MLX91208LDC-CAV-000-RE 数据手册
MLX91208
IMC-Hall® Current Sensor
Datasheet
Features and Benefits
Description
IMC-Hall Technology
Very high sensitivity due to Integrated
Magnetic Concentrator (IMC-Hall®)
Programmable high speed current sensor IC
Wideband: DC to 250kHz
Short response time 3us
Programmable linear transfer characteristic
Selectable Analog ratiometric output
SOIC8 package RoHS compliant
Lead free component, suitable for lead free
soldering profile 260°C (target), MSL3
AEC-Q100 Automotive Qualified
The MLX91208 is a monolithic sensor IC featuring the IMCHall technology. Conventional planar Hall technology is
only sensitive to the flux density applied orthogonally to the
IC surface. The IMC-Hall current sensor is sensitive to the
flux density applied parallel to the IC surface. This is
obtained through an Integrated Magneto-Concentrator
(IMC-Hall) which is deposited on the CMOS die (as an
additional back-end step). The IMC-Hall technology is
automotive qualified.
The product is a single chip Hall sensor which provides an
output signal proportional to the flux density applied
horizontally and is therefore suitable for current
measurement. It is ideally suited as an open loop current
sensor for PCB or bus bar mounting. It features small size
application design and a simple construction for various
current ranges from few Amperes up to 1000 Amperes.
The transfer characteristic of the MLX91208 is
programmable in terms of offset, gain or temperature
compensation. The linear analog output is designed for
applications where a very fast response is required, such as
inverter applications.
Application Examples
Inverter HEV and EV
BLDC motor current monitoring
Smart fuse (over-current detection)
AC/DC Converters
DC/AC Converter (inverter)
DC/DC switched mode power supply
Figure 2: Block diagram
/D
Figure 1: Typical application of MLX91208
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Ordering Information
Product
Temperature
Package
Option Code
Packing Form
Sensitivity Range (typ.)
ML91208
L (-40°C to 150°C)
DC
CAL - 000
TU/RE
100-700mV/mT (250mV/mT)
ML91208
L (-40°C to 150°C)
DC
CAH - 000
TU/RE
50-350mV/mT (100mV/mT)
ML91208
L (-40°C to 150°C)
DC
CAV - 000
TU/RE
30-200mV/mT (40mV/mT)
ML91208
L (-40°C to 150°C)
DC
CAV - 001
TU/RE
30-200mV/mT (60mV/mT)
Table 1: Ordering Information
Legend:
Temperature Code:
Package Code:
Option Code:
Packing Form Code:
Ordering Example:
L
DC
xxL
xxH
xxV
- from -40°C to 150°C
- for SOIC-8 package
- Low field version
- High field version
- Very high field version
- for Reel
RE
TU
- for Tube
“MLX91208LDC-CAH-000-RE”
Table 2: Legend
Glossary of Terms
Terms
Definition
Tesla
Units for the magnetic flux density, 1 mT = 10 Gauss
TC
Temperature Coefficient in ppm/deg C
NC
Not Connected
ADC
Analog to Digital Converter
DAC
Digital to Analog Converter
LSB
Least Significant Bit
MSB
Most Significant Bit
DNL
Differential Non Linearity
INL
Integral Non Linearity
IMC
Integrated Magneto Concentrator (IMC-HALL)
PTC
Programming Through Connector
Table 3: Glossary of terms
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Contents
Features and Benefits ............................................................................................................................ 1
Application Examples............................................................................................................................. 1
Description ............................................................................................................................................ 1
Ordering Information ............................................................................................................................ 2
Glossary of Terms .................................................................................................................................. 2
Absolute Maximum Ratings ................................................................................................................... 5
Pin Definitions and Descriptions ............................................................................................................ 5
General Electrical Specifications ............................................................................................................ 6
Magnetic specification........................................................................................................................... 7
Low Field Version 10mT (option code xxL) ........................................................................................ 7
High Field Version 25mT (option code xxH) ...................................................................................... 7
Very High Field Version 60mT (option code xxV) .............................................................................. 8
Analog output specification ................................................................................................................. 8
Timing specification .......................................................................................................................... 8
Accuracy specification ...................................................................................................................... 9
Remarks to the achievable accuracy ............................................................................................... 9
