MLX90316 Rotary Position Sensor IC
Datasheet
Absolute Rotary Position Sensor IC
Simple & Robust Magnetic Design
Tria⊗is® Hall Technology
Programmable Angular Range up to 360
Degrees
Programmable Linear Transfer Characteristic
Selectable Analog (Ratiometric), PWM, Serial
Protocol
12 bit Angular Resolution - 10 bit Angular
Thermal Accuracy
40 bit ID Number
Single Die – SOIC-8 Package RoHS Compliant
Dual Die (Full Redundant) – TSSOP-16 Package
RoHS Compliant
SOIC-8
TSSOP-16
Applications
Absolute Rotary Position Sensor
Steering Wheel Position Sensor
Pedal Position Sensor
Motor-shaft Position Sensor
Throttle Position Sensor
Float-Level Sensor
Ride Height Position Sensor
Non-Contacting Potentiometer
Description
The MLX90316 is a Tria⊗is® Rotary Position
Sensor providing the absolute angular position of
a small dipole magnet rotating above the device
surface (end-of-shaft magnet).
Thanks to an Integrated Magneto-Concentrator
(IMC) on its surface, the monolithic device senses,
in a contactless fashion, the horizontal component
of the applied magnetic flux density.
This unique sensing principle applied to a rotary
position sensor results into an impressive
robustness of the angular position over the
mechanical (airgap, off-axis) tolerances.
The rotation of this horizontal component is
sensed over a wide range (up to 360 Deg. complete revolution) and processed by the onchip DSP (Digital Signal Processing) to ultimately
report the absolute angular position of the
magnet either as a ratiometric analog output or as
PWM (Pulse-Width Modulation) signal or as a 14bit data accessible through a 3-pin SPI (serial
interface) channel.
The output transfer characteristic is fully
programmable (e.g. offset, gain, clamping levels,
linearity, thermal drift, filtering, range...) to match
any specific requirement through end-of-line
calibration. The Melexis programming unit PTC-04
communicates and calibrates the device
exclusively through the connector terminals (VDDVSS-OUT).
VDD
VDIG
Prot.
3V3
Reg
DSP
Triaxis®
EEPROM
RAM
VX
VY
MUX
Features and Benefits
Output Stage
12 bit Analog
G
ADC
µC
12 bit PWM
SPI
ROM - Firmware
OUT1
MOSI/MISO
OUT2
SCLK
Switch Out
/SS
VSS
MLX90316 Rotary Position Sensor IC
Datasheet
Contents
Features and Benefits................................................................................................................................... 1
Applications .................................................................................................................................................. 1
Description ................................................................................................................................................... 1
1. Ordering Information ............................................................................................................................... 5
2. Functional Diagram .................................................................................................................................. 6
3. Glossary of Terms ..................................................................................................................................... 7
4. Pinout ....................................................................................................................................................... 8
5. Absolute Maximum Ratings ...................................................................................................................... 9
6. Electrical Specification ............................................................................................................................ 10
7. Isolation Specification............................................................................................................................. 12
8. Timing Specification................................................................................................................................ 12
9. Accuracy Specification ............................................................................................................................ 13
10. Magnetic Specification ......................................................................................................................... 14
11. CPU & Memory Specification ............................................................................................................... 14
12. End-User Programmable Items ............................................................................................................ 15
13. Description of End-User Programmable Items ..................................................................................... 17
13.1. Output Mode ............................................................................................................................... 17
13.1.1. Analog Output Mode ............................................................................................................. 17
13.1.2. PWM Output Mode ............................................................................................................... 18
13.1.3. Serial Protocol Output Mode ................................................................................................. 18
13.1.4. Switch Out .............................................................................................................................. 19
13.2. Output Transfer Characteristic .................................................................................................... 19
13.2.1. CLOCKWISE Parameter .......................................................................................................... 20
13.2.2. Discontinuity Point (or Zero Degree Point) ........................................................................... 20
13.2.3. LNR Parameters ..................................................................................................................... 21
13.2.4. CLAMPING Parameters .......................................................................................................... 21
13.2.5. DEADZONE Parameter ........................................................................................................... 22
13.2.6. Output 2 (MLX90316xDC-BCS ONLY) .................................................................................... 22
13.3. Identification ................................................................................................................................ 23
13.4. Sensor Front-End ......................................................................................................................... 23
13.4.1. HIGHSPEED Parameter........................................................................................................... 23
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MLX90316 Rotary Position Sensor IC
Datasheet
13.4.2. ARGC, AUTO_RG, RoughGain and FORCECRA75 Parameters ............................................... 24
13.4.3. RGThresL, RGThresH Parameters .......................................................................................... 24
13.5. FILTER ........................................................................................................................................... 25
13.5.1. Hysteresis Filter ...................................................................................................................... 25
13.5.2. FIR Filters ................................................................................................................................ 25
13.5.3. IIR Filters ................................................................................................................................. 27
13.6. Programmable Diagnostic Settings.............................................................................................. 28
13.6.1. RESONFAULT Parameter ........................................................................................................ 28
13.6.2. EEHAMHOLE Parameter ........................................................................................................ 28
13.7. Lock .............................................................................................................................................. 28
13.7.1. MLXLOCK Parameter .............................................................................................................. 28
13.7.2. LOCK Parameter ..................................................................................................................... 28
14. Self Diagnostic ...................................................................................................................................... 29
15. Serial Protocol ...................................................................................................................................... 32
15.1. Introduction ................................................................................................................................. 32
15.2. SERIAL PROTOCOL Mode ............................................................................................................. 32
15.3. MOSI (Master Out Slave In) ......................................................................................................... 32
15.4. MISO (Master In Slave Out) ......................................................................................................... 32
15.5. /SS (Slave Select) .......................................................................................................................... 32
15.6. Master Start-Up ........................................................................................................................... 32
15.7. Slave Start-Up .............................................................................................................................. 33
15.8. Timing ........................................................................................................................................... 33
15.9. Slave Reset ................................................................................................................................... 34
15.10. Frame Layer ............................................................................................................................... 34
15.10.1. Command Device Mechanism ............................................................................................. 34
15.10.2. Data Frame Structure .......................................................................................................... 34
15.10.3. Timing ................................................................................................................................... 35
15.10.4. Data Structure ...................................................................................................................... 35
15.10.5. Angle Calculation ................................................................................................................. 36
15.10.6. Error Handling ...................................................................................................................... 36
16. Recommended Application Diagrams .................................................................................................. 37
16.1. Analog Output Wiring in SOIC-8 Package .................................................................................... 37
16.2. Analog Output Wiring in TSSOP-16 Package ............................................................................... 38
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MLX90316 Rotary Position Sensor IC
Datasheet
16.3. PWM Low Side Output Wiring ..................................................................................................... 38
16.4. Serial Protocol .............................................................................................................................. 39
16.4.1. SPI Version – Single Die .......................................................................................................... 39
16.4.2. SPI Version – Dual Die ............................................................................................................ 40
16.4.3. Non SPI Version (Standard Version) ...................................................................................... 41
17. Standard information regarding manufacturability of Melexis products with different soldering
processes ............................................................................................................................................... 42
18. ESD Precautions.................................................................................................................................... 42
19. Package Information............................................................................................................................. 43
19.1. SOIC-8 - Package Dimensions ...................................................................................................... 43
19.2. SOIC-8 - Pinout and Marking ....................................................................................................... 43
19.3. SOIC-8 - IMC Positionning ............................................................................................................ 44
19.4. TSSOP-16 - Package Dimensions ................................................................................................. 45
19.5. TSSOP-16 - Pinout and Marking................................................................................................... 46
19.6. TSSOP-16 - IMC Positionning ....................................................................................................... 46
20. Disclaimer ............................................................................................................................................. 48
21. Contact ................................................................................................................................................. 48
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MLX90316 Rotary Position Sensor IC
Datasheet
1. Ordering Information
Product Code
Temperature Code
Package Code
Option Code
Packing Form Code
MLX90316
S
DC
BCG-000
RE
MLX90316
E
DC
BCG-000
RE
MLX90316
K
DC
BCG-000
RE
MLX90316
L
DC
BCG-000
RE
MLX90316
E
GO
BCG-000
RE
MLX90316
K
GO
BCG-000
RE
MLX90316
L
GO
BCG-000
RE
MLX90316
K
DC
BCG-200
RE
MLX90316
K
GO
BCG-200
RE
MLX90316
K
DC
BCG-300
RE
MLX90316
K
GO
BCG-300
RE
MLX90316
E
DC
BDG-100
RE
MLX90316
K
DC
BDG-100
RE
MLX90316
L
DC
BDG-100
RE
MLX90316
E
GO
BDG-100
RE
MLX90316
K
GO
BDG-100
RE
MLX90316
L
GO
BDG-100
RE
MLX90316
L
GO
BDG-102
RE
MLX90316
L
DC
BDG-102
RE
MLX90316
L
DC
BCS-000
RE
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MLX90316 Rotary Position Sensor IC
Datasheet
Legend:
Temperature Code:
S: from -20 Deg.C to 85 Deg.C
E: from -40 Deg.C to 85 Deg.C
K: from -40 Deg.C to 125 Deg.C
L: from -40 Deg.C to 150 Deg.C
Package Code:
“DC” for SOIC-8 package
“GO” for TSSOP-16 package (dual die)
Option Code:
AAA-xxx: die version
xxx-000: standard
xxx-100: SPI
xxx-102: SPI75AGC, see section 13.4.2
xxx-200: PPA (Pre-programmed Analog)
xxx-300: PPD (Pre-programmed Digital)
Packing Form:
“RE” for Reel
“TU” for Tube
Ordering Example:
MLX90316KDC-BCG-000-TU
Table 1 - Legend
2. Functional Diagram
VDD
VDIG
Prot.
