70291E

dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 Data Sheet High-Performance, 16-bit Digital Signal Controllers © 2011 Microchip Technology Inc. DS70291E Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-830-6 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70291E-page 2 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 High-Performance, 16-Bit Digital Signal Controllers Operating Range: • Up to 40 MIPS operation (at 3.0V -3.6V): - Industrial temperature range (-40°C to +85°C) - Extended temperature range (-40°C to +125°C) • Up to 20 MIPS operation (at 3.0V -3.6V): - High temperature range (-40°C to +150°C) Timers/Capture/Compare/PWM: • Timer/Counters, up to five 16-bit timers: - Can pair up to make two 32-bit timers - One timer runs as a Real-Time Clock with an external 32.768 kHz oscillator - Programmable prescaler • Input Capture (up to four channels): - Capture on up, down or both edges - 16-bit capture input functions - 4-deep FIFO on each capture • Output Compare (up to four channels): - Single or Dual 16-bit Compare mode - 16-bit Glitchless PWM mode • Hardware Real-Time Clock and Calendar (RTCC): - Provides clock, calendar and alarm functions High-Performance DSC CPU: • • • • • • • • • Modified Harvard architecture C compiler optimized instruction set 16-bit wide data path 24-bit wide instructions Linear program memory addressing up to 4M instruction words Linear data memory addressing up to 64 Kbytes 83 base instructions: mostly 1 word/1 cycle Two 40-bit accumulators with rounding and saturation options Flexible and powerful addressing modes: - Indirect - Modulo - Bit-Reversed Software stack 16 x 16 fractional/integer multiply operations 32/16 and 16/16 divide operations Single-cycle multiply and accumulate: - Accumulator write back for DSP operations - Dual data fetch Up to ±16-bit shifts for up to 40-bit data Interrupt Controller: • • • • • 5-cycle latency Up to 53 available interrupt sources Up to three external interrupts Seven programmable priority levels Five processor exceptions • • • • Digital I/O: • • • • • Peripheral pin Select functionality Up to 35 programmable digital I/O pins Wake-up/Interrupt-on-Change for up to 31 pins Output pins can drive from 3.0V to 3.6V Up to 5.5V output with open drain configuration on 5V tolerant pins with external pull-up • 4 mA sink on all I/O pins • Direct Memory Access (DMA): • 8-channel hardware DMA • Up to 2 Kbytes dual ported DMA buffer area (DMA RAM) to store data transferred via DMA: - Allows data transfer between RAM and a peripheral while CPU is executing code (no cycle stealing) • Most peripherals support DMA On-Chip Flash and SRAM: • Flash program memory (up to 128 Kbytes) • Data SRAM (up to 16 Kbytes) • Boot, Secure, and General Security for program Flash © 2011 Microchip Technology Inc. DS70291E-page 3 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 System Management: • Flexible clock options: - External, crystal, resonator, internal RC - Fully integrated Phase-Locked Loop (PLL) - Extremely low jitter PLL • Power-up Timer • Oscillator Start-up Timer/Stabilizer • Watchdog Timer with its own RC oscillator • Fail-Safe Clock Monitor • Reset by multiple sources Motor Control Peripherals: • 6-channel 16-bit Motor Control PWM: - Three duty cycle generators - Independent or Complementary mode - Programmable dead-time and output polarity - Edge-aligned or center-aligned - Manual output override control - One Fault input - Trigger for ADC conversions - PWM frequency for 16-bit resolution (@ 40 MIPS) = 1220 Hz for Edge-Aligned mode, 610 Hz for Center-Aligned mode - PWM frequency for 11-bit resolution (@ 40 MIPS) = 39.1 kHz for Edge-Aligned mode, 19.55 kHz for Center-Aligned mode • 2-channel 16-bit Motor Control PWM: - One duty cycle generator - Independent or Complementary mode - Programmable dead time and output polarity - Edge-aligned or center-aligned - Manual output override control - One Fault input - Trigger for ADC conversions - PWM frequency for 16-bit resolution (@ 40 MIPS) = 1220 Hz for Edge-Aligned mode, 610 Hz for Center-Aligned mode - PWM frequency for 11-bit resolution (@ 40 MIPS) = 39.1 kHz for Edge-Aligned mode, 19.55 kHz for Center-Aligned mode • 2-Quadrature Encoder Interface module: - Phase A, Phase B, and index pulse input - 16-bit up/down position counter - Count direction status - Position Measurement (x2 and x4) mode - Programmable digital noise filters on inputs - Alternate 16-bit Timer/Counter mode - Interrupt on position counter rollover/underflow Power Management: • On-chip 2.5V voltage regulator • Switch between clock sources in real time • Idle, Sleep, and Doze modes with fast wake-up Analog-to-Digital Converters (ADCs): • 10-bit, 1.1 Msps or 12-bit, 500 Ksps conversion: - Two and four simultaneous samples (10-bit ADC) - Up to nine input channels with auto-scanning - Conversion start can be manual or synchronized with one of four trigger sources - Conversion possible in Sleep mode - ±2 LSb max integral nonlinearity - ±1 LSb max differential nonlinearity Audio Digital-to-Analog Converter (DAC): - 16-bit Dual Channel DAC module - 100 Ksps maximum sampling rate - Second-Order Digital Delta-Sigma Modulator Comparator Module: • Two analog comparators with programmable input/output configuration CMOS Flash Technology: • • • • • Low-power, high-speed Flash technology Fully static design 3.3V (±10%) operating voltage Industrial and Extended temperature Low power consumption DS70291E-page 4 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Communication Modules: • 4-wire SPI (up to two modules): - Framing supports I/O interface to simple codecs - Supports 8-bit and 16-bit data - Supports all serial clock formats and sampling modes • I2C™: - Full Multi-Master Slave mode support - 7-bit and 10-bit addressing - Bus collision detection and arbitration - Integrated signal conditioning - Slave address masking • UART (up to two modules): - Interrupt on address bit detect - Interrupt on UART error - Wake-up on Start bit from Sleep mode - 4-character TX and RX FIFO buffers - LIN 2.0 bus support - IrDA® encoding and decoding in hardware - High-Speed Baud mode - Hardware Flow Control with CTS and RTS • Enhanced CAN (ECAN™ module) 2.0B active: - Up to eight transmit and up to 32 receive buffers - 16 receive filters and three masks - Loopback, Listen Only and Listen All - Messages modes for diagnostics and bus monitoring - Wake-up on CAN message - Automatic processing of Remote Transmission Requests - FIFO mode using DMA - DeviceNet™ addressing support • Parallel Master Slave Port (PMP/EPSP): - Supports 8-bit or 16-bit data - Supports 16 address lines • Programmable Cyclic Redundancy Check (CRC): - Programmable bit length for the CRC generator polynomial (up to 16-bit length) - 8-deep, 16-bit or 16-deep, 8-bit FIFO for data input Packaging: • 28-pin SDIP/SOIC/QFN-S • 44-pin TQFP/QFN Note: See Table 1 for the exact peripheral features per device. © 2011 Microchip Technology Inc. DS70291E-page 5 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 PRODUCT FAMILIES The device names, pin counts, memory sizes, and peripheral availability of each device are listed in Table 1. The pages that follow show their pinout diagrams. TABLE 1: dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 CONTROLLER FAMILIES Analog Comparator (2 Channels/Voltage Regulator) Remappable Peripheral Program Flash Memory (Kbyte) External Interrupts(4) 8-bit Parallel Master Port (Address Lines) Quadrature Encoder Interface Motor Control PWM (Channels)(3) 10-bit/12-bit ADC (Channels) Remappable Pins Output Compare Standard PWM 16-bit Timer(2) 6-pin 16-bit DAC Input Capture CRC Generator RAM (Kbyte)(1) dsPIC33FJ128MC804 dsPIC33FJ128MC802 44 28 128 128 16 16 26 16 5 5 4 4 4 4 6, 2 6, 2 2 2 2 2 SPI Device 2 2 ECAN™ 1 1 3 3 1 1 1 1 1 1 9 6 1 0 1/1 1/0 11 2 35 21 QFN TQFP SDIP SOIC QFN-S QFN TQFP SDIP SOIC QFN-S QFN TQFP SDIP SOIC QFN-S QFN TQFP SDIP SOIC QFN-S QFN TQFP dsPIC33FJ128MC204 dsPIC33FJ128MC202 44 28 128 128 8 8 26 16 5 5 4 4 4 4 6, 2 6, 2 2 2 2 2 2 2 0 0 3 3 1 1 1 1 1 1 9 6 0 0 1/1 1/0 11 2 35 21 dsPIC33FJ64MC804 dsPIC33FJ64MC802 44 28 64 64 16 16 26 16 5 5 4 4 4 4 6, 2 6, 2 2 2 2 2 2 2 1 1 3 3 1 1 1 1 1 1 9 6 1 0 1/1 1/0 11 2 35 21 dsPIC33FJ64MC204 dsPIC33FJ64MC202 44 28 64 64 8 8 26 16 5 5 4 4 4 4 6, 2 6, 2 2 2 2 2 2 2 0 0 3 3 1 1 1 1 1 1 9 6 0 0 1/1 1/0 11 2 35 21 dsPIC33FJ32MC304 dsPIC33FJ32MC302 44 28 32 32 4 4 26 16 5 5 4 4 4 4 6, 2 6, 2 2 2 2 2 2 2 0 0 3 3 1 1 1 1 1 1 9 6 0 0 1/1 1/0 11 2 35 21 Note 1: 2: 3: 4: SDIP SOIC QFN-S RAM size is inclusive of 2 Kbytes of DMA RAM for all devices except dsPIC33FJ32MC302/304, which include 1 Kbyte of DMA RAM. Only four out of five timers are remappable. Only PWM fault pins are remappable. Only two out of three interrupts are remappable. DS70291E-page 6 © 2011 Microchip Technology Inc. Packages UART I/O Pins RTCC I2C™ Pins dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Pin Diagrams 28-Pin SDIP, SOIC MCLR AN0/VREF+/CN2/RA0 AN1/VREF-/CN3/RA1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 PGEC1/ AN3/C2IN+/RP1 /CN5/RB1 AN4/C1IN-/RP2(1)/CN6/RB2 AN5/C1IN+/RP3(1)/CN7/RB3 VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/PMA0/RA3 SOSCI/RP4(1)/CN1/PMBE/RB4 SOSCO/T1CK/CN0/PMA1/RA4 VDD PGED3/ASDA1/RP5(1)/CN27/PMD7/RB5 (1) = Pins are up to 5V tolerant 1 2 3 4 5 6 7 8 9 10 11 12 13 14 dsPIC33FJ32MC302 dsPIC33FJ64MC202 dsPIC33FJ64MC802 dsPIC33FJ128MC202 dsPIC33FJ128MC802 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS PWM1L1/RP15(1)/CN11/PMCS1/RB15 PWM1H1/RTCC/RP14(1)/CN12/PMWR/RB14 PWM1L2/RP13(1)/CN13/PMRD/RB13 PWM1H2/RP12(1)/CN14/PMD0/RB12 PGEC2/TMS/PWM1L3/RP11(1)/CN15/PMD1/RB11 PGED2/TDI/PWM1H3/RP10(1)/CN16/PMD2/RB10 VCAP VSS TDO/PWM2L1/SDA1/RP9(1)/CN21/PMD3/RB9 TCK/PWM2H1/SCL1/RP8(1)/CN22/PMD4/RB8 INT0/RP7(1)/CN23/PMD5/RB7 PGEC3/ASCL1/RP6(1)/CN24/PMD6/RB6 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 AN4/C1IN-/RP2 /CN6/RB2 AN5/C1IN+/RP3(1)/CN7/RB3 VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/PMA0/RA3 (1) 28 27 26 25 24 23 22 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS PWM1L1/RP15(1)/CN11/PMCS1/RB15 PWM1H1/RTCC/RP14(1)/CN12/PMWR/RB14 28-Pin QFN-S(2) = Pins are up to 5V tolerant 1 2 dsPIC33FJ32MC302 3 dsPIC33FJ64MC202 4 dsPIC33FJ64MC802 5 dsPIC33FJ128MC202 6 dsPIC33FJ128MC802 7 8 9 10 11 12 13 14 21 20 19 18 17 16 15 PWM1L2/RP13(1)/CN13/PMRD/RB13 PWM1H2/RP12(1)/CN14/PMD0/RB12 PGEC2/TMS/PWM1L3/RP11(1)/CN15/PMD1/RB11 PGED2/TDI/PWM1H3/RP10(1)/CN16/PMD2/RB10 VCAP VSS TDO/PWM2L1/SDA1/RP9(1)/CN21/PMD3/RB9 Note 1: 2: The RPx pins can be used by any remappable peripheral. See Table 1 in this section for the list of available peripherals. The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally. © 2011 Microchip Technology Inc. SOSCI/RP4(1)/CN1/PMBE/RB4 SOSCO/T1CK/CN0/PMA1/RA4 VDD PGED3/ASDA1/RP5(1)/CN27/PMD7/RB5 PGEC3//ASCL1/RP6(1)/CN24/PMD6/RB6 INT0/RP7(1)/CN23/PMD5/RB7 TCK/PWM2H1/SCL1/RP8(1)/CN22/PMD4/RB8 DS70291E-page 7 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Pin Diagrams (Continued) PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS PWM1L1/DAC1LN/RP15(1)/CN11/PMCS1/RB15 PWM1H1/DAC1LP/RTCC/RP14(1)/CN12/PMWR/RB14 TCK/PMA7/RA7 TMS/PMA10/RA10 44-Pin QFN(2) = Pins are up to 5V tolerant 22 21 20 19 18 17 16 15 14 13 12 AN4/C1IN-/RP2(1)/CN6/RB2 AN5/C1IN+/RP3(1)/CN7/RB3 AN6/DAC1RM/RP16(1)/CN8/RC0 AN7/DAC1LM/RP17 /CN9/RC1 AN8/CVREF/RP18(1)/PMA2/CN10/RC2 VDD VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 TDO/PMA8/RA8 SOSCI/RP4(1)/CN1/RB4 (1) 23 24 25 26 27 28 29 30 31 32 33 11 10 9 8 7 6 5 4 3 2 PWM1L2/DAC1RN/RP13(1)/CN13/PMRD/RB13 PWM1H2/DAC1RP/RP12(1)/CN14/PMD0/RB12 PGEC2/PWM1L3/RP11(1)/CN15/PMD1/RB11 PGED2/PWM1H3/RP10(1)/CN16/PMD2/RB10 VCAP VSS RP25(1)/CN19/PMA6/RC9 RP24(1)/CN20/PMA5/RC8 PWM2L1/RP23(1)/CN17/PMA0/RC7 PWM2H1/RP22(1)/CN18/PMA1/RC6 SDA1/RP9(1)/CN21/PMD3/RB9 dsPIC33FJ64MC804 dsPIC33FJ128MC804 34 35 36 37 38 39 40 41 42 43 44 SOSCO/T1CK/CN0/RA4 TDI/PMA9/RA9 RP19(1)/CN28/PMBE/RC3 (1)/CN25/PMA4/RC4 RP20 RP21(1)/CN26/PMA3/RC5 VSS VDD PGED3/ASDA1/RP5(1)/CN27/PMD7/RB5 PGEC3/ASCL1/RP6(1)/CN24/PMD6/RB6 INT0/RP7(1)/CN23/PMD5/RB7 SCL1/RP8(1)/CN22/PMD4/RB8 1 Note 1: 2: The RPx pins can be used by any remappable peripheral. See Table 1 in this section for the list of available peripherals. The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally. DS70291E-page 8 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Pin Diagrams (Continued) 44-Pin QFN(2) PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS PWM1L1/RP15(1)/CN11/PMCS1/RB15 PWM1H1/RTCC/RP14(1)/CN12/PMWR/RB14 TCK/PMA7/RA7 TMS/PMA10/RA10 = Pins are up to 5V tolerant 22 21 20 19 18 17 16 15 14 13 12 AN4/C1IN-/RP2(1)/CN6/RB2 AN5/C1IN+/RP3(1)/CN7/RB3 AN6/RP16 /CN8/RC0 AN7/RP17(1)/CN9/RC1 AN8/CVREF/RP18 /PMA2/CN10/RC2 VDD VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 TDO/PMA8/RA8 SOSCI/RP4(1)/CN1/RB4 (1) (1) 23 24 25 26 27 28 29 30 31 32 33 11 10 9 8 PWM1L2/RP13(1)/CN13/PMRD/RB13 PWM1H2/RP12(1)/CN14/PMD0/RB12 PGEC2/PWM1L3/RP11(1)/CN15/PMD1/RB11 PGED2/PWM1H3/RP10(1)/CN16/PMD2/RB10 VCAP VSS RP25(1)/CN19/PMA6/RC9 RP24(1)/CN20/PMA5/RC8 PWM2L1/RP23(1)/CN17/PMA0/RC7 PWM2H1/RP2(1)2/CN18/PMA1/RC6 SDA1/RP9(1)/CN21/PMD3/RB9 dsPIC33FJ32MC304 dsPIC33FJ64MC204 dsPIC33FJ128MC204 7 6 5 4 3 2 34 35 36 37 38 39 40 41 42 43 44 SOSCO/T1CK/CN0/RA4 TDI/PMA9/RA9 RP19(1)/CN28/PMBE/RC3 RP20(1)/CN25/PMA4/RC4 RP21(1)/CN26/PMA3/RC5 VSS VDD PGED3/ASDA1/RP5(1)/CN27/PMD7/RB5 PGEC3/ASCL1/RP6(1)/CN24/PMD6/RB6 INT0/RP7(1)/CN23/PMD5/RB7 SCL1/RP8(1)/CN22/PMD4/RB8 1 Note 1: 2: The RPx pins can be used by any remappable peripheral. See Table 1 in this section for the list of available peripherals. The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally. © 2011 Microchip Technology Inc. DS70291E-page 9 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Pin Diagrams (Continued) 44-Pin TQFP PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS PWM1L1/DAC1LN/RP15(1)/CN11/PMCS1/RB15 PWM1H1/DAC1LP/RTCC/RP14(1)/CN12/PMWR/RB14 TCK/PMA7/RA7 TMS/PMA10/RA10 = Pins are up to 5V tolerant 22 21 20 19 18 17 16 15 14 13 12 Note 1: The RPx pins can be used by any remappable peripheral. See Table 1 in this section for the list of available peripherals. SOSCO/T1CK/CN0/RA4 TDI/PMA9/RA9 RP19(1)/CN28/PMBE/RC3 (1)/CN25/PMA4/RC4 RP20 RP21(1)/CN26/PMA3/RC5 VSS VDD PGED3/ASDA1/RP5(1)/CN27/PMD7/RB5 PGEC3/ASCL1/RP6(1)/CN24/PMD6/RB6 INT0/RP7(1)/CN23/PMD5/RB7 SCL1/RP8(1)/CN22/PMD4/RB8 34 35 36 37 38 39 40 41 42 43 44 AN4/C1IN-/RP2(1)/CN6/RB2 AN5/C1IN+/RP3(1)/CN7/RB3 AN6/DAC1RM/RP16(1)/CN8/RC0 AN7/DAC1LM/RP17(1)/CN9/RC1 AN8/CVREF/RP18(1)/PMA2/CN10/RC2 VDD VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 TDO/PMA8/RA8 SOSCI/RP4(1)/CN1/RB4 23 24 25 26 27 28 29 30 31 32 33 11 10 9 8 dsPIC33FJ64MC804 7 6 dsPIC33FJ128MC804 5 4 3 2 1 PWM1L2/DAC1RN/RP13(1)/CN13/PMRD/RB13 PWM1H2/DAC1RP/RP12(1)/CN14/PMD0/RB12 PGEC2/PWM1L3/RP11(1)/CN15/PMD1/RB11 PGED2/EMCD2/PWM1H3/RP10(1)/CN16/PMD2/RB10 VCAP VSS RP25(1)/CN19/PMA6/RC9 RP24(1)/CN20/PMA5/RC8 PWM2L1/RP23(1)/CN17/PMA0/RC7 PWM2H1/RP22(1)/CN18/PMA1/RC6 SDA1/RP9(1)/CN21/PMD3/RB9 DS70291E-page 10 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Pin Diagrams (Continued) PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS PWM1L1/RP15(1)/CN11/PMCS1/RB15 PWM1H1/RTCC/RP14(1)/CN12/PMWR/RB14 TCK/PMA7/RA7 TMS/PMA10/RA10 44-Pin TQFP = Pins are up to 5V tolerant 22 21 20 19 18 17 16 15 14 13 12 Note 1: The RPx pins can be used by any remappable peripheral. See Table 1 in this section for the list of available peripherals. © 2011 Microchip Technology Inc. SOSCO/T1CK/CN0/RA4 TDI/PMA9/RA9 RP19(1)/CN28/PMBE/RC3 (1)/CN25/PMA4/RC4 RP20 RP21(1)/CN26/PMA3/RC5 VSS VDD (1)/CN27/PMD7/RB5 PGED3/ASDA1/RP5 PGEC3/ASCL1/RP6(1)/CN24/PMD6/RB6 INT0/RP7(1)/CN23/PMD5/RB7 SCL1/RP8(1)/CN22/PMD4/RB8 34 35 36 37 38 39 40 41 42 43 44 AN4/C1IN-/RP2(1)/CN6/RB2 AN5/C1IN+/RP3(1)/CN7/RB3 AN6/RP16(1)/CN8/RC0 AN7/RP17(1)/CN9/RC1 AN8/CVREF/RP18/PMA2/CN10/RC2 VDD VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 TDO/PMA8/RA8 SOSCI/RP4(1)/CN1/RB4 23 24 25 26 27 28 29 30 31 32 33 11 10 9 8 dsPIC33FJ32MC304 7 dsPIC33FJ64MC204 6 dsPIC33FJ128MC204 5 4 3 2 1 PWM1L2/RP13(1)/CN13/PMRD/RB13 PWM1H2/RP12(1)/CN14/PMD0/RB12 PGEC2/PWM1L3/RP11(1)/CN15/PMD1/RB11 PGED2/EMCD2/PWM1H3/RP10(1)/CN16/PMD2/RB10 VCAP VSS RP25(1)/CN19/PMA6/RC9 RP24(1)/CN20/PMA5/RC8 PWM2L1/RP23(1)/CN17/PMA0/RC7 PWM2H1/RP22(1)/CN18/PMA1/RC6 SDA1/RP9(1)/CN21/PMD3/RB9 DS70291E-page 11 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Table of Contents dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 Product Families............................................. 6 1.0 Device Overview ........................................................................................................................................................................ 15 2.0 Guidelines for Getting Started with 16-bit Digital Signal Controllers .......................................................................................... 21 3.0 CPU............................................................................................................................................................................................ 25 4.0 Memory Organization ................................................................................................................................................................. 39 5.0 Flash Program Memory .............................................................................................................................................................. 77 6.0 Resets ....................................................................................................................................................................................... 83 7.0 Interrupt Controller ..................................................................................................................................................................... 91 8.0 Direct Memory Access (DMA) .................................................................................................................................................. 133 9.0 Oscillator Configuration ............................................................................................................................................................ 145 10.0 Power-Saving Features............................................................................................................................................................ 157 11.0 I/O Ports ................................................................................................................................................................................... 163 12.0 Timer1 ...................................................................................................................................................................................... 195 13.0 Timer2/3 And TImer4/5 Feature .............................................................................................................................................. 197 14.0 Input Capture............................................................................................................................................................................ 203 15.0 Output Compare....................................................................................................................................................................... 205 16.0 Motor Control PWM Module ..................................................................................................................................................... 209 17.0 Quadrature Encoder Interface (QEI) Module ........................................................................................................................... 223 18.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 227 19.0 Inter-Integrated Circuit™ (I2C™) .............................................................................................................................................. 233 20.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 241 21.0 Enhanced CAN (ECAN™) Module ........................................................................................................................................... 247 22.0 10-bit/12-bit Analog-to-Digital Converter (ADC1) ..................................................................................................................... 273 23.0 Audio Digital-to-Analog Converter (DAC) ................................................................................................................................. 287 24.0 Comparator Module.................................................................................................................................................................. 293 25.0 Real-Time Clock and Calendar (RTCC) .................................................................................................................................. 299 26.0 Programmable Cyclic Redundancy Check (CRC) Generator .................................................................................................. 309 27.0 Parallel Master Port (PMP)....................................................................................................................................................... 313 28.0 Special Features ...................................................................................................................................................................... 321 29.0 Instruction Set Summary .......................................................................................................................................................... 331 30.0 Development Support............................................................................................................................................................... 339 31.0 Electrical Characteristics .......................................................................................................................................................... 343 32.0 High Temperature Electrical Characteristics ............................................................................................................................ 397 33.0 Packaging Information.............................................................................................................................................................. 407 Appendix A: Revision History............................................................................................................................................................. 417 Index ................................................................................................................................................................................................. 427 The Microchip Web Site ..................................................................................................................................................................... 433 Customer Change Notification Service .............................................................................................................................................. 433 Customer Support .............................................................................................................................................................................. 433 Reader Response .............................................................................................................................................................................. 434 Product Identification System............................................................................................................................................................. 435 DS70291E-page 12 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. © 2011 Microchip Technology Inc. DS70291E-page 13 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 14 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 1.0 DEVICE OVERVIEW This document contains device specific information for the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 Digital Signal Controller (DSC) Devices. The dsPIC33F devices contain extensive Digital Signal Processor (DSP) functionality with a high performance 16-bit Microcontroller (MCU) architecture. Figure 1-1 shows a general block diagram of the core and peripheral modules in the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. Table 1-1 lists the functions of the various pins shown in the pinout diagrams. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. However, it is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. © 2011 Microchip Technology Inc. DS70291E-page 15 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 1-1: PSV and Table Data Access Control Block Interrupt Controller 8 16 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/ X04 BLOCK DIAGRAM Y Data Bus X Data Bus PORTA 16 16 16 Data Latch Data Latch Y RAM Address Latch DMA Controller DMA RAM PORTB 23 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic X RAM Address Latch 16 23 16 16 PORTC Address Latch Address Generator Units Program Memory EA MUX Data Latch 24 ROM Latch 16 Literal Data Remappable Pins 16 Instruction Decode and Control Control Signals to Various Blocks Timing Generation FRC/LPRC Oscillators Precision Band Gap Reference Voltage Regulator Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer Brown-out Reset Instruction Reg 16 DSP Engine 16 x 16 W Register Array 16 OSC2/CLKO OSC1/CLKI Divide Support 16-bit ALU 16 VCAP VDD, VSS MCLR PMP/ EPSP Comparator 2 Ch. ECAN1 Timers 1-5 UART1, 2 ADC1 OC/ PWM1-4 PWM 2 Ch RTCC DAC1 SPI1, 2 IC1, 2, 7, 8 CNx I2C1 QEI1, 2 PWM 6 Ch Note: Not all pins or features are implemented on all device pinout configurations. See “Pin Diagrams” for the specific pins and features present on each device. DS70291E-page 16 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 1-1: Pin Name AN0-AN8 CLKI PINOUT I/O DESCRIPTIONS Pin Type I I Buffer Type Analog ST/CMOS PPS No No Analog input channels. External clock source input. Always associated with OSC1 pin function. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. 32.768 kHz low-power oscillator crystal input; CMOS otherwise. 