MLX90329LDC-DBA-000-RE 数据手册
MLX90329
Automotive Sensor Interfaces
2. Application Examples
1. Features and Benefits
Sensor interface IC for use in harsh
automotive environments
High EMC robustness
Possibilities to achieve outstanding overall
sensor performances
SENT output with option for pressure,
calibrated on chip or external NTC
temperature information
Outstanding
accuracy
for
factory
calibrated NTC within ±1°C
Piezoresistive automotive pressure sensors
interface
Sensors based on Wheatstone bridge
resistors
3. Ordering information
Product Code
Temperature
Code
Package
Code
Option Code
Packing
Form Code
MLX90329
L
DC
DBA-000
RE
Legend:
Temperature Code:
Package Code:
Option Code:
Packing Form:
Ordering example:
L (-40°C to 150°C)
DC = SOIC-8 Plastic Small Outline, 150 mil
DBA-000
RE = Reel
MLX90329LDC-DBA-000-RE
4. Functional Diagram
DSP
6/7 VDDA
Piezoresistive
sensing element
Sensor bias
Off chip temperature
sensor current output
Divided bridge
current
IV conversion
Gain & Offset
Temperature
Compensation
Overvoltage &
reverse voltage
protection
Voltage regulator
POR
On chip temperature
sensor
SENT
driver
Pressure Linearization
Vbrg
Vext
PGA
InP
OPA
InN
NTC
N
T
C
Vsupply
M
U
X
Vana
Programmable Filter
ADC
Temperature conditioning
16 bits
Slew
rate
control
SENT
Output
Rom
SE1, SE2, VEXT
EEPROM
NTC interface
and linearization
Test
Oscillator
Ram
Test
Gnd
Figure 1: Functional block diagram
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Automotive Sensor Interfaces
5. General Description
The MLX90329 covers the most typical resistive type of Wheatstone bridge applications for use in an automotive
environment. It is a mixed signal sensor interface IC that converts small changes in resistors, configured in a full
Wheatstone bridge on a sensing element, to large output voltage variations.
The signal conditioning includes gain adjustment, offset control as well as temperature compensation in order to
accommodate variations of the different resistive sensing elements. Compensation values are stored in EEPROM
and can be reprogrammed with a Melexis tool including the necessary software. The MLX90329 is programmed
with a single wire serial interface through the output pin.
The user can specify SENT fast channel configuration, slow channel messages and enable several diagnostic
settings. By intercepting these various fault modes, the MLX90329 is able to inform about the reliability of its
output signal.
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Automotive Sensor Interfaces
Contents
1. Features and Benefits........................................................................................................................................... 1
2. Application Examples ........................................................................................................................................... 1
3. Ordering information ........................................................................................................................................... 1
4. Functional Diagram .............................................................................................................................................. 1
5. General Description.............................................................................................................................................. 2
6. Glossary of Terms ................................................................................................................................................. 4
7. Absolute Maximum Ratings .................................................................................................................................. 4
8. Pin Definitions and Descriptions ........................................................................................................................... 4
9. General Electrical Specifications ........................................................................................................................... 5
10. Filters ................................................................................................................................................................. 6
10.1. PFLT ........................................................................................................................................................... 6
10.2. SSF ............................................................................................................................................................. 7
11. Analog Front End ................................................................................................................................................ 9
12. ADC .................................................................................................................................................................. 11
13. Digital ............................................................................................................................................................... 11
14. NTC Temperature Linearization ........................................................................................................................ 12
15. SENT Configuration .......................................................................................................................................... 15
15.1. Fast Channel Configuration ..................................................................................................................... 15
15.2. Slow Channel Configuration .................................................................................................................... 16
16. Wrong Connections Overview .......................................................................................................................... 20
17. Diagnostics ....................................................................................................................................................... 21
17.1. Input Diagnostics ..................................................................................................................................... 21
17.2. Diagnostic Sources................................................................................................................................... 21
17.3. Fast and Slow Channel Diagnostics .......................................................................................................... 22
18. Timings ............................................................................................................................................................. 26
19. Unique features................................................................................................................................................ 27
20. Application Information.................................................................................................................................... 28
21. Standard information regarding manufacturability of Melexis products with different soldering processes..... 29
22. ESD Precautions ............................................................................................................................................... 29
23. Package Information ........................................................................................................................................ 30
24. Contact............................................................................................................................................................. 31
25. Disclaimer......................................................................................................................................................... 31
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Automotive Sensor Interfaces
6. Glossary of Terms
POR: Power-on Reset
ADC: Analog to Digital Converter
DSP: Digital Signal Processor
EMC: Electro Magnetic Compatibility
SENT: Single Edge Nibble Transmission
OV: Over Voltage
UV: Under Voltage
FC: SENT Fast Channel
FC1: SENT Fast Channel 1
FC2: SENT Fast Channel 2
7. Absolute Maximum Ratings
Parameter
Supply Voltage (overvoltage)
Value
Units
18
V
Reverse Voltage Protection
-14
V
Positive output voltage
18
V
Reverse output voltage
-0.5
V
Operating Temperature Range
-40 to 150
°C
Storage Temperature Range
-40 to 150
°C
Programming Temperature Range
-40 to 125
°C
Table 1: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
8. Pin Definitions and Descriptions
Pin number SOIC8
1
2
3
4
5
6
7
8
Description
Vbrg: bridge supply voltage
InP: positive bridge output
Test: pin used for testing purposes only
InN: negative bridge output
Out: SENT output
Vsupply: IC supply
NTC: NTC input
Gnd: Ground
Table 2: Pin out definitions and descriptions
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Package side
Top
Line number
1
Description
Product number
Top
2
Lot number
Top
3
Sublot number (optional)
Bottom
1
Year and calendar week (yyww)
Table 3: Package marking definition
9. General Electrical Specifications
DC Operating Parameters TA = -40°C to 150°C
Parameter
Nominal supply voltage
Nominal supply current
Symbol
Vdd
Idd
Decoupling capacitor on
supply
Supply series resistor
Remarks
Min
4.5
Sensing element current
consumption, SENT interface
current and NTC current excluded
Typ(1)
5
8
100
Not mandatory but recommended
for optimal EMC performance
Pure capacitive load
Capacitive load on output
Analog POR hysteresis
Digital POR level (rising)
Digital POR hysteresis
Analog regulator
Nominal bridge supply
voltage
Power up time
Pull-up to Vdd at receiver
Vdd_com
Ohm
nF
10
6.2
2.2
1.1nF +
220Ω +
1.1nF
55
7.8
kOhm
V
3.9
V
500
2.7
200
+9%
+9%
mV
V
mV
V
V
1.1
msec
3
SENT
frames
2
100
2.05
10
-9%
-9%
VDDA
Vbrg
nF
10
3.1
Pressure response time(2)
1
Threshold to enter communication
mode
Units
V
mA
0
CRC load circuit
(C close to device + Series R + C
close to connector)
Resistive load on output
Supply programming
entry level
Analog POR level (rising)
Max
5.5
10
Time from reaching minimum
allowed supply voltage of 4.5V till
the first falling edge of the first SENT
frame
Filter setting PFLT = 0 and SSF = 1.
