MLX81112KDC-AAD-000-SP

MLX81112 Single Channel LIN RGB Controller Gen 2 Short Datasheet 1. Features Configurations   MLX81112: MLX81115: 8 pin device in SOIC8 package, 32kB Flash memory + 16kB ROM 12 pin device in DFN12 4x4 package, 32kB Flash memory + 16kB ROM Application Controller    Internal RC-Oscillator (24 MHz default clock) 16-bit MULAN MCU with o max. 32kByte Flash o 16kB ROM with MLX4 LIN firmware, MLX16 LIN boot-loader and MLX16 Application User Library o 2048 Byte RAM o 512 Byte NVRAM with ECC (380 Byte for customer purpose) Math Co-processor for 32 bit MUL/DIV Operations LIN Protocol Controller according to LIN 2.x and SAE J2602    Baudrate up to 19.2 kBaud Frame processing Low interrupt load to the application LIN Transceiver according to LIN 2.x and SAE J2602  Support for Autoconfig according bus shunt method IO configuration        MLX81112: 4x high voltage I/Os with free configurable current sources (up to 48mA) for RGBW MLX81115: 2 x 3 high voltage I/Os with free configurable current sources (up to 48mA) for RGB Diagnostic capability for connected LED 4x (81112) or 6x (81115) 16-bit PWM outputs Interrupt capability for all inputs Configurable wake up sources (LIN and IOs) 10 bit ADC with DMA, conversion time 1µF blocking capacitor; ISO 7637 test pulses are applied to LIN via a coupling capacitance of 1nF; Simulated value for low conductance board (JEDEC). Equivalent to discharging a 150pF capacitor through a 330Ω resistor; Based on the evaluation results, additional external protection components might be recommended to reach the specified system ESD levels. Equivalent to discharging a 100pF capacitor through a 1.5kΩ resistor conform to MIL STD 883 method 3015.7. [1] [2] [3] [4] [5] [6] 4. Operating conditions  The IC can have 6 different hardware modes. The exact functionality of these modes depends on the hardware and software configuration:  Reset: o      Triggered by hardware. When VS or VDDA or VDDD drop below a critical level, the complete chip is powered down. o The analogue and digital supply regulators are disabled. No functionality is available in this mode. Normal mode. Main application running o Microcontroller fully functional o Analogue fully functional Low power mode (managed via firmware). Digital part running at lower frequency (250kHz) o Microcontroller fully functional o LIN not possible o Analogue fully functional Under voltage: triggered by the hardware under voltage detection interrupt o Microcontroller fully functional. o Power down behavior can be managed via software. o Reduced current capability on HVx below VS=5.5V. Over voltage: triggered by the hardware over voltage detection interrupt. o Microcontroller fully functional o Behaviour can be managed via software. Sleep Mode: Triggered by the software. o Microcontroller powered down o Digital and analogue supply powered down. o Sleep Mode and wake-up functionality running on help supply Vaux Parameter Supply Voltage Range Ambient Temperature Symbol Conditions VS TA Min 5.5 -40 Limit Typ Max 18 125 Unit V °C Table 1 – Operating conditions REVISION 001 –DECEMBER 2016 Page 7 of 14 MLX81112/15 Single and Dual Channel LIN RGB Controller Short Datasheet 5. Typical application examples The following section shows typical application examples. Please refer to additional Melexis application notes for more details. The signal order in all application diagrams does not reflect any pin order of the device. The following application diagrams are only principle examples, showing how the controller could be embedded into a system. Detailed application data must be worked out by customers to meet the needs of their dedicated application. Application Example MLX81112 VBat 2.2µF VS VS 47nF HV0 0 ... 48mA MLX81112 VS HV3 HV1 0 ... 48mA VS LIN_IN 180p LIN_OUT HV2 0 ... 48mA GND Figure 3 – RGB LED application controlled via LIN bus MLX81112 is perfectly suited to build highly integrated RGB LED modules. The PWM output stages allow excellent color and brightness control. The integrated flow current measurement units can be used to react on aging or other effects of the diodes over life time. For this the initial voltage drop for a certain forward current is stored in the flash during EOL at customer side, which can be used later to detect any change in the diode characteristics and adapt the control algorithms accordingly. REVISION 001 –DECEMBER 2016 Page 8 of 14 MLX81112/15 Single and Dual Channel LIN RGB Controller Short Datasheet Application Example MLX81115 VS VBat HV0 2.2µF 0 ... 