MLX80020KDC-BAA-000-RE

MLX80020 Enhanced LIN Transceiver Datasheet 1. Features ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ RxD 1 8 INH Compatible to LIN Physical Layer Specification EN 2 7 VS MLX Rev.2.x and SAE J2602 80020 6 LIN WAKE 3 Baud rate up to 20 kBaud TxD 4 5 GND Wide operating voltage range VS = 5 to 27 V Very low standby current consumption of 10µA in sleep mode Bus and local wake up capable with source recognition Control output for voltage regulator with low on – resistance for switchable master termination Low EME(emission) and high EMI(immunity) level Fully compatible to 3.3V and 5V devices Integrated termination resistor for LIN slave nodes TxD dominant time out function Sleep timer to guarantee the most power saving mode after power on or wake up in case of faulty passive microcontroller High impedance Bus pin in case of loss of ground and undervoltage condition Bus short to ground protection Enhanced ESD robustness according to IEC 61000-4-2 RoHs compliant and AECQ-100 qualified Ordering Code Product Code MLX80020 MLX80020 MLX80020 MLX80020 Temperature Code K K K K Package Code DC DC DC DC Option Code BBA-000 BBA-000 BAA-000 BAA-000 Legend: Temperature Code: Package Code: Option Code: Packing Form: K for Temperature Range -40°C to 125°C DC for SOIC150Mil BBA-000 for SAE J2602, BAA-000 for LIN 2.x RE for Reel, TU for Tube Ordering example: MLX80020KDC-BBA-000-TU Packing Form Code TU RE TU RE 2. General Description The MLX80020 is a physical layer device for a single wire data link capable of operating in applications using baud rates from 1kBd to 20kBd. The MLX80020 is compatible to LIN2.x as well as to the SAE J2602 specifications. Because of the very low power consumption of the MLX80020 in the sleep mode it’s suitable for ECU applications with hard standby current requirements. The implemented high resistive termination in sleep mode as well as the driving capability of the INH pin allows a comfortable handling of LIN short circuits to GND. In order to reduce the power consumption in case of failure modes, the integrated sleep timer takes care for switching the ECU into the most power saving sleep mode after power on or wake up events that are not followed by a mode change response of the microcontroller. The MLX80020 has an improved EMI performance and ESD robustness. The MLX80020 version with the ordering code extension ‘A’ is suitable for applications with baud rates up to 20kbd. The version of the MLX80020 with the ordering code extension ‘B’ is optimized for baud rates up to 10.4kbd as specified in the SAE J2602 standard. MLX80020 Enhanced LIN Transceiver Datasheet Contents 1. Features.............................................................................................................................................................. 1 2. General Description............................................................................................................................................ 1 3. List of Figures...................................................................................................................................................... 3 4. Functional Diagram ............................................................................................................................................ 4 5. Pin Description ................................................................................................................................................... 5 6. Electrical Specification........................................................................................................................................ 6 6.1. Operating Conditions ................................................................................................................................. 6 6.2. Absolute Maximum Ratings ....................................................................................................................... 6 6.3. Static Characteristics .................................................................................................................................. 7 6.4. Dynamic Characteristics ............................................................................................................................. 9 7. Functional Description...................................................................................................................................... 10 7.1. Operating Modes ..................................................................................................................................... 10 7.2. Initialization and Standby mode .............................................................................................................. 11 7.3. Normal Mode ........................................................................................................................................... 11 7.3.1. RxD .................................................................................................................................................... 11 7.3.2. TxD .................................................................................................................................................... 11 7.3.3. TxD dominant time-out feature ....................................................................................................... 11 7.3.4. EN ...................................................................................................................................................... 