Tick time = 3us and Pause Pulse
enabled.
For other configurations refer to
Table 5 in chapter 10.
3.5
2.3
3.5
3
Typical values are defined at T A = +25°C and V DD = 5V.
Number of SENT frames between pressure step and settled output (last frame containing stable pressure data)
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Parameter
Symbol
Wheastone Bridge
sensitivity range at 25°C(3)
Wheastone Bridge
resistance range
InP InN digital diagnostic
levels
Pressure sensor signal
chain accuracy
Wheastone Bridge(4) offset
range
External Wheatstone
Bridge Temperature
accuracy
Input voltage range on
NTC pin
ADC resolution
NTC Temperature Output
noise
NTC Temperature Range
Temperature response
time
Remarks
Min
2
Typ(1)
Max
55
2
Diagnostic thresholds of 25% of
VDDA (low) and 75% of VDDA (high)
kOhm
-16384
16384
lsb
0.2
%FSO
-20
20
mV/V
-3
+3
°C
0
3.5
V
Initial errors compensated by
calibration of the pressure sensor at
minimum two temperatures. Only
drift over life remaining in error
budget. Worst case for maximum
gain setting.
For typical Wheatstone bridges.
Application specific.
Units
mV/V
16
1
-55
200
100
Bits
LSB pkpk
°C
msec
Table 4: Electrical specifications
10. Filters
There are two filters available to filter the pressure signal. The first filter is a Small Signal Filter which can be
disabled or enabled. The second filter is a first order low pass filter for the pressure signal which has a
programmable depth.
An overview of the noise levels using different filter and gain combinations can be found in Table 6.
10.1. PFLT
PFLT is a programmable first order low pass filter. The depth of this filter can be selected. This filter can be
configured to select the optimal trade-off between response time and output noise.
3
A maximum performance can be obtained with this sensor sensitivity range. A programmable gain with 5 bits from a gain of 9 to 237 is used in the
analog front end circuitry to adapt the sensor range to the on chip ADC input range. Half of the ADC input range (= 1.75V) is foreseen to be used
during the sensor calibration at the first temperature. The rest of the ADC input range is left for the compensation of the s ensor temperature
effects. A coarse offset compensation is available to calibrate large sensor offsets.
A more detailed overview of the gains in the analog frontend can be found in Table 7.
4
Please contact Melexis for assistance in evaluating the match between the sensing element and the MLX90329 interface if needed.
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Automotive Sensor Interfaces
The low pass filter is implemented according to the following formula:
( )
( )
(
)
(
)
The PFLT parameter in the formula is set in EEPROM and can have a value between 0 and 9. An overview of
typical response times when applying a step on the input using different PFLT filter settings can be found in Table
5. The number of SENT frames indicated in the table includes the last frame which contains stable pressure data.
Filter setting 0 disables the PFLT.
PFLT setting
0
1
2
3
4
5
6
7
8
9
Response time
in SENT
frames(5)
3
3
5
8
13
24
45
88
176
350
Table 5: Filter settings with corresponding typical response times
10.2. SSF
The SSF (Small Signal Filter) is a digital filter which is designed not to have an impact on the response time of a
fast changing pressure signal like a pressure step. When a large signal change at the input is present, the filter is
bypassed and not filtering the signal. For small signal changes, which are in most cases noise, the filter is used
and filtering the pressure signal.
The Small Signal Filter can be enabled or disabled in EEPROM. It is advised not to use the SSF in combination with
the PFLT enabled.
5
Tick time is set to 3us and Pause Pulse is enabled.
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Automotive Sensor Interfaces
Analog front
end gain (CG)
0
0
0
0
0
0
0
0
0
0
0
0
10
10
10
10
10
10
10
10
10
10
10
10
31
31
31
31
31
31
31
31
31
31
31
31
Digital gain
(G0)
10000
10000
10000
10000
17000
17000
17000
17000
30000
30000
30000
30000
10000
10000
10000
10000
17000
17000
17000
17000
30000
30000
30000
30000
10000
10000
10000
10000
17000
17000
17000
17000
30000
30000
30000
30000
PFLT setting
SSF
0
1
4
9
0
1
4
9
0
1
4
9
0
1
4
9
0
1
4
9
0
1
4
9
0
1
4
9
0
1
4
9
0
1
4
9
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
Noise
(LSB pk-pk)
2
2
1
0
2
2
1
1
4
3
2
0
2
1
1
0
3
2
1
0
4
4
2
0
3
3
2
1
4
4
2
1
7
7
4
1
Table 6: Filter settings and gain combinations with corresponding pressure noise values
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Automotive Sensor Interfaces
11. Analog Front End
The analog front end of the MLX90329 consists of a chopping stage and 3 amplification stages as can be seen in
Figure 2. There are also several input diagnostics integrated into this front end to be able to detect a broken InP
or InN connection or an input which is out of range. This diagnostic information is transferred to the
microcontroller to handle further action for example flagging a diagnostic message.
G = 4.5 to 10.5
3 bits
G = 1.25 or 3.5
CSOF: 1/3 to 2/3
of VDDA
G = 1.6, 3.2 or 6.4
InP
Input
Diag
nostics
InN
OPA
Chopping
1us/phase
Stage 1:
Instrumentation amplifier
OPA
Stage 2:
Differential amplifier
Stage 3:
Integrator
Figure 2: Analog front end block diagram
The first stage is an instrumentation amplifier of which the gain can be programmed using 3 bits to cover a gain
range between 4.5 and 10.6.
Transfer equation:
OUTP1 – OUTN1 = Gst1*(InP – InN) in phase 1
OUTP1 – OUTN1 = Gst1*(InN – InP) in phase 2
The second stage is a fully differential amplifier. The gain of the amplifier can be calibrated using 1 bit.
