MLX90422 Triaxis® Position Sensor IC
Datasheet
Features and Benefits
▪
▪
▪
▪
▪
▪
▪
▪
▪
Triaxis® Hall Technology
On Chip Signal Processing for Robust
Absolute Position Sensing
ISO26262 ASIL-B Safety
Element out of Context
AEC-Q100 Qualified (Grade 0)
Programmable Measurement Range
Programmable Linear Transfer Characteristic
with up to 17 points
SENT Output - SAE J2716 APR2016
Enhanced serial data communication
Packages RoHS compliant
o Single Die - SOIC-8
o Dual Die (Full Redundant) - TSSOP-16
o PCB-less DMP-4 and SMP-3
o PCB-less dual die SMP-4
SOIC-8 (DC)
TSSOP-16 (GO)
SMP-4 (VD)
DMP-4 (VS)
Description
The MLX90422 is a monolithic magnetic position
sensor IC. It consists of a Triaxis® Hall magnetic
front end, an analog to digital signal conditioner, a
DSP for advanced signal processing and a
programmable output stage driver.
The MLX90422 is sensitive to the three
components of the magnetic flux density applied
to the ICs (i.e. Bx, By and Bz). Programming the
sensor determines which axes are used to
calculate a rotation or linear position. This allows
the MLX90422 with the correct magnetic design
to calculate the absolute position of any moving
magnet (e.g. rotary position from 0 to 360
Degrees, see Figure 2). It enables the design of
non-contacting position sensors that are
frequently required for both automotive and
industrial applications.
The MLX90422 provide SENT frames encoded
according to a Single Secure Sensor A.3 (H.4) or
Dual Throttle Position Sensor A.1 (H.1) format.
The circuit delivers enhanced serial messages
providing error codes, and user-defined values.
SMP-3 (VE)
Application Examples
▪
▪
▪
▪
▪
▪
▪
Absolute Rotary and Linear Position Sensor
Pedal Position Sensor
Throttle Position Sensor
Ride Height Position Sensor
Transmission Position Sensor
Steering Wheel Position Sensor
Non-Contacting Potentiometer
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MLX90422 functional diagram
MLX90422 Triaxis® Position Sensor IC
Datasheet
Ordering Information
Product
MLX90422
MLX90422
MLX90422
MLX90422
MLX90422
MLX90422
MLX90422
Temp.
Package
Option Code
Packing
Form
G
G
G
G
G
G
G
DC
GO
VS
VS
VS
VE
VD
ADD-030
ADD-030
ADD-030
ADD-033
ADD-038
ADD-030
ADD-030
RE
RE
RE/RX
RE/RX
RE/RX
RE/RX
RE/RX
Definition
Angular Rotary SENT version
Angular Rotary SENT version
Angular Rotary SENT version
Angular Rotary SENT version
Angular Rotary SENT version
Angular Rotary SENT version
Angular Rotary SENT version
Table 1 - Ordering codes
Temperature Code:
G : from -40°C to 160°C
Some parts can be exposed to higher temperatures for a limited time (1)
Package Code:
DC : SOIC-8 package (see 18.1)
GO : TSSOP-16 package (full redundancy dual die, see 18.2)
VS : DMP-4 package (PCB-less dual mold, see 18.3)
VE : SMP-3 package (PCB-less single mold, see 18.4)
VD : SMP-4 package (PCB-less single mold dual die, see 18.5)
Option Code - Chip revision
AAA-123 : Chip Revision
▪ ADD: MLX90422 production version
Option Code - Application
AAA-123 : 1-Application - Magnetic configuration
▪ 0: Angular Rotary / Linear Position
Option Code
AAA-123 : 2-Option
▪ 3: Standard SENT
Option Code - Trim & Form
AAA-123 : 3-DMP-4 Trim & Form configuration
▪ 0: Standard straight leads. See section 18.3.1
▪ 3: Trim and Form STD2 2.54. See section 18.3.2
▪ 8: Trim and Form STD4 2.54. See section 18.3.3
Packing Form:
-RE : Tape & Reel
▪ VS/VE/VD: 2500 pcs/reel
▪ DC: 3000 pcs/reel
▪ GO: 4500 pcs/reel
-RX : Tape & Reel, similar to RE with parts face-down
Ordering Example:
MLX90422GDC-ADD-030-RE
For a SENT version in SOIC-8 package, delivered in Reel of 3000pcs.
Table 2 - Ordering codes information
1
The devices can be used up-to an ambient temperature of +180°C. For a description of the conditions, refer to the sub-sections
labelled “High-temperature Extension” (4.1, 9.2.3, 13.5.4).
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MLX90422 Triaxis® Position Sensor IC
Datasheet
Contents
Features and Benefits ..................................................................................................................... 1
Application Examples ...................................................................................................................... 1
Description..................................................................................................................................... 1
Ordering Information ..................................................................................................................... 2
1. Functional Diagram and Application Modes ................................................................................. 5
2. Glossary of Terms ....................................................................................................................... 6
3. Pin Definitions and Descriptions .................................................................................................. 7
3.1. Pin Definition for SOIC-8 .......................................................................................................... 7
3.2. Pin Definition for TSSOP-16 ..................................................................................................... 7
3.3. Pin Definition for DMP-4 ......................................................................................................... 8
3.4. Pin Definition for SMP-3 .......................................................................................................... 8
3.5. Pin Definition for SMP-4 .......................................................................................................... 8
4. Absolute Maximum Ratings ......................................................................................................... 9
4.1. High-Temperature Extension Absolute Maximum Ratings .................................................... 10
5. Isolation Specification ............................................................................................................... 10
6. General Electrical Specifications ................................................................................................ 11
7. Timing Specification .................................................................................................................. 12
7.1. General Timing Specifications ............................................................................................... 12
7.2. Timing Definitions .................................................................................................................. 12
7.3. SENT Output Timing Specifications ....................................................................................... 14
8. Magnetic Field Specifications .................................................................................................... 17
9. Accuracy Specifications ............................................................................................................. 18
9.1. Definitions ............................................................................................................................. 18
9.2. Performances ........................................................................................................................ 19
10. Memory Specifications ............................................................................................................ 20
11. Output Protocol Description ................................................................................................... 21
11.1. Single Edge Nibble Transmission (SENT) SAE J2716 ............................................................ 21
12. End-User Programmable Items ................................................................................................ 26
13. Description of End-User Programmable Items ......................................................................... 30
13.1. SENT Output Mode Options ................................................................................................ 30
13.2. Output Transfer Characteristic ............................................................................................ 31
13.3. Sensor Front-End ................................................................................................................. 37
13.4. Filtering ................................................................................................................................ 37
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13.5. Programmable Diagnostics Settings .................................................................................... 38
14. Functional Safety .................................................................................................................... 41
14.1. Safety Manual ...................................................................................................................... 41
14.2. Safety Mechanisms .............................................................................................................. 41
14.3. Fault Handling Time Interval................................................................................................ 45
15. Recommended Application Diagrams ...................................................................................... 46
15.1. Wiring with the MLX90422 in SOIC-8 Package .................................................................... 46
15.2. Wiring with the MLX90422 in TSSOP-16 Package ................................................................ 47
15.3. Wiring with the MLX90422 in DMP-4 Package (built-in capacitors) .................................... 48
15.4. Wiring with the MLX90422 in SMP-3 Package (built-in capacitors) .................................... 49
15.5. Wiring with the MLX90422 in SMP-4 Package (built-in capacitors) .................................... 50
16. Standard information regarding manufacturability of Melexis products with different
soldering processes .................................................................................................................. 51
17. ESD Precautions ...................................................................................................................... 51
18. Package Information ............................................................................................................... 52
18.1. SOIC-8 - Package Information .............................................................................................. 52
18.2. TSSOP-16 - Package Information ......................................................................................... 54
18.3. DMP-4 - Package Information .............................................................................................. 56
18.4. SMP-3 - Package Information .............................................................................................. 59
18.5. SMP-4 - Package Information .............................................................................................. 62
18.6. Packages Thermal Performances ......................................................................................... 64
19. Contact .................................................................................................................................. 65
20. Disclaimer .............................................................................................................................. 65
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Datasheet
1. Functional Diagram and Application Modes
Figure 1 - MLX90422 block diagram
Angular Rotary
Linear Position
Figure 2 - Applications mode
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2. Glossary of Terms
Name
Description
ADC
Analog-to-Digital Converter
AoU
Assumption of Use
AWD
Absolute Watchdog
CPU
Central Processing Unit
CRC
Cyclic Redundancy Check
%DC
Duty Cycle of the output signal i.e. T ON /(TON + TOFF)
DMP
Dual Mold Package
DP
Discontinuity Point
DCT
Diagnostic Cycle Time
DSP
Digital Signal Processing
ECC
Error Correcting Code
EMC
Electro-Magnetic Compatibility
EoL
End of Line
FIR
Finite Impulse Response
Gauss (G)
Alternative unit for the magnetic flux density (10G = 1mT)
HW
Hardware
IMC
Integrated Magnetic Concentrator
INL / DNL
Integral Non-Linearity / Differential Non-Linearity
IWD
Intelligent Watchdog
LSB/MSB
Least Significant Bit / Most Significant Bit
N.C.
Not Connected
NVRAM
Non Volatile RAM
PCB
Printed Circuit Board
POR
Power On Reset
PSF
Product Specific Functions
PWL
Piecewise Linear
RAM
Random Access Memory
ROM
Read-Only Memory
SEooC
Safety Element out of Context
SMP
Single-Mold Package
TC
Temperature Coefficient (in ppm/°C)
Tesla (T)
SI derived unit for the magnetic flux density (Vs/m2)
Table 3 - Glossary of terms
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3. Pin Definitions and Descriptions
3.1. Pin Definition for SOIC-8
Pin #
Name
Description
1
VDD
Supply
2
Test1
For Melexis factory test
3
Test2
For Melexis factory test
4
N.C.
Not connected
5
OUT
Output
6
N.C.
Not connected
7
VDEC
Decoupling pin
8
VSS
Ground
Table 4 - SOIC-8 pins definition and description
Test pins are internally grounded when in application mode. For optimal EMC behavior always connect
the Test and N.C. pins to the ground of the PCB.
3.2. Pin Definition for TSSOP-16
Pin #
Name
Description
1
VDEC1
Decoupling pin die1
2
VSS1
Ground die1
3
VDD1
Supply die1
4
Test11
For Melexis factory test, die 1
5
Test22
For Melexis factory test, die 2
6
OUT2
Output die2
7
N.C.
Not connected
8
N.C.
Not connected
9
VDEC2
Decoupling pin die2
10
VSS2
Ground die2
11
VDD2
Supply die2
12
Test12
For Melexis factory test, die 2
13
Test21
For Melexis factory test, die 1
14
N.C.
Not connected
15
OUT1
Output die1
16
N.C.
Not connected
Table 5 - TSSOP-16 pins definition and description
Test pins are internally grounded when in application mode. For optimal EMC behavior, always connect
the Test and N.C. pins to the ground of the PCB.
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3.3. Pin Definition for DMP-4
DMP-4 package offers a pin-to-pin compatibility with the previous generation of Triaxis® products.
Pin #
Name
Description
1
VSS
Ground
2
VDD
Supply
3
OUT
Output
4
VSS
Ground
Table 6 - DMP-4 pins definition and description
3.4. Pin Definition for SMP-3
SMP-3 package offers advanced components integration in a single mold compact form.