11 7.3.5. Data transmission speed .................................................................................................................. 12 7.3.6. Duty cycle calculation LIN 2.x ........................................................................................................... 12 7.3.7. Duty cycle calculation J2602:............................................................................................................ 13 7.4. Sleep Mode............................................................................................................................................... 14 7.5. Wake Up ................................................................................................................................................... 14 7.6. Wake Up Source Recognition ................................................................................................................... 14 8. Fail-safe features .............................................................................................................................................. 16 8.1. Loss of battery .......................................................................................................................................... 16 8.2. Loss of Ground ......................................................................................................................................... 16 8.3. Short circuit to battery ............................................................................................................................. 16 8.4. Short circuit to ground ............................................................................................................................. 16 8.5. Thermal overload ..................................................................................................................................... 16 8.6. Undervoltage lock out .............................................................................................................................. 16 8.7. Open Circuit protection............................................................................................................................ 16 9. Application Hints .............................................................................................................................................. 17 9.1. Application Circuitry ................................................................................................................................. 17 10. Mechanical Specification SOIC8 ..................................................................................................................... 18 11. Tape and Reel Specification............................................................................................................................ 19 11.1. Tape Specification .................................................................................................................................. 19 11.2. Reel Specification ................................................................................................................................... 20 REVISION 007 - JULY 2017 3901080020 PAGE 2 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 12. ESD/EMC Remarks .......................................................................................................................................... 21 12.1. General Remarks .................................................................................................................................... 21 12.2. ESD-Test.................................................................................................................................................. 21 12.3. EMC ........................................................................................................................................................ 21 13. Standard information regarding manufacturability of Melexis products with different soldering processes 22 14. Revision History .............................................................................................................................................. 23 15. Contact ........................................................................................................................................................... 24 16. Disclaimer ....................................................................................................................................................... 24 3. List of Figures Figure 1: Block Diagram ...........................................................................................................................4 Figure 2: Pin description SOIC8 package .................................................................................................... 5 Figure 3: State Diagram of the MLX80020 .............................................................................................. 10 Figure 4 - Duty cycle measurement and calculation in accordance to LINphysical layer specification 2.x for baud rates up to 20Kbps ........................................................................................................ 12 Figure 5 - Duty cycle measurement and calculation in accordance to LIN physical layer specification 2.x for baud rates of 10.4Kbps or below .......................................................................................... 