Transfer equation:
OUTP2 – OUTN2 = -Gst2*(OUTP1 – OUTN1) – Gst2*(CSOF1 – CSOF2) in phase 1
OUTP2 – OUTN2 = -Gst2*(OUTN1 – OUTP1) – Gst2*(CSOF2 – CSOF1) in phase 2
The CSOF1 and CSOF2 signals are generated by the coarse offset DAC with the following transfer functions:
VDDA
2 1 VDDA CO[6 : 0]
CO7
1 * *
*
2
2
127
3 3
VDDA
1 VDDA CO[6 : 0]
CO7 2
CSOF 2
1 * *
*
2
2
127
3 3
CSOF1
CO[6:0] fixes the DAC output. CO7 is used for the polarity.
The third stage is an integrator which is controlled using 2 bits to set a gain between 1.6 and 6.4
Transfer equation at the outputs of the amplifier:
OUTP3 – OUTN3 = -N*(C1/C2)*(OUTP2 – OUTN2)
OUTP3_common_mode and OUTN3_common_mode = VCM = VDDA/2
In this equation N represents the number of integration cycles which is a fixed value of N = 40.
C2 is a fixed feedback capacitor of approximately 5pF. C1 can have 3 different values: 0.2pF, 0.4pF or 0.8pF.
Transfer equation after the ADC:
Pressure_ADC = ((OUTN3 – OUTP3)*216/VDDA) + 32768
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Automotive Sensor Interfaces
An overview of all possible values for Gst1, Gst2 and Gst3 can be found in Table 7 below.
The input stage is designed to work with an input common-mode voltage range between 42%Vbrg and 58%Vbrg.
Gain
setting
Gst1
Gst2
Gst3
Total
gain
FS Differential
Input Signal
[-]
[V/V]
[V/V]
[V/V]
[V/V]
[mV]
4.49
5.06
5.8
6.52
7.43
8.37
9.35
10.6
4.49
5.06
5.8
6.52
7.43
8.37
9.35
10.6
4.49
5.06
5.8
6.52
7.43
8.37
9.35
10.6
4.49
5.06
5.8
6.52
7.43
8.37
9.35
10.6
-1.25
-1.25
-1.25
-1.25
-1.25
-1.25
-1.25
-1.25
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
6.4
6.4
6.4
6.4
6.4
6.4
6.4
6.4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
-9.0
-10.1
-11.6
-13.0
-14.9
-16.7
-18.7
-21.2
-25.1
-28.3
-32.5
-36.5
-41.6
-46.9
-52.4
-59.4
-50.3
-56.7
-65.0
-73.0
-83.2
-93.7
-104.7
-118.7
-100.6
-113.3
-129.9
-146.0
-166.4
-187.5
-209.4
-237.4
± 195
± 173
± 151
± 134
± 118
± 105
± 94
± 83
± 70
± 62
± 54
± 48
± 42
± 37
± 33
± 29
± 35
± 31
± 27
± 24
± 21
± 19
± 17
± 15
± 17
± 15
± 13
± 12
± 11
±9
±8
±7
Table 7: Gain and input signal range of the analog front end
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Automotive Sensor Interfaces
12. ADC
The 16 bit differential ADC has a range from –VDDA/2 to +VDDA/2.
There are 7 different ADC channels. Channel 0 is not used. Table 8 below describes all the channels.
ADC
Signal
Remarks
SIN[2:0]
0
1
2
3
4
5
6
7
P
Tint
Vsup
InP/InN
Vdig
Tntc
Text
Nothing connected
Pressure
Internal Temperature
External Supply
Multiplexing between Positive/Negative Sensor Output
Digital Regulator
NTC Output
External Temperature
Table 8: ADC channels
The different channels are converted in a constantly repeating sequence at a rate of 50µsec for each individual
conversion. The order is shown in Figure 3 below.
P
Tint
P
Text
P
Tntc
P
Vsup
P
Tint
P
Text
P
Tntc
P
InP/InM
P
Tint
P
...
Figure 3: ADC sequence
13. Digital
The digital is built around a 16-bit microcontroller. It contains besides the processor also ROM, RAM and EEPROM
and a set of user and system IO registers.
Temperature compensation of the pressure signal and pressure linearization is handled by the microcontroller.
For the pressure compensation there are EEPROM parameters allocated to be able to cover a large variety of
calibration approaches.
Both for gain and offset of the pressure signal, there is a separate temperature dependency programmable
ranging from a temperature independence to a first order, second order and finally a third order compensation.
This is reflected in EEPROM parameters for the offset (O0, O1, O2 and O3) and for the gain (G0, G1, G2 and G3). If
required, the linearity of the pressure signal can also be compensated without a temperature dependency or
with a first order temperature dependency through EEPROM parameters L0 and L1.
For the temperature compensation of the pressure signal both the internal on-chip PTAT temperature as the
temperature measured using the sensor bridge resistance can be used. The selection between both can be set in
EEPROM using the ‘Tpress_Select’ parameter. Tpress_Select = 0 corresponds to sensing element temperature
reference and Tpress_Select = 1 is on-chip PTAT temperature. When using the sensing element bridge resistance
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temperature measurement, a selection of a 2K, 4K, 8K or a 32K bridge resistance can be done using EEPROM
parameter ‘BRIDGE_SEL’(6), see Table 9.
Resistance
selection
BRIDGE_SEL
0
1
2
3
2K
4K
8K
32K
Table 9: Bridge resistance selection for temperature reference
Linearization of the NTC temperature is also covered partially by the microcontroller. More information in this
topic can be found in chapter 14.
14. NTC Temperature Linearization
The linearization of the NTC temperature signal is split up in several stages. A schematic overview of these steps
can be seen in Figure 4.
VDDA
3 or 4 points
MLX calibration
@ 3 temp
Rs
Vdiv
ADC_raw[15:0]
VDDA/2
ADC
Calibration
&
Compensation
Rntc
ADC_comp[15:0]
LUT
ADC_ROM
=>
Tntc
Figure 4: Block diagram NTC linearization
The complete system can be divided into 5 separate stages.
1. A resistor divider with internal resistor Rs is used to linearize Rntc into a voltage.
2. A fully differential amplifier with unity gain is used to drive the ADC.
3. The 16-bit ADC is being used to convert the analog resistor divider output voltage into a digital signal
called ADC_raw.
4. With the help of calibration data saved in EEPROM the microcontroller will perform a first compensation
on ADC_raw converting in to ADC_comp. This new value is targeted to be as close as possible to the value
ADC_ROM.
5. Finally a look up table (LUT) will be used to convert the ADC_ROM values into the Tntc value which is the
desired linearized NTC temperature.
6
It is not mandatory to have a bridge resistance identical to the resistance selection setting. In this case it is advised to select the setting closest to
the actual value. In case support is needed please contact Melexis.