Programmable items ......................................................................................................................... 10
Parameter table .............................................................................................................................. 10
Sensitivity programming (RG, FG) .................................................................................................. 10
Offset / output quiescent voltage programming (VOQ) ............................................................... 10
Output ratiometry (ENRATIO) ........................................................................................................ 11
Sensitivity temperature drift programming (TC1ST, TC2ND_COLD, TC2ND_HOT) ..................... 11
Offset temperature drift programming (OFFDR2C, OFFDR2H) .................................................... 11
Noise filter (NOISEFILT) .................................................................................................................. 11
Identification code (ID) ................................................................................................................... 11
Self-diagnostic ................................................................................................................................... 12
Application information ..................................................................................................................... 12
Recommended Application Diagrams ................................................................................................ 13
Resistor and capacitor values......................................................................................................... 13
Pull-down resistor for diagnostic low ............................................................................................ 13
Typical performance .......................................................................................................................... 14
Standard information regarding manufacturability of Melexis products with different soldering
processes ............................................................................................................................................ 15
ESD Precautions................................................................................................................................. 15
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Package information .......................................................................................................................... 16
SOIC-8 Package Dimensions ........................................................................................................... 16
SOIC-8 Pinout and Marking ............................................................................................................ 16
SOIC-8 Hall plate position ............................................................................................................... 17
SOIC-8 IMC Position and magnetic sensitive direction ................................................................. 17
Contact .............................................................................................................................................. 18
Disclaimer .......................................................................................................................................... 18
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Absolute Maximum Ratings
Parameters
Symbol
Value
Units
Vdd
+10
V
Reverse Supply Voltage Protection
-0.3
V
Positive Output Voltage
+10
V
±70
mA
Reverse Output Voltage
-0.3
V
Reverse Output Current
-50
mA
Positive Supply Voltage
(overvoltage)
Output Current
Iout
Package Thermal Resistance
(junction-to-ambient) ja is defined
according JEDEC 1s0p board
ja
174
°C/W
Operating Ambient Temperature
Range
TA
-40 to 150
°C
Storage Temperature Range
TS
-55 to 165
°C
±3
T
-55 to 155
°C
2
kV
Magnetic Flux Density
Maximum Junction Temperature
Tj,max
ESD (HBM)
Table 4: Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum
rated conditions for extended periods may affect device reliability.
Pin Definitions and Descriptions
Pin №
Name
Type
Function
5
VDD
Supply
Supply Voltage
3
GND
Ground
Supply Voltage
1
VDEC
Digital
Digital supply voltage
4
TEST/MUST
Digital
Test and Factory calibration
6
OUT
Analog
Current sensor output
2,7,8
NC
-
Not connected / unused
Table 5: PIN definitions and descriptions
It is recommended to connect the unused pins to the Ground for optimal EMC performance.
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General Electrical Specifications
Operating Parameters: TA = -40 to 125deg.C, Vdd = 4.5V to 5.5V, Iout = -2mA to +2 mA, recommended
application diagram in section 14, unless otherwise specified.
Parameter
Symbol
Nominal Supply Voltage
Vdd
Supply Current
Idd
Test Conditions
Min
Typ.
Max
Units
4.5
5
5.5
V
W/o output load
in application mode
TA = -40 to 150oC
9
12
14
mA
DC load Current
Iout
Rout in range [6kΩ, 100kΩ]
-2
2
mA
Maximum Output Current
(driving capability)
Imax
Inside this range, output voltage
reaches 3%VDD and 97%VDD
-2
2
mA
5
10
nF
Output Resistance
Vout = 50% Vdd, RL = 6kΩ
1
Output Capacitive Load
Cload
Output amplifier is optimized for
the capacitive load range.
1
Output resistive load
Rload
Output resistive load for high
linearity
6
Output Short Circuit Current
Ishort
Output shorted permanent to
Vdd.
Not
destroyed
Output shorted permanent to
GND.
