MLX90371GDC-BCC-300-SP

MLX90371 – Triaxis® Position Processor Datasheet Features and Benefits Hall Technology          On-Chip Signal Processing for Robust Absolute Position Sensing ISO26262 ASIL-B Safety Element out-of-Context Programmable Measurement Range Programmable Linear Transfer Characteristic (Multi-points 4 or 8 points or Piece-WiseLinear 16 or 32 segments) Selectable Analog (Ratiometric) or PWM Output 12 bit Resolution - 10 bit Thermal Accuracy 48 bit ID Number option Robustness against Stray-Field Description The MLX90371 is a monolithic sensor sensitive to the three components of the flux density applied to the IC (i.e. BX, BY and BZ). This allows the MLX90371 with the correct magnetic circuit to decode the absolute position of any magnet moving in its vicinity (e.g. rotary position from 0 to 360 Degrees or linear displacement, see Figure 2). The MLX90371 reports a programmable ratiometric analog output signal compatible with any resistive potentiometer or programmable linear Hall sensor. Through programming, the MLX90371 can provide a digital PWM (Pulse Width Modulation) output characteristic. TEST INPUT Test Access VDD VDEC Regulator Rev. Pol & Overvolt Prot. DSP RAM G SOIC-8 TSSOP-16 DMP-4 Application Examples         Absolute Rotary Position Sensor Absolute Linear Position Sensor Pedal Position Sensor Throttle Position Sensor Ride Height Position Sensor Steering Wheel Position Sensor Float-Level Sensor Non-Contacting Potentiometer MUX Tria xis® VX VY VZ ADC NVRAM Output Stage 12 bit Analog OUT Processor 12 bit PWM Temp Sensor ROM - Firmware VSS MLX90371 - Triaxis® Position Processor Datasheet Ordering Information Temperature Package Option Code Packing Form MLX90371 G DC BCC-100 RE Rotary Stray-Field Immune Mode MLX90371 G DC BCC-200 RE Linear Stray-Field Immune Mode MLX90371 G DC BCC-300 RE Standard / Legacy Mode MLX90371 G GO BCC-100 RE Rotary Stray-Field Immune Mode – LowField Variant MLX90371 G GO BCC-200 RE Linear Stray-Field Immune Mode MLX90371 G GO BCC-300 RE Standard / Legacy Mode MLX90371 G GO BCC-500 RE Rotary Stray-Field Immune Mode – HighField Variant MLX90371 G VS BCC-100 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-150 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-101 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-151 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-103 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-153 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-108 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-158 RE/RX Rotary Stray-Field Immune Mode MLX90371 G VS BCC-200 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-250 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-201 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-251 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-203 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-253 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-208 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-258 RE/RX Linear Stray-Field Immune Mode MLX90371 G VS BCC-300 RE/RX Standard / Legacy Mode MLX90371 G VS BCC-350 RE/RX Standard / Legacy Mode MLX90371 G VS BCC-301 RE/RX Standard / Legacy Mode Product Revision 004 Mar-19 Definition Page 2 of 68 MLX90371 - Triaxis® Position Processor Datasheet Temperature Package Option Code Packing Form Definition MLX90371 G VS BCC-351 RE/RX Standard / Legacy Mode MLX90371 G VS BCC-303 RE/RX Standard / Legacy Mode MLX90371 G VS BCC-353 RE/RX Standard / Legacy Mode MLX90371 G VS BCC-308 RE/RX Standard / Legacy Mode MLX90371 G VS BCC-358 RE/RX Standard / Legacy Mode Product Revision 004 Mar-19 Page 3 of 68 MLX90371 - Triaxis® Position Processor Datasheet Legend: Temperature Code: G: from -40°C to 160°C Package Code: “DC” for SOIC-8 package “GO” for TSSOP-16 package (dual die) “VS” for DMP-4 package (dual mold, PCB-less) Option Code: BCC-xxx: die Version xxx-123: 1: Application – Magnetic configuration  1: Rotary Stray-Field Immune mode – Low-Field Variant  2: Linear Stray-Field Immune mode  3: Standard / Legacy mode (legacy backwards comparable to previous generation)  5: Rotary Stray-Field Immune mode – High-Field Variant 2: Configuration for DMP package  0: 100nF output capacitor  5: 10nF output capacitor 3: Trim-and-Form for DMP-4 Packing Form:  0: Standard straight leads. See section 18.3.1  1: Trim-and-Form STD1 2.54. See section 18.3.2 (not recommended for new designs, prefer STD4 2.54)  3: Trim-and-Form STD2 2.54. See section 18.3.3  8: Trim-and-Form STD4 2.54. See section 18.3.4 -RE : Tape & Reel  VS:2500 pcs/reel  DC:3000 pcs/reel  GO:4500 pcs/reel -RX : Tape & Reel, similar to RE with parts face-down (VS package only) Ordering Example: “MLX90371GDC-BCC-100-RE” For a Rotary Stray-Field Immune mode variant1 application in SOIC-8 package, delivered in Reel. Table 1 – Ordering information legend Revision 004 Mar-19 Page 4 of 68 MLX90371 - Triaxis® Position Processor Datasheet Contents Features and Benefits................................................................................................................................ 1 Application Examples ................................................................................................................................ 1 Description ................................................................................................................................................ 