13 Figure 6: Remote wake-up behavior ....................................................................................................... 15 Figure 7: Application Circuitry ................................................................................................................. 17 REVISION 007 - JULY 2017 3901080020 PAGE 3 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 4. Functional Diagram Figure 1: Block Diagram REVISION 007 - JULY 2017 3901080020 PAGE 4 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 5. Pin Description RxD 1 EN 2 WAKE 3 TxD 4 MLX 80020 8 INH 7 VS 6 LIN 5 GND Figure 2: Pin description SOIC8 package Pin Name IO-Type Description 1 RXD O Received data from LIN bus, LOW in dominant state 2 EN I Mode control pin, enables the normal operation mode when HIGH 3 WAKE I High voltage input for local wake up, negative edge triggered 4 TXD I/O 5 GND G 6 BUS I/O 7 VS P Battery supply voltage 8 INH O Control output for voltage regulator, termination pin for master pull up Transmit data input (LOW = dominant), active low after local wake up Ground LIN bus transmitter/receiver pin, (LOW = dominant) REVISION 007 - JULY 2017 3901080020 PAGE 5 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 6. Electrical Specification All voltages are referenced to ground (GND). Positive currents flow into the IC. 6.1. Operating Conditions Parameter Symbol Min Max Unit VS 7 18 V High battery supply voltage VS_S 18 27 V Low battery supply voltage Vs_L 5 7 V Operating ambient temperature Tamb -40 +125 °C Battery supply voltage [1] [1] Vs is the IC supply voltage VBAT_ECU voltage range is 8 to 18V including voltage drop of reverse battery protection diode, V DROP = 0.4 to 1V, 6.2. Absolute Maximum Ratings In accordance with the Maximum Rating System (IEC 60134). The absolute maximum ratings given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposu re to limiting values may affect the reliability of the device. Parameter Battery Supply Voltage Transients at battery supply voltage Symbol VS VVS.tr1 Condition Respective to GND ISO 7637/2 pulse 1 [1] [1] Transients at battery supply voltage VVS.tr2 ISO 7637/2 pulse 2 Transients at high voltage signal pins VLIN..tr1 ISO 7637/3 pulses 1[2] Transients at high voltage signal pins VLIN..tr2 ISO 7637/3 pulses 2[2] Transients at high voltage signal and power supply pins VHV..tr3 ISO 7637/2 pulses 3A, 3B [3] DC voltage LIN, WAKE VLIN_DC Respective to GND and VS Loss of Ground( VGND=VS ) DC voltage INH DC voltage low voltage I/O’s (RxD,TxD,EN) Max Unit -0.3 40 V -100 V 75 -30 V V 30 V -150 100 V -27 40 V VINH_DC -0.3 VS + 0.3 V Vlv_DC -0.3 7 V -6 6 kV -8 -2 8 2 kV kV -1000 1000 V VESD_IEC ESD voltage Min IEC 61000-4-2 Pin LIN, VS,to GND, WAKE VESD_HBM HBM (AEC-Q100-002) Pin LIN, VS to GND, WAKE, INH All other pins VESD_CDM CDM (AEC-Q100-011) REVISION 007 - JULY 2017 3901080020 PAGE 6 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet Parameter Symbol Maximum latch - up free current at any Pin Condition ILATCH Min Max Unit -500 500 mA 152 K/W Thermal impedance JA Storage temperature Tstg -55 150 °C Junction temperature Tvj -40 150 °C [1] [2] [3] in free air ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >2uF blocking capacitor. ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF. ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor 6.3. Static Characteristics Unless otherwise specified all values in the following tables are valid for VS = 5 to 27V and TJ= -40 to 150°C. Typical values are valid for VS = 12V and TAMB= 25°C. All voltages are referenced to ground (GND), positive currents are flow into the IC. Parameter Symbol Condition Min Typ Max Unit 4.8 V 0.7 V 4.9 V PIN VS Power on reset Power on reset hysteresis Undervoltage lockout Undervoltage lockout hysteresis VS_POR 2.4 VS_POR_hys 0.1 VS_UV 4.2 VS_UV_hys 0.1 0.3 0.7 V 3 9 20 µA 300 800 2000 µA 0.3 Supply current, sleep mode ISsl VEN = 0V, VWAKE = VS = VLIN High Standby t > 150ms -> no mode change -> no valid wake up EN INH low RxD TxD VS floating low/ low[1] high[2] LIN termination 30kO Transmitter off EN =>High Sleep Mode EN INH RxD low floating floating Remote or local wake up request LIN termination 200kO Transmitter off [1] [2] floating after power on active low interrupt after wake up weak pull down after power on indicates wake up source via weak /strong pull down Figure 3: State Diagram of the MLX80020 REVISION 007 - JULY 2017 3901080020 PAGE 10 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 7.2. Initialization and Standby mode When the battery supply voltage Vs exceeds the specified threshold VS_POR, the MLX80020 automatically enters an intermediate standby mode. The INH output becomes HIGH (Vs) and therefore the external voltage regulator will provide the Vcc supply voltage to the ECU. The pin RxD is floating and the integrated slave pull up resistor with decoupling diode secures high level on the pin LIN. The transmitter as well as the receiver is disabled. If there occurs no mode change to normal mode via an EN LOW to HIGH transition within the time defined (typically 350ms), the IC enters the most power saving sleep mode and the INH output will become floating (logic 0). Furthermore the standby mode will be entered after a valid local or remote wake up event, when the MLX80020 is in sleep mode. The entering of the standby mode after wake up will be indicated by an active LOW interrupt on pin RxD. 7.3. Normal Mode By entering this mode the MLX80020 can be used as interface between the single wire LIN bus and the microcontroller. The incoming bus traffic is detected by the receiver and transferred via the RxD output pin to the microcontroller. (see figure 3, LIN timing diagram) 7.3.1. RxD The pin RxD is a buffered open drain output with a typical load of: Resistance: 2.7 kOhm Capacitance: < 25 pF The output signal supports by the external pull up resistor 3.3V and 5V supply systems. 