MLX90377 - Triaxis® Position Sensor IC
Datasheet
Features and Benefits
Triaxis® Hall Technology
On Chip Signal Processing for Robust
Absolute Position Sensing
Programmable Measurement Range
Programmable Linear Transfer Characteristic
(4 or 8 Multi-points or 16 or 32 Piece-WiseLinear)
Selectable (fast) SENT, PWM, SPC or
Ratiometric Analog Output modes
SAE J2716 APR2016 SENT
ISO26262
ASIL-C capable for (fast) SENT, PWM, SPC
Output modes, and ASIL-B capable for analog
output mode, Safety Element out of Context
Enhanced serial data communication
48 bit ID Number option
Single Die - SOIC-8, DMP-4, SMP-3, and Dual
Die (Full Redundant) - TSSOP-16 package
RoHS Compliant
Robustness against stray-field
SOIC-8
TSSOP-16
Ride Height Position Sensor
Steering Wheel Position Sensor
Float-Level Sensor
Non-Contacting Potentiometer
Small Angle Position Sensor
Small Stroke Position Sensor
Description
The MLX90377 is a monolithic magnetic position
sensor IC. It consists of a Triaxis® Hall magnetic
front end, an analog to digital signal conditioner, a
DSP for advanced signal processing and an output
stage driver.
The MLX90377 is sensitive to the three
components of the magnetic flux density applied to
the IC (i.e. Bx, By and Bz). This allows the MLX90377
with the correct magnetic circuit to decode the
absolute position of any moving magnet (e.g.
rotary position from 0 to 360 Degrees or linear
displacement, see Figure 2). It enables the design
of non-contacting position sensors that are
frequently required for both automotive and
industrial applications.
The MLX90377 provides 3 output modes. Firstly,
the IC supports (fast) SENT frames encoded
according to a Secure Sensor format. The output
delivers enhanced serial messages providing error
codes, and user-defined values. Through
programming, the MLX90377 can also be
configured to output a PWM (Pulse Width
Modulated) signal. Finally, analog ratiometric
output is also supported.
VDD
INPUT
DMP-4
SMP-3
Rev. Pol &
Overvolt Prot.
Ext. Signal
Absolute Rotary or Linear Position Sensor
Pedal Position Sensor
Throttle Position Sensor
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3901090377
Analog
Regulator
Digital
Regulator
PWM
Meas.
DSP
Tria xis®
VX
VY
VZ
G
MUX
Temp Sensor
Application Examples
VDEC
ADC
RAM
NVRAM
Output Stage
12 bit SENT
12 bit SPC
µC
OUT
12 bit Analog
12 bit PWM
ROM - Firmware
VSS
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MLX90377 Triaxis® Position Sensor IC
Datasheet
Ordering Information
Product
1
TemperPackage
ature
Option
Code
Packing
Form
Definition
MLX90377
G
DC
ADB-300
RE
Standard/Legacy Mode, Analog/PWM output,
Low Power Mode
MLX90377
G
DC
ADB-310
RE
Standard/Legacy Mode, Analog/PWM output,
High Speed Mode
MLX90377
G
DC
ADB-330
RE
Standard / Legacy Mode, SENT output
MLX90377
G
GO
ADB-210
RE
Linear Stray-Field Immune Mode,
Analog/PWM output, High Speed Mode
MLX90377
G
GO
ADB-280 (1)
RE
Linear Stray-Field Immune Mode,
SPC output
MLX90377
G
GO
ADB-300
RE
Standard/Legacy Mode, Analog/PWM output,
Low Power Mode
MLX90377
G
GO
ADB-310
RE
Standard/Legacy Mode, Analog/PWM output,
High Speed Mode
MLX90377
G
GO
ADB-330
RE
Standard / Legacy Mode, SENT output
MLX90377
G
GO
ADB-380 (1)
RE
Standard / Legacy Mode, SPC output
MLX90377
G
GO
ADB-510
RE
Rotary Stray-Field Immune Mode,
Analog/PWM output, High Speed Mode
MLX90377
G
VS
ADB-300
RE/RX
Standard/Legacy Mode, Analog/PWM output,
Low Power Mode
MLX90377
G
VS
ADB-303
RE/RX
Standard/Legacy Mode, Analog/PWM output,
Low Power Mode
MLX90377
G
VS
ADB-308
RE/RX
Standard/Legacy Mode, Analog/PWM output,
Low Power Mode
MLX90377
G
VS
ADB-310
RE/RX
Standard/Legacy Mode, Analog/PWM output,
High Speed Mode
MLX90377
G
VS
ADB-313
RE/RX
Standard/Legacy Mode, Analog/PWM output,
High Speed Mode
MLX90377
G
VS
ADB-318
RE/RX
Standard/Legacy Mode, Analog/PWM output,
High Speed Mode
MLX90377
G
VS
ADB-330
RE/RX
Standard / Legacy Mode, SENT output
MLX90377
G
VS
ADB-333
RE/RX
Standard / Legacy Mode, SENT output
MLX90377
G
VS
ADB-338
RE/RX
Standard / Legacy Mode, SENT output
For products with SPC output, please contact Melexis Direct Sales team for detailed specification and further information.
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MLX90377 Triaxis® Position Sensor IC
Datasheet
Product
TemperPackage
ature
Option
Code
Packing
Form
Definition
MLX90377
G
VE
ADB-110
RE/RX
Rotary Stray-Field Immune Mode (Low Field
variant),
Analog/PWM output, High Speed Mode
MLX90377
G
VE
ADB-210
RE/RX
Linear Stray-Field Immune Mode,
Analog/PWM output, High Speed Mode
MLX90377
G
VE
ADB-230
RE/RX
Linear Stray-Field Immune Mode,
SENT output
MLX90377
G
VE
ADB-300
RE/RX
Standard/Legacy Mode,
Analog/PWM output, Low Power Mode
MLX90377
G
VE
ADB-310
RE/RX
Standard/Legacy Mode,
Analog/PWM output, High Speed Mode
MLX90377
G
VE
ADB-330
RE/RX
Standard / Legacy Mode,
SENT output
MLX90377
G
VE
ADB-510
RE/RX
Rotary Stray-Field Immune Mode (High Field
variant),
Analog/PWM output, High Speed Mode
Table 1 - Ordering Codes
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MLX90377 Triaxis® Position Sensor IC
Datasheet
Temperature Code:
G: -40°C to 160°C
Package Code:
DC: SOIC-8 package (see 19.1)
GO: TSSOP-16 package (see 19.2)
VS: DMP-4 package (PCB-less dual mold, see 19.3)
VE: SMP-3 package (PCB-less single mold, see 19.4)
Option Code - Chip
revision
ADB-123: Chip Revision
ADB : Standard revision
Option Code - Application
ADB-123: 1-Application - Magnetic configuration
1: Angular Rotary Strayfield Immune - Low field Variant
2: Linear position Strayfield Immune
3: Legacy / Angular Rotary / Linear position
5: Angular Rotary Strayfield Immune - High field Variant
Option Code - SW
configuration: output
mode, protocol
ADB-123: 2-SW configuration: output mode, protocol
0: Analog/PWM output mode, low power mode
1: Analog/PWM output mode, high speed mode
3. SENT output mode, 3μs tick time
8: SPC output mode, 1.5μs tick time
Important: Product must be ordered by the option code corresponding to
the desired output protocol. The output protocols are not
interchangeable by reprograming at the end-user.
Option Code - DMP-4 Trim
& Form configuration
ADB-123: 3-DMP-4 Trim & Form configuration
0: Standard straight leads. See section 19.3.1
3: Trim and Form STD2 2.54. See section 19.3.2
8: Trim and Form STD4 2.54. See section 19.3.3
Packing Form:
-RE : Tape & Reel
VS:2500 pcs/reel
VE:2500 pcs/reel
DC:3000 pcs/reel
GO:4500 pcs/reel
-RX : Tape & Reel, similar to RE with parts face-down (VS and VE package)
Ordering Example:
MLX90377GDC-ADB-300-RE
For a legacy version in SOIC-8 package, low-power analog output, delivered
in Reel of 3000pcs.
Table 2 - Ordering Codes Information
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MLX90377 Triaxis® Position Sensor IC
Datasheet
Contents
Features and Benefits ............................................................................................................. 1
Application Examples .............................................................................................................. 1
Description.............................................................................................................................. 1
Ordering Information .............................................................................................................. 2
1. Functional Diagram and Application Modes ........................................................................ 7
2. Glossary of Terms................................................................................................................ 8
3. Pin Definitions and Descriptions.......................................................................................... 9
3.1. Pin Definition for SOIC-8 package .................................................................................. 9
3.2. Pin Definition for TSSOP-16 Dual-Die package ............................................................ 10
3.3. Pin Definition for DMP-4 package ............................................................................... 10
3.4. Pin Definition for SMP-3 package ................................................................................ 11
4. Absolute Maximum Ratings ............................................................................................... 12
5. Isolation Specification ....................................................................................................... 12
6. General Electrical Specifications ....................................................................................... 13
7. Timing Specifications ........................................................................................................ 15
7.1. General Timing Specifications ..................................................................................... 15
7.2. Timing Definitions ........................................................................................................ 15
7.3. Analog output timing specifications ............................................................................ 17
7.4. SENT output timing specifications ............................................................................... 18
7.5. PWM output timing specifications .............................................................................. 21
8. Magnetic Field Specifications ............................................................................................ 22
8.1. Rotary Stray-field Immune Mode – Low Field Variant (-1xx code) .............................. 22
8.2. Linear Stray-field Immune Mode (-2xx code) .............................................................. 23
8.3. Standard/Legacy Mode (-3xx code) ............................................................................. 24
8.4. Rotary Stray-field Immune Mode - High Field Variant (-5xx code) .............................. 25
9. Accuracy Specifications ..................................................................................................... 26
9.1. Definitions ................................................................................................................... 26
9.2. Rotary Stray-field Immune Mode – Low Field Variant (-1xx code) .............................. 27
9.3. Linear Stray-field Immune Mode (-21x Code) ............................................................. 28
9.4. Standard/Legacy Mode (-3xx Code) ............................................................................ 29
9.5. Rotary Stray-field Immune Mode – High Field Variant (-51x Code) ............................ 30
10. Memory Specifications .................................................................................................... 30
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MLX90377 Triaxis® Position Sensor IC
Datasheet
11. Output Accuracy and Protocol ........................................................................................ 31
11.1. Analog Output ........................................................................................................... 31
11.2. Single Edge Nibble Transmission (SENT) SAE J2716 .................................................. 31
11.3. PWM (pulse width modulation) ................................................................................. 40
12. End User Programmable Items ........................................................................................ 41
13. End User Identification Items .......................................................................................... 47
14. Description of End-User Programmable Items ................................................................ 48
14.1. Output Modes ........................................................................................................... 48
14.2. Output Transfer Characteristic .................................................................................. 49
14.3. Sensor Front-End ....................................................................................................... 58
14.4. Filtering...................................................................................................................... 59
14.5. Programmable Diagnostics Settings .......................................................................... 61
15. Functional Safety ............................................................................................................ 63
15.1. Safety Manual ............................................................................................................ 63
15.2. Safety Mechanisms .................................................................................................... 63
15.3. Fault Handling Time Interval...................................................................................... 67
16. Recommended Application Diagrams .............................................................................. 69
16.1. Wiring with the MLX90377 in SOIC-8 Package .......................................................... 69
16.2. Wiring with the MLX90377 in TSSOP-16 Package ...................................................... 70
16.3. Wiring with the MLX90377 in DMP-4 Package (built-in capacitors) .......................... 71
16.4. Wiring with the MLX90377 in SMP-3 Package (built-in capacitors) .......................... 72
17. Standard Information Regarding Manufacturability of Melexis Products with Different
Soldering Processes .......................................................................................................... 73
18. ESD Precautions .............................................................................................................. 73
19. Package Information ....................................................................................................... 74
19.1. SOIC-8 Package .......................................................................................................... 74
19.2. TSSOP-16 Package ..................................................................................................... 77
19.3. DMP-4 - Package ........................................................................................................ 80
19.4. SMP-3 - Package ........................................................................................................ 85
19.5. Packages Thermal Performances ............................................................................... 89
20. Contact ........................................................................................................................... 90
21. Disclaimer ....................................................................................................................... 90
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MLX90377 Triaxis® Position Sensor IC
Datasheet
1. Functional Diagram and Application Modes
VDD
INPUT
Rev. Pol &
Overvolt Prot.
Ext. Signal
VDEC
Analog
Regulator
Digital
Regulator
PWM
Meas.
DSP
Tria xis®
VX
VY
VZ
G
MUX
Temp Sensor
ADC
RAM
Output Stage
NVRAM
12 bit SENT
12 bit SPC
µC
OUT
12 bit Analog
12 bit PWM
ROM - Firmware
VSS
Figure 1 - MLX90377 Block diagram
Rotary Stray-field Immune
Angular Rotary
Linear Motion
Figure 2 - Application Modes
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MLX90377 Triaxis® Position Sensor IC
Datasheet
2. Glossary of Terms
Name
Description
Name
Description
ADC
Analog-to-Digital Converter
RAM
Random Access Memory
AoU
Assumption of Use
ROM
Read-Only Memory
ASP
Analog Signal Processing
SPC
Short PWM Code
AWD
Absolute WatchDog
SCN
Status & Communication Nibble
CPU
Central Processing Unit
SEooC
Safety Element out of Context
CRC
Cyclic Redundancy Check
DC
Duty Cycle of the output signal i.e.
TON /(TON + TOFF)
TC
Temperature
ppm/°C)
DMP
Dual Mould Package
Tesla (T)
SI derived unit for the magnetic
flux density (Vs/m2)
DP
Discontinuity Point
DSP
Digital Signal Processing
DTI
Diagnostic Test Interval
ECC
Error Correcting Code
EMA
Exponential Moving Average
EMC
Electro-Magnetic Compatibility
EoL
End of Line
FIR
Finite Impulse Response
FHTI
Fault Handling Time Interval
Gauss (G)
Alternative unit for the magnetic
flux density (10G = 1mT)
HW
Hardware
IMC
Integrated Magnetic Concentrator
INL/DNL
Integral Non-Linearity /
Differential Non-Linearity
IWD
Intelligent WatchDog
LNR
LiNeaRization
LSB/MSB
Least Significant Bit /
Most Significant Bit
NC
Not Connected
NVRAM
Non Volatile RAM
POR
Power On Reset
PSF
Product Specific Functions
PWL
Piecewise Linear
PWM
Pulse Width Modulation
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3901090377
Coefficient
(in
Table 3 - Glossary of Terms
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MLX90377 Triaxis® Position Sensor IC
Datasheet
3. Pin Definitions and Descriptions
3.1. Pin Definition for SOIC-8 package
Pin #
Name
Description
1
VDD
Supply
2
Input
For Melexis test or External
Measurement
3
Test
For Melexis test
4
N.C.
Not connected
5
OUT
Output
6
N.C.
Not connected
7
VDEC
Decoupling pin
8
VSS
Ground
Table 4 - SOIC-8 Pin definitions and descriptions
For optimal EMC behavior, it is recommended to connect the unused pins (N.C. and Test) to the Ground.
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MLX90377 Triaxis® Position Sensor IC
Datasheet
3.2. Pin Definition for TSSOP-16 Dual-Die package
Pin #
Name
Description
1
VDEC1
Decoupling pin die1
2
VSS1
Ground die1
3
VDD1
Supply die1
4
Input1
For Melexis test or External
Measurement
5
Test2
For Melexis test
6
OUT2
Output die2
7
N.C.
Not connected
8
N.C.
Not connected
9
VDEC2
Decoupling pin die2
10
VSS2
Ground die2
11
VDD2
Supply die2
12
Input2
For Melexis test or External
Measurement
13
Test1
For Melexis test
14
N.C.
Not connected
15
OUT1
Output die1
16
N.C.
Not connected
Table 5 - TSSOP-16 Pin definitions and descriptions
For optimal EMC behavior, it is recommended to connect the unused pins (N.C. and Test) to the Ground.
3.3. Pin Definition for DMP-4 package
DMP-4 package offers a pin to pin compatibility with the previous generation of Triaxis® products.