1 Ordering Information ................................................................................................................................ 2 1. Functional Diagram ............................................................................................................................... 8 2. Glossary of Terms .................................................................................................................................. 9 3. Pin Definitions ..................................................................................................................................... 10 3.1. Pin Definition for SOIC-8 package .................................................................................................... 10 3.2. Pin Definition for TSSOP-16 package ............................................................................................... 11 3.3. Pin Definition for DMP-4 package .................................................................................................... 11 4. Absolute Maximum Ratings ................................................................................................................. 12 5. Isolation Specification.......................................................................................................................... 12 6. General Electrical Specifications .......................................................................................................... 13 7. Timing Specification............................................................................................................................. 15 7.1. General Timing .................................................................................................................................. 15 7.2. Latency Time Definition .................................................................................................................... 15 7.3. Step Response Definition ................................................................................................................. 16 7.4. Analog timing .................................................................................................................................... 16 7.5. Digital (PWM) timing ........................................................................................................................ 17 8. Magnetic Field Requirements .............................................................................................................. 18 8.1. Rotary Stray-Field Immune Mode – Low-Field Variant ................................................................... 18 8.2. Rotary Stray-Field Immune Mode – High-Field Variant .................................................................. 19 8.3. Linear Stray-Field Immune Mode .................................................................................................... 20 8.4. Standard/Legacy Mode .................................................................................................................... 22 9. Accuracy Specification ......................................................................................................................... 24 9.1. Magnetic Specification ..................................................................................................................... 24 9.1.1. Definition ..................................................................................................................................... 24 9.1.2. Rotary Stray-Field Immune Mode – Low-Field Variant............................................................. 25 9.1.3. Rotary Stray-Field Immune Mode – High-Field Variant ............................................................ 25 9.1.4. Linear Stray-Field Immune Mode .............................................................................................. 26 9.1.5. Standard/Legacy Mode .............................................................................................................. 27 Revision 004 Mar-19 Page 5 of 68 MLX90371 - Triaxis® Position Processor Datasheet 9.2. Analog Output Accuracy ................................................................................................................... 28 9.3. Digital (PWM) Output Accuracy ....................................................................................................... 28 9.3.1. Definition ..................................................................................................................................... 28 9.3.2. Performances .............................................................................................................................. 29 10. Memory Specification........................................................................................................................ 29 11. End-User Programmable Items.......................................................................................................... 30 12. End-User Identification Items ............................................................................................................ 33 13. Description of End-User Programmable Items................................................................................... 