7.3.2. TxD The transmit data stream of the LIN protocol controller applied to the pin TxD is converted into the LIN bus signal with slew rate control in order to minimize electromagnetic emissions. The pin TxD contains a weak pull down resistor. The input thresholds are compatible to 3.3V and 5V supply systems. To enable the transmit path, the TxD pin has to be driven recessive (HIGH) after or during the normal mode has been entered. 7.3.3. TxD dominant time-out feature By the first dominant level on pin TxD after the transmit path has been enabled, the dominant time-out counter is started. In case of a faulty blocked permanent dominant level on pin TxD the transmit path will be disabled after the specified time tTxD_to. The time-out counter is reset by the first negative edge on pin TxD. 7.3.4. EN The normal mode can be entered being in sleep or standby mode, when the pin EN is driven HIGH. To prevent unwanted mode transitions, the EN input contains a debounce filter as specified (tEN_deb). The pin EN contains a weak pull down resistor. The input thresholds are compatible to 3.3V and 5V supply systems. Additionally the positive edge on pin EN results in an immediate reset of the active low interrupt on pin RxD as well as the wake-up source recognition flag on pin TxD (see chapter 4.5 Wake Up). REVISION 007 - JULY 2017 3901080020 PAGE 11 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 7.3.5. Data transmission speed The MLX80020 is a constant slew rate transceiver that means the bus driver operates with a fixed slew rate range independent of the supply voltage. This principle secures a very good symmetry of the slope times between recessive to dominant and dominant to recessive slopes within the LIN bus load range (CBUS, Rterm). The MLX80020 KDC A version guarantees data rates up to 20kbd within the complete bus load range under worst case conditions. The version MLX80020 KDC B is optimized for applications with a maximum baud rate of 10.4kBd (SAE J2602) in order to minimize EME. These devices can not be used in applications with higher baud rates. The constant slew rate principle is very robust against voltage drops and can operate with RC- oscillator systems with a clock tolerance up to ±2% between 2 nodes. 7.3.6. Duty cycle calculation LIN 2.x With the timing parameters shown in the picture below two duty cycles , based on trec(min) and trec(max) can be calculated as follows : tBit =50µs D1 = trec(min) / (2 x tBit) D2 = trec(max) / (2 x tBit) Figure 4 - Duty cycle measurement and calculation in accordance to LIN physical layer specification 2.x for baud rates up to 20Kbps REVISION 007 - JULY 2017 3901080020 PAGE 12 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 7.3.7. Duty cycle calculation J2602: With the timing parameters shown in the table below two duty cycles , based on trec(min) and trec(max) can be calculated as follows : tBit =96µs D3 = trec(min) / (2 x tBit) D4 = trec(max) / (2 x tBit) Figure 5 - Duty cycle measurement and calculation in accordance to LIN physical layer specification 2.x for baud rates of 10.4Kbps or below REVISION 007 - JULY 2017 3901080020 PAGE 13 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 7.4. Sleep Mode The most power saving mode of the MLX80020 is the sleep mode. The MLX80020 offers two procedures to enter the sleep mode: ▪ The mode is selected when the pin EN is driven LOW in normal mode for longer than the specified filter time (tEN_deb). The mode change into sleep mode is possible even in case of dominant voltage levels on the LIN bus, pins WAKE or TxD. ▪ If the MLX80020 is in standby mode after power-on or wake-up, a sleep counter is started and switches the transceiver into sleep mode after the specified time (typ. 350ms) even when the microcontroller of the ECU will not confirm the normal operation by setting the EN pin to logic HIGH. This new feature allows faulty blocked LIN nodes to reach always the most power saving mode. Being in sleep mode the INH pin becomes floating and the ECU voltage regulator can be switched off in order to minimize the current consumption of the complete LIN node. The transmitter is disabled and the pin RxD is disconnected from the receive path and is floating. The slave termination resistor (LIN pull up resistor with decoupling diode between pins LIN and Vs) is disconnected and only a weak LIN pull up resistor is applied to the LIN bus (see chapter 5.4 fail-safe features) 7.5. Wake Up When in sleep mode the MLX80020 offers thee wake-up procedures: ▪ In applications with continuously powered ECU a wake up via mode transition to normal mode is possible (see chapter 4.3 Normal Mode) ▪ Remote wake-up via LIN bus traffic After a falling edge on the LIN bus followed by a dominant voltage level for longer than the specified value(twu_remote) and a rising edge on pin LIN will cause a remote wake up (see fig.4 page ) ▪ Local wake-up via a negative edge on pin WAKE A negative edge on the pin WAKE and a dominant