3V3
Reg
DSP
EEPROM
RAM
VX
VY
MUX
Triaxis
®
Output Stage
12 bit Analog
G
ADC
µC
12 bit PWM
SPI
ROM - Firmware
OUT1
MOSI/MISO
OUT2 (1)
SCLK
Switch Out
/SS
VSS
Figure 1 – Block Diagram
1
Output 2 only available on MLX90316xDC-BCS
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MLX90316 Rotary Position Sensor IC
Datasheet
3. Glossary of Terms
Gauss (G), Tesla (T)
TC
NC
PWM
%DC
ADC
DAC
LSB
MSB
DNL
INL
RISC
ASP
DSP
ATAN
IMC
CoRDiC
EMC
Units for the magnetic flux density - 1 mT = 10 G
Temperature Coefficient (in ppm/Deg.C.)
Not Connected
Pulse Width Modulation
Duty Cycle of the output signal i.e. TON /(TON + TOFF)
Analog-to-Digital Converter
Digital-to-Analog Converter
Least Significant Bit
Most Significant Bit
Differential Non-Linearity
Integral Non-Linearity
Reduced Instruction Set Computer
Analog Signal Processing
Digital Signal Processing
Trigonometric function: arctangent (or inverse tangent)
Integrated Magneto-Concentrator (IMC®)
Coordinate Rotation Digital Computer (i.e. iterative rectangular-to-polar transform)
Electro-Magnetic Compatibility
Table 2 – Glossary of Terms
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MLX90316 Rotary Position Sensor IC
Datasheet
4. Pinout
PIN
SOIC-8
TSSOP-16
Analog / PWM
Serial Protocol
Analog / PWM
Serial Protocol
1
VDD
VDD
VDIG1
VDIG1
2
Test 0
Test 0
VSS1 (Ground1)
VSS1 (Ground1)
3
Switch OUT
/SS
VDD1
VDD1
4
Not Used / OUT 2 (2)
SCLK
Test 01
Test 01
5
OUT
MOSI / MISO
Switch OUT2
/SS2
6
Test 1
Test 1
Not Used2
SCLK2
7
VDIG
VDIG
OUT2
MOSI2 / MISO2
8
VSS (Ground)
VSS (Ground)
Test 12
Test 12
9
VDIG2
VDIG2
10
VSS2 (Ground2)
VSS2 (Ground2)
11
VDD2
VDD2
12
Test 02
Test 02
13
Switch OUT1
/SS1
14
Not Used1
SCLK1
15
OUT1
MOSI1 / MISO1
16
Test 11
Test 11
For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the Ground
(see section 16).
2
MLX90316xDC-BCS includes a programmable second output
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MLX90316 Rotary Position Sensor IC
Datasheet
5. Absolute Maximum Ratings
Parameter
Value
Supply Voltage, VDD (overvoltage)
+ 20 V
Reverse Voltage Protection
- 10 V
Positive Output Voltage – Standard Version
+ 10 V
(Analog or PWM)
+ 14 V (200 s max – TA = + 25 Deg.C)
Positive Output Voltage – SPI Version
VDD + 0.3V
Positive Output Voltage (Switch Out)
+ 10 V
+ 14 V (200 s max – TA = + 25 Deg.C)
Output Current (IOUT)
± 30 mA
Reverse Output Voltage
- 0.3 V
Reverse Output Current
- 50 mA
Operating Ambient Temperature Range, TA
- 40 Deg.C … + 150 Deg.C
Storage Temperature Range, TS
- 40 Deg.C … + 150 Deg.C
Magnetic Flux Density
± 700 mT
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximumrated conditions for extended periods may affect device reliability.
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MLX90316 Rotary Position Sensor IC
Datasheet
6. Electrical Specification
DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the
Temperature suffix (S, E, K or L).
Parameter
Symbol
Nominal Supply Voltage
Supply Current
(3)
POR Level
Output Current
Output Short Circuit Current
Output Load
Analog Saturation Output
Level
Digital Saturation Output Level
Min
Typ
Max
Units
4.5
5
5.5
V
Slow mode (4)
8.5
11
mA
Fast mode (4)
13.5
16
mA
2.7
3
V
VDD
IDD
VDD POR
IOUT
Ishort
RL
Supply Under Voltage
2
Analog Output mode
-8
8
mA
PWM Output mode
-20
20
mA
VOUT = 0 V
12
15
mA
VOUT = 5 V
12
15
mA
VOUT = 14 V (TA = 25 Deg.C)
24
45
mA
10
∞ (6)
kΩ
10
(6)
kΩ
Pull-down to Ground
Pull-up to 5V
(5)
Vsat_lo
Pull-up load RL ≥ 10 kΩ
Vsat_hi
Pull-down load RL ≥ 10 kΩ
VsatD_lo
VsatD_hi
Diag_lo
Active Diagnostic Output Level
Diag_hi
Passive Diagnostic Output
Level
Test Conditions
BVSSPD
1
1
3
%VDD
96
Pull-up Low Side RL ≥ 10 kΩ
%VDD
1.5
Push-Pull (IOUT = -20mA)
Push-Pull (IOUT = 20mA)
∞
97
Pull-down load RL ≥ 10 kΩ
Pull-up load RL ≥ 10 kΩ
%VDD
%VDD
1
%VDD
1.5
%VDD
Pull-down load RL ≥ 10 kΩ
97
%VDD
Pull-up load RL ≥ 10 kΩ
98
%VDD
Broken VSS (8) &
Pull-down load RL ≤ 10 kΩ
4 (7)
%VDD
3
Supply current per silicon die. Dual die version will consume twice the current
See section 13.4.1 for details concerning Slow and Fast mode
5
Applicable for output in Analog and PWM (Open-Drain) mode
4
6
RL < ∞ for output in PWM mode
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MLX90316 Rotary Position Sensor IC
Datasheet
Parameter
Symbol
(Broken Track Diagnostic)
(7)
BVSSPU
BVDDPD
BVDDPU
Clamped Output Level (9)
Switch Out (10)
Test Conditions
Broken VSS (8) &
Pull-up load RL ≥ 1 kΩ
Min
Typ
99
100
Broken VDD (8) &
Max
%VDD
0
Pull-down load RL ≥ 1 kΩ
Broken VDD &
1
%VDD
No Broken Track
diagnostic
Pull-up load to 5 V
Units
%VDD
Clamp_lo
Programmable
0
100
%VDD
Clamp_hi
Programmable
0
100
%VDD
Sw_lo
Pull-up Load 1.5 kΩ to 5 V
0.55
1.1
V
Sw_hi
Pull-up Load 1.5 kΩ to 5 V
3.65
4.35
V
As an illustration of the previous table, the MLX90316 fits the typical classification of the output span
described on the Figure 2.
100 %
90 %
96 %
92 %
88 %
Diagnostic Band (High)
Clamping High
80 %
Output Level
70 %
60 %
Linear Range
50 %
40 %
30 %
20 %
10 %
0%
12 %
8%
4%
Clamping Low
Diagnostic Band (Low)
Figure 2 – Output Span Classification
7
For detailed information, see also section 14
Not Valid for the SPI Version
9
Clamping levels need to be considered vs the saturation of the output stage (see Vsat_lo and Vsat_hi)
10
See section 13.1.4 for the application diagram
8
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MLX90316 Rotary Position Sensor IC
Datasheet
7. Isolation Specification
DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the
Temperature suffix (S, E, K or L). Only valid for the package code GO i.e. dual die version.
