MLX92251LSE-ABA-000-RE 数据手册
MLX92251LSE-AxA
Dual Hall Effect Latch with Speed & Direction Detection
Features and Benefits
Applications
Operating Voltage from 2.7V to 24V
Two Integrated Hall plates for Direction
Detection
Latching Magnetic Characteristics
Speed & Direction Open-Drain Outputs
Direction Output updated prior Speed
Output
Excellent Temperature Stability
Reverse Supply Voltage Protection
Output Current Limitation and Auto-Shutoff
Under-Voltage Lockout Protection
Windows lifter with Anti-Pinch feature
Rotation speed & direction detection
Linear speed & direction detection
Angular position detection
Power closures with Anti-Pinch features
Ordering information
Part No.
MLX92251LSE-AAA-000-RE
MLX92251LSE-ABA-000-RE
Temperature Code
L (-40°C to 150°C)
L (-40°C to 150°C)
Sensitivity
± 7.5 mT
± 2.5 mT
Package Code
SE (TSOT-5L)
SE (TSOT-5L)
Packing Form
RE (Tape & Reel)
RE (Tape & Reel)
Legend:
Temperature Code:
Package Code:
Packing Form:
Ordering example:
L for Temperature Range -40°C to 150°C
SE for TSOT,
RE for Reel
MLX92251LSE-AAA-000-RE
1. Functional Diagram
spacing of 1.45mm between the sensing elements. The
first Hall plate signal is used to provide the speed signal
output. The combination of both the first and second Hall
plate signals is then internally processed to directly deliver
a direction signal output.
VDD
Switched
Hall
Plate
Switched
Hall
Plate
Voltage Regulator
with Reverse Polarity
Protection
CDS
Amplifier
Open-Drain
Output
CDS
Amplifier
Direction
Detection
Open-Drain
Output
SP
DIR
Timing
Logic
Reference
GND
2. General Description
The Melexis MLX92251 is a second generation Hall-effect
dual latch designed in mixed signal CMOS technology. The
device integrates a voltage regulator, two Hall sensors with
advanced offset cancellation system and two open-drain
output drivers, all in a single package.
The MLX92251 shares the MLX922xx-based platform,
synonym of high performance in terms of electrical
specification, magnetic specification and protection level.
With latching magnetic characteristics, the speed (SP)
output is turned low or high respectively with a sufficiently
strong South or North pole facing the package top side.
When removing the magnetic field, the device keeps its
previous state.
The direction (DIR) output is latched in Low or High state
depending on the movement direction of the applied
magnetic field, as a result of certain magnetic pulse
sequence on both Hall sensors.
The MLX92251 is delivered in a Green compliant 5-pin Thin
Small Outline Transistor (TSOT) for surface-mount process.
Two Hall plates are integrated on the same piece of silicon,
thus using the high precision of the wafer fabrication
process to ensure a fixed
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Contents
1. Functional Diagram ................................................................................................................................ 1
2. General Description ............................................................................................................................... 1
3. Glossary of Terms................................................................................................................................... 3
4. Absolute Maximum Ratings.................................................................................................................... 3
5. General Electrical Specifications............................................................................................................. 4
6. Magnetic Specifications ......................................................................................................................... 5
6.1. MLX92251LSE-AAA-000 ..................................................................................................................... 5
6.2. MLX92251LSE-ABA-000...................................................................................................................... 5
7. Output Behaviour versus Magnetic Pole ................................................................................................ 6
8. Application Information ......................................................................................................................... 7
8.1. Default Application Schematic ........................................................................................................... 7
