MLX90293LDC-ADM-100-SP

MLX90293 Linear Hall Position Sensor IC Datasheet Features and Benefits Linear Hall Position Sensor IC Non-linear Magnetic Design with Linear Output Signal Programmable Transfer Characteristic to compensate system non-linearity and thermal drift: Over Position : 16 segments – Piece-WiseLinear Thermal Drift over Temperature : Sensitivity and Offset : 6 segments - Piece-Wise-Linear(1) Selectable Output Mode: Analog (Ratiometric) Pulse Width Modulation (PWM) SENT (according to SAE J2716-2010) 12 bit Resolution - 10 bit Thermal Accuracy Open/Short Diagnostics Over-Voltage Protection Under-Voltage Detection 48 bit ID Number option AEC-Q100 Qualified Single Die – SOIC-8 Package RoHS Compliant Dual Die (Full Redundant) – TSSOP-16 Package RoHS Compliant SOIC-8 TSSOP-16 Applications Absolute Small Angle Rotary Position Sensor Absolute Small Stroke Linear Position Sensor Pedal Position Sensor Non-Contacting Potentiometer 1 IC is trimmed at Melexis to achieve minimized IC sensitivity & offset drift over temperature. Customers can trim the sensitivity & offset drift of the application over temperature. Description The MLX90293 is a SMD Programmable Linear Hall Sensor IC that enables contact less position sensor applications. The sensor measures the magnetic field component perpendicular to the surface of the IC. The MLX90293 supports multiple output modes, such as analog, PWM and SENT 2010. The MLX090293 enables extensive nonlinear optimization of the transfer characteristic. Such optimization in turn enables simplified magnetic designs. The result is a linear output characteristic over position after calibration. The customer can program this relation in his endof-line calibration through the connector with Melexis tooling. MLX90293 Linear Hall Position Sensor IC Datasheet Contents Features and Benefits................................................................ ................................................................................................ ................................................................................................ ................................................................ 1 Applications................................................................ ................................................................................................ ................................................................................................ ............................................................................... ............................................... 1 Description ................................................................ ................................................................................................ ................................................................................................ ................................................................................ ................................................ 1 1. Ordering Information Information ................................................................ ................................................................................................ ............................................................................................ ............................................................ 5 2. Functional Diagram ................................................................ ................................................................................................ ............................................................................................... ............................................................... 6 3. Glossary of Terms ................................................................ ................................................................................................ ................................................................................................ .................................................................. .................................. 6 4. Pinout ................................................................ ................................................................................................ ................................................................................................ .................................................................................... .................................................... 7 5. Absolute Maximum Ratings ................................................................ ................................................................................................ ................................................................................... ................................................... 7 6. Electrical Specification ................................................................ ................................................................................................ ........................................................................................... ........................................................... 8 7. Isolation Specification................................................................ ................................................................................................ ............................................................................................ ............................................................ 9 8. Timing Specification................................ Specification................................................................ ................................................................................................ ............................................................................................. ............................................................. 