MLX90340EDC-AAA-300-SP

MLX90340 Datasheet 1. Features and Benefits position sensors that are frequently required for both heavy-duty and industrial applications. Triaxis Hall Technology On Chip Signal Processing for Robust Absolute Position Sensing Programmable Measurement Range Programmable Linear Transfer Characteristic (Multi-points 4 or PieceWise-Linear 17) The MLX90340 reports a programmable ratiometric analog output signal compatible with a programmable linear Hall sensor. Through programming, the MLX90340 provides also a digital PWM (Pulse Width Modulation) output characteristic. Selectable Analog (Ratiometric) or PWM Output VDIG Prot. Reg DSP Tria xis® VX VY VZ RAM M UX 12 bit Resolution - 10 bit Thermal Accuracy VDD G ADC EEPROM Output Stage 12 bit Analog µC OUT 12 bit PW M 48 bit ID Number option ROM - Firmware Single Die – SOIC-8 Package RoHS Compliant Dual Die (Full Redundant) – TSSOP-16 Package RoHS Compliant 2. Application Examples Absolute Rotary Position Sensor Absolute Linear Position Sensor Non-Contacting Potentiometer 3. Description The MLX90340 is a monolithic sensor IC sensitive to the flux density applied orthogonally and parallel to the IC surface. The MLX90340 is sensitive to the three components of the flux density applied to the IC (i.e. Bx, By and Bz). This allows the MLX90340 with the correct magnetic circuit to decode the absolute position of any moving magnet (e.g. rotary position from 0 to 360 Degrees or linear displacement, stroke - Figure 2). It enables the design of novel generation of non-contacting REVISION 2-31AUG2020 [3901090340] VSS MLX90340 Datasheet Contents 1. Features and Benefits ................................................................ ................................................................................................ ............................................................................................ ............................................................ 1 2. Application Examples................................................................ ................................................................................................ ............................................................................................. ............................................................. 1 3. Description ................................................................ ................................................................................................ ................................................................................................ ............................................................................ ............................................ 1 4. Ordering Information ................................................................ ................................................................................................ ............................................................................................ ............................................................ 4 5. Functional Diagram ................................................................ ................................................................................................ ............................................................................................... ............................................................... 5 6. Glossary of Terms ................................................................ ................................................................................................ ................................................................................................ .................................................................. .................................. 6 7. Pin Definitions and Descriptions ................................................................ ................................................................................................ ............................................................................ ............................................ 7 7.1. Pin Definition for SOIC-8..................................................................................................................... 7 7.2. Pin Definition for TSSOP-16 ................................................................................................................ 8 8. Absolute Maximum Ratings ................................................................ ................................................................................................ ................................................................................... ................................................... 9 9. Detailed General Description................................................................ ................................................................................................ ................................................................................. ................................................. 