32.768 kHz low-power oscillator crystal output. Change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. Capture inputs 1/2. Capture inputs 7/8. Compare Fault A input (for Compare Channels 1, 2, 3 and 4). Compare outputs 1 through 4. External interrupt 0. External interrupt 1. External interrupt 2. PORTA is a bidirectional I/O port. PORTA is a bidirectional I/O port. PORTB is a bidirectional I/O port. PORTC is a bidirectional I/O port. Timer1 external clock input. Timer2 external clock input. Timer3 external clock input. Timer4 external clock input. Timer5 external clock input. UART1 clear to send. UART1 ready to send. UART1 receive. UART1 transmit. UART2 clear to send. UART2 ready to send. UART2 receive. UART2 transmit. Synchronous serial clock input/output for SPI1. SPI1 data in. SPI1 data out. SPI1 slave synchronization or frame pulse I/O. Synchronous serial clock input/output for SPI2. SPI2 data in. SPI2 data out. SPI2 slave synchronization or frame pulse I/O. Synchronous serial clock input/output for I2C1. Synchronous serial data input/output for I2C1. Alternate synchronous serial clock input/output for I2C1. Alternate synchronous serial data input/output for I2C1. Analog = Analog input O = Output TTL = TTL input buffer P = Power I = Input Description CLKO OSC1 OSC2 SOSCI SOSCO CN0-CN30 IC1-IC2 IC7-IC8 OCFA OC1-OC4 INT0 INT1 INT2 RA0-RA4 RA7-RA10 RB0-RB15 RC0-RC9 T1CK T2CK T3CK T4CK T5CK U1CTS U1RTS U1RX U1TX U2CTS U2RTS U2RX U2TX SCK1 SDI1 SDO1 SS1 SCK2 SDI2 SDO2 SS2 SCL1 SDA1 ASCL1 ASDA1 O I I/O I O I I I I O I I I I/O I/O I/O I/O I I I I I I O I O I O I O I/O I O I/O I/O I O I/O I/O I/O I/O I/O — ST/CMOS — ST/CMOS — ST ST ST ST — ST ST ST ST ST ST ST ST ST ST ST ST ST — ST — ST — ST — ST ST — ST ST ST — ST ST ST ST ST No No No No No No Yes Yes Yes Yes No Yes Yes No No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No No Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels PPS = Peripheral Pin Select © 2011 Microchip Technology Inc. DS70291E-page 17 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 1-1: Pin Name TMS TCK TDI TDO INDX1 QEA1 QEB1 UPDN1 INDX2 QEA2 QEB2 UPDN2 C1RX C1TX RTCC CVREF C1INC1IN+ C1OUT C2INC2IN+ C2OUT PMA0 PMA1 PMA2 -PMPA10 PMBE PMCS1 PMD0-PMPD7 PMRD PMWR DAC1RN DAC1RP DAC1RM DAC2RN DAC2RP DAC2RM PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type I I I O I I I O I I I O I O O O I I O I I O I/O I/O O O O I/O O O O O O O O O Buffer Type ST ST ST — ST ST ST CMOS ST ST ST CMOS ST — — ANA ANA ANA — ANA ANA — TTL/ST TTL/ST — — — TTL/ST — — — — — — — — PPS No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No No Yes No No Yes No No No No No No No No No No No No No No JTAG Test mode select pin. JTAG test clock input pin. JTAG test data input pin. JTAG test data output pin. Quadrature Encoder Index1 Pulse input. Quadrature Encoder Phase A input in QEI1 mode. Auxiliary Timer External Clock/Gate input in Timer mode. Quadrature Encoder Phase A input in QEI1 mode. Auxiliary Timer External Clock/Gate input in Timer mode. Position Up/Down Counter Direction State. Quadrature Encoder Index2 Pulse input. Quadrature Encoder Phase A input in QEI2 mode. Auxiliary Timer External Clock/Gate input in Timer mode. Quadrature Encoder Phase A input in QEI2 mode. Auxiliary Timer External Clock/Gate input in Timer mode. Position Up/Down Counter Direction State. ECAN1 bus receive pin. ECAN1 bus transmit pin. Real-Time Clock Alarm Output. Comparator Voltage Reference Output. Comparator 1 Negative Input. Comparator 1 Positive Input. Comparator 1 Output. Comparator 2 Negative Input. Comparator 2 Positive Input. Comparator 2 Output. Parallel Master Port Address Bit 0 Input (Buffered Slave modes) and Output (Master modes). Parallel Master Port Address Bit 1 Input (Buffered Slave modes) and Output (Master modes). Parallel Master Port Address (Demultiplexed Master Modes). Parallel Master Port Byte Enable Strobe. Parallel Master Port Chip Select 1 Strobe. Parallel Master Port Data (Demultiplexed Master mode) or Address/ Data (Multiplexed Master modes). Parallel Master Port Read Strobe. Parallel Master Port Write Strobe. DAC1 Negative Output. DAC1 Positive Output. DAC1 Output indicating middle point value (typically 1.65V). DAC2 Negative Output. DAC2 Positive Output. DAC2 Output indicating middle point value (typically 1.65V). Analog = Analog input O = Output TTL = TTL input buffer P = Power I = Input Description Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels PPS = Peripheral Pin Select DS70291E-page 18 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 1-1: Pin Name FLTA1 PWM1L1 PWM1H1 PWM1L2 PWM1H2 PWM1L3 PWM1H3 FLTA2 PWM2L1 PWM2H1 PGED1 PGEC1 PGED2 PGEC2 PGED3 PGEC3 MCLR AVDD AVSS VDD VCAP VSS VREF+ VREF- PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type I O O O O O O I O O I/O I I/O I I/O I I/P P P P P P I I Buffer Type ST — — — — — — ST — — ST ST ST ST ST ST ST P P — — — Analog Analog PPS Yes No No No No No No Yes No No No No No No No No No No No No No No No No PWM1 Fault A input. PWM1 Low output 1 PWM1 High output 1 PWM1 Low output 2 PWM1 High output 2 PWM1 Low output 3 PWM1 High output 3 PWM2 Fault A input. PWM2 Low output 1 PWM2 High output 1 Data I/O pin for programming/debugging communication channel 1. Clock input pin for programming/debugging communication channel 1. Data I/O pin for programming/debugging communication channel 2. Clock input pin for programming/debugging communication channel 2. Data I/O pin for programming/debugging communication channel 3. Clock input pin for programming/debugging communication channel 3. Master Clear (Reset) input. This pin is an active-low Reset to the device. Positive supply for analog modules. This pin must be connected at all times. Ground reference for analog modules. Positive supply for peripheral logic and I/O pins. CPU logic filter capacitor connection. Ground reference for logic and I/O pins. Analog voltage reference (high) input. Analog voltage reference (low) input. Analog = Analog input O = Output TTL = TTL input buffer P = Power I = Input Description Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels PPS = Peripheral Pin Select © 2011 Microchip Technology Inc. DS70291E-page 19 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 20 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 2.0 GUIDELINES FOR GETTING STARTED WITH 16-BIT DIGITAL SIGNAL CONTROLLERS 2.2 Decoupling Capacitors The use of decoupling capacitors on every pair of power supply pins, such as VDD, VSS, AVDD and AVSS is required. Consider the following criteria when using decoupling capacitors: • Value and type of capacitor: Recommendation of 0.1 µF (100 nF), 10-20V. This capacitor should be a low-ESR and have resonance frequency in the range of 20 MHz and higher. It is recommended that ceramic capacitors be used. • Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended to place the capacitors on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace length from the pin to the capacitor is within one-quarter inch (6 mm) in length. • Handling high frequency noise: If the board is experiencing high frequency noise, upward of tens of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 µF to 0.001 µF. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible. For example, 0.1 µF in parallel with 0.001 µF. • Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum thereby reducing PCB track inductance. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. 2.1 Basic Connection Requirements Getting started with the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 family of 16-bit Digital Signal Controllers (DSC) requires attention to a minimal set of device pin connections before proceeding with development. The following is a list of pin names, which must always be connected: • All VDD and VSS pins (see Section 2.2 “Decoupling Capacitors”) • All AVDD and AVSS pins (regardless if ADC module is not used) (see Section 2.2 “Decoupling Capacitors”) • VCAP (see Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)”) • MCLR pin (see Section 2.4 “Master Clear (MCLR) Pin”) • PGECx/PGEDx pins used for In-Circuit Serial Programming™ (ICSP™) and debugging purposes (see Section 2.5 “ICSP Pins”) • OSC1 and OSC2 pins when external oscillator source is used (see Section 2.6 “External Oscillator Pins”) Additionally, the following pins may be required: • VREF+/VREF- pins used when external voltage reference for ADC module is implemented Note: The AVDD and AVSS pins must be connected independent of the ADC voltage reference source. © 2011 Microchip Technology Inc. DS70291E-page 21 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 2-1: RECOMMENDED MINIMUM CONNECTION 0.1 µF Ceramic 2.4 Master Clear (MCLR) Pin The MCLR pin provides for two specific device functions: • Device Reset • Device programming and debugging. During device programming and debugging, the resistance and capacitance that can be added to the pin must be considered. Device programmers and debuggers drive the MCLR pin. Consequently, specific voltage levels (VIH and VIL) and fast signal transitions must not be adversely affected. Therefore, specific values of R and C will need to be adjusted based on the application and PCB requirements. VDD R R1 10 µF Tantalum VCAP VDD VSS MCLR C dsPIC33F VSS VDD VDD VSS AVDD AVSS VDD VSS 0.1 µF Ceramic 0.1 µF Ceramic 10 Ω 0.1 µF Ceramic 0.1 µF Ceramic For example, as shown in Figure 2-2, it is recommended that the capacitor C, be isolated from the MCLR pin during programming and debugging operations. Place the components shown in Figure 2-2 within one-quarter inch (6 mm) from the MCLR pin. 2.2.1 TANK CAPACITORS FIGURE 2-2: On boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor for integrated circuits including DSCs to supply a local power source. The value of the tank capacitor should be determined based on the trace resistance that connects the power supply source to the device, and the maximum current drawn by the device in the application. In other words, select the tank capacitor so that it meets the acceptable voltage sag at the device. Typical values range from 4.7 µF to 47 µF. EXAMPLE OF MCLR PIN CONNECTIONS VDD R R1 MCLR JP C dsPIC33F 2.3 CPU Logic Filter Capacitor Connection (VCAP) Note 1: A low-ESR (< 5 Ohms) capacitor is required on the VCAP pin, which is used to stabilize the voltage regulator output voltage. The VCAP pin must not be connected to VDD, and must have a capacitor between 4.7 µF and 10 µF, 16V connected to ground. The type can be ceramic or tantalum. Refer to Section 31.0 “Electrical Characteristics” for additional information. The placement of this capacitor should be close to the VCAP. It is recommended that the trace length not exceed one-quarter inch (6 mm). Refer to Section 28.2 “On-Chip Voltage Regulator” for details. R ≤ 10 kΩ is recommended. A suggested starting value is 10 kΩ. Ensure that the MCLR pin VIH and VIL specifications are met. R1 ≤ 470Ω will limit any current flowing into MCLR from the external capacitor C, in the event of MCLR pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin VIH and VIL specifications are met. 2: DS70291E-page 22 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 2.5 ICSP Pins 2.6 External Oscillator Pins The PGECx and PGEDx pins are used for In-Circuit Serial Programming™ (ICSP™) and debugging purposes. It is recommended to keep the trace length between the ICSP connector and the ICSP pins on the device as short as possible. If the ICSP connector is expected to experience an ESD event, a series resistor is recommended, with the value in the range of a few tens of Ohms, not to exceed 100 Ohms. Pull-up resistors, series diodes, and capacitors on the PGECx and PGEDx pins are not recommended as they will interfere with the programmer/debugger communications to the device. If such discrete components are an application requirement, they should be removed from the circuit during programming and debugging. Alternatively, refer to the AC/DC characteristics and timing requirements information in the respective device Flash programming specification for information on capacitive loading limits and pin input voltage high (VIH) and input low (VIL) requirements. Ensure that the “Communication Channel Select” (i.e., PGECx/PGEDx pins) programmed into the device matches the physical connections for the ICSP to MPLAB® ICD 2, MPLAB® ICD 3 or MPLAB® REAL ICE™. For more information on ICD 2, ICD 3 and REAL ICE connection requirements, refer to the following documents that are available on the Microchip web site. • “MPLAB® ICD 2 In-Circuit Debugger User’s Guide” DS51331 • “Using MPLAB® ICD 2” (poster) DS51265 • “MPLAB® ICD 2 Design Advisory” DS51566 • “Using MPLAB® ICD 3” (poster) DS51765 • “MPLAB® ICD 3 Design Advisory” DS51764 • “MPLAB® REAL ICE™ In-Circuit Emulator User’s Guide” DS51616 • “Using MPLAB® REAL ICE™” (poster) DS51749 Many DSCs have options for at least two oscillators: a high-frequency primary oscillator and a low-frequency secondary oscillator (refer to Section 9.0 “Oscillator Configuration” for details). The oscillator circuit should be placed on the same side of the board as the device. Also, place the oscillator circuit close to the respective oscillator pins, not exceeding one-half inch (12 mm) distance between them. The load capacitors should be placed next to the oscillator itself, on the same side of the board. Use a grounded copper pour around the oscillator circuit to isolate them from surrounding circuits. The grounded copper pour should be routed directly to the MCU ground. Do not run any signal traces or power traces inside the ground pour. Also, if using a two-sided board, avoid any traces on the other side of the board where the crystal is placed. A suggested layout is shown in Figure 2-3. FIGURE 2-3: SUGGESTED PLACEMENT OF THE OSCILLATOR CIRCUIT Main Oscillator 13 Guard Ring 14 15 Guard Trace Secondary Oscillator 16 17 18 19 20 © 2011 Microchip Technology Inc. DS70291E-page 23 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 2.7 Oscillator Value Conditions on Device Start-up 2.9 Unused I/Os If the PLL of the target device is enabled and configured for the device start-up oscillator, the maximum oscillator source frequency must be limited to less than or equal to 8 MHz for start-up with PLL enabled to comply with device PLL start-up conditions. This means that if the external oscillator frequency is outside this range, the application must start-up in the FRC mode first. The default PLL settings after a POR with an oscillator frequency outside this range will violate the device operating speed. Once the device powers up, the application firmware can initialize the PLL SFRs, CLKDIV and PLLDBF to a suitable value, and then perform a clock switch to the Oscillator + PLL clock source. Note that clock switching must be enabled in the device Configuration word. Unused I/O pins should be configured as outputs and driven to a logic-low state. Alternatively, connect a 1k to 10k resistor between VSS and the unused pin. 2.8 Configuration of Analog and Digital Pins During ICSP Operations If MPLAB ICD 2, ICD 3 or REAL ICE is selected as a debugger, it automatically initializes all of the A/D input pins (ANx) as “digital” pins, by setting all bits in the AD1PCFGL register. The bits in this register that correspond to the A/D pins that are initialized by MPLAB ICD 2, ICD 3 or REAL ICE, must not be cleared by the user application firmware; otherwise, communication errors will result between the debugger and the device. If your application needs to use certain A/D pins as analog input pins during the debug session, the user application must clear the corresponding bits in the AD1PCFGL register during initialization of the ADC module. When MPLAB ICD 2, ICD 3 or REAL ICE is used as a programmer, the user application firmware must correctly configure the AD1PCFGL register. Automatic initialization of this register is only done during debugger operation. Failure to correctly configure the register(s) will result in all A/D pins being recognized as analog input pins, resulting in the port value being read as a logic ‘0’, which may affect user application functionality. DS70291E-page 24 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 3.0 CPU There are two classes of instruction in the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices: MCU and DSP. These two instruction classes are seamlessly integrated into a single CPU. The instruction set includes many addressing modes and is designed for optimum C compiler efficiency. For most instructions, the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, three parameter instructions can be supported, allowing A + B = C operations to be executed in a single cycle. A block diagram of the CPU is shown in Figure 3-1, and the programmer’s model for the dsPIC33FJ32MC302/ 304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 is shown in Figure 3-2. Note 1: This data sheet summarizes the features dsPIC33FJ32MC302/304, of dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to “Section 2. CPU” (DS70204) of the “dsPIC33F/PIC24H Family Reference Manual”, which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. 3.2 3.1 Overview The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 CPU module has a 16-bit (data) modified Harvard architecture with an enhanced instruction set, including significant support for DSP. The CPU has a 24-bit instruction word with a variable length opcode field. The Program Counter (PC) is 23 bits wide and addresses up to 4M x 24 bits of user program memory space. The actual amount of program memory implemented varies by device. A single-cycle instruction prefetch mechanism is used to help maintain throughput and provides predictable execution. All instructions execute in a single cycle, with the exception of instructions that change the program flow, the double-word move (MOV.D) instruction and the table instructions. Overhead-free program loop constructs are supported using the DO and REPEAT instructions, both of which are interruptible at any time. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 devices have sixteen, 16-bit working registers in the programmer’s model. Each of the working registers can serve as a data, address or address offset register. The 16th working register (W15) operates as a software Stack Pointer (SP) for interrupts and calls. Data Addressing Overview The data space can be addressed as 32K words or 64 Kbytes and is split into two blocks, referred to as X and Y data memory. Each memory block has its own independent Address Generation Unit (AGU). The MCU class of instructions operates solely through the X memory AGU, which accesses the entire memory map as one linear data space. Certain DSP instructions operate through the X and Y AGUs to support dual operand reads, which splits the data address space into two parts. The X and Y data space boundary is device-specific. Overhead-free circular buffers (Modulo Addressing mode) are supported in both X and Y address spaces. The Modulo Addressing removes the software boundary checking overhead for DSP algorithms. Furthermore, the X AGU circular addressing can be used with any of the MCU class of instructions. The X AGU also supports Bit-Reversed Addressing to greatly simplify input or output data reordering for radix-2 FFT algorithms. The upper 32 Kbytes of the data space memory map can optionally be mapped into program space at any 16K program word boundary defined by the 8-bit Program Space Visibility Page (PSVPAG) register. The program-to-data-space mapping feature lets any instruction access program space as if it were data space. © 2011 Microchip Technology Inc. DS70291E-page 25 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 3.3 DSP Engine Overview 3.4 Special MCU Features The DSP engine features a high-speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. The barrel shifter is capable of shifting a 40-bit value up to 16 bits right or left, in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC instruction and other associated instructions can concurrently fetch two data operands from memory while multiplying two W registers and accumulating and optionally saturating the result in the same cycle. This instruction functionality requires that the RAM data space be split for these instructions and linear for all others. Data space partitioning is achieved in a transparent and flexible manner through dedicating certain working registers to each address space. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 features a 17-bit by 17-bit single-cycle multiplier that is shared by both the MCU ALU and DSP engine. The multiplier can perform signed, unsigned and mixed-sign multiplication. Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit multiplication not only allows you to perform mixed-sign multiplication, it also achieves accurate results for special operations, such as (-1.0) x (-1.0). The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 supports 16/16 and 32/16 divide operations, both fractional and integer. All divide instructions are iterative operations. They must be executed within a REPEAT loop, resulting in a total execution time of 19 instruction cycles. The divide operation can be interrupted during any of those 19 cycles without loss of data. A 40-bit barrel shifter is used to perform up to a 16-bit left or right shift in a single cycle. The barrel shifter can be used by both MCU and DSP instructions. DS70291E-page 26 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 3-1: dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/ X04 CPU CORE BLOCK DIAGRAM PSV and Table Data Access Control Block Interrupt Controller 8 16 Y Data Bus X Data Bus 16 16 Data Latch 16 Data Latch DMA Y RAM Address Latch RAM 16 23 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic X RAM Address Latch 23 16 Address Latch 16 DMA Controller Address Generator Units Program Memory EA MUX Data Latch 24 ROM Latch 16 Literal Data 16 Instruction Decode and Control Instruction Reg Control Signals to Various Blocks 16 DSP Engine 16 x 16 W Register Array 16 Divide Support 16-bit ALU 16 To Peripheral Modules © 2011 Microchip Technology Inc. DS70291E-page 27 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 3-2: dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/ X04 PROGRAMMER’S MODEL D15 W0/WREG W1 W2 W3 W4 DSP Operand Registers W5 W6 W7 W8 DSP Address Registers W9 W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer Working Registers DO Shadow D0 PUSH.S Shadow Legend SPLIM AD39 DSP Accumulators PC22 ACCA ACCB PC0 0 7 TBLPAG 7 PSVPAG 0 Program Space Visibility Page Address 15 RCOUNT 15 DCOUNT 22 DOSTART 22 DOEND 15 CORCON 0 0 0 0 0 Data Table Page Address AD31 Stack Pointer Limit Register AD15 AD0 Program Counter REPEAT Loop Counter DO Loop Counter DO Loop Start Address DO Loop End Address Core Configuration Register OA OB SA SB OAB SAB DA SRH DC IPL2 IPL1 IPL0 RA SRL N OV Z C STATUS Register DS70291E-page 28 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 3.5 CPU Control Registers SR: CPU STATUS REGISTER R-0 OB R/C-0 SA(1) R/C-0 SB(1) R-0 OAB R/C-0 SAB R -0 DA R/W-0 DC bit 8 R/W-0(3) IPL(2) bit 7 Legend: C = Clear only bit S = Set only bit ‘1’ = Bit is set bit 15 R = Readable bit W = Writable bit ‘0’ = Bit is cleared OA: Accumulator A Overflow Status bit 1 = Accumulator A overflowed 0 = Accumulator A has not overflowed OB: Accumulator B Overflow Status bit 1 = Accumulator B overflowed 0 = Accumulator B has not overflowed SA: Accumulator A Saturation ‘Sticky’ Status bit(1) 1 = Accumulator A is saturated or has been saturated at some time 0 = Accumulator A is not saturated SB: Accumulator B Saturation ‘Sticky’ Status bit(1) 1 = Accumulator B is saturated or has been saturated at some time 0 = Accumulator B is not saturated OAB: OA || OB Combined Accumulator Overflow Status bit 1 = Accumulators A or B have overflowed 0 = Neither Accumulators A or B have overflowed SAB: SA || SB Combined Accumulator (Sticky) Status bit(4) 1 = Accumulators A or B are saturated or have been saturated at some time in the past 0 = Neither Accumulator A or B are saturated DA: DO Loop Active bit 1 = DO loop in progress 0 = DO loop not in progress DC: MCU ALU Half Carry/Borrow bit 1 = A carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data) of the result occurred 0 = No carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data) of the result occurred This bit can be read or cleared (not set). The IPL bits are concatenated with the IPL bit (CORCON) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL = 1. User interrupts are disabled when IPL = 1. The IPL Status bits are read only when the NSTDIS bit (INTCON1) = 1. This bit can be read or cleared (not set). Clearing this bit clears SA and SB. U = Unimplemented bit, read as ‘0’ -n = Value at POR x = Bit is unknown R/W-0(3) R-0 RA R/W-0 N R/W-0 OV R/W-0 Z R/W-0 C bit 0 REGISTER 3-1: R-0 OA bit 15 R/W-0(3) bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 Note 1: 2: 3: 4: © 2011 Microchip Technology Inc. DS70291E-page 29 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 3-1: bit 7-5 SR: CPU STATUS REGISTER (CONTINUED) IPL: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) RA: REPEAT Loop Active bit 1 = REPEAT loop in progress 0 = REPEAT loop not in progress N: MCU ALU Negative bit 1 = Result was negative 0 = Result was non-negative (zero or positive) OV: MCU ALU Overflow bit This bit is used for signed arithmetic (two’s complement). It indicates an overflow of a magnitude that causes the sign bit to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred Z: MCU ALU Zero bit 1 = An operation that affects the Z bit has set it at some time in the past 0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result) C: MCU ALU Carry/Borrow bit 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred This bit can be read or cleared (not set). The IPL bits are concatenated with the IPL bit (CORCON) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL = 1. User interrupts are disabled when IPL = 1. The IPL Status bits are read only when the NSTDIS bit (INTCON1) = 1. This bit can be read or cleared (not set). Clearing this bit clears SA and SB. bit 4 bit 3 bit 2 bit 1 bit 0 Note 1: 2: 3: 4: DS70291E-page 30 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 3-2: U-0 — bit 15 R/W-0 SATA bit 7 Legend: R = Readable bit 0’ = Bit is cleared bit 15-13 bit 12 CORCON: CORE CONTROL REGISTER U-0 — U-0 — R/W-0 US R/W-0 EDT(1) R-0 R-0 DL R-0 bit 8 R/W-0 SATB R/W-1 SATDW R/W-0 ACCSAT R/C-0 IPL3(2) R/W-0 PSV R/W-0 RND R/W-0 IF bit 0 C = Clear only bit W = Writable bit ‘x = Bit is unknown -n = Value at POR ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ bit 11 bit 10-8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 Unimplemented: Read as ‘0’ US: DSP Multiply Unsigned/Signed Control bit 1 = DSP engine multiplies are unsigned 0 = DSP engine multiplies are signed EDT: Early DO Loop Termination Control bit(1) 1 = Terminate executing DO loop at end of current loop iteration 0 = No effect DL: DO Loop Nesting Level Status bits 111 = 7 DO loops active • • • 001 = 1 DO loop active 000 = 0 DO loops active SATA: ACCA Saturation Enable bit 1 = Accumulator A saturation enabled 0 = Accumulator A saturation disabled SATB: ACCB Saturation Enable bit 1 = Accumulator B saturation enabled 0 = Accumulator B saturation disabled SATDW: Data Space Write from DSP Engine Saturation Enable bit 1 = Data space write saturation enabled 0 = Data space write saturation disabled ACCSAT: Accumulator Saturation Mode Select bit 1 = 9.31 saturation (super saturation) 0 = 1.31 saturation (normal saturation) IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less PSV: Program Space Visibility in Data Space Enable bit 1 = Program space visible in data space 0 = Program space not visible in data space This bit is always read as ‘0’. The IPL3 bit is concatenated with the IPL bits (SR) to form the CPU interrupt priority level. Note 1: 2: © 2011 Microchip Technology Inc. DS70291E-page 31 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 3-2: bit 1 CORCON: CORE CONTROL REGISTER (CONTINUED) bit 0 RND: Rounding Mode Select bit 1 = Biased (conventional) rounding enabled 0 = Unbiased (convergent) rounding enabled IF: Integer or Fractional Multiplier Mode Select bit 1 = Integer mode enabled for DSP multiply ops 0 = Fractional mode enabled for DSP multiply ops This bit is always read as ‘0’. The IPL3 bit is concatenated with the IPL bits (SR) to form the CPU interrupt priority level. Note 1: 2: DS70291E-page 32 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 3.6 Arithmetic Logic Unit (ALU) 3.7 DSP Engine The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 ALU is 16 bits wide and is capable of addition, subtraction, bit shifts and logic operations. Unless otherwise mentioned, arithmetic operations are two’s complement in nature. Depending on the operation, the ALU can affect the values of the Carry (C), Zero (Z), Negative (N), Overflow (OV) and Digit Carry (DC) Status bits in the SR register. The C and DC Status bits operate as Borrow and Digit Borrow bits, respectively, for subtraction operations. The ALU can perform 8-bit or 16-bit operations, depending on the mode of the instruction that is used. Data for the ALU operation can come from the W register array or data memory, depending on the addressing mode of the instruction. Likewise, output data from the ALU can be written to the W register array or a data memory location. Refer to the “16-bit MCU and DSC Programmer’s Reference Manual” (DS70157) for information on the SR bits affected by each instruction. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 CPU incorporates hardware support for both multiplication and division. This includes a dedicated hardware multiplier and support hardware for 16-bit-divisor division. The DSP engine consists of a high-speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/ subtracter (with two target accumulators, round and saturation logic). The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 is a single-cycle instruction flow architecture; therefore, concurrent operation of the DSP engine with MCU instruction flow is not possible. However, some MCU ALU and DSP engine resources can be used concurrently by the same instruction (e.g., ED, EDAC). The DSP engine can also perform inherent accumulator-to-accumulator operations that require no additional data. These instructions are ADD, SUB and NEG. The DSP engine has options selected through bits in the CPU Core Control register (CORCON), as listed below: • • • • • • Fractional or integer DSP multiply (IF) Signed or unsigned DSP multiply (US) Conventional or convergent rounding (RND) Automatic saturation on/off for ACCA (SATA) Automatic saturation on/off for ACCB (SATB) Automatic saturation on/off for writes to data memory (SATDW) • Accumulator Saturation mode selection (ACCSAT) A block diagram of the DSP engine is shown in Figure 3-3. 3.6.1 MULTIPLIER Using the high-speed 17-bit x 17-bit multiplier of the DSP engine, the ALU supports unsigned, signed or mixed-sign operation in several MCU multiplication modes: • • • • • • • 16-bit x 16-bit signed 16-bit x 16-bit unsigned 16-bit signed x 5-bit (literal) unsigned 16-bit unsigned x 16-bit unsigned 16-bit unsigned x 5-bit (literal) unsigned 16-bit unsigned x 16-bit signed 8-bit unsigned x 8-bit unsigned TABLE 3-1: Instruction CLR ED EDAC MAC MAC MOVSAC MPY MPY MPY.N MSC DSP INSTRUCTIONS SUMMARY Algebraic Operation A=0 A = (x – y)2 A = A + (x – y)2 A = A + (x • y) A = A + x2 No change in A A=x•y A=x2 A=–x•y A=A–x•y ACC Write Back Yes No No Yes No Yes No No No Yes 3.6.2 DIVIDER The divide block supports 32-bit/16-bit and 16-bit/16-bit signed and unsigned integer divide operations with the following data sizes: • • • • 32-bit signed/16-bit signed divide 32-bit unsigned/16-bit unsigned divide 16-bit signed/16-bit signed divide 16-bit unsigned/16-bit unsigned divide The quotient for all divide instructions ends up in W0 and the remainder in W1. 16-bit signed and unsigned DIV instructions can specify any W register for both the 16-bit divisor (Wn) and any W register (aligned) pair (W(m + 1):Wm) for the 32-bit dividend. The divide algorithm takes one cycle per bit of divisor, so both 32-bit/16-bit and 16-bit/16-bit instructions take the same number of cycles to execute. © 2011 Microchip Technology Inc. DS70291E-page 33 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 3-3: DSP ENGINE BLOCK DIAGRAM S a 40 Round t 16 u Logic r a t e 40 Carry/Borrow Out 40-bit Accumulator A 40-bit Accumulator B Saturate Carry/Borrow In Adder Negate 40 40 40 Barrel Shifter 16 40 Sign-Extend Y Data Bus 32 Zero Backfill 33 32 16 17-bit Multiplier/Scaler 16 16 To/From W Array DS70291E-page 34 © 2011 Microchip Technology Inc. X Data Bus dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 3.7.1 MULTIPLIER The adder/subtracter generates Overflow Status bits, SA/SB and OA/OB, which are latched and reflected in the STATUS register: • Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed • Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits are not identical to each other. The adder has an additional saturation block that controls accumulator data saturation, if selected. It uses the result of the adder, the Overflow Status bits described previously and the SAT (CORCON) and ACCSAT (CORCON) mode control bits to determine when and to what value to saturate. Six STATUS register bits support saturation and overflow: • OA: ACCA overflowed into guard bits • OB: ACCB overflowed into guard bits • SA: ACCA saturated (bit 31 overflow and saturation) or ACCA overflowed into guard bits and saturated (bit 39 overflow and saturation) • SB: ACCB saturated (bit 31 overflow and saturation) or ACCB overflowed into guard bits and saturated (bit 39 overflow and saturation) • OAB: Logical OR of OA and OB • SAB: Logical OR of SA and SB The OA and OB bits are modified each time data passes through the adder/subtracter. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding Overflow Trap Flag Enable bits (OVATE, OVBTE) in the INTCON1 register are set (refer to Section 7.0 “Interrupt Controller”). This allows the user application to take immediate action, for example, to correct system gain. The SA and SB bits are modified each time data passes through the adder/subtracter, but can only be cleared by the user application. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation or bit 39 for 40-bit saturation) and is saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, the SA and SB bits generate an arithmetic warning trap when saturation is disabled. The 17-bit x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17-bit x 17-bit multiplier/scaler is a 33-bit value that is sign-extended to 40 bits. Integer data is inherently represented as a signed two’s complement value, where the Most Significant bit (MSb) is defined as a sign bit. The range of an N-bit two’s complement integer is -2N-1 to 2N-1 – 1. • For a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF) including 0 • For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,647 (0x7FFF FFFF) When the multiplier is configured for fractional multiplication, the data is represented as a two’s complement fraction, where the MSb is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit two’s complement fraction with this implied radix point is -1.0 to (1 – 21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF) including 0 and has a precision of 3.01518x10-5. In Fractional mode, the 16 x 16 multiply operation generates a 1.31 product that has a precision of 4.65661 x 10-10. The same multiplier is used to support the MCU multiply instructions, which include integer 16-bit signed, unsigned and mixed sign multiply operations. The MUL instruction can be directed to use byte or word-sized operands. Byte operands direct a 16-bit result, and word operands direct a 32-bit result to the specified registers in the W array. 3.7.2 DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/ subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its pre-accumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled using the barrel shifter prior to accumulation. 3.7.2.1 Adder/Subtracter, Overflow and Saturation The adder/subtracter is a 40-bit adder with an optional zero input into one side, and either true or complement data into the other input. • In the case of addition, the Carry/Borrow input is active-high and the other input is true data (not complemented) • In the case of subtraction, the Carry/Borrow input is active-low and the other input is complemented © 2011 Microchip Technology Inc. DS70291E-page 35 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 The Overflow and Saturation Status bits can optionally be viewed in the STATUS Register (SR) as the logical OR of OA and OB (in bit OAB) and the logical OR of SA and SB (in bit SAB). Programmers can check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This is useful for complex number arithmetic, which typically uses both accumulators. The device supports three Saturation and Overflow modes: • Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF) or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. This condition is referred to as ‘super saturation’ and provides protection against erroneous data or unexpected algorithm problems (such as gain calculations). • Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. When this Saturation mode is in effect, the guard bits are not used, so the OA, OB or OAB bits are never set. • Bit 39 Catastrophic Overflow: The bit 39 Overflow Status bit from the adder is used to set the SA or SB bit, which remains set until cleared by the user application. No saturation operation is performed, and the accumulator is allowed to overflow, destroying its sign. If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. 3.7.3.1 Round Logic The round logic is a combinational block that performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16-bit, 1.15 data value that is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least significant word is simply discarded. Conventional rounding zero-extends bit 15 of the accumulator and adds it to the ACCxH word (bits 16 through 31 of the accumulator). • If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. • If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value tends to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. In this case, the Least Significant bit (bit 16 of the accumulator) of ACCxH is examined: • If it is ‘1’, ACCxH is incremented. • If it is ‘0’, ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme removes any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC), or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus, subject to data saturation (see Section 3.7.3.2 “Data Space Write Saturation”). For the MAC class of instructions, the accumulator write-back operation functions in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. 3.7.3 ACCUMULATOR ‘WRITE BACK’ The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. The write is performed across the X bus into combined X and Y address space. The following addressing modes are supported: • W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. • [W13] + = 2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). DS70291E-page 36 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 3.7.3.2 Data Space Write Saturation 3.7.4 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data space can also be saturated, but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These inputs are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly: • For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF • For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000 The Most Significant bit of the source (bit 39) is used to determine the sign of the operand being tested. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. The barrel shifter can perform up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators or the X bus (to support multi-bit shifts of register or memory data). The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value shifts the operand right. A negative value shifts the operand left. A value of ‘0’ does not modify the operand. The barrel shifter is 40 bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 and 31 for right shifts, and between bit positions 0 and 16 for left shifts. © 2011 Microchip Technology Inc. DS70291E-page 37 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 38 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.0 Note: MEMORY ORGANIZATION This data sheet summarizes the features dsPIC33FJ32MC302/304, of the dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 4. “Program Memory” (DS70203) of the “dsPIC33F/ PIC24H Family Reference Manual”, which is available from the Microchip web site (www.microchip.com). 4.1 Program Address Space The program address memory space of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices is 4M instructions. The space is addressable by a 24-bit value derived either from the 23-bit Program Counter (PC) during program execution, or from table operation or data space remapping as described in Section 4.6 “Interfacing Program and Data Memory Spaces”. User application access to the program memory space is restricted to the lower half of the address range (0x000000 to 0x7FFFFF). The exception is the use of TBLRD/TBLWT operations, which use TBLPAG to permit access to the Configuration bits and Device ID sections of the configuration memory space. The memory map for the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 devices is shown in Figure 4-1. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 architecture features separate program and data memory spaces and buses. This architecture also allows the direct access of program memory from the data space during code execution. FIGURE 4-1: PROGRAM MEMORY MAP FOR dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 AND dsPIC33FJ128MCX02/X04 DEVICES dsPIC33FJ64MCX02/X04 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table dsPIC33FJ128MCX02/X04 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table 0x000000 0x000002 0x000004 0x0000FE 0x000100 0x000104 0x0001FE 0x000200 dsPIC33FJ32MC302/304 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table User Program Flash Memory (11264 instructions) User Memory Space User Program Flash Memory (22016 instructions) User Program Flash Memory (44032 instructions) 0x0057FE 0x005800 0x00ABFE 0x00AC00 Unimplemented (Read ‘0’s) Unimplemented (Read ‘0’s) Unimplemented (Read ‘0’s) 0x7FFFFE 0x800000 0x0157FE 0x015800 Reserved Configuration Memory Space Reserved Reserved Device Configuration Registers Device Configuration Registers Device Configuration Registers 0xF7FFFE 0xF80000 0xF80017 0xF80018 Reserved Reserved Reserved 0xFEFFFE 0xFF0000 0xFF0002 0xFFFFFE DEVID (2) Reserved DEVID (2) Reserved DEVID (2) Reserved Note: Memory areas are not shown to scale. © 2011 Microchip Technology Inc. DS70291E-page 39 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.1.1 PROGRAM MEMORY ORGANIZATION 4.1.2 INTERRUPT AND TRAP VECTORS The program memory space is organized in word-addressable blocks. Although it is treated as 24 bits wide, it is more appropriate to think of each address of the program memory as a lower and upper word, with the upper byte of the upper word being unimplemented. The lower word always has an even address, while the upper word has an odd address (Figure 4-2). Program memory addresses are always word-aligned on the lower word, and addresses are incremented or decremented by two during code execution. This arrangement provides compatibility with data memory space addressing and makes data in the program memory space accessible. All dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 devices reserve the addresses between 0x00000 and 0x000200 for hard-coded program execution vectors. A hardware Reset vector is provided to redirect code execution from the default value of the PC on device Reset to the actual start of code. A GOTO instruction is programmed by the user application at 0x000000, with the actual address for the start of code at 0x000002. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices also have two interrupt vector tables, located from 0x000004 to 0x0000FF and 0x000100 to 0x0001FF. These vector tables allow each of the device interrupt sources to be handled by separate Interrupt Service Routines (ISRs). A more detailed discussion of the interrupt vector tables is provided in Section 7.1 “Interrupt Vector Table”. FIGURE 4-2: msw Address 0x000001 0x000003 0x000005 0x000007 PROGRAM MEMORY ORGANIZATION most significant word 23 00000000 00000000 00000000 00000000 Program Memory ‘Phantom’ Byte (read as ‘0’) Instruction Width 16 least significant word 8 0 0x000000 0x000002 0x000004 0x000006 PC Address (lsw Address) DS70291E-page 40 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.2 Data Address Space All word accesses must be aligned to an even address. Misaligned word data fetches are not supported, so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. If a misaligned read or write is attempted, an address error trap is generated. If the error occurred on a read, the instruction underway is completed. If the error occurred on a write, the instruction is executed but the write does not occur. In either case, a trap is then executed, allowing the system and/or user application to examine the machine state prior to execution of the address Fault. All byte loads into any W register are loaded into the Least Significant Byte. The Most Significant Byte is not modified. A sign-extend instruction (SE) is provided to allow user applications to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, user applications can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 CPU has a separate 16 bit wide data memory space. The data space is accessed using separate Address Generation Units (AGUs) for read and write operations. The data memory maps is shown in Figure 4-4. All Effective Addresses (EAs) in the data memory space are 16 bits wide and point to bytes within the data space. This arrangement gives a data space address range of 64 Kbytes or 32K words. The lower half of the data memory space (that is, when EA = 0) is used for implemented memory addresses, while the upper half (EA = 1) is reserved for the Program Space Visibility area (see Section 4.6.3 “Reading Data from Program Memory Using Program Space Visibility”). dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices implement up to 16 Kbytes of data memory. Should an EA point to a location outside of this area, an all-zero word or byte is returned. 4.2.1 DATA SPACE WIDTH 4.2.3 SFR SPACE The data memory space is organized in byte addressable, 16-bit wide blocks. Data is aligned in data memory and registers as 16-bit words, but all data space EAs resolve to bytes. The Least Significant Bytes (LSBs) of each word have even addresses, while the Most Significant Bytes (MSBs) have odd addresses. The first 2 Kbytes of the Near Data Space, from 0x0000 to 0x07FF, is primarily occupied by Special Function Registers (SFRs). These are used by the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 core and peripheral modules for controlling the operation of the device. SFRs are distributed among the modules that they control, and are generally grouped together by module. Much of the SFR space contains unused addresses; these are read as ‘0’. Note: The actual set of peripheral features and interrupts varies by the device. Refer to the corresponding device tables and pinout diagrams for device-specific information. 4.2.2 DATA MEMORY ORGANIZATION AND ALIGNMENT To maintain backward compatibility with PIC® MCU devices and improve data space memory usage efficiency, the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 instruction set supports both word and byte operations. As a consequence of byte accessibility, all effective address calculations are internally scaled to step through word-aligned memory. For example, the core recognizes that Post-Modified Register Indirect Addressing mode [Ws++] results in a value of Ws + 1 for byte operations and Ws + 2 for word operations. A data byte read, reads the complete word that contains the byte, using the LSB of any EA to determine which byte to select. The selected byte is placed onto the LSB of the data path. That is, data memory and registers are organized as two parallel byte-wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register that matches the byte address. 4.2.4 NEAR DATA SPACE The 8 Kbyte area between 0x0000 and 0x1FFF is referred to as the near data space. Locations in this space are directly addressable via a 13-bit absolute address field within all memory direct instructions. Additionally, the whole data space is addressable using MOV instructions, which support Memory Direct Addressing mode with a 16-bit address field, or by using Indirect Addressing mode using a working register as an address pointer. © 2011 Microchip Technology Inc. DS70291E-page 41 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 4-3: DATA MEMORY MAP FOR dsPIC33FJ32MC302/304 DEVICES WITH 4 KB RAM MSb Address MSb 2 Kbyte SFR Space 0x0000 SFR Space 0x07FF 0x0801 X Data RAM (X) 0x0FFF 0x1001 4 Kbyte SRAM Space 0x13FF 0x1401 DMA RAM 0x17FF 0x1801 Y Data RAM (Y) 0x13FE 0x1400 0x17FE 0x1800 0x0FFE 0x1000 6 Kbyte Near Data Space 0x07FE 0x0800 LSb Address LSb 0x0000 16 bits 0x8001 0x8000 Optionally Mapped into Program Memory X Data Unimplemented (X) 0xFFFF 0xFFFE DS70291E-page 42 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 4-4: DATA MEMORY MAP FOR dsPIC33FJ128MC202/204 AND dsPIC33FJ64MC202/ 204 DEVICES WITH 8 KB RAM MSb Address MSb 2 Kbyte SFR Space 0x0001 SFR Space 0x07FF 0x0801 X Data RAM (X) 8 Kbyte SRAM Space 0x17FF 0x1801 Y Data RAM (Y) 0x1FFF 0x2001 0x27FF 0x2801 DMA RAM 0x1FFE 0x2000 0x27FE 0x2800 0x17FE 0x1800 0x07FE 0x0800 8 Kbyte Near Data Space LSb Address LSb 0x0000 16 bits 0x8001 0x8000 Optionally Mapped into Program Memory X Data Unimplemented (X) 0xFFFF 0xFFFE © 2011 Microchip Technology Inc. DS70291E-page 43 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 4-5: DATA MEMORY MAP FOR dsPIC33FJ128MC802/804 AND dsPIC33FJ64MC802/ 804 DEVICES WITH 16 KB RAM MSb Address MSb 2 Kbyte SFR Space 0x0001 SFR Space 0x07FF 0x0801 X Data RAM (X) 0x1FFF 16 Kbyte SRAM Space 0x27FF 0x2801 Y Data RAM (Y) 0x3FFF 0x4001 0x47FF 0x4801 DMA RAM 0x3FFE 0x4000 0x47FE 0x4800 0x1FFE 0x27FE 0x2800 0x07FE 0x0800 8 Kbyte Near Data Space LSb Address LSb 0x0000 16 bits 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFF 0xFFFE DS70291E-page 44 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.2.5 X AND Y DATA SPACES 4.2.6 DMA RAM The core has two data spaces, X and Y. These data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. This feature allows certain instructions to concurrently fetch two words from RAM, thereby enabling efficient execution of DSP algorithms such as Finite Impulse Response (FIR) filtering and Fast Fourier Transform (FFT). The X data space is used by all instructions and supports all addressing modes. X data space has separate read and write data buses. The X read data bus is the read data path for all instructions that view data space as combined X and Y address space. It is also the X data prefetch path for the dual operand DSP instructions (MAC class). The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. Both the X and Y data spaces support Modulo Addressing mode for all instructions, subject to addressing mode restrictions. Bit-Reversed Addressing mode is only supported for writes to X data space. All data memory writes, including in DSP instructions, view data space as combined X and Y address space. The boundary between the X and Y data spaces is device-dependent and is not user-programmable. All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes, or 32K words, though the implemented memory locations vary by device. Every dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 device contains up to 2 Kbytes of dual ported DMA RAM located at the end of Y data space, and is a part of Y data space. Memory locations in the DMA RAM space are accessible simultaneously by the CPU and the DMA controller module. DMA RAM is utilized by the DMA controller to store data to be transferred to various peripherals using DMA, as well as data transferred from various peripherals using DMA. The DMA RAM can be accessed by the DMA controller without having to steal cycles from the CPU. When the CPU and the DMA controller attempt to concurrently write to the same DMA RAM location, the hardware ensures that the CPU is given precedence in accessing the DMA RAM location. Therefore, the DMA RAM provides a reliable means of transferring DMA data without ever having to stall the CPU. Note: DMA RAM can be used for general purpose data storage if the DMA function is not required in an application. © 2011 Microchip Technology Inc. DS70291E-page 45 DS70291E-page 46 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-1: SFR Name WREG0 WREG1 WREG2 WREG3 WREG4 WREG5 WREG6 WREG7 WREG8 WREG9 WREG10 WREG11 WREG12 WREG13 WREG14 WREG15 SPLIM ACCAL ACCAH ACCAU ACCBL ACCBH ACCBU PCL PCH TBLPAG PSVPAG RCOUNT DCOUNT DOSTARTL DOSTARTH DOENDL DOENDH SR CORCON MODCON Legend: SFR Addr 0000 0002 0004 0006 0008 000A 000C 000E 0010 0012 0014 0016 0018 001A 001C 001E 0020 0022 0024 0026 0028 002A 002C 002E 0030 0032 0034 0036 0038 003A 003C 003E 0040 0042 0044 0046 CPU CORE REGISTERS MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0800 xxxx xxxx xxxx ACCAU ACCBL ACCBH ACCB Program Counter Low Word Register — — — — — — — — — — — — — — — — — — — — — — — — DCOUNT DOSTARTL — — OA — XMODEN — — OB — YMODEN — — SA — — — — SB US — — — OAB EDT — — SAB — — DA DL BWM — — DC — — IPL2 SATA — — IPL1 SATB IPL0 SATDW RA ACCSAT DOSTARTH 0 DOENDH N IPL3 OV PSV Z RND C IF DOENDL 0 Program Counter High Byte Register Table Page Address Pointer Register Program Memory Visibility Page Address Pointer Register ACCBU xxxx xxxx xxxx xxxx xxxx 0000 0000 0000 xxxx xxxx xxxx 00xx xxxx 00xx 0000 0020 0000 Working Register 0 Working Register 1 Working Register 2 Working Register 3 Working Register 4 Working Register 5 Working Register 6 Working Register 7 Working Register 8 Working Register 9 Working Register 10 Working Register 11 Working Register 12 Working Register 13 Working Register 14 Working Register 15 Stack Pointer Limit Register ACCAL ACCAH ACCA Repeat Loop Counter Register YWM XWM x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-1: SFR Name XMODSRT XMODEND YMODSRT YMODEND XBREV DISICNT Legend: SFR Addr 0048 004A 004C 004E 0050 0052 CPU CORE REGISTERS MAP (CONTINUED) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 XS XE YS YE BREN — — XB Disable Interrupts Counter Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 1 0 1 All Resets xxxx xxxx xxxx xxxx xxxx xxxx © 2011 Microchip Technology Inc. DS70291E-page 47 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. DS70291E-page 48 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-2: SFR Name CNEN1 CNEN2 CNPU1 CNPU2 Legend: SFR Addr 0060 0062 0068 006A CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ128MC202/802, dsPIC33FJ64MC202/802 AND dsPIC33FJ32MC302 