10 8.1. Generic Timings ................................................................................................................................ 10 8.2. Timings in Analog/PWM mode ........................................................................................................ 10 8.3. Timings specific for PWM Protocol .................................................................................................. 10 8.4. Timings in SENT mode ...................................................................................................................... 12 8.5. Timing diagrams ................................................................................................................................ 13 8.6. Application diagram used for rise and fall time measurement ...................................................... 14 9. Accuracy specification ................................................................ ................................................................................................ ......................................................................................... ......................................................... 15 10. Magnetic Specification ................................................................ ................................................................................................ ...................................................................................... ...................................................... 15 11. CPU CPU & Memory Specification................................................................ ................................................................................................ ............................................................................. ............................................. 15 12. Traceability Information ................................................................ ................................................................................................ .................................................................................... .................................................... 16 13. EndEnd-User Programmable Items................................................................ ................................................................................................ .......................................................................... .......................................... 16 14. Description of EndEnd-User Programmable Items................................................................ ................................................................................... ................................................... 18 14.1. Output modes ................................................................................................................................. 18 14.1.1. Out mode .................................................................................................................................. 18 14.1.2. PWM Output Mode .................................................................................................................. 20 14.2. Output Transfer Characteristic ...................................................................................................... 20 14.2.1. Introduction .............................................................................................................................. 20 14.2.2. Order selection of the calculation ........................................................................................... 21 14.2.3. Piecewise Linear Compensation over Position ....................................................................... 21 14.2.4. Piecewise Linear Compensation for Thermal Offset Drift ...................................................... 23 REVISION 004 390109029301 Page 2/40 MLX90293 Linear Hall Position Sensor IC Datasheet 14.2.5. Piecewise Linear Compensation for Thermal Sensitivity Drift ............................................... 24 14.2.6. CLAMPING Parameters............................................................................................................. 24 14.3. SENT output Protocol ..................................................................................................................... 24 14.3.1. Generalities ............................................................................................................................... 24 14.3.2. Single Secure Fast Channel ...................................................................................................... 24 14.3.3. Slow Channel............................................................................................................................. 26 14.3.4. Start-up ..................................................................................................................................... 28 14.3.5. Field sensing (A2D conversions) and the frame Synchro pulse ............................................. 28 14.4. Identification ................................................................................................................................... 28 14.5. Lock.................................................................................................................................................. 28 14.6. Digital Filter ..................................................................................................................................... 29 14.6.1. Introduction .............................................................................................................................. 