MLX91210KDC-CAS-101-SP 数据手册
MLX91210 Integrated Current Sensor IC
Datasheet
Features and Benefits
Applications
Factory trimmed AC and DC current sensor
Household/Appliance Smart Metering
Analog ratiometric output voltage
Electric Motor Control
Combining sensing element, signal
conditioning & isolation in small footprint
and low profile SOIC package
Demand Response Load Control
Servers / Motherboard monitoring
Switched Mode Power Supplies
No application programming required
High speed sensing
DC to 100kHz bandwidth
5µs response time
Robust against external magnetic fields
No magnetic hysteresis
Low ohmic losses of integrated conductor
0.8mΩ SOIC-8 / 0.7mΩ SOIC-16
SOIC-8 narrow body and SOIC-16 wide
body package, RoHS compliant
Lead free component, suitable for lead
free soldering profile up to 260°C, MSL3
Rated voltage isolation
2.5kVRMS for SOIC-8
2.5kVRMS for SOIC-16
SOIC-8
SOIC-16
IEC60950-1:2005
IEC60950-1:2005
+ Am 1:2009 & 2:2013 + Am 1:2009 & 2:2013
UL1577
UL1577
Description
The MLX91210 is an Integrated Current Sensor
that senses the current flowing through the
leadframe of the SOIC package. The current
conductor exhibits low power dissipation (0.7 0.8mΩ). By virtue of fixing the current conductor
position with respect to the monolithic CMOS
sensor, a fully integrated Hall-effect current
sensor is obtained, that is factory calibrated.
Inside the package, the magnetic flux density
generated by the current flow is sensed
differentially by two sets of Hall plates. As a result
the influence of external disturbing fields
originating from the dense power electronics
surrounding the IC is minimized in the fast analog
front-end. The residual signal is amplified to
provide a high-speed linear analog output voltage.
The close proximity of the Hall plates to the
current conductor ensures a high signal-to-noise
ratio and an accurate signal over temperature.
With this miniaturization, high voltage isolation
ratings are still maintained between the primary
and their opposing secondary side leads of the
package.
MLX91210 Integrated Current Sensor IC
Datasheet
Contents
Features and Benefits................................................................................................................................ 1
Applications............................................................................................................................................... 1
Description ................................................................................................................................................ 1
Contents.................................................................................................................................................... 2
1. Ordering Information ............................................................................................................................ 3
2. Functional Diagram ............................................................................................................................... 4
3. Glossary of Terms .................................................................................................................................. 4
4. Pinout .................................................................................................................................................... 5
5. Absolute Maximum Ratings ................................................................................................................... 6
6. MLX91210 Electrical Specification ......................................................................................................... 7
7. MLX91210 Current Specification ........................................................................................................... 8
8. MLX91210 Voltage Isolation Specification ............................................................................................. 9
9. MLX91210 Timing Specification ........................................................................................................... 10
10. MLX91210 Accuracy Specification ..................................................................................................... 11
11. MLX91210 Self Diagnostic ................................................................................................................. 11
12. Recommended Application Diagrams ................................................................................................ 12
12.1. Resistor and Capacitor Values ........................................................................................................ 12
12.2. Pull-down Diagnostic ...................................................................................................................... 12
12.3. Pull-up Diagnostic ........................................................................................................................... 13
12.4. Optional RC filter ............................................................................................................................ 14
13. Standard information regarding manufacturability with different soldering processes ..................... 14
14. ESD Precautions................................................................................................................................. 16
15. Package Information.......................................................................................................................... 16
15.1. SOIC-8 - Package Dimensions ......................................................................................................... 16
15.2. SOIC-16 - Package Dimensions....................................................................................................... 17
16. Disclaimer .......................................................................................................................................... 18
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MLX91210 Integrated Current Sensor IC
Datasheet
1. Ordering Information
Product Code
Temperature Code
Package Code
Option Code
Packing Form Code
MLX91210
K
DC
CAS-101
RE
MLX91210
K
DC
CAS-102
RE
MLX91210
K
DC
CAS-103
RE
MLX91210
K
DC
CAS-104
RE
MLX91210
K
DC
CAS-105
RE
MLX91210
K
DC
CAS-106
RE
MLX91210
K
DF
CAS-101
RE
MLX91210
K
DF
CAS-102
RE
MLX91210
K
DF
CAS-103
RE
MLX91210
K
DF
CAS-104
RE
Legend:
Temperature Code:
K: from -40°C to 125°C
Package Code:
“DC” for SOIC-8 NB (Narrow Body) package
“DF” for SOIC-16 WB (Wide Body) package
Option Code:
CAS-xxx: die version
xxx-101: Bipolar current sensor // 0A at 50%Vdd // nominal 80mV/A or ±25A full scale
xxx-102: Bipolar current sensor // 0A at 50%Vdd // nominal 40mV/A or ±50A full scale
xxx-103: Bipolar current sensor // 0A at 50%Vdd // nominal 26.7mV/A or ±75A full scale
xxx-104: Bipolar current sensor // 0A at 50%Vdd // nominal 32mV/A or ±62.5A full scale
xxx-105: Bipolar current sensor // 0A at 50%Vdd // nominal 66.7mV/A or ±30A full scale
xxx-106: Bipolar current sensor // 0A at 50%Vdd // nominal 50mV/A or ±40A full scale
Packing Form:
“RE” for Reel
Ordering Example:
MLX91210KDC-CAS-101-RE
Table 1 – Legend
Melexis is continuously expanding its product portfolio by adding new option codes to better meet the
needs of our customer’s applications. This table is being updated frequently, please go to the Melexis
website to download the latest version of this datasheet. For custom transfer characteristics, please contact
your local Melexis Sales representative or distributor.