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The default NTC characteristic which is calibrated can be found in Table 10. When using an NTC which does not
match the coefficients described above, it is advised to contact Melexis.
The EEPROM coefficients which are used for the conversion from ADC_raw to ADC_comp are N0 to N3,
N0_Diff_Low to N3_Diff_Low, N0_Diff_High to N3_Diff_High and TEMP1 to TEMP3.
T (°C)
RT/R25
R (Ω)
-55
53.68 268400
-50
39.112 195560
-45
28.817 144085
-40
21.459 107295
-35
16.142
80710
-30
12.259
61295
-25
9.3959 46979.5
-20
7.2644
36322
-15
5.6633 28316.5
-10
4.4503 22251.5
-5
3.5236
17618
0
2.8102
14051
5
2.2567 11283.5
10
1.8243
9121.5
15
1.4841
7420.5
20
1.2147
6073.5
25
1
5000
30 0.82785 4139.25
35
0.689
3445
40 0.57639 2881.95
45 0.48457 2422.85
50 0.40931 2046.55
55 0.34731 1736.55
60 0.29599 1479.95
65 0.25332
1266.6
70 0.21768
1088.4
T (°C)
75
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
155
160
165
170
175
180
185
190
195
200
RT/R25
0.18779
0.16261
0.14131
0.12324
0.10783
0.094663
0.083361
0.073638
0.06524
0.057964
0.05164
0.046128
0.041309
0.037085
0.033373
0.030102
0.027213
0.024654
0.022384
0.020364
0.018564
0.016955
0.015515
0.014223
0.013063
0.012017
R (Ω)
938.95
813.05
706.55
616.2
539.15
473.315
416.805
368.19
326.2
289.82
258.2
230.64
206.545
185.425
166.865
150.51
136.065
123.27
111.92
101.82
92.82
84.775
77.575
71.115
65.315
60.085
Table 10: Default NTC characteristic
The overall accuracy of the default NTC can be found in Table 11. The default temperature characteristic of the
NTC and the internal temperature signal can be found in the graph of Figure 6.
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NTC Accuracy
Parameter
Symbol
Center NTC
temperature accuracy
εTc
Extended NTC
temperature accuracy
εTe
Remarks
Min
Overall accuracy
using the default NTC
as described in Table
10.
See Figure 5: NTC
temperature
accuracy.
Typ
Max
Unit
-1
1
°C
-2
2
°C
Table 11: NTC accuracy
Temperature Accuracy
(°C)
εTe
εTc
-40
35
100
150
170
Temperature (°C)
εTc
εTe
Figure 5: NTC temperature accuracy
SENT Output
in LSB
4088
1
Temperature in °C
-73.025
437.85
Figure 6: NTC and internal temperature transfer function
REVISION 002 – 22 DECEMBER 2017
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Automotive Sensor Interfaces
15. SENT Configuration
The SENT output is designed to be compliant with the SAE J2716 rev. Apr 2016 SENT standard. The tick time is
configurable in EEPROM using parameter TICK_DIV. The available tick time settings are 3us, 4us, 6us, 10us, 12us
and 16us. A pause pulse can also be enabled to have a fixed frame length of 282 ticks. This can be done using
parameter PAUSE.
15.1. Fast Channel Configuration
On the fast channel, 8 different options are available to configure channel 1 and channel 2. An overview of these
different options and how to configure them can be found in Table 12.
1
2
FC_CFG
setting
0
1
Pressure (3x 4 bit)
Pressure (3x 4 bit)
3
2
Pressure (3x 4 bit)
4
3
Pressure (3x 4 bit)
Internal temperature
(3x 4 bit)
5
6
7
4
5
6
Pressure only (3x 4 bit)
Pressure only (4x 3 bit)
Data indicated by pointer 1
(3x 4 bit)
/
/
Data indicated by pointer 2
(3x 4 bit)
8
7
Pressure (3x 4 bit)
0 (3x 4 bit)
#
Fast Channel 1
Fast Channel 2
Inverse of Pressure (3x 4 bit)
Rolling counter (2x 4 bit) and
inverse of MSN of Pressure
(1x 4 bit)
Medium temperature
(3x 4 bit)
Remark
Media temperature can either be
NTC or sensing element temperature.
(Tmedium_Select)
Internal temperature can either be
PTAT or sensing element
temperature (Tinternal_Select)
In this mode no diagnostics are
available. FC configuration only used
by Melexis.
Table 12: Fast channel configuration options
The selection of the fast channel output mode can be done by changing the parameter ‘FC_CFG’ in the EEPROM.
In case Medium temperature is selected to be available on fast channel 2, the type of media should be defined in
EEPROM using parameter ‘Tmedium_Select’. When selecting 0, linearized NTC temperature will be available.
Selecting 1 enables sensing element temperature. Sensing element temperature needs to be calibrated after
connecting the sensing element to the MLX90329 and is not calibrated by Melexis(7).
For Internal temperature, also two options are available defined in EEPROM parameter ‘Tinternal_Select’ where
0 corresponds to on chip factory calibrated PTAT temperature and 1 corresponds to sensing element
temperature. The same comment regarding the calibration of the sensing element temperature calibration as
made above applies here.
7
Contact Melexis for assistance if required.
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Automotive Sensor Interfaces
15.2. Slow Channel Configuration
The Slow Serial Channel is implemented according to the Enhanced Serial Message Format using 12 bit data and 8
bit message ID as described in the reference SENT protocol standard SAE J2716 rev. Apr 2016.
An overview of the different slow channel messages which are available in the MLX90329 can be found in Table
13. From this table 16 messages can be configured completely in EEPROM. The 12 bit data content of these
messages can be configured freely. The ID of programmable message PR0, PR1, PR2 and PR3 is copied from
EEPROM (2x 4 bit). The ID of PR5 is 1 bit higher than of PR4. The same is valid for the other pairs: PR6-7, PR8-9, …,
PR14-15. This programmable ID is indicated in Table 13 as 0xYZ.