Bit 15 CN15IE — Bit 14 CN14IE CN30IE Bit 13 CN13IE CN29IE Bit 12 CN12IE — Bit 11 CN11IE CN27IE Bit 10 — — — — Bit 9 — — — — Bit 8 — CN24IE — Bit 7 CN7IE CN23IE CN7PUE Bit 6 CN6IE CN22IE CN6PUE Bit 5 CN5IE CN21IE CN5PUE Bit 4 CN4IE — CN4PUE — Bit 3 CN3IE — CN3PUE — Bit 2 CN2IE — CN2PUE — Bit 1 CN1IE — CN1PUE — Bit 0 CN0IE CN16IE CN0PUE CN16PUE All Resets 0000 0000 0000 0000 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE — CN30PUE CN29PUE — CN27PUE CN24PUE CN23PUE CN22PUE CN21PUE x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-3: SFR Name CNEN1 CNEN2 CNPU1 SFR Addr 0060 0062 0068 CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ128MC204/804, dsPIC33FJ64MC204/804 AND dsPIC33FJ32MC304 Bit 15 CN15IE — Bit 14 CN14IE CN30IE Bit 13 CN13IE CN29IE Bit 12 CN12IE CN28IE Bit 11 CN11IE CN27IE Bit 10 CN10IE CN26IE Bit 9 CN9IE CN25IE CN9PUE Bit 8 CN8IE CN24IE CN8PUE Bit 7 CN7IE CN23IE CN7PUE Bit 6 CN6IE CN22IE CN6PUE Bit 5 CN5IE CN21IE CN5PUE Bit 4 CN4IE CN20IE CN4PUE Bit 3 CN3IE CN19IE CN3PUE Bit 2 CN2IE CN18IE CN2PUE Bit 1 CN1IE CN17IE CN1PUE Bit 0 CN0IE CN16IE CN0PUE All Resets 0000 0000 0000 0000 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE — CNPU2 006A Legend: CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. © 2011 Microchip Technology Inc. DS70291E-page 49 TABLE 4-4: SFR Name INTCON1 INTCON2 IFS0 IFS1 IFS2 IFS3 IFS4 IEC0 IEC1 IEC2 IEC3 IEC4 IPC0 IPC1 IPC2 IPC3 IPC4 IPC5 IPC6 IPC7 IPC8 IPC9 IPC11 IPC14 IPC15 IPC16 IPC17 IPC18 IPC19 SFR Addr 0080 0082 0084 0086 0088 008A INTERRUPT CONTROLLER REGISTER MAP Bit 15 NSTDIS ALTIVT — U2TXIF — FLTA1IF Bit 14 OVAERR DISI DMA1IF U2RXIF DMA4IF RTCIF Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 OVBTE — SPI1EIF OC3IF — PWM1IF Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 — INT0EP INT0IF All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 4444 4444 4444 0444 4444 4404 4444 4444 4444 0004 — — — — 0440 0440 4440 4440 0444 — — 4440 4400 4444 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 OVBERR COVAERR COVBERR OVATE — AD1IF INT2IF PMPIF DMA5IF — AD1IE INT2IE PMPIE DMA5IE — T1IP T2IP U1RXIP — U1TXIF T5IF — — — U1TXIE T5IE — — — — U1RXIF T4IF — — QEI2IF U1RXIE T4IE — — QEI2IE — — — — — — — — — — — — — — — — — — — — — — — — — SPI1IF OC4IF — QEI1IF COVTE SFTACERR DIV0ERR DMACERR MATHERR ADDRERR STKERR OSCFAIL — T3IF DMA2IF — — — T3IE DMA2IE — — — — T2IF IC8IF — — — T2IE IC8IE — — — — — — — — — — — — — — — — — — — — — — — — — — OC2IF IC7IF — — C1TXIF(1) OC2IE IC7IE — — C1TXIE(1) — IC2IF — — — DMA7IF IC2IE — — — DMA7IE IC1IP IC2IP SPI1EIP AD1IP MI2C1IP — OC3IP INT2IP SPI2IP — PMPIP PWM1IP DMA5IP U1EIP DMA7IP PWM2IP — — — — — DMA0IF INT1IF DMA3IF — DMA6IF DMA0IE INT1IE DMA3IE — DMA6IE — T1IF CNIF C1IF(1) — CRCIF T1IE CNIE C1IE(1) — CRCIE — — — — — — — — — — — — — — — — — VECNUM — — — — — — INT2EP OC1IF CMIF C1RXIF(1) — U2EIF OC1IE CMIE C1RXIE(1) — U2EIE INT1EP IC1IF MI2C1IF SI2C1IF SPI2IF — U1EIF IC1IE SPI2EIF — — INT0IE 008C DAC1LIF(2) DAC1RIF(2) 0094 0096 0098 009A — U2TXIE — FLTA1IE DMA1IE U2RXIE DMA4IE RTCIE FLTA2IF PWM2IF SPI1IE OC4IE — QEI1IE SPI1EIE OC3IE — PWM1IE MI2C1IE SI2C1IE SPI2IE — U1EIE INT0IP DMA0IP T3IP U1TXIP SI2C1IP INT1IP DMA2IP T5IP SPI2EIP DMA3IP — — — — DMA6IP — — SPI2EIE — — 009C DAC1LIE(2) DAC1RIE(2) 00A4 00A6 00A8 00AA 00AC 00AE 00B0 00B2 00B4 00B6 00BA 00C0 00C2 00C4 00C6 00C8 00CA — — — — — — — — — — — — — — — — — — — — — — — — FLTA2IE PWM2IE OC1IP OC2IP SPI1IP DMA1IP CMIP IC7IP OC4IP U2RXIP C1RXIP(1) — DMA4IP QEI1IP RTCIP U2EIP C1TXIP(1) FLTA2IP DAC1RIP(2) ILR — CNIP IC8IP T4IP U2TXIP C1IP(1) — — — FLTA1IP CRCIP — QEI2IP DAC1LIP(2) — INTTREG 00E0 Legend: Note 1: 2: x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. Interrupts disabled on devices without ECAN™ modules. Interrupts disabled on devices without a DAC module. DS70291E-page 50 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-5: SFR Name TMR1 PR1 T1CON TMR2 TMR3HLD TMR3 PR2 PR3 T2CON T3CON TMR4 TMR5HLD TMR5 PR4 PR5 T4CON T5CON Legend: SFR Addr 0100 0102 0104 0106 0108 010A 010C 010E 0110 0112 0114 0116 0118 011A 011C 011E 0120 TIMER REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 FFFF TGATE TCKPS — TSYNC TCS — 0000 0000 xxxx 0000 FFFF FFFF TGATE TGATE TCKPS TCKPS T32 — — — TCS TCS — — 0000 0000 0000 xxxx 0000 FFFF FFFF TGATE TGATE TCKPS TCKPS T32 — — — TCS TCS — — 0000 0000 Timer1 Register Period Register 1 TON — TSIDL — — — — — — Timer2 Register Timer3 Holding Register (for 32-bit timer operations only) Timer3 Register Period Register 2 Period Register 3 TON TON — — TSIDL TSIDL — — — — — — — — — — — — Timer4 Register Timer5 Holding Register (for 32-bit timer operations only) Timer5 Register Period Register 4 Period Register 5 TON TON — — TSIDL TSIDL — — — — — — — — — — — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-6: SFR Name IC1BUF IC1CON IC2BUF IC2CON IC7BUF IC7CON IC8BUF IC8CON Legend: SFR Addr 0140 0142 0144 0146 0158 015A 015C 015E INPUT CAPTURE REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx ICI ICOV ICBNE ICM 0000 xxxx ICI ICOV ICBNE ICM 0000 xxxx ICI ICOV ICBNE ICM 0000 xxxx ICI ICOV ICBNE ICM 0000 Input 1 Capture Register — — ICSIDL — — — — — ICTMR Input 2 Capture Register — — ICSIDL — — — — — ICTMR Input 7 Capture Register — — ICSIDL — — — — — ICTMR Input 8Capture Register — — ICSIDL — — — — — ICTMR x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. © 2011 Microchip Technology Inc. DS70291E-page 51 TABLE 4-7: SFR Name OC1RS OC1R OC1CON OC2RS OC2R OC2CON OC3RS OC3R OC3CON OC4RS OC4R OC4CON Legend: SFR Addr 0180 0182 0184 0186 0188 018A 018C 018E 0190 0192 0194 0196 OUTPUT COMPARE REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx xxxx — OCFLT OCTSEL OCM 0000 xxxx xxxx — OCFLT OCTSEL OCM 0000 xxxx xxxx — OCFLT OCTSEL OCM 0000 xxxx xxxx — OCFLT OCTSEL OCM 0000 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Output Compare 1 Secondary Register Output Compare 1 Register — — OCSIDL — — — — — — — Output Compare 2 Secondary Register Output Compare 2 Register — — OCSIDL — — — — — — — Output Compare 3 Secondary Register Output Compare 3 Register — — OCSIDL — — — — — — — Output Compare 4 Secondary Register Output Compare 4 Register — — OCSIDL — — — — — — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-8: SFR Name P1TCON P1TMR P1TPER P1SECMP PWM1CON1 PWM1CON2 P1DTCON1 P1DTCON2 P1FLTACON P1OVDCON P1DC1 P1DC2 P1DC3 Legend: SFR Addr 01C0 01C2 01C4 01C6 01C8 01CA 01CC 01CE 01D0 01D4 01D6 01D8 01DA 6-OUTPUT PWM1 REGISTER MAP Bit 15 PTEN PTDIR — SEVTDIR — — — — — — — — — PMOD3 PMOD2 Bit 14 — Bit 13 PTSIDL Bit 12 — Bit 11 — Bit 10 — Bit 9 — Bit 8 — Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 0000 0000 0000 PEN1H — — — PEN3L IUE PEN2L OSYNC PEN1L UDIS 00FF 0000 0000 DTS1A FAEN2 POUT1H DTS1I FAEN1 POUT1L 0000 0000 FF00 0000 0000 0000 PTOPS PTCKPS PTMOD PWM Timer Count Value Register PWM Time Base Period Register PWM Special Event Compare Register PMOD1 — — PEN3H — PEN2H — SEVOPS DTB DTBPS — — — — — — — FAOV3H — FAOV3L — DTAPS — FAOV1H POVD1H — FAOV1L POVD1L — FLTAM — — — — DTS3A — POUT3H DTS3I — POUT3L DTA DTS2A — POUT2H DTS2I FAEN3 POUT2L — FAOV2L POVD2L FAOV2H POVD3H POVD3L POVD2H PWM Duty Cycle #1 Register PWM Duty Cycle #2 Register PWM Duty Cycle #3 Register u = uninitialized bit, — = unimplemented, read as ‘0’ DS70291E-page 52 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-9: SFR Name P2TCON P2TMR P2TPER P2SECMP PWM2CON1 PWM2CON2 P2DTCON1 P2DTCON2 P2FLTACON P2OVDCON P2DC1 Legend: Addr. 05C0 05C2 05C4 05C6 05C8 05CA 05CC 05CE 05D0 05D4 05D6 2-OUTPUT PWM2 REGISTER MAP Bit 15 PTEN PTDIR — SEVTDIR — — — — — — — — — — — Bit 14 — Bit 13 PTSIDL Bit 12 — Bit 11 — Bit 10 — Bit 9 — Bit 8 — Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 0000 0000 0000 — — PEN1H — — — — IUE DTA — — — — — — — — — — — — DTS1A — POUT1H DTS1I FAEN1 POUT1L — OSYNC PEN1L UDIS 00FF 0000 0000 0000 0000 FF00 0000 PTOPS PTCKPS PTMOD PWM Timer Count Value Register PWM Time Base Period Register PWM Special Event Compare Register PMOD1 — — — — SEVOPS DTB DTBPS — — — — — — — — — — — — DTAPS — FAOV1H — FAOV1L — FLTAM — — — — — — — — — — POVD1H POVD1L PWM Duty Cycle #1 Register u = uninitialized bit, — = unimplemented, read as ‘0’ TABLE 4-10: SFR Name QEI1CON DFLT1CON POS1CNT MAX1CNT Legend: Addr. 01E0 01E2 01E4 01E6 QEI1 REGISTER MAP Bit 15 CNTERR — Bit 14 — — Bit 13 QEISIDL — Bit 12 INDX — Bit 11 UPDN — Bit 10 Bit 9 Bit 8 Bit 7 SWPAB CEID QEOUT Bit 6 PCDOUT Bit 5 TQGATE QECK Bit 4 Bit 3 Bit 2 POSRES — Bit 1 TQCS — Bit 0 UPDN_SRC — Reset State 0000 0000 0000 FFFF QEIM IMV TQCKPS — Position Counter Maximum Count u = uninitialized bit, — = unimplemented, read as ‘0’ TABLE 4-11: SFR Name QEI2CON DFLT2CON POS2CNT MAX2CNT Legend: Addr. 01F0 01F2 01F4 01F6 QEI2 REGISTER MAP Bit 15 CNTERR — Bit 14 — — Bit 13 QEISIDL — Bit 12 INDX — Bit 11 UPDN — Bit 10 Bit 9 Bit 8 Bit 7 SWPAB CEID QEOUT Bit 6 PCDOUT Bit 5 TQGATE QECK Bit 4 Bit 3 Bit 2 POSRES — Bit 1 TQCS — Bit 0 UPDN_SRC — Reset State 0000 0000 0000 FFFF QEIM IMV TQCKPS — Position Counter Maximum Count u = uninitialized bit, — = unimplemented, read as ‘0’ TABLE 4-12: SFR Name I2C1RCV I2C1TRN I2C1BRG I2C1CON I2C1STAT I2C1ADD I2C1MSK Legend: SFR Addr 0200 0202 0204 0206 0208 020A 020C I2C1 REGISTER MAP © 2011 Microchip Technology Inc. DS70291E-page 53 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Bit 15 — — — I2CEN ACKSTAT — — Bit 14 — — — — TRSTAT — — Bit 13 — — — I2CSIDL — — — Bit 12 — — — SCLREL — — — Bit 11 — — — IPMIEN — — — Bit 10 — — — A10M BCL — — Bit 9 — — — DISSLW GCSTAT Bit 8 — — Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 00FF 0000 Receive Register Transmit Register Baud Rate Generator Register SMEN ADD10 GCEN IWCOL STREN I2COV ACKDT D_A ACKEN P RCEN S PEN R_W RSEN RBF SEN TBF 1000 0000 0000 0000 Address Register Address Mask Register x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-13: SFR Name U1MODE U1STA U1TXREG U1RXREG U1BRG Legend: SFR Addr 0220 0222 0224 0226 0228 UART1 REGISTER MAP Bit 15 UARTEN UTXISEL1 — — Bit 14 — UTXINV — — Bit 13 USIDL UTXISEL0 — — Bit 12 IREN — — — Bit 11 RTSMD UTXBRK — — Bit 10 — UTXEN — — Bit 9 UEN1 UTXBF — — Bit 8 UEN0 TRMT UTX8 URX8 Baud Rate Generator Prescaler Bit 7 WAKE Bit 6 LPBACK Bit 5 ABAUD ADDEN Bit 4 URXINV RIDLE Bit 3 BRGH PERR Bit 2 Bit 1 Bit 0 STSEL URXDA All Resets 0000 0110 xxxx 0000 0000 PDSEL FERR OERR URXISEL UART Transmit Register UART Received Register x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-14: SFR Name U2MODE U2STA U2TXREG U2RXREG U2BRG Legend: SFR Addr 0230 0232 0234 0236 0238 UART2 REGISTER MAP Bit 15 UARTEN UTXISEL1 — — Bit 14 — UTXINV — — Bit 13 USIDL UTXISEL0 — — Bit 12 IREN — — — Bit 11 RTSMD UTXBRK — — Bit 10 — UTXEN — — Bit 9 UEN1 UTXBF — — Bit 8 UEN0 TRMT UTX8 URX8 Baud Rate Generator Prescaler Bit 7 WAKE Bit 6 LPBACK Bit 5 ABAUD ADDEN Bit 4 URXINV RIDLE Bit 3 BRGH PERR Bit 2 Bit 1 Bit 0 STSEL URXDA All Resets 0000 0110 xxxx 0000 0000 PDSEL FERR OERR URXISEL UART Transmit Register UART Receive Register x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. DS70291E-page 54 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-15: SFR Name SPI1STAT SPI1CON1 SPI1CON2 SPI1BUF Legend: SFR Addr 0240 0242 0244 0248 SPI1 REGISTER MAP Bit 15 SPIEN — FRMEN Bit 14 — — SPIFSD Bit 13 SPISIDL — FRMPOL Bit 12 — DISSCK — Bit 11 — Bit 10 — Bit 9 — SMP — Bit 8 — CKE — Bit 7 — SSEN — Bit 6 SPIROV CKP — Bit 5 — MSTEN — — Bit 4 — Bit 3 — SPRE — — Bit 2 — Bit 1 SPITBF Bit 0 SPIRBF All Resets 0000 0000 0000 0000 DISSDO MODE16 — — PPRE FRMDLY — SPI1 Transmit and Receive Buffer Register x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-16: SFR Name SPI2STAT SPI2CON1 SPI2CON2 SPI2BUF Legend: SFR Addr 0260 0262 0264 0268 SPI2 REGISTER MAP Bit 15 SPIEN — FRMEN Bit 14 — — SPIFSD Bit 13 SPISIDL — FRMPOL Bit 12 — DISSCK — Bit 11 — Bit 10 — Bit 9 — SMP — Bit 8 — CKE — Bit 7 — SSEN — Bit 6 SPIROV CKP — Bit 5 — MSTEN — — Bit 4 — Bit 3 — SPRE — — Bit 2 — Bit 1 SPITBF Bit 0 SPIRBF All Resets 0000 0000 0000 0000 DISSDO MODE16 — — PPRE FRMDLY — SPI2 Transmit and Receive Buffer Register x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-17: File Name ADC1BUF0 AD1CON1 AD1CON2 AD1CON3 AD1CHS123 AD1CHS0 AD1PCFGL AD1CSSL AD1CON4 Legend: Addr 0300 0320 0322 0324 0326 0328 032C 0330 0332 ADC1 REGISTER MAP FOR dsPIC33FJ64MC202/802, dsPIC33FJ128MC202/802 AND dsPIC33FJ32MC302 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx SSRC BUFS — — SIMSAM ASAM SAMP BUFM DONE ALTS 0000 0000 0000 CH123NA CH0SA PCFG4 CSS4 — PCFG3 CSS3 — PCFG2 CSS2 PCFG1 CSS1 DMABL PCFG0 CSS0 CH123SA 0000 0000 0000 0000 0000 ADC Data Buffer 0 ADON — VCFG ADRC — CH0NB — — — — — — — — — — — — — — — — — — — — — — — ADSIDL ADDMABM — — — AD12B CSCNA SAMC CH123NB CH0SB — — — — — — — — — CH123SB — CH0NA — — — — — — — — — — PCFG5 CSS5 — FORM CHPS SMPI ADCS — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. © 2011 Microchip Technology Inc. DS70291E-page 55 TABLE 4-18: File Name ADC1BUF0 AD1CON1 AD1CON2 AD1CON3 AD1CHS123 AD1CHS0 AD1PCFGL AD1CSSL AD1CON4 Legend: Addr 0300 0320 0322 0324 0326 0328 032C 0330 0332 ADC1 REGISTER MAP FOR dsPIC33FJ64MC204/804, dsPIC33FJ128MC204/804 AND dsPIC33FJ32MC304 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx SSRC BUFS — — SIMSAM ASAM SAMP BUFM DONE ALTS 0000 0000 0000 CH123NA CH0SA PCFG4 CSS4 — PCFG3 CSS3 — PCFG2 CSS2 PCFG1 CSS1 DMABL PCFG0 CSS0 CH123SA 0000 0000 0000 0000 0000 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 ADC Data Buffer 0 ADON — VCFG ADRC — CH0NB — — — — — — — — — — — — — — — — — — — — — — — ADSIDL ADDMABM — — — AD12B CSCNA SAMC CH123NB CH0SB — — — — — — PCFG8 CSS8 — CH123SB — CH0NA PCFG7 CSS7 — — — PCFG6 CSS6 — — — PCFG5 CSS5 — FORM CHPS SMPI ADCS — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-19: SFR Name DAC1CON DAC1STAT DAC1DFLT DAC1RDAT DAC1LDAT Legend: SFR Addr 03F0 03F2 03F4 03F6 03F8 DAC1 REGISTER MAP FOR dsPIC33FJ128MC804 AND dsPIC33FJ64MC804 Bit 15 DACEN LOEN Bit 14 — — Bit 13 DACSIDL LMVOEN Bit 12 AMPON — Bit 11 — — Bit 10 — LITYPE Bit 9 — LFULL Bit 8 FORM LEMPTY Bit 7 — ROEN — RMVOEN — Bit 6 Bit 5 Bit 4 Bit 3 DACFDIV — RITYPE RFULL REMPTY Bit 2 Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 DAC1DFLT DAC1RDAT DAC1LDAT x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. DS70291E-page 56 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-20: File Name DMA0CON DMA0REQ DMA0STA DMA0STB DMA0PAD DMA0CNT DMA1CON DMA1REQ DMA1STA DMA1STB DMA1PAD DMA1CNT DMA2CON DMA2REQ DMA2STA DMA2STB DMA2PAD DMA2CNT DMA3CON DMA3REQ DMA3STA DMA3STB DMA3PAD DMA3CNT DMA4CON DMA4REQ DMA4STA DMA4STB DMA4PAD DMA4CNT DMA5CON DMA5REQ DMA5STA DMA5STB Legend: Addr 0380 0382 0384 0386 0388 038A 038C 038E 0390 0392 0394 0396 0398 039A 039C 039E 03A0 03A2 03A4 03A6 03A8 03AA 03AC 03AE 03B0 03B2 03B4 03B6 03B8 03BA 03BC 03BE 03C0 03C2 DMA REGISTER MAP Bit 15 CHEN FORCE Bit 14 SIZE — Bit 13 DIR — Bit 12 HALF — Bit 11 NULLW — Bit 10 — — Bit 9 — — Bit 8 — — Bit 7 — — STA STB PAD — CHEN FORCE — SIZE — — DIR — — HALF — — NULLW — — — — — — — — — — STA STB PAD — CHEN FORCE — SIZE — — DIR — — HALF — — NULLW — — — — — — — — — — STA STB PAD — CHEN FORCE — SIZE — — DIR — — HALF — — NULLW — — — — — — — — — — STA STB PAD — CHEN FORCE — SIZE — — DIR — — HALF — — NULLW — — — — — — — — — — STA STB PAD — CHEN FORCE — SIZE — — DIR — — HALF — — NULLW — — — — — — — — — — STA STB — CNT AMODE — IRQSEL — MODE — CNT AMODE — IRQSEL — MODE — CNT AMODE — IRQSEL — MODE — CNT AMODE — IRQSEL — MODE — CNT AMODE — IRQSEL — MODE Bit 6 — Bit 5 Bit 4 Bit 3 — IRQSEL Bit 2 — Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 AMODE MODE — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-20: File Name DMA5PAD DMA5CNT DMA6CON DMA6REQ DMA6STA DMA6STB DMA6PAD DMA6CNT DMA7CON DMA7REQ DMA7STA DMA7STB DMA7PAD DMA7CNT DMACS0 DMACS1 DSADR Legend: Addr 03C4 03C6 03C8 03CA 03CC 03CE 03D0 03D2 03D4 03D6 03D8 03DA 03DC 03DE 03E0 03E2 03E4 DMA REGISTER MAP (CONTINUED) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 PAD — CHEN FORCE — SIZE — — DIR — — HALF — — NULLW — — — — — — — — — — STA STB PAD — CHEN FORCE — SIZE — — DIR — — HALF — — NULLW — — — — — — — — — — STA STB PAD — — — — — — XWCOL7 PPST7 DSADR XWCOL6 PPST6 CNT XWCOL5 PPST5 XWCOL4 PPST4 XWCOL3 PPST3 XWCOL2 PPST2 XWCOL1 PPST1 XWCOL0 PPST0 — CNT AMODE — IRQSEL — MODE — CNT AMODE — IRQSEL — MODE Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 © 2011 Microchip Technology Inc. DS70291E-page 57 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 PWCOL7 PWCOL6 PWCOL5 PWCOL4 PWCOL3 PWCOL2 PWCOL1 PWCOL0 — — — — LSTCH — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. DS70291E-page 58 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-21: File Name C1CTRL1 C1CTRL2 C1VEC C1FCTRL C1FIFO C1INTF C1INTE C1EC C1CFG1 C1CFG2 C1FEN1 C1FMSKSEL1 C1FMSKSEL2 Legend: ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 0 OR 1 (FOR dsPIC33FJ128MC802/804 AND dsPIC33FJ64MC802/804) Bit 15 — — — Bit 14 — — — DMABS — — — — — — TXBO — TXBP — Bit 13 CSIDL — — — — FBP RXBP — TXWAR — RXWAR — EWARN — Bit 12 ABAT — Bit 11 — — — FILHIT — — — Bit 10 Bit 9 REQOP — — — — — — IVRIF IVRIE — — WAKIF WAKIE ERRIF ERRIE — — — Bit 8 Bit 7 Bit 6 OPMODE — — Bit 5 Bit 4 — Bit 3 CANCAP Bit 2 — Bit 1 — Bit 0 WIN All Resets 0480 0000 0000 0000 0000 RBIF RBIE TBIF TBIE 0000 0000 0000 0000 PRSEG FLTEN2 FLTEN1 FLTEN0 0000 FFFF 0000 0000 Addr 0400 0402 0404 0406 0408 040A 040C 040E 0410 0412 0414 0418 041A DNCNT ICODE FSA FNRB FIFOIF FIFOIE RBOVIF RBOVIE TERRCNT — — FLTEN15 — WAKFIL FLTEN14 — — FLTEN13 — — FLTEN12 — — FLTEN11 — — SEG2PH FLTEN10 FLTEN9 FLTEN8 — SJW SEG2PHTS FLTEN7 SAM FLTEN6 RERRCNT BRP SEG1PH FLTEN5 FLTEN4 FLTEN3 F7MSK F15MSK F6MSK F14MSK F5MSK F13MSK F4MSK F12MSK F3MSK F11MSK F2MSK F10MSK F1MSK F9MSK F0MSK F8MSK — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-22: File Name Addr 0400041E C1RXFUL1 C1RXFUL2 C1RXOVF1 C1RXOVF2 0420 0422 0428 ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 0 (FOR dsPIC33FJ128MC802/804 AND dsPIC33FJ64MC802/804) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets See definition when WIN = x RXFUL15 RXFUL14 RXFUL13 RXFUL12 RXFUL11 RXFUL10 RXFUL9 RXFUL8 RXFUL7 RXFUL6 RXFUL5 RXFUL4 RXFUL3 RXFUL2 RXFUL1 RXFUL0 0000 0000 0000 0000 0000 0000 0000 0000 xxxx xxxx RXFUL31 RXFUL30 RXFUL29 RXFUL28 RXFUL27 RXFUL26 RXFUL25 RXFUL24 RXFUL23 RXFUL22 RXFUL21 RXFUL20 RXFUL19 RXFUL18 RXFUL17 RXFUL16 RXOVF15 RXOVF14 RXOVF13 RXOVF12 RXOVF11 RXOVF10 RXOVF9 RXOVF8 RXOVF7 RXOVF6 RXOVF5 RXOVF4 RXOVF3 RXOVF2 RXOVF1 RXOVF0 042A RXOVF31 RXOVF30 RXOVF29 RXOVF28 RXOVF27 RXOVF26 RXOVF25 RXOVF24 RXOVF23 RXOVF22 RXOVF21 RXOVF20 RXOVF19 RXOVF18 RXOVF17 RXOVF16 TXEN1 TXEN3 TXEN5 TXEN7 TXABT1 TXABT3 TXABT5 TXABT7 TXLARB1 TXLARB3 TXLARB5 TXLARB7 TXERR1 TXERR3 TXERR5 TXERR7 TXREQ1 TXREQ3 TXREQ5 TXREQ7 RTREN1 RTREN3 RTREN5 RTREN7 TX1PRI TX3PRI TX5PRI TX7PRI TXEN0 TXEN2 TXEN4 TXEN6 TXABT0 TXABT2 TXABT4 TXABT6 TXLARB0 TXLARB2 TXLARB4 TXLARB6 TXERR0 TXERR2 TXERR4 TXERR6 TXREQ0 TXREQ2 TXREQ4 TXREQ6 RTREN0 RTREN2 RTREN4 RTREN6 TX0PRI TX2PRI TX4PRI TX6PRI C1TR01CON 0430 C1TR23CON 0432 C1TR45CON 0434 C1TR67CON 0436 C1RXD C1TXD Legend: 0440 0442 Received Data Word Transmit Data Word x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. © 2011 Microchip Technology Inc. DS70291E-page 59 TABLE 4-23: File Name ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 1 (FOR dsPIC33FJ128MC802/804 AND dsPIC33FJ64MC802/804) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Addr 0400041E See definition when WIN = x F3BP F7BP F11BP F15BP SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID EID SID SID SID SID SID SID SID SID SID SID SID SID SID SID SID F2BP F6BP F10BP F14BP F1BP F5BP F9BP F13BP SID — MIDE F0BP F4BP F8BP F12BP — EID 0000 0000 0000 0000 xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx C1BUFPNT1 C1BUFPNT2 C1BUFPNT3 C1BUFPNT4 C1RXM0SID C1RXM0EID C1RXM1SID C1RXM1EID C1RXM2SID C1RXM2EID C1RXF0SID C1RXF0EID C1RXF1SID C1RXF1EID C1RXF2SID C1RXF2EID C1RXF3SID C1RXF3EID C1RXF4SID C1RXF4EID C1RXF5SID C1RXF5EID C1RXF6SID C1RXF6EID C1RXF7SID C1RXF7EID C1RXF8SID C1RXF8EID C1RXF9SID C1RXF9EID C1RXF10SID C1RXF10EID C1RXF11SID Legend: 0420 0422 0424 0426 0430 0432 0434 0436 0438 043A 0440 0442 0444 0446 0448 044A 044C 044E 0450 0452 0454 0456 0458 045A 045C 045E 0460 0462 0464 0466 0468 046A 046C EID — MIDE EID — MIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-23: File Name C1RXF11EID C1RXF12SID C1RXF12EID C1RXF13SID C1RXF13EID C1RXF14SID C1RXF14EID C1RXF15SID C1RXF15EID Legend: ECAN1 REGISTER MAP WHEN C1CTRL1.WIN = 1 (FOR dsPIC33FJ128MC802/804 AND dsPIC33FJ64MC802/804) (CONTINUED) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx — EID xxxx xxxx DS70291E-page 60 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Addr 046E 0470 0472 0474 0476 0478 047A 047C 047E EID SID EID SID EID SID EID SID EID SID SID SID SID EID — EXIDE EID — EXIDE EID — EXIDE EID — EXIDE EID x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. © 2011 Microchip Technology Inc. DS70291E-page 61 TABLE 4-24: File Name RPINR0 RPINR1 RPINR3 RPINR4 RPINR7 RPINR10 RPINR11 RPINR12 RPINR13 RPINR14 RPINR15 RPINR16 RPINR17 RPINR18 RPINR19 RPINR20 RPINR21 RPINR22 RPINR23 RPINR26(1) Legend: Note 1: Addr 0680 0682 0686 0688 068E 0694 0696 0698 069A 069C 069E 06A0 06A2 06A4 06A6 06A8 06AA 06AC 06AE 06B4 PERIPHERAL PIN SELECT INPUT REGISTER MAP Bit 15 Bit 14 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Bit 13 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Bit 12 Bit 11 Bit 10 INT1R — T3CKR T5CKR IC2R IC8R — — — QEB1R — QEB2R — U1CTSR U2CTSR SCK1R — SCK2R — — — — — — — — — — — — — — — — — — — — Bit 9 Bit 8 Bit 7 — — — — — — — — — — — — — — — — — — — — Bit 6 — — — — — — — — — — — — — — — — — — — — Bit 5 — — — — — — — — — — — — — — — — — — — — Bit 4 — Bit 3 — Bit 2 — INT2R T2CKR T4CKR IC1R IC7R OCFAR FLTA1R FLTA2R QEA1R INDX1R QEA2R INDX2R U1RXR U2RXR SDI1R SS1R SDI2R SS2R C1RXR Bit 1 — Bit 0 — All Resets 1F00 001F 1F1F 1F1F 1F1F 1F1F 001F 001F 001F 1F1F 001F 1F1F 001F 1F1F 1F1F 1F1F 001F 1F1F 001F 001F dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. This register is present for dsPIC33FJ128MC802/804 and dsPIC33FJ64MC802/804 devices only. DS70291E-page 62 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-25: File Name RPOR0 RPOR1 RPOR2 RPOR3 RPOR4 RPOR5 RPOR6 RPOR7 Legend: Addr 06C0 06C2 06C4 06C6 06C8 06CA 06CC PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ128MC202/802, dsPIC33FJ64MC202/802 AND dsPIC33FJ32MC302 Bit 15 — — — — — — — Bit 14 — — — — — — — Bit 13 — — — — — — — Bit 12 Bit 11 Bit 10 RP1R RP3R RP5R RP7R RP9R RP11R RP13R Bit 9 Bit 8 Bit 7 — — — — — — — Bit 6 — — — — — — — — Bit 5 — — — — — — — — Bit 4 Bit 3 Bit 2 RP0R RP2R RP4R RP6R RP8R RP10R RP12R RP14R Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 06CE — — — RP15R — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-26: File Name RPOR0 RPOR1 RPOR2 RPOR3 RPOR4 RPOR5 RPOR6 RPOR7 RPOR8 RPOR9 RPOR10 RPOR11 RPOR12 Legend: Addr 06C0 06C2 06C4 06C6 06C8 06CA 06CC 06CE 06D0 06D2 06D4 06D6 PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ128MC204/804, dsPIC33FJ64MC204/804 AND dsPIC33FJ32MC304 Bit 15 — — — — — — — — — — — — Bit 14 — — — — — — — — — — — — Bit 13 — — — — — — — — — — — — Bit 12 Bit 11 Bit 10 RP1R RP3R RP5R RP7R RP9R RP11R RP13R RP15R RP17R RP19R RP21R RP23R Bit 9 Bit 8 Bit 7 — — — — — — — — — — — — Bit 6 — — — — — — — — — — — — — Bit 5 — — — — — — — — — — — — — Bit 4 Bit 3 Bit 2 RP0R RP2R RP4R RP6R RP8R RP10R RP12R RP14R RP16R RP18R RP20R RP22R RP24R Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 06D8 — — — RP25R — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. © 2011 Microchip Technology Inc. DS70291E-page 63 TABLE 4-27: File Name PMCON PMMODE PMADDR PMDOUT1 PMDOUT2 PMDIN1 PMPDIN2 PMAEN PMSTAT Legend: 0606 0608 060A 060C 060E Addr 0600 0602 0604 PARALLEL MASTER/SLAVE PORT REGISTER MAP FOR dsPIC33FJ128MC202/802, dsPIC33FJ64MC202/802 AND dsPIC33FJ32MC302 Bit 15 PMPEN BUSY ADDR15 Bit 14 — Bit 13 PSIDL Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 CSF1 Bit 6 CSF0 Bit 5 ALP Bit 4 — Bit 3 CS1P Bit 2 BEP Bit 1 WRSP Bit 0 RDSP All Resets 0000 0000 0000 0000 0000 0000 0000 — — — — — OB3E — OB2E PTEN OB1E OB0E 0000 008F dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 ADRMUX INCM PTBEEN PTWREN PTRDEN MODE16 MODE IRQM CS1 WAITB ADDR WAITM WAITE Parallel Port Data Out Register 1 (Buffers 0 and 1) Parallel Port Data Out Register 2 (Buffers 2 and 3) Parallel Port Data In Register 1 (Buffers 0 and 1) Parallel Port Data In Register 2 (Buffers 2 and 3) — IBF PTEN14 IBOV — — — — — IB3F — IB2F — IB1F — IB0F — OBE — OBUF — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-28: File Name PMCON PMMODE PMADDR PMDOUT1 PMDOUT2 PMDIN1 PMPDIN2 PMAEN PMSTAT Legend: 0606 0608 060A 060C 060E Addr 0600 0602 0604 PARALLEL MASTER/SLAVE PORT REGISTER MAP FOR dsPIC33FJ128MC204/804, dsPIC33FJ64MC204/804 AND dsPIC33FJ32MC304 Bit 15 PMPEN BUSY ADDR15 Bit 14 — Bit 13 PSIDL Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 CSF1 Bit 6 CSF0 Bit 5 ALP Bit 4 — Bit 3 CS1P Bit 2 BEP Bit 1 WRSP Bit 0 RDSP All Resets 0000 0000 0000 0000 0000 0000 0000 0000 — OB3E OB2E OB1E OB0E 008F ADRMUX INCM PTBEEN PTWREN PTRDEN MODE16 MODE IRQM CS1 WAITB ADDR WAITM WAITE Parallel Port Data Out Register 1 (Buffers 0 and 1) Parallel Port Data Out Register 2 (Buffers 2 and 3) Parallel Port Data In Register 1 (Buffers 0 and 1) Parallel Port Data In Register 2 (Buffers 2 and 3) — IBF PTEN14 IBOV — — — — — IB3F IB2F IB1F IB0F OBE OBUF PTEN — — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. DS70291E-page 64 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-29: File Name ALRMVAL ALCFGRPT RTCVAL RCFGCAL PADCFG1 Legend: Addr 0620 0622 0624 0626 02FC REAL-TIME CLOCK AND CALENDAR REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx ARPT 0000 xxxx CAL — — — — — — RTSECSEL PMPTTL 0000 0000 Alarm Value Register Window based on APTR ALRMEN CHIME AMASK ALRMPTR RTCC Value Register Window based on RTCPTR RTCEN — — — RTCWREN — RTCSYNC — HALFSEC — RTCOE — RTCPTR — — x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-30: File Name CRCCON CRCXOR CRCDAT CRCWDAT Legend: Addr 0640 0642 0644 0646 CRC REGISTER MAP Bit 15 — Bit 14 — Bit 13 CSIDL Bit 12 Bit 11 Bit 10 VWORD Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 — Bit 4 CRCGO Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 0000 0000 0000 CRCFUL CRCMPT X CRC Data Input Register CRC Result Register PLEN — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-31: File Name CMCON CVRCON Legend: Addr 0630 0632 DUAL COMPARATOR REGISTER MAP Bit 15 CMIDL — Bit 14 — — Bit 13 C2EVT — Bit 12 C1EVT — Bit 11 C2EN — Bit 10 C1EN — Bit 9 C2OUTEN — Bit 8 C1OUTEN — Bit 7 C2OUT CVREN Bit 6 C1OUT CVROE Bit 5 C2INV CVRR Bit 4 C1INV CVRSS Bit 3 C2NEG Bit 2 C2POS Bit 1 C1NEG Bit 0 C1POS All Resets 0000 0000 CVR — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-32: File Name TRISA PORTA LATA ODCA Legend: Addr 02C0 02C2 02C4 02C6 PORTA REGISTER MAP FOR dsPIC33FJ128MC202/802, dsPIC33FJ64MC202/802 AND dsPIC33FJ32MC302 Bit 15 — — — — Bit 14 — — — — Bit 13 — — — — Bit 12 — — — — Bit 11 — — — — Bit 10 — — — — Bit 9 — — — — Bit 8 — — — — Bit 7 — — — — Bit 6 — — — — Bit 5 — — — — Bit 4 TRISA4 RA4 LATA4 — Bit 3 TRISA3 RA3 LATA3 — Bit 2 TRISA2 RA2 LATA2 — Bit 1 TRISA1 RA1 LATA1 — Bit 0 TRISA0 RA0 LATA0 — All Resets 001F xxxx xxxx 0000 