voltage level for longer than the specified time(twu_local) will cause a local wake-up. The current for an external switch has to be provided by an external pull up resistor RWK. For a reverse current limitation in case of a closed external switch and a negative ground shift or an ECU loss of ground a protection resistor RWK_prot between pin WAKE and the switch is recommended. (see fig.5 page ) The pin WAKE provides a weak pull up current towards the battery voltage that provides a HIGH level on the pin in case of open circuit failures or if no local wake up is required. In such applications it is recommended to connect the pin WAKE directly to pin Vs in order to prevent influences due to EMI. 7.6. Wake Up Source Recognition The device can distinguish between a local wake-up event (pin WAKE) and a remote wake-up event. The wake-up source flag is set after a local wake-up event and is indicated by an active LOW on pin TxD. The wake-up flag can be read if an external pull up resistor towards the microcontroller supply voltage has been added (see fig.5 ) and the MLX80020 is still in stanby mode: ▪ ▪ LOW level indicates a local wake-up event HIGH level indicates a remote wake up event The wake-up request is indicated by an active LOW on pin RxD and can be used for an interrupt.. When the microcontroller confirms a normal mode operation by setting the pin EN to HIGH, both the wake-up request on pin RxD as well as the wake-up source flag on pin TxD are reset immediately. REVISION 007 - JULY 2017 3901080020 PAGE 14 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet VLIN t VINH t > twu_remote t VCC_ECU t VEN t VRxD wake-up interrupt t Figure 6: Remote wake-up behavior REVISION 007 - JULY 2017 3901080020 PAGE 15 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 8. Fail-safe features 8.1. Loss of battery If the ECU is disconnected from the battery, the bus pin is in high impedance state. There is no impact to the bus traffic and to the ECU itself. Reverse current is limited to < 20µA 8.2. Loss of Ground In case of an interrupted ECU ground connection there is no influence to the bus line. The current from the ECU to the LIN bus is limited by the weak pull up resistance of the pin LIN, the slave termination resistor is disconnected in order to fulfill the SAE J2602 requirements for the loss of ground current ( F K0 W B0 B1 S1 G2 P1 D1 T1 Cover Tape Abwickelrichtung Standard Reel with diameter of 13“ Package Parts per Reel Width Pitch SOIC8 3000 12 mm 8 mm D0 E P0 P2 Tmax T1 max G1 min G2 min B1 max D1 min F P1 Rmin T2 max W 1.5 +0.1 1.75 0.1 4.0 0.1 2.0 0.05 0.6 0.1 0.75 0.75 8.2 1.5 5.5 0.05 4.0 0.1 30 6.5 12.0 0.3 A0, B0, K0 can be calculated with package specification. Cover Tape width 9.2 mm. REVISION 007 - JULY 2017 3901080020 PAGE 19 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 11.2. Reel Specification W2 W1 B* C D* A N Amax B* C D*min 330 2.0 0.5 13.0 +0,5/-0,2 20.2 Width of half reel Nmin W1 W2 max 4 mm 100,0 4,4 7,1 8 mm 100,0 8,4 11,1 REVISION 007 - JULY 2017 3901080020 PAGE 20 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 12. ESD/EMC Remarks 12.1. General Remarks Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 12.2. ESD-Test The MLX80020 is tested according to HBM AEC-Q100-002. The ESD test CDM according to AEC-Q100-011 as well as system level ESD test according to IEC 61000-4-2 are performed by an external test house. 12.3. EMC The test on EMC impacts is done according to ISO 7637-2 for power supply pins and ISO 7637-3 for data-and signal pins as well as the “Hardware requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi, BMW, Daimler, Porsche, VW; 2009-12-02” REVISION 007 - JULY 2017 3901080020 PAGE 21 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 13. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) ▪ ▪ IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) ▪ ▪ EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) ▪ EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) ▪ EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx REVISION 007 - JULY 2017 3901080020 PAGE 22 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 14. Revision History Version Changes 001 Remark Initial release Date October 2010 002 Changed maximum ratings (ESD value CDM increased) Changed Static Characteristic in acc to CPK-values Changed Chapter 9.3 EMC Changes Tape Specification Chapter 8.1 November 2010 003 Change of Order Code November 2010 004 Change “short term” to “high” operating range in chapter “Operating Conditions” June 2011 005 Logo, disclaimer, ordering code June 2012 006 Electrical Specification of LIN-Transmitter updated November 2015 007 New branding: colours, font, logo, contact, disclaimer July 2017 REVISION 007 - JULY 2017 3901080020 PAGE 23 OF 24 MLX80020 Enhanced LIN Transceiver Datasheet 15. Contact For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our Direct Sales team and get help for your specific needs: Europe, Africa Telephone: +32 13 67 04 95 Email : sales_europe@melexis.com Americas Telephone: +1 603 223 2362 Email : sales_usa@melexis.com Asia Email : sales_asia@melexis.com 16. Disclaimer The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services. 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This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document. Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016) ISO/TS 16949 and ISO14001 Certified REVISION 007 - JULY 2017 3901080020 PAGE 24 OF 24