Parameter
Symbol
Isolation Resistance
Test Conditions
Min
Between dice
Typ
Max
4
Units
MΩ
8. Timing Specification
DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the
Temperature suffix (S, E, K or L).
Parameter
Main Clock Frequency
Symbol
Ck
Sampling Rate
Ts
Watchdog
Wd
Start-up Cycle
Tsu
Analog Output Slew Rate
Digital Output Rise Time
Digital Output Fall Time
11
12
FPWM
Min
Typ
Max
Units
Slow mode (11)
7
MHz
Fast mode (11)
20
MHz
Slow mode (11)
600
μs
200
μs
Fast mode
Step Response Time
PWM Frequency
Test Conditions
(11)
Slow mode (11), Filter = 5 (12)
4
ms
600
μs
See section 14
5
ms
Slow and Fast mode (11)
15
ms
Fast mode
(11)
, Filter = 0
(12)
400
COUT = 42 nF
200
V/ms
COUT = 100 nF
100
V/ms
PWM Output Enabled
100
1000
Hz
Mode 5 – 10 nF, RL = 10 kΩ
120
μs
Mode 7 – 10 nF, RL = 10 kΩ
2.2
μs
Mode 5 – 10 nF, RL = 10 kΩ
1.8
μs
Mode 7 – 10 nF, RL = 10 kΩ
1.9
μs
See section 13.4.1 for details concerning Slow and Fast mode
See section 13.5 for details concerning Filter parameter
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MLX90316 Rotary Position Sensor IC
Datasheet
9. Accuracy Specification
DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the
Temperature suffix (S, E, K or L).
Parameter
ADC Resolution on the raw
signals sine and cosine
Symbol
RADC
Test Conditions
Min
Slow Mode (13)
Fast Mode
(13)
Typ
Max
Units
15
bits
14
bits
Thermal Offset Drift at the DSP
input
(excl. DAC and output stage)
Thermal Offset Drift #1 (14)
-60
60
Temperature suffix L
-90
90
LSB15
LSB15
Temperature suffix S, E and K
-0.3
0.3
%VDD
Temperature suffix L
-0.4
0.4
%VDD
Temperature suffix S, E and K
-0.3
0.3
%
Temperature suffix L
-0.5
0.5
%
-1
1
Deg.
Thermal Offset Drift of the
DAC and Output Stage
Thermal Offset Drift #2
(to be considered only for the
analog output mode)
Thermal Drift of Sensitivity
Mismatch (15)
Intrinsic Linearity Error (16)
Temperature suffix S, E and K
Le
TA = 25 Deg.C
12 bits DAC
Analog Output Resolution
Output stage Noise
RDAC
0.025
%VDD
/LSB
(Theoretical – Noise free)
INL
-4
4
LSB
DNL
-2
2
LSB
Clamped Output
0.05
%VDD
13
15 bits corresponds to 14 bits + sign and 14 bits corresponds to 13 bits + sign. After angular calculation, this corresponds to
0.005Deg./LSB15 in Low Speed Mode and 0.01Deg./LSB14 in High Speed.
14
For instance, Thermal Offset Drift #1 equal ± 60LSB15 yields to max. ± 0.3 Deg. angular error for the computed angular information
(output of the DSP). See Front End Application Note for more details. This is only valid if automatic gain is set (See section 13.4.2)
15
For instance, Thermal Drift of Sensitivity Mismatch equal ± 0.4% yields to max. ± 0.1 Deg. angular error for the computed angular
information (output of the DSP). See Front End Application Note for more details.
16
The Intrinsic Linearity Error refers to the IC itself (offset, sensitivity mismatch, orthogonality) taking into account an ideal rotating
field. Once associated to a practical magnetic construction and the associated mechanical and magnetic tolerances, the output
linearity error increases. However, it can be improved with the multi point end-user calibration that is available on the MLX90316.
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MLX90316 Rotary Position Sensor IC
Datasheet
Parameter
Symbol
Noise pk-pk (17)
Test Conditions
Typ
Max
Units
RG = 9, Slow mode, Filter = 5
0.03
0.06
Deg.
RG = 9, Fast mode, Filter = 0
0.1
0.2
Deg.
0
0.1
%VDD
Ratiometry Error
-0.1
PWM Output Resolution
RPWM
PWM Jitter (18)
JPWM
Serial Protocol Output
Resolution
Min
RSP
12 bits
%DC/
0.025
(Theoretical – Jitter free)
RG = 6,
LSB
0.2
FPWM = 250 Hz – 800 Hz
14 bits – 360 Deg. Mapping
Deg./
0.022
(Theoretical – Jitter free)
%DC
LSB
10. Magnetic Specification
DC Operating Parameters at VDD = 5V (unless otherwise specified) and for TA as specified by the
Temperature suffix (S, E, K or L).
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
50
70 (19)
mT
Magnetic Flux Density
B
20
Magnet Temperature
Coefficient
TCm
-2400
ppm/
0
Deg.C
11. CPU & Memory Specification
The DSP is based on a 16 bit RISC µController. This CPU provides 5 MIPS while running at 20 MHz.
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
ROM
10
KB
RAM
256
B
EEPROM
128
B
17
The application diagram used is described in the recommended wiring. For detailed information, refer to section Filter in
application mode (Section 13.5).
18
Jitter is defined by ± 3 σ for 1000 successive acquisitions and the slope of the transfer curve is 100%DC/360 Deg.
19
Above 70 mT, the IMC starts saturating yielding to an increase of the linearity error.
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MLX90316 Rotary Position Sensor IC
Datasheet
12. End-User Programmable Items
Default Values
Parameter
Comments
STANDARD
SPI /
SPI75AGC
PPA
PPD
# bit
Output Stage Mode
4
N/A
4
7
3
MLX90316BCS
2
N/A
2
N/A
3
PWMPOL1
PWM Polarity
0
N/A
N/A
1
1
PWMT
PWM Frequency
1000h
N/A
N/A
1kHz
16
0
0
0
1
1
Output Mode
CLOCKWISE
DP
Discontinuity Point
0h
0h
0h
0h
15
LNR_S0
Initial Slope
0h
N/A
N/A
N/A
16
LNR_A_X
AX Coordinate
8000h
0
0
0
16
LNR_A_Y
AY Coordinate
0h
0%
10%
10%
16
LNR_A_S
AS Slope
0h
100%/360d
80%/360d
80%/360d
16
LNR_B_X
BX Coordinate
FFFFh
FFFFh
FFFFh
FFFFh
16
LNR_B_Y
BY Coordinate
0h
FFFFh
FFFFh
FFFFh
16
LNR_B_S
BS Slope
0h
N/A
N/A
N/A
16
LNR_C_X
CX Coordinate
FFFFh
FFFFh
FFFFh
FFFFh
16
LNR_C_Y
CY Coordinate
FFFFh
FFFFh
FFFFh
FFFFh
16
LNR_C_S
CS Slope
0h
N/A
N/A
N/A
16
CLAMP_HIGH
Clamping High
8%
0%
10%
10%
16
CLAMP_LOW
Clamping Low
8%
100%
90%
90%
16
FFFFh
FFFFh
FFFFh
FFFFh
16
0
N/A
FFFFh
N/A
16
N/A
N/A
N/A
N/A
8
0
0
0
0
8
4
0
0
0
8
0
N/A
0
N/A
8
KD
KDHYST
Switch Out
MLX90316BCS
Hysteresis on Switch Out
DEADZONE
FHYST
MLX90316BCS
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MLX90316 Rotary Position Sensor IC
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Default Values
Parameter
Comments
STANDARD
SPI /
SPI75AGC
PPA
PPD
# bit
MLX
MLX
MLX
MLX
16
1
1
1
1
8
CUSTID2 (21)
6 (22)
19 / 36
16
20
16
CUSTID3
MLX
MLX
MLX
MLX
16
0
0
0
0
8
0
N/A
2Ah
N/A
16
5
0
2
5
16
MLXID1 / MLXID2 /
MLXID3 (20)
CUSTID1
FREE2
MLX90316BCS
FILTER
FILTER A1 (21)
Filter coefficient A1 for
FILTER = 6
6600h
N/A
N/A
N/A
16
FILTER A2 (21)
Filter coefficient A2 for
FILTER = 6
2A00h
N/A
N/A
N/A
16
Auto Gain at Start Up
0
1
1
1
1
MLX90316BCS
0
N/A
1
N/A
1
HIGHSPEED
0
1
0
1
1
FSWAP
1
1
0
1
1
ARGC
FORCECRA75
Radius Adjustment to 75%
0
0/1
0
0
1
AUTO_RG
Automatic Rough Gain
Selection
0
1
1
1
1
9
0
3
0
8
6
N/A
3
N/A
8
RGThresL
0
0
0
0
4
RGThresH
15
15
15
15
4
EEHAMHOLE
3131h
0
0
0
16
RESONFAULT
0
1
1
1
2
RoughGain
MLX90316BCS
20
MLXIDs parameters contain unique ID programmed by Melexis to guarantee full part traceability
Not available in MLX90316xDC-BCS
22
For MLX90316SDC–BCG–000, the CUSTID2 parameter might differ from the given value (28d instead of 6d)
21
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MLX90316 Rotary Position Sensor IC
Datasheet
Default Values
Parameter
Comments
STANDARD
SPI /
SPI75AGC
PPA
PPD
# bit
0
1
1
1
1
0
1
1
1
1
0
N/A
0
N/A
1
1
N/A
1
N/A
1
N/A
N/A
-1
N/A
8
OUT2 OFFSET
MLX
N/A
100%
N/A
8
CLAMP_LOW OUT2
8%
N/A
10%
N/A
16
CLAMP_HIGH OUT2
8%
N/A
90%
N/A
16
MLXLOCK
LOCK
MLX90316BCS
Parameters for MLX90316xDC-BCS only
OUT2EN
OUT2 SLOPE RATIO
Was CUSTID2
13. Description of End-User Programmable Items
13.1. Output Mode
The MLX90316 output type is defined by the Output Mode parameter.