29 14.6.2. Specification & EEPROM settings ............................................................................................ 29 14.6.3. Hard Threshold ......................................................................................................................... 29 14.7. Programmable Diagnostic Settings ................................................................................................ 30 14.7.1. DIAG mode ................................................................................................................................ 30 14.7.2. DIAG Level ................................................................................................................................. 30 14.7.3. Diagnostic Features .................................................................................................................. 30 14.8. EEPROM endurance........................................................................................................................ 30 15. Self Diagnostic ................................................................ ................................................................................................ ................................................................................................ ................................................................... ................................... 31 16. Recommended Application Diagrams ................................................................ ................................................................................................ ................................................................ 33 16.1. MLX90293 in SOIC-8 Package ........................................................................................................ 33 16.2. MLX90293 in TSSOP-16 Package.................................................................................................... 34 17. Standard information regarding manufacturability of Melexis products with different soldering processes................................................................ ................................................................................................ ................................................................................................ ............................................................................ ............................................ 36 18. ESD Precautions................................................................ ................................................................................................ ................................................................................................ ................................................................. ................................. 36 19. Package Information................................................................ ................................................................................................ .......................................................................................... .......................................................... 37 19.1. SOIC-8 - Package Dimensions ......................................................................................................... 37 19.2. SOIC-8 - Pinout and Marking .......................................................................................................... 37 19.3. SOIC-8 - Sensitive spot positioning ................................................................................................ 38 19.4. TSSOP-16 - Package Dimensions .................................................................................................... 38 19.5. TSSOP-16 - Pinout and Marking ..................................................................................................... 39 19.6. TSSOP-16 - Sensitive spot positioning ........................................................................................... 39 REVISION 004 390109029301 Page 3/40 MLX90293 Linear Hall Position Sensor IC Datasheet 20. Disclaimer ................................................................ ................................................................................................ ................................................................................................ .......................................................................... .......................................... 40 21. Contact ................................................................ ................................................................................................ ................................................................................................ .............................................................................. .............................................. 40 REVISION 004 390109029301 Page 4/40 MLX90293 Linear Hall Position Sensor IC Datasheet 1. Ordering Information Product Code MLX90293 MLX90293 MLX90293 MLX90293 MLX90293 MLX90293 MLX90293 MLX90293 Temperature Code E L E L E L E L Package Code DC DC GO GO DC DC GO GO Option Code ADM-000 ADM-000 ADM-000 ADM-000 ADM-100 ADM-100 ADM-100 ADM-100 Packing Form RE RE RE RE RE RE RE RE Legend: Temperature Code: Package Code: Option Code: Packing Form: Ordering Example: E: from -40 Deg.C to 85 Deg.C L: from -40 Deg.C to 150 Deg.C “DC” for SOIC-8 package “GO” for TSSOP-16 package (dual die) ADM-000 – Default ADM-100 – Low thermal drift “RE” for Reel “SP” for Sample Pack MLX90293LGO-ADM-100-RE Table 1 - Legend REVISION 004 390109029301 Page 5/40 MLX90293 Linear Hall Position Sensor IC Datasheet 2. Functional Diagram Figure 1 - Block Diagram 3. Glossary of Terms Gauss (G), Tesla (T) TC NC PWM Units