34 13.1. Output modes ................................................................................................................................. 34 13.1.1. OUT modes ............................................................................................................................... 34 13.1.2. PWM Output Mode .................................................................................................................. 34 13.2. Output transfer characteristic ....................................................................................................... 35 13.2.1. Enable scaling Parameter (USEROPTION_SCALING) ............................................................... 36 13.2.2. CLOCKWISE Parameter (CW) ................................................................................................... 36 13.2.3. Discontinuity Point or Zero Degree Point (DP)........................................................................ 36 13.2.4. 4-Pts LNR Parameters ............................................................................................................... 36 13.2.5. 8-Pts LNR Parameters ............................................................................................................... 37 13.2.6. 17-Pts LNR Parameters ............................................................................................................. 38 13.2.7. 32-Pts LNR Parameters ............................................................................................................. 39 13.2.8. CLAMPING Parameters............................................................................................................. 40 13.3. Sensor Front-End ............................................................................................................................ 40 13.3.1. SENSING MODE......................................................................................................................... 40 13.3.2. GAINMIN and GAINMAX Parameters ...................................................................................... 40 13.4. Filter ................................................................................................................................................ 41 13.4.1. FIR Filters ................................................................................................................................... 41 13.4.2. Exponential Moving Average Filter .......................................................................................... 42 13.5. Programmable Diagnostic Settings ................................................................................................ 42 13.5.1. DIAG mode ................................................................................................................................ 42 13.5.2. DIAG Level ................................................................................................................................. 42 13.5.3. PWM Diagnostic ....................................................................................................................... 43 13.5.4. DIAG Debouncing...................................................................................................................... 43 14. Functional Safety ............................................................................................................................... 45 14.1. Safety Mechanism .......................................................................................................................... 45 Revision 004 Mar-19 Page 6 of 68 MLX90371 - Triaxis® Position Processor Datasheet 14.2. Safety Manual ................................................................................................................................. 47 15. Recommended Application Diagrams ................................................................................................ 48 15.1. Wiring with the MLX90371 in SOIC-8 Package.............................................................................. 48 15.2. Wiring with the MLX90371 in TSSOP-16 Package ......................................................................... 50 15.3. Wiring with the MLX90371 in DMP-4 Package (built-in capacitors) ............................................ 52 16. Standard Information Regarding Manufacturability of Melexis Products with Different Soldering Processes ............................................................................................................................................ 53 17. ESD Precautions................................................................................................................................. 53 18. Package Information.......................................................................................................................... 54 18.1. SOIC-8 Package ............................................................................................................................... 54 18.1.1. SOIC-8 - Package Dimensions................................................................................................... 54 18.1.2. SOIC-8 - Pinout and Marking .................................................................................................... 