Parameter
Analog Output Mode
PWM Output Mode
Serial Protocol Output Mode
Value
Description
2, 4
Analog Rail-to-Rail
5
Low Side (NMOS)
7
Push-Pull
N/A
Low Side (NMOS)
13.1.1. Analog Output Mode
The Analog Output Mode is a rail-to-rail and ratiometric output with a push-pull output stage configuration
allows the use of a pull-up or pull-down resistor.
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13.1.2. PWM Output Mode
If one of the PWM Output modes is selected, the output signal is a digital signal with Pulse Width
Modulation (PWM).
In mode 5, the output stage is an open drain NMOS transistor (low side), to be used with a pull-up resistor to
VDD.
In mode 7, the output stage is a push-pull stage for which Melexis recommends the use of a pull-up resistor
to VDD.
The PWM polarity is selected by the PWMPOL1 parameter:
PWMPOL1 = 0 for a low level at 100%
PWMPOL1 = 1 for a high level at 100%
The PWM frequency is selected by the PWMT parameter.
Oscillator Mode
Pulse-Width Modulation Frequency (Hz)
100
200
500
1000
Low Speed
~35000
~17500
~7000
~3500
High Speed
-
~50000
~20000
~10000
Table 3 – PWM Frequency Code (based on typical main clock frequency)
For instance, in Low Speed Mode, set PWMT = 7000 (decimal) to set the PWM frequency around 500 Hz (23).
13.1.3. Serial Protocol Output Mode
The MLX90316 features a digital Serial Protocol mode. The MLX90316 is configured as a Slave node. See the
dedicated Serial Protocol section for a full description (Section 15).
23
In order to compensate for the lot to lot variation of the main clock frequency (Ck), Melexis strongly recommends trimming the
PWM frequency during EOL programming (see the PTC-04 documentation).
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MLX90316 Rotary Position Sensor IC
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13.1.4. Switch Out
Parameter
KD
KDHYST
Value
Unit
0 … 359.9999
Deg.
0 … 1.4
Deg.
The switch is activated (Sw_lo) when the digital angle is greater than the value stored in the KD parameter.
This angle refers to the internal angular reference linked to the parameter DP and not to the absolute
physical 0 Deg. angle.
The KDHYST defines the hysteresis amplitude around the Switch point. The switch is activated if the digital
angle is greater than KD+KDHYST. It is deactivated if the digital angle is less than KD-KDHYST.
The mandatory application diagram to use this feature is depicted in the Figure 3. See section 6 for the
electrical characteristic.
If the Switch feature is not used in the application, the output pin shall be connected to ground.
5V
MLX
1.5kΩ
125Ω
175Ω
Switch Out
6kΩ
to µC
I/O Port
100 nF
ECU
Figure 3 – Application Diagram for the Switch Out
13.2. Output Transfer Characteristic
Parameter
CLOCKWISE
DP
Value
Unit
0 CCW
1 CW
0 … 359.9999
Deg.
0 … 359.9999
Deg.
LNR_A_X
LNR_B_X
LNR_C_X
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MLX90316 Rotary Position Sensor IC
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Parameter
Value
Unit
0 … 100
%
0 … 17
%/Deg.
-17 … 0 … 17
%/Deg.
CLAMP_LOW
0 … 100
%
CLAMP_HIGH
0 … 100
%
0 … 359.9999
Deg.
OUT2 SLOPE RATIO
-8 … 0 … 8
-
OUT2 OFFSET
-400 … 400
%
CLAMP_LOW OUT2
0 … 100
%
CLAMP_HIGH OUT2
0 … 100
%
LNR_A_Y
LNR_B_Y
LNR_C_Y
LNR_S0
LNR_A_S
LNR_B_S
LNR_C_S
DEADZONE
MLX90316 xDC – BCS only
13.2.1. CLOCKWISE Parameter
The CLOCKWISE parameter defines the magnet rotation direction.
CCW is the defined by the 1-4-5-8 pin order direction for the SOIC-8 package and 1-8-9-16 pin order
direction for the TSSOP-16 package.
CW is defined by the reverse direction: 8-5-4-1 pin order direction for the SOIC-8 and 16-9-8-1 pin
order direction for the TSSOP-16 package.
Refer to the drawing in the IMC positioning sections (Sections 19.3 and 19.6).
13.2.2. Discontinuity Point (or Zero Degree Point)
The Discontinuity Point redefines the 0 Deg. point. The discontinuity point places the origin at any location
of the trigonometric circle. The DP is used as reference for all the angular measurements.
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MLX90316 Rotary Position Sensor IC
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0 Deg.
360 Deg.
Figure 4 - The placement of the Discontinuity Point (Zero Degree Point) is programmable
13.2.3. LNR Parameters
The LNR parameters, together with the clamping values, fully define the relation (the transfer function)
between the digital angle and the output signal.
The shape of the MLX90316 transfer function from the digital angle value to the output voltage is described
by the drawing below. Six segments can be programmed but the clamping levels are necessarily flat.
Two to five calibration points are then available, reducing the overall non-linearity of the IC by almost an
order of magnitude each time. Three to five point calibration will be preferred by customers looking for
excellent non-linearity figures. Two-point calibrations will be preferred by customers looking for a lower cost
calibration set-up and shorter calibration time.
100%
CLAMPHIGH
Clamping High
C
Slope
LNR_C_S
LNR_C_Y
LNR_B_Y
LNR_A_Y
CLAMPLOW
0%
0 (Deg.)
Slope
LNR_B_S
B
Slope
LNR_A_S
A
Slope
LNR_S0
LNR_A_X
Clamping Low
LNR_B_X
LNR_C_X
360 (Deg.)
13.2.4. CLAMPING Parameters
The clamping levels are two independent values to limit the output voltage range in normal operation. The
CLAMP_LOW parameter sets the minimum output voltage level while the CLAMP_HIGH parameter sets the
maximum output voltage level. Both parameters have 16 bits of adjustment. In analog mode the resolution
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will be limited by the D/A converter (12 bits) to 0.024%VDD. In PWM mode the resolution will be 0.024%DC.
In SPI mode the resolution is 14bits or 0.022 Deg. over 360 Deg.
13.2.5. DEADZONE Parameter
The dead zone is defined as the angle window between 0 and 359.9999 Deg.
When the digital angle lies in this zone, the IC is in fault mode (RESONFAULT must be set to “1” – See section
13.6.1).
13.2.6. Output 2 (MLX90316xDC-BCS ONLY)
The MLX90316BCS firmware offers the possibility to program a second output transfer characteristic of the
single die version.