Pin #
Name
Description
1
VDD
Supply
2
OUT
Output
3
VSS
Ground
Table 7 - SMP-3 pins definition and description
3.5. Pin Definition for SMP-4
SMP-4 package offers a redundant dual-die package with advanced components integration in a single
mold compact form.
Pin #
Name
Description
1
OUT1
Output 1
2
VSS
Ground
3
VDD
Supply
4
OUT2
Output 2
Table 8 - SMP-4 pins definition and description
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4. Absolute Maximum Ratings
Parameter
Symbol
Supply Voltage
Min
VDD
Reverse Voltage Protection
VOUT
Reverse Output Voltage
VOUT-rev
Internal Voltage
V
< 48h
< 1h
V
< 48h
< 1h
V
< 48h
< 1h
V
< 1h
V
< 1h
V
< 1h
V
< 1h
V
< 1h
V
< 1h
-0.3
Reverse Test 1 pin Voltage
VTest1-rev
Positive Test 2 pin Voltage
Vtest2
Reverse Test 2 pin Voltage
Vtest2-rev
-0.3
TAMB
-40
Junction Temperature
< 48h
< 60s; TAMB ≤ 35°C
3.6
VTest1
(2)
V
-14
-18
Positive Test 1 pin Voltage
Operating Temperature
28
37
28
34
VDEC
VDEC-rev
Unit
-14
-18
VDD-rev
Positive Output Voltage
Max
6
-3
3.6
TJ
+160
°C
+175
°C
Storage Temperature
TST
-55
+170
°C
Magnetic Flux Density
Bmax
-1
1
T
Condition
Table 9 - Absolute maximum ratings
Exceeding any of the absolute maximum ratings may cause permanent damage.
Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
The voltages given in Table 9 are valid for a single die and will degrade when simultaneously applied to
multiple dice in the same package.
2
Find package thermal dissipation values in section 18.4
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4.1. High-Temperature Extension Absolute Maximum Ratings
The MLX90422 can be exposed to high-temperature within the range [160, 180] °C for a limited duration.
The device continues to operate with degraded performances according to the values listed in the
following table. This extension is only valid for the SMP-3, SMP-4 and DMP-4 packages.
Parameter
Symbol
Supply Voltage
Min
Max
Unit
5.5
V
TAMB = 180°C, see (3)
V
TAMB = 180°C, < 1h
V
TAMB = 180°C, < 1h
V
TAMB = 180°C, < 1h
+180
°C
< 250h
+190
°C
< 250h
+190
°C
< 250h
VDD
Reverse Voltage Protection
VDD-rev
-14
Positive Output Voltage
VOUT
Reverse Output Voltage
VOUT-rev
-14
Operating Temperature
TAMB
-40
Junction Temperature
TJ
Storage Temperature
TST
26
-55
Condition
Table 10 - High-temperature extension absolute maximum ratings
Exceeding any of the absolute maximum ratings may cause permanent damage.
Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
The voltages given in Table 10 are valid for a single die and will degrade when simultaneously applied to
multiple dice in the same package.
5. Isolation Specification
The specified isolation resistance is only valid for the TSSOP-16 package (code GO).
To be co
Parameter
Isolation Resistance
Symbol
Min
Typ.
Max
Unit
Condition
Risol
4
-
-
MΩ
Between dice, measured between
VSS1 and VSS2 with +/-20V bias
Table 11 - Isolation specification
3
Higher supply voltages will increase the die temperature above the max junction temperature T J
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6. General Electrical Specifications
General electrical specifications are valid for temperature range [-40, 160] °C and supply voltage range
[4.5, 5.5] V unless otherwise noted.
Electrical Parameter
Symbol
Min
Typ.
Max
Unit
Supply Voltage
VDD
4.5
5
5.5
V
Supply Current (4)
IDD
7.5
8.5
10.0
mA
VDDstartH
3.85
4.00
4.15
V
Start-up Level (rising)
Start-up Hysteresis
PTC Entry Level (rising)
VDDstartHyst
100
5.85
6.05
6.25
V
VPROV0Hyst
100
175
250
mV
Under voltage detection
VDDUVL
3.75
3.90
4.05
V
Under voltage detection
hysteresis
VDDUVHyst
Regulated Voltage
VDEC
100
3.2
3.3
Single die
mV
VPROV0
PTC Entry Level Hysteresis
Condition
Supply overvoltage detection
Supply voltage low threshold
mV
3.4
V
Internal analog voltage
Table 12 - Supply system electrical specifications
Electrical Parameter
External pull-up Voltage
Output Short Circuit
Current Limit
Symbol
Min
Typ.
Vext
Max
Unit
VDD
V
Condition
SENT Receiver supply voltage
IOUTshort
10
35
mA
Output Load
RL
10
55
kΩ
Pull-up to Vext
Low state voltage (5)
VOL
0.5
V
0.52mA DC load current
High state voltage (5)
VOH
V
0.10mA DC load current
µA
With a pull-up to Vext
Digital open-drain
output leakage
IleakpuOd
Passive Diagnostic
Output Level (BrokenWire Detection) (6)
BVSSPU
BVDDPU
4.1
20
99.5
92.5
97.0
100
98.7
99.5
%Vext
%Vext
Broken VSS &
Pull-up load R L 1 kΩ to Vext
Broken VDD &
Pull-up load R L ≤ 25 kΩ to Vext
Pull-up load R L ≤ 10 kΩ to Vext
Table 13 - Output electrical specifications
4 For
the dual die version, the supply current is multiplied by 2.
5
Compliant with SAE J2716 Revised APR2016
6
Valid for dual-die configurations as well where the two dies have the same supply and ground level.
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7. Timing Specification
Timing specifications are valid for temperature range [-40, 160] °C and supply voltage range [4.5, 5.5] V
unless otherwise noted.
7.1. General Timing Specifications
Parameter
Symbol
Min
Typ.
Max
Unit
Condition
FCK
22.8
-5
24
25.2
5
MHz
%Fck
Including thermal and lifetime
drift
ΔFCK,0
-1
1
MHz
%Fck
T=35°C, trimmed
Main Clock Frequency
Thermal Drift
ΔFCK,T
-3.5
3.5
%Fck
Relative to clock frequency at
35°C. Ageing effect not included
1MHz Clock Frequency
F1M
0.95
-5
1.05
5
MHz
%F1M
Including thermal and lifetime
drift
Main Clock Frequency
Main Clock initial
tolerances
1
Table 14 - General timing specifications
7.2. Timing Definitions
7.2.1. Startup Behavior
In SENT mode, the startup time consists of two values. The first one, T init, is the time needed for the
circuit to be ready to start acquiring an angle. In SENT mode, at that time, the IC starts transmitting
initialisation frames. The second value, T stup, is the time when the first valid angle is transmitted.
These definitions are illustrated in the following figure (Figure 3) where τinit represents the sensor internal
initialization sequence.
VDDstartH
Supply Voltage
Tinit
Tstup
SENT output
High-Z
Null
Frame
Null
Frame
Null
Frame
Valid Angle
Valid Angle
Figure 3 - Startup time definition
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7.2.2. Latency (average)
Latency is the average lag between the movement of the detected object (magnet) and the response of
the sensor output. This value is representative of the time constant of the MLX90422 for regulation
calculations.
Figure 4 - Definition of latency
7.2.3. Step Response (worst-case)
Step response is defined as the delay between a change of position of the magnet and the 100% sett ling
time of the sensor output with full angle accuracy with regards to filtering. Step response therefore
consists of the sum of:
▪
▪
▪
δmag,frameEnd, the delay between magnetic step and the end of the frame,
δframeEnd,frameEndPartial, the delay between the end of the frame when the magnetic step occurred and
the end of the frame which carries the partial response,
Tframe,no PP, the frame length excluding the pause pulse (PP), which carries the complete response.
Figure 5 depicts step response when applied to a SENT with pause output format.
Magnetic step
(input change
δmag,frameEnd
δframeEnd,frameEndPartial
Tframe, no PP
Complete response
Partial response
Output response to
the magnetic step
acq = angle acquisition (analog)
dsp = angle calculation (digital)
Angle
Acquisition
tasks
(simplified)
acq
SENT
output
acq
dsp
frame
acq
dsp
acq
dsp
PP
acq
dsp
frame
acq
dsp
PP
frame
dsp
PP
Step Response
Figure 5 - Step response definition
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7.3. SENT Output Timing Specifications
Parameter
Symbol
Min
Tick time (7)
Typ.
Max
Unit
3
μs
3μs = Normal SENT (fixed)
between 1.1V and 3.8V
for 3μs tick time
SENT edge rise Time
Trise
12.5
18
μs
SENT edge fall Time
Tfall
5.3
6.5
μs
576
432
Slow Message cycle length
Condition
frames
Extended sequence (32 frames)
Short sequence (24 frames)
Table 15 - SENT Output timing specifications
7.3.1. Continuous Synchronous Acquisition Mode
For the SENT output protocol in the Standard/Legacy Mode, the MLX90422 with the default factory
calibration operates with constant SENT frame length (SENT with pause). The length of the SENT frame is
defined by NTframe in number of ticks (see T_FRAME in section 12 and 13.1). The sensor is configured in
continuous synchronous timing mode, acquires angles based on the output frequency, and the sensor
output has a fixed frame frequency.
acq = angle acquisition (analog)
dsp = angle calculation (digital)
TSYNC_DE LA Y
acq
Angle
Acquisition
tasks
(simplified)
acq
dsp
acq
dsp
frame
SENT
w/ pause
acq
dsp
PP
frame
dsp
PP
Tframe
Figure 6 - Continuous synchronous timing mode
The detailed default setting of the SENT protocol is as follows:
▪ Protocol: SENT with pause
▪ Tick time: 3μs
▪ SENT format: A.3 (H.4)
▪ Number of angle acquisitions per SENT frame: 2
▪ DSP linearization: 16 points
The corresponding timing specifications are listed in Table 16.
7
The MLX90422 has a fixed tick time of 3 μs. It cannot be changed.
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Parameter
Symbol
Min
SENT frame tick count
NTframe
287
Output refresh period
Tframe
SENT startup time
Tstup
Average Latency (8)(9)(10)
Typ.
Max
Unit
Condition
ticks
861
1.32
1.75
τL
905
μs
Ppc = NTframe= 287
5.93
ms
Until first valid angle received
1.58
2.03
ms
Filter 1,
Filter 2 (see 13.4 Filtering)
Step Response (9)(10)
TwcStep
2.71
3.61
ms
Filter 1,
Filter 2 (see 13.4 Filtering)
Analog Diagnostics Cycle
DCTANA
10.4
ms
Ppc = NTframe= 287
Digital Diagnostics Cycle
DCTDIG
19.7
ms
Safe startup Time
TSafeStup
33
ms
5
Table 16 - Synchronous SENT mode timing specifications
7.3.2. Continuous Asynchronous Acquisition Mode
Optionally, the MLX90422 can be configured to operate with variable SENT frame length (SENT without
pause), where latency and step response is dependent on the transmitted data. The length of the SENT
frame is defined by the data content. The sensor is configured in the continuous asynchronous
acquisition mode and periodically acquires a magnetic measurement asynchronously to the SENT
transmission.
