24AA01T

24AA01/24LC01B 1K I2C™ Serial EEPROM Device Selection Table Part Number 24AA01 24LC01B Note 1: VCC Range 1.7-5.5 2.5-5.5 Max. Clock Frequency 400 kHz(1) 400 kHz Temp. Ranges I I, E Description: The Microchip Technology Inc. 24AA01/24LC01B (24XX01*) is a 1 Kbit Electrically Erasable PROM. The device is organized as one block of 128 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7V with standby and active currents of only 1 μA and 1 mA, respectively. The 24XX01 also has a page write capability for up to 8 bytes of data. The 24XX01 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN, 2x3 TDFN and MSOP packages, and is also available in the 5-lead SOT-23 and SC-70 packages. 100 kHz for VCC 4,000V • More than 1 Million Erase/Write Cycles • Data Retention >200 Years • Factory Programmable Available • Packages include 8-lead PDIP, SOIC, TSSOP, DFN, TDFN, MSOP, 5-lead SOT-23 and SC-70 • Pb-free and RoHS Compliant • Temperature Ranges: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Package Types PDIP, MSOP A0 A1 A2 VSS 1 2 3 4 8 7 6 5 SOT-23/SC-70 SCL Vss SDA Note: 1 2 3 4 Vcc 5 WP A0 1 A1 2 A2 3 VSS 4 VCC WP SCL A0 A1 A2 SOIC, TSSOP 1 2 3 4 DFN/TDFN 8 VCC 7 WP 6 SCL 5 SDA 8 7 6 5 VCC WP SCL SDA SDA VSS Pins A0, A1 and A2 are not used by the 24XX01 (no internal connections). Block Diagram WP HV Generator I/O Control Logic Memory Control Logic XDEC EEPROM Array Page Latches I/O SCL YDEC SDA VCC VSS Sense Amp. R/W Control © 2009 Microchip Technology Inc. DS21711J-page 1 24AA01/24LC01B 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ 4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V Min. — DC CHARACTERISTICS Param. No. D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 Sym. VIH — VIL VHYS VOL ILI ILO CIN, COUT ICC read Standby current Characteristic WP, SCL and SDA pins High-level input voltage Low-level input voltage Hysteresis of Schmitt Trigger inputs Low-level output voltage Input leakage current Output leakage current Pin capacitance (all inputs/outputs) Typ. — — — — — — — — 0.1 0.05 0.01 — Max. — — 0.3 VCC — 0.40 ±1 ±1 10 3 1 1 5 Units — V V V V μA μA pF mA mA μΑ μΑ — — — (Note) Conditions 0.7 VCC — 0.05 VCC — — — — — — — — IOL = 3.0 mA, VCC = 2.5V VIN = VSS or VCC VOUT = VSS or VCC VCC = 5.0V (Note) TA = 25°C, FCLK = 1 MHz VCC = 5.5V, SCL = 400 kHz — Industrial Automotive SDA = SCL = VCC WP = VSS ICC write Operating current ICCS Note: This parameter is periodically sampled and not 100% tested. DS21711J-page 2 © 2009 Microchip Technology Inc. 24AA01/24LC01B TABLE 1-2: AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V Min. — — 600 4000 1300 4700 — — — 600 4000 600 4700 0 100 250 600 4000 — — 1300 4700 Typ. — — — — — — — — — — — — — — — — — — — — — — — — Max. 400 100 — — — — 300 1000 300 — — — — — — — — — 900 3500 — — Units kHz ns ns ns ns ns ns ns ns ns ns ns Conditions 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC < 2.5V (24AA01) 2.5V ≤ VCC ≤ 5.5V 1.7V ≤ VCC 6& 1RWH @ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ D b 3 2 1 E1 E 4 e e 5 A A2 c A1 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK /HDG 7KLFNQHVV /HDG :LGWK 1 H $ $ $ ( ( ' / F E ± ± %6& ± ± ± 0,1 0,//,0(7(56 120 0$; L 1RWHV 'LPHQVLRQV ' DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG 'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( < 0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV PP SHU VLGH 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ & % © 2009 Microchip Technology Inc. DS21711J-page 21 24AA01/24LC01B 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ DS21711J-page 22 © 2009 Microchip Technology Inc. 24AA01/24LC01B /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0& ± [ [ 1RWH PP %RG\ >')1@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ D N L e N b K E E2 EXPOSED PAD NOTE 1 1 2 D2 TOP VIEW BOTTOM VIEW 2 1 NOTE 1 A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ /LPLWV 0,1 0,//,0(7(56 120 %6& 0$; 