Not
destroyed
Leakage current
Ileak
Linear Output Voltage Range
Vout in [10%Vdd, 90%Vdd]
High-impedance
levels(1)
mode Vout_HiZ_pd
Under-voltage detection (2)
Over-voltage detection(2)
Ratiometry enable detection
(2)
Vout_pd
kΩ
High impedance mode (1)
T=150°C
pull down ≥ 10 kΩ
10
pull-down RL ≤ 25 kΩ, T≤125°C
Vdd_uvd
Low to high voltage
Vdd_uvh
20
uA
90
%Vdd
5
%Vdd
3
3.3
4
V
Hysteresis
0.20
0.3
0.45
V
Vdd_ovd
Low to High voltage
6.5
7.6
V
Vdd_ovh
Hysteresis
0.05
0.7
V
Vratio_d
Low to High Voltage
4
4.50
V
Vratio_h
Hysteresis
0.01
0.5
V
Table 6: General electrical parameter
1
Refer to chapter Self-diagnostic, table 12
2
See graph below the table
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(2) According to the figure below:
Vout
Hysteresis
Detected Vdd
Voltage
Magnetic specification
Low Field Version 10mT (option code xxL)
Operating Parameters TA = -40 to 125deg.C, Vdd = 4.5 V to 5.5 V, unless otherwise specified.
Parameter
Symbol
Nominal Field Range
Bnom
Bop
Operational Field Range(3)
Linearity Error
Test Conditions
Min
Typ
Max
Units
-7.5
+7.5
mT
-10
+10
mT
NL
B in range Bop
Vout in [10%VDD, 90%VDD]
-0.7
+0.7
%FS
Hysteresis, remanent Field
Br
B = Bop
-15
+15
uT
Programmable Sensitivity
S
700
mV/mT
Sensitivity programming Resolution
100
Sres
250
0.1
%
Table 7: Magnetic specification for 10mT version (low-field version)
High Field Version 25mT (option code xxH)
Operating Parameters TA = -40 to 125deg.C, Vdd = 4.5 V to 5.5 V, unless otherwise specified.
Parameter
Nominal Field Range
Symbol Test Conditions
Min
Typ
Max
Units
Bnom
-20
+20
mT
Operational Field Range(3)
Bop
-25
+25
mT
Linearity Error
NL
B in range Bop
Vout in [10%VDD, 90%VDD]
-0.7
+0.7
%FS
Hysteresis, remanent Field
Br
B = Bop
-25
+25
uT
Programmable Sensitivity
S
350
mV/mT
Sensitivity programming Resolution
50
Sres
100
0.1
%
Table 8: Magnetic specification 25mT version (high-field version)
3
Outside Bop, the IMC progressively enters saturation, yielding to an increase of the linearity error.
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Very High Field Version 60mT (option code xxV)
Operating Parameters TA = -40 to 125deg.C, Vdd = 4.5 V to 5.5 V, unless otherwise specified.
Parameter
Symbol
Nominal Field Range
Operational Field Range
(3)
Test Conditions
Min
Typ
Max
Units
Bnom
-50
+50
mT
Bop
-60
+60
mT
Linearity Error
NL
B in range Bop
Vout in [10%VDD, 90%VDD]
-0.7
+0.7
%FS
Hysteresis, remanent Field
Br
B = Bop
-60
+60
uT
Programmable Sensitivity
S
CAV-000
CAV-001
30
30
200
200
mV/mT
mV/mT
Sensitivity programming Resolution
Sres
40
60
0.1
%
Table 9: Magnetic specification 60mT version (Very high-field version)
Note: The noise filter is disabled by default for all MLX91208 versions.