Pin #
Name
Description
1
VSS
Ground
2
VDD
Supply
3
OUT
Output
4
VSS
Ground
Table 6 - DMP-4 Pin definitions and descriptions
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MLX90377 Triaxis® Position Sensor IC
Datasheet
3.4. Pin Definition for SMP-3 package
b
TEST
a
INPUT
2
1
OUT
VDD
3
VSS
Figure 3 – Pins definition for SMP-3 Package
Pin #
Name
Description
1
VDD
Supply
2
OUT
Output
3
VSS
Ground
a
INPUT
Test
b
TEST
Test
Table 7 - SMP-3 Pins definition and description
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MLX90377 Triaxis® Position Sensor IC
Datasheet
4. Absolute Maximum Ratings
Parameter
Symbol
Supply Voltage( 2)
Min
Typ
Max
Unit
28
37
V
< 48h
< 60s
V
< 48h
< 1h
V
< 48h
V
< 48h
< 1h
VDD
Reverse Voltage Protection(2)
-14
-18
VDD-rev
Positive Output Voltage(2)
VOUT
Reverse Output Voltage(2)
VOUT-rev
Internal Voltage
28
-14
-18
VDEC
3.6
VDEC-rev
VInput
Reverse Input pin Voltage
VInput-rev
-3
TAMB
-40
Operating Temperature
V
-0.3
Positive Input pin Voltage
Condition
V
6
V
V
+160
°C
+175
°C
Junction Temperature
TJ
Storage Temperature
TST
-55
+170
°C
Magnetic Flux Density
Bmax
-1
1
T
Table 8 - Absolute maximum ratings
Exceeding any of the absolute maximum ratings may cause permanent damage.
Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
The values in Table 8 are referred to the capability of a single die in the package. Derating might occur In a
dual-die package, if both dies are exposed to the absolute maximum ratings conditions simultaneously.
5. Isolation Specification
Only valid for the TSSOP-16 package (code GO, i.e. dual die version).
Parameter
Isolation Resistance
Symbol
Min
Typ
Max
Unit
Condition
Risol
4
-
-
MΩ
Between dice, measured between
VSS1 and VSS2 with +/-20V bias
Table 9 - Isolation specification
2 Valid
for full operating temperature range.
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MLX90377 Triaxis® Position Sensor IC
Datasheet
6. General Electrical Specifications
General electrical specifications are valid for temperature range [-40;160] °C and supply voltage range
[4.5;5.5] V unless otherwise noted.
Electrical Parameter
Supply Voltage
Symbol
Min
Typ
Max
Unit
VDD
4.5
5
5.5
V
Powered by regulated supply
VDD
6
12
18
V
Powered by vehicle battery
8
9
11
10
11
13.5
8
9
11.5
Supply Current for
Legacy / Angular
Rotary (-30x code)
Supply Current for
Legacy / Angular
Rotary (-31x code)
IDD
Supply Current for
Legacy / Angular
Rotary (-33x code)
Condition
Low power mode,
Analog/PWM output
mA
High speed mode,
Analog/PWM output
Low power mode,
SENT output
Supply Current for
Strayfield Immune (21x, -51x code)
IDD
12
13.5
15
mA
Start-up Level (rising)
VDDstartH
3.95
4.1
4.25
V
VDDstartHyst
-
200
-
mV
VPROV0( 3)
6.3
6.55
6.8
V
Powered by regulated supply
VPROV1
21.5
23
24.5
V
Powered by vehicle battery
VPROV0Hyst
400
500
600
mV
IOUTshort
-35
10
-10
35
mA
Vout = 0 V
Vout = 5 V or 18V
kΩ
Analog pull-up/pull-down
100
kΩ
PWM push-pull, pull-up to 5V,
PWM push-pull, pull-down to 0V
Start-up Hysteresis
PTC Entry Level
(rising)
PTC Entry Level
Hysteresis
Output Short Circuit
Current
5
Output Load
Digital open drain
output level
RL
VsatLoOd
10
5
High speed mode,
Analog/PWM output
10
-
55
kΩ
SENT push-pull, pull-up
1
-
100
kΩ
Open drain pull-up/pull-down
10
%Vext
Pull-up to any external voltage
Vext ≤ 18V, IL ≤ 3.4mA
0
Programming through Connector (PTC) requires raising supply voltage above Vprov0 or Vprov1. This is customer configurable by
setting a bit in the NVRAM
3
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MLX90377 Triaxis® Position Sensor IC
Datasheet
Electrical Parameter
Digital open drain
output leakage( 4)
Symbol
Min
VsatHiOd
90
Max
Unit
Condition
100
%Vext
Pull-down to GND with any supply
voltage VDD ≤ 18V, IL ≤ 3.4mA
400
µA
Vext ≤ 18V, 4.5V ≤ VDD ≤ 5.5V,
with a pull-up resistor
100
µA
Vvdd = Vext, with a pull-up resistor
150
µA
with a pull-down resistor
50
130
Ω
Push-pull mode
0.5( 5)
3.3(5)
1.2( 6)
7.4(6)
%VDD
Pull-up load RL ≥ 10 kΩ to 5 V
Pull-up load RL ≥ 5 kΩ to 18 V
%VDD
Pull-down load RL ≥ 10 kΩ
Pull-down load RL ≥ 5 kΩ
Typ
IleakpuOd
IleakpdOd
Digital output Ron
Analog Saturation
Output Level
Ron
27
VsatA_lo
VsatA_hi
97(6)
95(6)
99(5)
98(5)
0.2(6)
0.5(6)
VsatD_lopp
Digital Output Level
VsatD_hipp
Active Diagnostic
Output Level
VDD -0.2(6)
VDD -0.5(6)
0.5(5)
3.3(5)
Diag_lo
Diag_hi
97(6)
95(6)
99(5)
98(5)
2.5
Passive Diagnostic
Output Level
(Broken-Wire
Detection) ( 7)
Pull-up load RL ≥ 10 kΩ
Pull-up load 10 kΩ > RL ≥ 5 kΩ
V
Pull-down load RL ≥ 10 kΩ
Pull-down load 10 kΩ > RL ≥ 5 kΩ
%VDD
Pull-up load RL ≥ 10 kΩ to 5 V
Pull-up load RL ≥ 5 kΩ to 18 V
%VDD
Pull-down load RL ≥ 10 kΩ
Pull-down load RL ≥ 5 kΩ
4
BVSSPD
%VDD
1
BVSSPU
Passive Diagnostic
Output Level
(Broken-Wire
Detection) (7)
1.2(6)
7.4(6)
V
99.5
BVDDPD
100
0
92.5
1.6
0.5
Broken VSS &
Pull-up load RL ≥ 5 kΩ
%VDD
Broken VDD &
Pull-down load RL ≥ 5 kΩ
%VDD
97
Broken VSS &
Pull-down load RL ≤ 10 kΩ
%VDD
97.5
BVDDPU
Broken VSS &
Pull-down load RL ≤ 25 kΩ
99
Broken VDD &
Pull-up load RL ≤ 25 kΩ
Broken VDD &
Pull-up load RL ≤ 10 kΩ
Table 10 - Electrical Specifications
4
The digital output level is thereby defined by the external voltage and pull-up or pull-down resistor.
5
at 27Deg.C and 5V supply voltage with typical process parameters
6
at 160Deg.C and 4.5V supply voltage with worst case (6 sigma) process parameters
Valid for dual-die configuration as well, i.e. TSSOP-16 package, where the two dies have the same supply and ground level,
while the output of one die is connected with PU and the output of the other one is connected with PD.
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MLX90377 Triaxis® Position Sensor IC
Datasheet
7. Timing Specifications
Timing specifications are valid for temperature range [-40; 160] °C and supply voltage range [4.5; 5.5] V
unless otherwise noted.
7.1. General Timing Specifications
Parameter
Symbol
Min.
Typ
Max.
Unit
Condition
FCK
11.4
22.8
12
24
12.6
25.2
MHz
-30x, -33x code
-21x, -31x, -51x code
Main Clock initial tolerances
at room temperature
ΔFCK,0
11.75
23.5
12
24
12.25
24.5
MHz
-30x, -33x code
-21x, -31x, -51x code
Main Clock Frequency
Thermal Drift
ΔFCK,T
-2.5
-
2.5
%Fck
Relative to 35°C
ΔFCK, TOT
-3.5
-
3.5
%Fck
Relative tolerances, including
thermal and lifetime drift, after
factory trimming at Melexis
Main Clock Frequency ( 8)
Main Clock Frequency Total
Drift
1MHz Clock Frequency
F1M
1
MHz
Table 11 - General Timing Specifications
7.2. Timing Definitions
7.2.1. Startup Time
In analog mode, the startup time is the time between the power on cycle and the time the first valid angle
transmitted on the output. During startup, the sensor output is in High-Z state, and the driver is only
enabled when the sensor is able to transmit a valid output.
In SENT mode, the startup time consists of two values. The first one, Tinit, is the time needed for the circuit
to be ready to start acquiring an angle. In SENT mode, at that time, the IC starts transmitting initialisation
frames. The second value, Tstup, is the time when the first valid angle is transmitted.
8
Including thermal and lifetime drift
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VDDstartH
Supply Voltage
Tinit
SENT output
Tstup
High-Z
Null Frame
Null Frame
Null Frame
Valid Angle
Valid Angle
Tstup3
Tstup2
Tstup1
Output
Ready
PWM output
High-Z (no drive)
First Sync
Pulse
First Valid Angle
Figure 4 - Startup Time Definition
In PWM mode, startup is defined by three values, Tstup[1..3]. The first value is reached when the output is
ready and starts to drive a voltage. The second value T2 is the start of the first value angle transmission and
the third one T3 the moment the first angle has been transmitted.
7.2.2. Latency (average)
angle/position
Latency is the average lag between the movement of the detected object (magnet) and the response of
the sensor output, as shown in Figure 5, where theta_ECU(t) is sampled as the beginning of the
synchronization pulse. This value is representative of the time constant of the system for regulation
calculations.
theta_magnet(t)
theta_ECU(t)
τL
time
Figure 5 - Definition of Latency
7.2.3. Step Response (worst case)
The step response is a suitable metric for the "delay" of the sensor in case of an abrupt step in the magnetic
change, considering 100% settling time without any DSP filter. Full settling is typically achieved in just two
steps. The sensor is asynchronous with the magnetic step change: the 100% settling time will fall in a time
window; worst case is illustrated in the figure below.
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Magnetic step
(input change)
Output refresh
100% of the target
50% of the target
Output response to
the magnetic step
Internal
processing
Step Response
Figure 6 - Step Response Definition
7.3. Analog output timing specifications
For the analog output configurations, specifications are valid for the operational temperature range, and
the supply voltage defined in section 6.
7.3.1. High Speed Mode (-21x, -31x, -51x code)
For the High Speed Mode, the timing specifications are listed in Table 12.
Parameter
Symbol
Min
Typ
Max
Unit
Output refresh period
τR
190
200
210
μs
Latency
τL
140
μs
no external load
Step response
τS
380
μs
no external load
Start-up time
τSU
3.2
ms
Slew Rate
SR
120
200
V/ms
Analog Diagnostics Cycle
DTIANA
7.2
ms
see Table 66, section 15.3
Digital Diagnostics Cycle
DTIDIG
6.1
ms
see Table 66, section 15.3
13.3
ms
Safe startup Time( 9)(10)
Condition
capacitive load at output is 100nF
capacitive load at output is 10nF
Table 12 - Analog General Timing Specifications for High Speed Mode
9
Fully programmable depending on the power/magnetic/output mode.
Time between reset due to digital fault to first valid data transmission. Min. value defined by OUT_DIAG_HIZ_TIME (see Table
42 in chapter 12 for details).
10
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7.3.2. Low Power Mode (-30x code)
For the Standard/Legacy Mode, the timing specifications are listed in Table 13:
Parameter
Symbol
Min
Typ
Max
Unit
Output refresh period
τR
380
400
420
μs
Latency
τL
300
μs
no external load
Step response
τS
680
μs
no external load
Start-up time
τSU
4.2
ms
Slew Rate
SR
120
200
V/ms
Analog Diagnostics Cycle
DTIANA
15
ms
see Table 66, section 15.3
Digital Diagnostics Cycle
DTIDIG
9.8
ms
see Table 66, section 15.3
21.7
ms
4
Safe startup Time(9)(10)
Condition
capacitive load at output is 100nF
capacitive load at output is 10nF
Table 13 - Analog General Timing Specifications for the Standard/Legacy Low Power Mode
7.4. SENT output timing specifications
The general SENT timing specifications are listed in Table 14.
Parameter
Symbol
Tick time( 11)
Min
Typ
Max
Unit
3
6
μs
SENT edge rise Time
Trise
12.5
18
μs
SENT edge fall Time
Tfall
5.3
6.5
μs
Slow Message cycle length
(3μs tick time)
791
475
ms
Condition
3μs = Normal SENT (default)
6μs = Slow SENT
between 1.1V and 3.8V
for 3μs tick time
Extended sequence (40 frames)
Short sequence (24 frames)
Table 14 - SENT General Timing Specifications
11
The device also supports SENT formats with other tick time, see Table 31.
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7.4.1. Standard/Legacy Mode (-33x code)
7.4.1.1. Continuous Synchronous Acquisition Mode
For the SENT output protocol in the Standard/Legacy Mode, MLX90377 with the default factory calibration
operates with constant SENT frame length (SENT with pause), where a constant latency and step response
time is guaranteed. The length of the SENT frame is defined by the parameter T_FRAME in number of ticks
(see Table 42). The sensor is configured in continuous synchronous timing mode, acquires angles based on
the output frequency, and the sensor output has a fixed frame frequency.
The detailed default setting of the SENT protocol for order code -33x is as follows:
Protocol: SENT with pause
Tick time: 3μs/tick
SENT format: A.3 (H.4)
Number of conversions per SENT frame: 2
ADC clock frequency: 3MHz
DSP linearization: 16 points
The corresponding timing specifications are listed in Table 15.
Parameter
Symbol
Min
SENT frame tick count
NTframe
320 ( 12)(13)
Output refresh period
τR
SENT startup time
Average Latency
Typ
Max
Unit
Condition
ticks
0.96
ms
Tstup
6.4
Tlatcy
1.7
1.9
2.5
2.24
2.71
3.62
ms
Until first valid angle received
ms
Filter = 0 (no filter) ( 14)
Filter = 1 (FIR11), default setting
Filter = 2 (FIR1111)
3.0
3.5
4.4
ms
Filter = 0 (no filter) (14)
Filter = 1 (FIR11), default setting
Filter = 2 (FIR1111)
Step Response (worst
case)
TwcStep
Analog Diagnostics Cycle
DTIANA
10.4
ms
see Table 66, section 15.3
Digital Diagnostics Cycle
DTIDIG
8.5
ms
see Table 66, section 15.3
12.1
ms
Safe startup Time(9)(10)
Table 15 - Synchronous SENT Mode Timing Specifications
12
Defines the typical Output refresh period (SENT Frame Period).
If the sensor is configured from the default factory setting of -33x code to have 1 conversion per SENT frame, the minimum
tick count is 282.
13
See section 14.4 for details concerning Filter parameter. It is an option to improve the speed, but will degrade noise
performance (see section 9.4) by a factor of 1.4.
14
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7.4.1.2. Continuous Asynchronous Acquisition Mode
Optionally to the default factory setting of the -33x code, the MLX90377 can be configured to operate with
variable SENT frame length (SENT without pause), where latency and step response is dependent on the
transmitted data. The length of the SENT frame is defined by the data content. The sensor is configured in
the continuous asynchronous acquisition mode and periodically acquires a magnetic measurement
asynchronously to the SENT transmission.
When configured in the continuous asynchronous acquisition mode, the detailed default setting of the
SENT protocol for order code -33x is as follows:
Protocol: SENT without pause
Tick time: 3μs/tick
SENT format: A.3 (H.4)
ADC clock frequency: 3MHz
DSP linearization: 16 points
The corresponding timing specifications are listed in Table 16.
Parameter
Symbol
Min
Typ
Max
Unit
τR
475
500
525
μs
Asynchronously to the output
protocol
Tstup
5.9
ms
Until first valid angle received
Tlatcy
1.8
2
2.5
ms
Filter = 0 (no filter) (14)
Filter = 1 (FIR11), default setting
Filter = 2 (FIR1111)
Step Response (worst
case)
TwcStep
2.2
2.8
3.7
ms
Filter = 0 (no filter) (14)
Filter = 1 (FIR11), default setting
Filter = 2 (FIR1111)
Analog Diagnostics Cycle
DTIANA
11
ms
see Table 66, section 15.3
Digital Diagnostics Cycle
DTIDIG
8.8
ms
see Table 66, section 15.3
18
ms
Internal angle
measurement period
SENT startup time
Average Latency
Safe startup Time(9) (10)
Condition
Table 16 - Synchronous SENT Mode Timing Specifications
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7.5. PWM output timing specifications
The factory calibrated parts with order code –x0x and –x1x default to ratiometric analog output, the end
user must reprogram the part to use the PWM output. Details can be found in Table 39. The Table 16 below
shows the timing specifications for PWM output.