TangleMeas
acq = angle acquisition (analog)
dsp = angle calculation (digital)
acq
Angle
Acquisition
tasks
(simplified)
acq
dsp
acq
dsp
dsp
frame
SENT
w/o pause
acq
frame
dsp
frame
SENT frames are not periodic
Figure 7 - Continuous asynchronous timing mode
When configured in the continuous asynchronous acquisition mode, the detailed default setting is as
follows:
▪ Protocol: SENT without pause
▪ Tick time: 3μs
▪ SENT format: A.3 (H.4)
▪ DSP linearization: 16 points
8
Typ. values assumes no clock drift and an average SENT frame (154 ticks, excluding pause pulse).
9
Max values assumes a clock drift of 5% and the longest SENT frame (270 ticks, excluding pause pulse).
10
Data is assumed available after the CRC nibble and before the pause pulse.
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The corresponding timing specifications are listed in Table 17.
Parameter
Symbol
Internal angle
measurement period
Typ.
Max
Unit
TangleMeas
512
537
μs
Asynchronously to the output
protocol
Output refresh period
Tframe
810
851
μs
Npp = 270, longest frame
w/o pause
SENT startup time
Tstup
5.9
ms
Until first valid angle received
ms
Filter 0,
Filter 1,
Filter 2 (see 13.4 Filtering)
TwcStep
2.68
3.22
4.29
ms
Filter 0,
Filter 1,
Filter 2 (see 13.4 Filtering)
Analog Diagnostics Cycle
DCTANA
12.4
ms
Digital Diagnostics Cycle
DCTDIG
19.7
ms
Safe startup Time
TSafeStup
33
ms
Average Latency
Step Response
(11)
(12)
τL
Min
0.83
1.07
1.56
5
1.30
1.56
2.08
1.83
2.10
2.64
Condition
Table 17 - Asynchronous SENT mode timing specifications
11
The range for the average latency is provided (including clock drift). The average latency var ies based on the programmable
items configuration and the data being transmitted.
12
Max values assumes a clock drift of 5% and the longest SENT frame (270 ticks).
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8. Magnetic Field Specifications
Magnetic field specifications are valid for temperature range [-40, 160] °C unless otherwise noted.
Parameter
Number of magnetic poles
Magnetic Flux Density in X-Y
plane
Magnetic Flux Density in Z
Symbol
Min
Max
Unit
Condition
Bx, By (13)
70
mT
√𝐵𝑋2 + 𝐵𝑌2
Bz
126
mT
in absolute value
NP
Typ.
2
√𝐵𝑋2 + 𝐵𝑌2
Useful Magnetic Flux
Density Norm
√𝐵𝑋2 + (
(X-Y mode)
1
𝐺𝐼𝑀𝐶
BNorm
10(14)
20
mT
2
𝐵𝑍 )
2
1
𝐵 )
𝐺𝐼𝑀𝐶 𝑍
√𝐵𝑌2 + (
(X-Z mode)
(Y-Z mode)
see 13.3 for sensing mode
description.
IMC gain (15)
GIMC
Magnet Temperature
Coefficient
TCm
-2400
Field Too Low Threshold
BTH_LOW
2
Field Too High Threshold (16)
BTH_HIGH
70
1.19
0
ppm
°C
4
30
mT
Typ. is recommended value to
be set by user (see 13.5.5)
126
126
mT
Typ. is recommended value to
be set by user (see 13.5.5)
Table 18 - Magnetic specifications for standard application
The magnetic performances are listed in chapter 9.2. The Figure 8 defined under which conditions
nominal, limited or high-temperature performances apply.
180
High-Temperature Performances
160
-40
Limited
Performances
Temperature (°C)
150
10
20
Nominal
Performances
Norm (mT)
Bmax
Figure 8 - Useful magnetic signal definition
13
The condition must be fulfilled for all combinations of B x and By.
14
Only valid under the conditions of Figure 8. Outside of the “Limited Performances” zone, the performances are further
degraded due to a reduction of the signal-to-noise ratio and signal-to-offset ratio.
15
The IMC has a better performance for concentrating in-plane (X-Y) field components, resulting in a better overall magnetic
sensitivity. A correction factor, called IMC gain has to be applied to the z field component to account for this difference.
16
Due to the saturation effect of the IMC, the FieldTooHigh monitor detects only defects in the sensor
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9. Accuracy Specifications
Accuracy specifications are valid for temperature range [-40, 160] °C and supply voltage range
[4.5, 5.5] V unless otherwise noted.
9.1. Definitions
This section defines several parameters, which will be used for the magnetic specifications.
Output (%DC, Deg)
9.1.1. Intrinsic Linearity Error
e
ve urv
r
u
C
l C red
a
e
Id asu
e
M
Noise (pk-pk)
Intrinsic Linearity Error
(LE)
±3σ
Input (Deg.)
Figure 9 - Sensor accuracy definition
The illustration of Figure 9 depicts the intrinsic linearity error in new parts. The Intrinsic Linearity Error
refers to the error sources of the IC (offset, sensitivity mismatch, orthogonality error) taking into account
an ideal magnetic field. Once associated to a practical magnetic construction and its respective
mechanical and magnetic tolerances, the output linearity error increases. The linearity error can be
improved with the multi-point end-user calibration (see 13.2). As a consequence, this error is not the
critical factor in application when it is calibrated away.
9.1.2. Total Angle Drift
After calibration, the output angle of the sensor might still change due to temperature change and aging.
This error is defined as the total drift 𝜕𝜃𝑇𝑇 :
𝜕𝜃𝑇𝑇 = max{𝜃(𝜃𝐼𝑁 , 𝑇, 𝑡) − 𝜃(𝜃𝐼𝑁 , 𝑇𝑅𝑇 , 𝑡0 )}
where 𝜃𝐼𝑁 is the input angle, 𝑇 is the temperature, 𝑇𝑅𝑇 is the room temperature, and 𝑡 is the elapsed
lifetime after calibration. 𝑡0 represents the start of the sensor operating life. Note that the total drift
𝜕𝜃𝑇𝑇 is always defined with respect to the angle at room temperature. In this datasheet, 𝑇𝑅𝑇 is typically
defined at 35°C unless stated otherwise. The total drift is valid for all angles along the full mechanical
stroke.
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9.2. Performances
9.2.1. Nominal Performances
Valid before EoL calibration and for all applications under nominal performances conditions described in
chapter 6 and chapter 8.
Parameter
Symbol
Min
XY - Intrinsic Linearity Error
LE_XY
XZ - Intrinsic Linearity Error
YZ - Intrinsic Linearity Error
Typ.
Max
Unit
-1
1
Deg.
LE_XZ
-2.5
2.5
Deg.
LE_YZ
-2.5
2.5
Deg.
0.1
0.15
0.1
Noise (17)
0.2
0.35
0.2
Deg.
XY - Total Drift (18)
𝜕𝜃𝑇𝑇_𝑋𝑌
-0.6
0.6
Deg.
XZ - Total Drift (18)
𝜕𝜃𝑇𝑇_𝑋𝑍
-0.8
0.8
Deg.
YZ - Total Drift (18)
𝜕𝜃𝑇𝑇_𝑌𝑍
-0.8
0.8
Deg.
0.1
Deg.
Hysteresis
Condition
Filter = 0, B Norm ≥ 40mT
Filter = 0, BNorm ≥ 20mT
Filter = 2, B Norm ≥ 20mT
Relative to 35°C.
BNorm ≥ 20mT
Table 19 - Nominal magnetic performances
9.2.2. Limited Performances
Valid before EoL calibration and for all applications under limited performances conditions described in
chapter 6 and chapter 8.
Parameter
Symbol
Min
XY - Intrinsic Linearity Error
LE_XY
XZ - Intrinsic Linearity Error
YZ - Intrinsic Linearity Error
Typ.
Max
Unit
-1
1
Deg.
LE_XZ
-2.5
2.5
Deg.
LE_YZ
-2.5
2.5
Deg.
0.15
0.3
0.55
0.15
Noise (17)
0.25
0.45
0.8
0.25
Deg.
XY - Total Drift (18)
𝜕𝜃𝑇𝑇_𝑋𝑌
-0.8
0.8
Deg.
XZ - Total Drift (18)
𝜕𝜃𝑇𝑇_𝑋𝑍
-1.0
1.0
Deg.
YZ - Total Drift (18)
𝜕𝜃𝑇𝑇_𝑌𝑍
-1.0
1.0
Deg.
0.2
Deg.
Hysteresis
Condition
Filter = 0, B Norm ≥ 40mT
Filter = 0, BNorm ≥ 20mT
Filter = 0, BNorm ≥ 10mT
Filter = 2, B Norm ≥ 20mT
Relative to 35°C.
BNorm ≥ 10mT
Table 20 - Limited magnetic performances
17 ±3σ
18 Verification done on new and aged devices in an ideal magnetic field. An additional application -specific error arises from the
non-ideal magnet and mechanical tolerance drift.
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9.2.3. High-Temperature Extension Performances
When the MLX90422 is exposed to high-temperatures within the range [160, 180] °C, the following
magnetic performances apply.
Parameter
Symbol
Min
XY - Intrinsic Linearity Error
LE_XY
XZ - Intrinsic Linearity Error
YZ - Intrinsic Linearity Error
Typ.
Max
Unit
-1.2
1.2
Deg.
LE_XZ
-2.5
2.5
Deg.
LE_YZ
-2.5
2.5
Deg.
0.20
0.40
0.80
0.20
0.30
0.55
1.0
0.30
Deg.
Filter = 0, B Norm ≥ 40mT
Filter = 0, BNorm ≥ 20mT
Filter = 0, BNorm ≥ 10mT
Filter = 2, B Norm ≥ 20mT
-1.0
1.0
Deg.
Relative to 35°C, BNorm ≥ 10mT
-0.75
0.75
Deg.
Relative to 35°C, B Norm ≥ 20mT
𝜕𝜃𝑇𝑇_𝑋𝑍
-1.2
1.2
Deg.
Relative to 35°C, BNorm ≥ 10mT
𝜕𝜃𝑇𝑇_𝑋𝑍
-1.0
1.0
Deg.
Relative to 35°C, B Norm ≥ 20mT
𝜕𝜃𝑇𝑇_𝑌𝑍
-1.2
1.2
Deg.
Relative to 35°C, BNorm ≥ 10mT
𝜕𝜃𝑇𝑇_𝑌𝑍
-1.0
1.0
Deg.
Relative to 35°C, B Norm ≥ 20mT
0.2
Deg.
BNorm ≥ 10mT
Noise (17)
XY - Total Drift (18)
𝜕𝜃𝑇𝑇_𝑋𝑌
XZ - Total Drift (18)
YZ - Total Drift (18)
Condition
Hysteresis
Table 21 - High-Temperature Magnetic Performances
10. Memory Specifications
Parameter
Symbol
Value
Unit
ROM
ROMsize
16
kB
1-bit parity check per 32-bit word (single error
detection)
RAM
RAMsize
512
B
1-bit parity check per 16-bit word (single error
detection)
NVRAM size
128
B
6-bit ECC per word 16b (single error correction,
double error detection)
NVRAM
Note
Table 22 - Memory specifications
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11. Output Protocol Description
11.1. Single Edge Nibble Transmission (SENT) SAE J2716
The MLX90422 provides a digital output signal compliant with SAE J2716 Revised APR2016.