9 10. General Electrical Specifications ................................................................ ................................................................................................ ........................................................................ ........................................ 10 11. Isolation Specification................................................................ ................................................................................................ ........................................................................................ ........................................................ 12 12. Timing Specification................................ Specification................................................................ ................................................................................................ ........................................................................................... ........................................................... 13 12.1. Latency time Definition .................................................................................................................. 13 12.2. Step Response Definition ............................................................................................................... 14 13. Accuracy ................................................................ ................................................................................................ ................................................................................................ ............................................................................ ............................................ 15 14. Magnetic Specification ................................................................ ................................................................................................ ...................................................................................... ...................................................... 16 15. CPU & Memory Specification................................................................ ................................................................................................ ............................................................................. ............................................. 17 16. EndEnd-User User Programmable Items................................................................ ................................................................................................ .......................................................................... .......................................... 17 17. Description of EndEnd-User Programmable Items................................................................ ................................................................................... ................................................... 19 17.1. Output mode................................................................................................................................... 19 17.1.1. Analog Output mode ................................................................................................................ 19 17.1.2. PWM Output mode .................................................................................................................. 19 17.2. Output Transfer Characteristic ...................................................................................................... 19 17.2.1. Enable Scaling Parameter......................................................................................................... 20 17.2.2. Clockwise parameter ................................................................................................................ 20 17.2.3. Discontinuity point (or Zero degree point) ............................................................................. 21 17.2.4. 4-Pts LNR Parameters ............................................................................................................... 21 17.2.5. 17-Pts LNR Parameters ............................................................................................................. 22 17.2.6. CLAMPING Parameters............................................................................................................. 23 REVISION 2-31AUG2020 [3901090340] Page 2 of 42 MLX90340 Datasheet 17.3. Identification ................................................................................................................................... 23 17.4. Sensor Front-End ............................................................................................................................ 24 17.4.1. MAPXYZ ..................................................................................................................................... 24 17.4.2. K parameter .............................................................................................................................. 