Parameter
Symbol
Min
Typ
Max
Unit
Internal angle measurement
period (-x0x code)
τR
380
400
420
μs
Internal angle measurement
period (-x1x code)
τR
190
200
210
μs
FPWM
100
2000
Hz
PWM Frequency Initial
Tolerances
ΔFPWM,0
-2
2
%FPWM
PWM Frequency Thermal Drift
ΔFPWM,T
-2.5
2.5
%FPWM
PWM Frequency Drift
ΔFPWM
-5.0
5.0
%FPWM
PWM startup Time (up to
output ready) ( 15)
Tstup1
3.2
ms
PWM startup Time (up to first
sync. Edge) (15)
Tstup2
4.2
ms
Tstup1 + TPWM, FPWM =1kHz
PWM startup Time (up to first
data received) (15)
Tstup3
5.2
ms
Tstup1 + 2* TPWM, FPWM =1kHz ( 16)
Rise Time PWM push-pull
mode( 17)
Trise_pp
3.1
5.0
μs
VDD in the range of [4.5V,
5.5V]
Tfall_pp
2.6
4.5
μs
VDD in the range of [4.5V,
5.5V]
200
μs
VDD=4.5V, Vpull-up = 18V, RL =
10kΩ ( 19)
PWM Frequency
Fall Time PWM push-pull mode
(17)
Fall Time PWM NMOS opendrain mode (17) ( 18)
Tfall_od
Condition
Details see section 14.1.4
T=35°C, can be trimmed at EOL
Over temperature and lifetime
Table 17 - PWM timing specifications with order code
Typical value specified according to the typical PWM frequency. Max. value can be obtained by scaling with the PWM
frequency drift accordingly.
15
16
First frame transmitted has no synchronization edge; Therefore the second frame transmitted is the first complete one.
17
10nF capacitive load, calculated between 10%-90% voltage level.
18
Rise time in PWM NMOS open-drain mode is not specified as it depends on external components and the pull-up voltage.
Vpull-up stands for the external pull up voltage. The worst-case scenario for this parameter is in the NMOS open-drain mode,
where there is the maximal voltage difference between Vpull-up and VDD. Furthermore, this parameter highly depends on the Vpullup , the capacitive and resistive load at the output. The rise/fall time should be adjusted accordingly, with a different V pull-up value
and RC time constant resulting from the output load.
19
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8. Magnetic Field Specifications
Magnetic field specifications are valid for temperature range [-40; 160] °C unless otherwise noted.
8.1. Rotary Stray-field Immune Mode – Low Field Variant (-1xx code)
Parameter
Number of magnetic poles
Magnetic Flux Density in X-Y
plane
Magnetic Flux Density in Z
Magnetic in-plane gradient
of in-plane field component
Symbol
Min
NP
4(20)
Typ
-
Max
�𝐵𝐵𝑋𝑋2 + 𝐵𝐵𝑌𝑌2
BX, BY ( 21)
25( 22)
mT
BZ
100
mT
3.8
TCm
-2400
0.075
0.100
0.125
Field too Low Threshold
∆𝐵𝐵𝑋𝑋𝑋𝑋
∆𝑋𝑋𝑋𝑋
BTH_LOW
0.8
1.2
(24)
Field too High Threshold ( 25)
BTH_HIGH
70
100
102
Field Strength Resolution (23)
Condition
-
∆𝐵𝐵𝑋𝑋𝑋𝑋
∆𝑋𝑋𝑋𝑋
Magnet Temperature
Coefficient
Unit
10
0
mT
mm
(this is not the useful signal)
(this is not the useful signal)
1
2
2
��𝑑𝑑𝐵𝐵𝑋𝑋 − 𝑑𝑑𝐵𝐵𝑌𝑌 � + �𝑑𝑑𝐵𝐵𝑋𝑋 + 𝑑𝑑𝐵𝐵𝑌𝑌 �
𝑑𝑑𝑑𝑑
𝑑𝑑𝑑𝑑
𝑑𝑑𝑑𝑑
𝑑𝑑𝑑𝑑
this is the useful signal (see
Figure 58)
ppm
°C
mT
Magnetic field gradient norm
mm LSB (12bits data)
mT
mm
mT
mm
Typ is recommended value to be
set by user (see 14.5.4)
Table 18 - Magnetic specification for rotary stray-field immune- low field variant
20
Due to 4 poles magnet usage, maximum angle measurement range is limited to 180°
21
The condition must be fulfilled for all combinations of BX and BY.
22
Above this limit, the IMC® starts to saturate, yielding to an increase of the linearity error.
23
Only valid with default MAGNET_SREL_T[1..7] configuration
Higher values of Field too Low threshold are not recommended by Melexis and shall only been set in accordance with the
magnetic design and taking a sufficient safety margin to prevent false positive
24
25
Due to the saturation effect of the IMC, the FieldTooHigh monitor detects only defects in the sensor.
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Temperature (°C)
160
Limited
Performances
Nominal
Performances
Typical magnet
characteristics
-40
3.8 5.7
10
∆B XY mT
∆XY mm
Figure 7 - Minimum useful signal definition for rotary stray-field immune application-low field variant
Nominal performances apply when the useful signal ∆𝐵𝐵𝑋𝑋𝑋𝑋 /∆𝑋𝑋𝑋𝑋 is above the typical specified limit. Under
this value, limited performances apply. See section 9.2 for accuracy specifications.
8.2. Linear Stray-field Immune Mode (-2xx code)
Parameter
Symbol
Number of magnetic poles
NP
Magnetic Flux Density in X
BX
Magnetic Flux Density in X-Y
Magnetic Flux Density in Z
Magnetic gradient of X-Z
field components
Distance between the two
IMC®
Typ
Max
2
-
Condition
Linear movement
mT
BY ≤ 20mT
BX, BY(21)
70(22)
mT
Bz
100
mT
�𝐵𝐵𝑋𝑋2 + 𝐵𝐵𝑌𝑌2 , BY>20mT
∆𝐵𝐵𝑋𝑋𝑋𝑋
∆𝑋𝑋
80
Unit
(22)
3
GIMC
Magnet Temperature
Coefficient
TCm
∆𝐵𝐵𝑋𝑋𝑋𝑋
∆𝑋𝑋
mT
mm
6(26)
1.91
∆𝑋𝑋
IMC gain
Field Strength Resolution (23)
Min
1.19
-2400
2
��∆𝐵𝐵𝑋𝑋 � + �
∆𝑋𝑋
∆𝐵𝐵𝑍𝑍 2 (27)
�
𝐺𝐺𝐼𝐼𝐼𝐼𝐼𝐼 ∆𝑋𝑋
1
See chapter 19 for magnetic
center definitions
See (27)
0
0.037
0.05
0.063
Field too Low Threshold
BTH_LOW
0.2
1.2
(24)
Field too High Threshold (25)
BTH_HIGH
35
50
51
ppm
°C
mT
Magnetic field gradient norm
mm LSB expressed in 12bits words
mT
mm
mT
mm
Typ is recommended value to
be set by user (see 14.5.4)
Table 19 - Magnetic specifications for linear stray-field application
26 Below
this value, the performances are degraded due to a reduction of the signal-to-noise ratio, signal-to-offset ratio.
27 IMC
has better performance for concentrating in-plane (x-y) field components, resulting in a better magnetic sensitivity. A
correction factor, called IMC gain has to be applied to the z field component to account for this difference.
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Nominal performances apply when the useful signal ∆Bxz/∆x and temperature ranges are inside the values
defined in the following Figure 8. At higher temperature or lower field gradients, the accuracy of MLX90377
is degraded and Limited Performances apply, as described in Table 23 in section 9.3.
160
Limited
Performances
135
Temperature (°C)
Limited
Performances
Typical magnet
characteristics
3
Nominal
Performances
6
∆BXZ mT
∆X mm
-40
Figure 8 – Minimum useful signal definition for linear stray-field immune application
8.3. Standard/Legacy Mode (-3xx code)
Parameter
Number of magnetic poles
Magnetic Flux Density in X-Y
plane
Magnetic Flux Density in Z
Useful Magnetic Flux
Density Norm
Symbol
Min.
Typ.
Max.
NP
-
2
-
Unit
Condition
�𝐵𝐵𝑥𝑥2 + 𝐵𝐵𝑦𝑦2
Bx, By(21)
70(22)
mT
Bz
100
mT
in absolute value
�𝐵𝐵𝑥𝑥 2 + 𝐵𝐵𝑦𝑦 2 (x-y mode)
BNorm
10(26)
20
mT
�𝐵𝐵𝑥𝑥 2 + �
1
𝐺𝐺𝐼𝐼𝐼𝐼𝐼𝐼
�𝐵𝐵𝑦𝑦 2 + �
1
𝐺𝐺𝐼𝐼𝐼𝐼𝐼𝐼
2
𝐵𝐵𝑧𝑧 � (x-z mode)
2
𝐵𝐵𝑧𝑧 � (y-z mode)
see 14.3.1 for sensing mode
description.
IMC gain
GIMC
1.19
see (27)
Magnet Temperature
Coefficient
TCm
-2400
Field Strength Resolution(23)
BNorm
0.075
0.100
0.125
Field Too Low Threshold
BTH_LOW
0.4
4.0
(24)
mT
LSB
Field Too High Threshold (25)
BTH_HIGH
70
100
100
mT
0
ppm
°C
mT
Magnetic field gradient norm
expressed in 12bits words
Typ is recommended value to
be set by user (see 14.5.4)
Table 20 - Magnetic specifications for Standard application
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Nominal performances apply when the useful signal BNorm is above the typical specified limit. Under this
value, limited performances apply. See Table 24 in section 9.4 for accuracy specifications.
160
Temperature (°C)
Limited
Performances
Nominal
Performances
Typical magnet
characteristic
-40
10
15
20
Norm (mT)
Figure 9 - Minimum useful signal definition for Standard/Legacy application
8.4. Rotary Stray-field Immune Mode - High Field Variant (-5xx code)
Parameter
Symbol
Min
Typ
Max
Number of magnetic poles
NP
4(20)
-
-
Magnetic Flux Density in XY plane
BX, BY (21)
Magnetic Flux Density in Z
BZ
Magnetic in-plane gradient
of in-plane field component
Magnet Temperature
Coefficient
Field Strength Resolution(23)
∆𝐵𝐵𝑋𝑋𝑋𝑋
∆𝑋𝑋𝑋𝑋
TCm
∆𝐵𝐵𝑋𝑋𝑋𝑋
∆𝑋𝑋𝑋𝑋
8.25
Unit
Condition
67(22)
mT
100
mT
�𝐵𝐵𝑋𝑋2 + 𝐵𝐵𝑌𝑌2
(this is not the useful signal)
mT
mm
1
21
-2400
0
0.075
0.100
0.125
Field too Low Threshold
BTH_LOW
1.2
2
(24)
Field too High Threshold(25)
BTH_HIGH
80
100
102
ppm
°C
mT
mm LSB
mT
mm
mT
mm
(this is not the useful signal)
2
2
��𝑑𝑑𝐵𝐵𝑋𝑋 − 𝑑𝑑𝐵𝐵𝑌𝑌 � + �𝑑𝑑𝐵𝐵𝑋𝑋 + 𝑑𝑑𝐵𝐵𝑌𝑌 �
𝑑𝑑𝑑𝑑
𝑑𝑑𝑑𝑑
𝑑𝑑𝑑𝑑
𝑑𝑑𝑑𝑑
this is the useful signal.
Magnetic field gradient norm
(12bits data)
Typ is recommended value to
be set by user (see 14.5.4)
Table 21 - Magnetic specification for rotary stray-field immune
See section 9.5 for accuracy specifications.
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9. Accuracy Specifications
Accuracy specifications are valid for temperature range [-40;160] °C and supply voltage range [4.5; 5.5] V
unless otherwise noted.
9.1. Definitions
This section defines several parameters, which will be used for the magnetic specifications.
ea
ea l Cu
r
su
re ve
d
Cu
rv
e
Id
M
Output (%DC, Deg)
9.1.1. Intrinsic Linearity Error
Noise (pk-pk)
Intrinsic Linearity Error
(LE)
±3σ
Input (Deg.)
Figure 10 - Sensor accuracy definition
Figure 10 depicts the intrinsic linearity error in new parts. The Intrinsic Linearity Error refers to the IC itself
(offset, sensitivity mismatch, orthogonality) considering an ideal magnetic field. Once associated to a
practical magnetic construction and the associated mechanical and magnetic tolerances, the output
linearity error increases. However, it can be significantly reduced with the multi-point end-user calibration
(see 14.2).
9.1.2. Total Angle Drift
After calibration, the output angle of the sensor might still change due to temperature change, aging, etc.
This is defined as the total drift 𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇 :
𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇 = |max{𝜃𝜃(𝜃𝜃𝐼𝐼𝐼𝐼 , 𝑇𝑇, 𝑡𝑡) − 𝜃𝜃(𝜃𝜃𝐼𝐼𝐼𝐼 , 𝑇𝑇𝑅𝑅𝑅𝑅 , 𝑡𝑡0 )}|
where 𝜃𝜃𝐼𝐼𝐼𝐼 is the input angle, 𝑇𝑇 is the temperature, 𝑇𝑇𝑅𝑅𝑅𝑅 is the room temperature, and 𝑡𝑡 is the elapsed
lifetime after calibration. 𝑡𝑡0 represents the status at the start of the operating life. Note the total drift 𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇
is always defined with respect to the angle at room temperature. In this datasheet, 𝑇𝑇𝑅𝑅𝑅𝑅 is typically defined
at 35°C, unless stated otherwise. The total drift is valid for all angles along the full mechanical range. The
total drift is expressed as an unsigned value, to indicate the ideal minimum drift should be 0. In reality, the
drift can happen in both positive and negative directions.
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9.2. Rotary Stray-field Immune Mode – Low Field Variant (-1xx code)
Valid before EoL calibration and for all applications under the conditions described in section 8.1.
Parameter
XY - Intrinsic Linearity Error
Symbol
Min
Le_XY
-1
Typ
Max
Unit
1
Deg.
0.55
Deg.
Filter = 0 (FIR1), for nominal
performance, see section 8.1
1
Deg.
Filter = 0 (FIR1), for limited
performance, see section 8.1
0.7
Deg.
Filter = 1 (FIR1), for limited
performance, see section 8.1
0.5
Deg.
Filter = 2 (FIR1), for limited
performance, see section 8.1
0.85
Deg.
0.2
Deg.
Noise ( 28)
XY - Total Drift
𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇_𝑋𝑋𝑋𝑋
Hysteresis
Output Stray Field Immunity
(29)
∂θFF
0.1
0.6
Deg.
Condition
In accordance of ISO 11452-8,
at 30 Deg.C, with 10mT/mm
magnetic In-plane gradient of
In-plane field component, and
stray-field
strength
of
4000A/m from any direction
Table 22 - Rotary stray-field immune magnetic performance – Low Field Variant
28
±3σ
29
Stray field induced error is linearly proportional to the stray field strength
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9.3. Linear Stray-field Immune Mode (-21x Code)
Valid before EoL calibration and for all applications under the conditions described in section 8.2.
Parameter
XZ - Intrinsic Maximum Error
Symbol
Min
Typ
Max
-2.5
±1.25
2.5
LE_XZ
Unit
Deg.
-4
±2
4
0.3
Noise (28)
0.45
Deg.
Hysteresis
Output Stray Field Immunity
(29)
Deg.
1.4(30)
0.1
∂θFF
0.8
for limited performance, see
section 8.2
Filter = 0, 6mT/mm
Filter = 0, 3mT/mm
0.8(30)
𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇_𝑋𝑋𝑋𝑋
for nominal performance, see
section 8.2
Filter = 1, 6mT/mm
0.9
XZ - Total Drift
Condition
for nominal performance, see
section 8.2
for limited performance, see
section 8.2
Deg.
6mT/mm gradient field
Deg.
In accordance of ISO 11452-8,
at 30 Deg.C, with 6mT/mm
magnetic In-plane gradient of
In-plane field component, and
stray-field strength of 4000A/m
from any direction
Table 23 - Linear stray-field immune magnetic performances
Valid for perfect field gradient. In most applications, an extra error caused by the bias field needs to be added. See Application
note Dual-Disk Linear Stray field Robust Position Sensing on melexis.com for more information.