All programmable messages can also be enabled and disabled, but not all independently of each other:
PR0, PR1, PR2 and PR3 can be each independently enabled or disabled
PR4 and PR5 are together enabled or disabled
PR6 and PR7 are together enabled or disabled
PR8, PR9, PR10 and PR11 are together enabled or disabled
PR12, PR13, PR14 and PR15 are together enabled or disabled
#
0
1
2
3
4
Type
RAM
EEPROM
EEPROM
EEPROM
RAM
ID
0x01
0x03
0x04
0x05
0x06
Description
Diagnostic codes
Sensor Type
Configuration code
Manufacturer Code
SENT revision
5
RAM
0x07
6
RAM
0x08
7
EEPROM 0xYZ
Fast channel 1
Characteristic X1
Fast channel 1
Characteristic X2
Fully Programmable
message 0
8
RAM
0x23
9
RAM
0x09
10 RAM
11 ROM
Internal Temperature
Fast channel 1
Characteristic Y1
0x0A Fast channel 1
Characteristic Y2
0x0B Fast channel 2
Characteristic X1
REVISION 002 – 22 DECEMBER 2017
3901090329
Data
Error_flags (See chapter 0 Diagnostics)
Configurable 0 to 15
Configurable 0 to 4095
Configurable 0 to 4095
Selectable by bit in EEPROM
Data = 3 or 4
Fast channel 1 Characteristic Configuration
Enable / disable shared with MID08
Fast channel 1 Characteristic Configuration
Enable / disable shared with MID07
Programmable ID:
8 bit
Programmable Data:
12 bit
According to default linear temperature transfer
characteristic in SAE J2716 standard
Fast channel 1 Characteristic Configuration
Enable / disable shared with MID0A
Fast channel 1 Characteristic Configuration
Enable / disable shared with MID09
If FC2 is pressure (FC_CFG = 0): ID0B = ID07
If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic X1: Fixed
value: 233
Enable / disable shared with MID0C / 0D / 0E
Rep
Y
N
N
N
N
N
N
N
Y
N
N
N
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Type
#
12 ROM
ID
0x0C
13 ROM
0x0D Fast channel 2
Characteristic Y1
14 ROM
0x0E
15 EEPROM 0x29
Description
Fast channel 2
Characteristic X2
Fast channel 2
Characteristic Y2
Sensor ID #1
16 EEPROM 0xYZ
Fully Programmable
message 1
17 EEPROM 0x2A Sensor ID #2
18 EEPROM 0x2B
Sensor ID #3
19 EEPROM 0x2C
Sensor ID #4
20 EEPROM 0xYZ
Fully Programmable
message 2
21 EEPROM 0xYZ
22 EEPROM 0xYZ
Fully Programmable
message 3
Programmable message 4
23 EEPROM 0xYZ
Programmable message 5
24 EEPROM 0xYZ
Programmable message 6
REVISION 002 – 22 DECEMBER 2017
3901090329
Data
If FC2 is pressure (FC_CFG = 0): ID0C = ID08
If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic X2: Fixed
value: 423
Enable / disable shared with MID0B / 0D / 0E
If FC2 is pressure (FC_CFG = 0): ID0D = ID09
If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic Y1: Fixed
value: 264
Enable / disable shared with MID0B / 0C / 0E
If FC2 is pressure (FC_CFG = 0): ID0E = ID0A
If FC2is temperature (FC_CFG = 2 or 3):
Default temperature Characteristic Y2: Fixed
value: 1784
Enable / disable shared with MID0B / 0C / 0D
Programmable Data: 12 bit
Enable / disable shared with MID2A / 2B / 2C
Programmable ID: 8 bit
Programmable Data: 12 bit
Programmable Data: 12 bit
Enable / disable shared with MID29 / 2B / 2C
Programmable Data: 12 bit
Enable / disable shared with MID29 / 2A / 2C
Programmable Data: 12 bit
Enable / disable shared with MID29 / 2A / 2B
Programmable ID: 8 bit
Programmable Data: 12 bit
Programmable ID: 8 bit
Programmable Data: 12 bit
Programmable ID: 8 bit
Programmable Data: 12 bit
Enable / disable shared with programmable
message 5
Message ID = ID programmable message 4 + 1
Programmable Data: 12 bit
Enable / disable shared with programmable
message 4
Programmable ID: 8 bit
Programmable Data: 12 bit
Enable / disable shared with programmable
message 7
Rep
N
N
N
N
N
N
N
N
N
N
N
N
N
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Type
#
ID
25 EEPROM 0xYZ
26 EEPROM 0xYZ
27 EEPROM 0xYZ
28 EEPROM 0xYZ
29 EEPROM 0xYZ
30 EEPROM 0xYZ
31 EEPROM 0xYZ
32 EEPROM 0xYZ
33 EEPROM 0xYZ
Description
Programmable message 7
Programmable message 8
Programmable message 9
Programmable message 10
Programmable message 11
Programmable message 12
Programmable message 13
Programmable message 14
Programmable message 15
34 RAM
0x10
Medium Temperature
35 RAM
0xE1
Device start-up check
Data
Message ID = ID programmable message 6 + 1
Programmable Data: 12 bit
Rep
N
Enable / disable shared with programmable
message 6
Programmable ID: 8 bit
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 9 / 10 / 11
Message ID = ID programmable message 8 + 1
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 8 / 10 / 11
Programmable ID: 8 bit
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 8 / 9 / 11
Message ID = ID programmable message 10 + 1
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 8 / 9 / 10
Programmable ID: 8 bit
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 13 / 14 / 15
Message ID = ID programmable message 12 + 1
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 12 / 14 / 15
Programmable ID: 8 bit
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 12 / 13 / 15
Message ID = ID programmable message 14 + 1
Programmable Data: 12 bit
N
Enable / disable shared with programmable
messages 12 / 13 / 14
According to default linear temperature transfer
characteristic in SAE J2716 standard
Start-up self-check result data
Y
N
Table 13: Slow channel messages
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Messages which have a “Y” in the column Rep of Table 13 can be selected to have a higher occurrence in the slow
channel message sequence. Their repetition rate can be configured as indicated in Table 14.
The repeatable messages MID01h, MID10h and MID23h can be configured individually to have their own
repetition rate. The repetition factor setting can be done in respectively “SENT_REP_FACT_ID_01”,
“SENT_REP_FACT_ID_10” and “SENT_REP_FACT_ID_23”.
Repetition Factor Setting
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Real Repetition Factor
Message repetition disabled
Message repeat every 2 messages
Message repeat every 3 messages
Message repeat every 4 messages
Message repeat every 5 messages
Message repeat every 6 messages
Message repeat every 7 messages
Message repeat every 8 messages
Message repeat every 9 messages
Message repeat every 10 messages
Message repeat every 12 messages
Message repeat every 16 messages
Message repeat every 20 messages
Message repeat every 24 messages
Message repeat every 28 messages
Message repeat every 30 messages
Table 14: Repetition rate settings
Once a message is configured to be repeatable, it will automatically have the highest priority. Therefore it will
appear first in the slow message sequences.