The following formula is used in the 90316BCS:
OUT2 = OUT2SlopeRatio * OUT1 + OUT2Offset
Range OUT2 = [Clamp_Low OUT2 … Clamp_High OUT2]
OUT2 SLOPE RATIO Controls the slope ratio OUT1 vs OUT2. The ratio can be positive or negative.
The example of MLX90316LDC-BCS-PPA is given in the figure below (slope = -1, OUT2 = -1 x slope OUT1 + 100%).
OUT1
Output Level (%VDD)
100%
90%
10%
0%
0 (Deg.)
REVISION 011 – AUGUST 17, 2017
OUT2
360 (Deg.)
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MLX90316 Rotary Position Sensor IC
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13.3. Identification
Parameter
Value
MLXID1
0 … 65535
MLXID2
0 … 65535
MLXID3
0 … 65535
CUSTID1
0 … 255
CUSTID2
0 … 65535
CUSTID3
0 … 65535
Unit
Identification number: 40 bits freely useable by Customer for traceability purpose.
13.4. Sensor Front-End
Parameter
HIGHSPEED
Value
Unit
0 = Slow mode
1 = Fast mode
0 = disable
ARGC
1 = enable
AUTO_RG
0 = disable
1 = enable
RoughGain
0 … 15
RGThresL
0 … 15
RGThresH
0 … 15
13.4.1. HIGHSPEED Parameter
The HIGHSPEED parameter defines the main frequency for the DSP:
HIGHSPEED = 0 selects the Slow mode with a 7 MHz master clock.
HIGHSPEED = 1 selects the Fast mode with a 20 MHz master clock.
For better noise performance, the Slow Mode must be enabled.
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MLX90316 Rotary Position Sensor IC
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13.4.2. ARGC, AUTO_RG, RoughGain and FORCECRA75 Parameters
AUTO_RG and ARGC parameters enable the automatic gain control (AGC) of the analog chain. The AGC loop
is based on
(VX)²+ (VY)² = (Amplitude)² = (Radius)²
and it targets an amplitude of 90% of the ADC input span.
At Start-Up phase, the gain stored in the parameter RoughGain is always used. Depending of the AUTO_RG
and ARGC settings, the AGC regulation acts as follow:
If ARGC is set, the regulation proceeds by jump to reach the target gain. Note that this regulation is
only valid if the starting gain does not saturate the ADC. Melexis recommendation is to use
RoughGain ≤ 3 if ARGC = 1.
If ARGC is “0” and AUTO_RG is set to “1”, the regulation adapts every cycle by one gain code the
current gain to reach the 90% ADC span target. Note that if the value of RoughGain is too far from
the actual gain, the chip will enter the normal operating mode (after the Start-Up phase) with an
incorrect gain which will cause the device to go in diagnostic low (field too low/field too high – See
section 14).
If ARGC and AUTO_RG are “0”, the AGC regulation is off and the gain used is the value stored in the
parameter RoughGain. Melexis does not advise the use of this mode.
The parameter AUTO_RG activates the automatic regulation during normal operation of the device as
background task.
The parameter FORCECRA75 modifies the target of the AGC algorithm to 75% - instead of 90% - of the ADC
span (at start-up and in normal operation).
Melexis strongly recommends to set ARGC = “1”, AUTO_RG = “1” and RoughGain ≤ 3 for all types of
application. If the magnetic specifications of the application are well known and under control, the
appropriate RoughGain can also be programmed with ARGC set to “0” and AUTO_RG to “1”.
Please note that the angular errors listed in the section 9 are only valid if the AUTO_RG is activated.
AUTO_RG avoids also the saturation of the analog chain and the associated linearity error.
The current gain (RG) can be read out with the PTC-04 and gives a rough indication of the applied magnetic
flux density (Amplitude).
13.4.3. RGThresL, RGThresH Parameters
RGThresL & RGThresH define the boundaries within the gain setting (Rough Gain) is allowed to vary. Outside
this range, the output is set in diagnostic low.
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Datasheet
13.5. FILTER
Parameter
Value
Unit
FHYST
0 … 11; step 0.04
Deg.
FILTER
0…6
0
FSWAP
1
The MLX90316 includes 3 types of filters:
Hysteresis Filter: programmable by the FHYST parameter
Low Pass FIR Filters controlled with the Filter parameter
Low Pass IIR Filter controlled with the Filter parameter and the coefficients FILTER A1 and FILTER A2
Note: if the parameter FSWAP is set to “1”, the filtering is active on the digital angle. If set to “0”, the
filtering is active on the output transfer function.
13.5.1. Hysteresis Filter
The FHYST parameter is a hysteresis filter. The output value of the IC is not updated when the digital step is
smaller than the programmed FHYST parameter value. The output value is modified when the increment is
bigger than the hysteresis. The hysteresis filter reduces therefore the resolution to a level compatible with
the internal noise of the IC. The hysteresis must be programmed to a value close to the noise level.
Please note that for the programmable version, the FHYST parameter is set to 4 by default. If you do not
wish this feature, please set it to “0”.
13.5.2. FIR Filters
The MLX90316 features 6 FIR filter modes controlled with Filter = 0 … 5. The transfer function is described
below:
yn =
j
∑a
i =0
REVISION 011 – AUGUST 17, 2017
j
1
∑a x
i =0
i n −i
i
Page 25 of 48
MLX90316 Rotary Position Sensor IC
Datasheet
The characteristics of the filters no 0 to 5 is given in the Table 4.
Filter No (j)
0
Type
1
2
3
Disable
Coefficients a0… a5
5
111100
122210
Finite Impulse Response
N/A
Title
4
110000
No Filter
121000
133100
Extra Light
Light
90% Response Time
1
2
3
4
4
5
99% Response Time
1
2
3
4
4
5
Efficiency RMS (dB)
0
2.9
4.0
4.7
5.6
6.2
Efficiency P2P (dB)
0
2.9
3.6
5.0
6.1
7.0
Table 4 – FIR Filters Selection Table
FIR and HYST Filters: Step Response Comparative Plot
40000
x(n)
fir(n)
hyst(n)
[0..65535] Scale
38000
36000
34000
32000
30000
0
5
10
15
Milliseconds
20
25
30
FIR and HYST Filter : Gaussian white noise response
40200
x(n)
fir(n)
hyst(n)
40150
[0..65535] Scale
40100
40050
40000
39950
39900
39850
39800
0
20
40
60
80
100
120
140
Milliseconds
Figure 5 - Step Response and Noise Response for FIR (No 3) and FHYST = 10
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MLX90316 Rotary Position Sensor IC
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13.5.3. IIR Filters
The IIR Filter is enabled with Filter = 6. The diagram of the IIR Filter implemented in the MLX90316 is given in
Figure 6. Only the parameters A1 and A2 are configurable (See Table 5).
b0 = 1
x(n)
y(n)
Z-1
Z-1
-a1
b1 = 2
Z-1
Z-1
b2 = 1
-a2
Figure 6 - IIR Diagram
Filter No
6
Type
2nd Order Infinite Impulse Response (IIR)
Title
Medium & Strong
90% Response Time
11
16
26
40
52
100
Efficiency RMS (dB)
9.9
11.4
13.6
15.3
16.2
>20
Efficiency P2P (dB)
12.9
14.6
17.1
18.8
20.0
>20
Coefficient A1
26112
28160
29120
30208
31296
31784
Coefficient A2
10752
12288
12992
13952
14976
15412
Table 5 – IIR Filter Selection Table
The Figure 7 shows the response of the filter to a Gaussian noise with default coefficient A1 and A2.
IIR Filter - Gaussian White Noise Response
40200
40150
x(n)
40100
y(n)
40050
40000
39950
39900
39850
39800
0
50
100
150
Figure 7 – Noise Response for the IIR Filter
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MLX90316 Rotary Position Sensor IC
Datasheet
13.6. Programmable Diagnostic Settings
Parameter
Value
RESONFAULT
0, 1
EEHAMHOLE
0, 3131h
Unit
13.6.1. RESONFAULT Parameter
This RESONFAULT parameter enables the soft reset when a fault is detected by the CPU when the parameter
is set to 1. By default, the parameter is set to “0” but it is recommended to set it to “1” to activate the self
diagnostic modes (See section 14).
Note that in the User Interface (MLX90316UI), the RESONFAULT is split in two bits:
DRESONFAULT: disable the reset in case of a fault.
DOUTINFAULT: disable output in diagnostic low in case of fault.
13.6.2. EEHAMHOLE Parameter
The EEHAMHOLE parameter disables the CRC check and the memory recovery (Hamming code) when it is
equal to 3131h. Melexis strongly recommends to set the parameter to 0 (enable memory recovery). This is
done automatically when using the MEMLOCK function.