30
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9.4. Standard/Legacy Mode (-3xx Code)
Valid before EoL calibration and for all applications under the conditions described in section 8.3.
Parameter
Symbol
Min
XY - Intrinsic Linearity Error
LE_XY
-1
XZ - Intrinsic Linearity Error
LE_XZ
-2.5
YZ - Intrinsic Linearity Error
LE_YZ
-2.5
Noise for nominal performance
in section 8.3 in low power
mode (-30x, -33x code) (28)
Noise for limited performance
in section 8.3 in low power
mode (-30x, -33x code) (28)
Typ
Max
Unit
1
Deg.
±1.25
2.5
Deg.
±1.25
2.5
Deg.
0.05
0.1
0.1
0.2
0.05
0.1
Filter = 2
0.2
0.4
Filter = 0
0.14
0.28
0.1
0.2
Deg.
Deg.
Condition
Filter = 0, �𝐵𝐵𝑥𝑥2 + 𝐵𝐵𝑦𝑦2 > 40mT
Filter = 0
Filter = 1
Filter = 2
Noise for nominal performance
in section 8.3 in high speed
mode (-31x code) (28)
0.28
Deg.
Filter = 0
Noise for limited performance
in section 8.3 in high speed
mode (-31x code) (28)
0.56
Deg.
Filter = 0
0.45
XY - Total Drift
XZ - Total Drift
YZ - Total Drift
Deg.
𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇_𝑋𝑋𝑋𝑋
0.6
for limited performance, see
section 8.3
0.6
for nominal performance, see
section 8.3
Deg.
𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇_𝑋𝑋𝑋𝑋
0.8
for limited performance, see
section 8.3
0.6
for nominal performance, see
section 8.3
Deg.
𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇_𝑌𝑌𝑌𝑌
0.05
0.8
for limited performance, see
section 8.3
0.1
for nominal performance, see
section 8.3
Hysteresis
Deg.
0.1
for nominal performance, see
section 8.3
0.2
for limited performance, see
section 8.3
Table 24 - Standard Mode Nominal Magnetic Performances
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9.5. Rotary Stray-field Immune Mode – High Field Variant (-51x Code)
Valid before EoL calibration and for all applications under the conditions described in section 8.4.
Parameter
XY - Intrinsic Linearity Error
Noise
Symbol
Min
LE_XY
-1
Typ
(28)
XY - Total Drift
𝜕𝜕𝜕𝜕𝑇𝑇𝑇𝑇_𝑋𝑋𝑋𝑋
Hysteresis
Output Stray Field Immunity
(29)
0.1
Max
Unit
1
Deg.
0.35
0.5
0.7
Deg.
0.67
Deg.
0.15
Deg.
0.3
∂θFF
Deg.
Condition
Filter = 2
Filter = 1
Filter = 0
In accordance of ISO 11452-8,
at 30 Deg.C, with 21mT/mm
magnetic In-plane gradient of
In-plane field component, and
stray-field strength of 4000A/m
from any direction
Table 25 - Rotary stray-field immune magnetic performance – High Field Variant
10. Memory Specifications
Parameter
Symbol
ROM
ROMsize
32
KB
1 bit parity check (single error
detection)
RAM
RAMsize
1024
B
1 bit parity check (single error
detection)
NVRAMsize
256
B
6 bits ECC (single error correction,
double error detection)
NVRAM
Min
Typ
Max
Unit
Note
Table 26 - Memory Specifications
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11. Output Accuracy and Protocol
11.1. Analog Output
Parameter
Symbol
Min.
Typ.
Thermal analog output Drift
Max.
Unit
Condition
0.2
0.3
%VDD
up to 125 °C
up to 160 °C
12
Analog Output Resolution
RDAC
-4
0.05
Ratiometric Error
1
-0.1
bit
12bit DAC (Theoretical)
+4
LSB12
INL (before EoL
calibration), output
clamped between 397%VDD
3
LSB12
DNL
0.1
%VDD
Table 27 – Analog output accuracy
11.2. Single Edge Nibble Transmission (SENT) SAE J2716
The MLX90377 provides a digital output signal compliant with SAE J2716 Revised APR2016.
11.2.1. Sensor message definition
The MLX90377 repeatedly transmits a sequence of pulses, corresponding to a sequence of nibbles (4 bits),
with the following sequence:
Calibration/Synchronization pulse period 56 clock ticks to determine the time base of the SENT
frame
One 4-bit Status and Serial Communication nibble pulse
A sequence of one up to six 4-bit data nibbles pulses representing the values of the signal(s) to be
transmitted. The number of nibbles will be fixed for each application of the encoding scheme (i.e.
Single Secure sensor format A.3, Throttle position sensor A.1)
One 4-bit Checksum nibble pulse
One optional pause pulse
See also SAE J2716 APR2016 for general SENT specification.
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Figure 11 - SENT message encoding example for two 12bits signals
11.2.2. Sensor message frame contents
The SENT output transmits a sequence of data nibbles, according to the following configurations:
Description
Symbol
Clock tick time
Min
Typ
Tick Time
Max
3
Number of data nibbles
Xdn
3
Frame duration (no pause
pulse)
Npp
154
Frame duration with
pause pulse
Ppc
282
Unit
6
µs
270
ticks
922
ticks
Description
Main use cases:
Normal SENT, 3µs tick time
Slow SENT, 6µs tick time
6
320
Dual Throttle Position sensors
Single Secure sensors
A.1
A.3
Sensor type
6 data nibbles
Table 28 - SENT Protocol Frame Definition
11.2.3. SENT Format Option
The default SENT format option of MLX90377 is Single Secure Sensor A.3 (H.4). The MLX90377 SENT
transmits a sequence of data nibbles; according single secure sensor format defined in SAE J2716 appendix
H.4 ( 31). The frame contains 12-bit angular value, an 8 bit rolling counter and an inverted copy of the most
significant nibble of angular value.
SM
[1:0]
S
[1:0]
Ch 1
[11:8]
Ch 1
[7:4]
12 bit angle data
Ch 1
[3:0]
COUNT
[7:4]
COUNT
[3:0]
~Ch 1
[11:8]
CRC
8 bit rolling counter
Figure 12 - H.4 Single Secure Sensor Frame Format
31
As referenced from section A.3 Single Secure Sensor of the standard.
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Shorthand Description
Tick
time
Data
nibbles
Pause
Pulse
Serial
message
Data
format
SENT2016-03.0us-6dn-ppc(366.0)-esp-A.3
3µs
6
Y
Enhanced
H.4
SENT2016-03.0us-6dn-ppc(366.0)-nsp-A.3
3µs
6
Y
None
H.4
SENT2016-03.0us-6dn-npp-nsp-A.3
3µs
6
N
None
H.4
1..12
6
Y/N
En/None
H.4
SENT2016-##-#us-#dn-###()-###-A.3
Table 29 - H.4 Single Secure Sensor Shorthand examples
11.2.4. Start-up behaviour
The circuit will send initialisation frames once digital start-up is done but angle measurement initialisation
sequence is not yet complete. These initialisation frames content can be chosen by user with the following
option:
SENT_INIT_GM
Initialisation frame value
Comments
0
0x000
SAE compliant
1
0xFFF
OEM requirement
Table 30 - Initialization Frame Content Definition
11.2.5. Output configuration
In SENT mode, the MLX90377 can be configured in open drain mode, normal push-pull mode, as well as an
enhanced emission mode, which is the default configuration, see also section 14.1.1.
The tick time is the unit reference for SENT. The default tick time value is 3μs.
The output resistive load, e.g. the external pull-up or pull-down resistor should be carefully selected,
because the MLX90377 has a built-in high order low pass filter. A large resistive load will deteriorate the
generated SENT signal, and could make the output signal not comply to the SENT specifications, such as
the fall times and the minimum output voltages, e.g. parameters VsatD_lopp/VsatD_hipp in Table 10 in chapter
6. In principle, the values in Table 10 in chapter 6 should be considered, which means it is not
recommended to have a resistive load value smaller than 10kΩ, and a resistive load value smaller than 3kΩ
should be avoided. The maximum output resistive load value should be less than 55kΩ to avoid unexpected
impact from leakage current.
Furthermore, the output capacitance should also be properly chosen, together with the output resistive
load to correspondingly match the application, e.g. tick time, to allow appropriate time constant for the
transmission of the SENT signal. Details can be seen in sections 16.1 and 16.2.
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11.2.6. SENT Output Timing configuration
Different SENT output timing configurations are listed in the following tables
SENT_TICK_TIME
Tick time configuration
Description
0
6 µs
1
1 µs
Not recommended
2
2 µs
Not recommended
3
3 µs
Standard SENT
4
4 µs
Not recommended
5
5 µs
Not recommended
6
12 µs
Do not use
7
24 µs
Do not use
Table 31 - SENT Tick Time Configuration ( -33x code)
NIBBLE_PULSE_CONFIG
High/low time configuration
2
Fixed low time (5 ticks)
3
Fixed high time (6 ticks)
Table 32 - SENT Nibble configuration (high/low times)
11.2.7. Serial message channel (slow channel)
Serial data is transmitted sequentially in bit number 3 and 2 of the status and communication nibble. A
serial message frame stretches over 18 consecutive SENT data messages from the transmitter. All 18 frames
must be successfully received (no errors, calibration pulse variation, data nibble CRC error, etc.) for the
serial value to be received.
11.2.7.1. Enhanced Serial Message (ESM)
Enhanced serial message with 12-bit data and 8-bit message ID is used (SAE J2716 APR2016 5.2.4.2, Figure
5.2.4.2-2). According to the standard, SM[0] contains a 6bits CRC followed by a 12-bits data. Message
content is defined by a 8-bit message ID transmitted in the SM[1] channel. Correspondence between ID
and message content is defined in the tables below (Table 33, Table 34 and Table 35).
SM
[1:0]
S
[1:0]
Status Nibble =
Ch 1
[11:8]
2 bit serial message
2 bit status
Figure 13 - SENT Status Nibble and Serial Message
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By default, the short sequence consisting of a cycle of 24 data is transmitted (Table 33). An extended
sequence can be used through configuration of SENT_SLOW_EXTENDED (Table 34). Additionally, the norm
of the B field detected by the sensor can be returned at the end of the sequence by setting
SENT_SLOW_BFIELD (Table 35)
#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
8-bit ID
0x01
0x06
0x01
0x05
0x01
0x03
0x01
0x07
0x01
0x08
0x01
0x09
0x01
0x0A
0x01
0x23
0x01
0x29
0x01
0x2A
0x01
0x2B
0x01
0x2C
Item
Diagnostic error code
SENT standard revision
Diagnostic error code
Manufacturer code
Diagnostic error code
Channel 1 / 2 Sensor type
Diagnostic error code
Fast channel 1: X1
Diagnostic error code
Fast channel 1: X2
Diagnostic error code
Fast channel 1: Y1
Diagnostic error code
Fast channel 1: Y2
Diagnostic error code
(Internal) temperature
Diagnostic error code
Sensor ID #1
Diagnostic error code
Sensor ID #2
Diagnostic error code
Sensor ID #3
Diagnostic error code
Sensor ID #4
Source data
Current status code from RAM
SENT_REV from NVRAM
Current status code from RAM
SENT_MAN_CODE from NVRAM
Current status code from RAM
SENT_SENSOR_TYPE from NVRAM
Current status code from RAM
SENT_CHANNEL_X1 from NVRAM
Current status code from RAM
SENT_CHANNEL_X2 from NVRAM
Current status code from RAM
SENT_CHANNEL_Y1 from NVRAM
Current status code from RAM
SENT_CHANNEL_Y2 from NVRAM
Current status code from RAM
Current temperature from RAM
Current status code from RAM
SENT_SENSOR_ID1 from NVRAM
Current status code from RAM
SENT_SENSOR_ID2 from NVRAM
Current status code from RAM
SENT_SENSOR_ID3 from NVRAM
Current status code from RAM
SENT_SENSOR_ID4 from NVRAM
Table 33 - SENT Enhanced Slow Channel Standard Data Sequence
#
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
8bit ID
0x01
0x90
0x01
0x91
0x01
0x92
0x01
0x93
0x01
0x94
0x01
0x95
0x01
0x96
0x01
0x97
Item
Diagnostic error code
OEM Code #1
Diagnostic error code
OEM Code #2
Diagnostic error code
OEM Code #3
Diagnostic error code
OEM Code #4
Diagnostic error code
OEM Code #5
Diagnostic error code
OEM Code #5
Diagnostic error code
OEM Code #5
Diagnostic error code
OEM Code #8
Source data
Current status code from RAM
SENT_OEM_CODE1 from NVRAM
Current status code from RAM
SENT_OEM_CODE2 from NVRAM
Current status code from RAM
SENT_OEM_CODE3 from NVRAM
Current status code from RAM
SENT_OEM_CODE4 from NVRAM
Current status code from RAM
SENT_OEM_CODE5 from NVRAM
Current status code from RAM
SENT_OEM_CODE6 from NVRAM
Current status code from RAM
SENT_OEM_CODE7 from NVRAM
Current status code from RAM
SENT_OEM_CODE8 from NVRAM
Table 34 - SENT Slow Channel Extended Data Sequence
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#
25
41
8bit ID
0x80
0x80
Item
source data
Field Strength
SENT_SLOW_EXTENSION
0: Disabled. No further extension
1: NTC value
2: field-strength temperature
compensated, before magnet sensitivity
compensation
3: field-strength temperature and gain
independent
(standard sequence)
Field Strength
SENT_SLOW_EXTENSION
0: Disabled. No further extension
1: NTC value
2: field-strength temperature
compensated, before magnet sensitivity
compensation
3: field-strength temperature and gain
independent
(extended sequence)
Table 35 - SENT Slow Channel Magnetic Field Norm ID and position
For Field Strength encoding, see section 14.5.4.
11.2.7.2. Short Serial Message (SSM)
Short serial message with 8-bit data and 4-bit message ID is used (SAE J2716 APR2016 5.2.4.1, Figure
5.2.4.1-1). According to the standard, it contains a 8-bit data followed by a 4-bit CRC.
#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
4-bit ID
0x01
0x06
0x01
0x05
0x01
0x03
0x01
0x07
0x01
0x08
0x01
0x09
0x01
0x0A
0x01
0x02
0x01
0x0B
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Item
Diagnostic error code
SENT standard revision
Diagnostic error code
Manufacturer code
Diagnostic error code
Channel 1 / 2 Sensor type
Diagnostic error code
Fast channel 1: X1
Diagnostic error code
Fast channel 1: X2
Diagnostic error code
Fast channel 1: Y1
Diagnostic error code
Fast channel 1: Y2
Diagnostic error code
(Internal) temperature
Diagnostic error code
Sensor ID #1
Source data
Current status code from RAM
SENT_REV from NVRAM
Current status code from RAM
SENT_MAN_CODE from NVRAM
Current status code from RAM
SENT_SENSOR_TYPE from NVRAM
Current status code from RAM
SENT_CHANNEL_X1 from NVRAM
Current status code from RAM
SENT_CHANNEL_X2 from NVRAM
Current status code from RAM
SENT_CHANNEL_Y1 from NVRAM
Current status code from RAM
SENT_CHANNEL_Y2 from NVRAM
Current status code from RAM
Current temperature from RAM
Current status code from RAM
SENT_SENSOR_ID1 from NVRAM
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#
19
20
21
22
23
24
25
26
4-bit ID
0x01
0x0C
0x01
0x0D
0x01
0x0E
0x01
0x04
Item
Diagnostic error code
Sensor ID #2
Diagnostic error code
Sensor ID #3
Diagnostic error code
Sensor ID #4
Diagnostic error code
Field Strength
Source data
Current status code from RAM
SENT_SENSOR_ID2 from NVRAM
Current status code from RAM
SENT_SENSOR_ID3 from NVRAM
Current status code from RAM
SENT_SENSOR_ID4 from NVRAM
Current status code from RAM
Field Strength (mapped to 8 bit)
Table 36 - SENT Short Serial Slow Channel Standard Data Sequence
11.2.8. Serial Message Error Code
11.2.8.1. Enhanced Serial Message (ESM)
The list of error and status messages transmitted in the 12-bit Serial Message data field when Serial
Message 8-bit ID is 0x01, is given in the Table 37. The error is one-hot encoded and therefore each bit is
linked to one or several diagnostics. Only the first error detected is reported and serial message error code
will not be updated until all the errors have disappeared. This mechanism ensures only one error at a time
takes control of the error debouncing counter (see 14.5.2).