48mA VS VS 47nF HV1 0 ... 48mA VS MLX81115 HV2 0 ... 48mA VS HV3 0 ... 48mA VS LIN_IN 180p LIN_OUT HV4 0 ... 48mA VS GND HV5 0 ... 48mA Figure 4 – Application schematic sample MLX81115 offers more flexibility due to the higher pin count making 3 additional HV pins available. They can be used to drive a second RGB-LED. Further the HV pins support the connection of the internal SPI, which allows connecting to any other controller and smart sensors supporting this standard interface. REVISION 001 –DECEMBER 2016 Page 9 of 14 MLX81112/15 Single and Dual Channel LIN RGB Controller Short Datasheet 6. Block diagram Power Supply VS VDDD VDDA ADCx Aux Supply + WakeUp Logic INTx HV0 HVDIN HVINEN HV1 WakeUp LIN HVDOUTB PWMx Out HV2 UVLO POR / AWD WakeUp HVx LIN Dig TX HV3 (MLX81115only) 0 ... 48mA HV4 (MLX81115only) HV5 (MLX81115only) ADCx ... ADCVS ... PWM5 ... 0 ... ADC Divider and Mux 16-bit PWM Test/Debug Interface GND INT LIN Autoconfig LIN _OUT RC-Osc. 10-bit ADC Window WD Timer 16kByte ROM LIN Controller MCU-Core 32kByte Flash 2048byte RAM to ADC MUX LIN PHY LIN_IN 512byte NVRAM Figure 5 – Block Diagram REVISION 001 –DECEMBER 2016 Page 10 of 14 MLX81112/15 Single and Dual Channel LIN RGB Controller Short Datasheet 7. Functional Description MCU  16-bit RISC MCU LIN Transceiver and Controller   Compliant to LIN 2.x and J2602 Support Autoconfig according bus shunt Memory      32kByte User Flash 16kByte ROM used for Bootloader, LIN Driver and Software Library Functions 2kByte RAM 380Byte User EEPROM 128byte MLX EEPROM for LIN IDs, Calibration data HV0..5 IO           High voltage capable open drain output (max 60Ohm RDSON) High voltage capable constant current output of 30mA per IO (max. 48mA short term) 16-bit PWM Output Digital output (5V) High voltage capable input Digital (5V) input 10-bit ADC Input inc.pre-devider for direct measurement of VS Differential SC-Amplifier for detection of very small voltage changes for LED threshold measurement SPI Interface Interrupt capable input Software Debug Interface   Available at HV0..3pins For full debug function a special packaged version will be available with additionl pins to be used as software development device. ADC     10-bit ADC Multiple channels (HVO..5, VS, internal references, temp sensor, difference voltage HVx, LIN AA) Full Scale 5V via internal pre-divider Continuous Mode: Automatic measuring of enabled channels. Result stored via DMA. If new result available old will be overwritten REVISION 001 –DECEMBER 2016 Page 11 of 14 MLX81112/15 Single and Dual Channel LIN RGB Controller Short Datasheet PWM       Max 16-bit resolution, min 370Hz Configurable from 8-bit to 16-bit, 8-bit mode with max possible frequency – approx 60kHz Up to 6 undependent PWM channels Programmable PWM frequency per channel Programmable interrupt generation at the beginning and/or end of every PWM period Synchronuous switch of duty cycle change Power Supply   Internal compensated Primary Cap min 2.2uF REVISION 001 –DECEMBER 2016 Page 12 of 14 MLX81112/15 Single and Dual Channel LIN RGB Controller Short Datasheet 8. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices)   IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)   EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices)  EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)  EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/Quality_soldering.aspx) as well as trim&form recommendations (http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx REVISION 001 –DECEMBER 2016 Page 13 of 14 MLX81112/15 Single and Dual Channel LIN RGB Controller Short Datasheet 9. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2013 Melexis NV. All rights reserved. 10. Contact Information For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: America: Phone: +32 1367 0495 E-mail: sales_europe@melexis.com Phone: +1 248 306 5400 E-mail: sales_usa@melexis.com ISO/TS 16949 and ISO14001 Certified REVISION 001 –DECEMBER 2016 Page 14 of 14