MLX90248ELD-EBA-000-RE 数据手册
MLX90248
Micropower & Omnipolar Hall Switch
Features and Benefits
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Applications
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Micropower consumption ideal for batterypowered applications
Omnipolar, easy to use as output switches with
both North and South pole
Very High Sensitivity Hall Sensor
Chopper stabilized amplifier stage
Open-Drain Output
Operation down to 1.5V
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Solid State Switch
Handheld Wireless Handset Awake Switch
Lid close sensor for battery-powered devices
Magnet proximity sensor for reed switch
replacement in low duty cycle applications
Energy metering
Ordering Information
Product Code
Package Code
MLX90248
Temperature
Code
E
Option Code
Packing Form Code
SE
EBA-000
RE
MLX90248
E
LD
EBA-000
RE
MLX90248
E
SC
EBA-000
CN
Legend:
Temperature Code:
Package Code:
Packing Form:
Ordering example:
E for Temperature Range -40°C to 85°C
SE for TSOT, LD for UTQFN, SC for SC-70
RE for Reel, CN for Canister
MLX90248ESE-EBA-000-RE
1. Functional Diagram
2. General Description
The MLX90248 Omnipolar Hall effect sensor technology. It
incorporates advanced chopper-stabilization techniques to
provide accurate and stable magnetic switch points. The
circuit design provides an internally controlled clocking
mechanism to cycle power to the Hall element and analog
signal processing circuits.
This serves to place the high current-consuming portions of
the circuit into a “Sleep” mode. Periodically the device is
“Awakened” by this internal logic and the magnetic flux
from the Hall element is evaluated against the predefined
thresholds. If the flux density is above or below the Bop/Brp
thresholds, then the output transistor is driven to change
states accordingly. While in the “Sleep” cycle the output
transistor is latched in its previous state. The design has
been optimized for service in applications requiring
extended operating lifetime in battery powered systems.
The output transistor of the 90248 will be latched on (BOP)
in the presence of a sufficiently strong South or North
magnetic field facing the marked side of the package. The
output will be latched off (BRP) in the absence of a magnetic
field.
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Contents
Features and Benefits.................................................................................................................................1
Applications................................................................................................................................................1
Ordering Information .................................................................................................................................1
1. Functional Diagram ................................................................................................................................1
2. General Description................................................................................................................................1
3. Glossary of Terms ...................................................................................................................................3
4. Absolute Maximum Ratings ....................................................................................................................3
5. Pin Definitions and Descriptions .............................................................................................................3
6. Electrical Specifications ..........................................................................................................................4
7. Magnetic Specifications ..........................................................................................................................4
8. Outputs behavior vs. Magnetic Pole .......................................................................................................4
9. Detailed General Description..................................................................................................................5
10. Unique Features ...................................................................................................................................5
11. Performance Graphs ............................................................................................................................6
Magnetic Thresholds vs. TA .............................................................................................................. 6
Magnetic Thresholds vs. VDD ............................................................................................................ 6
Current Consumption vs. TA .............................................................................................................. 6
Current Consumption vs. VDD ........................................................................................................... 6
Consumption Period vs. TA ............................................................................................................... 6
Consumption Period vs. VDD ............................................................................................................. 6
Output Saturation Voltage vs. TA ..................................................................................................... 7
12. Application Information........................................................................................................................7
13. Standard information regarding manufacturability of Melexis products with different soldering
processes...............................................................................................................................................8
14. ESD Precautions ...................................................................................................................................8
15. Package Information ............................................................................................................................9
TSOT-3L (SE Package) ....................................................................................................................... 9
UTQFN-6L (LD package).................................................................................................................. 10
SC-70 (SC Package) ......................................................................................................................... 12
16. Contact ...............................................................................................................................................13
17. Disclaimer...........................................................................................................................................13
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3. Glossary of Terms
Gauss, milliTesla (mT),
Units of magnetic flux density
10 Gauss = 1mT
4. Absolute Maximum Ratings
Parameter
Supply Voltage
Symbol
VDD
Value
5
Units
V
Supply Current
IDD
5
mA
Output Voltage
VOUT
5
V
Output Current
IOUT
10
mA
Operating Temperature Range
TA
-40 to 85
⁰C
Storage Temperature Range
TS
-50 to 150
⁰C
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
5. Pin Definitions and Descriptions
SC package
SE Package
LD Package
Pin Name
Function
Pin No (SE)
Pin No (LD)
Pin No (SC)
VDD
Power Supply
1
2
1
GND
Ground
3
4
3
OUT
Output
2
5
2
N.C.