The MSB acts as an error Flag when SENT_DIAG_STRICT is set. This bit will be high only when an error is
present. This bit can be kept high even if no error is present (SENT_DIAG_STRICT = 0).
Bit Nb
12 Bit Data (hex)
Diagnostic
-
0x000 / 0x800
No error
0
0x801
GAINOOS
1
0x802
FieldTooLow
2
0x804
FieldTooHigh
3
4
0x808
0x810
ADCclip
ADC_test
5
0x820
Analog Supply Monitors
6
0x840
Digital Supply Monitors
7
0x880
8
0x900
9
0xA00
10
0xC00
RoughOffset
Over/Under Temp /
ADCdrop
DSP overflow / HE_Bias /
Analog Front End
Supply Bias Current /
Stress Range
11
0x800
Extra Error Flag
Comments
Programmable (see SENT_DIAG_STRICT in
Table 42)
Magnetic Signal Conditioning Gain
Clamping
Fieldstrength is below defined low
threshold (see 14.5.4)
Fieldstrength is above defined high
threshold (see 14.5.4)
ADC is saturated, either low or high
ADC made wrong conversion
Detects VDDA (VDEC) over and under
voltage or VDD under voltage
Detects VDDD (1.8V internal digital
supply) overvoltage
Hall Element offset monitor
Temperature sensor monitor (see 14.5.3) /
ADC conversion interruption
DSP overflow / Hall Element biasing issue /
Analog front end self-test
Current biasing system monitor / Stress
Sensor Readout
set to one if any error present (only when
SENT_DIAG_STRICT = 1). Otherwise,
always high.
Table 37 - SENT Serial Message Error Code for Enhanced Serial Message
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11.2.8.2. Short Serial Message (SSM)
The list of error and status messages transmitted in the 8-bit Serial Message data field when Serial Message
8-bit ID is 0x01, is given in the Table 38. The error is one-hot encoded and therefore each bit is linked to
one or several diagnostics. Only the first error detected is reported and serial message error code will not
be updated until all the errors have disappeared. This mechanism ensures only one error at a time takes
control of the error debouncing counter (see 14.5.2).
Bit Nb
8 Bit Data (hex)
Diagnostic
Comments
-
0x00
No error
0
0x01
GAINOOS
1
0x02
FieldTooLow
2
0x04
FieldTooHigh
3
0x08
ADCclip / ADC_test
ADC is saturated, either low or high / ADC
made wrong conversion
4
0x10
Analog Supply Monitors /
Digital Supply Monitors /
Supply Bias Current /
Stress Range
Detects VDDA (VDEC) over and under
voltage or VDD under voltage / Detects
VDDD (1.8V internal digital supply)
overvoltage / Current biasing system
monitor / Stress Sensor Readout
5
0x20
RoughOffset
Hall Element offset monitor
6
0x40
Over/Under Temp /
ADCdrop
Temperature sensor monitor (see 14.5.3) /
ADC conversion interruption
Magnetic Signal Conditioning Gain
Clamping
Fieldstrength is below defined low
threshold (see 14.5.4)
Fieldstrength is above defined high
threshold (see 14.5.4)
Table 38 - SENT Serial Message Error Code for Short Serial Message
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11.2.9. SENT configuration shorthand definition
Shorthand description
Format
Req
90377 programmable setting
SENT SAE J2716 Rev
SENT
xxxx
2007
2008
2010
2016
CRC_2007
0
> 2007
1
2007
Clock Tick length [µs]
XX.X µs
SENT format option
H.x
Pause Pulse Option
npp
ppc
(xxx.0)
xxx
Use of Serial protocol
nsp
ssp
esp
SENT_TICK_TIME
0
SENT 6µs
1
SENT 1µs
1 -57 deg.C
8
8
8
DIAG_TEMP_THR_HIGH
Temperature threshold & limiter for over-temperature
diagnostic. Default=128 -> 183 deg.C
128
128
8
DIAG_FIELDTOOLOWTHRES
Field strength limit under which a fault is reported. (see
14.5.4)
6
0
8
DIAG_FIELDTOOHIGHTHRES
Field strength limit over which a fault is reported. (see
14.5.4)
255
255
8
DIAG_DEBOUNCE_STEPDO
WN
Diagnostic debouncing stepdown time used for recovery
time setting
1
1
4
DIAG_DEBOUNCE_STEPUP
Diagnostic debouncing stepup time used for hold time
setting
1
1
4
DIAG_DEBOUNCE_THRESH
Diagnostic debouncing threshold
1
1
6
COLD_SAFE_STARTUP_EN
Normal (0) or safe start-up (1) after power-on reset
0
0
1
OUT_ALWAYS_HIGHZ
Forces the OUT pin in high-Z mode (for test mode, Do
not modify!)
0
0
1
SENT_REPORT_MODE_ANA
1: Enables the error message within SENT/SPC frame in
ANA diagnostic mode. See DIAG_FAULT_CODE
0
N/A
2
DIAG_FAULT_CODE
Defines the error message = DIAG_FAULT_CODE + FF9
6
N/A
3
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Parameter
Default Values
Description
SENT
Analog/PWM
#bits
DAC_REPORT_MODE_ANA
Defines the DAC state in analog-fault report mode
N/A
0
2
SENT_INIT_GM
Initialization frame definition until first valid data
0: 000
1 : DIAG_FAULT_CODE + FF9
0
N/A
1
OUT_DIAG_HIZ_TIME
Output Digital failure (HiZ) recovery time.
= 6 + OUT_DIAG_HIZ_TIME ms
0
0
5
PROTOCOL
0: SENT without pause
1: PWM
2: SENT with pause
3: N/A
4: Analog output
5: SENT-B (SENT rev 5) - reserved for future use
2
4
3
ABE_OUT_MODE
HW backend output-amplifier mode selection
0: Analog output (12 bit)
1: Digital output with open-drain-Nmos
2: Digital output with open-drain-Pmos
3: Digital output with Push-Pull
4: Digital output with improved emission
4
0
3
ABE_DAC_SEQ_BYPASS
DAC sequencer bypass option
0
1
1
DAC_SEQ_LUT_SEL
DAC Sequence LUT, default for 3µs tick time. Do not
modify!
6
N/A
4
NV_DAC_SEQ_CLK_DIV
DAC Sequence LUT, default for 3µs tick time. Do not
modify!
0
N/A
3
NIBBLE_PULSE_CONFIG
Sets the SENT nibble high/low-time configuration
2: 5 fixed ticks low time (Default)
3: 6 fixed ticks high time
2
N/A
2
2
N/A
2
N/A
0
2
OUTPUT CONFIGURATIONS
PWM PROTOCOL OPTIONS
PWM_POL
Invert the PWM polarity
0: PWM Period start = falling edge , % DC active low
PWM_REPORT_MODE_ANA
Error message within PWM frame
0x0: PWM DC_FAULT
0x1: HiZ
0x2: Vss
0x3: Vdd
PWM DC_FAULT
PWM Duty Cycle in case of Fault
PWM DC_ FIELDTOOLOW
PWM Duty Cycle in case of Field Strength Too Low
PWM DC_ WEAKMAG
PWM Duty Cycle in case of Weak Magnet
SENT PROTOCOL OPTIONS
SENT_TICK_TIME
Normal SENT low power mode
0
N/A
3
SERIAL_CONFIG
1: NSP
3
N/A
2
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Parameter
Default Values
Description
SENT
Analog/PWM
#bits
2: SSP
3: ESP
SPC_FORMAT
SPC frame sequence:
8: see SENT_FC_FORMAT[2:0]
8
N/A
4
SENT_LEGACY_CRC
Enable legacy CRC calculation
0: The SAE J2716 recommended CRC is calculated
0
N/A
1
STATUS_IN_CRC
1: Add SCN in checksum calculation
0
N/A
1
SENT_FC_FORMAT
SENT format option (only if SPC_FORMAT = 8)
1: Format H.1 (A.1, Two 12-bit Fast Channels)
2: Format H.2 (One 12-bit Fast Channel, 3 x 4 bit)
3: Format H.3 (One 12-bit fast channel, 4 x 3 bit)
4: Format H.4 (A.3, 12-bit Fast Channel & Single secure)
5: Format H.5 (12-bit Fast Channel & zero values)
6: Format H.6 (14-bit Fast Channel1 & 10-bit Fast
Channel2)
7: Format H.7 (16-bit Fast Channel & 8-bit Fast
Channel2)
4
N/A
3
TWO_ANGLES_FRAME
Enable 2 fields measure per output frame (SENT with
pulse)
1
N/A
1
T_FRAME
SENT w/ PP frame length
PWM period (4µs/LSB)
320
N/A
12
T_SYNC_DELAY
SENT - ADC synchronization delay - used in SENT-withpause only
27
N/A
12
SENT_FAST_CHANNEL_2
Definition of data transmitted in the SENT fast channel 2
in case SENT_FC_FORMAT=1, 6 or 7
0
Temperature sensor (SP ID 0x23)
1
0xFF9(d4089) - CH1
2
RAM data (RAMPROBE_PTR)
3
0xFFF(d4095) - CH1
0
N/A
2
SENT_SLOW_EXTENDED
ESM length configuration
0
N/A
1
SENT_SLOW_EXTENSION
ESM length configuration
0
N/A
2
SENT_DIAG_STRICT
ESM length configuration
0
N/A
1
SENT PROTOCOL OPTIONS
SERIAL MESSAGE CONFIGURATION
SENT_SENSOR_TYPE
Part of SSM/ESM : Channel 1/2 sensor type
0x050
N/A
12
SENT_MAN_CODE
Part of SSM/ESM: Manufacturer code
0x000
N/A
12
SENT_REV
Part of SSM/ESM: SENT standard revision
0x4
N/A
4
SENT_CHANNEL_X1
Part of SSM/ESM: Fast-channel 1 - X1
0
N/A
12
SENT_CHANNEL_X2
Part of SSM/ESM: Fast-channel 1 - X2
0
N/A
12
SENT_CHANNEL_Y1
Part of SSM/ESM: Fast-channel 1 - Y1
0
N/A
12
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Parameter
Default Values
Description
SENT
Analog/PWM
#bits
SENT_CHANNEL_Y2
Part of SSM/ESM: Fast-channel 1 - Y2
0
N/A
12
SENT_SENSOR_ID1
Part of SSM/ESM : Sensor ID-1
0
N/A
12
SENT_SENSOR_ID2
Part of SSM/ESM : Sensor ID-2
0
N/A
12
SENT_SENSOR_ID3
Part of SSM/ESM : Sensor ID-3
0
N/A
12
SENT_SENSOR_ID4
Part of SSM/ESM : Sensor ID-4
0
N/A
12
SENT_OEM_CODE1
Part of SSM/ESM : OEM code 1
0
N/A
12
SENT_OEM_CODE2
Part of SSM/ESM : OEM code 2
0
N/A
12
SENT_OEM_CODE3
Part of SSM/ESM : OEM code 3
0
N/A
12
SENT_OEM_CODE4
Part of SSM/ESM : OEM code 4
0
N/A
12
SENT_OEM_CODE5
Part of SSM/ESM : OEM code 5
0
N/A
12
SENT_OEM_CODE6
Part of SSM/ESM : OEM code 6
0
N/A
12
SENT_OEM_CODE7
Part of SSM/ESM : OEM code 7
0
N/A
12
SENT_OEM_CODE8
Part of SSM/ESM : OEM code 8
0
N/A
12
Table 42 - MLX90377 End-User Programmable Items Table
Performances described in this document are only achieved by adequate programming of the device. To
ensure desired functionality, Melexis recommends following its programming guide and to contact its
technical or application service.
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13. End User Identification Items
Default Values
Parameter
Description
USER_ID0
Bin1 from production test, can also be reserved for end-user to
program information to keep traceability
USER_ID1
Analog
SENT
#bits
1
8
Reserve for end-user to program information to keep traceability
N/A
8
USER_ID2
Reserve for end-user to program information to keep traceability
0x20
8
USER_ID3
Reserve for end-user to program information to keep traceability
N/A
8
USER_ID4
Reserve for end-user to program information to keep traceability
N/A
8
USER_ID5
Reserve for end-user to program information to keep traceability
N/A
8
IMC / application type:
IMC_VERSION
0: Sun (rotary stray field robust low field variant)
0 for -1xx order code
1: Clover (standard/legacy)
1 for -3xx order code
2: Dual-disk (linear stray field robust)
2 for -2xx order code
4: Bubble (rotary stray field robust high field variant)
4 for -5xx order code
TEST_STATUS
Bin 1 verification bit
MLX_ID0
X-Y position on the wafer (8 bit each)
MLX_ID1
MLX_ID2
Wafer ID [b15..11]
Lot ID [b10..0]
Fab ID (4 bits)
Test Database ID (6 bits)
6
1
1
MLX
16
MLX
16
MLX
16
Table 43 - Melexis and Customer ID fields description
User identification numbers (48 bits) are freely usable by customers for traceability purpose. Other IDs are
read only.
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14. Description of End-User Programmable Items
14.1. Output Modes
14.1.1. OUT mode (ABE_OUT_MODE and ABE_DAC_SEQ_BYPASS)
Defines the Output Stage mode (outside fail-safe state) in application.
ABE_OUT_MODE
ABE_DAC_SEQ_BYPASS
Description
Comments
0
1
Analog output (12-bit DAC)
1
1
Digital output with opendrain-Nmos
Requires a pull-up resistor on
output.
2
1
Digital output with opendrain-Pmos
Requires a pull-down resistor on
output.
3
1
Digital output with PushPull
.
4
0
Digital
output
improved emission
with
Table 44 - Output Mode Selection
14.1.2. Digital OUT protocol (PROTOCOL)
Selection of the measurement timing mode and the corresponding output protocol
PROTOCOL
Descriptions
0
Continuous asynchronous angle acquisition, SENT without pause
1
Continuous asynchronous angle acquisition, PWM
2
Continuous synchronous angle acquisition, SENT with pause
3
master-triggered angle transmission, SPC (with or without ID)
4
continuous asynchronous angle acquisition, analog output (DAC)
Table 45 - Protocol Selection
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14.1.3. Serial Channel Configuration
Slow Channel configuration:
SERIAL_CONFIG
Descriptions
0
Slow Channel isn't present, the whole nibble is skipped =>
violating the protocol. Do not use.
1
No serial message
2
Short serial message
3
Enhanced serial message
Table 46 - SENT Serial channel Configuration
14.1.4. PWM Output Mode
If PWM output mode is selected, the output signal is a digital signal with Pulse Width Modulation (PWM).
The PWM polarity is selected by the PWMPOL parameter:
PWM_POL = 0 for a low level at 100%
PWM_POL = 1 for a high level at 100%
The PWM frequency is selected in the range [100, 2000] Hz by the T_FRAME parameter (12bits), defining
the period time in the range [0.5; 10] ms. Minimum allowed value for T_FRAME is therefore 125 (0x7d).
𝑇𝑇𝑃𝑃𝑃𝑃𝑃𝑃 =
4
× 𝑇𝑇_𝐹𝐹𝐹𝐹𝐹𝐹𝐹𝐹𝐹𝐹
106
The PWM period is subject to the same tolerances as the main clock (see ΔTck).
14.2. Output Transfer Characteristic
Figure 15 gives the simplified digital signal processing chain from the position after ADC to the output. This
section explains the compensation capability of the IC. The remainder of this chapter explains every
parameter in more detail.
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Figure 15 – A Digital Signal Process Chain from ADC to the Output of MLX90377
There are 4 different possibilities to define the transfer function (LNR) as specified in the Table 47.
With 4 arbitrary points (defined by X and Y coordinates) and 5 slopes
With 8 arbitrary points (defined by X and Y coordinates)
With 17 equidistant points for which only the Y coordinates are defined
With 32 equidistant points for which only offset of Y compared to the average value is defined
Output Transfer Characteristic
DSP_SEL_4PTS
DSP_LNR_RESX2
4 Arbitrary Points
1
0
8 Arbitrary Points
1
1
17 Equidistant Points
0
0
32 Equidistant Points
0
1
Table 47 - Output Transfer Characteristic Selection Table
Parameter
LNR type
Value
Unit
CW
All
0 counterclockwise
1 clockwise
LSB
DP
All
0 … 359.9999
deg
LNR_A_X
LNR_B_X
LNR_C_X
LNR_D_X
4 pts, X coordinates
0 … 359.9999
deg
LNR_A_Y
LNR_B_Y
LNR_C_Y
LNR_D_Y
4 pts, Y coordinates
0 … 100
-50 … + 150
%
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Parameter
LNR type
Value
Unit
LNR_S0
LNR_A_S
LNR_B_S
LNR_C_S
LNR_D_S
4 pts, slopes
-17 … 0 … 17
%/deg
LNR_X00..X07
8 pts, X coordinates
0 … 359.9999
deg
LNR_Y00..Y16
8,17 pts, Y coordinates
0..100
-50 … + 150
%
LNN_DELTA_Y00..Y32
33 pts offsets
+/-3.125%
+/-6.25%
+/-12.5%
+/-25%
%
WORKING RANGE
17/33 pts
65.5 … 360
32.75 … 180
deg
CLAMPLOW
All
0 … 100
%
CLAMPHIGH
All
0 … 100
%
Table 48 - Output linearization and clamping parameters
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14.2.1. Enable scaling Parameter
This parameter enables to double the scale of Y coordinates linearisation parameters from [0 .. 100]% to [50 .. 150]% according to the following table (Table 49). This is valid for all linearisation schemes except the
32 points.