8.2. Recommended Application Schematic for ISO7637-2 (pulses 5a and 5b) ..................................... 7
8.3. Speed (SP) Output Behavior vs. BOP/BRP ......................................................................................... 7
8.4. Output Jitter, Speed Signal Delay and Direction Detection ............................................................. 8
8.5. UV lockout and POR behaviour.......................................................................................................... 8
9. Performance Graphs .............................................................................................................................. 9
9.1. Magnetic parameters vs. TA ............................................................................................................... 9
9.2. Magnetic parameters vs. VDD ............................................................................................................. 9
9.3. VDSON vs. TA .......................................................................................................................................... 9
9.4. VDSON vs. VDD ........................................................................................................................................ 9
9.5. IDD vs. TA............................................................................................................................................... 9
9.6. IDD vs. VDD ............................................................................................................................................ 9
9.7. ILEAK vs. TA .......................................................................................................................................... 10
9.8. ILEAK vs. VDD ........................................................................................................................................ 10
9.9. Power Derating vs. TA ....................................................................................................................... 10
10. Standard information regarding manufacturability of Melexis products with different soldering
processes ............................................................................................................................................ 11
11. ESD Precautions ................................................................................................................................. 11
12. SE Package Information...................................................................................................................... 12
12.1. Pin Definitions and Descriptions .................................................................................................... 12
13. Contact .............................................................................................................................................. 13
14. Disclaimer .......................................................................................................................................... 13
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3. Glossary of Terms
MilliTesla (mT), Gauss
RoHS
TSOT
Units of magnetic flux density: 1mT = 10 Gauss
Restriction of Hazardous Substances
Thin Small Outline Transistor (TSOT package) – also referred with the Melexis package code
“SE”
Electro-Static Discharge
code “SE”
ESD
4. Absolute Maximum Ratings
Parameter
Symbol
Value
Units
Supply Voltage
VDD
+27
V
Supply Current
IDD
+20
mA
Reverse Supply Voltage
VDDREV
-27
V
Reverse Supply Current
IDDREV
-20
mA
Output Voltage
VOUT
+27
V
Output Current
IOUT
+20
mA
Reverse Output Voltage
VOUTREV
-0.5
V
Reverse Output Current
IOUTREV
-50
mA
Operating Temperature Range
TA
-40 to +150
C
Storage Temperature Range
TS
-55 to +165
C
Maximum Junction Temperature
TJ
+165
C
-
2500
V
-
1000
V
B
Unlimited
mT
ESD Sensitivity – HBM
(1)
ESD Sensitivity – CDM
(2)
Magnetic Flux Density
Table 1. Absolute maximum ratings
Exceeding the absolute maximum ratings may cause permanent damage.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
1
__________________
Human Body Model according AEC-Q100-002 standard.
2
Charged Device Model according AEC-Q100-011 standard.
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5. General Electrical Specifications
DC Operating Parameters TA = -40°C to 150°C, VDD = 2.7V to 24V (unless otherwise specified)