Not connected
-
1, 3, 6
-
Table 1: Pin definitions and descriptions
Note: Exposed Pad on LD package is connected to ground
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6. Electrical Specifications
DC Operating Parameters TA = 25oC, VDD = 1.5V to 3.6V (unless otherwise specified)
Parameter
Symbol Conditions
Min Typ.
Max
Supply Voltage
VDD
Operating
1.5
3.6
Awake Supply Current
IDDawake VDD = 3.6V
3
5
Sleep Supply Current
IDDsleep
VDD = 3.6V
3.5
6
Average Supply Current
IDDav
VDD = 3.6V, Average
6.5
10
Output Saturation Voltage
VSAT
IOUT = 1mA
0.27
0.4
Output Leakage Current
ILEAK
VDD = 3.6V
1
Awake Period
TAW
Operating
30
50
120
Sleep Period
TSL
Operating
25
40
70
Units
V
mA
uA
uA
V
uA
us
ms
Table 2: Electrical specifications
7. Magnetic Specifications
DC Operating Parameters TA = 25⁰C, VDD = 1.5V to 3.6V (unless otherwise specified)
Parameter
Operating Point
Release Point
Hysteresis
Symbol
BOP
BRP
BHYS
Min
+/-1.1
+/-0.8
0.3
Typ.
+/-3.8
+/-2.8
-
Max
+/-6
+/-5.7
2.3
Units
mT
mT
mT
Table 3: Magnetic specifications
Note : For typical values, please refer to the performance graphs section
8. Outputs behavior vs. Magnetic Pole
Parameter
North or South pole
“Zero” magnetic pole
Test conditions
B > |BOP|
B < |BRP|
OUT
Low
High
Table 5: Outputs behavior vs. magnetic pole
Note: The magnetic pole is applied facing the branded side of the package
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9. Detailed General Description
The MLX90248 is originally used in mobile phone applications for open/close lid detection (flip, slide and swivel
phone type). The goal of this detection is to switch on or off the application if the lid is opened or closed, in order to
save battery power.
The same operation principle can be simply applied to any other battery-powered device with a lid/cover like laptop,
digital cameras and camcorders.
By the use of a very high sensitivity Hall sensor, a very small and cheap magnet is enough to trigger the MLX90248,
hence it can easily replace reed switch.
The major benefit of using a Hall sensor is to provide “electronic” commutation, which is bounce-free, more reliable
and with increased lifetime compared to usual mechanical contacts.
10. Unique Features
The MLX90248 exhibits “Omnipolar” magnetic characteristics. It means the device reacts to both North and South
magnetic pole. The purpose is to detect the presence of any magnetic field applied on the device.
This mode of operation simplifies customer production processes by avoiding the need to detect the Hall sensor pole
active on the magnet used in the application.
Taking the example of a generic Hall sensor “south pole active”, during its production, the customer must detect the
south pole of the application magnet and face it to the device to enable the output to be turned on and off. Without
any magnet pole detection system, the incorrect magnetic pole (north in this example) could be faced to the device
which would fail the application.
Therefore, the “Omnipolar” magnetic behavior helps customers by removing the need of magnet pole detection
system during production phase.
The “Micropower” feature makes the MLX90248 especially suitable for battery-powered device as it combines low
voltage operation and low current consumption. By using a sleep/awake strategy managed internally, the power
consumption is drastically reduced. To make a comparison, the MLX90248 consumes 100 times less power than the
generic low voltage Melexis Hall sensor US3881.
As well as Thin SOT package, the MLX90248 is now delivered in a UTQFN package. This new leadless package only
requires 3mm2 PCB surface and is 0.43mm maximum thick, which is particularly important in design where spacesaving and miniaturization are the critical factors.
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Micropower & Omnipolar Hall Switch
11. Performance Graphs
Unless otherwise specified, performance graphs given at V DD = 3.6V and T A = 25 ⁰C.