13.7. Lock
Parameter
Value
MLXLOCK
0, 1
LOCK
0, 1
Unit
13.7.1. MLXLOCK Parameter
MLXLOCK locks all the parameters set by Melexis.
13.7.2. LOCK Parameter
LOCK locks all the parameters set by the user. Once the lock is enabled, it is not possible to change the
EEPROM values. However it is still possible to read back the memory contents with the PTC-04 programmer.
Note that the lock bit should be set by the solver function “MemLock”.
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14. Self Diagnostic
The MLX90316 provides numerous self-diagnostic features. Those features increase the robustness of the IC
functionality as it will prevent the IC to provide erroneous output signal in case of internal or external failure
modes (“fail-safe”).
Fault Mode
Action
Effect on Outputs
Remark
ROM CRC Error at start up
(64 words including
Intelligent Watch Dog - IWD)
CPU Reset (24)
Diagnostic low (25)
All the outputs are already in
Diagnostic low - (start-up)
Enter Endless Loop:
ROM CRC Error (Operation
- Background task)
RAM Test Fail (Start-up)
- Progress (watchdog
Acknowledge)
Immediate Diagnostic low
- Set Outputs in Diagnostic
low
CPU Reset
Diagnostic low
Start-Up Time is increased
by 3 ms if successful
recovery
Calibration Data CRC Error
(Start-Up)
Hamming Code Recovery
Hamming Code Recovery
Error (Start-Up)
CPU Reset
Immediate Diagnostic low
CPU Reset
Immediate Diagnostic low
Set Outputs in Diagnostic
low. Normal Operation
until the “dead zone” is
left.
Immediate Diagnostic low
Set Outputs in Diagnostic
low. Normal mode and
CPU Reset If recovery
Immediate Diagnostic low
Calibration Data CRC Error
(Operation - Background)
Dead Zone
ADC Clipping
(ADC Output is 0000h or
7FFFh)
All the outputs are already in
Diagnostic low (start-up)
See section 13.6.2
Immediate recovery if the
“dead zone” is left
24
CPU reset means
1.
Core Reset (same as Power-On-Reset). It induces a typical start up time.
2.
Periphery Reset (same as Power-On-Reset)
3.
Fault Flag/Status Lost
4.
The reset can be disabled by clearing the RESONFAULT bit (See 13.6.1)
25
Refer to section 6 for the Diagnostic Output Level specifications
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MLX90316 Rotary Position Sensor IC
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Fault Mode
Action
Radius Overflow (> 100%)
or Radius Underflow
(< 50 %)
Set Outputs in Diagnostic
low. Normal mode and
CPU Reset If recovery
Immediate Diagnostic low
Fine Gain Clipping
Set Outputs in Diagnostic
low. Normal mode, and
CPU Reset If recovery
Immediate Diagnostic low
Set Outputs in Diagnostic
low. Normal mode, and
CPU Reset If recovery
Immediate Diagnostic low
Set Outputs in Diagnostic
low. Normal mode, and
CPU Reset If recovery
Immediate Diagnostic low
DAC Monitor (Digital to
Analog converter)
Set Outputs in Diagnostic
low. Normal Mode with
immediate recovery
without CPU Reset
Immediate Diagnostic low
ADC Monitor (Analog to
Digital Converter)
Set Outputs in Diagnostic
low. Normal Mode with
immediate recovery
without CPU Reset
Immediate Diagnostic low
(FG < 0d or > 63d)
Rough Offset Clipping
(RO is < 0d or > 127d)
Rough Gain Clipping
(RG < RGTHRESLOW or
RG > RGTHRESHIGH)
At Start-Up, wait until
VDD > 3V.
Effect on Outputs
Remark
(50 % - 100 %)
No magnet / field too high
See also section 13.4.2
See also section 13.4.2
ADC Inputs are Shorted
- VDD < POR level =>
Outputs high impedance
Undervoltage Mode
During operation, CPU
Reset after 3 ms
debouncing
Firmware Flow Error
CPU Reset
Immediate Diagnostic low
Intelligent Watchdog
(Observer)
Read/Write Access out of
physical memory
CPU Reset
Immediate Diagnostic low
100% Hardware detection
Write Access to protected
area (IO and RAM Words)
CPU Reset
Immediate Diagnostic low
100% Hardware detection
Unauthorized entry in
“SYSTEM” Mode
CPU Reset
Immediate Diagnostic low
100% Hardware detection
VDD > 7 V
Set Output High
Impedance (Analog)
REVISION 011 – AUGUST 17, 2017
- POR level < VDD < 3 V =>
Outputs in Diagnostic low
Pull down resistive load =>
Diag. Low
Pull up resistive load =>
Diag. High (25)
100% Hardware detection
Page 30 of 48
MLX90316 Rotary Position Sensor IC
Datasheet
Fault Mode
Action
VDD > 9.4 V
IC is switched off (internal
supply)
CPU Reset on recovery
Effect on Outputs
Pull down resistive load =>
Diag. Low
Pull up resistive load =>
Diag. High
Remark
100% Hardware detection
100% Hardware detection.
Broken VSS
(26)
CPU Reset on recovery
Pull down resistive load =>
Diag. Low
Pull up resistive load =>
Diag. High
Pull down load ≤ 10 kΩ to
meet Diag Low spec:
- < 2% VDD (temperature
suffix S and E)
- < 4% VDD ( temperature
suffix K)
- contact Melexis for
temperature suffix L
Broken VDD (26)
26
CPU Reset on recovery
Pull down resistive load =>
Diag. Low
Pull up resistive load =>
Diag. High
No valid diagnostic for
VPULLUP = VDD.
Pull up load (≤ 10kΩ) to
VPULLUP > 8 V to meet Diag
Hi spec > 96% VDD.
Not Valid for SPI Version
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15. Serial Protocol
15.1. Introduction
The MLX90316 features a digital Serial Protocol mode. The MLX90316 is configured as a Slave node. The
serial protocol of the MLX90316 is a three wires protocol (/SS, SCLK, MOSI-MISO):
/SS pin is a 5 V tolerant digital input
SCLK pin is a 5 V tolerant digital input
MOSI-MISO pin is a 5 V tolerant open drain digital input/output
The basic knowledge of the standard SPI specification is required for the good understanding of the present
section.
15.2. SERIAL PROTOCOL Mode
CPHA = 1
even clock changes are used to sample the data
CPOL = 0
active-Hi clock
The positive going edge shifts a bit to the Slave’s output stage and the negative going edge samples the bit
at the Master’s input stage.
15.3. MOSI (Master Out Slave In)
The Master sends a command to the Slave to get the angle information.
15.4. MISO (Master In Slave Out)
The MISO of the slave is an open-collector stage. Due to the capacitive load, a >1 kΩ pull-up is used for the
recessive high level (in fast mode). Note that MOSI and MISO use the same physical pin of the MLX90316.
15.5. /SS (Slave Select)
The /SS pin enables a frame transfer (if CPHA = 1). It allows a re-synchronization between Slave and Master
in case of communication error.
15.6. Master Start-Up
/SS, SCLK, MISO can be undefined during the Master start-up as long as the Slave is re-synchronized before
the first frame transfer.
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Datasheet
15.7. Slave Start-Up
The slave start-up (after power-up or an internal failure) takes 16 ms. Within this time /SS and SCLK is
ignored by the Slave. The first frame can therefore be sent after 16 ms. MISO is Hi-Z (i.e. Hi-Impedance) until
the Slave is selected by its /SS input. MLX90316 will cope with any signal from the Master while starting up.
15.8. Timing
To synchronize communication, the Master deactivates /SS high for at least t5 (1.5 ms). In this case, the
Slave will be ready to receive a new frame. The Master can re-synchronize at any time, even in the middle of
a byte transfer.
Note: Any time shorter than t5 leads to an undefined frame state, because the Slave may or may not have
seen /SS inactive.
t6
t1
t1
t1 t7 t1
t1
t4
t2
t9
t5
SCLK
MOSI/
MISO
/SS
2 Startbytes
27
Byte 1
Byte 0
Byte 2
Byte 7
Timings
Min (27)
Max
t1
2.3 μs / 6.9 μs
-
t2
12.5 μs / 37.5 μs
-
t2 the minimum time between any other byte
t4
2.3 μs / 6.9 μs
-
Time between last clock and /SS=high=chip de-selection
t5
300 μs / 1500 μs
-
Minimum /SS = Hi time where it’s guaranteed that a
frame re-synchronizations will be started.
t5
0 μs
-
Maximum /SS = Hi time where it’s guaranteed that NO
frame re-synchronizations will be started.
t6
2.3 μs / 6.9 μs
-
The time t6 defines the minimum time between /SS = Lo
and the first clock edge
Remarks
No capacitive load on MISO.
t1 is the minimum clock period for any bits within a byte.