USEROPTION_SCALING
LNR_Y min value
LNR_Y max value
0
0%
100%
1
-50%
150%
Table 49 - USEROPTION_SCALING parameter
14.2.2. CW (Clockwise) Parameter
The CW parameter defines the magnet rotation direction.
0 or counter clockwise is the defined by the 1-4-5-8 pin order direction for the SOIC-8 package, 18-9-16 pin order direction for the TSSOP-16 package, and 1-2-3-4 pin order direction for the
DMP-4 package.
1 or clockwise is defined by the reverse direction: 8-5-4-1 pin order direction for the SOIC-8
package, 16-9-8-1 pin order direction for the TSSOP-16 package, and 4-3-2-1 pin order direction
for the DMP-4 package.
Refer to the drawing in the sensitive spot positioning section (19.1.4, 19.2.4, 19.3.6).
14.2.3. Discontinuity Point (or Zero Degree Point)
The Discontinuity Point defines the 0° point on the circle. The discontinuity point places the origin at any
location of the trigonometric circle. The DP is used as reference for all the angular measurements.
0 Deg.
360 Deg.
Figure 16 - Discontinuity Point Positioning
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14.2.4. 4-pts LNR Parameters
The LNR parameters, together with the clamping values, fully define the relation (the transfer function)
between the digital angle and the output signal.
The shape of the MLX90377 4-pts transfer function from the digital angle value to the digital output is
described in Figure 17. Seven segments can be programmed but the clamping levels are always flat.
Two to six calibration points are available, reducing the overall non-linearity of the IC by almost an order
of magnitude each time. Three or more calibration points will be preferred by customers looking for
excellent non-linearity figures. Two-point calibrations will be preferred by customers looking for a lower
cost calibration set-up and shorter calibration time.
100%
CLAMPHIGH
D
Output [%]
LNR_D_Y
C
LNR_C_Y
B
LNR_B_Y
Slope LNR_C_S
Slope LNR_B_S
Slope
LNR_A_S
A
LNR_A_Y
Slope LNR_D_S
Slope
LNR_S0
CLAMPLOW
LNR_A_X
DP(0,0)
LNR_B_X
LNR_C_X
LNR_D_X
Angle [°] 360
Figure 17 – 4-pts Linearization Parameters Description
14.2.5. 8-pts LNR Parameters
The LNR parameters, together with the clamping values, fully define the relation (the transfer function)
between the digital angle and the output signal.
The shape of the MLX90377 8-pts transfer function from the digital angle value to the output voltage is
described in Figure 18. Eight calibration points [LNR_X0...7, LNR_Y0...7] together with 2 fixed points at the
extremity of the range ([0°, 0%] ; [360°, 100%]) divides the transfer curve into 9 segments. Each segment
is defined by 2 points and the values in between is calculated by linear interpolation.
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100%
CLAMPHIGH
Output [%]
...
LNR_Y7
LNR_Y1
LNR_Y0
2
1
0
4
3
7
6
5
CLAMPLOW
DP(0,0)
...
LNR_X0 LNR_X1
...
Angle [°]
LNR_X7
360
Figure 18 – 8-pts Linearization Parameters Description
14.2.6. 17-pts LNR Parameters
The LNR parameters, together with the clamping values, fully define the relation (the transfer function)
between the digital angle and the output signal.
The shape of the MLX90377 17-pts transfer function from the digital angle value to the output voltage is
described in Figure 19. In the 17-pts mode, the output transfer characteristic is Piece-Wise-Linear (PWL).
LNR_Y16
16
100
LNR_Y15
LNR_Y14
15
Output [%]
...
13
11
10
LNR_Y9
LNR_Y8
50
LNR_Y7
8
7
...
5
9
14
12
Prog. Slope : NV_GAIN
w=
16·360°
NV_GAIN
Δx fixed delta angle (w/16)
6
4
LNR_Y3
LNR_Y2
LNR_Y1
DP(0,0)
LNR_Y0
2
1
180-
w
2
3
Δx
180
Angle [°]
0
180+
w
2
Figure 19 – 17-pts Linearization Parameters Description
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All the Y-coordinates can be programmed from -50% up to +150% to allow clamping in the middle of one
segment (like on the figure), but the output value is limited to CLAMPLOW and CLAMPHIGH values.
Between two consecutive points, the output characteristic is interpolated.
14.2.7. 33-pts LNR parameters
The LNR parameters, together with the clamping values, fully define the relation (the transfer function)
between the digital angle and the output signal.
The shape of the MLX90377 33-pts transfer function from the digital angle value to the output voltage is
described in Figure 20 below. In the 33-pts mode, the output transfer characteristic is Piece-Wise-Linear
(PWL).
The points are spread evenly across the working range (see. 14.2.8 and 14.2.9 for working range selection).
The Y-coordinates can be offset from the ideal characteristic within an adjustable range defined by
LNR_DELTA_Y_EXPAND_LOG2. The available values are summarized in Table 50. All LNR_delta_Y##
parameters are encoded in a fractional signed 8-bit value.
Adjustable
range
100
LNR_Delta_Y32
CLAMPHIGH
Output [%]
LNR_deltaY :
Programmable delta correction vs. Ideal slope (%)
The adjustable range can be selected from
[+/-3.125%, +/-6.25%, +/-12.5%, +/-25%]
Δx fixed delta angle (w/32)
Prog. Slope : NV_GAIN
LNR_Delta_Y16
50
Anchor point
w=
CLAMPLOW
Δx
LNR_Delta_Y01
DP(0,0)
180-
16·360°
NV_GAIN
w
2
180
Angle [°]
180+
w
2
Figure 20 – 33-pts Linearization Parameters Description
LNR_DELTA_Y_EXP
AND_LOG2
Adjustable
Range
Correction
resolution
0
±3.125%
0.024%
1
±6.25%
0.049%
2
±12.5%
0.098%
3
±25%
0.20%
Table 50 - LRN_DELTA_Y_EXPAND_LOG2 values and correction resolution
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14.2.8. WORK_RANGE Parameter for Angle Range Selection
The parameter WORK_RANGE determines the input range on which the 16 or 32 segments are uniformly
spread. This parameter is provided for compatibility with former versions of Melexis Triaxis sensors. For
full featured working range selection, see 14.2.9. For WORK_RANGE parameter, following table applies.
WORK_RANGE
Range
Δx 17pts
Δx 32pts
WORK_RANGE
Range
Δx 17pts
Δx 32pts
0
180.0°
11.3°
5.6°
8
90.0°
5.6°
2.8°
1
160.0°
10.0°
5.0°
9
72.0°
4.5°
2.3°
2
144.0°
9.0°
4.5°
10
60.0°
3.8°
1.9°
3
131°
8.2°
4.1°
11
51.45°
3.2°
1.6°
4
120.0°
7.5°
3.8°
12
45.0°
2.8°
1.4°
5
221.5°
6.9°
3.5°
13
40.0°
2.5°
1.3°
6
103°
6.4°
3.2°
14
36.0°
2.3°
1.1°
7
96°
6.0°
3.0°
15
32.75°
2.0°
1.0°
Table 51 - Work range for 180° periodicity (ordering code -5xx)
WORK_RANGE
Range
Δx 17pts
Δx 32pts
WORK_RANGE
Range
Δx 17pts
Δx 32pts
0
360.0°
22.5°
11.3°
8
180.0°
11.3°
5.6°
1
320.0°
20.0°
10.0°
9
144.0°
9.0°
4.5°
2
288.0°
18.0°
9.0°
10
120.0°
7.5°
3.8°
3
261.8°
16.4°
8.2°
11
102.9°
6.4°
3.2°
4
240.0°
15.0°
7.5°
12
90.0°
5.6°
2.8°
5
221.5°
13.8°
6.9°
13
80.0°
5.0°
2.5°
6
205.7°
12.9°
6.4°
14
72.0°
4.5°
2.3°
7
192.0°
12.0°
6.0°
15
65.5°
4.1°
2.0°
Table 52 - Work range for 360° periodicity (ordering code -2xx, -3xx)
Outside of the selected range, the output will remain at clamping levels.
14.2.9. WORK_RANGE_GAIN Parameter for Angle Range Selection
Alternatively, the range for the angle can be selected using the WORK_RANGE_GAIN parameter, which
applies a fixed gain to the transfer characteristics. WORK_RANGE_GAIN is coded on 8 bits where the 4 MSB
defines the integer part and the 4 LSB the fractional part (in power of twos). Therefore, the following
equation applies to define the angle range w:
𝑤𝑤 =
16 ∗ 𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀
𝑊𝑊𝑊𝑊𝑊𝑊𝑊𝑊_𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅_𝐺𝐺𝐺𝐺𝐺𝐺𝐺𝐺
MaxRange depends on the application. It is 360° for ordering code -2xx / -3xx, and 180° for ordering code
-5xx (rotary stray-field immune). Both minimal and maximal angles are then defined by:
𝜃𝜃𝑚𝑚𝑚𝑚𝑚𝑚 =
𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀 − 𝑤𝑤
𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀𝑀 + 𝑤𝑤
; 𝜃𝜃𝑚𝑚𝑚𝑚𝑚𝑚 =
2
2
where θmin corresponds to the angle yielding 0% output and θmax the angle giving a 100% output.
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Using WORK_RANGE_GAIN parameter, the anchor point is kept at MaxRange/2 and the range is
symmetrically set around this value. It creates a zoom-in of the angle around this point.
Following tables give some values as example:
GAIN
Factor
Range (w)
θmin
θmax
Δx 17pts
Δx 32pts
0x10
1
180°
0°
180°
11.25°
5.63°
0x20
2
90°
45°
135°
5.63°
2.81°
0x40
4
45°
67.5°
112.5°
2.81°
1.41°
0xFF
15.94
11.3°
78.7°
101.3°
0.71°
0.35°
Table 53 - Working range defined by WORK_RANGE_GAIN parameter (ordering code -5xx)
GAIN
Factor
Range (w)
θmin
θmax
Δx 17pts
Δx 32pts
0x10
1
360°
0°
360°
22.5°
11.3°
0x20
2
180°
90°
270°
11.3°
5.6°
0x40
4
90°
135°
225°
5.6°
2.8°
0xFF
15.94
22.6°
168.7°
191.3°
1.41°
0.71°
Table 54 - Working range defined by WORK_RANGE_GAIN parameter (ordering code -2xx, -3xx)
Outside of the working range, the output will remain at clamping levels.
14.2.10. Thermal OUTSLOPE offset correction
Two parameters, OUTSLOPEHOT and OUTSLOPECOLD, are used to add a temperature dependent offset.
This feature is enabled by the parameter OUTSLOPE_SEL that apply this modification either directly to the
angle or after the linearisation function. The MLX90377 uses its internal linearized temperature to compute
the offset shift as depicted in the figure below (Figure 21).
+6.25%
(at ΔT=128°C)
OUTSLOPEHOT
OUTSLOPECOLD
-6.25%
(at ΔT=128°C)
-40
Temperature (°C)
35
160
Figure 21 - Temperature compensated offset
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The thermal offset can be added or subtracted to the output, before the clamping. The span of this offset
is ±6.25% of the full output scale for a temperature difference of 128°C. The added thermal offset varies
with temperature following the equations below. The two thermal coefficients are encoded in signed two’s
complement 8bit format (-128..127) and defined separately below 35°C (OUTSLOPECOLD) and above 35°C
(OUTSLOPEHOT).
OUTSLOPE_SEL
Description
No thermal offset correction
0
Thermal offset enabled, applied after angle calculation, i.e. after
discontinuity point (𝜃𝜃𝑟𝑟2𝑝𝑝 )
1
Enabled, applied after output calculation and before clamping (𝜃𝜃𝑜𝑜𝑜𝑜𝑜𝑜 )
2
Table 55 - Temperature compensated offset selection parameter
If IC internal temperature is higher than 35°C then:
𝜃𝜃𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇 = 𝜃𝜃𝑖𝑖𝑖𝑖 − Δ𝑇𝑇 ⋅ OUTSLOPEHOT
If IC internal temperature is lower than 35°C then:
𝜃𝜃𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇 = 𝜃𝜃𝑖𝑖𝑖𝑖 − Δ𝑇𝑇 ⋅ OUTSLOPECOLD
where 𝜃𝜃𝑖𝑖𝑖𝑖 is either 𝜃𝜃𝑟𝑟2𝑝𝑝 or 𝜃𝜃𝑜𝑜𝑜𝑜𝑜𝑜 depending on OUSLOPE_SEL value.
14.2.11. CLAMPING Parameters
The clamping levels are two independent values to limit the output voltage range. The CLAMPLOW
parameter adjusts the minimum output level. The CLAMPHIGH parameter sets the maximum output. Both
parameters have 16 bits of adjustment and are available for all four LNR modes. As output data resolution
is limited to 12 bits, both in SENT and in PWM, the 4 LSB of this parameter will have no significant effect
on the output. The value is encoded in fractional code, from 0% to 100%
14.3. Sensor Front-End
Parameter
Value
SENSING MODE
[0..7]
GAINMIN
[0..63]
GAINMAX
[0..63]
GAINSATURATION
[0, 1]
Table 56 - Sensing Mode and Front-End Configuration
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14.3.1. SENSING MODE
The SENSING_MODE parameter defines which sensing mode and fields are used to calculate the angle. The
different possibilities are described in the tables below. This 3-bit value selects the first (B1) and second
(B2) field components according to the Table 57 content.
MAPXYZ
B1
B2
Angular
0
X
Y
Rotary position stray-field Immune, order code -100 and -5xx
1
X
Y
X-Y Angular Rotary, order code -3xx
2
Y
Z
Y-Z Angular Rotary, order code -3xx
3
X
Z
X-Z Angular Rotary, order code -3xx
4
ΔX
ΔZ
Linear position, stray-field Immune, order code -2xx
Table 57 - Sensing Mode Description
14.3.2. GAINMIN and GAINMAX Parameters
GAINMIN and GAINMAX define the thresholds on the gain code outside which the fault “GAIN out of Spec.”
is reported. If GAINSATURATION is set, then the virtual gain code is clamped at GAINMIN and GAINMAX,
and no diagnostic fault will be set since the clamping will prevent the gain from exceeding GAINMIN and
GAINMAX.
14.4. Filtering
The MLX90377 includes 2 types of filters:
Exponential moving average (EMA) Filter: programmable by the HYST parameter
Low Pass FIR Filters controlled with the FILTER parameter
Parameter
Value
DSP_FILTER
0…2
HYST
0 … 255
Table 58 - Filtering configuration
14.4.1. Exponential Moving Average (IIR) Filter
The HYST parameter is a hysteresis threshold to activate / de-activate the exponential moving average
filter. The output value of the IC is updated with the applied filter when the digital step is smaller than the
programmed HYST parameter value. The output value is updated without applying the filter when the
increment is bigger than the hysteresis. The filter reduces therefore the noise but still allows a fast step
response for bigger angle changes. The hysteresis must be programmed to a value close to the internal
magnetic angle noise level (1LSB = 8 ∙ 360/216 ).
yn = a * xn + (1 − a ) * yn−i
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The filters characteristic is given in the following table (Table 59):
DENOISING_FILTER_ALPHA_SEL
0
1
2
3
Coefficients a
0.75
0.5
0.25
0.125
2.4
4.2
Efficiency RMS (dB)
Table 59 - IIR Filter characteristics
14.4.2. FIR Filters
The MLX90377 features 2 FIR filter modes controlled with Filter = 1…2. Filter = 0 corresponds to no filtering.
The transfer function is described by:
yn =
1
j
j
∑a
i
i =0
∑a x
i =0
i n −i
This filter characteristic is given in the Table 60.