Analog output specification
Timing specification
Operating Parameters TA = -40 to 125deg.C, Vdd = 4.5 V to 5.5 V (unless otherwise specified)
Parameter
Refresh rate
Symbol
Trr
Step Response Time
Tresp
Bandwidth
Power on Delay
TPOD
Min
Typ
Max
Units
0.8
1
2
us
2
5
3
6
μs
μs
250
150
300
180
kHz
kHz
1
ms
Delay between the input
signal reaching 90% and the
output signal reaching 90%,
(2V step at the output, input
rise time = 1µs)
-Noise filter OFF
-Noise filter ON
-Noise filter OFF
-Noise filter ON
BW
Ratiometry Cut-off Frequency
Test Conditions
200
120
Vout =100% of FS
Pull-down resistor
≤100kOhm
During the Power-on delay,
the output will remain within
the 10% fault band at all
time.
Fratio
250
Hz
Table 10: Timing specification high speed analog output
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in, Vout
Response
time
100 % 90%
time
1 µs
Figure 3: Response time definition
Accuracy specification
Operating Parameters TA = -40 to 125deg.C, Vdd = 4.5 V to 5.5 V (unless otherwise specified)
Parameter
Thermal Offset Drift
Symbol
ΔTVoq
Test Conditions
Min
Offset drift referred to 25°C
S=40mV/mT (xxV version)
S=100mV/mT (xxH version)
S=250mV/mT (xxL version)
Typ
-10
Max
Units
+10
mV
+1.5
% of S
10
6
mVrms
mVrms
Vdd=5V, TC=0150 ppm/°C
Voq=500.2 %Vdd
Thermal Sensitivity Drift
RMS Output noise
Ratiometry Error Offset
Ratiometry Error Sensitivity
TC
Nrms
-1.5
S=40mV/mT (xxV version)
S=100mV/mT (xxH version)
S=250mV/mT (xxL version)
-Noise filter OFF
-Noise filter ON
0
ΔVoq
Voq = 50%Vdd
ΔVdd = 10%Vdd
-0.4
+0.4
% of
Voq
ΔS
ΔVdd = 10%Vdd
-0.4
+0.4
% of S
Table 11: Accuracy-Specific Parameters
Remarks to the achievable accuracy
The achievable target accuracy is dependent on user’s end-of-line calibration. The resolution for the offset
and offset drift calibration is better than 0.1%Vdd. Trimming capability is higher than the measurement
accuracy. End-user calibration can increase the accuracy of the system.
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Programmable items
Parameter table
Parameter
Bits
Factory Setting
Comment
VOQ[11:0]
12
trimmed
Quiescent output level (0 Gauss) adjustment
RG[2:0]
3
trimmed
Rough gain adjustment
FG[9:0]
10
trimmed
Fine gain adjustment
ENRATIO
1
1
TC1[7:0]
8
trimmed
Adjustment of the first order temperature compensation of the
magnetic sensitivity
TC2HOT[4:0]
5
trimmed
Adjustment of the extra temperature compensation of the magnetic
sensitivity at high temperature
TC2COLD[4:0]
5
trimmed
Adjustment of the extra temperature compensation of the magnetic
sensitivity at low temperature
OFFDR2C[5:0]
6
trimmed
Adjustment of the offset drift at low temperature after the VGA
OFFDR2H[5:0]
6
trimmed
Adjustment of the offset drift at high temperature after the VGA
NOISEFILT
1
0
Noise filter enablement
ID[47:0]
48
Programmed
Melexis traceability ID
Ratiometry enablement
Table 12: Customer programmable items
Sensitivity programming (RG, FG)
The sensitivity can be programmed from 50 to 350mV/mT (high field version) or 100 to 700mV/mT (low field
version), with the ROUGHGAIN (3 bits) and FINEGAIN (10 bits) parameters.
Offset / output quiescent voltage programming (VOQ)
The offset is programmable with 12 bits in 1.5 mV steps over the full output range. This corresponds to a
calibration resolution of 0.03 %VDD.
The typical step size would be 5V/4096 = 1.22 mV, but the actual step size can differ from the nominal value
because of internal gain tolerance. A maximum step size of 1.5 mV is guaranteed.
Note: for optimal performance over temperature, the VOQ should be programmed in the range from 2 to
3V.
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Output ratiometry (ENRATIO)
The ratiometry of the output versus the supply can be disabled by setting this bit to 0.
Note: for optimal performance over temperature, the ratiometry setting should not be changed on
customer side. By default, this setting is enabled during final test calibration.
