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24FC64

24FC64

  • 厂商:

    MICROCHIP

  • 封装:

  • 描述:

    24FC64 - 64K I2C™ Serial EEPROM - Microchip Technology

  • 数据手册
  • 价格&库存
24FC64 数据手册
24AA64/24LC64/24FC64 64K I2C™ Serial EEPROM Device Selection Table Part Number 24AA64 24LC64 24FC64 Note 1: 2: VCC Range 1.7-5.5 2.5-5.5 1.7-5.5 VCC Max. Clock Frequency 400 kHz(1) 400 kHz 1 MHz (2) Temp. Ranges I I, E I • Pb-Free and RoHS Compliant • Temperature Ranges: - Industrial (I): -40°C to +85°C - Automotive (E): -40°C to +125°C Description: The Microchip Technology Inc. 24AA64/24LC64/ 24FC64 (24XX64*) is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. Lowvoltage design permits operation down to 1.7V, with standby and active currents of only 1 A and 3 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24XX64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space. The 24XX64 is available in the standard 8-pin PDIP, surface mount SOIC, SOIJ, TSSOP, DFN, TDFN and MSOP packages. The 24XX64 is also available in the 5-lead SOT-23, and Chip Scale packages. 200 Years • Factory Programming Available • Packages include 8-lead PDIP, SOIC, SOIJ, TSSOP, X-Rotated TSSOP, MSOP, DFN, TDFN, 5-lead SOT-23 or Chip Scale Block Diagram A0 A1 A2 WP HV Generator I/O Control Logic Memory Control Logic XDEC EEPROM Array Page Latches I/O SCL YDEC SDA VCC VSS Sense Amp. R/W Control Package Types PDIP/MSOP/SOIC/SOIJ/TSSOP A0 A1 A2 VSS 1 2 3 4 8 7 6 5 VCC WP SCL SDA SOT-23 X-Rotated TSSOP (X/ST) SCL SCL VSS SDA VSS SDA A2 DFN/TDFN 5 WP A0 1 A1 2 4 A2 3 VCC VSS 4 CS (Chip Scale)(1) 1 3 4 5 SDA 2 VSS 1 2 3 WP VCC A0 A1 1 2 3 4 8 7 6 5 8 VCC VCC 7 WP WP 6 SCL SCL 5 SDA (Top Down View, Balls Not Visible) Note 1: Available in I-temp, “AA” only. * 24XX64 is used in this document as a generic part number for the 24AA64/24LC64/24FC64 devices.  2010 Microchip Technology Inc. DS21189R-page 1 24AA64/24LC64/24FC64 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins  4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V Min. — DC CHARACTERISTICS Param. No. Sym. — D1 D2 D3 VIH VIL VHYS Characteristic A0, A1, A2, WP, SCL and SDA pins High-level input voltage Low-level input voltage Hysteresis of Schmitt Trigger inputs (SDA, SCL pins) Low-level output voltage Input leakage current Output leakage current Pin capacitance (all inputs/outputs) Typ. — — — — Max. — — 0.3 VCC 0.2 VCC — Units — V V V V — — Conditions 0.7 VCC — 0.05 VCC VCC  2.5V VCC  2.5V VCC  2.5V (Note 1) D4 D5 D6 D7 D8 D9 D10 VOL ILI ILO CIN, COUT ICC read — — — — — — — — — — — — 0.1 0.05 .01 — 0.40 ±1 ±1 10 3 400 1 5 V A A pF mA A A A IOL = 3.0 mA @ VCC = 4.5V IOL = 2.1 mA @ VCC = 2.5V VIN = VSS or VCC, WP = VSS VIN = VSS or VCC, WP = VCC VOUT = VSS or VCC VCC = 5.0V (Note 1) TA = 25°C, FCLK = 1 MHz VCC = 5.5V, SCL = 400 kHz Industrial Automotive SDA = SCL = VCC A0, A1, A2, WP = VSS ICC write Operating current ICCS Standby current Note 1: 2: This parameter is periodically sampled and not 100% tested. Typical measurements taken at room temperature. DS21189R-page 2  2010 Microchip Technology Inc. 24AA64/24LC64/24FC64 TABLE 1-2: AC CHARACTERISTICS Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C Characteristic Clock frequency Min. — — — — 4000 600 600 500 4700 1300 1300 500 — — — — — 4000 600 600 250 4700 600 600 250 0 250 100 100 4000 600 600 250 4000 600 600 4700 1300 1300 Max. 100 400 400 1000 — — — — — — — — 1000 300 300 300 100 — — — — — — — — — — — — — — — — — — — — — — Units kHz Conditions 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  5.5V 24FC64 All except, 24FC64 1.7V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5V  VCC  5.5V 24FC64 (Note 2) 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  5.5V 24FC64 1.7 V  VCC  2.5V 2.5 V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5 V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  5.5V 24FC64 AC CHARACTERISTICS Param. No. 1 Sym. FCLK 2 THIGH Clock high time ns 3 TLOW Clock low time ns 4 TR SDA and SCL rise time (Note 1) SDA and SCL fall time (Note 1) ns 5 6 TF ns ns THD:STA Start condition hold time 7 TSU:STA Start condition setup time ns 8 9 THD:DAT Data input hold time TSU:DAT Data input setup time ns ns 10 TSU:STO Stop condition setup time ns 11 TSU:WP WP setup time ns 12 THD:WP WP hold time ns Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com.  2010 Microchip Technology Inc. DS21189R-page 3 24AA64/24LC64/24FC64 AC CHARACTERISTICS Param. No. 13 Sym. TAA Characteristic Output valid from clock (Note 2) Electrical Characteristics: Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C Min. — — — — 4700 1300 1300 500 10 + 0.1CB Max. 3500 900 900 400 — — — — 250 250 50 5 — Units ns Conditions 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5V  VCC  5.5V 24FC64 1.7V  VCC  2.5V 2.5V  VCC  5.5V 1.7V  VCC  2.5V 24FC64 2.5V  VCC  5.5V 24FC64 All except, 24FC64 (Note 1) 24FC64 (Note 1) All except, 24FC64 (Notes 1 and 3) — 14 TBUF Bus free time: Time the bus must be free before a new transmission can start Output fall time from VIH minimum to VIL maximum CB  100 pF Input filter spike suppression (SDA and SCL pins) Write cycle time (byte or page) Endurance ns 15 TOF ns 16 17 18 TSP TWC — — — 1,000,000 ns ms cycles Page Mode 25°C, 5.5V (Note 4) Note 1: Not 100% tested. CB = total capacitance of one bus line in pF. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site at www.microchip.com. FIGURE 1-1: BUS TIMING DATA 5 2 D4 4 SCL SDA IN 7 6 16 3 8 9 10 13 SDA OUT (protected) (unprotected) 14 WP 11 12 DS21189R-page 4  2010 Microchip Technology Inc. 24AA64/24LC64/24FC64 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Rotated DFN(1) TDFN(1) MSOP TSSOP 3 4 5 6 7 8 1 2 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SOT-23 — — — 2 3 1 5 4 CS — — — 2 5 4 3 1 Description Chip Address Input Chip Address Input Chip Address Input Ground Serial Address/Data I/O Serial Clock Write-Protect Input +1.7V to 5.5V Power Supply Name PDIP SOIC TSSOP A0 A1 A2 VSS SDA SCL WP VCC 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 Note 1: The exposed pad on the DFN/TDFN packages can be connected to VSS or left floating. 2.1 A0, A1, A2 Chip Address Inputs 2.3 Serial Clock (SCL) The A0, A1 and A2 inputs are used by the 24XX64 for multiple device operation. The levels on these inputs are compared with the corresponding bits in the slave address. The chip is selected if the compare is true. Up to eight devices may be connected to the same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or VSS. In most applications, the chip address inputs A0, A1 and A2 are hard-wired to logic ‘0’ or logic ‘1’. For applications in which these pins are controlled by a microcontroller or other programmable device, the chip address pins must be driven to logic ‘0’ or logic ‘1’ before normal device operation can proceed. Address pins are not available in the SOT-23 or Chip Scale packages. The SCL input is used to synchronize the data transfer from and to the device. 2.4 Write-Protect (WP) This pin must be connected to either VSS or VCC. If tied to VSS, write operations are enabled. If tied to VCC, write operations are inhibited but read operations are not affected. 3.0 FUNCTIONAL DESCRIPTION 2.2 Serial Data (SDA) SDA is a bidirectional pin used to transfer addresses and data into and out of the device. Since it is an opendrain terminal, the SDA bus requires a pull-up resistor to VCC (typical 10 k for 100 kHz, 2 kfor 400 kHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. The 24XX64 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX64 works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated.  2010 Microchip Technology Inc. DS21189R-page 5 24AA64/24LC64/24FC64 4.0 BUS CHARACTERISTICS The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition Accordingly, the following bus conditions have been defined (Figure 4-1). The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is determined by the master device and is, theoretically, unlimited (although only the last thirty two will be stored when doing a write operation). When an overwrite does occur, it will replace data in a first-in first-out (FIFO) fashion. 4.1 Bus Not Busy (A) 4.5 Acknowledge Both data and clock lines remain high. 4.2 Start Data Transfer (B) Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Note: The 24XX64 does not generate any Acknowledge bits if an internal programming cycle is in progress. A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition. 4.3 Stop Data Transfer (C) A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition. 4.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The device that acknowledges has to pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24XX64) will leave the data line high to enable the master to generate the Stop condition. FIGURE 4-1: (A) SCL (B) DATA TRANSFER SEQUENCE ON THE SERIAL BUS (D) (D) (C) (A) SDA Start Condition Address or Acknowledge Valid Data Allowed to Change Stop Condition DS21189R-page 6  2010 Microchip Technology Inc. 24AA64/24LC64/24FC64 5.0 DEVICE ADDRESSING A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a four-bit control code. For the 24XX64, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX64 devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are, in effect, the three Most Significant bits of the word address. For the SOT-23 and Chip Scale packages, the address