The priority order between MID01, MID10 and MID23 can also be configured using EEPROM parameter
“SC_R_O”:
SC_R_O = 0: Priority order: ID01h > ID10h > ID23h
SC_R_O = 1: Priority order: ID10h > ID23h > ID01h
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16. Wrong Connections Overview
Table 15 provides an overview of the behavior of the MLX90329 when different combinations of connections to
GND, VDD and OUT are made.
GND
VDD
SENT out
Effect on output
0V
5V
Normal operation
Disconnected
5V
No communication
Normal operation
0V
Disconnected
No communication
Normal operation
0V
5V
SAE Standard
Load Circuit
SAE Standard
Load Circuit
SAE Standard
Load Circuit
Disconnected
Action after wrong
connection
Normal operation
No communication
Normal operation
0V
5V
0V
Normal operation
0V
5V
5V
0V
5V
18V
0V
0V
0V
18V
No communication
Normal operation
5V
5V
No communication
Normal operation
5V
0V
SAE Standard
Load Circuit
SAE Standard
Load Circuit
SAE Standard
Load Circuit
SAE Standard
Load Circuit
0V – No
communication
5V – No
communication
18V – No
communication
No communication
No communication
Normal operation
Normal operation
Normal operation
Normal operation
Table 15: Wrong connections overview
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Automotive Sensor Interfaces
17. Diagnostics
17.1. Input Diagnostics
An overview of the different input diagnostics conditions and their corresponding fast channel mapping and
diagnostic bit information in slow channel can be found in Table 16.
Condition
Vbrg disconnected
GND (sensor) disconnected
InP disconnected
InN disconnected
Vbrg shorted to GND
InP shorted to GND
InN shorted to GND
InP shorted to Vbrg
InN shorted to Vbrg
Fast Channel Code
4090
4090
4090
4090
4090
4090
4090
4090
4090
Error(8)
ERROR_SPSN
ERROR_SPSN
ERROR_PRESS_BROKEN_W
ERROR_PRESS_BROKEN_W
ERROR_SPSN
ERROR_SPSN
ERROR_SPSN
ERROR_SPSN
ERROR_SPSN
Table 16: Input diagnostics
17.2. Diagnostic Sources
The MLX90329 product has several internal checks which monitor the status of device. These checks or
diagnostic sources can be enabled or disabled based on the sensor module requirements. An overview of the
different diagnostic sources, their enable/disable parameter and the explanation of their functionality can
be found below in table Table 17.
Bit
10
9
8
7
6
5
4
2
1
0
Parameter
ERR_EN_TINT
ERR_EN_IO
ERR_EN_SPSN
ERR_EN_PV
ERR_EN_PP
ERR_EN_BW
ERR_EN_TMED
ERR_EN_VSUPH
ERR_EN_VSUPL
ERR_EN_TCHIP
Error condition
The Internal temperature could not be measured/calculated
RAM configuration error
SP or SN pin voltage out of range
The pressure value could not be measured/calculated
Pressure parameter error
A broken wire is detected in the pressure sensor path
The Medium temperature could not be measured/calculated
The supply voltage is too high
The supply voltage is too low
The chip temperature out of range
Table 17: Diagnostic sources
8
See tables 17 to 19 for more information on the errors
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Automotive Sensor Interfaces
17.3. Fast and Slow Channel Diagnostics
There are two values reserved to show an error diagnostic mode in the fast channel. These values are 4090 and
4091. According to the type of diagnostic flag, one of the values will be transmitted if enabled. Internal errors like
for example PRESS_BROKEN_W or PRESS_PAR use 4090 to indicate an error condition on the fast channel.
Errors conditions which can be linked to external influences can be configured to either transmit 4090 or 4091.
These errors are VSUP_HIGH, VSUP_LOW and T_CHIP.
For both VSUP_HIGH and VSUP_LOW fast channel overwriting using an error message can even be disabled. This
allows you to still decode properly the pressure or optionally temperature information in case of an over voltage
or under voltage condition. The OV or UV condition can still be monitored using the status bits for FC1 and FC2
and the slow channel diagnostic message MID01.
An overview of the fast channel error configuration can be found in Table 18. The EEPROM parameters V_ERR,
FCE_VSUP and FCE_TCHIP handle this configuration.
Fast
Channel
ERR_VSUP
No change
4091
4090
Parameter
V_ERR
FCE_VSUP
0
Not applicable
1
0
1
1
Fast
Channel
ERR_TCH
4091
4090
Parameter
FCE_TCHIP
0
1
Table 18: Fast channel error configuration
The diagnostic slow channel message (MID 1) can be enabled or disabled independent of the other slow channel
messages and it has an adjustable repetition factor (2, 4, .., 30).
More information on the different diagnostics shown in SENT, their fast channel, slow channel and status bit
mapping can be found in the tables below.
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ERROR_ENABLE
parameter
FC_CFG = 0
FC_CFG = 1
FC_CFG = 2
FC_CFG = 3
ERROR
FC1
FC2
St[0]
St[1]
FC1
FC2
St[0]
St[1]
FC1
FC2
St[0]
St[1]
FC1
FC2
St[0]
St[1]
0
0
P
Tmed
0
0
P
Tint
0
0
N.A.