for the magnetic flux density - 1 mT = 10 G Temperature Coefficient (in ppm/Deg.C.) Not Connected ADC LSB MSB DNL INL RISC ASP DSP ATAN Analog-to-Digital Converter Least Significant Bit Most Significant Bit Differential Non-Linearity Integral Non-Linearity Reduced Instruction Set Computer Analog Signal Processing Digital Signal Processing Trigonometric function: arctangent (or inverse tangent) Integrated Magneto-Concentrator (IMC®) Coordinate Rotation Digital Computer IMC CoRDiC REVISION 004 390109029301 Pulse Width Modulation EMC FE RE FW HW PWM %DC (i.e. iterative rectangular-to-polar transform) Electro-Magnetic Compatibility Falling Edge Rising Edge Firmware Hardware Pulse Width Modulation Ratio Ton / Tperiod where Ton is the high state duration and Tperiod is the duration of 1 pwm period MT3V More than 3V Condition MT4V More than 4V Condition LSD PP Low Side Driver = Open drain N Push-Pull Table 2 - Glossary of Terms Page 6/40 MLX90293 Linear Hall Position Sensor IC Datasheet 4. Pinout PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 SOIC-8 VDD Test 0 Test 2 Not Used OUT Test 1 VDIG VSS (Ground) TSSOP-16 VDIG1 VSS1 (Ground1) VDD1 Test 01 Test 22 OUT2 Not Used2 Test 12 VDIG2 VSS2 (Ground2) VDD2 Test 02 Test 21 Not Used1 OUT1 Test 11 For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the Ground (see section 16). 5. Absolute Maximum Ratings DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. Parameter Supply Voltage, VDD (overvoltage) Reverse Voltage Protection Positive Output Voltage Output Current (IOUT) Reverse Output Voltage Reverse Output Current Operating Ambient Temperature Range, TA Storage Temperature Range, TS Magnetic Flux Density Value + 24 V − 12 V (breakdown at -14 V) + 18 V (breakdown at 24 V) + 30 mA (in breakdown) − 0.3 V − 50 mA (in breakdown) − 40 … + 150 Deg.C − 40 … + 150 Deg.C ±1T Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximumrated conditions for extended periods may affect device reliability. REVISION 004 390109029301 Page 7/40 MLX90293 Linear Hall Position Sensor IC Datasheet 6. Electrical Specification DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. Parameter Nominal Supply Voltage Supply Current(2) Isurge Current(4) Power-On reset (rising) Power-On reset Hysteresis Start-up Level (rising) Start-up Hysteresis PTC Entry Level (rising) PTC Entry Level Hysteresis Output Short Circuit Current Output Load Analog Saturation Output Level Active Diagnostic Output Level Symbol VDD IDD Isurge HPOR_LH HPOR_Hyst MT4V LH MT4V Hyst MT7V_LH MT7V_Hyst Ishort RL Vsat_lo Vsat_hi Diag_lo Diag_hi BVSSPD Passive Diagnostic Output Level (Broken Track Diagnostic) (5) BVSSPU BVDDPD BVDDPU Clamped Output Level Clamp_lo Clamp_hi Test Conditions Min 4.5 Typ 5 6 2 50 3.8 50 5.8 50 2.25 4.7 4.7 10 10 0.5 2 97 98.5 0.5 2 97 98.5 Power saving Enabled Refer to internal voltage Vdig Vout = 0 V Vout = 5 V Vout = 18 V (TA = 25Deg.C) Pull-down to Ground Pull-up to 5V Pull-up load RL ≥ 10 kΩ to 5 V Pull-up load RL ≥ 5 kΩ to 18 Pull-down load RL ≥ 5 kΩ Pull-down load RL ≥ 10 kΩ Pull-up load RL ≥ 10 kΩ to 5 V Pull-up load RL ≥ 5 kΩ to 18V Pull-down load RL ≥ 5 kΩ Pull-down load RL ≥ 10 kΩ Broken VSS & Pull-down load RL ≥ 5 kΩ Pull-down load RL ≥ 10 kΩ Broken VSS & Pull-up load RL ≥ 1kΩ Broken VDD & Pull-down load RL ≥ 1kΩ Broken VDD & Pull-up load RL ≥ 5kΩ Programmable Programmable 95 97.5 95 97.5 4.0 6.2 Max 5.5 10(3) 20 2.5 200 4.2 200 6.6 200 15 15 18 2 3 2 3 %VDD %VDD %VDD 100 0 0 0 %VDD %VDD 95 97.5 99.5 Units V mA mA V mV V mV V mV mA mA mA kΩ kΩ %VDD 0.5 %VDD 2 %VDD 100 100 %VDD(6) %VDD(6) 2 For the dual version, the supply current is multiplied by 2. 3 To reach 10mA, the power saving option is enabled. This option switches off and on internal blocks dynamically. It can be disabled to reduce emission and meet stringent EMC requirements; the maximum supply current consumption then is increased up to 12mA. 4 The specified value is valid during early start-up time only; the current might dynamically exceed the specified value, shortly, during the Start-up phase. 5 For detailed information, see also section on Diagnostics 6 Clamping levels need to be considered vs the saturation of the output stage (see Vsat_lo and Vsat_hi) REVISION 004 390109029301 Page 8/40 MLX90293 Linear Hall Position Sensor IC Datasheet As an illustration of the previous table, the MLX90293 fits the typical classification of the output span described on the Figure 2. 100 % 90 % 96 % 92 % 88 % Diagnostic Band (High) Clamping High 80 % Output Level 70 % 60 % 50 % Linear Range 40 % 30 % 20 % 10 % 12 % 8% 4% Clamping Low Diagnostic Band (Low) 0% Figure 2 - Example of Output Span Classification for typical application 7. Isolation Specification DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. Only valid for the Package Code GO i.e. dual die version. Parameter Isolation Resistance REVISION 004 390109029301 Symbol Test Conditions Between dice Min 4 Typ Max Units MΩ Page 9/40 MLX90293 Linear Hall Position Sensor IC Datasheet 8. Timing Specification 8.1. Generic Timings DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. These timings hold true regardless of the choosen communication protocol. Parameter Main Clock Frequency Symbol Ck Main Clock Frequency Thermal Drift Watchdog Test Conditions All contributors included thermal drift Min 12.6 Typ 13.3 ∆TCk Twd 114.5 118 Max 14 Units MHz ± 3% CkNOM 121.5 ms 8.2. Timings in Analog/PWM mode DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. Parameter Refresh Period Symbol Analog OUT Slewrate Min ts Filter=0(7) Filter=1 Filter=2 IIR is described separately in section 14.6 Latency over Refresh Period ratio Start-up Cycle Test Conditions Tsu Typ Units 441 μs 1.5 2 3 ts [refresh rate](8) Analog OUT Slew-rate excluded Mode 1 from COUT = 47 