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MLX91210 Integrated Current Sensor IC
Datasheet
2. Functional Diagram
Figure 1 – Functional Diagram for MLX91210
3. Glossary of Terms
Gauss (G), Tesla (T)
Units for the magnetic flux density - 1 mT = 10 G
TC
Temperature Coefficient (in ppm/°C)
NC
Not Connected
IP
Integrated Primary
ASP
Analog Signal Processing
DSP
Digital Signal Processing
AC
Alternate Current
DC
Direct Current
RAM
Random Access Memory
EMC
Electro-Magnetic Compatibility
Table 2 – Glossary of Terms
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4. Pinout
PIN
SOIC-8
SOIC-16
Pin
Function
IP+
Primary Current
Path Input
IP-
Primary Current
Path Output
9
VSS
Ground Voltage
10
VSS
Ground Voltage
11
TEST
Digital Factory Test
12
OUT
Output Voltage
13
NC
Not connected
14
VDD
Supply Voltage
15
NC
Not connected
16
NC
Not connected
1
2
3
Pin
Function
IP+
Primary Current
Path Input
IP-
Primary Current
Path Output
5
VSS
Ground Voltage
6
TEST
Digital Factory Test
7
OUT
Output Voltage
8
VDD
Supply Voltage
4
For optimal EMC behavior, it is recommended to connect the unused pins (NC and TEST) to the Ground (see
section 12).
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5. Absolute Maximum Ratings
Parameter
Value
Positive Supply Voltage (overvoltage)
+ 10 V
Reverse Supply Voltage
- 0.3 V
Positive Output Voltage
+ 10 V
Positive Output Current
+ 70 mA
Reverse Output Voltage
- 0.3 V
Reverse Output Current
- 50 mA
Operating Ambient Temperature Range, TA
- 40°C to + 125°C
Storage Temperature Range, TS
- 55°C to + 165°C
Maximum Junction Temperature, TJ
+ 165°C
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
For more information on how the junction temperature relates to the applied current and ambient
temperature range, please refer to section 7.
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6. MLX91210 Electrical Specification
DC Operating Parameters at VDD = 5V (unless otherwise specified) and for T A as specified by the
Temperature suffix (K).
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
4.5
5
5.5
V
12
14
mA
Nominal Supply Voltage
VDD
Supply Current
IDD
Without RLOAD, in application
mode
7
DC Load Current
IOUT
RLOAD in range [6kΩ, 100kΩ]
-2
2
mA
Maximum Output Current
(driving capability)
IMAX
VOUT can cover 3%Vdd to
97%Vdd span
-2
2
mA
Output Resistance
ROUT
VOUT = 50%VDD, RLOAD = 10kΩ
1
5
Output Capacitive Load
CLOAD
Output amplifier stability is
optimized for this typical value
10
RLOAD_PU
RLOAD_PD
Output resistive load for high
linearity (pull-up or pull-down)
6
Output Short Circuit Current
ISHORT
Output shorted to VDD or VSS Permanent
35
Output Leakage current
ILEAK
High impedance mode(Error!
Bookmark not defined.)
, TA=150°C
0.5
Pull-down or pull-up ≥ 10 kΩ
10
VOUT_HIZ_PU
RLOAD_PU ≤ 25kΩ, TA ≤ 125°C
95
VOUT_HIZ_PD
RLOAD_PD ≤ 25kΩ, TA ≤ 125°C
Output Resistive Load
Output Voltage Linear Swing
High-impedance Mode Levels
Under-Voltage Detection
Over-Voltage Detection
Ratiometry Fault Detection
VOUT_LSW
k
1.5
180
mA
20
µA
90
%VDD
%VDD
5
%VDD
VDD_UVL
Detected Voltage (Low to High)
3.15
3.3
3.45
V
VDD_UVH
Hysteresis(2)
0.25
0.3
0.4
V
VDD_OVL
Low to High Voltage
6.7
7.6
V
VDD_OVH
Hysteresis(2)
0.05
0.7
V
VRATIO_L
Low to High Voltage
4
4.4
V
VRATIO_H
Low to High Voltage
0.05
0.5
V
(1) According to Table 3 of Section 11.