11.1.1. Sensor Message Definition
The MLX90422 repeatedly transmits a sequence of pulses, corresponding to a sequence of nibbles (4
bits), with the following sequence:
▪ Calibration/Synchronization pulse period 56 clock ticks to determine the time base of the SENT
frame
▪ One 4-bit Status and Serial Communication nibble pulse
▪ A sequence six 4-bit data nibbles pulses representing the values of the signal(s) to be transmitted .
The number of nibbles will be fixed for each application of the encoding scheme (i.e. Single
Secure sensor format A.3, Throttle position sensor A.1)
▪ One 4-bit Checksum nibble pulse
▪ One optional pause pulse
See also SAE J2716 APR2016 for general SENT specification.
Figure 10 - SENT message encoding example for two 12-bit signals
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11.1.2. Sensor Message Frame Contents
The SENT output of the MLX90422 transmits a sequence of data nibbles, according to the following
configurations:
Description
Symbol
Clock tick time
Min
Typ.
Tick Time
3
Number of data nibbles
Xdn
6
Frame duration w/o pause
Npp
154
Frame duration w/ pause
Ppc
287
Max
Unit
Description
µs
287
Normal SENT, 3µs tick time
270
ticks
6 data nibbles
922
ticks
6 data nibbles
Dual Throttle Position sensor
Single Secure sensor
A.1
A.3
Sensor type
Table 23 - SENT protocol frame definition
11.1.3. SENT Format Option
The default SENT format option of MLX90422 is Single Secure Sensor A.3 (H.4). The MLX90422 SENT
transmits a sequence of data nibbles; according single secure sensor format defined in SAE J2716
appendix H.4 (19). The frame contains 12-bit angular value, an 8-bit rolling counter and an inverted copy of
the most significant nibble of angular value.
SM
[1:0]
S
[1:0]
Ch.1
[11:8]
Ch.1
[7:4]
Ch.1
[3:0]
Channel 1 - 12-bits angle data
COUNT
[7:0]
COUNT
[3:0]
~Ch.1
[11:8]
CRC
8-bits rolling counter
Figure 11 - H.4 frame format
Optionally, the SENT format option of MLX90422 can be changed to Dual Throttle Position Sensor A.1
(H.1). The MLX90422 SENT transmits a sequence of data nibbles; according single secure sensor format
defined in SAE J2716 appendix H.1 (20). The frame contains 12-bit magnetic measurement value and a
configurable 12-bit data which can contain either the internal sensor temperature or an inverted value of
the magnetic measurement.
SM
[1:0]
S
[1:0]
Ch.1
[11:8]
Ch.1
[7:4]
Ch.1
[3:0]
Channel 1 - 12-bits magnetic data
Ch.2
[3:0]
Ch.2
[7:4]
Ch.2
[11:8]
CRC
Channel 2 – 12-bits data
Figure 12 - H.1 frame format
19
As referenced from section A.3 Single Secure Sensor of the standard.
20
As referenced from section A.1 Single Secure Sensor of the standard.
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11.1.4. Start-up Behavior
The circuit will send initialisation frames once digital start-up is done but angle measurement
initialisation sequence is not yet complete (see section 7.2.1). These initialisation frames content can be
chosen by user with SENT_INT_GM parameter.
SENT_INIT_GM
Initialisation frame value
Comments
0
0x000
SAE compliant, default
1
0xFFF
OEM requirement
Table 24 - Initialization frame content definition
11.1.5. Output Configuration
The output resistive load, e.g. the external pull-up resistor should be carefully selected, because the
MLX90422 has a built-in high order low pass filter. A large resistive load will deteriorate the generated
SENT signal, and could make the output signal not comply to the SENT specifications, such as the fall
times and the minimum output voltages. In principle, the values in Table 13 should be considered, which
means it is not recommended to have a resistive load value smaller than 10kΩ, and a resistive load value
smaller than 3kΩ should be avoided.
Furthermore, the output capacitance should also be properly chosen, together with the output resistive
load to correspondingly match the application, e.g. tick time, to allow appropriate time constant for the
transmission of the SENT signal. Details can be seen in sections 15.1 and 15.2.
11.1.6. Enhanced Serial Message (ESM) channel
Serial data is transmitted sequentially in bit number 3 and 2 of the status and communication nibble. A
serial message frame stretches over 18 consecutive SENT data messages from the transmitter. All 18
frames must be successfully received (no errors, calibration pulse variation, data nibble CRC error, etc.)
for the serial value to be received.
Enhanced serial message with 12-bit data and 8-bit message ID is used (SAE J2716 APR2016 5.2.4.2,
Figure 5.2.4.2-2). According to the standard, SM[0] contains a 6-bit CRC followed by a 12-bit data.
Message content is defined by a 8-bit message ID transmitted in the SM[1] channel. Correspondence
between ID and message content is defined in the tables below (Table 25).
By default, the short sequence consisting of a cycle of 24 data is transmitted. An extended sequence can
optionally be used leading to a cycle with 32 data being transmitted.
Additionally, the norm of the B field detected by the sensor can optionally be returned at the end of the
sequence (short or extended).
#
8-bit ID
Item
Source data
Short Sequence
1
0x01
Diagnostic error code
Current status code from RAM
2
0x06
SENT standard revision
0x004 from ROM
3
0x01
Diagnostic error code
Current status code from RAM
4
0x05
Manufacturer code
0x006 from ROM
5
0x01
Diagnostic error code
Current status code from RAM
6
0x03
Channel 1 / 2 Sensor type
0x050 from ROM
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#
8-bit ID
Item
Source data
7
0x01
Diagnostic error code
Current status code from RAM
8
0x07
Fast channel 1: X1
SENT_CHANNEL_X1 from NVRAM
9
0x01
Diagnostic error code
Current status code from RAM
10
0x08
Fast channel 1: X2
SENT_CHANNEL_X2 from NVRAM
11
0x01
Diagnostic error code
Current status code from RAM
12
0x09
Fast channel 1: Y1
SENT_CHANNEL_Y1 from NVRAM
13
0x01
Diagnostic error code
Current status code from RAM
14
0x0A
Fast channel 1: Y2
SENT_CHANNEL_Y2 from NVRAM
15
0x01
Diagnostic error code
Current status code from RAM
16
0x23
(Internal) temperature
Current temperature from RAM
17
0x01
Diagnostic error code
Current status code from RAM
18
0x29
Sensor ID #1
SENT_SENSOR_ID1 from NVRAM
19
0x01
Diagnostic error code
Current status code from RAM
20
0x2A
Sensor ID #2
SENT_SENSOR_ID2 from NVRAM
21
0x01
Diagnostic error code
Current status code from RAM
22
0x2B
Sensor ID #3
SENT_SENSOR_ID3 from NVRAM
23
0x01
Diagnostic error code
Current status code from RAM
24
0x2C
Sensor ID #4
SENT_SENSOR_ID4 from NVRAM
Extended Sequence
25
0x01
Diagnostic error code
Current status code from RAM
26
0x90
OEM Code #1
SENT_OEM_CODE1 from NVRAM
27
0x01
Diagnostic error code
Current status code from RAM
28
0x91
OEM Code #2
SENT_OEM_CODE2 from NVRAM
29
0x01
Diagnostic error code
Current status code from RAM
30
0x92
OEM Code #3
SENT_OEM_CODE3 from NVRAM
31
0x01
Diagnostic error code
Current status code from RAM
32
0x93
OEM Code #4
SENT_OEM_CODE4 from NVRAM
Field Norm Extension
25 or 33
0x01
Diagnostic error code
Current status code from RAM
26 or 35
0x80
Magnetic field Norm
Field Strength corrected from RAM
Table 25 - SENT slow channel data sequence
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11.1.7. Enhanced Serial Message Error Code
The list of error and status messages transmitted in the 12-bit Serial Message data field when Serial
Message 8-bit ID is 0x01, is given in the Table 26. The error is one-hot encoded and therefore each bit is
linked to one or several diagnostics. Only the first error detected during a diagnostics cycle is reported,
and the serial message error code will be updated at every diagnostics cycle. The serial message error
code will only be cleared out once all the errors have disappeared. This mechanism ensures only one
error at a time takes control of the error debouncing counter (see 13.5.2).
The MSb acts either as an error flag or can be kept high regardless of the error status. See section 13.5.6.
Bit Nb
-
12 Bit Data (hex)
0x000 / 0x800
Diagnostic
No error
0
0x801
GAINOOS
1
0x802
FieldTooLow
2
0x804
FieldTooHigh
3
4
0x808
0x810
ADCclip
ADC_test
5
0x820
Analog Supply Monitors
6
0x840
Digital Supply Monitors
7
0x880
8
0x900
9
0xA00
10
0xC00
RoughOffset
Over/Under Temp /
ADCdrop
DSP overflow / HE_Bias /
Analog Front End
Supply Bias Current /
Stress Range
11
0x800
Extra Error Flag
Comments
Programmable (See section 13.5.6)
Magnetic Signal Conditioning Gain
Clamping
Fieldstrength is below defined low
threshold (see section 13.5.3)
Fieldstrength is above defined high
threshold (see section 13.5.3)
ADC is saturated, either low or high
ADC made wrong conversion
Detects VDDA (VDEC) over and under
voltage or VDD under voltage
Detects VDDD (1.8V internal digital
supply) overvoltage
Hall Element offset monitor
Temperature sensor monitor (see 13.5.3)
/ ADC conversion interruption
DSP overflow / Hall Element biasing issue
/ Analog front end self-test
Current biasing system monitor / Stress
Sensor Readout
set to one if any error present (only when
SENT_DIAG_STRICT = 1). Otherwise,
always high.
Table 26 - SENT serial message error code for enhanced serial message
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12. End-User Programmable Items
Parameter
PSF
value
Description
Default
Values
# bits
GENERAL CONFIGURATION
USER_ID[0:5]
94
..
101
Reserve for end-user to program
information to keep traceability, unless the
patch area is used.
-
8
WARM_TRIGGER_LONG
120
Add delay for PTC entry level
0
1
MUPET_ADDRESS
124
PTC address for which the slave will
communicate
0/1
2
SENSOR FRONT-END
GAINMIN
2
Virtual Gain min
0
6
GAINMAX
3
Virtual Gain max
47
7
GAINSATURATION
4
Gain saturation enable
0
1
22
0: X-Y Angular Rotary
1: Y-Z Angular Rotary / Y Linear Position
2: X-Z Angular Rotary / X Linear Position
3: Do not use
0
2
1
2
0
1
SENSING_MODE
FILTERING
FILTER
23
FIR filter bandwidth selection
0: no filter
1: FIR11 (default)
2: FIR1111
3: Do not use
LINEAR TRANSFER CHARACTERISTIC
4POINTS
17
Enable 4 points PWL linearization
CLAMPHIGH
21
High clamping value of angle output data
4088
12
CLAMPLOW
15
Low clamping value of angle output data
1
12
CW
16
Magnet rotation direction.