nF to 330 nF Mode 2: up to COUT = 10 nF Mode 3: up to COUT = 47 nF Mode 4: up to COUT = 330 nF Max 10 25 37 300 17 1.8 320 19 2.5 ms V/ms 8.3. Timings specific for PWM Protocol DC Operating Parameters at VDD Temperature Code. = VPU = 5V (unless otherwise specified) and for TA as specified by the 7 See section 14.6 for details concerning Filter parameter 8 The step response time is the Refresh Period times ts. So, the step response time of filter = 1 is 882μs = 2x441 μs REVISION 004 390109029301 Page 10/40 MLX90293 Linear Hall Position Sensor IC Datasheet Parameter PWM Output Resolution Symbol RPWM PWM % DC Jitter JDC PWM Freq Jitter JPWM PWM % DC thermal drift Test Conditions 12 bits LSD – Mode5 100Hz, 4.7nF, RL = 1 kΩ PU 200Hz, 4.7nF, RL = 1 kΩ PU 1000Hz, 4.7nF, RL = 1 kΩ PU Min PP – Mode7 100Hz, 4.7nF, RL = 1 kΩ PU 200Hz, 4.7nF, RL = 1 kΩ PU 1000Hz, 4.7nF, RL = 1 kΩ PU LSD – Mode5 100-1000 Hz, 4.7nF, RL = 1 kΩ PU Typ 0.025 Max ±0.003 ±0.005 ±0.009 ±0.016 ±0.02 ±0.035 ±0.003 ±0.005 ±0.009 ±0.016 ±0.02 ±0.035 ±0.04 ±0.15 PP – Mode7 100-1000 Hz, 4.7nF, RL = 1 kΩ PU LSD – Mode5 100Hz, 4.7nF, RL = 1 kΩ PU 200Hz, 4.7nF, RL = 1 kΩ PU 1000Hz, 4.7nF, RL = 1 kΩ PU PP – Mode7 100Hz, 4.7nF, RL = 1 kΩ PU 200Hz, 4.7nF, RL = 1 kΩ PU 1000Hz, 4.7nF, RL = 1 kΩ PU LSD – Mode5 100Hz, 4.7nF, RL = 1 kΩ PU PWM % DC Level drift (Trigger level= 25/50/75%) PP – Mode7 100Hz, 4.7nF, RL = 1 kΩ PU 100Hz – PP Application Diagram (see below) Rs = 0, 50, 100, 150 Ohm Tolerance on R ± 20% Tolerance on C ± 30% PWM % DC Level drift Units %DC/LSB %DC Hz ±0.04 ±0.15 ±0.02 ±0.02 ±0.02 ±0.03 ±0.03 ±0.05 ±0.02 ±0.02 ±0.02 ±0.03 ±0.03 ±0.05 ±0.1 ±0.15 %DC %DC ±0.05 ±0.1 ±0.05 ±0.1 %DC Jitter is defined by ± 3 σ for 1000 successive acquisitions with clamped output, see Figure below. %Duty Cycle = TON / TPWM %DC Jitter = JDC = JON / TPWM Output (V) TPWM T ON Jitter on T ON = JON Jitter on T PWM = JPWM Time (s) REVISION 004 390109029301 Page 11/40 MLX90293 Linear Hall Position Sensor IC Datasheet Parameter Symbol TON TPWM PWM TON, TPWM Rise time, Fall time Test Conditions Trigger level = 50 % Vpp 10% and 90% of amplitude JON JPWM % DC Jitter Duty Cycle ± 3 σ for 1000 successive acquisitions TON / TPWM Figure 3 - MLX90293 PWM measurement conditions. 8.4. Timings in SENT mode DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. Parameter Tick time(9) SENT Frame Period(10) Maximal SENT Frame Tick Count(11) (pause pulse disabled) Internal Measurement Period12 First Measurement to Sync Pulse latency Second Measurement to Sync Pulse latency Latency (in case of Synchronous communication) Start-up Time (up to first sync pulse) Start-up Time (up to first data received) Serial Message Rise Time @ Cable Rise Time @ Receiver Fall Time @ Cable Fall Time @ Receiver Symbol tframe Test Conditions Ck = 13.3 MHz Ck = 13.3 MHz Min Typ 3 882 Max Units μs μs 256 ticks Tper Ck = 13.3 MHz 441 μs ta1 Ck = 13.3 MHz 1084 μs ta2 Ck = 13.3 MHz 643 μs 1745 μs 1.8 ms Latency FILTER = 1 (recommended) SENT Transmission Included 1745 tsu1 tsu2 Last pause pulse not included 7.5 Extended sequence (18 frames) Short sequence ( 8 frames) Thresholds : 0.5V and 4.5V 8.1 15.9 7.1 3.0 5.1 2.7 4.8 ms ms ms 5.3 6.8 2.8 4.9 μs μs μs μs 9 Tick time scales with Main Clock Frequency. Variation of Tick time for one IC is given by the Main Clock Frequency Thermal Drift. 10 This frame period with pause pulse enabled ensures synchronous communication. Synchronous means the time between data acquisition & signal transmitted in a SENT frame is fixed. 11 Length of frame depends on pause pulse enabled/disabled. The pause pulse and thus the frame length can be varied. A typical SENT frame is 56 ticks for the sync pulse, 8 nibble packages which vary between 12 & 25 ticks and an optional pause pulse which is at minimal 12 ticks. 12 This period is used if the pause pulse is enabled. If disabled, the Internal Measurement Period = 551s, i.e. 25 higher. REVISION 004 390109029301 Page 12/40 MLX90293 Linear Hall Position Sensor IC Datasheet 8.5. Timing diagrams VDD Tsu1 Tsu2 OUT High-Z Null Frame Null Frame Null Frame Null Frame Valid Angle Valid Angle Figure 4 - Start-up phase timings Latency ta1 Half Field component sensing & position calculation { Half B1 B1 B2 B2 ta2 B1 B1 B2 B2 tframe B1 B1 B2 B2 Field Average B1 B1 B1 B2 B2 Field Average dsp SENT wIth pause Pause Frame dsp Pause Frame Pause Figure 5 - Latencies (acquisition to output delays) – FILTER = 1 (recommended) Two readouts are averaged. Note: B1/B2 are needed to get one field readout. Field component sensing & position calculation SENT wIth pause B1 B2 B1 B2 B1 B2 B1 B2 dsp Pause Frame dsp Pause Frame Pause Figure 6 - Latency - Case FILTER = 0 (not recommended). The difference between Filter=0 & Filter =1 is that Filter =0 skips one acquisition of B1/B2. Field component sensing & angle calculation B1 B2 B1 B2 B1 B2 B1 B2 B1 B2 B1 B2 Field Average Field Average dsp dsp SENT wIth pause Pause Frame Pause Frame Pause Figure 7 - Latency - Case FILTER = 2 REVISION 004 390109029301 Page 13/40 MLX90293 Linear Hall Position Sensor IC Datasheet 8.6. Application diagram used for rise and fall time measurement 1 V DD VDD RPU SENT Protocol Generator 8 VSS VSS C01 C02 Cinput RV CTau R01 Cf 5 Wiring OUT MLX90293 MLX90293 MLX90367 OUT RTau Rf Figure 8 - Schematic used for rise and fall time measurements (ref: J2716 Rev Jan 2010 Fig. 6.3.4) Component C01 C02 R01 Cinput CTau Cf RTau Rf RPU RV Value 10 ± 25% not mounted not mounted 68 2.2 100 568 10 14.7 not mounted Unit nF nF Ω pF nF pF Ω kΩ kΩ Ω Component values used for rise and fall time measurements (ref: J2716 Rev Jan 2010 Fig. 6.3.4) REVISION 004 390109029301 Page 14/40 MLX90293 Linear Hall Position Sensor IC Datasheet 9. Accuracy specification DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. Parameter