Parameter
Symbol Test Conditions
Min
Supply Voltage
VDD
Operating
2.7
Supply Current
IDD
VDD = 12V
3
Reverse Supply Current
IDDREV
VDD = -18V
Output Leakage Current
IOFF
VOUT = 12V, VDD = 12V, B < BRP
Output Saturation Voltage
VOUTS
B > BOP, IOUT = 10mA
(4)
VDD = 12V, VPU = 5V,
(2,3)
Output Rise/Fall Time
tR / tF
0.1
RPU = 1kΩ, CL = 50pF
Output Current Limit
ICL
B > BOP, VOUT = 12V
14
Output ON Time under Current
tCLON
150
(5)
Limit conditions
B > BOP, VPU = 12V, RPU = 100Ω
Output OFF Time under Current
tCLOFF
(5)
Limit conditions
B > BOP, VPU = 12V, RPU = 100Ω
Chopping Frequency
fCHOP
(2,6)
Speed Signal Delay
0.4
tSPD
Output Refresh Period
tPER
3.2
Over 1000 successive output
switching
tJITTER
(2)
Output Jitter (p-p value)
events @1kHz square wave, BPEAK=
50mT, tRISE=tFALL ≤100μs
≥30mT square wave magnetic
(2,7)
Maximum Switching Frequency
40
fSW
field
(8)
Power-On Time
tPON
VDD= 5V, dVDD/dt > 2V/µs
Under-voltage Lockout Threshold
VUVL
2.2
(2)
Under-voltage Lockout Reaction time
tUVL
SE Package Thermal Resistance
RTH
Single layer (1S) JEDEC board
(1)
0.1
0.2
Max
24
7
1
10
0.5
Units
V
mA
mA
µA
V
0.3
1
µs
25
44
mA
Typ
4.5
230
µs
3.5
ms
400
0.85
5
kHz
µs
µs
1.6
8.4
±2.6
µs
66
kHz
16
2.4
1
300
35
2.7
μs
V
µs
°C/W
Table 2: electrical specifications
1 Typical values are defined at T A = +25°C and V DD = 12V
2
3
4
5
Based on device characterization results, not subject to production test
Measured between 0.1*V PU and 0.9*V PU
RPU and V PU are respectively the external pull-up resistor and pull-up power supply
If the Output is in Current Limitation longer than t CLON the Output is switched off in high-impedance state. The Output returns back in
active state at next reaching of B OP or after t CLOFF time interval
6 Controlled delay between direction (DIR) signal update and speed (SP) signal update
7 Maximum switching frequency corresponds to the maximum frequency of the applied magnetic field which is detected without loss of
pulses
8 The Power-On Time represents the time from reaching V DD = 2.7V to the first refresh of the SP output
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6. Magnetic Specifications
6.1. MLX92251LSE-AAA-000
DC Operating Parameters VDD = 2.7V to 24V and TA =-40°C to 150°C (unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Operating Point
BOP
5
7.5
10
mT
Release Point
BRP
-10
-7.5
-5
mT
Magnetic Matching
BMATCH
BOP1 – BOP2 or BRP1 – BRP2, TA = 25°C
-2
2
mT
BOP1 – BOP2 or BRP1 – BRP2
-3
3
mT
(BOP1 + BRP1) / 2, (BOP2 + BRP2) / 2
-2
2
mT
Magnetic Offset
BOFF
Temperature Coefficient
TC
0
ppm/°C
-
1.45
mm
Hall Plates Spacing
Table 3: Magnetic specifications
6.2. MLX92251LSE-ABA-000
DC Operating Parameters VDD = 2.7V to 24V and TA =-40°C to 150°C (unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Operating Point
BOP
0.6
2.5
4.5
mT
Release Point
BRP
-4.5
-2.5
-0.6
mT
Magnetic Matching
BMATCH
BOP1 – BOP2 or BRP1 – BRP2, TA = 25°C
-2
2
mT
BOP1 – BOP2 or BRP1 – BRP2
-3
3
mT
(BOP1 + BRP1) / 2, (BOP2 + BRP2) / 2
-2
2
mT
Magnetic Offset
BOFF
Temperature Coefficient
TC
-1100
ppm/°C
-
1.45
mm
Hall Plates Spacing
Table 3: Magnetic specifications
Note: Temperature coefficient value is guaranteed by design and verified by characterization and is calculated using the
following formula:
TC
BT 2 BT 1
* 106 , ppm / o C; T1 40o C; T2 150o C
B25o C T2 T1
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Dual Hall Effect Latch with Speed & Direction
7. Output Behavior versus Magnetic Pole
DC Operating Parameters T A = -40°C to 150°C, VDD = 2.7V to 24V (unless otherwise specified)
Parameter
Test Conditions
SP Output State
South pole
B > BOP
Low
(1)
North pole
B < BRP
High
Table 4: Output behavior versus magnetic pole
Direction
CCW
Direction
CW
(2)
Step
nx
n(x + 1)
n(x + 2)
n(x + 3)
n(x + 4) nx
H1
N
N
S
S
N
H2
S
N
N
S
S
DIR Output State
Step
nx
n(x + 1)
n(x + 2)
n(x + 3)
n(x + 4) nx
H1
N
S
S
N
N
H2
S
S
N
N
S
DIR Output State
Low
3
High
2
1
(3)
4
5
1
Default SP output state during power-up
Magnetic pole applied perpendicularly to Hall plate “H1”, facing the branded/top side of the package
3
Default magnetic and DIR output state during power-up
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8. Application Information
8.1. Default Application Schematic
VDD
VDD
RPU1
RPU2
10k
10k
C1
SP
VoutSP
10nF
DIR
VoutDIR
GND
MLX92251
8.2. Recommended Application Schematic for ISO7637-2 (pulses 5a and 5b)
Notes:
D1
R1
200Ohm
see note 1
VDD
VDD
Z1
see note 2
C1
10nF
GND
RPU1
RPU2
10k
10k
SP
VoutSP
DIR
VoutDIR
MLX92251
1. Recommended for conducted transients on supply line above 32V with duration above 500ms.
2. Recommended for conducted transients on supply line above 36V.
3. Recommended zener diode Z1 is BZX55C27 or equivalent.
8.3. Speed (SP) Output Behavior vs. BOP/BRP
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8.4. Output Jitter, Speed Signal Delay and Direction Detection
8.5. UV lockout and POR behaviour
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9. Performance Graphs
9.1. Magnetic parameters vs. TA
Brp- MLX92251LSE-ABA
Bop- MLX92251LSE-AAA
Brp- MLX92251LSE-AAA
Bop- MLX92251LSE-ABA
Brp- MLX92251LSE-ABA
Bop- MLX92251LSE-AAA
Brp- MLX92251LSE-AAA
Magnetic Field (mT)
Magnetic Field (mT)
Bop- MLX92251LSE-ABA
9.2. Magnetic parameters vs. VDD
Temp (DegC)
9.3. VDSON vs. TA
9.4. VDSON vs. VDD
9.5. IDD vs. TA
9.6. IDD vs. VDD
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9.7. ILEAK vs. TA
9.8. ILEAK vs. VDD
9.9. Power Derating vs. TA
TA(ᵒc)
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10. Standard information regarding manufacturability of Melexis products
with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with
Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive
strength between device and board.
Melexis recommends reviewing on our web site the General Guidelines soldering recommendation
(http://www.melexis.com/Quality_soldering.aspx) as well as trim&form recommendations
(http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx).
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on
qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous
Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx
11. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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12. SE Package Information
C
L
e1
E
E1
51X
1
b
a
Notes:
1.Dimension “D” and “E1” do not include mold flash
or protrusions. Mold flash or protrusion shall not
exceed 0.15mm on “D” and 0.25mm on “E” per
side.
3. This part is compliant with JEDEC specification
MO-193.
This part is full compliance to EIAJ specification
SC-74.
A1
A
A2
2. Dimension “b” does not include dambar
protrusion.
e
Marking:
Top Side:
D
●51A – MLX92251LSE-AAA-000
●51C – MLX92251LSE-ABA-000
Bottom Side: xyww
x = last digit of lot number
y = last digit of year
ww = week
Hall plate location
F
1
I
H
G
END VIEW
N
TOP VIEW
This table in mm
A
A1
A2
D
E
E1
L
b
c
e
e1
F
G
H
I
α
min
max
0.85
0.90
2.80
3.00
2.60
3.00
1.50
1.70
0.30
0.50
0.30
0.45
0.10
0.20
0.95
BSC
1.90
BSC
1.45
1.45
0.525
0.925
0.6
1
0.562
0.622
0°
8°
–
1.00
0.025
0.10
12.1. Pin Definitions and Descriptions
SE Pin №
1
2,3
4
5
Name
VDD
GND
SP
DIR
Type
Supply
Ground
Output
Output
Function
Power Supply
Ground pin
Speed Open-Drain Output
Direction Open-Drain Output
4
5
3
2
1
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13. Contact
For the latest version of this document, go to our website at www.melexis.com.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa
Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas
Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia
Email : sales_asia@melexis.com
14. Disclaimer
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the
furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and al l liability, including without limitation, special,
consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, noninfringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to
designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current.
Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a
particular purpose.
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the In formation does not grant, explicitly or implicitly, to
any party any patent rights, licenses, or any other intellectual property rights.
This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities.
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s ) are not designed, authorized or warranted to be
suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or lifesustaining equipment are specifically not recommended by Melexis.
The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,
recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance o r storage of missiles for such weapons: 2) civil
firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone
or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any
similar violent situation.
The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-andconditions.
This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)
ISO/TS 16949 and ISO14001 Certified
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