0
1
DP
10
DSP discontinuity point
0
13
LNRS0
24
4-pts - Slope coefficient before reference
point A
-
16
LNRAX
LNRBX
LNRCX
LNRDX
27
37
48
60
4-pts - X Coordinate for reference points
A,B,C,D
-
16
LNRAY
LNRBY
LNRCY
LNRDY
32
43
55
67
4-pts - Y Coordinate for reference points
A,B,C,D
-
16
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Parameter
PSF
value
Description
Default
Values
# bits
-
16
1
256
512
767
1023
1278
1534
1789
2045
2300
2555
2811
3066
3322
3577
3833
4089
12
LNRAS
LNRBS
LNRCS
LNRDS
34
45
57
69
LNRY0
LNRY1
LNRY2
LNRY3
LNRY4
LNRY5
LNRY6
LNRY7
LNRY8
LNRY9
LNRY10
LNRY11
LNRY12
LNRY13
LNRY14
LNRY15
LNRY16
26
28
33
36
39
44
47
50
56
59
62
68
71
74
77
80
83
17-pts / 16 segments - Y coordinate point
[0:16]
OUTSLOPE_COLD
85
Slope coefficient at cold of the
programmable temperature-dependent
offset.
0
8
OUTSLOPE_HOT
86
Slope coefficient at hot of the
programmable temperature-dependent
offset.
0
8
T_SYNC_DELAY
8
SENT - ADC synchronization delay
(SENT with PAUSE only)
130
8
4-pts - Slope coefficient for reference points
A,B,C,D
TWO_ANGLES_FRAME
127
Enable 2 fields measure per output frame
(SENT with PAUSE only)
1
1
USEROPTION_SCALING
18
Enable output scaling 2x after linearization
0
1
WORK_RANGE
128
Working Range 17 points.
0
4
Post DSP Gain Stage.
16
8
WORK_RANGE_GAIN
7
DIAGNOSTICS
COLD_SAFE_STARTUP_EN
52
Normal (0) or safe start-up (1) after poweron reset
0
1
DIAG_EN
42
Diagnostics global enable.
Do not modify!
1
1
DIAG_FIELDTOOHIGHTHRES
132
Field strength limit over which a fault is
reported.
14
4
DIAG_FIELDTOOLOWTHRES
133
Field strength limit under which a fault is
reported.
3
4
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Parameter
PSF
value
Description
Default
Values
# bits
DIAGDEBOUNCE_STEPDOWN
30
Diagnostic debouncing step-down time used
for recovery time setting
1
2
DIAGDEBOUNCE_STEPUP
31
Diagnostic debouncing step-up time used for
hold time setting
1
2
DIAGDEBOUNCE_THRESH
41
Diagnostic debouncing threshold
1
3
MEMLOCK
54
Enable NVRAM write protection
0
2
OUT_DIAG_HIZ_TIME
118
Recovery time when a transient digital
failure is detected
15
5
ROUT_LOW
119
Select output impedance for PTC
communication
1
1
SENT_DIAG_STRICT
11
Option of analog fault reporting in the SENT
slow message
0
1
125
Defines the error message within SENT
frame in diagnostic mode
Refer to the Safety Manual
0
2
12
Sets the SENT nibble high/low-time
configuration:
0: 7 fixed ticks high time
1: 5 fixed ticks low time
1
1
PROTOCOL
121
Selection of the measurement timing mode
and the corresponding output protocol
0: continuous asynchronous angle
acquisition, SENT without PAUSE
1: continuous synchronous angle
acquisition, SENT with PAUSE
1
1
T_FRAME
88
SENT period in ticks of 3us
287
12
66
Definition of data transmitted in the SENT
fast channel 2 in case SENT_FC_FORMAT=0
0: Temperature sensor (SP ID 0x23)
1: 0xFF9(d4089) - CH1
2: RAM data (RAMPROBE_PTR)
3: 0xFFF(d4095) - CH1
3
2
90
SENT frame format option
0: Format H.1 (A.1, Two 12-bit Fast
Channels)
1: Format H.4 (A.3, 12-bit Fast Channel &
Single secure)
1
1
SENT_REPORT_MODE_ANA
OUTPUT CONFIGURATION
NIBBLE_PULSE_CONFIG
SENT PROTOCOL OPTIONS
SENT_FAST_CHANNEL_2
SENT_FC_FORMAT
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Parameter
SENT_INIT_GM
PSF
value
65
Description
Initialization frame definition until first valid
data
0: 0x000
1: 0xFFF(d4095) error code
Enable legacy CRC calculation
0: The SAE J2716 recommended CRC is
calculated
Serial Message configuration
0: Serial Message is disabled
1: Serial Message is enabled
Serial Message Sequence definition
0: Short Sequence Serial Message
1: Extended Sequence Serial Message
Extended sequence configuration
0: without field norm extension
1: with field norm extension
Default
Values
# bits
0
1
0
1
1
1
0
1
1
1
SENT_LEGACY_CRC
64
SERIAL_CONFIG
91
SENT_SLOW_EXTENDED
126
SENT_SLOW_EXTENSION
129
SENT_CHANNEL_X1
103
Part of ESM: Fast-channel 1 - X1
0
12
SENT_CHANNEL_X2
104
Part of ESM: Fast-channel 1 - X2
0
12
SENT_CHANNEL_Y1
106
Part of ESM: Fast-channel 1 - Y1
0
12
SENT_CHANNEL_Y2
108
Part of ESM: Fast-channel 1 - Y2
0
12
SENT_OEM_CODE1
SENT_OEM_CODE2
SENT_OEM_CODE3
SENT_OEM_CODE4
73
75
78
81
Part of ESM: OEM code [1:4]
(only if 4POINTS = 1)
-
12
SENT_SENSOR_ID1
SENT_SENSOR_ID2
SENT_SENSOR_ID3
SENT_SENSOR_ID4
110
111
113
115
Part of SSM/ESM: Sensor ID-[1:4]
-
12
Table 27 - MLX90422 end-user programmable items table
Performances described in this document are only achieved by adequate programming of the device. To
ensure desired functionality, Melexis recommends to follow its programming guide and to contact its
technical or application service.
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13. Description of End-User Programmable Items
13.1. SENT Output Mode Options
The parameter PROTOCOL defined the measurement timings mode and the corresponding output
protocol.
PROTOCOL
Description
0
Continuous asynchronous angle acquisition, SENT without pause
1
Continuous synchronous angle acquisition, SENT with pause
Table 28 - MLX90422 protocol selection
When using the SENT with pause protocol, the parameter T_FRAME can be used to control the SENT
frame period. By default, the period is 287 ticks. While this parameter is encoded on 12 bits, it is
recommended that its value fits within the range specified in section 11.1.
The frame format, and therefore the data available through the fast channels, is selected using the
SENT_FC_FORMAT parameter. Refer to section 11.1.3 for a description of these SENT frame format.
SENT_FC_FORMAT
Description
0
Dual Throttle Position Sensor A.1 (H.1)
1
Single Secure Sensor A.3 (H.4), default
Table 29 - MLX90422 frame format selection
When using the H.1 format, the parameter SENT_FAST_CHANNEL_2 can be used to control what data will
be output on the 2 nd fast channel
SENT_FAST_CHANNEL_2
Description
0
Internal temperature sensor (SP ID 0x23)
1
0xFF9(d4089) - CH1
2
RAM data (RAMPROBE_PTR)
3
0xFFF(d4095) - CH1
Table 30 - MLX90422 fast channel 2 data selection
The SENT protocol allows to either fix the number of ticks for the high time of fix the number of ticks for
the low time in the SENT nibble pulses. This can be done using NIBBLE_PULSE_CONFIG parameter.
NIBBLE_PULSE_CONFIG
Description
0
Fixed high time (7 ticks)
1
Fixed low time (5 ticks), default
Table 31 - MLX90422 nibble pulses configuration
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The enhanced serial message channel can be enabled or disabled using the SERIAL_CONFIG parameter.
SERIAL_CONFIG
Description
0
Serial Message is disabled
1
Serial Message is enabled, default
Table 32 - MLX90422 enhanced serial message configuration
When the enhanced serial message is enabled, it is possible to control whether the short sequence of the
extended sequence is used (see section 11.1.6) using the SENT_SLOW_EXTENDED parameter
SENT_SLOW_EXTENDED
Description
0
Short Sequence Serial Message, default
1
Extended Sequence Serial Message
Table 33 - MLX90422 serial sequence message definition
Furthermore, when the extended sequence is enabled, it is possible to configure whether or not the field
norm extension is used (see section 11.1.6) using the SENT_SLOW_EXTENSION parameter
SENT_SLOW_EXTENSION
Description
0
without field norm extension
1
with field norm extension, default
Table 34 - MLX90422 extended sequence definition
13.2. Output Transfer Characteristic
There are 2 different possibilities to define the transfer function (LNR) as specified in Table 35.
▪ With 4 arbitrary points (defined by X and Y coordinates) and 5 slopes
▪ With 17 equidistant points for which only the Y coordinates are defined
Output Transfer Characteristic
4POINTS
4 Arbitrary Points
1
17 Equidistant Points
0
Table 35 - Output transfer characteristic selection table
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13.2.1. Clockwise Parameter
The CW parameter defines the magnet rotation direction.
Rotation Direction
CW
Clockwise
1
Counter Clockwise
0
Table 36 - Magnet rotation selection table
Counter clockwise is the defined by
▪ the 1-4-5-8 pin order direction for the SOIC-8 package
▪ the 1-8-9-16 pin order direction for the TSSOP-16 package
▪ the 1-2-3-4 pin order direction for the DMP-4 package
▪ the 1-2-3 pin order direction for the SMP-3 package
▪ the 1-2-3-4 pin order direction for the SMP-4 package
Clockwise if defined by the reverse pin order. Refer to the package drawings in chapter 18.
13.2.2. Discontinuity Point (or Zero Degree Point)
The Discontinuity Point defines the 0° point on the circle. The discontinuity point places the origin at any
location of the trigonometric circle. The DP is used as reference for all the angular measurements.
New Angle = Angle − DP
The DP parameter is encoded using a 13-bit two’s complement signed format. The new angle and the
input angle are expressed in LSB12.
360 Deg.
0 Deg.
Figure 13 - Discontinuity point positioning
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13.2.3. 4-Pts LNR Parameters
The LNR parameters, together with the clamping values, fully define the relation (the transfer function)
between the digital angle and the output signal.
The shape of the MLX90422 four points transfer function from the digital angle value to the digital output
is described in the following figure (Figure 14). Seven segments can be programmed but the clamping
levels are necessarily flat.
Two, three, or even six calibration points are then available, reducing the overall non -linearity of the IC
by almost an order of magnitude each time. Three or six calibration point will be preferred by customers
looking for excellent non-linearity figures. Two-point calibrations will be preferred by customers looking
for a cheaper calibration set-up and shorter calibration time.
100%
CLAMPHIGH
D
Output [%]
LNR_D_Y
C
LNR_C_Y
B
LNR_B_Y
DP(0,0)
Slope LNR_C_S
Slope LNR_B_S
Slope
LNR_A_S
A
LNR_A_Y
CLAMPLOW
Slope LNR_D_S
Slope
LNR_S0
LNR_A_X
LNR_B_X
LNR_C_X
LNR_D_X
Angle [°] 360
Figure 14 - 4pts linearization parameters description
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13.2.4. 17-Pts LNR Parameters
The LNR parameters, together with the clamping values, fully define the relation (the transfer function)
between the digital angle and the output signal.