Timings shown for oscillator base frequency of 20MHz (Fast Mode) / 7 MHz (Slow Mode)
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MLX90316 Rotary Position Sensor IC
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Timings
Min (27)
Max
t7
15 μs / 45 μs
-
t9
-
< 1 μs
TStartUp
-
< 10 ms /
16 ms
Remarks
t7 is the minimum time between the StartByte and the
Byte0
Maximum time between /SS = Hi and MISO Bus HighImpedance
Minimum time between reset-inactive and any master
signal change
15.9. Slave Reset
On internal soft failures the Slave resets after 1 second or after an (error) frame is sent. On internal hard
failures the Slave resets itself. In that case, the Serial Protocol will not come up. The serial protocol link is
enabled only after the completion of the first synchronization (the Master deactivates /SS for at least t5).
15.10. Frame Layer
15.10.1. Command Device Mechanism
Before each transmission of a data frame, the Master should send a byte AAh to enable a frame transfer.
The latch point for the angle measurement is at the last clock before the first data frame byte.
Latch Point
/SS
SCLK
MOSI
A
A
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
A
A
F
F
F
F
MISO
F
F
F
F
D
A
T
A
F
F
F
F
F
F
F
F
F
F
F
F
D
Figure 8 – Timing Diagram
15.10.2. Data Frame Structure
A data frame consists of 10 bytes:
2 start bytes (AAh followed by FFh)
2 data bytes (DATA16 – most significant byte first)
2 inverted data bytes (/DATA16 - most significant byte first)
4 all-Hi bytes
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MLX90316 Rotary Position Sensor IC
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The Master should send AAh (55h in case of inverting transistor) followed by 9 bytes FFh. The Slave will
answer with two bytes FFh followed by 4 data bytes and 4 bytes FFh.
15.10.3. Timing
There are no timing limits for frames: a frame transmission could be initiated at any time. There is no interframe time defined.
15.10.4. Data Structure
The DATA16 could be a valid angle or an error condition. The two meanings are distinguished by the LSB.
DATA16: Angle A[13:0] with (Angle Span)/214
Most Significant Byte
Least Significant Byte
MSB
A13
A12
A11
A10
A9
A8
A7
LSB
MSB
A6
A5
LSB
A4
A3
A2
A1
A0
0
1
DATA16: Error
Most Significant Byte
Least Significant Byte
MSB
E15
E14
E13
E12
E11
E10
E9
LSB
MSB
E8
E7
LSB
E6
E5
E4
E3
E2
E1
BIT
NAME
E0
0
E1
1
E2
F_ADCMONITOR
ADC Failure
E3
F_ADCSATURA
ADC Saturation (Electrical failure or field too strong)
E4
F_RGTOOLOW
Analog Gain Below Trimmed Threshold (Likely reason: field too weak)
E5
F_MAGTOOLOW
Magnetic Field Too Weak
E6
F_MAGTOOHIGH
Magnetic Field Too Strong
E7
F_RGTOOHIGH
Analog Gain Above Trimmed Threshold (Likely reason: field too strong)
E8
F_FGCLAMP
Never occurring in serial protocol
E9
F_ROCLAMP
Analog Chain Rough Offset Compensation: Clipping
E10
F_MT7V
Device Supply VDD Greater than 7V
REVISION 011 – AUGUST 17, 2017
E0
Description
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MLX90316 Rotary Position Sensor IC
Datasheet
BIT
NAME
E11
-
E12
-
E13
-
E14
F_DACMONITOR
E15
-
Description
Never occurring in serial protocol
15.10.5. Angle Calculation
All communication timing is independent (asynchronous) of the angle data processing. The angle is
calculated continuously by the Slave:
Slow Mode: every 1.5 ms at most.
Fast Mode: every 350 μs at most.
The last angle calculated is hold to be read by the Master at any time. Only valid angles are transferred by
the Slave, because any internal failure of the Slave will lead to a soft reset.
15.10.6. Error Handling
In case of any errors listed in section 15.10.4, the Serial protocol will be initialized and the error condition
can be read by the master. The slave will perform a soft reset once the error frame is sent.
In case of any other errors (ROM CRC error, EEPROM CRC error, RAM check error, intelligent watchdog
error…) the Slave’s serial protocol is not initialized. The MOSI/MISO pin will stay Hi-impedant (no error
frames are sent).
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16. Recommended Application Diagrams
16.1. Analog Output Wiring in SOIC-8 Package
ECU
5V
VDD
8
1
VDD
MLX90316
Test 0
VSS
C2
100 nF
VDIG
Switch Out
C1
100 nF
Test 1
GND
ADC
C3
100 nF
5
4
Output
OUT1
NotUsed
R1
10k
C4
4.7nF
Figure 9 – Recommended wiring in SOIC-8 package (28)
ECU
5V
VDD
8
1
VDD
VSS
MLX90316BCS
Test 0
Switch Out
C1
100 nF
C2
100 nF
VDIG
Test 1
5
4
OUT2
OUT1
GND
C4
100 nF
ADC
C3
100 nF
Output 1
Output 2
Figure 10 – Recommended wiring in SOIC-8 package – “BCS” Version
28
See section 13.1.4 if the Switch Output feature is used
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MLX90316 Rotary Position Sensor IC
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16.2. Analog Output Wiring in TSSOP-16 Package
ECU
VDD1
VDD1
GND1
C3
100 nF
16
C1
100nF
GND1
GND1
1
C2
100 nF
VDIG1
VSS1
Output 1
OUT1
C7
4.7 nF
R1
10k
VDD1
C4
100 nF
MLX90316
VDD2
VDIG2
C6
100 nF
ADC
9
8
VSS2
OUT2
VDD2
VDD2
GND2
GND2
C5
100 nF
Output 2
GND2
C8
4.7 nF
R2
10k
Figure 11 – Recommended wiring in TSSOP-16 package (dual die)
16.3. PWM Low Side Output Wiring
ECU
5V
VDD
8
1
VDD
MLX90316
Test 0
Switch Out
VSS
C2
100 nF
VDIG
Test 1
5
4
NotUsed
OUT1
C1
100 nF
GND
TIMER
5V
C3
4.7 nF
Output
R1
1k
C4
4.7nF
Figure 12 – Recommended wiring for a PWM Low Side Output configuration (28)
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MLX90316 Rotary Position Sensor IC
Datasheet
16.4. Serial Protocol
Generic schematics for single slave and dual slave applications are described.
16.4.1. SPI Version – Single Die
SPI Master
GND
8
1
VDD
5V
C1
100 nF
VDD
MLX90316
Test 0
_SS
_SS
/SS
Test 1
SCLK
MOSI
5
MISO
C2
100 nF
VDIG
4
SCLK
SCLK
Vss
MOSI
R2
1k
MOSI
3.3V/5V
Figure 13 – SPI Version – Single Die – Application Diagram
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MLX90316 Rotary Position Sensor IC
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16.4.2. SPI Version – Dual Die
SPI Master
C1
100nF
GND
8
1
VDD
5V
Vss
VDD
C2
100nF
MLX90316
Test 0
_SS1
_SS1
/SS
Test 1
5
MISO
#1
4
SCLK1
SCLK1
VDIG
MOSI
SCLK
MOSI
R2
1K
MOSI
3.3V/5V
C1
100nF
_SS2
8
1
VSS
VDD
SCLK2
C2
100nF
MLX90316
Test 0
_SS2
#2
Test 1
5
4
SCLK2
/SS
VDIG
SCLK
MOSI
Figure 14 – SPI Version – Dual Die – Application Diagram
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MLX90316 Rotary Position Sensor IC
Datasheet
16.4.3. Non SPI Version (Standard Version)
SPI Master
8
SCLK
1
VDD
5V
_SS
C1
100 nF
GND
VDD
_SS
VSS
Test 0
R4
R5
VDIG
/SS
Test 1
SCLK
MOSI
R1
MOSI
5
4
MISO
R3
C2
100 nF
MLX90316
MOSI
R2
3.3V/5V
Figure 15 – Single Die - Serial Protocol Mode
Application Type
μCtrl
Supply
(V)
Pull-up
90316
Supply
(V)
Supply
(V)
R1 (Ω)
R2 (Ω)
R3 (Ω)
R4 (Ω)
R5 (Ω)
MOS
Type
5V μCtrl w/o O.D. w/o 3.3V
5V
5V
5V
100
1000
20,000
1000
20,000
BS170
5V μCtrl w/o O.D. w/ 3.3V
5V
3.3V
5V
150
1000
N/A
1000
20,000
BS170
3.3V
3.3V
5V
150
1000
N/A
N/A
N/A
BS170
5V
5V
5V
100
1000
20,000
1000
20,000
N/A
3.3V
3.3V
5V
150
1000
N/A
N/A
N/A
N/A
3.3V μCtrl w/o O.D. (29)
5V μCtrl w/ O.D. w/o 3.3V (30)
3.3V μCtrl w/ O.D.