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. © 2011 Microchip Technology Inc. DS70291E-page 65 TABLE 4-33: File Name TRISA PORTA LATA ODCA Legend: Addr 02C0 02C2 02C4 02C6 PORTA REGISTER MAP FOR dsPIC33FJ128MC204/804, dsPIC33FJ64MC204/804 AND dsPIC33FJ32MC304 Bit 15 — — — — Bit 14 — — — — Bit 13 — — — — Bit 12 — — — — Bit 11 — — — — Bit 10 TRISA10 RA10 LATA10 ODCA10 Bit 9 TRISA9 RA9 LATA9 ODCA9 Bit 8 TRISA8 RA8 LATA8 ODCA8 Bit 7 TRISA7 RA7 LATA7 ODCA7 Bit 6 — — — — Bit 5 — — — — Bit 4 TRISA4 RA4 LATA4 — Bit 3 TRISA3 RA3 LATA3 — Bit 2 TRISA2 RA2 LATA2 — Bit 1 TRISA1 RA1 LATA1 — Bit 0 TRISA0 RA0 LATA0 — All Resets 001F xxxx xxxx 0000 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-34: File Name TRISB PORTB LATB ODCB Legend: Addr 02C8 02CA 02CC 02CE PORTB REGISTER MAP Bit 15 TRISB15 RB15 LATB15 — Bit 14 TRISB14 RB14 LATB14 — Bit 13 TRISB13 RB13 LATB13 — Bit 12 TRISB12 RB12 LATB12 — Bit 11 TRISB11 RB11 LATB11 ODCB11 Bit 10 TRISB10 RB10 LATB10 ODCB10 Bit 9 TRISB9 RB9 LATB9 ODCB9 Bit 8 TRISB8 RB8 LATB8 ODCB8 Bit 7 TRISB7 RB7 LATB7 ODCB7 Bit 6 TRISB6 RB6 LATB6 ODCB6 Bit 5 TRISB5 RB5 LATB5 ODCB5 Bit 4 TRISB4 RB4 LATB4 — Bit 3 TRISB3 RB3 LATB3 — Bit 2 TRISB2 RB2 LATB2 — Bit 1 TRISB1 RB1 LATB1 — Bit 0 TRISB0 RB0 LATB0 — All Resets FFFF xxxx xxxx 0000 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-35: File Name TRISC PORTC LATC ODCC Legend: Addr 02D0 02D2 02D4 02D6 PORTC REGISTER MAP FOR dsPIC33FJ128MC204/804, dsPIC33FJ64MC204/804 AND dsPIC33FJ32MC304 Bit 15 — — — — Bit 14 — — — — Bit 13 — — — — Bit 12 — — — — Bit 11 — — — — Bit 10 — — — — Bit 9 TRISC9 RC9 LATC9 ODCC9 Bit 8 TRISC8 RC8 LATC8 ODCC8 Bit 7 TRISC7 RC7 LATC7 ODCC7 Bit 6 TRISC6 RC6 LATC6 ODCC6 Bit 5 TRISC5 RC5 LATC5 ODCC5 Bit 4 TRISC4 RC4 LATC4 ODCC4 Bit 3 TRISC3 RC3 LATC3 ODCC3 Bit 2 TRISC2 RC2 LATC2 — Bit 1 TRISC1 RC1 LATC1 — Bit 0 TRISC0 RC0 LATC0 — All Resets 03FF xxxx xxxx 0000 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-36: File Name Addr 0740 0742 0744 0746 0748 074A SYSTEM CONTROL REGISTER MAP Bit 15 Bit 14 Bit 13 — COSC DOZE — — — — — SELACLK — — Bit 12 — Bit 11 — — DOZEN — — — — Bit 10 — Bit 9 CM NOSC FRCDIV — — APSTSCLR — — ASRCSEL — — — — Bit 8 VREGS Bit 7 EXTR CLKLOCK Bit 6 SWR IOLOCK Bit 5 SWDTEN LOCK — PLLDIV TUN — — — — Bit 4 WDTO — Bit 3 SLEEP CF Bit 2 IDLE — Bit 1 BOR LPOSCEN Bit 0 POR OSWEN All Resets xxxx(1) 0300(2) 3040 0030 0000 0000 RCON OSCCON CLKDIV PLLFBD OSCTUN ACLKCON Legend: Note 1: 2: TRAPR IOPUWR — ROI — — — PLLPOST PLLPRE AOSCMD x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. RCON register Reset values dependent on type of Reset. OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset. DS70291E-page 66 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-37: File Name BSRAM SSRAM Legend: Addr 0750 0752 SECURITY REGISTER MAP FOR dsPIC33FJ128MC204/804 AND dsPIC33FJ64MC204/804 ONLY Bit 15 — — Bit 14 — — Bit 13 — — Bit 12 — — Bit 11 — — Bit 10 — — Bit 9 — — Bit 8 — — Bit 7 — — Bit 6 — — Bit 5 — — Bit 4 — — Bit 3 — — Bit 2 IW_BSR IW_ SSR Bit 1 IR_BSR IR_SSR Bit 0 RL_BSR RL_SSR All Resets 0000 0000 x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-38: File Name NVMCON NVMKEY Legend: Addr 0760 0766 NVM REGISTER MAP Bit 15 WR — Bit 14 WREN — Bit 13 WRERR — Bit 12 — — Bit 11 — — Bit 10 — — Bit 9 — — Bit 8 — — Bit 7 — Bit 6 ERASE Bit 5 — Bit 4 — NVMKEY Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 0000 NVMOP x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. TABLE 4-39: File Name PMD1 PMD2 PMD3 Legend: Addr 0770 0772 0774 PMD REGISTER MAP Bit 15 T5MD IC8MD — Bit 14 T4MD IC7MD — Bit 13 T3MD — — Bit 12 T2MD — — Bit 11 T1MD — — Bit 10 Bit 9 Bit 8 — IC1MD PMPMD Bit 7 I2C1MD — CRCMD Bit 6 U2MD — DAC1MD Bit 5 U1MD — QEI2MD Bit 4 SPI2MD — PWM2MD Bit 3 SPI1MD OC4MD — Bit 2 — OC3MD — Bit 1 C1MD OC2MD — Bit 0 AD1MD OC1MD — All Resets 0000 0000 0000 QEI1MD PWM1MD — CMPMD IC2MD RTCCMD x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.2.7 SOFTWARE STACK 4.2.8 DATA RAM PROTECTION FEATURE In addition to its use as a working register, the W15 register in the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 devices is also used as a software Stack Pointer. The Stack Pointer always points to the first available free word and grows from lower to higher addresses. It pre-decrements for stack pops and post-increments for stack pushes, as shown in Figure 4-6. For a PC push during any CALL instruction, the MSb of the PC is zero-extended before the push, ensuring that the MSb is always clear. Note: A PC push during exception processing concatenates the SRL register to the MSb of the PC prior to the push. The dsPIC33F product family supports Data RAM protection features that enable segments of RAM to be protected when used in conjunction with Boot and Secure Code Segment Security. BSRAM (Secure RAM segment for BS) is accessible only from the Boot Segment Flash code when enabled. SSRAM (Secure RAM segment for RAM) is accessible only from the Secure Segment Flash code when enabled. See Table 4-1 for an overview of the BSRAM and SSRAM SFRs. 4.3 Instruction Addressing Modes The Stack Pointer Limit register (SPLIM) associated with the Stack Pointer sets an upper address boundary for the stack. SPLIM is uninitialized at Reset. As is the case for the Stack Pointer, SPLIM is forced to ‘0’ because all stack operations must be word aligned. Whenever an EA is generated using W15 as a source or destination pointer, the resulting address is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a stack error trap does not occur. The stack error trap occurs on a subsequent push operation. For example, to cause a stack error trap when the stack grows beyond address 0x2000 in RAM, initialize the SPLIM with the value 0x1FFE. Similarly, a Stack Pointer underflow (stack error) trap is generated when the Stack Pointer address is found to be less than 0x0800. This prevents the stack from interfering with the Special Function Register (SFR) space. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. The addressing modes shown in Table 4-40 form the basis of the addressing modes optimized to support the specific features of individual instructions. The addressing modes provided in the MAC class of instructions differ from those in the other instruction types. 4.3.1 FILE REGISTER INSTRUCTIONS Most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). Most file register instructions employ a working register, W0, which is denoted as WREG in these instructions. The destination is typically either the same file register or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction allows additional flexibility and can access the entire data space. 4.3.2 MCU INSTRUCTIONS The three-operand MCU instructions are of the form: Operand 3 = Operand 1 Operand 2 where: Operand 1 is always a working register (that is, the addressing mode can only be register direct), which is referred to as Wb. Operand 2 can be a W register, fetched from data memory, or a 5-bit literal. The result location can be either a W register or a data memory location. The following addressing modes are supported by MCU instructions: FIGURE 4-6: 0x0000 15 CALL STACK FRAME 0 Stack Grows Toward Higher Address PC 000000000 PC W15 (before CALL) W15 (after CALL) POP : [--W15] PUSH : [W15++] • • • • • Register Direct Register Indirect Register Indirect Post-Modified Register Indirect Pre-Modified 5-bit or 10-bit Literal Note: Not all instructions support all the addressing modes given above. Individual instructions can support different subsets of these addressing modes. © 2011 Microchip Technology Inc. DS70291E-page 67 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 4-40: FUNDAMENTAL ADDRESSING MODES SUPPORTED Description The address of the file register is specified explicitly. The contents of a register are accessed directly. The contents of Wn forms the Effective Address (EA). The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Addressing Mode File Register Direct Register Direct Register Indirect Register Indirect Post-Modified Register Indirect Pre-Modified Register Indirect with Register Offset The sum of Wn and Wb forms the EA. (Register Indexed) Register Indirect with Literal Offset The sum of Wn and a literal forms the EA. 4.3.3 MOVE AND ACCUMULATOR INSTRUCTIONS 4.3.4 MAC INSTRUCTIONS Move instructions and the DSP accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the addressing modes supported by most MCU instructions, move and accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (Register Offset) field is shared by both source and destination (but typically only used by one). The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, use a simplified set of addressing modes to allow the user application to effectively manipulate the data pointers through register indirect tables. The two-source operand prefetch registers must be members of the set {W8, W9, W10, W11}. For data reads, W8 and W9 are always directed to the X RAGU, and W10 and W11 are always directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Note: Register Indirect with Register Offset Addressing mode is available only for W9 (in X space) and W11 (in Y space). In summary, the following addressing modes are supported by move and accumulator instructions: • • • • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. In summary, the following addressing modes are supported by the MAC class of instructions: • • • • • Register Indirect Register Indirect Post-Modified by 2 Register Indirect Post-Modified by 4 Register Indirect Post-Modified by 6 Register Indirect with Register Offset (Indexed) 4.3.5 OTHER INSTRUCTIONS Besides the addressing modes outlined previously, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. DS70291E-page 68 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.4 Modulo Addressing The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). Modulo Addressing mode is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo Addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo Addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for Modulo Addressing since these two registers are used as the Stack Frame Pointer and Stack Pointer, respectively. In general, any particular circular buffer can be configured to operate in only one direction as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing buffers), based upon the direction of the buffer. The only exception to the usage restrictions is for buffers that have a power-of-two length. As these buffers satisfy the start and end address criteria, they can operate in a bidirectional mode (that is, address boundary checks are performed on both the lower and upper address boundaries). 4.4.2 W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register, MODCON, contains enable flags as well as a W register field to specify the W Address registers. The XWM and YWM fields select the registers that operate with Modulo Addressing: • If XWM = 15, X RAGU and X WAGU Modulo Addressing is disabled • If YWM = 15, Y AGU Modulo Addressing is disabled The X Address Space Pointer W register (XWM), to which Modulo Addressing is to be applied, is stored in MODCON (see Table 4-1). Modulo Addressing is enabled for X data space when XWM is set to any value other than ‘15’ and the XMODEN bit is set at MODCON. The Y Address Space Pointer W register (YWM) to which Modulo Addressing is to be applied is stored in MODCON. Modulo Addressing is enabled for Y data space when YWM is set to any value other than ‘15’ and the YMODEN bit is set at MODCON. 4.4.1 START AND END ADDRESS The Modulo Addressing scheme requires that a starting and ending address be specified and loaded into the 16-bit Modulo Buffer Address registers: XMODSRT, XMODEND, YMODSRT and YMODEND (see Table 4-1). Note: Y space Modulo Addressing EA calculations assume word-sized data (LSb of every EA is always clear). FIGURE 4-7: Byte Address 0x1100 MODULO ADDRESSING OPERATION EXAMPLE MOV MOV MOV MOV MOV MOV MOV MOV #0x1100, W0 W0, XMODSRT #0x1163, W0 W0, MODEND #0x8001, W0 W0, MODCON #0x0000, W0 #0x1110, W1 ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;W0 holds buffer fill value ;point W1 to buffer ;fill the 50 buffer locations ;fill the next location ;increment the fill value 0x1163 DO AGAIN, #0x31 MOV W0, [W1++] AGAIN: INC W0, W0 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words © 2011 Microchip Technology Inc. DS70291E-page 69 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.4.3 MODULO ADDRESSING APPLICABILITY XB is the Bit-Reversed Address modifier, or ‘pivot point,’ which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: All bit-reversed EA calculations assume word-sized data (LSb of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. Modulo Addressing can be applied to the Effective Address (EA) calculation associated with any W register. Address boundaries check for addresses equal to: • The upper boundary addresses for incrementing buffers • The lower boundary addresses for decrementing buffers It is important to realize that the address boundaries check for addresses less than or greater than the upper (for incrementing buffers) and lower (for decrementing buffers) boundary addresses (not just equal to). Address changes can, therefore, jump beyond boundaries and still be adjusted correctly. Note: The modulo corrected effective address is written back to the register only when Pre-Modify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (such as [W7 + W2]) is used, Modulo Address correction is performed but the contents of the register remain unchanged. When enabled, Bit-Reversed Addressing is executed only for Register Indirect with Pre-Increment or Post-Increment Addressing and word-sized data writes. It does not function for any other addressing mode or for byte-sized data, and normal addresses are generated instead. When Bit-Reversed Addressing is active, the W Address Pointer is always added to the address modifier (XB), and the offset associated with the Register Indirect Addressing mode is ignored. In addition, as word-sized data is a requirement, the LSb of the EA is ignored (and always clear). Note: Modulo Addressing and Bit-Reversed Addressing should not be enabled together. If an application attempts to do so, Bit-Reversed Addressing assumes priority when active for the X WAGU and X WAGU, Modulo Addressing is disabled. However, Modulo Addressing continues to function in the X RAGU. 4.5 Bit-Reversed Addressing Bit-Reversed Addressing mode is intended to simplify data reordering for radix-2 FFT algorithms. It is supported by the X AGU for data writes only. The modifier, which can be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. If Bit-Reversed Addressing has already been enabled by setting the BREN bit (XBREV), a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. 4.5.1 BIT-REVERSED ADDRESSING IMPLEMENTATION Bit-Reversed Addressing mode is enabled in any of these situations: • BWM bits (W register selection) in the MODCON register are any value other than ‘15’ (the stack cannot be accessed using Bit-Reversed Addressing) • The BREN bit is set in the XBREV register • The addressing mode used is Register Indirect with Pre-Increment or Post-Increment If the length of a bit-reversed buffer is M = 2N bytes, the last ‘N’ bits of the data buffer start address must be zeros. DS70291E-page 70 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 4-8: BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-Word Bit-Reversed Buffer TABLE 4-41: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address Bit-Reversed Address Decimal 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A3 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 A2 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Decimal 0 8 4 12 2 10 6 14 1 9 5 13 3 11 7 15 A3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 © 2011 Microchip Technology Inc. DS70291E-page 71 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.6 Interfacing Program and Data Memory Spaces 4.6.1 ADDRESSING PROGRAM SPACE The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 architecture uses a 24-bit-wide program space and a 16-bit-wide data space. The architecture is also a modified Harvard scheme, meaning that data can also be present in the program space. To use this data successfully, it must be accessed in a way that preserves the alignment of information in both spaces. Aside from normal execution, the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 architecture provides two methods by which program space can be accessed during operation: • Using table instructions to access individual bytes or words anywhere in the program space • Remapping a portion of the program space into the data space (Program Space Visibility) Table instructions allow an application to read or write to small areas of the program memory. This capability makes the method ideal for accessing data tables that need to be updated periodically. It also allows access to all bytes of the program word. The remapping method allows an application to access a large block of data on a read-only basis, which is ideal for look-ups from a large table of static data. The application can only access the least significant word of the program word. Since the address ranges for the data and program spaces are 16 and 24 bits, respectively, a method is needed to create a 23-bit or 24-bit program address from 16-bit data registers. The solution depends on the interface method to be used. For table operations, the 8-bit Table Page register (TBLPAG) is used to define a 32K word region within the program space. This is concatenated with a 16-bit EA to arrive at a full 24-bit program space address. In this format, the Most Significant bit of TBLPAG is used to determine if the operation occurs in the user memory (TBLPAG = 0) or the configuration memory (TBLPAG = 1). For remapping operations, the 8-bit Program Space Visibility register (PSVPAG) is used to define a 16K word page in the program space. When the Most Significant bit of the EA is ‘1’, PSVPAG is concatenated with the lower 15 bits of the EA to form a 23-bit program space address. Unlike table operations, this limits remapping operations strictly to the user memory area. Table 4-42 and Figure 4-9 show how the program EA is created for table operations and remapping accesses from the data EA. Here, P refers to a program space word, and D refers to a data space word. TABLE 4-42: PROGRAM SPACE ADDRESS CONSTRUCTION Access Space User User Configuration Program Space Address 0 0xx xxxx TBLPAG 0xxx xxxx TBLPAG 1xxx xxxx 0 0 PSVPAG xxxx xxxx PC xxxx xxxx xxxx xxx0 Data EA xxxx xxxx xxxx xxxx Data EA xxxx xxxx xxxx xxxx Data EA(1) xxx xxxx xxxx xxxx 0 Access Type Instruction Access (Code Execution) TBLRD/TBLWT (Byte/Word Read/Write) Program Space Visibility (Block Remap/Read) Note 1: User Data EA is always ‘1’ in this case, but is not used in calculating the program space address. Bit 15 of the address is PSVPAG. DS70291E-page 72 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 4-9: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION Program Counter(1) 0 Program Counter 23 bits 0 EA Table Operations(2) 1/0 TBLPAG 8 bits 24 bits 16 bits 1/0 Select Program Space (Remapping) Visibility(1) 0 PSVPAG 8 bits 1 EA 0 15 bits 23 bits User/Configuration Space Select Byte Select Note 1: The Least Significant bit (LSb) of program space addresses is always fixed as ‘0’ to maintain word alignment of data in the program and data spaces. 2: Table operations are not required to be word aligned. Table read operations are permitted in the configuration memory space. © 2011 Microchip Technology Inc. DS70291E-page 73 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.6.2 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS - In Byte mode, either the upper or lower byte of the lower program word is mapped to the lower byte of a data address. The upper byte is selected when Byte Select is ‘1’; the lower byte is selected when it is ‘0’. • TBLRDH (Table Read High): - In Word mode, this instruction maps the entire upper word of a program address (P) to a data address. The ‘phantom’ byte (D), is always ‘0’. - In Byte mode, this instruction maps the upper or lower byte of the program word to D of the data address, in the TBLRDL instruction. The data is always ‘0’ when the upper ‘phantom’ byte is selected (Byte Select = 1). In a similar fashion, two table instructions, TBLWTH and TBLWTL, are used to write individual bytes or words to a program space address. The details of their operation are explained in Section 5.0 “Flash Program Memory”. For all table operations, the area of program memory space to be accessed is determined by the Table Page register (TBLPAG). TBLPAG covers the entire program memory space of the device, including user application and configuration spaces. When TBLPAG = 0, the table page is located in the user memory space. When TBLPAG = 1, the page is located in configuration space. The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lower word of any address within the program space without going through data space. The TBLRDH and TBLWTH instructions are the only method to read or write the upper 8 bits of a program space word as data. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit-wide word address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space that contains the least significant data word. TBLRDH and TBLWTH access the space that contains the upper data byte. Two table instructions are provided to move byte or word-sized (16-bit) data to and from program space. Both function as either byte or word operations. • TBLRDL (Table Read Low): - In Word mode, this instruction maps the lower word of the program space location (P) to a data address (D). FIGURE 4-10: TBLPAG ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS Program Space 02 23 15 0 0x000000 00000000 00000000 23 16 8 0 0x020000 0x030000 00000000 00000000 ‘Phantom’ Byte TBLRDH.B (Wn = 0) TBLRDL.B (Wn = 1) TBLRDL.B (Wn = 0) TBLRDL.W The address for the table operation is determined by the data EA within the page defined by the TBLPAG register. Only read operations are shown; write operations are also valid in the user memory area. 0x800000 DS70291E-page 74 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 4.6.3 READING DATA FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY 24-bit program word are used to contain the data. The upper 8 bits of any program space location used as data should be programmed with ‘1111 1111’ or ‘0000 0000’ to force a NOP. This prevents possible issues should the area of code ever be accidentally executed. Note: PSV access is temporarily disabled during table reads/writes. The upper 32 Kbytes of data space may optionally be mapped into any 16K word page of the program space. This option provides transparent access to stored constant data from the data space without the need to use special instructions (such as TBLRDH). Program space access through the data space occurs if the Most Significant bit of the data space EA is ‘1’ and program space visibility is enabled by setting the PSV bit in the Core Control register (CORCON). The location of the program memory space to be mapped into the data space is determined by the Program Space Visibility Page register (PSVPAG). This 8-bit register defines any one of 256 possible pages of 16K words in program space. In effect, PSVPAG functions as the upper 8 bits of the program memory address, with the 15 bits of the EA functioning as the lower bits. By incrementing the PC by 2 for each program memory word, the lower 15 bits of data space addresses directly map to the lower 15 bits in the corresponding program space addresses. Data reads to this area add a cycle to the instruction being executed, since two program memory fetches are required. Although each data space address 0x8000 and higher maps directly into a corresponding program memory address (see Figure 4-11), only the lower 16 bits of the For operations that use PSV and are executed outside a REPEAT loop, the MOV and MOV.D instructions require one instruction cycle in addition to the specified execution time. All other instructions require two instruction cycles in addition to the specified execution time. For operations that use PSV, and are executed inside a REPEAT loop, these instances require two instruction cycles in addition to the specified execution time of the instruction: • Execution in the first iteration • Execution in the last iteration • Execution prior to exiting the loop due to an interrupt • Execution upon re-entering the loop after an interrupt is serviced Any other iteration of the REPEAT loop allows the instruction using PSV to access data, to execute in a single cycle. FIGURE 4-11: PROGRAM SPACE VISIBILITY OPERATION When CORCON = 1 and EA = 1: Program Space PSVPAG 02 23 15 0 0x000000 0x010000 0x018000 The data in the page designated by PSVPAG is mapped into the upper half of the data memory space... Data Space 0x0000 Data EA 0x8000 PSV Area ...while the lower 15 bits of the EA specify an exact address within 0xFFFF the PSV area. This corresponds exactly to the same lower 15 bits of the actual program space address. 0x800000 © 2011 Microchip Technology Inc. DS70291E-page 75 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 76 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 5.0 FLASH PROGRAM MEMORY programming clock and programming data (one of the alternate programming pin pairs: PGECx/PGEDx), and three other lines for power (VDD), ground (VSS) and Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user application can write program memory data either in blocks or ‘rows’ of 64 instructions (192 bytes) at a time or a single program memory word, and erase program memory in blocks or ‘pages’ of 512 instructions (1536 bytes) at a time. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 5. “Flash Programming” (DS70191) of the “dsPIC33F/PIC24H Family Reference Manual”, which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 devices contain internal Flash program memory for storing and executing application code. The memory is readable, writable and erasable during normal operation over the entire VDD range. Flash memory can be programmed in two ways: • In-Circuit Serial Programming™ (ICSP™) programming capability • Run-Time Self-Programming (RTSP) ICSP allows a dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 device to be serially programmed while in the end application circuit. This is done with two lines for 5.1 Table Instructions and Flash Programming Regardless of the method used, all programming of Flash memory is done with the table read and table write instructions. These allow direct read and write access to the program memory space from the data memory while the device is in normal operating mode. The 24-bit target address in the program memory is formed using bits of the TBLPAG register and the Effective Address (EA) from a W register specified in the table instruction, as shown in Figure 5-1. The TBLRDL and the TBLWTL instructions are used to read or write to bits of program memory. TBLRDL and TBLWTL can access program memory in both Word and Byte modes. The TBLRDH and TBLWTH instructions are used to read or write to bits of program memory. TBLRDH and TBLWTH can also access program memory in Word or Byte mode. FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS 24 bits Using Program Counter 0 Program Counter 0 Working Reg EA Using Table Instruction 1/0 TBLPAG Reg 8 bits 16 bits User/Configuration Space Select 24-bit EA Byte Select © 2011 Microchip Technology Inc. DS70291E-page 77 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 5.2 RTSP Operation For example, if the device is operating at +125°C, the FRC accuracy will be ±5%. If the TUN bits (see Register 9-4) are set to ‘b111111, the minimum row write time is equal to Equation 5-2. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 Flash program memory array is organized into rows of 64 instructions or 192 bytes. RTSP allows the user application to erase a page of memory, which consists of eight rows (512 instructions) at a time, and to program one row or one word at a time. Table 31-12 shows typical erase and programming times. The 8-row erase pages and single row write rows are edge-aligned from the beginning of program memory, on boundaries of 1536 bytes and 192 bytes, respectively. The program memory implements holding buffers that can contain 64 instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the buffers sequentially. The instruction words loaded must always be from a group of 64 boundary. The basic sequence for RTSP programming is to set up a Table Pointer, then do a series of TBLWT instructions to load the buffers. Programming is performed by setting the control bits in the NVMCON register. A total of 64 TBLWTL and TBLWTH instructions are required to load the instructions. All of the table write operations are single-word writes (two instruction cycles) because only the buffers are written. A programming cycle is required for programming each row. EQUATION 5-2: MINIMUM ROW WRITE TIME 11064 Cycles T RW = ---------------------------------------------------------------------------------------------- = 1.435 ms 7.37 MHz × ( 1 + 0.05 ) × ( 1 – 0.00375 ) The maximum row write time is equal to Equation 5-3. EQUATION 5-3: MAXIMUM ROW WRITE TIME 11064 Cycles T RW = --------------------------------------------------------------------------------------------- = 1.586 ms 7.37 MHz × ( 1 – 0.05 ) × ( 1 – 0.00375 ) Setting the WR bit (NVMCON) starts the operation, and the WR bit is automatically cleared when the operation is finished. 5.4 Control Registers Two SFRs are used to read and write the program Flash memory: • NVMCON: The NVMCON register (Register 5-1) controls which blocks are to be erased, which memory type is to be programmed and the start of the programming cycle. • NVMKEY: NVMKEY (Register 5-2) is a write-only register that is used for write protection. To start a programming or erase sequence, the user application must consecutively write 0x55 and 0xAA to the NVMKEY register. Refer to Section 5.3 “Programming Operations” for further details. 5.3 Programming Operations A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. The processor stalls (waits) until the programming operation is finished. The programming time depends on the FRC accuracy (see Table 31-19) and the value of the FRC Oscillator Tuning register (see Register 9-4). Use the following formula to calculate the minimum and maximum values for the Row Write Time, Page Erase Time, and Word Write Cycle Time parameters (see Table 31-12). EQUATION 5-1: PROGRAMMING TIME T ------------------------------------------------------------------------------------------------------------------------7.37 MHz × ( FRC Accuracy ) % × ( FRC Tuning ) % DS70291E-page 78 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 5-1: R/SO-0(1) WR bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15 SO = Satiable only bit W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0(1) ERASE U-0 — U-0 — R/W-0(1) R/W-0(1) R/W-0(1) NVMCON: FLASH MEMORY CONTROL REGISTER R/W-0(1) WREN R/W-0(1) WRERR U-0 — U-0 — U-0 — U-0 — U-0 — bit 8 R/W-0(1) bit 0 NVMOP(2) WR: Write Control bit 1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete 0 = Program or erase operation is complete and inactive WREN: Write Enable bit 1 = Enable Flash program/erase operations 0 = Inhibit Flash program/erase operations WRERR: Write Sequence Error Flag bit 1 = An improper program or erase sequence attempt or termination has occurred (bit is set automatically on any set attempt of the WR bit) 0 = The program or erase operation completed normally Unimplemented: Read as ‘0’ ERASE: Erase/Program Enable bit 1 = Perform the erase operation specified by NVMOP on the next WR command 0 = Perform the program operation specified by NVMOP on the next WR command Unimplemented: Read as ‘0’ NVMOP: NVM Operation Select bits(2) If ERASE = 1: 1111 = Memory bulk erase operation 1110 = Reserved 1101 = Erase General Segment 1100 = Erase Secure Segment 1011 = Reserved 0011 = No operation 0010 = Memory page erase operation 0001 = No operation 0000 = Erase a single Configuration register byte If ERASE = 0: 1111 = No operation 1110 = Reserved 1101 = No operation 1100 = No operation 1011 = Reserved 0011 = Memory word program operation 0010 = No operation 0001 = Memory row program operation 0000 = Program a single Configuration register byte bit 14 bit 13 bit 12-7 bit 6 bit 5-4 bit 3-0 Note 1: 2: These bits can only be reset on POR. All other combinations of NVMOP are unimplemented. © 2011 Microchip Technology Inc. DS70291E-page 79 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 5-2: U-0 — bit 15 W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-8 bit 7-0 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown W-0 W-0 W-0 W-0 W-0 W-0 W-0 bit 0 NVMKEY: NONVOLATILE MEMORY KEY REGISTER U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — bit 8 NVMKEY Unimplemented: Read as ‘0’ NVMKEY: Key Register (write-only) bits DS70291E-page 80 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 5.4.1 PROGRAMMING ALGORITHM FOR FLASH PROGRAM MEMORY 4. 5. Write the first 64 instructions from data RAM into the program memory buffers (see Example 5-2). Write the program block to Flash memory: a) Set the NVMOP bits to ‘0001’ to configure for row programming. Clear the ERASE bit and set the WREN bit. b) Write 0x55 to NVMKEY. c) Write 0xAA to NVMKEY. d) Set the WR bit. The programming cycle begins and the CPU stalls for the duration of the write cycle. When the write to Flash memory is done, the WR bit is cleared automatically. Repeat steps 4 and 5, using the next available 64 instructions from the block in data RAM by incrementing the value in TBLPAG, until all 512 instructions are written back to Flash memory. Programmers can program one row of program Flash memory at a time. To do this, it is necessary to erase the 8-row erase page that contains the desired row. The general process is: 1. 2. 3. Read eight rows of program memory (512 instructions) and store in data RAM. Update the program data in RAM with the desired new data. Erase the block (see Example 5-1): a) Set the NVMOP bits (NVMCON) to ‘0010’ to configure for block erase. Set the ERASE (NVMCON) and WREN (NVMCON) bits. b) Write the starting address of the page to be erased into the TBLPAG and W registers. c) Write 0x55 to NVMKEY. d) Write 0xAA to NVMKEY. e) Set the WR bit (NVMCON). The erase cycle begins and the CPU stalls for the duration of the erase cycle. When the erase is done, the WR bit is cleared automatically. 6. For protection against accidental operations, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user application must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs, as shown in Example 5-3. EXAMPLE 5-1: ERASING A PROGRAM MEMORY PAGE ; ; Initialize NVMCON ; ; ; ; ; ; ; ; ; ; ; ; ; Set up NVMCON for block erase operation MOV #0x4042, W0 MOV W0, NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR), W0 MOV W0, TBLPAG MOV #tbloffset(PROG_ADDR), W0 TBLWTL W0, [W0] DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR Initialize PM Page Boundary SFR Initialize in-page EA[15:0] pointer Set base address of erase block Block all interrupts with priority C2 VIN1 = C2 VIN+ < C2 VINIf C2OUTEN = 1, the C2OUT peripheral output must be configured to an available RPx pin. See Section 11.6 “Peripheral Pin Select” for more information. If C1OUTEN = 1, the C1OUT peripheral output must be configured to an available RPx pin. See Section 11.6 “Peripheral Pin Select” for more information. bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 Note 1: 2: DS70291E-page 294 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 24-1: bit 6 CMCON: COMPARATOR CONTROL REGISTER (CONTINUED) C1OUT: Comparator 1 Output bit When C1INV = 0: 1 = C1 VIN+ > C1 VIN0 = C1 VIN+ < C1 VINWhen C1INV = 1: 0 = C1 VIN+ > C1 VIN1 = C1 VIN+ < C1 VINC2INV: Comparator 2 Output Inversion bit 1 = C2 output inverted 0 = C2 output not inverted C1INV: Comparator 1 Output Inversion bit 1 = C1 output inverted 0 = C1 output not inverted C2NEG: Comparator 2 Negative Input Configure bit 1 = Input is connected to VIN+ 0 = Input is connected to VINSee Figure 24-1 for the comparator modes. C2POS: Comparator 2 Positive Input Configure bit 1 = Input is connected to VIN+ 0 = Input is connected to CVREF See Figure 24-1 for the comparator modes. C1NEG: Comparator 1 Negative Input Configure bit 1 = Input is connected to VIN+ 0 = Input is connected to VINSee Figure 24-1 for the comparator modes. C1POS: Comparator 1 Positive Input Configure bit 1 = Input is connected to VIN+ 0 = Input is connected to CVREF See Figure 24-1 for the comparator modes. If C2OUTEN = 1, the C2OUT peripheral output must be configured to an available RPx pin. See Section 11.6 “Peripheral Pin Select” for more information. If C1OUTEN = 1, the C1OUT peripheral output must be configured to an available RPx pin. See Section 11.6 “Peripheral Pin Select” for more information. bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Note 1: 2: © 2011 Microchip Technology Inc. DS70291E-page 295 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 24.1 24.1.1 Comparator Voltage Reference CONFIGURING THE COMPARATOR VOLTAGE REFERENCE The comparator reference supply voltage can come from either VDD and VSS, or the external VREF+ and VREF-. The voltage source is selected by the CVRSS bit (CVRCON). The settling time of the comparator voltage reference must be considered when changing the CVREF output. The voltage reference module is controlled through the CVRCON register (Register 24-2). The comparator voltage reference provides two ranges of output voltage, each with 16 distinct levels. The range to be used is selected by the CVRR bit (CVRCON). The primary difference between the ranges is the size of the steps selected by the CVREF Selection bits (CVR3:CVR0), with one range offering finer resolution. FIGURE 24-2: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM VREF+ AVDD CVRSS = 1 CVRSRC 8R R R R R 16 Steps CVRCON CVR3 CVR2 CVR1 CVR0 CVRSS = 0 CVREN CVREFIN 16-to-1 MUX CVREF R R R CVROE (CVRCON) CVRR VREFAVSS CVRSS = 1 8R CVRSS = 0 DS70291E-page 296 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 24-2: U-0 — bit 15 R/W-0 CVREN bit 7 Legend: R = Readable bit -n = Value at POR bit 15-8 bit 7 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0 CVROE R/W-0 CVRR R/W-0 CVRSS R/W-0 R/W-0 R/W-0 CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — bit 8 R/W-0 bit 0 CVR Unimplemented: Read as ‘0’ CVREN: Comparator Voltage Reference Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down CVROE: Comparator VREF Output Enable bit 1 = CVREF voltage level is output on CVREF pin 0 = CVREF voltage level is disconnected from CVREF pin CVRR: Comparator VREF Range Selection bit 1 = CVRSRC range should be 0 to 0.625 CVRSRC with CVRSRC/24 step size 0 = CVRSRC range should be 0.25 to 0.719 CVRSRC with CVRSRC/32 step size CVRSS: Comparator VREF Source Selection bit 1 = Comparator reference source CVRSRC = VREF+ – VREF0 = Comparator reference source CVRSRC = AVDD – AVSS CVR: Comparator VREF Value Selection 0 ≤ CVR ≤ 15 bits When CVRR = 1: CVREF = (CVR/ 24) • (CVRSRC) When CVRR = 0: CVREF = 1/4 • (CVRSRC) + (CVR/32) • (CVRSRC) bit 6 bit 5 bit 4 bit 3-0 © 2011 Microchip Technology Inc. DS70291E-page 297 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 298 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 25.0 REAL-TIME CLOCK AND CALENDAR (RTCC) • Time: hours, minutes, and seconds • 24-hour format (military time) • Calendar: weekday, date, month and year • Alarm configurable • Year range: 2000 to 2099 • Leap year correction • BCD format for compact firmware • Optimized for low-power operation • User calibration with auto-adjust • Calibration range: ±2.64 seconds error per month • Requirements: External 32.768 kHz clock crystal • Alarm pulse or seconds clock output on RTCC pin The RTCC module is intended for applications where accurate time must be maintained for extended periods of time with minimum to no intervention from the CPU. The RTCC module is optimized for low-power usage to provide extended battery lifetime while keeping track of time. The RTCC module is a 100-year clock and calendar with automatic leap year detection. The range of the clock is from 00:00:00 (midnight) on January 1, 2000 to 23:59:59 on December 31, 2099. The hours are available in 24-hour (military time) format. The clock provides a granularity of one second with half-second visibility to the user. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to “Section 37. Real-Time Clock and Calendar (RTCC)” (DS70301) of the “dsPIC33F/PIC24H Family Reference Manual”, which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. This chapter discusses the Real-Time Clock and Calendar (RTCC) module, available on dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices, and its operation. The following are some of the key features of this module: FIGURE 25-1: RTCC BLOCK DIAGRAM RTCC Clock Domain CPU Clock Domain RCFGCAL RTCC Prescalers 0.5s RTCC Timer Alarm Event RTCVAL ALCFGRPT 32.768 kHz Input from SOSC Comparator Compare Registers with Masks Repeat Counter ALRMVAL RTCC Interrupt RTCC Interrupt Logic Alarm Pulse RTCC Pin RTCOE © 2011 Microchip Technology Inc. DS70291E-page 299 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 25.1 RTCC Module Registers By writing the ALRMVALH byte, the Alarm Pointer value, ALRMPTR bits, decrement by one until they reach ‘00’. Once they reach ‘00’, the ALRMMIN and ALRMSEC value will be accessible through ALRMVALH and ALRMVALL until the pointer value is manually changed. The RTCC module registers are organized into three categories: • RTCC Control Registers • RTCC Value Registers • Alarm Value Registers TABLE 25-2: ALRMPTR 00 01 10 11 25.1.1 REGISTER MAPPING ALRMVAL REGISTER MAPPING Alarm Value Register Window ALRMVAL ALRMVAL ALRMMIN ALRMWD ALRMMNTH — ALRMSEC ALRMHR ALRMDAY — To limit the register interface, the RTCC Timer and Alarm Time registers are accessed through corresponding register pointers. The RTCC Value register window (RTCVALH and RTCVALL) uses the RTCPTR bits (RCFGCAL) to select the desired timer register pair (see Table 25-1). By writing the RTCVALH byte, the RTCC Pointer value, RTCPTR bits, decrement by one until they reach ‘00’. Once they reach ‘00’, the MINUTES and SECONDS value will be accessible through RTCVALH and RTCVALL until the pointer value is manually changed. TABLE 25-1: RTCPTR 00 01 10 11 RTCVAL REGISTER MAPPING RTCC Value Register Window RTCVAL MINUTES WEEKDAY MONTH — RTCVAL SECONDS HOURS DAY YEAR Considering that the 16-bit core does not distinguish between 8-bit and 16-bit read operations, the user must be aware that when reading either the ALRMVALH or ALRMVALL bytes will decrement the ALRMPTR value. The same applies to the RTCVALH or RTCVALL bytes with the RTCPTR being decremented. Note: This only applies to read operations and not write operations. 25.1.2 WRITE LOCK In order to perform a write to any of the RTCC Timer registers, the RTCWREN bit (RCFGCAL) must be set (refer to Example 25-1). Note: To avoid accidental writes to the timer, it is recommended that the RTCWREN bit (RCFGCAL) is kept clear at any other time. For the RTCWREN bit to be set, there is only 1 instruction cycle time window allowed between the 55h/AA sequence and the setting of RTCWREN; therefore, it is recommended that code follow the procedure in Example 25-1. The Alarm Value register window (ALRMVALH and ALRMVALL) uses the ALRMPTR bits (ALCFGRPT) to select the desired Alarm register pair (see Table 25-2). EXAMPLE 25-1: MOV MOV MOV MOV MOV BSET SETTING THE RTCWREN BIT ;move the address of NVMKEY into W1 #NVMKEY, W1 #0x55, W2 #0xAA, W3 W2, [W1] W3, [W1] RCFGCAL, #13 ;start 55/AA sequence ;set the RTCWREN bit DS70291E-page 300 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-1: R/W-0 RTCEN(2) bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1) U-0 — R/W-0 RTCWREN R-0 RTCSYNC R-0 HALFSEC(3) R/W-0 RTCOE R/W-0 R/W-0 bit 8 R/W-0 bit 0 RTCPTR CAL RTCEN: RTCC Enable bit(2) 1 = RTCC module is enabled 0 = RTCC module is disabled Unimplemented: Read as ‘0’ RTCWREN: RTCC Value Registers Write Enable bit 1 = RTCVALH and RTCVALL registers can be written to by the user 0 = RTCVALH and RTCVALL registers are locked out from being written to by the user RTCSYNC: RTCC Value Registers Read Synchronization bit 1 = RTCVALH, RTCVALL and ALCFGRPT registers can change while reading due to a rollover ripple resulting in an invalid data read. If the register is read twice and results in the same data, the data can be assumed to be valid 0 = RTCVALH, RTCVALL or ALCFGRPT registers can be read without concern over a rollover ripple HALFSEC: Half-Second Status bit(3) 1 = Second half period of a second 0 = First half period of a second RTCOE: RTCC Output Enable bit 1 = RTCC output enabled 0 = RTCC output disabled RTCPTR: RTCC Value Register Window Pointer bits Points to the corresponding RTCC Value registers when reading RTCVALH and RTCVALL registers; the RTCPTR value decrements on every read or write of RTCVALH until it reaches ‘00’. RTCVAL: 11 =Reserved 10 =MONTH 01 =WEEKDAY 00 =MINUTES RTCVAL: 11 =YEAR 10 =DAY 01 =HOURS 00 =SECONDS The RCFGCAL register is only affected by a POR. A write to the RTCEN bit is only allowed when RTCWREN = 1. This bit is read-only. It is cleared to ‘0’ on a write to the lower half of the MINSEC register. bit 14 bit 13 bit 12 bit 11 bit 10 bit 9-8 Note 1: 2: 3: © 2011 Microchip Technology Inc. DS70291E-page 301 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-1: bit 7-0 RCFGCAL: RTCC CALIBRATION AND CONFIGURATION REGISTER(1) (CONTINUED) CAL: RTC Drift Calibration bits 11111111 =Minimum negative adjustment; subtracts 4 RTC clock pulses every one minute • • • 10000000 =Maximum negative adjustment; subtracts 512 RTC clock pulses every one minute 01111111 =Maximum positive adjustment; adds 508 RTC clock pulses every one minute • • • 00000001 =Minimum positive adjustment; adds 4 RTC clock pulses every one minute 00000000 =No adjustment The RCFGCAL register is only affected by a POR. A write to the RTCEN bit is only allowed when RTCWREN = 1. This bit is read-only. It is cleared to ‘0’ on a write to the lower half of the MINSEC register. Note 1: 2: 3: DS70291E-page 302 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-2: U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15-2 bit 1 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown U-0 — U-0 — U-0 — U-0 — U-0 — R/W-0 RTSECSEL(1) PADCFG1: PAD CONFIGURATION CONTROL REGISTER U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — bit 8 R/W-0 PMPTTL bit 0 Unimplemented: Read as ‘0’ RTSECSEL: RTCC Seconds Clock Output Select bit(1) 1 = RTCC seconds clock is selected for the RTCC pin 0 = RTCC alarm pulse is selected for the RTCC pin PMPTTL: PMP Module TTL Input Buffer Select bit 1 = PMP module uses TTL input buffers 0 = PMP module uses Schmitt Trigger input buffers To enable the actual RTCC output, the RTCOE bit (RCFGCAL) needs to be set. bit 0 Note 1: © 2011 Microchip Technology Inc. DS70291E-page 303 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-3: R/W-0 ALRMEN bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ALCFGRPT: ALARM CONFIGURATION REGISTER R/W-0 CHIME R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 8 R/W-0 bit 0 AMASK ALRMPTR ARPT ALRMEN: Alarm Enable bit 1 = Alarm is enabled (cleared automatically after an alarm event whenever ARPT = 0x00 and CHIME = 0) 0 = Alarm is disabled CHIME: Chime Enable bit 1 = Chime is enabled; ARPT bits are allowed to roll over from 0x00 to 0xFF 0 = Chime is disabled; ARPT bits stop once they reach 0x00 AMASK: Alarm Mask Configuration bits 11xx = Reserved – do not use 101x = Reserved – do not use 1001 = Once a year (except when configured for February 29th, once every 4 years) 1000 = Once a month 0111 = Once a week 0110 = Once a day 0101 = Every hour 0100 = Every 10 minutes 0011 = Every minute 0010 = Every 10 seconds 0001 = Every second 0000 = Every half second ALRMPTR: Alarm Value Register Window Pointer bits Points to the corresponding Alarm Value registers when reading ALRMVALH and ALRMVALL registers; the ALRMPTR value decrements on every read or write of ALRMVALH until it reaches ‘00’. ALRMVAL: 11 = Unimplemented 10 = ALRMMNTH 01 = ALRMWD 00 = ALRMMIN ALRMVAL: 11 = Unimplemented 10 = ALRMDAY 01 = ALRMHR 00 = ALRMSEC ARPT: Alarm Repeat Counter Value bits 11111111 = Alarm will repeat 255 more times • • • 00000000 = Alarm will not repeat The counter decrements on any alarm event. The counter is prevented from rolling over from 0x00 to 0xFF unless CHIME = 1. bit 14 bit 13-10 bit 9-8 bit 7-0 DS70291E-page 304 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-4: U-0 — bit 15 R/W-x bit 7 Legend: R = Readable bit -n = Value at POR bit 15-8 bit 7-4 bit 3-0 Note 1: W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x RTCVAL (WHEN RTCPTR = 11): YEAR VALUE REGISTER(1) U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — bit 8 R/W-x bit 0 YRTEN YRONE Unimplemented: Read as ‘0’ YRTEN: Binary Coded Decimal Value of Year’s Tens Digit; contains a value from 0 to 9 YRONE: Binary Coded Decimal Value of Year’s Ones Digit; contains a value from 0 to 9 A write to the YEAR register is only allowed when RTCWREN = 1. REGISTER 25-5: U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12 bit 11-8 bit 7-6 bit 5-4 bit 3-0 Note 1: RTCVAL (WHEN RTCPTR = 10): MONTH AND DAY VALUE REGISTER(1) U-0 — U-0 — R-x MTHTEN0 R-x R-x R-x R-x bit 8 U-0 — R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x bit 0 MTHONE DAYTEN DAYONE W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown Unimplemented: Read as ‘0’ MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit; contains a value of 0 or 1 MTHONE: Binary Coded Decimal Value of Month’s Ones Digit; contains a value from 0 to 9 Unimplemented: Read as ‘0’ DAYTEN: Binary Coded Decimal Value of Day’s Tens Digit; contains a value from 0 to 3 DAYONE: Binary Coded Decimal Value of Day’s Ones Digit; contains a value from 0 to 9 A write to this register is only allowed when RTCWREN = 1. © 2011 Microchip Technology Inc. DS70291E-page 305 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-6: U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 10-8 bit 7-6 bit 5-4 bit 3-0 Note 1: W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown U-0 — R/W-x R/W-x R/W-x R/W-x R/W-x RTCVAL (WHEN RTCPTR = 01): WKDYHR: WEEKDAY AND HOURS VALUE REGISTER(1) U-0 — U-0 — U-0 — U-0 — R/W-x R/W-x WDAY bit 8 R/W-x bit 0 R/W-x HRTEN HRONE Unimplemented: Read as ‘0’ WDAY: Binary Coded Decimal Value of Weekday Digit; contains a value from 0 to 6 Unimplemented: Read as ‘0’ HRTEN: Binary Coded Decimal Value of Hour’s Tens Digit; contains a value from 0 to 2 HRONE: Binary Coded Decimal Value of Hour’s Ones Digit; contains a value from 0 to 9 A write to this register is only allowed when RTCWREN = 1. REGISTER 25-7: U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 bit 11-8 bit 7 bit 6-4 bit 3-0 RTCVAL (WHEN RTCPTR = 00): MINUTES AND SECONDS VALUE REGISTER R/W-x R/W-x MINTEN R/W-x R/W-x R/W-x R/W-x R/W-x bit 8 R/W-x R/W-x SECTEN R/W-x R/W-x R/W-x R/W-x R/W-x bit 0 MINONE SECONE W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown Unimplemented: Read as ‘0’ MINTEN: Binary Coded Decimal Value of Minute’s Tens Digit; contains a value from 0 to 5 MINONE: Binary Coded Decimal Value of Minute’s Ones Digit; contains a value from 0 to 9 Unimplemented: Read as ‘0’ SECTEN: Binary Coded Decimal Value of Second’s Tens Digit; contains a value from 0 to 5 SECONE: Binary Coded Decimal Value of Second’s Ones Digit; contains a value from 0 to 9 DS70291E-page 306 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-8: U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12 bit 11-8 bit 7-6 bit 5-4 bit 3-0 Note 1: W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown U-0 — R/W-x R/W-x R/W-x R/W-x R/W-x ALRMVAL (WHEN ALRMPTR = 10): ALARM MONTH AND DAY VALUE REGISTER(1) U-0 — U-0 — R/W-x MTHTEN0 R/W-x R/W-x R/W-x R/W-x bit 8 R/W-x bit 0 MTHONE DAYTEN DAYONE Unimplemented: Read as ‘0’ MTHTEN0: Binary Coded Decimal Value of Month’s Tens Digit; contains a value of 0 or 1 MTHONE: Binary Coded Decimal Value of Month’s Ones Digit; contains a value from 0 to 9 Unimplemented: Read as ‘0’ DAYTEN: Binary Coded Decimal Value of Day’s Tens Digit; contains a value from 0 to 3 DAYONE: Binary Coded Decimal Value of Day’s Ones Digit; contains a value from 0 to 9 A write to this register is only allowed when RTCWREN = 1. REGISTER 25-9: U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 10-8 bit 7-6 bit 5-4 bit 3-0 Note 1: ALRMVAL (WHEN ALRMPTR = 01): ALARM WEEKDAY AND HOURS VALUE REGISTER(1) U-0 — U-0 — U-0 — U-0 — R/W-x WDAY2 R/W-x WDAY1 R/W-x WDAY0 bit 8 U-0 — R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x bit 0 HRTEN HRONE W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown Unimplemented: Read as ‘0’ WDAY: Binary Coded Decimal Value of Weekday Digit; contains a value from 0 to 6 Unimplemented: Read as ‘0’ HRTEN: Binary Coded Decimal Value of Hour’s Tens Digit; contains a value from 0 to 2 HRONE: Binary Coded Decimal Value of Hour’s Ones Digit; contains a value from 0 to 9 A write to this register is only allowed when RTCWREN = 1. © 2011 Microchip Technology Inc. DS70291E-page 307 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 25-10: ALRMVAL (WHEN ALRMPTR = 00): ALARM MINUTES AND SECONDS VALUE REGISTER U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 bit 11-8 bit 7 bit 6-4 bit 3-0 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-x R/W-x SECTEN R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x MINTEN R/W-x R/W-x R/W-x R/W-x R/W-x bit 8 R/W-x bit 0 MINONE SECONE Unimplemented: Read as ‘0’ MINTEN: Binary Coded Decimal Value of Minute’s Tens Digit; contains a value from 0 to 5 MINONE: Binary Coded Decimal Value of Minute’s Ones Digit; contains a value from 0 to 9 Unimplemented: Read as ‘0’ SECTEN: Binary Coded Decimal Value of Second’s Tens Digit; contains a value from 0 to 5 SECONE: Binary Coded Decimal Value of Second’s Ones Digit; contains a value from 0 to 9 DS70291E-page 308 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 26.0 PROGRAMMABLE CYCLIC REDUNDANCY CHECK (CRC) GENERATOR 26.1 Overview Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to “Section 36. Programmable Cyclic Redundancy Check (CRC)” (DS70298) of the “dsPIC33F/PIC24H Family Reference Manual”, which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. The programmable CRC generator offers the following features: • User-programmable polynomial CRC equation • Interrupt output • Data FIFO The module implements a software configurable CRC generator. The terms of the polynomial and its length can be programmed using the CRCXOR bits (X) and the CRCCON bits (PLEN), respectively. EQUATION 26-1: x 16 CRC EQUATION +x 12 5 +x +1 To program this polynomial into the CRC generator, the CRC register bits should be set as shown in Table 26-1. TABLE 26-1: Bit Name PLEN X EXAMPLE CRC SETUP Bit Value 1111 000100000010000 For the value of X, the 12th bit and the 5th bit are set to ‘1’, as required by the CRC equation. The 0th bit required by the CRC equation is always XORed. For a 16-bit polynomial, the 16th bit is also always assumed to be XORed; therefore, the X bits do not have the 0th bit or the 16th bit. The topology of a standard CRC generator is shown in Figure 26-2. FIGURE 26-1: CRC SHIFTER DETAILS PLEN 0 1 2 15 CRC Shift Register Hold XOR DOUT X1 0 Hold X2 0 Hold X3 0 X15 0 Hold OUT IN BIT 0 OUT IN BIT 1 OUT IN BIT 2 OUT IN BIT 15 1 1 1 1 p_clk p_clk p_clk p_clk CRC Read Bus CRC Write Bus © 2011 Microchip Technology Inc. DS70291E-page 309 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 26-2: XOR D SDOx BIT 0 BIT 4 BIT 5 BIT 12 BIT 15 Q D Q D Q D Q D Q CRC GENERATOR RECONFIGURED FOR x16 + x12 + x5 + 1 p_clk p_clk p_clk p_clk p_clk CRC Read Bus CRC Write Bus 26.2 26.2.1 User Interface DATA INTERFACE To empty words already written into a FIFO, the CRCGO bit must be set to ‘1’ and the CRC shifter allowed to run until the CRCMPT bit is set. Also, to get the correct CRC reading, it will be necessary to wait for the CRCMPT bit to go high before reading the CRCWDAT register. If a word is written when the CRCFUL bit is set, the VWORD Pointer will roll over to 0. The hardware will then behave as if the FIFO is empty. However, the condition to generate an interrupt will not be met; therefore, no interrupt will be generated (See Section 26.2.2 “Interrupt Operation”). At least one instruction cycle must pass after a write to CRCWDAT before a read of the VWORD bits is done. To start serial shifting, a ‘1’ must be written to the CRCGO bit. The module incorporates a FIFO that is 8 deep when PLEN (PLEN) > 7, and 16 deep, otherwise. The data for which the CRC is to be calculated must first be written into the FIFO. The smallest data element that can be written into the FIFO is one byte. For example, if PLEN = 5, then the size of the data is PLEN + 1 = 6. The data must be written as follows: data[5:0] = crc_input[5:0] data[7:6] = ‘bxx Once data is written into the CRCWDAT MSb (as defined by PLEN), the value of VWORD (VWORD) increments by one. The serial shifter starts shifting data into the CRC engine when CRCGO = 1 and VWORD > 0. When the MSb is shifted out, VWORD decrements by one. The serial shifter continues shifting until the VWORD reaches 0. Therefore, for a given value of PLEN, it will take (PLEN + 1) * VWORD number of clock cycles to complete the CRC calculations. When VWORD reaches 8 (or 16), the CRCFUL bit will be set. When VWORD reaches 0, the CRCMPT bit will be set. To continually feed data into the CRC engine, the recommended mode of operation is to initially “prime” the FIFO with a sufficient number of words so no interrupt is generated before the next word can be written. Once that is done, start the CRC by setting the CRCGO bit to ‘1’. From that point onward, the VWORD bits should be polled. If they read less than 8 or 16, another word can be written into the FIFO. 26.2.2 INTERRUPT OPERATION When the VWORD4:VWORD0 bits make a transition from a value of ‘1’ to ‘0’, an interrupt will be generated. 