FILTER value
0
1
2
Type
Disable
Coefficients ai
1
11
1111
Title
No filter
Extra light
Light
DSP cycles (#taps)
1
2
4
Efficiency RMS (dB)
0
3.0
6.0
Finite Impulse Response (FIR)
Table 60 - FIR Filter Characteristics
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14.5. Programmable Diagnostics Settings
14.5.1. Diagnostics Global Enable
DIAG_EN must be kept to its default value (1) to retain all functional safety abilities of the MLX90377. This
feature shall not be disabled.
14.5.2. Diagnostic Debouncer
A debouncing algorithm is available for analog diagnostic reporting. Enabling this debouncer will increase
the FHTI of the device. Therefore, Melexis recommends keeping the debouncing of analog faults off, by not
modifying below described values. The factory default settings mentioned in chapter 12 should be used.
NVRAM Parameter
Description
DIAGDEBOUNCE_STEPDOWN
Decrement values for debouncer counter
DIAGDEBOUNCE_STEPUP
Increment value for debouncer counter
DIAG_DEBOUNCE_THRESH
Threshold for debouncer counter to enter diagnostic mode
Table 61 - Diagnostic debouncing parameters
Once an analog monitor detects an error, it takes control of the debouncing counter. This counter will be
incremented by STEPUP value each time this specific monitor is evaluated and the error is still present.
When the debouncing counter reaches the value defined by DEBOUNCE_THRESH, an error is reported on
the error channel, and the debouncing counter stays clamped to this DEBOUNCE_THRESH value (see
section 11.2.8 for SENT error message codes, and 14.5.5 for PWM error reporting). Once the error
disappears, each time its monitor is evaluated, the debouncing counter is decremented by STEPDOWN
value. When the debouncing counter reaches zero, the error disappears from the reporting channel and
the debouncing counter is released. To implement proper reporting times, one should refer to the FHTI,
see chapter 15.3. The reporting and recovery time are defined in the table below (valid for THRESH≠0).
Parameter
Reporting Time
Recovery Time
Min
Max
𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇
� − 1�
𝐷𝐷𝐷𝐷𝐷𝐷 ∙ ��
𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆
𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇
��
𝐷𝐷𝐷𝐷𝐷𝐷 ∙ ��
𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆
𝑥𝑥
� �
𝑦𝑦
𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇
��
𝐷𝐷𝐷𝐷𝐷𝐷 ∙ ��
𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆
𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇
� + 1�
𝐷𝐷𝐷𝐷𝐷𝐷 ∙ ��
𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆𝑆
is the ceiling function of x divided by y
Table 62 - Diagnostic Reporting and Recovery times
14.5.3. Over/Under Temperature Diagnostic
DIAG_TEMP_THR_HIGH defines the threshold for over temperature detection and is compared to the
linearized value of the temperature sensor TLIN. DIAG_TEMP_THR_LOW defines the threshold for under
temperature detection and is compared to the linearized value of the temperature sensor TLIN
TLIN is encoded using the SENT standard for temperature sensor. One can get the physical temperature of
the die using following formula:
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𝑇𝑇𝑃𝑃𝑃𝑃𝑃𝑃 [°𝐶𝐶] =
𝑇𝑇𝐿𝐿𝐿𝐿𝐿𝐿
− 73.15
8
DIAG_TEMP_THR_LOW/HIGH are encoded on 8-bit unsigned values with the following relationship towards
TLin
𝐷𝐷𝐷𝐷𝐷𝐷𝐷𝐷_𝑇𝑇𝑇𝑇𝑇𝑇𝑇𝑇_𝑇𝑇𝑇𝑇𝑇𝑇_(𝐿𝐿𝐿𝐿𝐿𝐿/𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻) =
𝑇𝑇𝐿𝐿𝐿𝐿𝐿𝐿
16
The value of TLIN is clamped between the thresholds defined by DIAG_TEMP_THR_LOW and
DIAG_TEMP_THR_HIGH.
Following table summarizes the characteristics of the linearized temperature sensor and the encoding of
the temperature monitor thresholds.
Parameter
Symbol
Min
Typ
Max
Unit
TLIN resolution
ResTLIN
-
0.125
-
°C/LSB
TLIN refresh rate
FS,TLIN
-
200
-
Hz
TLIN linearity error
TLinErr
-8
-
8
°C
from -40 to 160°C
TLIN linearity error
TLinErr
-2
-
6
°C
from 35 to 125°C
High temperature
threshold
DIAG_TEMP
_THR_LOW
-
8
-
LSB
Recommended value,
corresponds to -57°C
Low temperature
threshold
DIAG_TEMP
_THR_HIGH
-
128
-
LSB
Recommended value,
corresponds to 183°C
High/low temperature
threshold resolution
ResTthr
2
Condition
°C/LSB
Table 63 - Linearized Temperature Sensor characteristics
14.5.4. Field Strength and Field Monitoring Diagnostics
Field Strength is compensated over the circuit operating temperature range and represents a reliable image
of the field intensity generated by the magnet. Field Strength value is optionally available in SENT
secondary fast channel.
14.5.5. PWM Diagnostic
DC_FAULT
This parameter defines the duty-cycle that is present on the PWM output in case of diagnostic reporting.
DC_FIELDTOOLOW
This parameter defines the duty-cycle that is output in case of Field Too Low, from 0% till 100 % by steps
of (100/256)%.
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15. Functional Safety
15.1. Safety Manual
The safety manual, available upon request, contains the necessary information to integrate the MLX90377
component in a safety related item, as Safety Element Out-of-Context (SEooC).
In particular, it includes:
The description of the Product Development lifecycle tailored for the Safety Element.
An extract of the Technical Safety concept.
The description of Assumptions-of-Use (AoU) of the element with respect to its intended use,
including:
assumption on the device safe state;
assumptions on fault tolerant time interval and multiple-point faults detection interval;
assumptions on the context, including its external interfaces;
The description of safety analysis results (at the device level, to be used for the system
integration), HW architectural metrics and description of dependent failures initiators.
The description and the result of the functional safety assessment process; list of confirmation
measures and description of the independency level.
15.2. Safety Mechanisms
The MLX90377 provides numerous self-diagnostic features (safety mechanisms). Those features increase
the robustness of the IC functionality either by preventing the IC from providing an erroneous output signal
or by reporting the failure according to the SENT protocol definition.
Legend
● High coverage
○ Medium coverage
ANA : Analog hardware failure reporting, described in the safety manual
High-Z : Special reporting, output is set in high impedance mode (no HW fail-safe mode/timeout, no
SW safe startup)
DIG : Digital hardware failure reporting, described in the safety manual
At Startup : HW fault present at time zero is detected before a first frame is transmitted.
DIAG_EN : This safety mechanism can be disabled by setting DIAG_EN = 0 (see chapter 12 End User
Programmable Items). This option should not be used in application mode!
Table 64 - Self Diagnostic Legend
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Reporting
mode
At
startup
DIAG
○
ANA
NO
●
●
○
ANA
NO
●
Magnetic Signal Conditioning Gain Monitor
●
○
●
ANA
YES
●
Magnetic Signal Conditioning Gain Clamping
●
○
●
ANA
YES
●
Mag. Sig. Cond. Failure control by the chopping technique
●
n/a
YES
External Sensor Sig. Cond. Voltage Valid Range Check
●
●
ANA
YES
●
External Sensor Sig. Cond. Frequency Valid Range Check
●
●
ANA
YES
●
Frontend
ADC
DSP
Magnetic Signal Conditioning Voltage Test Pattern
●
○
Magnetic Signal Conditioning Rough Offset Clipping check
Category and safety mechanism name
Backend
Support.
Func.
Module &
Package
EN
Signal-conditioning (AFE, External Sensor) Diagnostic
A/D Converter Test Pattern
●
ANA
NO
●
ADC Conversion errors & Overflow Errors
●
ANA
YES
●
ANA
NO
●
Flux Monitor (Specific to Rotary mode)
●
○
●
HE Switching Circuitry Symmetry Check
●
ANA
NO
●
HE Bias Current Supply Monitor
●
ANA
NO
●
Stress Sensor Valid Range Check
●
ANA
YES
●
Digital-circuit Diagnostic
RAM Parity, 1 bit per 16 bits word, ISO D.2.5.2
●
DIG
YES
●
ROM Parity, 1 bit per 32 bits word, ISO D.2.5.2
●
DIG
YES
●
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Category and safety mechanism name
Frontend
ADC
DSP
Backend
Support.
Func.
Module &
Package
Reporting
mode
At
startup
DIAG
●
EN
"NVRAM 16 bits signature (run-time) ISO D.2.4.3,
by means of SW CRC-CCITT16"
●
DIG
NO
NVRAM Double Error Detection ECC ISO
●
DIG
YES
Logical Monitoring of program sequence ISO D.2.9.3 via
Watchdog "IWD" (cpu clock) ISO D2.9.2
●
○
DIG
NO
Watchdog "AWD" (separate clock) ISO D2.9.1
●
○
DIG
YES
CPU Errors "Invalid Address", "Wrong opcode"
●
○
DIG
YES
DIG
NO
●
DIG
NO
●
●
ADC Interface Checksum
○
DSP Test Pattern (atan2)
●
Critical ports monitoring
●
DIG
NO
●
○
●
DIG
YES
●
○
●
DIG
YES
●
SENT Fall Collision detection (SENT pulse generator)
●
DIG
NO
●
DAC Overflow
●
DIG
NO
●
DSP Overflow
ADC data adder test
○
○
●
Communication Interface Diagnostic
SENT parity check over Configuration registers
●
DIG
NO
●
SENT block: Protection against re-configuration at run-time
●
DIG
NO
●
SENT Frame Counter & Redundant Nibble
●
n/a
n/a
System-level diagnostic
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Support.
Func.
Module &
Package
Reporting
mode
At
startup
DIAG
Supply Voltage Monitors
(all supply domains) except VS_OV & POR
●
●
ANA
YES
●
External Supply Overvoltage Monitor VS_OV
●
●
High-Z
YES
Digital Supply under-voltage monitor (Power-on reset)
●
●
High-Z
YES
Supply Bias Current Monitor
●
ANA
NO
●
ANA
YES
●
Category and safety mechanism name
Frontend
○
DSP
Backend
○
○
○
HW Error Controller
●
●
●
DIG
YES
HW Fail-safe mode with timeout
●
●
●
DIG
YES
●
ANA
NO
●
●
DIG
n/a
●
●
DIG
YES
Overheating monitor
○
ADC
●
EN
Warning/Reporting Mechanisms
Analog-type Error management
Safe start-up mode
●
●
●
Mechanisms executed at start-up only
RAM March-C HW Test at start-up
Table 65 - MLX90377 List of Self Diagnostics with Characteristics
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15.3. Fault Handling Time Interval
Name
Definition
DTIANA
Time to run one full analog diagnostic cycle (programmable value)
DTIDIG
Time to run one full nvram BIST cycle (programmable value)
τR
Output refresh period in analog output mode (see “Timings definition” chapter)
Tpwm_input
the period of the incoming PWM signal on gateway pin
Ttrigger
the time between 2 SPC trigger pulses
DTI
Diagnostic Time Interval: worst-case time between 2 consecutive runs of a specific diagnostic
EXE
Execution Time: worst-case time between the measurement start of a given diagnostic and the
availability of the result of this measurement
REP
Reporting Time: worst-case time needed between an internal diagnostic error event and a switch
of the output to fail-safe state
FHTI
Fault Handling Time Interval: the time interval between the start of the first frame with invalid
position value without notice, and the end of the last frame preceding a fail-safe state of the IC.
It is calculated as the sum of DTI, EXE, and REP figures. The following equation is valid for any
diagnostic: 𝐹𝐹𝐹𝐹𝐹𝐹𝐹𝐹 = 𝐷𝐷𝐷𝐷𝐷𝐷 + 𝐸𝐸𝐸𝐸𝐸𝐸 + 𝑅𝑅𝑅𝑅𝑅𝑅
Table 66 – Glossary of Terms for the Definition Regarding Fault Handling Time Interval
The following table details the cycle time, execution time and reporting time for all monitors included
in MLX90377. In all cases, the worst-case timing values are provided in the table below:
Category and safety mechanism name
DTI
EXE
REP
Magnetic Signal Conditioning Voltage Test Pattern
1 * DTIANA
1 * τR
1 * τR
Magnetic Signal Cond. Rough Offset Clipping check
2.5 ms
1 * τR
1 * τR
Magnetic Signal Conditioning Gain Monitor & clamp
2.5 ms
1 * τR
1 * τR
External Sensor Sig. Cond. Voltage Valid Range Check
9 * τR
0
1 * τR
External Sensor Sig. Cond. Frequency Valid Range Check
1*Tpwm_input
1 * τR
1 * τR
A/D Converter Test Pattern
1 * DTIANA
0
1 * τR
ADC Conversion errors & Overflow Errors
1 * τR
0
1 * τR
Flux monitor
2.5 ms
1 * τR
1 * τR
1 * DTIANA
0
1 * τR
RAM Parity, 1 bit per 16 bits word, ISO D.2.5.2
< 1 * DTIANA
0
0
ROM Parity, 1 bit per 16 bits word, ISO D.2.5.2
< 1 * DTIANA
0
0
NVRAM Double Error Detection ECC ISO D.2.4.1
< 10μs
0
0
Signal-conditioning (AFE, External Sensor) Diagnostic
Hall-element & Mechanical-stress Tests
Digital-circuit Diagnostic
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Category and safety mechanism name
DTI
EXE
REP
1 * DTIDIG
0
0
Logical Monitoring of program sequence ISO D.2.9.3 via
Watchdog "IWD" (cpu clock) ISO D2.9.2
4 ms
0
0
Watch-dog "AWD" (separate clock) ISO D2.9.1
5ms
0
0
CPU error detection
1 * τR
0
0
ADC Interface Checksum
1 * DTIANA
0
0
DSP Test Pattern (atan2)
1 * DTIANA
0
0
Critical ports monitoring
1 * DTIANA
0
0
DSP overflow
1 * τR
0
0
ADC data adder test
1 * τR
0
0
SENT Fall Collision detection & DAC Overflow
1 * τR
0
0
SENT parity check over Configuration registers
1 * Ttrigger
0
0
SENT HW: Protection against re-configuration
1 * Ttrigger
0
0
Supply Voltage Monitors except VS_OV & POR
1 * DTIANA
0
1 * τR
External Supply Overvoltage Monitor VS_OV
1 * DTIANA
0
1 * τR
Supply Bias Current Monitor
1 * DTIANA
0
1 * τR
9 * τR
1 * τR
1 * τR
NVRAM 16 bits signature (run-time) ISO D.2.4.3
SENT H/W Interface Diagnostic
System-level diagnostic
Overheating monitor
Table 67 - Timings of the cyclic detection mechanism
Note:
1. The orange colour coding shows the worst-case FHTI for analog and digital diagnostics
2. The ROM and RAM parity mechanism trigger a fail-safe state on the failing ROM or RAM word
is accessed. (It is assumed that it will be accessed within one full diagnostic cycle in worst
case)
3. EXE/REP time = 0 means that the execution or reporting time is negligible compared to the
FHTI value
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16. Recommended Application Diagrams
This chapter shows the typical application diagrams for the MLX90377 in different packages, which should
not be considered as a specification but rather a recommendation. It is up to the end user to define the
proper application circuit, based on the exact use-case, i.e. output protocol, power mode, etc.
16.1. Wiring with the MLX90377 in SOIC-8 Package
Figure 22 shows the typical recommended application circuit for the MLX90377 in SOIC-8 package, and
Table 68 shows the corresponding value of the external components.
R1
1
VDD
VDEC
C1
C4
C3
8
VSS
C5
7
R2
C2
MLX90377
2,3,4,6
5
X
OUT
Figure 22 - Recommended wiring for the MLX90377 in SOIC-8 package
Component
Value
Remark
C1
220nF
Place close to the IC pin
C2(CL)
100nF
10nF
for –x10, -x00 codes, with default setting after factory trimming
for –x30 codes, with default setting after factory trimming
C3
100nF
Place close to the IC pin
C4
0nF
Place close to the connector
C5
0nF
Place close to the connector
R1
0Ω
R2
0Ω
Table 68 - Recommended Values for the MLX90377 in SOIC-8 Package
C2 should consider the total capacitance on the bus. C4, C5, R1, R2 are not needed under typical conditions.
They are only needed, when extremely high electromagnetic immunity (EMI) compliance is required, but
the value of the resistors and capacitors should not exceed 10Ω and 1nF.