pins are not available. During device addressing, the A2, A1 and A0 Chip Select bits (Figure 5-2) should be set to ‘0’. The last bit of the control byte defines the operation to be performed. When set to a ‘1’, a read operation is selected. When set to a ‘0’, a write operation is selected. The next two bytes received define the address of the first data byte (Figure 5-2). Because only A12...A0 are used, the upper-three address bits are “don’t care” bits. The upper-address bits are transferred first, followed by the Less Significant bits. Following the Start condition, the 24XX64 monitors the SDA bus, checking the device-type identifier being transmitted. Upon receiving a ‘1010’ code and appropriate device-select bits, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX64 will select a read or write operation. FIGURE 5-1: CONTROL BYTE FORMAT Read/Write Bit Chip Select Bits 0 A2 A1 A0 R/W ACK Control Code S 1 0 1 Slave Address Start Bit Acknowledge Bit 5.1 Contiguous Addressing Across Multiple Devices The Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space for up to 512K bits by adding up to eight 24XX64 devices on the same bus. In this case, software can use A0 of the control byte as address bit A13; A1 as address bit A14; and A2 as address bit A15. It is not possible to sequentially read across device boundaries. The SOT-23 and Chip Scale packages do not support multiple device addressing on the same bus. FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS Control Byte Address High Byte Address Low Byte 1 0 1 0 A 2 A 1 Chip Select bits A 0 R/W x x x AAA 12 11 10 A 9 A 8 A 7 • • • • • • A 0 Control Code x = “don’t care” bit  2010 Microchip Technology Inc. DS21189R-page 7 24AA64/24LC64/24FC64 6.0 6.1 WRITE OPERATIONS Byte Write 6.2 Page Write Following the Start condition from the master, the control code (four bits), the Chip Select (three bits) and the R/W bit (which is a logic low) are clocked onto the bus by the master transmitter. This indicates to the addressed slave receiver that the address high byte will follow once it has generated an Acknowledge bit during the ninth clock cycle. Therefore, the next byte transmitted by the master is the high-order byte of the word address and will be written into the Address Pointer of the 24XX64. The next byte is the Least Significant Address Byte. After receiving another Acknowledge signal from the 24XX64, the master device will transmit the data word to be written into the addressed memory location. The 24XX64 acknowledges again and the master generates a Stop condition. This initiates the internal write cycle and, during this time, the 24XX64 will not generate Acknowledge signals (Figure 6-1). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written and the device will immediately accept a new command. After a byte Write command, the internal address counter will point to the address location following the one that was just written. Note: When doing a write of less than 32 bytes the data in the rest of the page is refreshed along with the data bytes being written. This will force the entire page to endure a write cycle, for this reason endurance is specified per page. The write control byte, word address and the first data byte are transmitted to the 24XX64 in the same way as in a byte write. However, instead of generating a Stop condition, the master transmits up to 31 additional bytes which are temporarily stored in the on-chip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the five lower Address Pointer bits are internally incremented by one. If the master should transmit more than 32 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle will begin (Figure 6-2). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command, but no write cycle will occur, no data will be written, and the device will immediately accept a new command. Note: Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of [page size – 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. 6.3 Write Protection The WP pin allows the user to write-protect the entire array (0000-1FFF) when the pin is tied to VCC. If tied to VSS the write protection is disabled. The WP pin is sampled at the Stop bit for every Write command (Figure 4-1). Toggling the WP pin after the Stop bit will have no effect on the execution of the write cycle. DS21189R-page 8  2010 Microchip Technology Inc. 24AA64/24LC64/24FC64 FIGURE 6-1: Bus Activity Master BYTE WRITE S T A R T Control Byte Address High Byte xxx A C K A C K A C K A C K Address Low Byte S T O P P Data SDA Line S 1 0 1 0 AAA 0 210 Bus Activity x = “don’t care” bit FIGURE 6-2: S T A R T PAGE WRITE Control Byte Address High Byte xxx A C K A C K A C K A C K A C K Address Low Byte S T O P P Bus Activity Master SDA Line Bus Activity x = “don’t care” bit Data Byte 0 Data Byte 31 S 10 10AAA0 210  2010 Microchip Technology Inc. DS21189R-page 9 24AA64/24LC64/24FC64 7.0 ACKNOWLEDGE POLLING FIGURE 7-1: Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a Write command (R/W = 0). If the device is still busy with the write cycle, then no ACK will be returned. If no ACK is returned, the Start bit and control byte must be re-sent. If the cycle is complete, the device will return the ACK and the master can then proceed with the next Read or Write command. See Figure 7-1 for a flow diagram of this operation. ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? Yes Next Operation No DS21189R-page 10  2010 Microchip Technology Inc. 24AA64/24LC64/24FC64 8.0 READ OPERATION Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the control byte is set to one. There are three basic types of read operations: current address read, random read and sequential read. This terminates the write operation, but not before the internal Address Pointer is set. The master then issues the control byte again, but with the R/W bit set to a one. The 24XX64 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition, which causes the 24XX64 to discontinue transmission (Figure 8-2). After a random Read command, the internal address counter will point to the address location following the one that was just read. 8.1 Current Address Read The 24XX64 contains an address counter that maintains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address ‘n’ (n is any legal address), the next current address read operation would access data from address n + 1. Upon receipt of the control byte with R/W bit set to one, the 24XX64 issues an acknowledge and transmits the eight-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX64 discontinues transmission (Figure 8-1). 8.3 Sequential Read 8.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24XX64 as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master generates a Start condition following the acknowledge. Sequential reads are initiated in the same way as random reads, except that once the 24XX64 transmits the first data byte, the master issues an acknowledge as opposed to the Stop condition used in a random read. This acknowledge directs the 24XX64 to transmit the next sequentially-addressed 8-bit word (Figure 8-3). Following the final byte being transmitted to the master, the master will NOT generate an acknowledge, but will generate a Stop condition. To provide sequential reads, the 24XX64 contains an internal Address Pointer which is incremented by one at the completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. The internal Address Pointer will automatically roll over from address 1FFF to address 0000 if the master acknowledges the byte received from the array address 1FFF. FIGURE 8-1: CURRENT ADDRESS READ S T A R T S A C K N O A C K Control Byte S T O P P Bus Activity Master Data (n) SDA Line Bus Activity  2010 Microchip Technology Inc. DS21189R-page 11 24AA64/24LC64/24FC64 FIGURE 8-2: Bus Activity Master RANDOM READ S T A R T Control Byte Address High Byte xxx A C K A C K A C K Address Low Byte S T A R T Control Byte Data Byte S T O P P A C K N O A C K SDA Line Bus Activity x = “don’t care” bit S1010AAA0 210 S 1 0 1 0 A AA1 210 FIGURE 8-3: Bus Activity Master SDA Line Bus Activity SEQUENTIAL READ Control Byte Data n Data n + 1 Data n + 2 Data n + x S T O P P A C K A C K A C K A C K N O A C K DS21189R-page 12  2010 Microchip Technology Inc. 24AA64/24LC64/24FC64 9.0 9.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW Example: 24LC64 I/P e3 13F 0527 8-Lead SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN Example: 24LC64I SN e3 0527 13F 8-Lead SOIC (5.28 mm) XXXXXXXX T/XXXXXX YYWWNNN Example: 24LC64 I/SM e3 052713F 8-Lead TSSOP XXXX TYWW NNN Example: 4LB I527 13F 8-Lead MSOP Example: XXXXXT YWWNNN 4L64I 52713F 8-Lead 2x3 DFN XXX YWW NN Example: 274 527 I3  2010 Microchip Technology Inc. DS21189R-page 13 24AA64/24LC64/24FC64 8-Lead 2x3 TDFN XXX YWW NN Example: A74 527 I3 5-Lead SOT-23 Example: XXNN 7GNN 5-Lead Chip Scale XW NN Example: 75 13 1st Line Marking Codes Part Number TSSOP 24AA64 24LC64 24FC64 Note: 4AB 4LB 4FB TSSOP X-Rotated 4ABX 4LBX — MSOP 4A64T 4L64T 4F64T 271 274 27A DFN I Temp. E Temp. — 275 — A71 A74 A7A TDFN I Temp. E Temp. — A75 — SOT-23 I Temp. 7HNN 7GNN — E Temp. — 7JNN — T = Temperature grade (I, E) Legend: XX...X T Y YY WW NNN Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) e3 Note: For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 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