26.3 26.3.1 Operation in Power-Saving Modes SLEEP MODE If Sleep mode is entered while the module is operating, the module will be suspended in its current state until clock execution resumes. 26.3.2 IDLE MODE To continue full module operation in Idle mode, the CSIDL bit must be cleared prior to entry into the mode. If CSIDL = 1, the module will behave the same way as it does in Sleep mode; pending interrupt events will be passed on, even though the module clocks are not available. DS70291E-page 310 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 26.4 Registers The CRC module provides the following registers: • CRC Control Register • CRC XOR Polynomial Register REGISTER 26-1: U-0 — bit 15 R-0 CRCFUL bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 CRCCON: CRC CONTROL REGISTER U-0 — R/W-0 CSIDL R-0 R-0 R-0 VWORD bit 8 R-1 U-0 — R/W-0 CRCGO R/W-0 R/W-0 R/W-0 R/W-0 bit 0 R-0 R-0 CRCMPT PLEN W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown Unimplemented: Read as ‘0’ CSIDL: CRC Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode VWORD: Pointer Value bits Indicates the number of valid words in the FIFO. Has a maximum value of 8 when PLEN > 7, or 16 when PLEN ≤ 7. CRCFUL: FIFO Full bit 1 = FIFO is full 0 = FIFO is not full CRCMPT: FIFO Empty Bit 1 = FIFO is empty 0 = FIFO is not empty Unimplemented: Read as ‘0’ CRCGO: Start CRC bit 1 = Start CRC serial shifter 0 = Turn off the CRC serial shifter after the FIFO is empty PLEN: Polynomial Length bits Denotes the length of the polynomial to be generated minus 1. bit 12-8 bit 7 bit 6 bit 5 bit 4 bit 3-0 © 2011 Microchip Technology Inc. DS70291E-page 311 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 26-2: R/W-0 bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-1 bit 0 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 X R/W-0 R/W-0 R/W-0 U-0 — bit 0 CRCXOR: CRC XOR POLYNOMIAL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 8 X X: XOR of Polynomial Term Xn Enable bits Unimplemented: Read as ‘0’ DS70291E-page 312 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 27.0 PARALLEL MASTER PORT (PMP) Key features of the PMP module include: • Fully Multiplexed Address/Data Mode - 16 bits of address • Demultiplexed or Partially Multiplexed Address/ Data mode: - Up to 11 address lines with single Chip Select - Up to 12 address lines without Chip Select • One Chip Select Line • Programmable Strobe Options: - Individual Read and Write Strobes or; - Read/Write Strobe with Enable Strobe • Address Auto-Increment/Auto-Decrement • Programmable Address/Data Multiplexing • Programmable Polarity on Control Signals • Legacy Parallel Slave Port Support • Enhanced Parallel Slave Support: - Address Support - 4-Byte Deep Auto-Incrementing Buffer • Programmable Wait States • Selectable Input Voltage Levels Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to “Section 35. Parallel Master Port (PMP)”(DS70299) of the “dsPIC33F/PIC24H Family Reference Manual”, which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. The Parallel Master Port (PMP) module is a parallel 8-bit I/O module, specifically designed to communicate with a wide variety of parallel devices, such as communication peripherals, LCDs, external memory devices and microcontrollers. Because the interface to parallel peripherals varies significantly, the PMP is highly configurable. FIGURE 27-1: PMP MODULE OVERVIEW Address Bus Data Bus Control Lines dsPIC33F Parallel Master Port PMA PMALL PMA PMALH Up to 11-Bit Address PMA (1) PMA PMCS1 EEPROM PMBE PMRD PMRD/PMWR PMWR PMENB PMD PMA PMA Microcontroller LCD FIFO Buffer 8-Bit Data Note 1: 28-pin devices do not have PMA. © 2011 Microchip Technology Inc. DS70291E-page 313 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 27-1: R/W-0 PMPEN bit 15 R/W-0 CSF1 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0 CSF0 R/W-0(1) ALP U-0 — R/W-0(1) CS1P R/W-0 BEP R/W-0 WRSP PMCON: PARALLEL PORT CONTROL REGISTER U-0 — R/W-0 PSIDL R/W-0 ADRMUX1 R/W-0 ADRMUX0 R/W-0 PTBEEN R/W-0 PTWREN R/W-0 PTRDEN bit 8 R/W-0 RDSP bit 0 PMPEN: Parallel Master Port Enable bit 1 = PMP enabled 0 = PMP disabled, no off-chip access performed Unimplemented: Read as ‘0’ PSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode ADRMUX1:ADRMUX0: Address/Data Multiplexing Selection bits(1) 11 =Reserved 10 =All 16 bits of address are multiplexed on PMD pins 01 =Lower 8 bits of address are multiplexed on PMD pins, upper 3 bits are multiplexed on PMA 00 =Address and data appear on separate pins PTBEEN: Byte Enable Port Enable bit (16-bit Master mode) 1 = PMBE port enabled 0 = PMBE port disabled PTWREN: Write Enable Strobe Port Enable bit 1 = PMWR/PMENB port enabled 0 = PMWR/PMENB port disabled PTRDEN: Read/Write Strobe Port Enable bit 1 = PMRD/PMWR port enabled 0 = PMRD/PMWR port disabled CSF1:CSF0: Chip Select Function bits 11 = Reserved 10 = PMCS1 functions as chip select 0x = PMCS1 functions as address bit 14 ALP: Address Latch Polarity bit(2) 1 = Active-high (PMALL and PMALH) 0 = Active-low (PMALL and PMALH) Unimplemented: Read as ‘0’ CS1P: Chip Select 1 Polarity bit(2) 1 = Active-high (PMCS1/PMCS1) 0 = Active-low (PMCS1/PMCS1) 28-pin devices do not have PMA. These bits have no effect when their corresponding pins are used as address lines. bit 14 bit 13 bit 12-11 bit 10 bit 9 bit 8 bit 7-6 bit 5 bit 4 bit 3 Note 1: 2: DS70291E-page 314 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 27-1: bit 2 PMCON: PARALLEL PORT CONTROL REGISTER (CONTINUED) BEP: Byte Enable Polarity bit 1 = Byte enable active-high (PMBE) 0 = Byte enable active-low (PMBE) WRSP: Write Strobe Polarity bit For Slave modes and Master mode 2 (PMMODE = 00,01,10): 1 = Write strobe active-high (PMWR) 0 = Write strobe active-low (PMWR) For Master mode 1 (PMMODE = 11): 1 = Enable strobe active-high (PMENB) 0 = Enable strobe active-low (PMENB) RDSP: Read Strobe Polarity bit For Slave modes and Master mode 2 (PMMODE = 00,01,10): 1 = Read strobe active-high (PMRD) 0 = Read strobe active-low (PMRD) For Master mode 1 (PMMODE = 11): 1 = Read/write strobe active-high (PMRD/PMWR) 0 = Read/write strobe active-low (PMRD/PMWR) 28-pin devices do not have PMA. These bits have no effect when their corresponding pins are used as address lines. bit 1 bit 0 Note 1: 2: © 2011 Microchip Technology Inc. DS70291E-page 315 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Register 27-2: R-0 BUSY bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMMODE: PARALLEL PORT MODE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 MODE16 R/W-0 R/W-0 bit 8 R/W-0 bit 0 IRQM INCM MODE WAITB(1) WAITM WAITE(1) BUSY: Busy bit (Master mode only) 1 = Port is busy (not useful when the processor stall is active) 0 = Port is not busy IRQM: Interrupt Request Mode bits 11 = Interrupt generated when Read Buffer 3 is read or Write Buffer 3 is written (Buffered PSP mode) or on a read or write operation when PMA = 11 (Addressable PSP mode only) 10 = No interrupt generated, processor stall activated 01 = Interrupt generated at the end of the read/write cycle 00 = No interrupt generated INCM: Increment Mode bits 11 = PSP read and write buffers auto-increment (Legacy PSP mode only) 10 = Decrement ADDR by 1 every read/write cycle 01 = Increment ADDR by 1 every read/write cycle 00 = No increment or decrement of address MODE16: 8/16-bit Mode bit 1 = 16-bit mode: data register is 16 bits, a read or write to the data register invokes two 8-bit transfers 0 = 8-bit mode: data register is 8 bits, a read or write to the data register invokes one 8-bit transfer MODE: Parallel Port Mode Select bits 11 =Master mode 1 (PMCS1, PMRD/PMWR, PMENB, PMBE, PMA and PMD) 10 =Master mode 2 (PMCS1, PMRD, PMWR, PMBE, PMA and PMD) 01 =Enhanced PSP, control signals (PMRD, PMWR, PMCS1, PMD and PMA) 00 =Legacy Parallel Slave Port, control signals (PMRD, PMWR, PMCS1 and PMD) WAITB: Data Setup to Read/Write Wait State Configuration bits(1) 11 = Data wait of 4 TCY; multiplexed address phase of 4 TCY 10 = Data wait of 3 TCY; multiplexed address phase of 3 TCY 01 = Data wait of 2 TCY; multiplexed address phase of 2 TCY 00 = Data wait of 1 TCY; multiplexed address phase of 1 TCY WAITM: Read to Byte Enable Strobe Wait State Configuration bits 1111 = Wait of additional 15 TCY • • • 0001 = Wait of additional 1 TCY 0000 = No additional wait cycles (operation forced into one TCY) WAITE: Data Hold After Strobe Wait State Configuration bits(1) 11 = Wait of 4 TCY 10 = Wait of 3 TCY 01 = Wait of 2 TCY 00 = Wait of 1 TCY WAITB and WAITE bits are ignored whenever WAITM3:WAITM0 = 0000. bit 14-13 bit 12-11 bit 10 bit 9-8 bit 7-6 bit 5-2 bit 1-0 Note 1: DS70291E-page 316 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 27-3: R/W-0 ADDR15 bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PMADDR: PARALLEL PORT ADDRESS REGISTER R/W-0 CS1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 8 R/W-0 bit 0 ADDR ADDR ADDR15: Parallel Port Destination Address bits CS1: Chip Select 1 bit 1 = Chip select 1 is active 0 = Chip select 1 is inactive ADDR13:ADDR0: Parallel Port Destination Address bits bit 13-0 REGISTER 27-4: U-0 — bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14 PMAEN: PARALLEL PORT ENABLE REGISTER R/W-0 U-0 — U-0 — U-0 — R/W-0 R/W-0 PTEN(1) bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 0 R/W-0 PTEN14 PTEN(1) PTEN W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown Unimplemented: Read as ‘0’ PTEN14: PMCS1 Strobe Enable bit 1 = PMA14 functions as either PMA bit or PMCS1 0 = PMA14 pin functions as port I/O Unimplemented: Read as ‘0’ PTEN: PMP Address Port Enable bits(1) 1 = PMA function as PMP address lines 0 = PMA function as port I/O PTEN: PMALH/PMALL Strobe Enable bits 1 = PMA1 and PMA0 function as either PMA or PMALH and PMALL 0 = PMA1 and PMA0 pads functions as port I/O Devices with 28 pins do not have PMA. bit 13-11 bit 10-2 bit 1-0 Note 1: © 2011 Microchip Technology Inc. DS70291E-page 317 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 27-5: R-0 IBF bit 15 R-1 OBE bit 7 Legend: R = Readable bit -n = Value at POR bit 15 HS = Hardware Set bit W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown R/W-0, HS OBUF U-0 — U-0 — R-1 OB3E R-1 OB2E R-1 OB1E R-1 OB0E bit 0 PMSTAT: PARALLEL PORT STATUS REGISTER U-0 — U-0 — R-0 IB3F R-0 IB2F R-0 IB1F R-0 IB0F bit 8 R/W-0, HS IBOV IBF: Input Buffer Full Status bit 1 = All writable input buffer registers are full 0 = Some or all of the writable input buffer registers are empty IBOV: Input Buffer Overflow Status bit 1 = A write attempt to a full input byte register occurred (must be cleared in software) 0 = No overflow occurred Unimplemented: Read as ‘0’ IB3F:IB0F Input Buffer x Status Full bits 1 = Input buffer contains data that has not been read (reading buffer will clear this bit) 0 = Input buffer does not contain any unread data OBE: Output Buffer Empty Status bit 1 = All readable output buffer registers are empty 0 = Some or all of the readable output buffer registers are full OBUF: Output Buffer Underflow Status bits 1 = A read occurred from an empty output byte register (must be cleared in software) 0 = No underflow occurred Unimplemented: Read as ‘0’ OB3E:OB0E Output Buffer x Status Empty bit 1 = Output buffer is empty (writing data to the buffer will clear this bit) 0 = Output buffer contains data that has not been transmitted bit 14 bit 13-12 bit 11-8 bit 7 bit 6 bit 5-4 bit 3-0 DS70291E-page 318 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 REGISTER 27-6: U-0 — bit 15 U-0 — bit 7 Legend: R = Readable bit -n = Value at POR bit 15-2 bit 1 W = Writable bit ‘1’ = Bit is set U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown U-0 — U-0 — U-0 — U-0 — U-0 — R/W-0 RTSECSEL(1) PADCFG1: PAD CONFIGURATION CONTROL REGISTER U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — U-0 — bit 8 R/W-0 PMPTTL bit 0 Unimplemented: Read as ‘0’ RTSECSEL: RTCC Seconds Clock Output Select bit(1) 1 = RTCC seconds clock is selected for the RTCC pin 0 = RTCC alarm pulse is selected for the RTCC pin PMPTTL: PMP Module TTL Input Buffer Select bit 1 = PMP module uses TTL input buffers 0 = PMP module uses Schmitt Trigger input buffers To enable the actual RTCC output, the RTCOE (RCFGCAL) bit needs to be set. bit 0 Note 1: © 2011 Microchip Technology Inc. DS70291E-page 319 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 320 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 28.0 SPECIAL FEATURES 28.1 Configuration Bits Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. However, it is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 devices include the following features intended to maximize application flexibility and reliability, and minimize cost through elimination of external components: • • • • • • Flexible configuration Watchdog Timer (WDT) Code Protection and CodeGuard™ Security JTAG Boundary Scan Interface In-Circuit Serial Programming™ (ICSP™) In-Circuit Emulation The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 devices provide nonvolatile memory implementations for device Configuration bits. Refer to Section 25. “Device Configuration” (DS70194), in the “dsPIC33F/PIC24H Family Reference Manual” for more information on this implementation. The Configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’), to select various device configurations. These bits are mapped starting at program memory location 0xF80000. The individual Configuration bit descriptions for the Configuration registers are shown in Table 28-2. Note that address 0xF80000 is beyond the user program memory space. It belongs to the configuration memory space (0x800000-0xFFFFFF), which can only be accessed using table reads and table writes. The Device Configuration register map is shown in Table 28-1. TABLE 28-1: Address 0xF80000 FBS DEVICE CONFIGURATION REGISTER MAP Name Bit 7 Bit 6 Bit 5 — — — — IOL1WAY — LPOL JTAGEN — WDTPRE ALTI2C — — — — Bit 4 — — — — — — Bit 3 Bit 2 BSS SSS GSS FNOSC OSCIOFNC POSCMD WDTPOST FPWRT ICS Bit 1 Bit 0 BWRP SWRP GWRP RBS RSS — IESO — — 0xF80002 FSS(1) 0xF80004 FGS 0xF80006 FOSCSEL 0xF80008 FOSC 0xF8000A FWDT 0xF8000C FPOR 0xF8000E FICD 0xF80010 FUID0 0xF80012 FUID1 0xF80014 FUID2 0xF80016 FUID3 FCKSM FWDTEN WINDIS PWMPIN HPOL Reserved(2) User Unit ID Byte 0 User Unit ID Byte 1 User Unit ID Byte 2 User Unit ID Byte 3 Legend: — = unimplemented bit, read as ‘0’. Note 1: This Configuration register is not available and reads as 0xFF on dsPIC33FJ32MC302/304 devices. 2: These bits are reserved for use by development tools and must be programmed as ‘1’. © 2011 Microchip Technology Inc. DS70291E-page 321 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 28-2: Bit Field BWRP dsPIC33F CONFIGURATION BITS DESCRIPTION Register FBS RTSP Effect Immediate Description Boot Segment Program Flash Write Protection 1 = Boot segment can be written 0 = Boot segment is write-protected BSS FBS Immediately Boot Segment Program Flash Code Protection Size X11 = No Boot program Flash segment Boot space is 1K Instruction Words (except interrupt vectors) 110 = Standard security; boot program Flash segment ends at 0x0007FE 010 = High security; boot program Flash segment ends at 0x0007FE Boot space is 4K Instruction Words (except interrupt vectors) 101 = Standard security; boot program Flash segment, ends at 0x001FFE 001 = High security; boot program Flash segment ends at 0x001FFE Boot space is 8K Instruction Words (except interrupt vectors) 100 = Standard security; boot program Flash segment ends at 0x003FFE 000 = High security; boot program Flash segment ends at 0x003FFE RBS(1) FBS Immediate Boot Segment RAM Code Protection Size 11 = No Boot RAM defined 10 = Boot RAM is 128 bytes 01 = Boot RAM is 256 bytes 00 = Boot RAM is 1024 bytes Secure Segment Program Flash Write-Protect bit 1 = Secure Segment can bet written 0 = Secure Segment is write-protected Secure Segment Program Flash Code Protection Size (Secure segment is not implemented on 32K devices) X11 = No Secure program flash segment Secure space is 4K IW less BS 110 = Standard security; secure program flash segment starts at End of BS, ends at 0x001FFE 010 = High security; secure program flash segment starts at End of BS, ends at 0x001FFE Secure space is 8K IW less BS 101 = Standard security; secure program flash segment starts at End of BS, ends at 0x003FFE 001 = High security; secure program flash segment starts at End of BS, ends at 0x003FFE Secure space is 16K IW less BS 100 = Standard security; secure program flash segment starts at End of BS, ends at 007FFEh 000 = High security; secure program flash segment starts at End of BS, ends at 0x007FFE SWRP(1) FSS(1) Immediate SSS FSS Immediate RSS(1) FSS(1) Immediate Secure Segment RAM Code Protection 11 = No Secure RAM defined 10 = Secure RAM is 256 Bytes less BS RAM 01 = Secure RAM is 2048 Bytes less BS RAM 00 = Secure RAM is 4096 Bytes less BS RAM Note 1: This Configuration register is not available on dsPIC33FJ32MC302/304 devices. DS70291E-page 322 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 28-2: Bit Field GSS dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED) Register FGS RTSP Effect Immediate Description General Segment Code-Protect bit 11 = User program memory is not code-protected 10 = Standard security 0x = High security General Segment Write-Protect bit 1 = User program memory is not write-protected 0 = User program memory is write-protected Two-speed Oscillator Start-up Enable bit 1 = Start-up device with FRC, then automatically switch to the user-selected oscillator source when ready 0 = Start-up device with user-selected oscillator source Initial Oscillator Source Selection bits 111 = Internal Fast RC (FRC) oscillator with postscaler 110 = Internal Fast RC (FRC) oscillator with divide-by-16 101 = LPRC oscillator 100 = Secondary (LP) oscillator 011 = Primary (XT, HS, EC) oscillator with PLL 010 = Primary (XT, HS, EC) oscillator 001 = Internal Fast RC (FRC) oscillator with PLL 000 = FRC oscillator Clock Switching Mode bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled Peripheral pin select configuration 1 = Allow only one reconfiguration 0 = Allow multiple reconfigurations OSC2 Pin Function bit (except in XT and HS modes) 1 = OSC2 is clock output 0 = OSC2 is general purpose digital I/O pin Primary Oscillator Mode Select bits 11 = Primary oscillator disabled 10 = HS Crystal Oscillator mode 01 = XT Crystal Oscillator mode 00 = EC (External Clock) mode Watchdog Timer Enable bit 1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled. Clearing the SWDTEN bit in the RCON register has no effect.) 0 = Watchdog Timer enabled/disabled by user software (LPRC can be disabled by clearing the SWDTEN bit in the RCON register) Watchdog Timer Window Enable bit 1 = Watchdog Timer in Non-Window mode 0 = Watchdog Timer in Window mode Watchdog Timer Prescaler bit 1 = 1:128 0 = 1:32 GWRP FGS Immediate IESO FOSCSEL Immediate FNOSC FOSCSEL If clock switch is enabled, RTSP effect is on any device Reset; otherwise, Immediate Immediate FCKSM FOSC IOL1WAY FOSC Immediate OSCIOFNC FOSC Immediate POSCMD FOSC Immediate FWDTEN FWDT Immediate WINDIS FWDT Immediate WDTPRE FWDT Immediate Note 1: This Configuration register is not available on dsPIC33FJ32MC302/304 devices. © 2011 Microchip Technology Inc. DS70291E-page 323 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 28-2: Bit Field WDTPOST dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED) Register FWDT RTSP Effect Immediate Description Watchdog Timer Postscaler bits 1111 = 1:32,768 1110 = 1:16,384 • • • 0001 = 1:2 0000 = 1:1 Motor Control PWM Module Pin Mode bit 1 = PWM module pins controlled by PORT register at device Reset (tri-stated) 0 = PWM module pins controlled by PWM module at device Reset (configured as output pins) Motor Control PWM High Side Polarity bit 1 = PWM module high side output pins have active-high output polarity 0 = PWM module high side output pins have active-low output polarity Motor Control PWM Low Side Polarity bit 1 = PWM module low side output pins have active-high output polarity 0 = PWM module low side output pins have active-low output polarity Power-on Reset Timer Value Select bits 111 = PWRT = 128 ms 110 = PWRT = 64 ms 101 = PWRT = 32 ms 100 = PWRT = 16 ms 011 = PWRT = 8 ms 010 = PWRT = 4 ms 001 = PWRT = 2 ms 000 = PWRT = Disabled Alternate I2C™ pins 1 = I2C mapped to SDA1/SCL1 pins 0 = I2C mapped to ASDA1/ASCL1 pins JTAG Enable bit 1 = JTAG enabled 0 = JTAG disabled ICD Communication Channel Select bits 11 = Communicate on PGEC1 and PGED1 10 = Communicate on PGEC2 and PGED2 01 = Communicate on PGEC3 and PGED3 00 = Reserved, do not use PWMPIN FPOR Immediate HPOL FPOR Immediate LPOL FPOR Immediate FPWRT FPOR Immediate ALTI2C FPOR Immediate JTAGEN FICD Immediate ICS FICD Immediate Note 1: This Configuration register is not available on dsPIC33FJ32MC302/304 devices. DS70291E-page 324 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 28.2 On-Chip Voltage Regulator 28.3 Brown-Out Reset (BOR) All of the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 devices power their core digital logic at a nominal 2.5V. This can create a conflict for designs that are required to operate at a higher typical voltage, such as 3.3V. To simplify system design, all devices in the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator provides power to the core from the other VDD pins. When the regulator is enabled, a low-ESR (less than 5 Ohms) capacitor (such as tantalum or ceramic) must be connected to the VCAP pin (Figure 28-1). This helps to maintain the stability of the regulator. The recommended value for the filter capacitor is provided in Table 31-13 located in Section 31.0 “Electrical Characteristics”. Note: It is important for the low-ESR capacitor to be placed as close as possible to the VCAP pin. The Brown-out Reset (BOR) module is based on an internal voltage reference circuit that monitors the regulated supply voltage VCAP. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (for example, missing portions of the AC cycle waveform due to bad power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned on). A BOR generates a Reset pulse, which resets the device. The BOR selects the clock source, based on the device Configuration bit values (FNOSC and POSCMD). If an oscillator mode is selected, the BOR activates the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, the clock is held until the LOCK bit (OSCCON) is ‘1’. Concurrently, the PWRT time-out (TPWRT) is applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, then a nominal delay of TFSCM = 100 is applied. The total delay in this case is TFSCM. The BOR Status bit (RCON) is set to indicate that a BOR has occurred. The BOR circuit, if enabled, continues to operate while in Sleep or Idle modes and resets the device should VDD fall below the BOR threshold voltage. On a POR, it takes approximately 20 μs for the on-chip voltage regulator to generate an output voltage. During this time, designated as TSTARTUP, code execution is disabled. TSTARTUP is applied every time the device resumes operation after any power-down. FIGURE 28-1: CONNECTIONS FOR THE ON-CHIP VOLTAGE REGULATOR(1) 3.3V dsPIC33F VDD VCAP CEFC 10 µF Tantalum VSS Note 1: These are typical operating voltages. Refer to Table 31-13 located in Section 31.1 “DC Characteristics” for the full operating ranges of VDD and VCAP. It is important for the low-ESR capacitor to be placed as close as possible to the VCAP pin. 2: © 2011 Microchip Technology Inc. DS70291E-page 325 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 28.4 Watchdog Timer (WDT) 28.4.2 SLEEP AND IDLE MODES For dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 devices, the WDT is driven by the LPRC oscillator. When the WDT is enabled, the clock source is also enabled. 