24 17.4.3. GAINMIN and GAINMAX Parameters ...................................................................................... 25 17.5. Filter ................................................................................................................................................ 25 17.6. Programmable Diagnostic Settings ................................................................................................ 26 17.6.1. Fixed-level diagnostic reporting............................................................................................... 26 17.6.2. HAMHOLE Parameter ............................................................................................................... 27 17.7. Lock.................................................................................................................................................. 27 17.8. EEPROM endurance........................................................................................................................ 28 18. Self Diagnostic ................................................................ ................................................................................................ ................................................................................................ ................................................................... ................................... 28 19. Recommended Application Diagrams ................................................................ ................................................................................................ ................................................................ 31 19.1. MLX90340 in SOIC-8 Package ........................................................................................................ 31 19.2. MLX90340 in TSSOP-16 Package.................................................................................................... 32 20. Standard information regarding manufacturability manufacturability of Melexis products with different soldering processes................................................................ ................................................................................................ ................................................................................................ ............................................................................ ............................................ 33 21. ESD Precautions................................................................ ................................................................................................ ................................................................................................ ................................................................. ................................. 34 22. Package Information................................................................ ................................................................................................ .......................................................................................... .......................................................... 34 22.1. SOIC-8 - Package Dimensions ......................................................................................................... 34 22.2. SOIC-8 - Pinout and Marking .......................................................................................................... 35 22.3. SOIC-8 - Sensitive spot Positioning ................................................................................................ 35 22.4. TSSOP16 - Package Dimensions ..................................................................................................... 37 22.5. TSSOP16 - Pinout and Marking ...................................................................................................... 38 22.6. TSSOP16 - Sensitive spot Positioning............................................................................................. 38 23. Disclaimer ................................................................ ................................................................................................ ................................................................................................ .......................................................................... .......................................... 40 24. Contacts ................................................................ ................................................................................................ ................................................................................................ ............................................................................ ............................................ 