(2) According to the following diagram on the right :
Vout
Hysteresis
Detection
Voltage
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Vdd
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MLX91210 Integrated Current Sensor IC
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7. MLX91210 Current Specification
DC Operating Parameters at VDD = 5V (unless otherwise specified) and for T A as specified by the
Temperature suffix (K).
Parameter
Symbol
Electrical Resistance of the
Primary Current Path
RIP_SOIC8
Test Conditions
Min
Typ
Max
Units
0.8
TA=25°C
RIP_SOIC16
mΩ
0.7
Nominal Range
IPNOM
CAS-101
CAS-102
±10
±20
A
A
Measurement Range
IPMAX
CAS-101
CAS-102
±25
±50
A
A
NL
Current in range IPMAX, TA=25°C
±0.5
%FS
IPC85_SOIC8
IPC25_SOIC8
IPT25_SOIC8
Continuous, TA=-40 to 85°C
Continuous, TA=25°C
Transient, 1ms pulse, TA=25°C
IPC85_SOIC16
IPC25_SOIC16
IPT25_SOIC16
Continuous, TA=-40 to 85°C
Continuous, TA=25°C
Transient, 1ms pulse, TA=25°C
Linearity Error
Current Capability(3)
(see also Figure 2 & Figure 3)
±25
±35
A
A
A
±30
±40
A
A
A
±100
±100
Figure 2 – Typical junction temperature [°C] on SOIC8 vs applied current [A] and ambient temperature [°C].
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Figure 3 – Typical junction temperature [°C] on SOIC16 vs applied current [A] and ambient temperature [°C].
(3) Current capability has been assessed on a Melexis evaluation board with 2oz of Copper on 2 layers. Please contact your
local Melexis representative to get access to the MLX91210 application notes for PCB design and layout
recommendations. Although the linear measurement range is wider, the steady-state DC current or RMS current should
never exceed the specified current capability values for any option code.
8. MLX91210 Voltage Isolation Specification
Parameter
Symbol
Test Conditions
Rated Isolation Voltage(4)
IEC60950
VISO_SOIC8
IEC60950-1:2005
+ Am 1:2009 + Am 2:2013
Rated Isolation Voltage(4)
UL1577
Working Voltage for Basic
Isolation IEC60950
VISO_SOIC16
VISO2_SOIC8
VISO2_SOIC16
VWFSI_SOIC8
VWFSI_SOIC16
UL1577(5)
IEC60950-1:2005
+ Am 1:2009 + Am 2:2013
Rating
2100
2500
2500
2500
354
390
Units
VAC
VAC
VDC or
VPEAK
(4) Measured between IP (pin 1-4 on SOIC8, pin 1-8 on SOIC16) and Secondary side (pin 5-8 on SOIC8, pin 9-16 on SOIC16).
(5) Melexis performs routine production-line tests with a test potential of 120% of the rated isolation voltage for 1s,
according to UL1577 requirements, for all SOIC8 & SOIC16 devices produced.
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9. MLX91210 Timing Specification
DC Operating Parameters at V DD = 5V (unless otherwise specified) and for T A as specified by the
Temperature suffix (K).
Parameter
Symbol
Test Conditions
Refresh rate
TRR
Step Response Time
TRESP
Delay between the input signal
reaching 90% and the output
reaching 90% (see Figure 4)
Bandwidth
BW
Min -3dB, TA =25°C
Power on Delay(6)
TPOD
VOUT =100% of FS,
RLOAD_PD ≤ 100kΩ
Ratiometry Cut-off Frequency
FRATIO
Min
Typ
Max
Units
0.8
1
2
μs
5
6
μs
100
kHz
1
250
ms
Hz
in, Vout
100%
Response
time
90%
time
1 µs
Figure 4 – Response Time definition
(6) During the Power-on delay, the output will remain within the 10% fault band at all time.
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10. MLX91210 Accuracy Specification
DC Operating Parameters at V DD = 5V (unless otherwise specified) and for T A as specified by the
Temperature suffix (K).
