BMW, Daimler,
Porsche, VW; 2009-12-02)
1000
Direct capacitive
pulses,
Vpulse_
Test pulse ‘DCC slow –‘
-100
V
coupled:
slow+
functional
1nF
state D
1000
Direct capacitive
pulses,
Vpulse_
Test pulse ‘DCC slow +‘
75
V
coupled:
slowfunctional
1nF
state D
Direct capacitive
10 min,
Vpulse_
Test pulse ‘DCC fast a’
-150
V
coupled:
functional
fast_a
100pF
state D
Direct capacitive
10 min,
Vpulse_
Test pulse ‘DCC fast b’
100
V
coupled:
functional
fast_b
100pF
state D
Table 15: Test pulses LIN
14.4. Test pulses on signal lines
Parameter
Symbol
Mi
n
Max
Dim
Coupling
test condition,
functional status
Transient test pulses in accordance to ISO7637-3 (signal lines). VS=13.5V, TA=(23 ± 5)°C
Test pulse ‘DCC slow –‘
Test pulse ‘DCC slow +‘
Test pulse ‘DCC fast a’
Test pulse ‘DCC fast b’
Vpulse_
slow+
Vpulse_
slowVpulse_
fast_a
Vpulse_
fast_b
-30
-8
V
+8
+30
V
-60
-10
V
10
40
V
Direct capacitive
coupled:100nF
Direct capacitive
coupled:100nF
Direct capacitive
coupled:100pF
Direct capacitive
coupled:100pF
1000 pulses,
functional state C
1000 pulses,
functional state A
10 min,
functional state A
10 min,
functional state A
Table 16: Test pulses signal lines
Description of functional state
A:
All functions of the module are performed as designed during and after the disturbance.
B:
All functions of the module are performed as designed during the disturbance:
One or more functions can violate the specified tolerances. All functions return automatically to within their
normal limits after the disturbance is removed. Memory functions shall remain class A.
C:
A function of the module does not perform as designed during the disturbance but returns
automatically to the normal operation after the disturbance is removed.
D:
A function of the module does not perform as designed during the disturbance and does not
return automatically to the normal operation after the disturbances is removed.
The device needs to be reset by a simple operation/action to return to the specified limits/function.
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Datasheet
14.5. Test circuitry for automotive transients
Figure 13: Test circuit for automotive transients
Figure 13 shows the general requirement on the test circuitry for applying automotive transient test pulses.
In order to represent the most critical network impedance, the LINx pins has to be connected via 1kOhm / decoupling
diode to the Schaffner test generator. Including the integrated master termination of 1kOhm, the minimum network
resistance of 500Ohm can be simulated by adding an external 1Kohm resistor.
In slave application mode (DIS_MAS = Vs), the external coupling has to be applied via 500Ohm resistor.
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Enhanced Universal Dual/Quad LIN Transceiver
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14.6. EMC Test pulse definition
EMC Test Pulse shapes (ISO7637-2 (supply lines))
Test Pulse 1
Ri = 10 Ohm
Test pulse 2
Ri = 2 Ohm
200 ms
V
0.5...5s
< 100 µs
50 µs
V
12 V
0V
10%
t
1 µs
90%
vpulse1
vpulse2
90%
10%
12V
1 µs
2 ms
0V
t
200 ms
0.5...5s
Test Pulse 3a
Ri = 50 Ohm
Test Pulse 3b
Ri = 50 Ohm
100 ns
5 ns
V
90%
V
12V
vpulse3b
10%
0V
t
vpulse3a
vpulse3b
vpulse3a
10%
12V
0V
100 µs
10 ms
90 ms
100 µs
90%
t
10 ms
90 ms
5 ns
100 ns
Test Pulse 5 (Load Dump)
Ri = 0.5…4 Ohm (clamped to 45V during test)
V
Pulse 5
90%
Pulse 5 at
device
vpulse5
40V
10%
12V
t
tr = 0.1...10ms
td = 40...400ms
Table 17: Test pulses shapes ISO7637-2
EMC Test Pulse shapes (ISO7637-3 (non-supply lines))
Test Pulse ‘DCC slow –’
Ri = 2 Ohm
Test Pulse ‘Fast a, DCC’
Ri = 50 Ohm
Test pulse ‘DCC slow +’
Ri = 2 Ohm
Test Pulse ‘Fast b, DCC’
Ri = 50 Ohm
Table 18: Test pulses shapes ISO7637-3
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Enhanced Universal Dual/Quad LIN Transceiver
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15. Standard information regarding
manufacturability of Melexis products with different
soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon
with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive
strength between device and board.
Melexis recommends reviewing on our web site the General Guidelines soldering recommendation
(http://www.melexis.com/Quality_soldering.aspx) as well as trim&form recommendations
(http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx).
For wettable flanks packages, please refer to the Melexis Application Note “QFN wettable flanks specific handling”.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information
on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain
Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
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Enhanced Universal Dual/Quad LIN Transceiver
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16. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no
representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or liability for any
errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. This documentation is
in fact provided without warranty, term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability, satisfactory
quality, non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees and agents will not be responsible for any loss,
however arising, from the use of, or reliance on this document. Notwithstanding the foregoing, contractual obligations expressly undertaken in writing by Melexis prevail
over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing orders or prior to designing the
product into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of reliability required and determine
whether it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require a prior authorization from
competent authorities. The product is not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual
environmental requirements. High reliability applications, such as medical life-support or life-sustaining equipment or avionics application are specifically excluded by
Melexis. The product may not be used for the following applications subject to export control regulations: the development, production, processing, operation,
maintenance, storage, recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a
means of violence in an armed conflict or any similar violent situation.
No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.
If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably understood as being confidential, the
recipient of this document shall not communicate, nor disclose to any third party, any part of the document without Melexis’ express written consent. The recipient shall
take all necessary measures to apply and preserve the confidential character of the document. In particular, the recipient shall (i) hold document in confidence with at least
the same degree of care by which it maintains the confidentiality of its own proprietary and confidential information, but no less than reasonable care; (ii) restrict the
disclosure of the document solely to its employees for the purpose for which this document was received, on a strictly need to know basis and providing that such persons
to whom the document is disclosed are bound by confidentiality terms substantially similar to those in this disclaimer; (iii) use the document only in connection with the
purpose for which this document was received, and reproduce document only to the extent necessary for such purposes; (iv) not use the document for commercial
purposes or to the detriment of Melexis or its customers. The confidentiality obligations set forth in this disclaimer will have indefinite duration and in any case they will be
effective for no less than 10 years from the receipt of this document.
This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject to the exclusive jurisdiction of
the courts of Brussels, Belgium.
The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other provisions.
The previous versions of this document are repealed.
Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2020)
IATF 16949 and ISO 14001 Certified
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
America:
Phone: +32 1367 0495
Phone: +1 603 223 2362
E-mail: sales_europe@melexis.com E-mail: sales_asia@melexis.com
E-mail: sales_usa@melexis.com
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