Sensitivity temperature drift programming (TC1ST, TC2ND_COLD, TC2ND_HOT)
First order sensitivity temperature drift can be trimmed with TC1. The programming resolution is 40ppm/K.
Second order sensitivity temperature drift can be trimmed with TC2COLD and TC2HOT. The programming
resolution is 2ppm/K2 for TC2COLD and 0.6ppm/K2 for TC2HOT.The second order can also be seen as third
order correction since cold and hot sides are independently adjusted.
Note: for optimal performance over temperature, the first order sensitivity drift compensation (TC1ST)
should not exceed ±250ppm/K.
Offset temperature drift programming (OFFDR2C, OFFDR2H)
Offset temperature drift caused by the output amplifier can be compensated with these two parameters.
This first order correction is done independently for temperatures over and below 25°C.
Note: Two additional parameters (OFFDR1C, OFFDR1H) are calibrated by Melexis to compensate for the
offset temperature drift caused by the Hall element (before the variable gain amplifier). These parameters
should not be adjusted on customer-side.
Noise filter (NOISEFILT)
Setting this bit to 1 enables the noise filter, reducing noise and increasing response time.
Identification code (ID)
48 bits programmed identification code.
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Self-diagnostic
The MLX91208 provides self-diagnostic features to detect internal memory errors and over- / under-voltage.
Those features increase the robustness of the IC functionality, as they prevent the IC from providing
erroneous output signal in case of internal or external failure modes.
Error
Action
Effect on
Outputs
Remarks
Calibration Data CRC Error (at power up
and in normal working mode)
Fault mode
High
Impedance
mode
Pull down resistive load, Diagnostic
Low
High
Impedance
mode
1ms max in high impedance
followed by settling
Power On delay
Undervoltage Mode
IC is reset
High
Impedance
mode
300mV Hysteresis (typical)
Overvoltage detection
IC is reset
High
Impedance
mode
500mV Hysteresis (typical)
Table 13: Self diagnostic
Application information
Please refer to our current sensor reference design guide for more application information:
https://www.melexis.com/en/documents/documentation/application-notes/application-note-currentsensor-design-guide
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Recommended Application Diagrams
Resistor and capacitor values
Part
C1
Description
Supply capacitor, EMI, ESD
Value
Unit
100
nF
(4)
C2
Decoupling, EMI, ESD
2-10
nF
C3
Decoupling, EMI, ESD
47
nF
R1
Pull down resistor
6-100
kΩ
Table 14: Resistor and capacitor values
Pull-down resistor for diagnostic low
Figure 4: Diagnostic low/ Pull-down resistors
4
10nF is recommended for better EMC and ESD performance
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Typical performance
Figure 6: Thermal offset drift.
Figure 5: Thermal sensitivity drift.
Figure 7: Linearity error for all versions.
shunt
shunt
MLX91208
MLX91208
Figure 8: Response time with noise filter OFF.
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Figure 9: Response time with noise filter ON.
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Standard information regarding manufacturability of Melexis products
with different soldering processes
Melexis devices are qualified using state-of-the-art practices in accordance with automotive and
environmental requirements.
Through qualifications, various soldering techniques are considered; please refer to “Soldering
recommendations for Melexis products” for more information:
https://www.melexis.com/en/documents/documentation/application-notes/application-note-solderingrecommendations
For components normally soldered using Surface Mounted Device techniques (eg: Reflow process), Melexis
has defined and qualified Moisture Sensitivity Level and Peak Temperature in accordance with the Jedec JSTD-020 standard. Delivered material is conditioned accordingly. Moisture Sensitivity Level and Peak
Temperature information can be found on the label identifying the material.
In case you intend to use a reflow soldering process for through hole devices (Melexis’ package codes: SA,
UA, VA, VK, VM), please contact Melexis to verify your soldering process compatibility.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, Europe legislations (Direction on the
Restriction of the Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has deployed
Pb free leadfinish (typically Matte Tin) on all ASSP products.