Parameter
Voltage Output Quiescent(8)
Thermal Offset Drift
Symbol
VOQ
ΔTVOQ
Test Conditions
Min
Typ
Max
Units
No current flowing through IP
TA=25°C
49.8
50
50.2
%VDD
±0.06
±0.12
±0.19
±0.15
±0.07
±0.1
±0.12
±0.25
±0.38
±0.31
±0.15
±0.2
A
A
A
A
A
A
80
40
26.7
32
66
50
81.2
40.6
27.1
32.5
67
50.8
mV/A
mV/A
mV/A
mV/A
mV/A
mV/A
±1
±1.5
%S
Referred to TA=25°C, IP = 0A
Option Code : CAS-101
Option Code : CAS-102
Option Code : CAS-103
Option Code : CAS-104
Option Code : CAS-105
Option Code : CAS-106
Sensitivity
S
At TA=25°C
Option Code : CAS-101
Option Code : CAS-102
Option Code : CAS-103
Option Code : CAS-104
Option Code : CAS-105
Option Code : CAS-106
Thermal Sensitivity Drift
TC
Current range IPNOM
78.8
39.4
26.3
31.5
65
49.3
RMS Output Noise(8)
NRMS
BW = 100kHz
Ratiometry Error Offset
ΔVOQ
VOQ = 50%Vdd
ΔVDD = ±10%VDD
±0.4
%VOQ
ΔS
ΔVDD = ±10%VDD
±0.4
% of S
Ratiometry Error Sensitivity
0.15
ARMS
(7) Voltage Output Quiescent level can be impacted by the position of the output capacitance’s proximity to the sensor ,
yielding up to 5mV of difference versus specification.
(8) Further output filtering possible, see section 12.4.
11. MLX91210 Self Diagnostic
The sensor provides self-diagnostic features to detect internal memory errors and under-voltage. These
features increase the robustness of the IC functionality as they prevent erroneous output signal in case of
internal or external failure modes. This detection is guaranteed provided the measured signal does not
exceed the Measurement Range IP MAX as described in Section 7 or this excessive current is interpreted as a
diagnostic as well.
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Fault Mode
Action
Effect on Outputs
Calibration Data CRC Error
Fault mode
Power On Delay
Remark
High Impedance mode
At power up and during
normal operation
High Impedance mode
1ms in high impedance
followed by settling
Undervoltage Mode
IC is reset
High Impedance mode
300mV hysteresis (typical)
Overvoltage Detection
IC is reset
High Impedance mode
100mV hysteresis (typical)
Table 3 – Self Diagnostic Functionality
12. Recommended Application Diagrams
12.1. Resistor and Capacitor Values
Part
Description
Value
Unit
C1
Supply capacitor, EMI, ESD
100
nF
C2
Decoupling, EMI, ESD
10
nF
R1
Pull up or pull down resistor
6-100
kΩ
Table 4 – Resistor and Capacitor Values for Recommended Application Diagrams
12.2. Pull-down Diagnostic
Figure 5 – Recommended wiring for the MLX91210 with pull-down diagnostic in SOIC-8 package
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Figure 6 – Recommended wiring for the MLX91210 with pull-down diagnostic in SOIC-16 package
12.3. Pull-up Diagnostic
Figure 7 – Recommended wiring for the MLX91210 with pull-up diagnostic in SOIC-8 package
Figure 8 – Recommended wiring for the MLX91210 with pull-up diagnostic in SOIC-16 package
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12.4. Optional RC filter
Figure 9 – Recommended Application Diagram with RC filter in SOIC-8 package
Figure 10 – Recommended Application Diagram with RC filter in SOIC-16 package
R [Ω]
C [nF]
Bandwidth [kHz]
Noise [ARMS]
n.a.
n.a.
100
0.15
100
150
10
0.05
1000
150
1
0.02
Table 5 – Additional Filtering Information
13. Standard information regarding manufacturability
with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
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Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles
according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s
(Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through
Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after co nsulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis recommends reviewing on our web site the General Guidelines soldering recommendation
(https://www.melexis.com/en/quality-environment/soldering).
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website
(https://www.melexis.com/en/quality-environment).
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14. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling
semiconductor products.
Parameter
Symbol
Test Method
Value
Unit
Human Body ESD
Protection
ESDHBM
AEC-Q100-002 Rev D
2
kV
Charged Device Model
ESD Protection
ESDCDM
AEC-Q100-011 Rev B
500
V
Table 6 – Electrostatic Discharge Ratings
15. Package Information
15.1. SOIC-8 - Package Dimensions
Figure 11 – SOIC8 Package Dimensions [inches]
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15.2. SOIC-16 - Package Dimensions
Figure 12 – SOIC16 Package Dimensions [inches]
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16. Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of
Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth
herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to
change specifications and prices at any time and without notice. Therefore, prior to designing this product into a
system, it is necessary to check with Melexis for current information. This product is intended for use in normal
commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not
recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable
recipient or any third party for any damages, including but not limited to personal injury, property damage, loss
profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind,
connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation
liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services.
to
of
in
or
© 2016 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: sales_europe@melexis.com
Americas:
Phone: +1 603 223 2362
E-mail: sales_usa@melexis.com
ISO/TS 16949 and ISO14001 Certified
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