In SENT protocol, an external pi-filter to improve radiated emission performance is not needed. The
MLX90377 has a built-in high order low pass filter. Therefore, any additional external filter will deteriorate
the generated SENT signal, and could make the output signal not comply to the SENT specifications, such
as the fall times and the minimum output voltages.
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16.2. Wiring with the MLX90377 in TSSOP-16 Package
Figure 23 shows the typical recommended application circuit for the MLX90377 in TSSOP-16 package, and
Table 69 shows the corresponding value of the external components.
R11
3
VDD1
1
VDEC1
C11
C14
C13
2
VSS1
C15
R12
C12
4,13,14,16
X1
15
OUT1
R21
MLX90377
11
VDD2
C24
9
VDEC2
C21
C23
10
VSS2
C25
C22
R22
5,7,8,12
6
X2
OUT2
Figure 23 - Recommended wiring for the MLX90377 in TSSOP-16 dual-die package
Component
Value
Remark
Cx1
220nF
Place close to the IC pin
Cx2
100nF
10nF
for –x10, -x00 codes, with default setting after factory trimming
for –x30 codes, with default setting after factory trimming
Cx3
100nF
Place close to the IC pin
Cx4
0nF
Place close to the connector
Cx5
0nF
Place close to the connector
Rx1
0Ω
Rx2
0Ω
Table 69 - Recommended Values for the MLX90377 in TSSOP-16 dual-die Package
Cx2 should consider the total capacitance on the bus. Cx4, Cx5, Rx1, Rx2 are not needed under typical
conditions. They are only needed, when extremely high electromagnetic immunity (EMI) compliance is
required, but the value of the resistors and capacitors should not exceed 10Ω and 1nF.
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In SENT protocol, an external pi-filter to improve radiated emission performance is not needed. The
MLX90377 has a built-in high order low pass filter. Therefore, any additional external filter will deteriorate
the generated SENT signal, and could make the output signal not comply to the SENT specifications, such
as the fall times and the minimum output voltages.
16.3. Wiring with the MLX90377 in DMP-4 Package (built-in capacitors)
Figure 24 shows the typical recommended application circuit for the MLX90377 in DMP-4 package, and
Table 70 shows the corresponding value of the external components.
VDD
MLX90377
C4
C1
VSS
C2
C3
OUT
MLX90377
VSS
OUT
VDD
VSS
Figure 24 - Internal wiring of the MLX90377 in DMP-4
Component
Value
C1
220nF
C2
100nF
C3
10nF
C4
0
Remark
not mounted
Table 70 - DMP-4 capacitors configuration
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16.4. Wiring with the MLX90377 in SMP-3 Package (built-in capacitors)
MLX90377
VDD
VSS
VDEC
OUT
VDEC
C1
C2
C4
C3
VDD
OUT
VSS
3
2
1
Figure 25 - Internal wiring of the MLX90377 in SMP-3
Component
Value
C1
220 nF
C2
100 nF
C3
10 nF
C4
0
Remark
not mounted
Table 71 - SMP-3 capacitors configuration
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17. Standard Information Regarding Manufacturability
of Melexis Products with Different Soldering Processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to standards in place in Semiconductor industry.
For further details about test method references and for compliance verification of selected soldering
method for product integration, Melexis recommends reviewing on our web site the General Guidelines
soldering recommendation (http://www.melexis.com/en/quality-environment/soldering)
For all soldering technologies deviating from the one mentioned in above document (regarding peak
temperature, temperature gradient, temperature profile etc), additional classification and qualification
tests have to be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends consulting
the dedicated trim & form recommendation application note : “Lead Trimming and Forming
Recommendations”
(http://www.melexis.com/en/documents/documentation/application-notes/leadtrimming-and-forming-recommendations).
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/en/quality-environment.
18. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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19. Package Information
19.1. SOIC-8 Package
19.1.1. SOIC-8 - Package Dimensions
1.27 TYP
NOTES:
5.80
3.81
3.99** 6.20
4.80
4.98*
All dimensions are in millimeters (angles in degrees).
* Dimension does not include mold flash, protrusions or
gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or
protrusion (shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition.
Dambar cannot be located on the lower radius of the foot.
1.37
1.57
1.52
1.72
0.36
0.46***
0.19
0.25
0.100
0.250
0.41
1.27
0°
8°
Figure 26 - SOIC-8 Package Outline Dimensions
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19.1.2. SOIC-8 - Pinout and Marking
8
OUT
N.C.
VSS A
VDEC
Marking :
Part Number MLX90377 (3 digits)
Die Version (3 digits)
5
Top
377
377ADB
F12345
Xy-Z
Xy
Z
Application code (1 digit)
“S” Rotary Stray-Field Immune Mode – Low-Field Variant
“D” Linear Stray-Field Immune Mode
“C” Standard / Legacy Mode
Split lot number
N.C.
Test
VDD
Lot number:
“one letter fab identifier” + 5 digits
F12345
4
Input
1
ADB
Bottom
YY
WW
Week Date code (2 digits)
Year Date code (2 digits)
Figure 27 - SOIC-8 Pinout and Marking
19.1.3. SOIC-8 - Sensitive spot positioning
19.1.3.1. Rotary Stray-field Immune and Standard Mode Applications
CW
8
7
6
5
CCW
X
1.44
1.84
1
2
1.96
2.26
3
0.46 +/- 0.06
4
Dimensions in “mm”
Y
Figure 28 - SOIC-8 Sensitive Spot Position
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19.1.3.2. Linear Stray-field Immune Applications
8
7
6
5
1.91
X
0.46 +/- 0.06
SENSITIVE AXIS
1.69
2.09
1
2
3
2.86
3.16
1.06
1.36
4
Dimensions in “mm”
Figure 29 - SOIC-8 Sensitive Spot position for Linear Stray-Field Immune
19.1.4. SOIC-8 - Angle detection
~ 0 Deg.*
S
N
6
2
3
5
8
7
4
1
2
7
2
5
8
7
5
3
4
6
5
3
4
S
S
N
1
6
6
~ 270 Deg.*
~ 180 Deg.*
8
S
1
7
N
8
~ 90 Deg.*
3
4
1
2
N
* No absolute reference for the angular information.
Figure 30 - SOIC-8 Angle Detection
The MLX90377 is an absolute angular position sensor but the linearity error (See section 9) does not include
the error linked to the absolute reference 0 Deg (which can be fixed in the application through the
discontinuity point).
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19.2. TSSOP-16 Package
19.2.1. TSSOP-16 - Package Dimensions
0.65 ± 0.04
12O REF
0.20 ± 0.04
1.0 DIA
REF
0.09 MIN
4.30
4.50** 6.4 ± 0.2
0.09 MIN
1.0 REF
0.50
0.75
12O REF
1.0
REF
0O
8O
1.0 ± 0.2
0.85
0.95
4.90
5.10*
1.1 MAX
0.19
0.30***
0.09
0.20
0.05
0.15
NOTES:
All dimensions are in millimeters (angles in degrees).
* Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the
dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
REF: Reference dimensions as stated in packaging supplier POD, based on JEDEC.
Figure 31 - TSSOP-16 Package Outline Dimensions
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19.2.2. TSSOP-16 Dual-Die Package - Pinout and Marking
Marking :
16
1
VDEC 1
Part Number MLX90377 (3 digits)
Die Version (3 digits)
N.C.
OUT1
VDD1
N.C.
377ADB
F12345
Xy-Z
VSS 1
Input1
Test2
377
Top
ADB
F12345
Test1
Xy
VDD2
N.C.
VSS 2
N.C.
VDEC 2
Z
Application code (1 digit)
“S” Rotary Stray-Field Immune Mode – Low-Field Variant
“B” Rotary Stray-Field Immune Mode – High-Field Variant
“D” Linear Stray-Field Immune Mode
“C” Standard / Legacy Mode
Split lot number
Input2
OUT2
Lot number:
“1 letter fab identifier” + 5 digits
9
8
Bottom
YY
WW
Week Date code (2 digits)
Year Date code (2 digits)
Figure 32 - TSSOP-16 Dual-Die Package Pinout and Marking
19.2.3. TSSOP-16 Dual-Die Package - Sensitive spot positioning
19.2.3.1. Rotary Stray-field Immune and Standard Mode applications
CW
X2
16
9
Die 1
Die 2
Y2
Y1
0.30 ± 0.06
CCW
1.95
2.45
1
8
1.62
1.82
2.96
3.16
X1
Dimensions in “mm”
Figure 33 - TSSOP-16 dual-die package Sensitive Spot Position
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19.2.3.2. Linear Stray-field Immune Applications
X2
9
Die 1
2.90
3.40
1.00
1.50
1
Die 2
1.91
SENSITIVE AXIS
16
0.30 ± 0.06
8
1.37
1.57
3.21
3.41
Dimensions in “mm”
X1
Figure 34 - TSSOP-16 dual-die package - Sensitive Spot Location for Linear Stray-field Immune
19.2.4. TSSOP-16 - Angle Detection
~ 180 Deg.*
9
16
Die 2
Die 1
S
8
16
S
Die 2
9
Die 1
N
1
~ 90 Deg.*
16
S
Die 1
8
~ 270 Deg.*
9
Die 2
1
~ 0 Deg.*
~ 180 Deg.*
9
S
1
~ 270 Deg.*
16
N
N
Die 1
~ 90 Deg.*
8
1
Die 2
N
~ 0 Deg.*
8
* No absolute reference for the angular information.
Figure 35 - TSSOP-16 Angle Detection
The MLX90377 is an absolute angular position sensor but the linearity error (see section 9) does not include
the error linked to the absolute reference 0Deg (which can be fixed in the application through the
discontinuity point).
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19.3. DMP-4 - Package
19.3.1. DMP-4 - Package Outline Dimensions (POD) - Straight Leads
Figure 36 - DMP-4 Straight Leads Package Outline Drawing
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19.3.2. DMP-4 - Package Outline Dimensions (POD) - STD2 2.54
Figure 37 - DMP-4 STD2 2.54 Package Outline Drawing
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19.3.3. DMP-4 - Package Outline Dimensions (POD) STD4 2.54
Figure 38 - DMP-4 STD4 2.54 Package Outline Drawing
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19.3.4. DMP-4 - Marking
Marking upper part
377ADB
F12345
y1y2 – Z
YYWW - 27
Part Number MLX90377 (3 digits)
Die version (3 digits)
377
ADB
F12345
y1y2
Lot number:
one letter fab identifier + 5 digits
Z
Application code
1 x 220nF
1 x 100nF
1 x 10nF
“S” rotary Stray-Field
“D” linear Stray-Field
“C” standard/legacy
Split lot nb (4 digits)
YYWW - 27
Leadframe reference
Assembly Year (YY) and week (WW)
Lower part gives capacitor configuration
1
2
3
4
Figure 39 - DMP-4 Marking
19.3.5. DMP-4 - Sensitive Spot Positioning
19.3.5.1. Rotary Stray-field Immune or Standard Mode Applications
Xc=0.26
Yc =
3.52
Dimensions in “mm”
Zc=0.495
Figure 40 - DMP-4 Rotary Stray-field or legacy Sensitive Spot Position
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19.3.5.2. Linear Stray-field Immune Applications
1.91
1.22
SENSITIVE AXIS
Xc=0.26
Yc =
3.27
Dimensions in “mm”
Zc=0.495
Figure 41 - DMP-4 Rotary Stray-field or legacy Sensitive Spot Position
19.3.6. DMP-4 - Angle detection MLX90377 DMP-4
~ 0 Deg.*
~ 90 Deg.*
S
N
S
N
S
N
~ 270 Deg.*
N
S
~ 180 Deg.*
* No absolute reference for the angular information.
Figure 42 - DMP-4 Angle Detection
The MLX90377 is an absolute angular position sensor but the linearity error (see section 9) does not include
the error linked to the absolute reference 0 Deg (which can be fixed in the application through the
discontinuity point).
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19.4. SMP-3 - Package
19.4.1. SMP-3 - Package Outline Dimensions (POD)
Figure 43 - SMP-3 Package Outline Drawing
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19.4.2. SMP-3 - Marking
Part Number
Die Version
377
377ADB-C
ADB
-C
‘S’ Rotary Stray-Field - Low Field
Application
‘D’ Linear Stray-Field
Code
‘C’ Standard/Legacy
‘B’ Rotary Stray-Field - High Field
xxxxxx
xxxxxx
1
2
Assembly Lot Number
3
TOP Marking
Part Number
Die Version
377ADB-C
xxxxxx
377
ADB
yyww
xxxxxx
yyww
CCCCC
CCCCC
-C
Application Code
Assembly Lot Number
Assembly Year (yy) and Week (ww)
Capacitor Configuration
‘DHT00’
- 1x220nF
- 1x100nF
- 1x10nF
BOTTOM Marking
Figure 44 - SMP-3 Marking
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19.4.3. SMP-3 - Sensitive Spot Positioning
19.4.3.1. Rotary Stray-field Immune or Standard Mode Applications
3.950 ± 0.15
0.546 ± 0.06
0.893 ± 0.15
Dimensions in “mm”
1
2
3
Figure 45 - SMP-3 Rotary Stray-field or legacy Sensitive Spot Position
19.4.3.2. Linear Stray-field Immune Applications
2.995 ± 0.15
1.91
0.546 ± 0.06
SENSITIVE AXIS
1.141 ± 0.15
Dimensions in “mm”
1
2
3
Figure 46 - SMP-3 Rotary Stray-field or legacy Sensitive Spot Position
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19.4.4. SMP-3 - Angle detection MLX90377 SMP-3
Angle detection SMP-3
N
S
N
~ 90 Deg.*
S
~ 0 Deg.*
~ 180 Deg.*
~ 270 Deg.*
S
N
S
N
* No absolute reference for the angular information.
Figure 47 - SMP-3 Angle Detection
The MLX90377 is an absolute angular position sensor but the linearity error (see section 9) does not include
the error linked to the absolute reference 0 Deg (which can be fixed in the application through the
discontinuity point).
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19.5. Packages Thermal Performances
The table below describe the thermal behaviour of available packages following JEDEC EIA/JESD 51.X
standard.
Package
Junction to case - θjc
Junction to ambient θja (JEDEC 1s2p board)
Junction to ambient θja (JEDEC 1s0p board)
SOIC-8
38.8 K/W
112 K/W
153 K/W
TSSOP-16
27.6 K/W
99.1 K/W
137 K/W
DMP-4
32.2 K/W
88.7 K/W
done without PCB ( 32)
SMP-3
34.4 K/W
-
206 K/W
Table 72 - Standard Packages Thermal Performances
32
DMP-4 as PCB-less solution has been evaluated in a typical application case. Values for this package are given as informative.
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20. Contact
For the latest version of this document, go to our website at www.melexis.com.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa
Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas
Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
21. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no
representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or liability for
any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. This
documentation is in fact provided without warranty, term, or condition of any kind, either implied or expressed, including but not limited to warranties of
merchantability, satisfactory quality, non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees and agents
will not be responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the foregoing, contractual obligations expressly
undertaken in writing by Melexis prevail over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing orders or prior to designing
the product into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of reliability required and
determine whether it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require a prior authorization from
competent authorities. The product is not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual
environmental requirements. High reliability applications, such as medical life-support or life-sustaining equipment or avionics application are specifically excluded
by Melexis. The product may not be used for the following applications subject to export control regulations: the development, production, processing, operation,
maintenance, storage, recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as
a means of violence in an armed conflict or any similar violent situation.
No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.
If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably understood as being confidential, the
recipient of this document shall not communicate, nor disclose to any third party, any part of the document without Melexis’ express written consent. The recipient
shall take all necessary measures to apply and preserve the confidential character of the document. In particular, the recipient shall (i) hold document in confidence
with at least the same degree of care by which it maintains the confidentiality of its own proprietary and confidential information, but no less than reasonable care;
(ii) restrict the disclosure of the document solely to its employees for the purpose for which this document was received, on a strictly need to know basis and providing
that such persons to whom the document is disclosed are bound by confidentiality terms substantially similar to those in this disclaimer; (iii) use the document only
in connection with the purpose for which this document was received, and reproduce document only to the extent necessary for such purposes; (iv) not use the
document for commercial purposes or to the detriment of Melexis or its customers. The confidentiality obligations set forth in this disclaimer will have indefinite
duration and in any case they will be effective for no less than 10 years from the receipt of this document.
This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject to the exclusive
jurisdiction of the courts of Brussels, Belgium.
The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other provisions.
The previous versions of this document are repealed.
Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2021)
IATF 16949 and ISO 14001 Certified
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