For through hole devices (Melexis’ package codes: SA, UA, VA, VK, VM) Trim&Form, please refer to “Trim &
Form recommendations for Melexis products” for more information:
(http://www.melexis.com/Assets/Trim_and_form_recommendations_DownloadLink_5565.aspx)
ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
ESD HBM robustness is 2kV on external pins according to AEC-Q100-002 REV-D.
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Package information
SOIC-8 Package Dimensions
1.27 TYP
NOTES:
3.81
3.99**
4.80
4.98*
All dimensions are in millimeters (anlges in degrees).
* Dimension does not include mold flash, protrusions or
gate burrs (shall not exceed 0.15 per side).
** Dimension does not include interleads flash or protrusion
(shall not exceed 0.25 per side).
* * * Dimension does not includ e dam bar protrusion.
Allowable dambar protrusion shall be 0.08 mm total in
excess of the dimension at maximum material condition.
Dambar cannot be located on the lower radius of the foot.
5.84
6.20**
1.40
1.55
1.55
1.73
0.19
0.25
0°
8°
0.35
0.49***
0.127
0.250
0.41
0.89
Figure 10: SOIC-8 Package dimensions
SOIC-8 Pinout and Marking
Low
High
Very High
Field
Field
Field
Marking description:
1st line: 91208CA
2nd line: XXXXXX
3rd line: YY………
3rd line: …WW…
3rd line: …………EL
3rd line: …………EH
3rd line: …………VP
- product
- wafer LOT number
- assembly LOT year
- assembly LOT week
- low field version
- high field version
- very high field version
Figure 11: SOIC-8 Pinout and marking (Low Field, High Field and Very High Field version)
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SOIC-8 Hall plate position
Figure 12: SOIC-8 Hall Plate positioning
SOIC-8 IMC Position and magnetic sensitive direction
B extern
B extern
Figure 13: IMC position and geometry for low-field version
B extern
B extern
Figure 14: IMC position and geometry high-field version
B extern
B extern
Figure 15: IMC position and geometry very high-field version
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Contact
For the latest version of this document, go to our website at http://www.melexis.com/MLX91208.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa
Email : sales_europe@melexis.com
Americas
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only
and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility
or liability for any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole
responsibility. This documentation is in fact provided without warranty, term, or condition of any kind, either implied or expressed, including but not
limited to warranties of merchantability, satisfactory quality, non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates'
and their employees and agents will not be responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the
foregoing, contractual obligations expressly undertaken in writing by Melexis prevail over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing orders or prior to
designing the product into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of reliability required
and determine whether it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require a prior authorization
from competent authorities. The product is not designed, authorized or warranted to be suitable in applications requiring extended temperature range
and/or unusual environmental requirements. High reliability applications, such as medical life-support or life-sustaining equipment or avionics application
are specifically excluded by Melexis. The product may not be used for the following applications subject to export control regulations: the development,
production, processing, operation, maintenance, storage, recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be
used as a means of violence in an armed conflict or any similar violent situation.
No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.
If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably understood as being
confidential, the recipient of this document shall not communicate, nor disclose to any third party, any part of the document without Melexis’ express
written consent. The recipient shall take all necessary measures to apply and preserve the confidential character of the document. In particular, the recipient
shall (i) hold document in confidence with at least the same degree of care by which it maintains the confidentiality of its own proprietary and confidential
information, but no less than reasonable care; (ii) restrict the disclosure of the document solely to its employees, agents, professional advisors and
contractors for the purpose for which this document was received, on a strictly need to know basis and providing that such persons to whom the document is
disclosed are bound by confidentiality terms substantially similar to those in this disclaimer; (iii) use the document only in connection with the purpose for
which this document was received, and reproduce document only to the extent necessary for such purposes; (iv) not use the document for commercial
purposes or to the detriment of Melexis or its customers. The confidentiality obligations set forth in this disclaimer will have indefinite duration and in any
case they will be effective for no less than 10 years from the receipt of this document.
This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject to the exclusive
jurisdiction of the courts of Brussels, Belgium.
The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other provisions.
The previous versions of this document are repealed.
Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2022)
IATF 16949 and ISO 14001 Certified
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