Magnetic Thresholds vs. TA
Magnetic Thresholds vs. VDD
Current Consumption vs. TA
Current Consumption vs. VDD
Consumption Period vs. TA
Consumption Period vs. VDD
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Output Saturation Voltage vs. TA
12. Application Information
MLX90248
VCC
C1
10nF
VDD
OUT
GND
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RPU
100k
VOUT
C2
100pF
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Micropower & Omnipolar Hall Switch
13. Standard information regarding manufacturability of Melexis products
with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according
to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
•
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature
gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength
between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the
use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
14. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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15. Package Information
TSOT-3L (SE Package)
15.1.1. TSOT-3L – Package dimensions
1.32 ± 0.20 mm
0.75 ± 0.20 mm
15.1.2. TSOT-3L - Sensitive spot positioning
1.47 ± 0.20 mm
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1.18 ± 0.15 mm
0.60 ± 0.03 mm
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Micropower & Omnipolar Hall Switch
15.1.3. TSOT-3L - Package Marking
3
Top
248E
Device Name
248E
1
2
1
2
Bottom
X
Y
XYWW
WW
Calender week
Last digit of calender year
Last digit of lot#
3
UTQFN-6L (LD package)
15.2.1. UTQFN-6L - Package dimensions
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Micropower & Omnipolar Hall Switch
0.92 ± 0.10 mm
0.24 ± 0.05 mm
0.08 ± 0.05 mm
15.2.2. UTQFN-6L - Sensitive spot positioning
Notes:
1. Terminals and exposed pad are for illustration only.
2. Hall plate center is aligned to package center.
0.60 ± 0.10 mm
0.15 ± 0.05 mm
15.2.3. UTQFN-6L - Package Marking
Top
.4E
YWW
.
4E
Device name
Dot used to show pin 1 mark
Y
WW
Calender week
Year (last digit)
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SC-70 (SC Package)
15.3.1. SC-70 - Package dimensions
1.02±0.20 mm
0.60±0.20 mm
15.3.2. SC-70 - Sensitive spot positioning
1.07±0.15 mm
0.82±0.15 mm
0.61 ± 0.05 mm
15.3.3. SC-70 - Package Marking
Top
8
8YLL
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Y
LL
5th and 6th digit of lot#
Last digit calender year
Fixed digit
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Micropower & Omnipolar Hall Switch
16. Contact
For the latest version of this document, go to our website at www.melexis.com.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa
Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas
Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
17. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no representation,
nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no respo nsibility or liability for any errors or inaccuracies that
may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. This documentation is in fact provided without warranty,
term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability, satisfactory quality, non-infringement, and fitness for
purpose. Melexis, its employees and agents and its affiliates' and their employees and agents will not be responsible for any loss, however arising, from the use of, or reliance on
this document. Notwithstanding the foregoing, contractual obligations expressly undertaken in writing by Melexis prevail over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing orders or prior to designing the product
into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of reliability required and determine whether
it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require a prior authorization from competent
authorities. The product is not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual environmental requirements.
High reliability applications, such as medical life-support or life-sustaining equipment or avionics application are specifically excluded by Melexis. The product may not be used for
the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage, recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of
violence in an armed conflict or any similar violent situation.
No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.
If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably understood as being confidential, the recipient of
this document shall not communicate, nor disclose to any third party, any part of the document without Melexis’ express written consent. The recipient shall take all necessary
measures to apply and preserve the confidential character of the document. In particular, the recipient shall (i) hold document in confidence with at least the same degree of care
by which it maintains the confidentiality of its own proprietary and confidential information, but no less than reasonable care; (ii) restrict the disclosure of the document solely to
its employees for the purpose for which this document was received, on a strictly need to know basis and providing that such persons to whom the document is disclosed are bound
by confidentiality terms substantially similar to those in this disclaimer; (iii) use the document only in connection with the purpose for which this document was received, and
reproduce document only to the extent necessary for such purposes; (iv) not use the document for commercial purposes or to the detriment of Melexis or its customers. The
confidentiality obligations set forth in this disclaimer will have indefinite duration and in any case they will be effective for no less than 10 years from the receipt of this document.
This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject to the exclusive jurisdiction of the
courts of Brussels, Belgium.
The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other provisions.
The previous versions of this document are repealed.
Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2020)
IATF 16949 and ISO 14001 Certified
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