42 REVISION 2-31AUG2020 [3901090340] Page 3 of 42 MLX90340 Datasheet 4. Ordering Information Product Temp. code Package code Option Code Packing Form Definition MLX90340 L GO AAA-000 RE Standard version – Heavy-duty MLX90340 L DC AAA-000 RE Standard version – Heavy-duty MLX90340 E GO AAA-000 RE Standard version – Industrial MLX90340 E DC AAA-000 RE Standard version - Industrial MLX90340 E DC AAA-100 RE 90deg Pre-programmed analog - Industrial MLX90340 E DC AAA-200 RE 360deg Pre-programmed analog - Industrial MLX90340 E DC AAA-300 RE 180deg Pre-programmed analog - Industrial MLX90340 E DC AAA-400 RE 270deg Pre-programmed analog - Industrial MLX90340 S DC AAA-000 RE Standard version - Consumer MLX90340 S DC AAA-100 RE 90deg Pre-programmed analog - Consumer MLX90340 S DC AAA-200 RE 360deg Pre-programmed analog - Consumer MLX90340 S DC AAA-300 RE 180deg Pre-programmed analog - Consumer MLX90340 S DC AAA-400 RE 270deg Pre-programmed analog - Consumer Legend: Temperature Code: L: from -40°C to 150°C E: from -40°C to 85°C S: from -20°C to 85°C Package Code: “DC” for SOIC-8 package Option Code: AAA-xxx: die Version xxx-123 1: Application 0: Standard version 1: Pre-programmed version in Analog output mode – Transfer function of 80%Vdd /90deg 2: Pre-programmed version in Analog output mode – Transfer function of 80%Vdd /360deg 3: Pre-programmed version in Analog output mode – Transfer function of 80%Vdd /180deg 4: Pre-programmed version in Analog output mode – Transfer function of 80%Vdd /270deg 2: N/A 3: N/A Packing Form: RE “for Reel”, TU “for Tube”, Ordering Example: “MLX90340EDC-AAA-000-RE” For a Standard version from -40 to 85degC in SOIC-8 package, delivered in Reel. “GO” for TSSOP-16 package (dual die) Table 1: Ordering information Legend REVISION 2-31AUG2020 [3901090340] Page 4 of 42 MLX90340 Datasheet 5. Functional Diagram VDD VDIG Prot. Reg DSP Triaxis VX VY VZ RAM MUX ® G EEPROM Output Stage 12 bit Analog ADC µC OUT 12 bit PWM ROM - Firmware VSS Figure 1: Block diagram Angle XY, Angle XZ, Angle YZ θ = arctan( Bi ) Bj Figure 2: Application examples REVISION 2-31AUG2020 [3901090340] Page 5 of 42 MLX90340 Datasheet 6. Glossary of Terms Gauss (G), Tesla (T) Units for the magnetic flux density − 1 mT = 10 G TC Temperature Coefficient (in ppm/Deg.C.) NC Not Connected PWM Pulse Width Modulation %DC Duty Cycle of the output signal i.e. TON /(TON + TOFF) ADC Analog-to-Digital Converter DAC Digital-to-Analog Converter LSB Least Significant Bit MSB Most Significant Bit DNL Differential Non-Linearity INL Integral Non-Linearity RISC Reduced Instruction Set Computer ASP Analog Signal Processing DSP Digital Signal Processing CoRDiC Coordinate Rotation Digital Computer (i.e. iterative rectangular-to-polar transform) EMC Electro-Magnetic Compatibility DLS Digital Low Speed DHS Digital High Speed Table 2: Glossary REVISION 2-31AUG2020 [3901090340] Page 6 of 42 MLX90340 Datasheet 7. Pin Definitions and Descriptions 7.1. Pin Definition for SOICSOIC-8 Pin # Name Description 1 VDD Supply 2 Test Input For test 3 Test For test 4 Not Used 5 OUT Output 6 Test1 Test pin 7 VDIG 3.3V Regulator pin 8 Vss Ground pin Table 3: SOIC-8 Pinout For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the Ground REVISION 2-31AUG2020 [3901090340] Page 7 of 42 MLX90340 Datasheet 7.2. Pin Definition for TSSOPTSSOP-16 Pin # Name Description 1 VDIG1 3.3V Regulator pin 2 VSS_1 Ground Die 1 3 VDD_1 Supply Die1 4 Test0_1 For test 5 Test2_2 For test 6 OUT2 Output Die 2 7 Not Used2 8 Test1_2 For test 9 VDIG2 3.3V Regulator pin 10 VSS_2 Ground Die 2 11 VDD_2 Supply Die 2 12 Test0_2 For test 13 Test2_1 For test 14 Not Used1 15 OUT1 Output 16 Test1_1 For test Table 4: TSSOP-16 Pinout For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the Ground REVISION 2-31AUG2020 [3901090340] Page 8 of 42 MLX90340 Datasheet 8. Absolute Maximum Ratings Parameter Supply Voltage Reverse Voltage Protection Positive Output Voltage Symbol Min. Typ. Condition VDD 24 V VDD-REV -12 V Independent of time, Breakdown at -14V VOUT 18 V Independent of time, Breakdown at 24V -0.3 V +150 °C 160 °C -40 +150 °C -1 1 T Reverse Output Voltage Operating Temperature TAMB Junction Temperature TJUNC Storage Temperature TST Magnetic Flux Density Max. Unit -40 Table 5 – Maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximumrated conditions for extended periods may affect device reliability. 9. Detailed General Description As described on the block diagram the three vector components of the magnetic flux density (BX, BY and BZ) applied to the IC are sensed through the sensor front-end. The respective Hall signals (VX, VY and VZ) are generated at the Hall plates and amplified. The analog signal processing is based on a fully differential analog chain featuring the classic offset cancellation technique (Hall plate 2-Phases spinning and chopper-stabilized amplifier). The conditioned analog signals are converted through an ADC (15 bits) and provided to a DSP block for further processing. The DSP stage is based on a 16 bit RISC micro-controller whose primary function is the extraction of the position from two (out of three) raw signals (after so-called front-end compensation steps) through the following function: α = ∠(V1 , k × V2 ) Figure 3: Angular calculation formula where alpha is the magnetic angle GAINMAX) ADC Monitor (Analog to Digital Converter) REVISION 2-31AUG2020 [3901090340] Set