ADC Resolution on the raw signals Symbol Thermal Offset Drift ΔT VOQ Analog Output Resolution Min Typ Max Units 15 RDAC Output stage Noise Overall Noise(14) Test Conditions Without system compensation 12b DAC (Theoretical, Noise free) INL (before EOL calibration) DNL Clamped Output 3σ EE_VG = 21 (=span of 30mT) Sensitivity Drift(16) ΔT S Sensitivity Drift(16) ΔT S 4.5V ≤ VDD ≤ 5.5V LT4V ≤ VDD ≤ MT7V Intrinsic IC Sensitivity Drift (Temperature Code=L) Intrinsic IC Sensitivity Drift (Temperature Code=E) Ratiometry Error (15) -0.45 (13) 0.45 0.35 -0.35 -4 0.05 bits %Span 0.025 1 +4 3 %VDD/ LSB12 0.05 0.075 %VDD 0.1 %VDD -0.05 -0.1 +0.05 +0.1 %VDD -190 190 ppm/Deg.C -150 150 ppm/Deg.C 10. Magnetic Specification DC Operating Parameters at Nominal Supply Voltage (unless otherwise specified) and for Application Temperature Range TA as specified by the Temperature Code. Parameter Magnetic Flux Density Magnet Temperature Coefficient (17) Symbol BZ Test Conditions TCm Min -150 -4000 Typ Max 150 Units mT 0 ppm/Deg.C 11. CPU & Memory Specification The DSP is based on a 16 bit RISC µController. This CPU provides 2.5 Mips while running at 10 MHz. 13 Parts with lowered thermal offset drift are available. A thermal offset drift within [-0.45,0.45] is ordered with MLX90293ExxADM-0xx-xx. A thermal offset drift within [-0.35, 0.35] is ordered with MLX90293Exx-ADM-1xx-xx. 14 Noise pk-pk (peak-to-peak) is 3 sigma Noise. The application diagram used is described in the recommended wiring. For detailed information, refer to section Filter in application mode (Section 14). This specification is achieved with Hard Filter & IIR filter k=4 while meeting a response time of 0 Channel1 = output value always when EE_CODE_REPORT=0. ForceCntrZero. in case of True, counter in SENT frame is set to 0 to reduce message length. EE_EXTENDEDSEQUENCE=1 enables the long sequence of slow messages. • Diagnostic Reporting through the fast channel Diagnostic Reporting, bit Status[0] The bit Status[0] is high whenever the three following conditions are met: 1. A diagnostic (analog/environmental) detects an error(28) 2. The reporting of the above error is enabled(29) 3. The debouncing time has elapsed. Diagnostic Reporting, Channel 1 The diagnostic can be reported through the 12 bit payload of channel 1, and not only through the status bit Status[0]. The EEPROM parameters EE_CODE_REPORT[2:0] controls the diagnostic reporting through channel 1 as follow: If EE_CODE_REPORT[2:0]=0, the channel 1 reports the angle, and not the diagnostic, as if no diagnostic. The error is reported only thanks to the Status bits. 28 A diagnostic of type digital cause the circuit to switch in fail-safe-mode 29 See EEPROM bits EE_DIAG_SETTINGS REVISION 004 390109029301 Page 25/40 MLX90293 Linear Hall Position Sensor IC Datasheet If EE_CODE_REPORT[2:0]>0, EE_CODE_REPORT[2:0]) the channel1 payload contains the value Channel1 = (4088 + Diagnostic Reporting Time The Diagnostic Reporting Time is programmable (defined as multiple of a macro-cycle unit time). A macro-cycle is a sequence of 20 angle acquisitions, and has a duration of approximately 6 ms. Diagnostic Debouncing The Diagnostic Reporting is debounced. The debouncing paramater are user-programmable, by steps of approximately 6 ms. Pause pulse A pause pulse, as defined by the standard, is present at the end of every frame. The pause pulse mode can be disabled. Please contact our local Melexis representative to obtain the complete procedure for deactivating the pause pulse mode. The pause pulse is adjusted by the circuit so that the frame period is constant. The field sensing and the frame synchro pulse are in sync. Fast Channel CRC The 90293 features the new recommended implementation. 14.3.3. Slow Channel • Enhanced Serial Serial Message The circuit encodes the slow messages according the Enhanced Serial Message Format as specified at Chapter 5.2.4.3 of the SENT norm, except for the following restriction: The configuration bit is always 0, meaning that the payload consists in 12-bit data and 8-bit message ID. • Serial Message Sequence The circuit complies with the following sub-set specifications of the norm for pressure sensors (The norm for the angular sensor case does not specify the serial message format) # 1 2 8bit ID 29 01 Item Sensor ID Error Code 12 bit data Prog. RAM 3 2A Sensor ID Prog. 4 01 / 80 Error Code / User-defined RAM value RAM 5 2B Sensor ID Prog. 6 7 01 2C Error Code Sensor ID RAM Prog. 8 01 / 80 Error Code / User-defined RAM value RAM REVISION 004 390109029301 Comments EE_USERID1_12LSB Described in section 14.3.3 {EE_USERID2_8LSB, EE_USERID1_4MSB } RAM variable @ address EE_RAM_PROBE_ADDR e.g. Temp, GainCode, FieldStrength {EE_USERID3_4LSB,EE_USERID2_8 MSB} EE_USERID3_12MSB RAM variable @ address EE_RAM_PROBE_ADDR e.g. Temp, GainCode, FieldStrength Page 26/40 MLX90293 Linear Hall Position Sensor IC Datasheet # 8bit ID Item Optional Part (EE_ExtendedSequence = 1) 9 06 SENT Revision 10 01 Error Code 12 bit data Comments 003 RAM 11 EE_SERIAL_ID1 User-defined #1 EE_SERIAL_DATA_1 12 01 / 80 Error Code / User-defined RAM value RAM 13 14 15 EE_SERIAL_ID12 01 EE_SERIAL_ID3 User-defined #2 Error Code User-defined #3 EE_SERIAL_DATA_2 RAM EE_SERIAL_DATA_3 16 01 / 80 Error Code / User-defined RAM value RAM 17 18 EE_SERIAL_ID4 01 User-defined #4 Error Code EE_SERIAL_DATA_4 RAM e.g. Sensor type, Manufacturing code RAM variable @ address EE_RAM_PROBE_ADDR e.g. Temp, GainCode, FieldStrength e.g. 07 – Kennlinie e.g. 03 – Sensor Type RAM variable @ address EE_RAM_PROBE_ADDR e.g. Temp, GainCode, FieldStrength The first part (positions 1 to 8) provides the Error Code and the Sensor ID alternatively. The second part (positions 9 to 18) is optional as a whole enabled with