The shape of the MLX90422 seventeen points transfer function from the digital angle value to the output
voltage is described in the Figure 15. In the 17-Pts mode, the output transfer characteristic is Piece-WiseLinear (PWL).
LNR_Y16
16
100
LNR_Y15
LNR_Y14
15
14
Output [%]
...
13
12
11
10
LNR_Y9
LNR_Y8
50
LNR_Y7
9
8
7
Δx = w/16, fixed delta angle, with
6
...
5
w=
4
LNR_Y3
LNR_Y2
LNR_Y1
DP(0,0)
LNR_Y0
16·360°
WORK_RANGE_GAIN
3
1
180-
w
2
2
180
Angle [°]
180+
w
2
0
Figure 15 - 17pts linearization parameters description
All the Y-coordinates can be programmed from -50% up to +150% to allow clamping in the middle of one
segment (like on the figure), but the output value is limited to CLAMPLOW and CLAMPHIGH values.
Between two consecutive points, the output characteristic is interpolated.
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13.2.5. WORK_RANGE Parameter for Angle Range Selection
The parameter WORK_RANGE determines the input range on which the 16 segments are uniformly
spread. This parameter is provided for compatibility with former versions of Melexis Triaxis sensors.
For full featured working range selection, see section 13.2.6. For WORK_RANGE parameter, following
table applies.
WORK_RANGE
Range
Δx 17pts
WORK_RANGE
Range
Δx 17pts
0
360.0°
22.5°
8
180.0°
11.3°
1
320.0°
20.0°
9
144.0°
9.0°
2
288.0°
18.0°
10
120.0°
7.5°
3
261.8°
16.4°
11
102.9°
6.4°
4
240.0°
15.0°
12
90.0°
5.6°
5
221.5°
13.8°
13
80.0°
5.0°
6
205.7°
12.9°
14
72.0°
4.5°
7
192.0°
12.0°
15
65.5°
4.1°
Table 37 - Work range for 360° periodicity
Outside of the selected range, the output will remain at clamping levels.
13.2.6. WORK_RANGE_GAIN Parameter for Angle Range Selection
Alternatively, the range for the angle can be selected using the WORK_RANGE_GAIN parameter, which
applies a fixed gain to the transfer characteristics. WORK_RANGE_GAIN is coded on 8 bits where the 4
MSb defines the integer part and the 4 LSb the fractional part (in power of twos). Therefore, the
following equation applies to define the angle range w:
𝑤=
16 ∗ 360
𝑊𝑂𝑅𝐾_𝑅𝐴𝑁𝐺𝐸_𝐺𝐴𝐼𝑁
Both minimal and maximal angles are then defined by:
𝜃𝑚𝑖𝑛 =
360 − 𝑤
360 + 𝑤
; 𝜃𝑚𝑎𝑥 =
2
2
where θmin corresponds to the angle yielding 0% output and θmax the angle giving a 100% output.
Using WORK_RANGE_GAIN parameter, the anchor point is kept at 180 and the range is symmetrically set
around this value. It creates a zoom-in of the angle around this point.
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Following tables give some values as an example:
WORK_RANGE_GAIN
Factor
Range (w)
θmin
θmax
Δx 17pts
0x10
1
360°
0°
360°
22.5°
0x20
2
180°
90°
270°
11.3°
0x40
4
90°
135°
225°
5.6°
0xFF
15.94
22.6°
168.7°
191.3°
1.41°
Table 38 - Working range defined by WORK_RANGE_GAIN parameter
Outside of the working range, the output will remain at clamping levels.
13.2.7. Thermal OUTSLOPE Offset Correction
Two parameters, OUTSLOPE_HOT and OUTSLOPE_COLD, are used to add a temperature dependent
offset. In the MLX90422, this offset is applied to the angle just before the clamping function.
The offset shift is computed using the device internal linearized temperature as depicted in the figure
below (Figure 16).
Offset
+6.25%
(at ΔT= 128°C)
OUTSLOPEHOT
OUTSLOPECOLD
-6.25%
(at ΔT= 128°C)
-40
Temperature (°C)
35
160
Figure 16 - Temperature compensated offset
The thermal offset can be added or subtracted to the output, before the clamping. The span of this offset
is ±6.25% of the full output scale for a temperature difference of 128°C. Two thermal coefficients are
defined depending on whether the linearized temperature is below (OUTSLOPE_COLD) or above
(OUTSLOPE_HOT) the 35°C anchor point.
If the device internal temperature is higher than 35°C then:
Compensated Angle = Angle − Δ𝑇 ⋅
OUTSLOPE_HOT
64
If the device internal temperature is lower than 35°C then:
Compensated Angle = Angle − Δ𝑇 ⋅
OUTSLOPE_COLD
64
Each of the two thermal coefficients is encoded using an 8-bit two’s complement signed format. The
thermally compensated angle and the input angle are expressed in LSB12, while the linearized
temperature difference ∆T is expressed in °C.
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13.2.8. Clamping Parameters
The clamping levels are two independent values to limit the output voltage range in normal operation.
The CLAMPLOW parameter adjusts the minimum output level. The CLAMPHIGH parameter sets the
maximum output level. Both parameters have 12 bits of adjustment and are available for all four LNR
modes. The values are encoded in fractional code, from 0% to 100%
13.3. Sensor Front-End
Parameter
Value
SENSING_MODE
[0:2]
GAINMIN
[0:47]
GAINMAX
[0:47]
GAINSATURATION
[0:1]
Table 39 - Sensing mode and front-end configuration
The SENSING_MODE parameter defines which sensing mode and fields are used to calculate the angle.
The different possibilities are described in the tables below. This 2-bit value selects the first (B1) and
second (B2) field components according to the Table 40 content.
SENSING_MODE
B1
B2
Motion
0
X
Y
X-Y Angular Rotary
1
Y
Z
Y-Z Angular Rotary / Y Linear Position
2
X
Z
X-Z Angular Rotary / X Linear Position
Table 40 - Sensing mode description
GAINMIN and GAINMAX define the thresholds on the virtual gain code outside which the fault “GAIN out
of Spec.” is reported. When either of the value of GAINMIN or GAINMAX is not within valid limits (see
Table 39), the fault reporting is disabled.
If GAINSATURATION is set, then the virtual gain code is saturated at GAINMIN and GAINMAX, and no
Diagnostic fault is set since the saturations applies before the diagnostic is checked.
13.4. Filtering
The MLX90422 features 2 low-pass FIR filter modes controlled with FILTER = 1…2. FILTER = 0 corresponds
to no filtering. The transfer function is described by:
yn =
j
a
i =0
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This filter characteristic is given in the Table 41.
FILTER
0
1
2
Type
Disable
Coefficients a i
1
11
1111
Title
No filter
ExtraLight
Light
DSP cycles (j= nb of taps)
1
2
4
Efficiency RMS (dB)
0
3.0
6.0
Finite Impulse Response (FIR)
Table 41 - FIR filter characteristics
13.5. Programmable Diagnostics Settings
13.5.1. Diagnostics Global Enable
DIAG_EN should be kept to its default value (1) to retain all functional safety abilities of the MLX90422.
This feature shall not be disabled.
13.5.2. Diagnostic Debouncer
A debouncing algorithm is available for analog diagnostic reporting. Enabling this debouncer will increase
the FHTI of the device. Therefore, Melexis recommends keeping the debouncing of analog faults off, by
not modifying below described values. The factory default settings mentioned in chapter 12 should be
used.
Parameter
Description
DIAGDEBOUNCE_STEPDOWN
Decrement values for debouncer counter. The counter is
decremented once per evaluation cycle when no analog
fault is detected.
DIAGDEBOUNCE_STEPUP
Increment value for debouncer counter. The counter is
incremented once per evaluation cycle when an analog
fault is detected.
DIAGDEBOUNCE_THRESH
Threshold for debouncer counter to enter diagnostic
mode. When set to 0, debouncing is off and analog faults
are reported immediately after detection.
Table 42 - Diagnostic debouncing parameters
Once an analog monitor detects an error, it takes control of the debouncing counter. This counter will be
incremented by DIAGDEBOUNCE_STEPUP value each time this specific monitor is evaluated and the error
is still present. When the debouncing counter reaches the value defined by DIAGDEBOUNCE_THRESH, an
error is reported on the error channel, and the debouncing counter stays clamped to this
DEBOUNCE_THRESH value (see section 13.5.6 for SENT error message codes). Once the error disappears,
each time its monitor is evaluated, the debouncing counter is decremented by
DIAGDEBOUNCE_STEPDOWN value. When the debouncing counter reaches zero, the error disappears
from the reporting channel and the debouncing counter is released. To implement proper reporting
times, one should refer to the FHTI, see chapter 14.3. The reporting and recovery time are defined in the
table below (valid for DIAGDEBOUNCE_THRESH > 0).
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Parameter
Reporting Time
Recovery Time
Min
Max
𝑇𝐻𝑅𝐸𝑆𝐻
⌉ − 1)
𝑆𝑇𝐸𝑃𝑈𝑃
𝑇𝐻𝑅𝐸𝑆𝐻
𝐷𝐶𝑇 ∙ (⌈
⌉)
𝑆𝑇𝐸𝑃𝐷𝑂𝑊𝑁
𝑥
⌈ ⌉
𝑦
𝑇𝐻𝑅𝐸𝑆𝐻
⌉)
𝑆𝑇𝐸𝑃𝑈𝑃
𝑇𝐻𝑅𝐸𝑆𝐻
𝐷𝐶𝑇 ∙ (⌈
⌉ + 1)
𝑆𝑇𝐸𝑃𝐷𝑂𝑊𝑁
𝐷𝐶𝑇 ∙ (⌈
𝐷𝐶𝑇 ∙ (⌈
is the ceiling function of x divided by y
Table 43 - Diagnostic reporting and recovery times
13.5.3. Over/Under Temperature Diagnostic
DIAG_TEMP_THR_HIGH defines the threshold for over temperature detection and is compared to the
linearized value of the temperature sensor T LIN. DIAG_TEMP_THR_LOW defines the threshold for under
temperature detection and is compared to the linearized value of the temperature sensor T LIN
TLIN is encoded using the SENT standard for temperature sensor. One can get the physical temperature
TPHY of the die from TLIN using following formula
𝑇𝑃𝐻𝑌 =
𝑇𝐿𝐼𝑁
− 73.15
8
TPHY is expressed in °C and the TLIN is expressed in LSB12.
Unlike TLIN, DIAG_TEMP_THR_LOW and DIAG_TEMP_THR_HIGH are encoded using 8-bit unsigned values.
Therefore, a factor of 16 must be considered when comparing either threshold to TLIN.
The following table summarizes the characteristics of the linearized temperature sensor and the
encoding of the temperature monitor thresholds.
Parameter
Symbol
Min
Typ.
Max
Unit
TLIN resolution
ResTLIN
-
0.125
-
°C
TLIN refresh rate
FS,TLIN
-
200
-
Hz
TLIN linearity error
TLinErr
-8
-
8
°C
from -40 to 160°C
TLIN linearity error
TLinErr
-2
-
6
°C
from 35 to 125°C
High temperature
threshold
DIAG_TEMP
_THR_HIGH
-
8
-
LSB12
Fixed value, corresponds to
-57°C
Low temperature
threshold
DIAG_TEMP
_THR_LOW
-
136
-
LSB12
Fixed value, corresponds to
199°C
High/low temperature
threshold resolution
ResTthr
2
°C
Condition
12-bit range
12-bit range
Table 44 - Linearized temperature sensor characteristics
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13.5.4. High-Temperature Extension Over-Temperature Diagnostic
When operating at a junction temperature up to 175°C, the MLX90422 retains all its diagnostic features.