Outputs in Diagnostic low/high Normal mode and CPU Reset If recovery Set Outputs in Diagnostic low/high Normal mode and CPU Reset If recovery Set Outputs in Diagnostic low/high Normal mode, with immediate recovery without CPU reset Set Outputs in Diagnostic low/high Normal mode, and CPU Reset If recovery Set Outputs in Diagnostic low/high. Normal Mode with immediate recovery without CPU Reset Immediate Diagnostic low/high(19) Immediate Diagnostic low/high(19) If no magnet IC in Diag. mode. Immediate Diagnostic low/high(19) Immediate Diagnostic low/high(19) See also Section GAINMIN and GAINMAX. Immediate Diagnostic low/high(19) ADC Inputs are Shorted and connected to Vref. ADC output is compared to a fixed value. Page 29 of 42 MLX90340 Datasheet Undervoltage Mode Action Effects on OUT At Start-Up, wait Until VDD > LT4V. - VDD < POR level => Output high impedance During operation, CPU Reset after 3 ms debouncing. Comments - POR level < VDD < ~LT4V => Output in Diagnostic low/high(7). Immediate Diagnostic low/high(19) Intelligent Watchdog (Observer) Immediate Diagnostic low/high(19) 100% Hardware detection Immediate Diagnostic low/high(19) 100% Hardware detection Immediate Diagnostic low/high(19) 100% Hardware detection Set Output High Impedance (Analog) Pull down resistive load => Diag. Low Pull up resistive load => Diag. High 100% Hardware detection VDD > LT11V IC is switched off (internal supply) CPU Reset on recovery Pull down resistive load => Diag. Low Pull up resistive load => Diag. High 100% Hardware detection Broken VSS CPU Reset on recovery 100% Hardware detection Broken VDD CPU Reset on recovery Pull down resistive load < 10kΩ => Diag. Low Pull up resistive load (any value) => Diag. High Pull down resistive load (any value) => Diag. Low Firmware Flow Error CPU Reset Read/Write Access out of physical memory CPU Reset Write Access to protected area (IO and RAM Words) CPU Reset Unauthorized entry in “SYSTEM” Mode CPU Reset VDD > MT7V 100% Hardware detection Pull up resistive load < 10kΩ => Diag. High 7 The diagnostics can be selectable between Diagnostic Low/Diagnostic High by setting the bits EE_DIAG and EE_ADIAG (for analog modes only). See section Programmable Diagnostic Settings for the Diagnostic Output Level specifications. REVISION 2-31AUG2020 [3901090340] Page 30 of 42 MLX90340 Datasheet Temperature Monitor Action Effects on OUT Comments Set Outputs in Diagnostic low/high. Immediate Diagnostic low/high(19) Temperature Sensor 1 is compared to temperature sensor 2 Normal Mode with immediate recovery without CPU Reset Table 25: Diagnostics details 19. Recommended Application Diagrams 19.1. MLX90340 in SOICSOIC-8 Package R1 VDD 1 VDD C4 MLX90340 C1 8 GND C5 2, 3, 4, 6 VSS Test x Out VDIG C2 5 Output 7 R2 C3 Figure 11 –Recommended wiring for the MLX90340 in SOIC-8 package Output Compact PCB routing EMC robust PCB routing Analog Output Min Typ. Max Min Typ. Max Remarks C1 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin C2 (20) 47 nF 100 nF 330 nF 47 nF 100 nF 330 nF Close to the pin C3 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin C4 - - - 500 pF 1 nF 10 nF Connector Side C5 - - - 500 pF 1 nF 10 nF Connector Side R1 - - - 0Ω 10 Ω 33 Ω Increased ratiometry error R2 - - - 10 Ω 50 Ω 100 Ω Figure 12 – Analog Ouptut mode - Recommended capacitor/resistor values for the MLX90340 in SOIC-8 package REVISION 2-31AUG2020 [3901090340] Page 31 of 42 MLX90340 Datasheet Output Compact PCB routing EMC robust PCB routing PWM Output Min Typ. Max Min Typ. Max Remarks C1 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin C2 2.2 nF 4.7 nF 22 nF 2.2 nF 4.7 nF 22 nF Close to the pin C3 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin C4 - - - 500 pF 1 nF 10 nF Connector Side C5 - - - 500 pF 1 nF 2.2 nF Connector Side R1 - - - 0Ω 10 Ω 33 Ω Impacts the Voltage on VDD pin R2 - - - 10 Ω 50 Ω 100 Ω Figure 13 – Analog Ouptut mode - Recommended capacitor/resistor values for the MLX90340 in SOIC-8 package 19.2. MLX9034 MLX90340 in TSSOPTSSOP-16 Package R 11 VDD 1 3 V DD 1 C 14 MLX90340 C 11 4,13,16,14 2 GND 1 C 15 V SS 1 Test x 1 Out1 V DIG 1 C 12 1 15 Output 1 C13 R 12 R 21 VDD 2 11 V DD 2 C 24 C 21 10 GND 2 C 25 5,7,8,12 V SS 2 Test x 2 Out2 V DIG 2 C 22 6 Output 2 R 22 9 C23 Figure 14 –Recommended wiring for the MLX90340 in TSSOP16 package (dual die) REVISION 2-31AUG2020 [3901090340] Page 32 of 42 MLX90340 Datasheet Output Compact PCB routing EMC robust PCB routing Analog Output Min Typ. Max Min Typ. Max Remarks C11, C21 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin C12, C22 47 nF 100 nF 330 nF 47 nF 100 nF 330 nF Close to the pin C13, C23 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin C14, C24 - - - 500 pF 1 nF 10 nF Connector Side C15, C25 - - - 500 pF 1 nF 10 nF Connector Side R11, R21 - - - 0Ω 10 Ω 33 Ω Increased ratiometry error R12, R22 - - - 10 Ω 50 Ω 100 Ω Output Compact PCB routing EMC robust PCB routing PWM Output Min Typ. Max Min Typ. Max Remarks C11, C21 100 nF 100 nF 1 uF 47 nF 100 nF 1 uF Close to the pin C12, C22 22 nF 4.7 nF 22 nF 2.2 nF 4.7 nF 22 nF Close to the pin C13, C23 47 nF 100 nF 220 nF 47 nF 100 nF 220 nF Close to the pin C14, C24 - - - 500 pF 1 nF 10 nF Connector Side C15, C25 - - - 500 pF 1 nF 2.2 nF Connector Side R11, R21 - - - 0Ω 10 Ω 33 Ω Impacts the Voltage on VDD pin R12, R22 - - - 10 Ω 50 Ω 100 Ω 20. Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. For further details about test method references and for compliance verification of selected soldering method for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/en/quality-environment/soldering). For all soldering technologies deviating from the one mentioned in above document (regarding peak temperature, temperature gradient, temperature profile etc), additional classification and qualification tests have to be agreed upon with Melexis. REVISION 2-31AUG2020 [3901090340] Page 33 of 42 MLX90340 Datasheet For package technology embedding trim and form post-delivery capability, Melexis recommends consulting the dedicated trim&forming recommendation application note: lead trimming and forming recommendations (http://www.melexis.com/en/documents/documentation/application-notes/lead-trimming-andforming-recommendations). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment 21. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 22. Package Information 22.1. SOICSOIC-8 - Package Dimensions Figure 15 REVISION 2-31AUG2020 [3901090340] Page 34 of 42 MLX90340 Datasheet 22.2. SOICSOIC-8 - Pinout and Marking Part Number MLX90340 (3 digits) Die Version (3 digits) Out Test1 VDIG VSS Marking : 8 5 Top 340Axx 123456 Xy-E 123456 Xy-E Bottom 4 Test2 Test0 YY Axx Lot number: 6 digits Split lot number (opt.) +”-E” WW Week Date code (2 digits) Year Date code (2 digits) Not Used 1 VDD 340 Figure 16 22.3. SOICSOIC-8 - Sensitive spot Positioning CW 8 7 6 5 CCW X 1.25 1.65 1 2 3 0.46 +/- 0.06 4 1.96 2.26 Y Figure 17 REVISION 2-31AUG2020 [3901090340] Page 35 of 42 MLX90340 Datasheet Angle detection MLX90340 SOIC-8 ~ 0 Deg.* S 1 2 6 5 8 7 4 1 2 N 7 3 ~ 180 Deg.* N 1 2 6 3 S3 4 ~ 270 Deg.* 5 8 7 4 1 2 S 7 5 6 5 N3 4 S 8 6 N 8 ~ 90 Deg.* * No absolute reference for the angular information. Figure 18 The MLX90340 is an absolute angular position sensor but the linearity error (See section 13) does not include the error linked to the absolute reference 0 Deg (which can be fixed in the application through the discontinuity point). REVISION 2-31AUG2020 [3901090340] Page 36 of 42 MLX90340 Datasheet 22.4. TSSOP16 - Package Dimensions Figure 19 REVISION 2-31AUG2020 [3901090340] Page 37 of 42 MLX90340 Datasheet 22.5. TSSOP16 - Pinout and Marking 16 1 V DIG1 Test1 1 VSS 1 Out1 VDD 1 Not Used1 340Axx 123456 Xy-E Test0 1 Test2 2 Test2 1 Test0 2 OUT2 VDD2 Not Used 2 VSS 2 Marking : Part Number MLX90340 (3 digits) Die Version (3 digits) 9 8 Test1 2 VDIG2 340 Axx Top 123456 Lot number: 6 digits + “-E” Bottom YY WW Week Date code (2 digits) Year Date code (2 digits) Figure 20 22.6. TSSOP16 TSSOP16 - Sensitive spot Positioning CW X2 16 9 Die 1 Die 2 Y2 Y1 0.30 +/- 0.06 CCW 1.95 2.45 1 8 1.84 2.04 X1 2.76 2.96 Figure 21 REVISION 2-31AUG2020 [3901090340] Page 38 of 42 MLX90340 Datasheet Angle detection MLX90340 TSSOP-16 ~ 0 Deg.* ~ 180 Deg.* 9 16 Die 1 ~ 90 Deg.*~ 270 Deg.* Die 2 Die 1 N S 8 ~ 180 Deg.*~ 0 Deg.* 9 16 1 S N Die 2 N S 1 Die 1 9 16 1 8 ~ 270 Deg.* ~ 90 Deg.* 9 16 Die 2 Die 1 Die 2 S N 8 1 8 * No absolute reference for the angular information. Figure 22 The MLX90340 is an absolute angular position sensor but the linearity error (See section 13) does not include the error linked to the absolute reference 0Deg (which can be fixed in the application through the discontinuity point). REVISION 2-31AUG2020 [3901090340] Page 39 of 42 MLX90340 Datasheet 23. Disclaimer The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. This documentation is in fact provided without warranty, term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability, satisfactory quality, noninfringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees and agents will not be responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the foregoing, contractual obligations expressly undertaken in writing by Melexis prevail over this disclaimer. 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This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject to the exclusive jurisdiction of the courts of Brussels, Belgium. REVISION 2-31AUG2020 [3901090340] Page 40 of 42 MLX90340 Datasheet The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other provisions. The previous versions of this document are repealed. Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2020) IATF 16949 and ISO 14001 Certified REVISION 2-31AUG2020 [3901090340] Page 41 of 42 MLX90340 Datasheet 24. Contacts For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our direct sales team and get help for your specific needs: Europe, Africa Telephone:+32 13 67 04 95 Email: sales_europe@melexis.com Americas Telephone:+ 1 603 223 2362 Email: sales_usa@melexis.com Asia REVISION 2-31AUG2020 [3901090340] Email: sales_asia@melexis.com Page 42 of 42