EEPROM bit (EE_ExtendedSequence=1(30)). This second part consists in the error code (5 occurrences), 4 User-defined messages (ID and data) and the SENT revision. The temperature can be derived from user-defined RAM value (see below), with the following equation: User-defined RAM value = 8 * (Tlin[C] – 35[C]) + 865 LSB12 when User-defined RAM value= ramTempSens The accuracy of the actual Temperature is around ± 10 Deg.C. Serial message sequence period Sequence Length (serial message count) 8 18 Sequence Length (frame count) 144 324 Sequence Period (ms, typical) 121 273 UserUser-defined RAM Value The payloads of the positions 4, 8 (and 12, 16 if relevant) are user-defined. Three possibilities: Error Code 12 LSB of a user-defined RAM value 12 MSB of a user-defined RAM value The positions 4, 12, 16, 20 refer to the same user-defined RAM address. Thus, customers may choose to send the user-defined RAM Values of the following parameter. Variable name ramTempSens Address 42 Description Temperature sensor value 30 See EE_SENT_SERIAL in section 14.3.2 REVISION 004 390109029301 Page 27/40 MLX90293 Linear Hall Position Sensor IC Datasheet Error Code Rate The Error Code are on purpose transmitted every second message, to maximize the rate, which equals then 36 SENT frames, when the user-defined RAM mode is not enabled (72 otherwise). • Serial Message Error Code The Serial error code contains the error Bit position 3 4 5 6 7 8 Diagnostic ADCSatura ADCMonitor VanaMoni VddMoni Rough Offset TempMonitor Comments Diagnostic ADC monitor Analog Internal Supply Too Low External Supply Too Low, Too High Front-end Rough Offset too low, too high Temperature Sensor monitor 14.3.4. StartStart-up During the chip initialization the output remains high until the circuit emits four initialization frames (all 6 data nibble zero). The fifth frame is not an initialization frame but a valid frame containing a measured angle. See also the section 8, “Timing Specification”. 14.3.5. Field sensing (A2D conversions) and the frame Synchro pulse The digital output value (fast channel payload) results of the average of two values. These values are themselves computed from 4 ADCs values. The time between the ADCs and the frame synchro pulse is constant. As a result the phase delay between the magnetic field value and the SENT synchro pulse is constant, allowing filtering at the ECU side. See also section 8, “Timing Specification”. 14.4. Identification Parameter EE_USERID1 EE_USERID2 EE_USERID3 Value 0…65535 0…65535 0…65535 Identification number: 48 bits (3 words) freely useable by Customer for traceability purpose. 14.5. Lock The MEMLOCK write protects all the EEPROM parameters set by the Melexis and user(31). Once the lock is enabled, it is not possible to change the EEPROM values anymore. Note that the Memlock bits should be set by the solver function “MemLock". 31 See EE_USERCFG2 in section 14.1.1 REVISION 004 390109029301 Page 28/40 MLX90293 Linear Hall Position Sensor IC Datasheet 14.6. Digital Filter 14.6.1. Introduction The MLX90293ADM offers both a Finite Impulse Response Filter and an Infinite Impulse Response Filter. Here, IIR filters are considered better for closed loped systems as these have a smaller parasitic phase delay. To enable extreme noise reduction, customers can also combine an IIR filter with a hard threshold. 14.6.2. Specification & EEPROM settings The table below gives the response time of the different filters for a step change. Filter Type Relative Noise Reduction Factor No filter FIR(1,1) FIR (1,1,1,1) IIR_K=2, IIR_K=2.66, IIR_K=4 1 1:0.707 1:0.500 1:0.578 1:0.480 1:0.379 Phase Delay (#samples) 0 0.5 1.5 Diagnostic Low Resistive Cable Test Dimension DTIANA DTIDIG Start-up on Hold Min 5.7 3.9 Diagnostic low/high Typ 6.0 7.2 Environ Monitoring Rate Reporting Rate DTIANA 1/DSP 8/20 · DTIANA x Diag_Debounce_Thresh Diag_Debounce_Stepup 8/20 · DTIANA DTIANA 1/DSP x Diag_Debounce_Thresh Diag_Debounce_Stepup n/a immediate Diag n/a immediate Diagnostic n/a immediate Diag. n/a immediate Diagnostic n/a immediate Diag n/a immediate Diagnostic n/a. n/a n/a immediate Diagnostic n/a immediate Diagnostic n/a immediate Diagnostic n/a immediate Diagnostic n/a immediate Diagnostic n/a immediate Diagnostic. Max Unit 6.3 ms (35) 10 ms Table 3 - Timing Specification @13.16 MHz 35 DTIDIG (eg. 10ms worst case) Corresponds to 20 output refresh time (eg. 500μs) REVISION 004 390109029301 Page 32/40 MLX90293 Linear Hall Position Sensor IC Datasheet 16. Recommended Application Diagrams 16.1. MLX90293 MLX90293 in SOICSOIC-8 Package R1 VDD 1 VDD C4 C1 MLX90293 8 GND C5 2, 3, 4, 6 VSS Test x Out VDIG C2 5 Output R2 7 C3 Figure 11 – Recommended wiring for the MLX90293 in SOIC-8 package Output Compact PCB routing EMC robust PCB routing Analog Output Min Typ. Max Min Typ. Max Remarks C1 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin C2 (20) 47 nF 100 nF 330 nF 47 nF 100 nF 330 nF Close to the pin C3 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin C4 500 pF 1 nF 10 nF Connector Side C5 500 pF 1 nF 10 nF Connector Side R1 0Ω 10 Ω 33 Ω Increased ratiometry error R2 10 Ω 50 Ω 100 Ω Table 4 - Recommended capacitances for the MLX90293 in analog output mode for SOIC-8 package Output PWM Output C1 C2 C3 C4 C5 R1 R2 Output SENT C1 C2 C3 C4 C5 R1 R2 Compact PCB routing EMC robust PCB routing Min Typ. Max Min Typ. Max Remarks 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin 2.2 nF 4.7 nF 22 nF 2.2 nF 4.7 nF 22 nF Close to the pin 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin 500 pF 1 nF 10 nF Connector Side 500 pF 1 nF 2.2 nF Connector Side 0Ω 10 Ω 33 Ω Impacts the Voltage on VDD pin 10 Ω 50 Ω 100 Ω Table 5 - Recommended capacitances for the MLX90293 in PWM mode for SOIC-8 package Compact PCB routing EMC robust