There’s no risk of false-positive. Above this temperature, the overheating monitor enters its detection
range. The default configuration of this monitor reports a typical junction temperature of 199°C. Due to
temperature sensor tolerances and noise at high temperatures, Melexis recommends a safety margin
greater than 15°C. Consequently, if the sensor operates up to 190°C of junction temperature, Melexis
cannot guarantee that the overheating monitor will not report an error and recommends to adapt the
overheating monitor threshold to 207°C. This can be done by reprogramming a custom device
configuration (patch) shown in Table 14 below. Contact a Melexis representative for further information.
Parameter
Patch Content
PATCH2_ADDRESS
0x3B0F
PATCH2_INSTRUCTION
0x008C
Table 45 - High-temperature extension patch to prevent false-positive on overheating monitor
13.5.5. Field Strength and Field Monitoring Diagnostics
Field Strength is compensated over the circuit operating temperature range and represents a reliable
image of the field intensity generated by the magnet.
13.5.6. SENT Mode Diagnostic Reporting
In case of a digital fault, the OUT pin is configured in high-impedance. Conversely, an analog fault is
reported by setting the SENT status bit S0 (refer to section 11.1.3).
The parameter SENT_DIAG_STRICT controls the behavior of the MSb in the ESM error code (see bit 11 in
Table 26).
SENT_DIAG_STRICT
Description
0
The MSb (in 11 in Table 26) in the ESM error reporting is fixed high,
even if no error needs to be reported.
1
The MSb in the ESM error reporting acts as an error reporting flag.
Table 46 - ESM error code MSb behavior selection
This reporting behavior is only valid for the factory default settings, with the exception of the
aforementioned parameters in this section. Other reporting behaviors and further information on the
safe-states are available in the safety manual of the MLX90422.
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14. Functional Safety
14.1. Safety Manual
The safety manual, available upon request, contains the necessary information to integrate the
MLX90422 component in a safety related item, as a Safety Element Out-of-Context (SEooC).
In particular, it includes:
▪ The description of the Product Development lifecycle tailored for the Safety Element.
▪ An extract of the Technical Safety concept.
▪ The description of Assumptions-of-Use (AoU) of the element with respect to its intended use,
including:
assumptions on the device safe state;
assumptions on fault tolerant time interval and multiple-point faults detection interval;
assumptions on the context, including its external interfaces;
▪ The description of safety analysis results (at the device level, to be used for the system
integration), HW architectural metrics and description of dependent failures initiators.
▪ The description and the result of the functional safety assessment process; list of confirmation
measures and description of the independency level.
14.2. Safety Mechanisms
The MLX90422 provides numerous self-diagnostic features (safety mechanisms). Those features increase
the robustness of the IC functionality either by preventing the IC from providing an erroneous output
signal or by reporting the failure according to the SENT protocol definition.
Legend
● High coverage
○ Medium coverage
ANA: Analog hardware failure reporting mode, described in the safety manual
High-Z: A special failure reporting mode where the output is set in high-impedance mode (no HW failsafe mode/timeout, no SW safe startup)
DIG: Digital hardware failure reporting mode, described in the safety manual
At Startup: A HW fault present at time zero is detected before the first frame is transmitted.
DIAG_EN: This safety mechanism can be disabled by setting DIAG_EN = 0 (see chapter 13.5.1). This
option should not be used in application mode!
Table 47 - Self diagnostic legend
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Preliminary Datasheet
Reporting
mode
At
startup
DIAG
○
ANA
NO
●
●
○
ANA
NO
●
Magnetic Signal Conditioning Gain Monitor & Clamping
●
○
ANA
YES
●
Mag. Sig. Cond. Failure Control by the Chopping Technique
●
n/a
n/a
Category and safety mechanism name
Frontend
ADC
DSP
Signal-conditioning Diagnostic
●
●
○
Magnetic Signal Conditioning Voltage Test Pattern
●
○
Magnetic Signal Conditioning Rough Offset Clipping check
Support.
Func.
Module &
Package
EN
●
●
A/D Converter Test Pattern
●
ANA
NO
●
ADC Conversion Errors & Overflow Errors
●
ANA
YES
●
ADC Common Mode Monitor
●
n/a
YES
ANA
NO
Flux Monitor (Rotary mode)
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Backend
●
○
●
●
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Preliminary Datasheet
Category and safety mechanism name
Frontend
Digital-circuit Diagnostic
ADC
DSP
●
●
Backend
Support.
Func.
Module &
Package
Reporting
mode
At
startup
DIAG
EN
○
RAM Parity, 1-bit per 16-bit word, ISO D.2.5.2
●
DIG
YES
ROM Parity, 1-bit per 32-bit word, ISO D.2.5.2
●
DIG
YES
NVRAM 16-bit signature (run-time) ISO D.2.4.3,
by means of SW CRC-CCITT16
●
DIG
NO
NVRAM Double Error Detection ECC ISO D.2.4.1
●
DIG
YES
Logical Monitoring of Program Sequence ISO D.2.9.3 via
Watchdog "IWD" (CPU clock) ISO D.2.9.2
●
○
DIG
NO
Watchdog "AWD" (separate clock) ISO D2.9.1
●
○
DIG
YES
CPU Errors "Invalid Address", "Wrong opcode"
●
○
DIG
YES
●
ADC Interface Checksum
●
DIG
NO
ADC Internal Errors
○
DIG
YES
DIG
NO
●
DIG
NO
●
●
DSP Test Pattern (atan2)
●
Critical Ports Monitoring
●
○
●
ADC Data Adder Test - Range Check and Buffer alignment
○
DIG
YES
ADC Data Adder Error
○
DIG
YES
●
ANA
NO
●
●
DIG
NO
●
DSP Overflow
SENT Fall Collision detection (SENT pulse generator)
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○
○
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Preliminary Datasheet
Category and safety mechanism name
Frontend
ADC
DSP
Backend
Support.
Func.
Module &
Package
Reporting
mode
At
startup
DIAG
●
Communication Interface Diagnostic
●
SENT Protection Against Re-configuration at Run-time
●
DIG
NO
SENT Frame Counter & Redundant Nibble
●
n/a
n/a
System-level Diagnostic
●
●
Supply Voltage Monitors
(all supply domains except VDD_OV & POR)
●
●
ANA
YES
External Supply Over-voltage Monitor
●
●
High-Z
YES
Digital Supply Under-voltage Monitor (Power-on Reset)
●
●
High-Z
YES
●
ANA
YES
○
○
○
HW Error Controller
●
●
●
DIG
n/a
HW Fail-safe mode with timeout
●
●
●
High-Z
n/a
●
ANA
n/a
●
●
DIG
n/a
●
●
DIG
YES
Overheating Monitor
○
○
EN
●
●
Warning/Reporting Mechanisms
Analog-type Error management
Safe start-up mode
●
●
Mechanisms executed at start-up only
RAM March-C HW Test at start-up
Table 48 - MLX90422 list of self-diagnostics with characteristics
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14.3. Fault Handling Time Interval
The Fault handling Time Interval (FHTI) is the time interval between the start of the first frame with
invalid position value without notice, and the end of the last frame preceding a fail -safe state of the IC.
The following table provides the worst-case FHTI for both an analog fault and a digital fault in MLX90422.
Case
FHTI
Analog Fault
DCTANA + 2 Tframe
Digital Fault
DCTDIG
Comment
Refer to section 7.3 for the DCTANA and Tframe values
Refer to section 7.3 for the DCTDIG value
Table 49 - Worst-case FHTI
The FHTI values provided here are valid only for the default factory settings. A full list of timings is
available in the safety manual of the MLX90422, including cycle times, execution times and reporting
times for every implemented safety mechanism.
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15. Recommended Application Diagrams
15.1. Wiring with the MLX90422 in SOIC-8 Package
1
R1
VDD
7
VDEC
C1
C4
C3
8
VSS
C5
MLX90422
2,3,4,6
C2
5
R2
X
OUT
Figure 17 - Recommended wiring for the MLX90422 in SOIC-8 package
Component
Min
Typ.
Max
C1
-
220 nF
-
C2(CL)
1 nF
10 nF
22 nF
C3
-
100 nF
220 nF
C4
-
-
1 nF
C5
-
-
1 nF
R1
-
-
10 Ω
R2
-
-
-
Remark
Optional, for improved
EMC robustness
Table 50 - Recommended values for the MLX90422 in SOIC-8 Package
For best EMC performance, C1, C2 and C3 with typical values need to be placed as close as possible to the
IC. To further improve EMC robustness, a 1nF capacitor can be placed close to the connector (C4, C5) and
a 10 Ohm resistor added in series with the supply line (R1).
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15.2. Wiring with the MLX90422 in TSSOP-16 Package
R11
3
VDD1
1
VDEC1
C11
C14
C13
2,16
VSS1
C15
4,13,14
C12
R12
X1
15
OUT1
R21
MLX90422
11
VDD2
9
VDEC2
C24
C21
C23
8, 10
VSS2
C25
5,7,12
C22
6
R22
X2
OUT2
Figure 18 - Recommended wiring for the MLX90422 in TSSOP-16 package (dual die)
Component
Min
Typ.
Max
Cx1
-
220 nF
-
Cx2(CL)
1 nF
10 nF
22 nF
Cx3
-
100 nF
220 nF
Cx4
-
-
1 nF
Cx5
-
-
1 nF
Rx1
-
-
10 Ω
Rx2
-
-
-
Remark
Optional, for improved
EMC robustness
Table 51 - Recommended values for the MLX90422 in TSSOP-16 Package
For best EMC performance, Cx1, Cx2 and Cx3 with typical values need to be placed as close as possible to
the IC. To further improve EMC robustness, a 1nF capacitor can be placed close to the connector (Cx4, Cx5)
and a 10 Ohm resistor added in series with the supply line (Rx1).
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15.3. Wiring with the MLX90422 in DMP-4 Package (built-in capacitors)
MLX90422
VDD
C4
C1
VSS
C3
VDEC
C2
OUT
4 VSS
3 OUT
MLX90422
2 VDD
VDEC
1 VSS
Figure 19 - Internal wiring of the MLX90422 in DMP-4
Component
Value
Remark
C1
220 nF
Supply capacitor
C2
10 nF
Output capacitor
C3
100 nF
Decoupling capacitor
C4
-
Not mounted
Table 52 - DMP-4 capacitors configuration
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15.4. Wiring with the MLX90422 in SMP-3 Package (built-in capacitors)
MLX90422
VDD
VDEC
VSS
OUT
C2
C1
C3
VDD
OUT
2
1
VSS
3
Figure 20 - Internal wiring of the MLX90422 in SMP-3
Component
Value
Remark
C1
220nF
Supply capacitor
C2
100nF
Decoupling capacitor
C3
10nF
Output capacitor
Table 53 - SMP-3 capacitors configuration
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15.5. Wiring with the MLX90422 in SMP-4 Package (built-in capacitors)
VDEC
VDEC
C5
90422
OUT
VDD VSS
C3
C6
90422
VSS
VDD
OUT
C1
C4
C2
OUT1
VSS
OUT2
4
3
2
1
VDD
Figure 21 - Internal wiring of the MLX90422 in SMP-4
Component
Value
Remark
C1
C2
220nF
Supply capacitor
C3
C4
10nF
Output capacitor
C5
C6
100nF
Decoupling capacitor
Table 54 - SMP-4 capacitors configuration
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16. Standard information regarding manufacturability
of Melexis products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to standards in place in Semiconductor industry.