no error
P
~P
0
0
P
cnt &
~MSN(P)
-
not calibrated
4095
4095
1
1
4095
nc
1
nc
4095
4095
1
1
4095
4095
1
1
DIAG_INT
initialization error
4090
4090
1
1
4090
nc
1
nc
4090
4090
1
1
4090
4090
1
1
ERR_EN_TINT
T_INT
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
4090
nc
1
ERR_EN_IO
RAM_IO_CFG
4090
4090
1
1
4090
nc
1
nc
4090
4090
1
1
4090
4090
1
1
ERR_EN_SPSN
SPSN
4090
4090
1
1
4090
nc
1
nc
4090
nc
1
nc
4090
nc
1
nc
ERR_EN_PV
PRESS
4090
4090
1
1
4090
nc
1
nc
4090
nc
1
nc
4090
nc
1
nc
ERR_EN_PP
PRESS_PAR
4090
4090
1
1
4090
nc
1
nc
4090
nc
1
nc
4090
nc
1
nc
ERR_EN_BW
PRESS_BROKEN_W
4090
4090
1
1
4090
nc
1
nc
4090
nc
1
nc
4090
nc
1
nc
ERR_EN_TMED
T_MED
nc
nc
nc
nc
nc
nc
nc
nc
nc
4090
nc
1
nc
nc
nc
nc
ERR_EN_TCHIP
T_CHIP
ERR_TCHIP
ERR_TCHIP
1
1
ERR_TCHIP
nc
1
nc
ERR_TCHIP
ERR_TCHIP
1
1
ERR_TCHIP
ERR_TCHIP
1
1
ERR_EN_VSUPH
VSUP_HIGH
ERR_VSUP
ERR_VSUP
1
1
ERR_VSUP
nc
1
nc
ERR_VSUP
ERR_VSUP
1
1
ERR_VSUP
ERR_VSUP
1
1
ERR_EN_VSUPL
VSUP_LOW
ERR_VSUP
ERR_VSUP
1
1
ERR_VSUP
nc
1
nc
ERR_VSUP
ERR_VSUP
1
1
ERR_VSUP
ERR_VSUP
1
1
DIAG_P1
P @ FC1 =
1
nc
1
nc
1
nc
1
nc
1
nc
1
nc
1
nc
1
nc
DIAG_P1
P @ FC1 =
4088
nc
1
nc
4088
nc
1
nc
4088
nc
1
nc
4088
nc
1
nc
DIAG_P2
P @ FC1 =
< Y1
nc
nc
nc
< Y1
nc
nc
nc
< Y1
nc
nc
nc
< Y1
nc
nc
nc
DIAG_P2
P @ FC1 =
>Y2
nc
nc
nc
>Y2
nc
nc
nc
>Y2
nc
nc
nc
>Y2
nc
nc
nc
DIAG_T1
T @ FC2 =
nc
1
nc
1
nc
1
nc
1
DIAG_T1
T @ FC2 =
nc
4088
nc
1
nc
4088
nc
1
DIAG_T2
T @ FC2 =
nc
=2266
nc
1
Table 19: Diagnostics in fast channel configuration 0 - 3
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ERROR_ENABLE
parameter
FC_CFG = 4
FC_CFG = 5
FC_CFG = 6
FC1
St[0]
FC1
St[0]
FC1
FC2
FC_CFG = 7
ERROR
St[0]
St[1]
FC1
St[0]
St[1]
N.A.
no error
P (3x 4b)
0
P (4x 3b)
0
[fc0_ptr]
[fc1_ptr]
0
0
P
0
0
0
-
not calibrated
4095
1
4095
1
nc
nc
nc
nc
4095
nc
1
nc
DIAG_INT
initialization error
4090
1
4090
1
nc
nc
nc
nc
4090
nc
1
nc
ERR_EN_TINT
T_INT
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
ERR_EN_IO
RAM_IO_CFG
4090
1
4090
1
nc
nc
nc
nc
4090
nc
1
nc
ERR_EN_SPSN
SPSN
4090
1
4090
1
nc
nc
nc
nc
4090
nc
1
nc
ERR_EN_PV
PRESS
4090
1
4090
1
nc
nc
nc
nc
4090
nc
1
nc
ERR_EN_PP
PRESS_PAR
4090
1
4090
1
nc
nc
nc
nc
4090
nc
1
nc
ERR_EN_BW
PRESS_BROKEN_W
4090
1
4090
1
nc
nc
nc
nc
4090
nc
1
nc
ERR_EN_TMED
T_MED
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
ERR_EN_TCHIP
T_CHIP
ERR_TCHIP
1
ERR_TCHIP
1
nc
nc
nc
nc
ERR_TCHIP
nc
1
nc
ERR_EN_VSUPH
VSUP_HIGH
ERR_VSUP
1
ERR_VSUP
1
nc
nc
nc
nc
ERR_VSUP
nc
1
nc
ERR_EN_VSUPL
VSUP_LOW
ERR_VSUP
1
ERR_VSUP
1
nc
nc
nc
nc
ERR_VSUP
nc
1
nc
DIAG_P1
P @ FC1 =
1
1
1
1
nc
nc
1
nc
1
nc
1
nc
DIAG_P1
P @ FC1 =
4088
1
4088
1
nc
nc
1
nc
4088
nc
1
nc
DIAG_P2
P @ FC1 =
< Y1
nc
< Y1
nc
nc
nc
nc
nc
< Y1
nc
nc
nc
DIAG_P2
P @ FC1 =
>Y2
nc
>Y2
nc
nc
nc
nc
nc
>Y2
nc
nc
nc
DIAG_T1
T @ FC2 =
nc
nc
nc
nc
DIAG_T1
T @ FC2 =
nc
nc
nc
nc
DIAG_T2
T @ FC2 =
nc
nc
nc
nc
DIAG_T2
T @ FC2 =
nc
nc
nc
nc
Table 20: Diagnostics in fast channel configuration 4 - 7
REVISION 002 – 22 DECEMBER 2017
3901090329
FC2
Page 24 of 31
MLX90329
Automotive Sensor Interfaces
ERROR_ENABLE
parameter
ERROR
N.A.
no error
-
not calibrated
DIAG_INT
initialization error
ERR_EN_TINT
T_INT
A05h if DIAG_INT=1, else set bit 11 & 10
ERR_EN_IO
RAM_IO_CFG
A05h if DIAG_INT=1, else set bit 11 & 9
ERR_EN_SPSN
SPSN
A05h if DIAG_INT=1, else set bit 11 & 8
ERR_EN_PV
PRESS
A05h if DIAG_INT=1, else set bit 11 & 7
ERR_EN_PP
PRESS_PAR
A05h if DIAG_INT=1, else set bit 11 & 6
ERR_EN_BW
PRESS_BROKEN_W
A05h if DIAG_INT=1, else set bit 11 & 5
ERR_EN_TMED
T_MED
A05h if DIAG_INT=1, else set bit 11 & 4
ERR_EN_TCHIP
T_CHIP
A05h if DIAG_INT=1, else set bit 11 & 0
ERR_EN_VSUPH
VSUP_HIGH
ERR_EN_VSUPL
VSUP_LOW
DIAG_P1
P @ FC1 =
002h if DIAG_PCL = 0 / 812h if DIAG_PCL = 1
DIAG_P1
P @ FC1 =
001h if DIAG_PCL = 0 / 811h if DIAG_PCL = 1
DIAG_P2
P @ FC1 =
002h
DIAG_P2
P @ FC1 =
001h
DIAG_T1
T @ FC2 =
005h
DIAG_T1
T @ FC2 =
004h
DIAG_T2
T @ FC2 =
805h (Remark: value 186 matches with -50 degC)
DIAG_T2
T @ FC2 =
804h (Remark: value 2266 matches with +210 degC)
Slow channel diagnostic
000h
nc = no change
003h (only once when reinit passes after reset)
(Remark: in contrary to the other errors, DIAG_INT is used here to enable/disable the complete check and not only the
customized slow channel error reporting)
021h / 901h if DIAG_VSUP = 0 / 1, but set bit 11 & 2 if also other errors are reported in the fast channel
and if DIAG_INT=0 (if DIAG_INT=1 and other errors, then A05h)
020h / 900h if DIAG_VSUP = 0 / 1, but set bit 11 & 1 if also other errors are reported in the fast channel
and if DIAG_INT=0 (if DIAG_INT=1 and other errors, then A05h)
Table 21: Diagnostics in slow channel
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Multiple diagnostic errors can be flagged in the range 8xxh – FFFh in case parameter DIAG_INT is set to 0.
