MLX91218LDC-AFV-200-SP

MLX91218 High Speed Current Sensor IC with OCD Datasheet 1. Features and Benefits 3. ▪ IMC-Hall® Technology ▪ Very High Field and Extra High Field variants ▪ End-of-line programmable sensor ▪ Flexible Supply Voltage with factory selectable 5V or 3.3V mode Selectable analog output: Ratiometric or fixed (Vref) The MLX91218 is a monolithic Hall-effect sensor utilizing the IMC-Hall® technology. The sensor provides an analog output voltage proportional to the applied magnetic flux density parallel to the IC surface. ▪ The transfer characteristic of the MLX91218 is factory trimmed over temperature, and is programmable (offset, sensitivity, filtering, internal overcurrent threshold) during end-of-line customer calibration. With the 400kHz bandwidth and fast response time, it is particularly adapted for high speed applications such as inverters and converters where fast response time due to fast switching is required. ▪ Measurement range from ±8 to ±333mT ▪ Wideband sensing: DC to 400kHz ▪ Very short response time (2µs) ▪ High linearity down to ±0.5% full scale ▪ AEC-Q100 – Grade 0 Automotive Qualified ▪ Very low thermal drift for wide temperature range ▪ ▪ Offset drift (200 kΩ R4 or R4_BIS External OCD Resistor custom - R5 Pull-down resistance >10 kΩ Table 19: Resistor and capacitor values 14.1. Resistance on reference voltage pin The resistance connected to the reference pin should be large enough to limit the current. Figure 10 shows an example of the case when the resistance on the reference pin is too low. The measured V REF will be equal 𝑅 𝑉 to 𝑉𝑅𝐸𝐹 = 𝑉𝑅𝐸𝐹 𝐼𝑁𝑇 × 𝑅 𝐸𝑋𝑇 = 1.25𝑉. Therefore, the current I REF will be equal to 𝐼𝑅𝐸𝐹 = 𝑅𝑅𝐸𝐹 = 6.25𝑚𝐴. +𝑅 𝐸𝑋𝑇 𝑅𝐸𝐹 𝐸𝑋𝑇 The maximum source current on the reference pin is 0.6mA (typical value). Therefore, the current flowing will be 0.6mA, and the measured V REF will be 𝑉𝑅𝐸𝐹 = 0.6𝑚𝐴 × 200Ω = 0.12𝑉. To conclude, to measure the correct reference voltage, it is important to have the resistance on the reference pin larger than the internal resistance, normally larger than 200kΩ. Revision 003 – 2 March 2023 Document 3901091218 Page 21 of 28 MLX91218 High Speed High Accuracy IMC-Hall® Current Sensor IC with OCD Datasheet Figure 10: Case when the external resistance on reference pin is low. Revision 003 – 2 March 2023 Document 3901091218 Page 22 of 28 MLX91218 High Speed High Accuracy IMC-Hall® Current Sensor IC with OCD Datasheet 15. Standard Information Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. Soldering of SMDs (Surface Mount Devices) For Surface Mounted Devices (SMD, as defined according to JEDEC norms), the only applicable soldering method is reflow. For more information, read the application note Soldering for Surface Mount Technology (SMT) at the link https://media.melexis.com/-/media/files/documents/application-notes/handling-andassembly/guidelines-surface-mount-technology-smt-soldering-application-note-melexis.pdf. Lead pre-forming of THDs (Surface Mount Devices) THD lead pre-forming (cutting and/or bending) is applicable under strict compliance with Melexis Guidelines for lead forming of SIP Hall Sensors. For more information, read the application note Lead forming of Hall sensors in SIP packages at the link https://www.melexis.com/en/tech-info/ic-handling-and-assembly/leadforming. Soldering of THDs (Surface Mount Devices) For Through Hole Devices (THD), the applicable soldering methods are reflow, wave, selective wave and robot point-to-point. For more information, read the application note Soldering of Through Hole Devices (THD) at the link https://media.melexis.com/-/media/files/documents/application-notes/handling-andassembly/guidelines-through-hole-device-thd-soldering-application-note-melexis.pdf?ts=20211210t1158483507. Soldering on PCB Melexis products soldering on PCB should be conducted according to the requirements of IPC/JEDEC and J STD-001. Solder quality acceptance should follow the requirements of IPC-A-610. Environmental information Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website (https://www.melexis.com/en/quality-environment). Revision 003 – 2 March 2023 Document 3901091218 Page 23 of 28 MLX91218 High Speed High Accuracy IMC-Hall® Current Sensor IC with OCD Datasheet 16. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 17. Packaging information 1.27 TYP NOTES: 3.81 5.80 3.99** 6.20 4.80 4.98* All dimensions are in millimeters (angles in degrees). * Dimension does not include mold flash, protrusions or gate burrs (shall not exceed 0.15 per side). ** Dimension does not include interleads flash or protrusion (shall not exceed 0.25 per side). *** Dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. 1.37 1.57 1.52 1.72 0.36 0.46*** 0.19 0.25 0.100 0.250 0° 8° 0.41 1.27 Figure 11: SOIC8 - Package Information Revision 003 – 2 March 2023 Document 3901091218 Page 24 of 28 MLX91218 High Speed High Accuracy IMC-Hall® Current Sensor IC with OCD Datasheet 17.1. SOIC-8 Pinout and Marking 91218AA XXXXXXX YYWWEV Marking description: 1st line: 91218AA - product and product revision 2nd line: XXXXXXX - wafer LOT number 3rd line: YY……… - assembly LOT year 3rd line: …WW…… - assembly LOT week 3rd line: …………EV - very high field version 3rd line: …………EX - extra high field version VDD GND OUT VDD GND OUT VREF 1 91218AA XXXXXXX YYWWEX 1 VREF NC 5 OCD_EXT (MUST 1) OCD_INT VOC_EXT (MUST 0) NC Extra High Field Version 5 OCD_EXT (MUST 1) OCD_INT VOC_EXT (MUST 0) Very High Field Version Figure 12: SOIC8 - Pinout and marking 17.2. Hall plate position 0.46 +/- 0.06 1.85 2.15 2.35 2.55 Figure 13: Hall plate position Revision 003 – 2 March 2023 Document 3901091218 Page 25 of 28 MLX91218 High Speed High Accuracy IMC-Hall® Current Sensor IC with OCD Datasheet 17.3. IMC Position and sensor active measurement direction IMC size not at scale, for representation only Figure 14: IMC position and geometry very high-field version B extern B extern Figure 15: IMC position and geometry extra high-field version Revision 003 – 2 March 2023 Document 3901091218 Page 26 of 28 MLX91218 High Speed High Accuracy IMC-Hall® Current Sensor IC with OCD Datasheet 18. Contact For additional information, please contact our Direct Sales team and get help for your specific needs: Europe, Africa Email : sales_europe@melexis.com Americas Email : sales_usa@melexis.com Asia Email : sales_asia@melexis.com Revision 003 – 2 March 2023 Document 3901091218 Page 27 of 28 MLX91218 High Speed High Accuracy IMC-Hall® Current Sensor IC with OCD Datasheet 19. Disclaimer The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. 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