55 18.1.3. SOIC-8 - Sensitive Spot Positioning .......................................................................................... 55 18.1.4. SOIC-8 - Angle Detection .......................................................................................................... 56 18.2. TSSOP-16 Package .......................................................................................................................... 57 18.2.1. TSSOP-16 - Package Dimensions .............................................................................................. 57 18.2.2. TSSOP-16 - Pinout and Marking ............................................................................................... 58 18.2.3. TSSOP-16 - Sensitive Spot Positioning ..................................................................................... 58 18.2.4. TSSOP-16 - Angle detection ..................................................................................................... 60 18.3. DMP-4 Package ............................................................................................................................... 61 18.3.1. DMP-4 - Package Outline Dimensions (POD) – Straight Leads ............................................... 61 18.3.2. DMP-4 - Package Outline Dimensions (POD) – STD1 2.54 ..................................................... 62 18.3.3. DMP-4 - Package Outline Dimensions (POD) – STD2 2.54 ..................................................... 63 18.3.4. DMP-4 - Package Outline Dimensions (POD) – STD4 2.54 ..................................................... 64 18.3.5. DMP-4 - Pinout and Marking ................................................................................................... 65 18.3.6. DMP-4 - Sensitive Spot Positioning & Sense direction ........................................................... 65 18.3.7. DMP-4 - Angle detection .......................................................................................................... 67 19. Contact .............................................................................................................................................. 68 20. Disclaimer .......................................................................................................................................... 68 Revision 004 Mar-19 Page 7 of 68 MLX90371 - Triaxis® Position Processor Datasheet 1. Functional Diagram INPUT TEST Test Access VDD VDEC Regulator Rev. Pol & Overvolt Prot. DSP VX VY VZ RAM G MUX Tria xis® NVRAM Output Stage 12 bit Analog ADC OUT Processor 12 bit PWM Temp Sensor ROM - Firmware VSS Figure 1 – MLX90371 Block Diagram Revision 004 Mar-19 Page 8 of 68 MLX90371 - Triaxis® Position Processor Datasheet 2. Glossary of Terms Term Description Term Description Gauss (G), Tesla (T) Units for the magnetic flux density: 1 mT = 10 G SEooC Safety Element Out of Context TC Temperature Coefficient (in ppm/Deg.C.) FIR Finite Impulse Response PWM Pulse Width Modulation DCT Diagnostic Cycle Time %DC Duty Cycle of the output signal. i.e. TON /(TON + TOFF) PWL Piece Wise Linear ADC Analog-to-Digital Converter IWD Intelligent Watchdog DAC Digital-to-Analog Converter AWD Absolute Watchdog LSB Least Significant Bit CPU Central Processing Unit MSB Most Significant Bit POR Power On Reset DNL Differential Non-Linearity SW Software INL Integral Non-Linearity HW Hardware ASP Analog Signal Processing ECC Error-Correcting Code DSP Digital Signal Processing ROM Read-only Memory EMC Electro-Magnetic Compatibility RAM Random-access Memory DMP Dual Mold Package NVRAM Non-volatile Random-access Memory DP Discontinuity Point AoU Assumptions of Use EoL End of Line IMC Integrated Magnetic Concentrator Table 2 – Glossary of Terms Revision 004 Mar-19 Page 9 of 68 MLX90371 - Triaxis® Position Processor Datasheet 3. Pin Definitions 3.1. Pin Definition for SOIC-8 package Pin # Name Description 1 VDD Supply 2 Test Input For test 3 Test For test 4 Not Used 5 OUT Output 6 VSSD Ground 7 VDEC Decoupling pin (on-chip regulator) 8 VSSA Ground Table 3 – SOIC-8 Pin Definitions and Descriptions For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the Ground (see section 15.1). Revision 004 Mar-19 Page 10 of 68 MLX90371 - Triaxis® Position Processor Datasheet 3.2. Pin Definition for TSSOP-16 package Pin # Name Description 1 VDEC1 Decoupling pin 2 VSSA1 Ground 3 VDD1 Supply 4 Test Input1 For test 5 Test2 For test 6 OUT2 Output 7 Not Used2 8 VSSD2 Ground 9 VDEC2 Decoupling pin 10 VSSA2 Ground 11 VDD2 Supply 12 Test Input2 For test 13 Test1 For test 14 Not Used1 15 OUT1 Output 16 VSSD1 Ground Table 4 – TSSOP-16 Pin Definitions and Descriptions For optimal EMC behavior, it is recommended to connect the unused pins (Not Used and Test) to the Ground (see section 15.2). 3.3. Pin Definition for DMP-4 package Pin # Name Description 1 VSS Ground 2 VDD Supply 3 OUT Output 4 VSS Ground Table 5 – DMP-4 Pin Definitions and Descriptions Revision 004 Mar-19 Page 11 of 68 MLX90371 - Triaxis® Position Processor Datasheet 4. Absolute Maximum Ratings Parameter Supply Voltage Symbol Min. Typ. VDD Reverse Voltage Protection VDDREV Positive Output Voltage VOUT Output Current IOUT -30 Reverse Output Voltage VOUTREV -0.3 Operating Temperature TAMB -40 Junction Temperature TJUNC Storage Temperature TST Magnetic Flux Density Max. Unit 28 45 V