PCB routing Min Typ. Max Min Typ. Max Remarks 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin 2.2 nF 4.7 nF 22 nF 2.2 nF 4.7 nF 22 nF Close to the pin 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin 500 pF 1 nF 10 nF Connector Side 500 pF 1 nF 2.2 nF Connector Side 0Ω 10 Ω 33 Ω Impacts the Voltage on VDD pin 10 Ω 50 Ω 100 Ω Table 6 - Recommended capacitances for the MLX90293 in SENT mode for SOIC-8 package REVISION 004 390109029301 Page 33/40 MLX90293 Linear Hall Position Sensor IC Datasheet 16.2. MLX90293 MLX90293 in TSSOPTSSOP-16 Package R11 VDD 1 3 VDD1 C14 MLX90293 C11 4,13,16,14 2 GND1 C15 VSS1 Test x1 Out 1 VDIG1 C12 1 15 Output1 R12 R21 VDD 2 C13 11 VDD2 C24 C21 10 GND2 C25 5,7,8,12 VSS2 Test x2 Out 2 VDIG2 C22 6 Output2 R22 9 C23 Figure 12 – Recommended wiring for the MLX90293 in TSSOP-16 package Output Compact PCB routing EMC robust PCB routing Analog Output Min Typ. Max Min Typ. Max Remarks C11, C21 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin C12, C22 47 nF 100 nF 330 nF 47 nF 100 nF 330 nF Close to the pin C13, C23 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin C14, C24 500 pF 1 nF 10 nF Connector Side C15, C25 500 pF 1 nF 10 nF Connector Side R11, R21 0Ω 10 Ω 33 Ω Increased ratiometry error R12, R22 10 Ω 50 Ω 100 Ω Table 7 - Recommended capacitances for the MLX90293 in ANALOG mode for TSSOP-16 package Output PWM Output C11, C21 C12, C22 C13, C23 C14, C24 C15, C25 R11, R21 R12, R22 REVISION 004 390109029301 Compact PCB routing EMC robust PCB routing Min Typ. Max Min Typ. Max Remarks 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin 2.2 nF 4.7 nF 22 nF 2.2 nF 4.7 nF 22 nF Close to the pin 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin 500 pF 1 nF 10 nF Connector Side 500 pF 1 nF 2.2 nF Connector Side 0Ω 10 Ω 33 Ω Impacts the Voltage on VDD pin 10 Ω 50 Ω 100 Ω Table 8 - Recommended capacitances for the MLX90293 in PWM mode for TSSOP-16 package Page 34/40 MLX90293 Linear Hall Position Sensor IC Datasheet Output SENT Output C11, C21 C12, C22 C13, C23 C14, C24 C15, C25 R11, R21 R12, R22 REVISION 004 390109029301 Compact PCB routing EMC robust PCB routing Min Typ. Max Min Typ. Max Remarks 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin 22 nF 4.7 nF 22 nF 2.2 nF 4.7 nF 22 nF Close to the pin 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin 500 pF 1 nF 10 nF Connector Side 500 pF 1 nF 2.2 nF Connector Side 0Ω 10 Ω 33 Ω Impacts the Voltage on VDD pin 10 Ω 50 Ω 100 Ω Table 9 - Recommended capacitances for the MLX90293 in SENT mode for TSSOP-16 package Page 35/40 MLX90293 Linear Hall Position Sensor IC Datasheet 17. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. For further details about test method references and for compliance verification of selected soldering method for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak temperature, temperature gradient, temperature profile etc), additional classification and qualification tests have to be agreed upon with Melexis. For package technology embedding trim and form post-delivery capability, Melexis recommends to consult the dedicated trim&form recommendation application note: lead trimming and forming recommendations Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment 18. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. REVISION 004 390109029301 Page 36/40 MLX90293 Linear Hall Position Sensor IC Datasheet 19. Package Information 19.1. SOICSOIC-8 - Package Dimensions 19.2. SOICSOIC-8 - Pinout Pinout and Marking 8 5 293ADM F12345 Xy REVISION 004 390109029301 293 F 12345 Bottom Not Used Test2 Test0 Top ADM Lot number (5 digits) Fab Identifier (1 letter) Split lot number Xy 4 VDD 1 Part Number MLX90293 (3 digits) Die Version (3 letters) Out Test1 VDIG VSS Marking : YY WW Week Date code (2 digits) Year Date code (2 digits) Page 37/40 MLX90293 Linear Hall Position Sensor IC Datasheet 19.3. SOICSOIC-8 - Sensitive spot positioning 19.4. TSSOPTSSOP-16 - Package Dimensions REVISION 004 390109029301 Page 38/40 MLX90293 Linear Hall Position Sensor IC Datasheet 19.5. TSSOPTSSOP-16 - Pinout and Marking 16 1 VDIG1 Marking : Test11 VSS1 Out1 VDD1 Not Used1 Part Number MLX90293 (3 digits) Test21 Test01 293ADM F12345 Xy Test22 OUT2 Not Used2 293 Axx Top Test02 F 12345 VDD2 Lot number (5 digits) Fab identifier (1 letter) VSS2 Bottom 9 8 Test12 Die Version (3 letters) YY WW VDIG2 Week Date code (2 digits) Year Date code (2 digits) 19.6. TSSOPTSSOP-16 - Sensitive spot positioning CW X2 16 9 Die 1 Die 2 Y2 Y1 0.30 +/- 0.06 CCW 1.95 2.45 1 0.70 +/- 0.13 8 1.84 2.04 X1 2.76 2.96 REVISION 004 390109029301 Page 39/40 MLX90293 Linear Hall Position Sensor IC Datasheet 20. Disclaimer The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, noninfringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services. The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current. Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a particular purpose. The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights. This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities. The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual environmental requirements. 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The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-conditions. This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document. Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2020) ISO/TS 16949 and ISO14001 Certified 21. Contact For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our Direct Sales team and get help for your specific needs: Europe, Africa Telephone: +32 13 67 04 95 Email : sales_europe@melexis.com Americas Telephone: +1 603 223 2362 Email : sales_usa@melexis.com Asia REVISION 004 390109029301 Email : sales_asia@melexis.com Page 40/40