1XPEHU RI 3LQV 3LWFK 2YHUDOO +HLJKW 6WDQGRII &RQWDFW 7KLFNQHVV 2YHUDOO /HQJWK 2YHUDOO :LGWK ([SRVHG 3DG /HQJWK ([SRVHG 3DG :LGWK &RQWDFW :LGWK &RQWDFW /HQJWK &RQWDFW WR ([SRVHG 3DG 1 H $ $ $ ' ( ' ( E / . ± 5() %6& %6& ± ± ± 1RWHV 3LQ YLVXDO LQGH[ IHDWXUH PD\ YDU\ EXW PXVW EH ORFDWHG ZLWKLQ WKH KDWFKHG DUHD 3DFNDJH PD\ KDYH RQH RU PRUH H[SRVHG WLH EDUV DW HQGV 3DFNDJH LV VDZ VLQJXODWHG 'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( < 0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5() 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH IRU LQIRUPDWLRQ SXUSRVHV RQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ & & © 2009 Microchip Technology Inc. DS21711J-page 23 24AA01/24LC01B /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0& ± [ [ 1RWH PP %RG\ >')1@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ DS21711J-page 24 © 2009 Microchip Technology Inc. 24AA01/24LC01B /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 01 ± [ [ 1RWH PP %RG\ >7')1@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ © 2009 Microchip Technology Inc. DS21711J-page 25 24AA01/24LC01B /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 01 ± [ [ 1RWH PP %RG\ >7')1@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ DS21711J-page 26 © 2009 Microchip Technology Inc. 24AA01/24LC01B APPENDIX A: Revision C Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC01B standard marking code. REVISION HISTORY Revision D Added DFN package. Revision E Revised Figure 3-2 Control Byte Allocation; Figure 4-1 Byte Write; Figure 4-2 Page Write; Section 6.0 Write Protection; Figure 7-1 Current Address Read; Figure 72 Random Read; Figure 7-3 Sequential Read. Revision F (01/2007) Revised Device Selection Table; Revised Features Section; Changed 1.8V to 1.7V; Revised Table 1-1, 1-2, 8-1; Replaced Package Drawings; Revised Product ID System. Revision G (03/2007) Replaced Package Drawings (Rev. AM). Revision H (08/2008) Added SC-70 Package; Updated Package Drawings. Revision J (01/2009) Added TDFN Package; Updated Package Drawings. © 2009 Microchip Technology Inc. DS21711J-page 27 24AA01/24LC01B NOTES: DS21711J-page 28 © 2009 Microchip Technology Inc. 24AA01/24LC01B THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2009 Microchip Technology Inc. DS21711J-page 29 24AA01/24LC01B READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: 24AA01/24LC01B Questions: 1. What are the best features of this document? Y N Literature Number: DS21711J FAX: (______) _________ - _________ 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21711J-page 30 © 2009 Microchip Technology Inc. 24AA01/24LC01B PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Examples: a) Temperature Package Range = 1.7V, 1 Kbit I2C™ Serial EEPROM = 1.7V, 1 Kbit I2C Serial EEPROM (Tape and Reel) 24LC01B: = 2.5V, 1 Kbit I2C Serial EEPROM 24LC01BT: = 2.5V, 1 Kbit I2C Serial EEPROM (Tape and Reel) 24AA01: 24AA01T: = -40°C to +85°C = -40°C to +125°C b) Device: c) d) e) Temperature I Range: E Package: f) 24AA01-I/P: Industrial Temperature,1.7V PDIP package 24AA01-I/SN: Industrial Temperature, 1.7V, SOIC package 24AA01T-I/OT: Industrial Temperature, 1.7V, SOT-23 package, tape and reel 24LC01B-I/P: Industrial Temperature, 2.5V, PDIP package 24LC01B-E/SN: Extended Temperature, 2.5V, SOIC package 24LC01BT-I/LT: Industrial Temperature, 1.7V, SC-70 package, tape and reel MC = 2x3 DFN, 8-lead P = Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (3.90 mm body), 8-lead ST = Plastic TSSOP (4.4 mm), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead OT = SOT-23, 5-lead (Tape and Reel only) LT = SC-70, 5-lead (Tape and Reel only) MNY(1)=TDFN, (2x3x0.75 mm body), 8-lead Note 1: "Y" indicates a Nickel Palladium Gold (NiPdAu) finish. © 2009 Microchip Technology Inc. DS21711J-page31 24AA01/24LC01B NOTES: DS21711J-page 32 © 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. 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