The level of the over and under voltage diagnostics can be configured according to the ranges described in Table
22.
Parameter
Under voltage detection
threshold range
Overvoltage detection
threshold range
Over-/Under-voltage
detection accuracy
Min
Max
Units
3.25
5.74
V
4.25
6.74
V
200
mV
Comment
Optional and Programmable
with 8 bits in parameter
VSUP_LOW
Optional and
Programmable with 8 bits in
parameter VSUP_HIGH
Table 22: MLX90818 under and overvoltage detection
18. Timings
Parameter
SENT frame period
Symbol
tframe
Start-up time
(to first falling edge)
Start-up time
(up to first data
received)
tsu1
tsu2
Comment
Shortest message (without pause
pulse) and longest message
(pause pulse enabled).
Example in µs calculated using a
3µs tick time.
Based on default settings.
Min
154
462
Typ
0.7
1
Max
282
846(9)
1.1
Unit
ticks
µs
ms
1.946(9) ms
First SENT frame contains valid
pressure data. Calculation based
on 3µs tick time.
Table 23: Start-up timings
tsu2
tsu1
OUT
tframe
Data
Data
Data
VDD
Figure 7: Start-up timings
9
Using nominal tick time, excluding tick time variations.
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19. Unique features
Thanks to its state of the art mixed signal chain, the MLX90329 offers the possibility to calibrate several types of
resistive Wheatstone bridge technologies allowing the MLX90329 users to reach an outstanding overall sensor
accuracy. The MLX90329 is robust for harsh automotive environments like large temperature range, overvoltage
conditions and external EMC disturbances.
The MLX90329 allows the compensation of sensor nonlinear variations over temperature as well as compensates
for the sensor pressure signal non linearity. Several parameters can be programmed through the application pins
in the MLX90329 to set clamping levels or filter settings to choose for the best trade-off between signal chain
noise and speed. The MLX90329 can also diagnose several error conditions like sensor connections errors.
The sensor bias Vbrg which is supplying the external pressure sensor is generated using a regulator. The target
sensor supply is 6/7VDDA or typically 3V. The current through the bridge resistance is mirrored and divided so
that it can be fed to an IV convertor. This IV converted signal is a measure for the external temperature so that it
can be used for the calibration of the pressure sensor.
MLX90329 can interface an external NTC and provide the linearized temperature information together with the
pressure signal on the SENT output. This NTC is factory calibrated by Melexis.
DSP
6/7 VDDA
Piezoresistive
sensing element
Sensor bias
Off chip temperature
sensor current output
Divided bridge
current
IV conversion
Gain & Offset
Temperature
Compensation
Overvoltage &
reverse voltage
protection
Voltage regulator
POR
On chip temperature
sensor
SENT
driver
Pressure Linearization
Vbrg
Vext
PGA
InP
OPA
M
U
X
Vana
Programmable Filter
ADC
Temperature conditioning
16 bits
Slew
rate
control
SENT
Output
Rom
InN
NTC
Vsupply
SE1, SE2, VEXT
EEPROM
NTC interface
and linearization
N
T
C
Test
Oscillator
Ram
Test
Gnd
Figure 8: MLX90329 Block Diagram
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20. Application Information
The MLX90329 only needs 2 capacitors in the application. A 100nF decoupling capacitor connected between the
supply line and the ground a 2.2nF load between the SENT output pin and the ground.
Optionally an NTC can be connected to pin 7. It is recommended to place a 10nF capacitor in parallel with the
NTC to improve EMC performance. In case no NTC is used, pin 7 has to be connected to GND.
MLX90329 has built in EMC protection for the sensor supply and sensing element input pins. Therefore it is
advised not to place any external capacitors between the sensing element and the interface. Capacitors on the
sensor supply or the inputs can even disturb the normal operation of the interface.
These recommendations for external components are however only providing a basic protection. Depending on
the module design and the EMC requirements different configurations can be needed.
Piezoresistive
sensing element
100nF
2.2nF
MLX90329
GND
VDD
OUT
N
T
C
10nF
NTC optional
If not used,
connect pin 7
to GND
Figure 9: MLX90329 basic application schematic
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Automotive Sensor Interfaces
21. Standard information regarding manufacturability of Melexis products
with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed
upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the
use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
22. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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Automotive Sensor Interfaces
23. Package Information
Figure 10: Package drawing
Package dimensions in mm
N
A
A1
min
1.52
0.10
8
max
1.73
0.25
A2
1.37
1.57
D
4.80
4.98
E
3.91
3.99
H
5.80
6.20
L
0.41
1.27
b
0.35
0.49
c
0.19
0.25
e
1.27
BSC
h
0.25
0.50
0°
8°
Package dimensions in inch
N
A
A1
min
.060
.004
8
max
.068
.010
A2
.054
.062
D
.189
.196
E
.150
.157
H
.228
.244
L
.016
.050
b
.014
.019
c
.008
.010
e
.050
BSC
h
.010
.020
0°
8°
Table 24: Package dimensions in mm and inch
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24. Contact
For the latest version of this document, go to our website at www.melexis.com.
For additional information, please contact our Direct Sales team and get help for your specific
needs:
Europe, Africa
Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas
Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
25. Disclaimer
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection
with or arising out of the furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability,
including without limitation, special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description,
including warranties of fitness for particular purpose, non-infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’
rendering of technical or other services.
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders
and/or prior to designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the
information being relied upon is current.
Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine
whether it is fit for a particular purpose.
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant,
explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights.
This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from
competent authorities.
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized
or warranted to be suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications,
such as medical life-support or life-sustaining equipment are specifically not recommended by Melexis.
The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation,
maintenance, storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or
storage of missiles for such weapons: 2) civil firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for
military use or for law enforcement; 4) any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to
persons or goods and that can be used as a means of violence in an armed conflict or any similar violent situation.
The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found
at https://www.melexis.com/en/legal/terms-and-conditions.
This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)
ISO/TS 16949 and ISO14001 Certified
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