For further details about test method references and for compliance verification of selected soldering
method for product integration, Melexis recommends reviewing on our web site the General Guidelines
soldering recommendation (http://www.melexis.com/en/quality-environment/soldering)
For all soldering technologies deviating from the one mentioned in above document (regarding peak
temperature, temperature gradient, temperature profile, etc.), additional classification and qualification
tests have to be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends
consulting the dedicated trim & form recommendation application note : “Lead Trimming and Forming
Recommendations”
(http://www.melexis.com/en/documents/documentation/application-notes/leadtrimming-and-forming-recommendations).
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction
Of the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/en/quality-environment.
17. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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18. Package Information
18.1. SOIC-8 - Package Information
18.1.1. SOIC-8 - Package Dimensions
1.27 TYP
NOTES:
3.81
5.80
3.99** 6.20
4.80
4.98*
All dimensions are in millimeters (angles in degrees).
* Dimension does not include mold flash, protrusions or
gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or
protrusion (shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition.
Dambar cannot be located on the lower radius of the foot.
1.37
1.57
1.52
1.72
0.36
0.46***
0.19
0.25
0°
8°
0.100
0.250
0.41
1.27
Figure 22 - SOIC-8 package outline drawing
18.1.2. SOIC-8 - Pinout and Marking
8
Part Number MLX90422 (3 digits)
Die Version (3 digits)
Out
N.C.
VDEC
VSS
Marking :
5
Top
F
422Axx
F12345
Xy-L
Axx
12345
Lot number (5 digits)
Fab Identifier (1 letter)
Xy-L
Split lot number (up to 4 letters) + “-L“
N.C.
Test2
Test1
4
VDD
1
422
Bottom
YY
WW
Week Date code (2 digits)
Year Date code (2 digits)
Figure 23 - SOIC-8 pinout and marking
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18.1.3. SOIC-8 - Sensitive Spot Positioning
CW
8
7
6
5
CCW
X
1.25
1.65
1
2
3
0.46 +/- 0.06
4
1.96
2.26
Y
Figure 24 - SOIC-8 sensitive spot position
18.1.4. SOIC-8 - Angle Detection
7
6
N
8
S
~ 0 Deg.*
~ 90 Deg.*
5
8
7
4
1
2
6
5
3
4
N
S
1
2
3
~ 180 Deg.*
8
7
6
~ 270 Deg.*
5
8
7
6
5
3
4
S
NN
S
1
2
3
N
4
1
2
* No absolute reference for the angular information.
Figure 25 - SOIC-8 angle detection
The MLX90422 is an absolute angular position sensor but the linearity error (See section 9) does not
include the error linked to the absolute reference 0 Deg. This reference can be fixed in the application
through the discontinuity point.
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18.2. TSSOP-16 - Package Information
18.2.1. TSSOP-16 - Package Dimensions
0.65 ± 0.04
12O REF
0.20 ± 0.04
1.0 DIA
REF
0.09 MIN
4.30
4.50** 6.4 ± 0.2
0.09 MIN
1.0 REF
12O REF
1.0
REF
0.50
0.75
0O
8O
1.0 ± 0.2
0.85
0.95
4.90
5.10*
0.09
0.20
1.1 MAX
0.19
0.30***
0.05
0.15
NOTES:
All dimensions are in millimeters (angles in degrees).
* Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side).
*** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the
dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
REF: Reference dimensions as stated in packaging supplier POD, based on JEDEC.
Figure 26 - TSSOP-16 package outline drawing
18.2.2. TSSOP-16 - Pinout and Marking
VSS2
VDEC2
Test12
VDD2
N.C.
Test21
N.C.
Out1
Marking :
Part Number MLX90422 (3 digits)
Die Version (3 digits)
9
16
Top
F
422Axx
F12345
Xy-L
8
Axx
12345
Lot number (5 digits)
Fab Identifier (1 letter)
Xy-L
Bottom
N.C.
N.C.
OUT2
Test22
VDD1
Test11
VSS1
VDEC1
1
422
YY
Split lot number (up to 4 letters) + “-L“
WW
Week Date code (2 digits)
Year Date code (2 digits)
Figure 27 - TSSOP-16 pinout and marking
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18.2.3. TSSOP-16 - Sensitive Spot Positioning
CW
X2
16
9
Die 1
Y2
Die 2
Y1
0.30 +/- 0.06
CCW
1.95
2.45
1
8
1.86
2.06
X1
2.71
2.91
Figure 28 - TSSOP-16 sensitive spot position
18.2.4. TSSOP-16 - Angle Detection
~ 180 Deg.*
16
9
9
Die 1
Die 2
S
8
1
~ 0 Deg.*
16
8
~ 270 Deg.*
9
9
Die 1
S
N
1
~ 90 Deg.*
16
S
Die 1
S
N
Die 2
1
~ 180 Deg.*
~ 270 Deg.*
16
N
Die 1
~ 90 Deg.*
Die 2
N
~ 0 Deg.*
Die 2
8
1
8
* No absolute reference for the angular information.
Figure 29 - TSSOP-16 angle detection
The MLX90422 is an absolute angular position sensor but the linearity error (See section 9) does not
include the error linked to the absolute reference 0 Deg. This reference can be fixed in the application
through the discontinuity point.
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18.3. DMP-4 - Package Information
18.3.1. DMP-4 - Package Outline Dimensions (POD) - Straight Leads
Figure 30 - DMP-4 straight leads package outline drawing
18.3.2. DMP-4 - Package Outline Dimensions (POD) - STD2 2.54
Figure 31 - DMP-4 STD2 2.54 package outline drawing
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18.3.3. DMP-4 - Package Outline Dimensions (POD) - STD4 2.54
Figure 32 - DMP-4 STD4 2.54 package outline drawing
18.3.4. DMP-4 - Marking
422Axx
Fxxxxx
XyXz-L
YYWW
Marking :
Part Number MLX90422 (3 digits)
Die Version (3 digits)
Upper part
422
F
Axx
12345
Lot number (5 digits)
Fab Identifier (1 letter)
1 x 220nF
1 x 100nF
1 x 10nF
1
2
3
4
XyXz-L
YY
Split lot number (up to 4 letters) + “-L“
WW
Week Date code (2 digits)
Year Date code (2 digits)
Lower part
Capacitor configuration
Figure 33 - DMP-4 Marking
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18.3.5. DMP-4 - Sensitive Spot Positioning
CW
Y
Xc=0.23
X
CCW
Yc =
3.67
Dimensions in “mm”
Zc=0.495
Figure 34 - DMP-4 sensitive spot position
18.3.6. DMP-4 - Angle Detection
~ 0 Deg.*
~ 90 Deg.*
S
S
N
N
~ 180 Deg.*
~ 270 Deg.*
N
S
N
S
* No absolute reference for the angular information.
Figure 35 - DMP-4 angle detection
The MLX90422 is an absolute angular position sensor but the linearity error (See section 9) does not
include the error linked to the absolute reference 0 Deg. This reference can be fixed in the application
through the discontinuity point.
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18.4. SMP-3 - Package Information
18.4.1. SMP-3 - Package Outline Dimension (POD)
Figure 36 - SMP-3 package outline drawing
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18.4.2. SMP-3 - Marking
Marking :
Top
Part Number
422Axx-L
Die Version
422
-L
Fxxxxx
Fxxxxx
Application Code
Assembly Lot Number
3
2
1
Axx
Bottom
Part Number
422Axx-L
Die Version
422
Fxxxxx
YYWW
CCCCC
Axx
-L
Application Code
Fxxxxx
Assembly Lot Number
YYWW
Year (YY) and Week (WW) date code
CCCCC
Capacitor Configuration
Figure 37 - SMP-3 marking
18.4.3. SMP-3 - Sensitive Spot Positioning
CW
3.95 ± 0.15
0.546
± 0.06
X
0.74
CCW
±0.15
Y
Figure 38 - SMP-3 sensitive spot position
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18.4.4. SMP-3 - Angle Detection
Angle detection SMP-3
~ 0 Deg.*
~ 90 Deg.*
N
S
S
N
~ 180 Deg.*
~ 270 Deg.*
S
N
S
N
* No absolute reference for the angular information.
Figure 39 - SMP-3 angle detection
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18.5. SMP-4 - Package Information
18.5.1. SMP-4 - Package Outline Dimension (POD)
Figure 40 - SMP-4 package outline drawing
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18.5.2. SMP-4 - Marking
Marking :
Top
422Axx-L
Part Number
Die Version
422
Fxxxxx
a
-L
Fxxxxx
b
2
1
Axx
Application Code
Assembly Lot Number
c
3
4
Bottom
Part Number
422Axx-L
Die Version
422
Fxxxxx
YYWW
CCCCCC
Axx
-L
Application Code
Fxxxxx
Assembly Lot Number
YYWW
Year (YY) and Week (WW) date code
CCCCCC
Capacitor Configuration
Figure 41 - SMP-4 marking
18.5.3. SMP-4 - Sensitive Spot Positioning
CW
X2
5.015 ± 0.15
0.546
± 0.06
Y2
Y1
0.82
CCW
±0.15
X1
Figure 42 - SMP-4 sensitive spot position
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18.5.4. SMP-4 - Angle Detection
~ 180 Deg.*
~ 0 Deg.*
~ 90 Deg.*
~ 270 Deg.*
N
~ 270 Deg.*
S
S
~ 90 Deg.*
N
S
~ 0 Deg.*
S
N
~ 180 Deg.*
N
Figure 43 - SMP-4 angle detection
18.6. Packages Thermal Performances
The table below describes the thermal behavior of available packages following JEDEC EIA/JESD 51.X
standard.
Package
Junction to case - θjc
Junction to ambient - Junction to ambient θja (JEDEC 1s2p board)
θja (JEDEC 1s0p board)
SOIC-8
38.8 K/W
112 K/W
153 K/W
TSSOP-16
27.6 K/W
99.1 K/W
137 K/W
DMP-4
32.2 K/W
-
88.7 K/W (21)
SMP-3
34.4 K/W
-
206 K/W (21)
SMP-4
20.8 K/W
-
140 K/W (21)
Table 55 - Standard packages thermal performances
21
PCB-less solutions have been evaluated in a typical application case. Values for these packages are given as informative.
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19. Contact
For the latest version of this document, go to our website at www.melexis.com/MLX90422.
For additional information, please get in touch, http://www.melexis.com/sales-contact.
20. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no
representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or liability
for any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. This
documentation is in fact provided without warranty, term, or condition of any kind, either implied or expressed, including bu t not limited to warranties of
merchantability, satisfactory quality, non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees and
agents will not be responsible for any loss, however arising, from the use of, or reliance on this document. Notwithsta nding the foregoing, contractual obligations
expressly undertaken in writing by Melexis prevail over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing orde rs or prior to
designing the product into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of reliability required and
determine whether it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require a prior authorization from
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