Table 6 – Resistor Values for Common Specific Applications
29
30
μCtrl w/ O.D. : Micro-controller with open-drain capability (for instance NEC V850ES series)
μCtrl w/o O.D. : Micro-controller without open-drain capability (like TI TMS320 series or ATMEL AVR)
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MLX90316 Rotary Position Sensor IC
Datasheet
17. Standard information regarding manufacturability
of Melexis products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to standards in place in Semiconductor industry.
For further details about test method references and for compliance verification of selected soldering
method for product integration, Melexis recommends reviewing on our web site the General Guidelines
soldering recommendation (http://www.melexis.com/en/quality-environment/soldering).
For all soldering technologies deviating from the one mentioned in above document (regarding peak
temperature, temperature gradient, temperature profile etc), additional classification and qualification tests
have to be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends consulting
the dedicated trim&forming recommendation application note: lead trimming and forming
recommendations
(http://www.melexis.com/en/documents/documentation/application-notes/leadtrimming-and-forming-recommendations).
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/en/quality-environment.
18. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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MLX90316 Rotary Position Sensor IC
Datasheet
19. Package Information
19.1. SOIC-8 - Package Dimensions
1.27 TYP
NOTES:
3.81
5.80
3.99** 6.20
4.80
4.98*
All dimensions are in millimeters (angles in degrees).
* Dimension does not include mold flash, protrusions or
gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or
protrusion (shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition.
Dambar cannot be located on the lower radius of the foot.
1.37
1.57
1.52
1.72
0.36
0.46***
0.19
0.25
0.100
0.250
0.41
1.27
0°
8°
8
OUT
MOSI/MISO
Test 1
VDIG
VSS
19.2. SOIC-8 - Pinout and Marking
Marking :
Part Number MLX90316 (3 digits)
Die Version (3 digits)
5
Top
316Bxx
M12345
Xy-E
M12345
Xy-E
REVISION 011 – AUGUST 17, 2017
OUT2
SCLK
\SS
Switch
Test 0
4
VDD
1
316
Bottom
YY
BCG
Standard
BDG
SPI Version
BCS
BCS Version
Lot number: “M” + 5 digits
Split lot number + “-E” (Optional )
WW
Week Date code (2 digits)
Year Date code (2 digits)
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MLX90316 Rotary Position Sensor IC
Datasheet
19.3. SOIC-8 - IMC Positionning
CW
8
7
6
5
CCW
COS
1.25
1.65
1
2
1.96
2.26
3
0.46 +/- 0.06
4
SIN
Angle detection SOIC-8
N
2
3
1
5
8
7
4
1
2
7
2
5
8
7
5
3
4
6
5
3
4
S
S
N
1
6
6
~ 270 Deg.*
~ 180 Deg.*
8
S
6
8
~ 90 Deg.*
N
7
S
~ 0 Deg.*
3
4
1
2
N
* No absolute reference for the angular information.
The MLX90316 is an absolute angular position sensor but the linearity error (Le – See section 9) does not
include the error linked to the absolute reference 0 Deg. (which can be fixed in the application through the
discontinuity point – See 13.2.2).
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MLX90316 Rotary Position Sensor IC
Datasheet
19.4. TSSOP-16 - Package Dimensions
0.65 TYP
12O TYP
0.20 TYP
0.09 MIN
1.0 DIA
4.30
4.50** 6.4 TYP
0.09 MIN
1.0
12O TYP
1.0
0.50
0.75
0O
8O
1.0 TYP
0.85
0.95
4.90
5.10*
1.1 MAX
0.19
0.30***
0.09
0.20
0.05
0.15
NOTES:
All dimensions are in millimeters (angles in degrees).
* Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the
dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
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MLX90316 Rotary Position Sensor IC
Datasheet
19.5. TSSOP-16 - Pinout and Marking
16
1
VDIG1
VSS1
Test 11
OUT1/MOSI/MISO1
SCLK1
316BxG
M12345
Xy-E
VDD1
Test 01
\SS2/Switch2
SCLK2
\SS1/Switch1
Test 02
VDD2
Marking :
VSS2
OUT2/MOSI/MISO2
9
8
Test 12
Part Number MLX90316 (3 digits)
Die Version (3 digits)
VDIG2
Top
316
BCG
Standard
BDG
SPI Version
M12345 Lot number: “M” + 5 digits
Xy-E
Bottom
YY
Split lot number + “-E” (Optional)
WW
Week Date code (2 digits)
Year Date code (2 digits)
19.6. TSSOP-16 - IMC Positionning
CW
COS 2
9
16
Die 1
Die 2
SIN 2
SIN 1
0.30 +/- 0.06
CCW
1.95
2.45
1
8
1.84
2.04
COS 1
2.76
2.96
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MLX90316 Rotary Position Sensor IC
Datasheet
Angle detection TSSOP-16
~ 180 Deg.*
16
9
Die 2
S
S
Die 2
9
Die 1
N
1
~ 90 Deg.*
16
S
Die 1
8
~ 270 Deg.*
9
S
16
Die 2
1
~ 0 Deg.*
~ 180 Deg.*
9
Die 1
8
1
~ 270 Deg.*
16
N
N
Die 1
~ 90 Deg.*
8
1
Die 2
N
~ 0 Deg.*
8
* No absolute reference for the angular information.
The MLX90316 is an absolute angular position sensor but the linearity error (Le – See section 9) does not
include the error linked to the absolute reference 0 Deg. (which can be fixed in the application through the
discontinuity point – See 13.2.2).
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MLX90316 Rotary Position Sensor IC
Datasheet
20. Disclaimer
The information furnished by Melexis herein is believed to be correct and accurate. Melexis disclaims (i) any and all liability in
connection with or arising out of the furnishing, performance or use of the technical data or use of the product as described herein,
(ii) any and all liability, including without limitation, special, consequential or incidental damages, and (iii) any and all warranties,
express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-infringement and
merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.
The information contained herein is provided "as is” and Melexis reserves the right to change specifications and/or any other
information contained herein at any time and without notice. Therefore, before placing orders and/or prior to designing this
product into a system, users or any third party should obtain the latest version of the relevant information to verify that the
information being relied upon is current. This document supersedes and replaces all prior information regarding the product(s) as
described herein and/or previous versions of this document.
Users or any third party must further determine the suitability of the Melexis’ product(s) described herein for its application,
including the level of reliability required and determine whether it is fit for a particular purpose.
The information contained herein is proprietary and/or confidential information of Melexis. The information contained herein or
any use thereof does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property
rights, whether with regard to such information itself or anything described by such information.
This document as well as the product(s) described herein may be subject to export control regulations. Please be aware that export
might require a prior authorization from competent authorities.
The product(s) as described herein is/are intended for use in normal commercial applications. Unless otherwise agreed upon in
writing, the product(s) described herein are not designed, authorized or warranted to be suitable in applications requiring extended
temperature range, unusual environmental requirements. High reliability applications, such as medical life-support or lifesustaining equipment are specifically not recommended by Melexis.
The product(s) may not be used for the following applications subject to export control regulations: the development, production,
processing, operation, maintenance, storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the
development, production, maintenance or storage of missiles for such weapons: 2) civil firearms, including spare parts or
ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any
applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods
and that can be used as a means of violence in an armed conflict or any similar violent situation.
Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at
https://www.melexis.com/en/legal/terms-and-conditions.
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2017)
ISO/TS 16949 and ISO14001 Certified
21. Contact
For the latest version of this document, go to our website at www.melexis.com. For additional information,
please contact our Direct Sales team and get help for your specific needs:
Europe, Africa
Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas
Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
REVISION 011 – AUGUST 17, 2017
Page 48 of 48
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