28.4.1 PRESCALER/POSTSCALER If the WDT is enabled, it continues to run during Sleep or Idle modes. When the WDT time-out occurs, the device wakes the device and code execution continues from where the PWRSAV instruction was executed. The corresponding SLEEP or IDLE bits (RCON) needs to be cleared in software after the device wakes up. The nominal WDT clock source from LPRC is 32 kHz. This feeds a prescaler than can be configured for either 5-bit (divide-by-32) or 7-bit (divide-by-128) operation. The prescaler is set by the WDTPRE Configuration bit. With a 32 kHz input, the prescaler yields a nominal WDT time-out period (TWDT) of 1 ms in 5-bit mode, or 4 ms in 7-bit mode. A variable postscaler divides down the WDT prescaler output and allows for a wide range of time-out periods. The postscaler is controlled by the WDTPOST Configuration bits (FWDT), which allow the selection of 16 settings, from 1:1 to 1:32,768. Using the prescaler and postscaler, time-out periods ranging from 1 ms to 131 seconds can be achieved. The WDT, prescaler and postscaler are reset: • On any device Reset • On the completion of a clock switch, whether invoked by software (i.e., setting the OSWEN bit after changing the NOSC bits) or by hardware (i.e., Fail-Safe Clock Monitor) • When a PWRSAV instruction is executed (i.e., Sleep or Idle mode is entered) • When the device exits Sleep or Idle mode to resume normal operation • By a CLRWDT instruction during normal execution Note: The CLRWDT and PWRSAV instructions clear the prescaler and postscaler counts when executed. 28.4.3 ENABLING WDT The WDT is enabled or disabled by the FWDTEN Configuration bit in the FWDT Configuration register. When the FWDTEN Configuration bit is set, the WDT is always enabled. The WDT can be optionally controlled in software when the FWDTEN Configuration bit has been programmed to ‘0’. The WDT is enabled in software by setting the SWDTEN control bit (RCON). The SWDTEN control bit is cleared on any device Reset. The software WDT option allows the user application to enable the WDT for critical code segments and disable the WDT during non-critical segments for maximum power savings. Note: If the WINDIS bit (FWDT) is cleared, the CLRWDT instruction should be executed by the application software only during the last 1/4 of the WDT period. This CLRWDT window can be determined by using a timer. If a CLRWDT instruction is executed before this window, a WDT Reset occurs. The WDT flag bit, WDTO (RCON), is not automatically cleared following a WDT time-out. To detect subsequent WDT events, the flag must be cleared in software. FIGURE 28-2: WDT BLOCK DIAGRAM All Device Resets Transition to New Clock Source Exit Sleep or Idle Mode PWRSAV Instruction CLRWDT Instruction Watchdog Timer Sleep/Idle WDTPRE WDTPOST WDT Wake-up RS Prescaler (divide by N1) RS 1 WDT Reset Postscaler (divide by N2) 0 SWDTEN FWDTEN LPRC Clock WINDIS WDT Window Select CLRWDT Instruction DS70291E-page 326 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 28.5 JTAG Interface 28.8 Code Protection and CodeGuard Security dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices implement a JTAG interface, which supports boundary scan device testing, as well as in-circuit programming. Detailed information on this interface is provided in future revisions of the document. Note: Refer to Section 24. “Programming and Diagnostics” (DS70207) of the dsPIC33F/PIC24H Family Reference Manual for further information on usage, configuration and operation of the JTAG interface. The dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices offer advanced implementation of CodeGuard Security that supports BS, SS and GS while, the dsPIC33FJ32MC302/304 devices offer the intermediate level of CodeGuard Security that supports only BS and GS. CodeGuard Security enables multiple parties to securely share resources (memory, interrupts and peripherals) on a single chip. This feature helps protect individual Intellectual Property in collaborative system designs. When coupled with software encryption libraries, CodeGuard Security can be used to securely update Flash even when multiple IPs reside on the single chip. The code protection features vary depending on the actual dsPIC33F implemented. The following sections provide an overview of these features. Secure segment and RAM protection is implemented on the dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 devices. The dsPIC33FJ32MC302/304 devices do not support secure segment and RAM protection. Note: Refer to Section 23. “CodeGuard™ Security” (DS70199) of the dsPIC33F/ PIC24H Family Reference Manual for further information on usage, configuration and operation of CodeGuard Security. 28.6 In-Circuit Serial Programming The dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/ X04 and dsPIC33FJ128MCX02/X04 devices can be serially programmed while in the end application circuit. This is done with two lines for clock and data and three other lines for power, ground and the programming sequence. Serial programming allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. Serial programming also allows the most recent firmware or a custom firmware to be programmed. Refer to the “dsPIC33F/PIC24H Flash Programming Specification” (DS70152) for details about In-Circuit Serial Programming (ICSP). Any of the three pairs of programming clock/data pins can be used: • PGEC1 and PGED1 • PGEC2 and PGED2 • PGEC3 and PGED3 28.7 In-Circuit Debugger When MPLAB® ICD 2 is selected as a debugger, the incircuit debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. Debugging functionality is controlled through the PGECx (Emulation/Debug Clock) and PGEDx (Emulation/Debug Data) pin functions. Any of the three pairs of debugging clock/data pins can be used: • PGEC1 and PGED1 • PGEC2 and PGED2 • PGEC3 and PGED3 To use the in-circuit debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, PGC, PGD and the PGECx/PGEDx pin pair. In addition, when the feature is enabled, some of the resources are not available for general use. These resources include the first 80 bytes of data RAM and two I/O pins. © 2011 Microchip Technology Inc. DS70291E-page 327 TABLE 28-3: CODE FLASH SECURITY SEGMENT SIZES FOR 32 KB DEVICES BSS=x11 0K VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh 0157FEh BSS=x10 1K VS = 256 IW BS = 768 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh 0157FEh BSS=x01 4K VS = 256 IW BS = 3840 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh 0157FEh BSS=x00 8K VS = 256 IW BS = 7936 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh 0157FEh DS70291E-page 328 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 CONFIG BITS SSS = x11 0K GS = 11008 IW GS = 10240 IW GS = 7168 IW GS = 3072 IW TABLE 28-4: CONFIG BITS CODE FLASH SECURITY SEGMENT SIZES FOR 64 KB DEVICES BSS=x11 0K VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh VS = 256 IW SS = 3840 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh VS = 256 IW BS = 768 IW VS = 256 IW BS = 768 IW SS = 7168 IW GS = 13824 IW VS = 256 IW BS = 768 IW SS = 3072 IW BSS=x10 1K VS = 256 IW BS = 768 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh VS = 256 IW BS = 3840 IW VS = 256 IW BS = 3840 IW SS = 4096 IW GS = 13824 IW VS = 256 IW BS = 3840 IW BSS=x01 4K VS = 256 IW BS = 3840 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh VS = 256 IW BS = 7936 IW VS = 256 IW BS = 7936 IW VS = 256 IW BS = 7936 IW BSS=x00 8K VS = 256 IW BS = 7936 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh © 2011 Microchip Technology Inc. DS70291E-page 329 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 SSS = x11 0K GS = 21760 IW GS = 20992 IW GS = 17920 IW GS = 13824 IW SSS = x10 4K GS = 17920 IW GS = 17920 IW GS = 17920 IW GS = 13824 IW SSS = x01 8K SS = 7936 IW GS = 13824 IW GS = 13824 IW SSS = x00 16K SS = 16128 IW GS = 5632 IW SS = 15360 IW GS = 5632 IW SS = 12288 IW GS = 5632 IW SS = 8192 IW GS = 5632 IW TABLE 28-5: CONFIG BITS CODE FLASH SECURITY SEGMENT SIZES FOR 128 KB DEVICES BSS=x11 0K VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh VS = 256 IW SS = 3840 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh VS = 256 IW BS = 768 IW VS = 256 IW BS = 768 IW SS = 7168 IW VS = 256 IW BS = 768 IW SS = 3072 IW BSS=x10 1K VS = 256 IW BS = 768 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh VS = 256 IW BS = 3840 IW VS = 256 IW BS = 3840 IW SS = 4096 IW VS = 256 IW BS = 3840 IW BSS=x01 4K VS = 256 IW BS = 3840 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh VS = 256 IW BS = 7936 IW VS = 256 IW BS = 7936 IW VS = 256 IW BS = 7936 IW BSS=x00 8K VS = 256 IW BS = 7936 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00ABFEh 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 007FFEh 008000h 00FFFEh 010000h 0157FEh DS70291E-page 330 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 SSS = x11 0K GS = 43776 IW GS = 43008 IW GS = 39936 IW GS = 35840 IW SSS = x10 4K GS = 39936 IW GS = 39936 IW GS = 39936 IW GS = 35840 IW SSS = x01 8K SS = 7936 IW GS = 35840 IW GS = 35840 IW GS = 35840 IW GS = 35840 IW SSS = x00 16K SS = 16128 IW GS = 27648 IW SS = 15360 IW GS = 27648 IW SS = 12288 IW GS = 27648 IW SS = 8192 IW GS = 27648 IW dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 29.0 Note: INSTRUCTION SET SUMMARY This data sheet summarizes the features of the dsPIC33FJ32MC302/ 304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. Most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: • The W register (with or without an address modifier) or file register (specified by the value of ‘Ws’ or ‘f’) • The bit in the W register or file register (specified by a literal value or indirectly by the contents of register ‘Wb’) The literal instructions that involve data movement can use some of the following operands: • A literal value to be loaded into a W register or file register (specified by ‘k’) • The W register or file register where the literal value is to be loaded (specified by ‘Wb’ or ‘f’) However, literal instructions that involve arithmetic or logical operations use some of the following operands: • The first source operand, which is a register ‘Wb’ without any address modifier • The second source operand, which is a literal value • The destination of the result (only if not the same as the first source operand), which is typically a register ‘Wd’ with or without an address modifier The MAC class of DSP instructions can use some of the following operands: • The accumulator (A or B) to be used (required operand) • The W registers to be used as the two operands • The X and Y address space prefetch operations • The X and Y address space prefetch destinations • The accumulator write back destination The other DSP instructions do not involve any multiplication and can include: • The accumulator to be used (required) • The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier • The amount of shift specified by a W register ‘Wn’ or a literal value The control instructions can use some of the following operands: • A program memory address • The mode of the table read and table write instructions The dsPIC33F instruction set is identical to that of the dsPIC30F. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single-word instruction is a 24-bit word, divided into an 8-bit opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: • • • • • Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations Table 29-1 shows the general symbols used in describing the instructions. The dsPIC33F instruction set summary in Table 29-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: • The first source operand, which is typically a register ‘Wb’ without any address modifier • The second source operand, which is typically a register ‘Ws’ with or without an address modifier • The destination of the result, which is typically a register ‘Wd’ with or without an address modifier However, word or byte-oriented file register instructions have two operands: • The file register specified by the value ‘f’ • The destination, which could be either the file register ‘f’ or the W0 register, which is denoted as ‘WREG’ © 2011 Microchip Technology Inc. DS70291E-page 331 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Most instructions are a single word. Certain doubleword instructions are designed to provide all the required information in these 48 bits. In the second word, the 8 MSbs are ‘0’s. If this second word is executed as an instruction (by itself), it executes as a NOP. The double-word instructions execute in two instruction cycles. Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table reads and writes and RETURN/RETFIE instructions, which are single-word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or two-word instruction. Moreover, double-word moves require two cycles. Note: For more details on the instruction set, refer to the “16-bit MCU and DSC Programmer’s Reference Manual” (DS70157). TABLE 29-1: Field #text (text) [text] {} .b .d .S .w Acc AWB bit4 C, DC, N, OV, Z Expr f lit1 lit4 lit5 lit8 lit10 lit14 lit16 lit23 None OA, OB, SA, SB PC Slit10 Slit16 Slit6 Wb Wd Wdo Wm,Wn Wm*Wm SYMBOLS USED IN OPCODE DESCRIPTIONS Description Means literal defined by “text” Means “content of text” Means “the location addressed by text” Optional field or operation Register bit field Byte mode selection Double-Word mode selection Shadow register select Word mode selection (default) One of two accumulators {A, B} Accumulator write back destination address register ∈ {W13, [W13]+ = 2} 4-bit bit selection field (used in word addressed instructions) ∈ {0...15} MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Absolute address, label or expression (resolved by the linker) File register address ∈ {0x0000...0x1FFF} 1-bit unsigned literal ∈ {0,1} 4-bit unsigned literal ∈ {0...15} 5-bit unsigned literal ∈ {0...31} 8-bit unsigned literal ∈ {0...255} 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode 14-bit unsigned literal ∈ {0...16384} 16-bit unsigned literal ∈ {0...65535} 23-bit unsigned literal ∈ {0...8388608}; LSb must be ‘0’ Field does not require an entry, can be blank DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate Program Counter 10-bit signed literal ∈ {-512...511} 16-bit signed literal ∈ {-32768...32767} 6-bit signed literal ∈ {-16...16} Base W register ∈ {W0...W15} Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Destination W register ∈ { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Dividend, Divisor working register pair (direct addressing) Multiplicand and Multiplier working register pair for Square instructions ∈ {W4 * W4,W5 * W5,W6 * W6,W7 * W7} DS70291E-page 332 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 29-1: Field Wm*Wn Wn Wnd Wns WREG Ws Wso Wx SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Description Multiplicand and Multiplier working register pair for DSP instructions ∈ {W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7} One of 16 working registers ∈ {W0...W15} One of 16 destination working registers ∈ {W0...W15} One of 16 source working registers ∈ {W0...W15} W0 (working register used in file register instructions) Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Source W register ∈ { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } X data space prefetch address register for DSP instructions ∈ {[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2, [W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2, [W9 + W12], none} X data space prefetch destination register for DSP instructions ∈ {W4...W7} Y data space prefetch address register for DSP instructions ∈ {[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2, [W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2, [W11 + W12], none} Y data space prefetch destination register for DSP instructions ∈ {W4...W7} Wxd Wy Wyd © 2011 Microchip Technology Inc. DS70291E-page 333 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 29-2: Base Instr # 1 Assembly Mnemonic ADD ADD ADD ADD ADD ADD ADD ADD 2 ADDC ADDC ADDC ADDC ADDC ADDC 3 AND AND AND AND AND AND 4 ASR ASR ASR ASR ASR ASR 5 BCLR BCLR BCLR 6 BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA 7 BSET BSET BSET 8 BSW BSW.C BSW.Z 9 BTG BTG BTG INSTRUCTION SET OVERVIEW Assembly Syntax Acc f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd Wso,#Slit4,Acc f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG Ws,Wd Wb,Wns,Wnd Wb,#lit5,Wnd f,#bit4 Ws,#bit4 C,Expr GE,Expr GEU,Expr GT,Expr GTU,Expr LE,Expr LEU,Expr LT,Expr LTU,Expr N,Expr NC,Expr NN,Expr NOV,Expr NZ,Expr OA,Expr OB,Expr OV,Expr SA,Expr SB,Expr Expr Z,Expr Wn f,#bit4 Ws,#bit4 Ws,Wb Ws,Wb f,#bit4 Ws,#bit4 Description Add Accumulators f = f + WREG WREG = f + WREG Wd = lit10 + Wd Wd = Wb + Ws Wd = Wb + lit5 16-bit Signed Add to Accumulator f = f + WREG + (C) WREG = f + WREG + (C) Wd = lit10 + Wd + (C) Wd = Wb + Ws + (C) Wd = Wb + lit5 + (C) f = f .AND. WREG WREG = f .AND. WREG Wd = lit10 .AND. Wd Wd = Wb .AND. Ws Wd = Wb .AND. lit5 f = Arithmetic Right Shift f WREG = Arithmetic Right Shift f Wd = Arithmetic Right Shift Ws Wnd = Arithmetic Right Shift Wb by Wns Wnd = Arithmetic Right Shift Wb by lit5 Bit Clear f Bit Clear Ws Branch if Carry Branch if greater than or equal Branch if unsigned greater than or equal Branch if greater than Branch if unsigned greater than Branch if less than or equal Branch if unsigned less than or equal Branch if less than Branch if unsigned less than Branch if Negative Branch if Not Carry Branch if Not Negative Branch if Not Overflow Branch if Not Zero Branch if Accumulator A overflow Branch if Accumulator B overflow Branch if Overflow Branch if Accumulator A saturated Branch if Accumulator B saturated Branch Unconditionally Branch if Zero Computed Branch Bit Set f Bit Set Ws Write C bit to Ws Write Z bit to Ws Bit Toggle f Bit Toggle Ws # of # of Words Cycles 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 2 1 (2) 2 1 1 1 1 1 1 Status Flags Affected OA,OB,SA,SB C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z OA,OB,SA,SB C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z N,Z N,Z N,Z N,Z N,Z C,N,OV,Z C,N,OV,Z C,N,OV,Z N,Z N,Z None None None None None None None None None None None None None None None None None None None None None None None None None None None None None None DS70291E-page 334 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 29-2: Base Instr # 10 Assembly Mnemonic BTSC BTSC BTSC 11 BTSS BTSS BTSS 12 BTST BTST BTST.C BTST.Z BTST.C BTST.Z 13 BTSTS BTSTS BTSTS.C BTSTS.Z 14 CALL CALL CALL 15 CLR CLR CLR CLR CLR 16 17 CLRWDT COM CLRWDT COM COM COM 18 CP CP CP CP 19 CP0 CP0 CP0 20 CPB CPB CPB CPB 21 22 23 24 25 26 CPSEQ CPSGT CPSLT CPSNE DAW DEC CPSEQ CPSGT CPSLT CPSNE DAW DEC DEC DEC 27 DEC2 DEC2 DEC2 DEC2 28 DISI DISI f f,WREG Ws,Wd f Wb,#lit5 Wb,Ws f Ws f Wb,#lit5 Wb,Ws Wb, Wn Wb, Wn Wb, Wn Wb, Wn Wn f f,WREG Ws,Wd f f,WREG Ws,Wd #lit14 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax f,#bit4 Ws,#bit4 f,#bit4 Ws,#bit4 f,#bit4 Ws,#bit4 Ws,#bit4 Ws,Wb Ws,Wb f,#bit4 Ws,#bit4 Ws,#bit4 lit23 Wn f WREG Ws Acc,Wx,Wxd,Wy,Wyd,AWB Description Bit Test f, Skip if Clear Bit Test Ws, Skip if Clear Bit Test f, Skip if Set Bit Test Ws, Skip if Set Bit Test f Bit Test Ws to C Bit Test Ws to Z Bit Test Ws to C Bit Test Ws to Z Bit Test then Set f Bit Test Ws to C, then Set Bit Test Ws to Z, then Set Call subroutine Call indirect subroutine f = 0x0000 WREG = 0x0000 Ws = 0x0000 Clear Accumulator Clear Watchdog Timer f=f WREG = f Wd = Ws Compare f with WREG Compare Wb with lit5 Compare Wb with Ws (Wb – Ws) Compare f with 0x0000 Compare Ws with 0x0000 Compare f with WREG, with Borrow Compare Wb with lit5, with Borrow Compare Wb with Ws, with Borrow (Wb – Ws – C) Compare Wb with Wn, skip if = Compare Wb with Wn, skip if > Compare Wb with Wn, skip if < Compare Wb with Wn, skip if ≠ Wn = decimal adjust Wn f=f–1 WREG = f – 1 Wd = Ws – 1 f=f–2 WREG = f – 2 Wd = Ws – 2 Disable Interrupts for k instruction cycles # of # of Words Cycles 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 1 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 1 1 1 1 1 1 1 Status Flags Affected None None None None Z C Z C Z Z C Z None None None None None OA,OB,SA,SB WDTO,Sleep N,Z N,Z N,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z None None None None C C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z None © 2011 Microchip Technology Inc. DS70291E-page 335 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 29-2: Base Instr # 29 Assembly Mnemonic DIV DIV.S DIV.SD DIV.U DIV.UD 30 31 DIVF DO DIVF DO DO 32 33 34 35 36 37 38 ED EDAC EXCH FBCL FF1L FF1R GOTO ED EDAC EXCH FBCL FF1L FF1R GOTO GOTO 39 INC INC INC INC 40 INC2 INC2 INC2 INC2 41 IOR IOR IOR IOR IOR IOR 42 43 44 LAC LNK LSR LAC LNK LSR LSR LSR LSR LSR 45 MAC MAC INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax Wm,Wn Wm,Wn Wm,Wn Wm,Wn Wm,Wn #lit14,Expr Wn,Expr Wm*Wm,Acc,Wx,Wy,Wxd Wm*Wm,Acc,Wx,Wy,Wxd Wns,Wnd Ws,Wnd Ws,Wnd Ws,Wnd Expr Wn f f,WREG Ws,Wd f f,WREG Ws,Wd f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd Wso,#Slit4,Acc #lit14 f f,WREG Ws,Wd Wb,Wns,Wnd Wb,#lit5,Wnd Wm*Wn,Acc,Wx,Wxd,Wy,Wyd , AWB Wm*Wm,Acc,Wx,Wxd,Wy,Wyd f,Wn f f,WREG #lit16,Wn #lit8,Wn Wn,f Wso,Wdo WREG,f Wns,Wd Ws,Wnd Acc,Wx,Wxd,Wy,Wyd,AWB Description Signed 16/16-bit Integer Divide Signed 32/16-bit Integer Divide Unsigned 16/16-bit Integer Divide Unsigned 32/16-bit Integer Divide Signed 16/16-bit Fractional Divide Do code to PC + Expr, lit14 + 1 times Do code to PC + Expr, (Wn) + 1 times Euclidean Distance (no accumulate) Euclidean Distance Swap Wns with Wnd Find Bit Change from Left (MSb) Side Find First One from Left (MSb) Side Find First One from Right (LSb) Side Go to address Go to indirect f=f+1 WREG = f + 1 Wd = Ws + 1 f=f+2 WREG = f + 2 Wd = Ws + 2 f = f .IOR. WREG WREG = f .IOR. WREG Wd = lit10 .IOR. Wd Wd = Wb .IOR. Ws Wd = Wb .IOR. lit5 Load Accumulator Link Frame Pointer f = Logical Right Shift f WREG = Logical Right Shift f Wd = Logical Right Shift Ws Wnd = Logical Right Shift Wb by Wns Wnd = Logical Right Shift Wb by lit5 Multiply and Accumulate # of # of Words Cycles 1 1 1 1 1 2 2 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 18 18 18 18 18 2 2 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Status Flags Affected N,Z,C,OV N,Z,C,OV N,Z,C,OV N,Z,C,OV N,Z,C,OV None None OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB None C C C None None C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z N,Z N,Z N,Z N,Z N,Z OA,OB,OAB, SA,SB,SAB None C,N,OV,Z C,N,OV,Z C,N,OV,Z N,Z N,Z OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB None None N,Z None None None None None None None None MAC 46 MOV MOV MOV MOV MOV MOV.b MOV MOV MOV MOV.D MOV.D 47 MOVSAC MOVSAC Square and Accumulate Move f to Wn Move f to f Move f to WREG Move 16-bit literal to Wn Move 8-bit literal to Wn Move Wn to f Move Ws to Wd Move WREG to f Move Double from W(ns):W(ns + 1) to Wd Move Double from Ws to W(nd + 1):W(nd) Prefetch and store accumulator 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 1 DS70291E-page 336 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 29-2: Base Instr # 48 Assembly Mnemonic MPY INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Description Multiply Wm by Wn to Accumulator Square Wm to Accumulator -(Multiply Wm by Wn) to Accumulator Multiply and Subtract from Accumulator # of # of Words Cycles 1 1 1 1 1 1 1 1 Status Flags Affected OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB None OA,OB,OAB, SA,SB,SAB None None None None None None None OA,OB,OAB, SA,SB,SAB C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z None None None None None All None None None None WDTO,Sleep None None None None None None None None C,N,Z C,N,Z C,N,Z N,Z N,Z N,Z C,N,Z C,N,Z C,N,Z 49 50 MPY.N MSC MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd , AWB Wb,Ws,Wnd Wb,Ws,Wnd Wb,Ws,Wnd Wb,Ws,Wnd Wb,#lit5,Wnd Wb,#lit5,Wnd f Acc f f,WREG Ws,Wd 51 MUL MUL.SS MUL.SU MUL.US MUL.UU MUL.SU MUL.UU MUL {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(Ws) {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(lit5) W3:W2 = f * WREG Negate Accumulator f=f+1 WREG = f + 1 Wd = Ws + 1 No Operation No Operation 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 2 1 1 2 2 1 1 1 3 (2) 3 (2) 3 (2) 1 1 1 1 1 1 1 1 1 52 NEG NEG NEG NEG NEG 53 NOP NOP NOPR 54 POP POP POP POP.D POP.S f Wdo Wnd Pop f from Top-of-Stack (TOS) Pop from Top-of-Stack (TOS) to Wdo Pop from Top-of-Stack (TOS) to W(nd):W(nd + 1) Pop Shadow Registers 55 PUSH PUSH PUSH PUSH.D PUSH.S f Wso Wns Push f to Top-of-Stack (TOS) Push Wso to Top-of-Stack (TOS) Push W(ns):W(ns + 1) to Top-of-Stack (TOS) Push Shadow Registers #lit1 Go into Sleep or Idle mode Relative Call Computed Call Repeat Next Instruction lit14 + 1 times Repeat Next Instruction (Wn) + 1 times Software device Reset Return from interrupt 56 57 PWRSAV RCALL PWRSAV RCALL RCALL Expr Wn #lit14 Wn 58 REPEAT REPEAT REPEAT 59 60 61 62 63 RESET RETFIE RETLW RETURN RLC RESET RETFIE RETLW RETURN RLC RLC RLC f f,WREG Ws,Wd f f,WREG Ws,Wd f f,WREG Ws,Wd #lit10,Wn Return with literal in Wn Return from Subroutine f = Rotate Left through Carry f WREG = Rotate Left through Carry f Wd = Rotate Left through Carry Ws f = Rotate Left (No Carry) f WREG = Rotate Left (No Carry) f Wd = Rotate Left (No Carry) Ws f = Rotate Right through Carry f WREG = Rotate Right through Carry f Wd = Rotate Right through Carry Ws 64 RLNC RLNC RLNC RLNC 65 RRC RRC RRC RRC © 2011 Microchip Technology Inc. DS70291E-page 337 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 29-2: Base Instr # 66 Assembly Mnemonic RRNC RRNC RRNC RRNC 67 SAC SAC SAC.R 68 69 SE SETM SE SETM SETM SETM 70 SFTAC SFTAC SFTAC 71 SL SL SL SL SL SL 72 SUB SUB SUB SUB SUB SUB SUB 73 SUBB SUBB SUBB SUBB SUBB SUBB 74 SUBR SUBR SUBR SUBR SUBR 75 SUBBR SUBBR SUBBR SUBBR SUBBR 76 SWAP SWAP.b SWAP 77 78 79 80 81 82 TBLRDH TBLRDL TBLWTH TBLWTL ULNK XOR TBLRDH TBLRDL TBLWTH TBLWTL ULNK XOR XOR XOR XOR XOR 83 ZE ZE f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd Ws,Wnd INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax f f,WREG Ws,Wd Acc,#Slit4,Wdo Acc,#Slit4,Wdo Ws,Wnd f WREG Ws Acc,Wn Acc,#Slit6 f f,WREG Ws,Wd Wb,Wns,Wnd Wb,#lit5,Wnd Acc f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG Wb,Ws,Wd Wb,#lit5,Wd f f,WREG Wb,Ws,Wd Wb,#lit5,Wd Wn Wn Ws,Wd Ws,Wd Ws,Wd Ws,Wd Description f = Rotate Right (No Carry) f WREG = Rotate Right (No Carry) f Wd = Rotate Right (No Carry) Ws Store Accumulator Store Rounded Accumulator Wnd = sign-extended Ws f = 0xFFFF WREG = 0xFFFF Ws = 0xFFFF Arithmetic Shift Accumulator by (Wn) Arithmetic Shift Accumulator by Slit6 f = Left Shift f WREG = Left Shift f Wd = Left Shift Ws Wnd = Left Shift Wb by Wns Wnd = Left Shift Wb by lit5 Subtract Accumulators f = f – WREG WREG = f – WREG Wn = Wn – lit10 Wd = Wb – Ws Wd = Wb – lit5 f = f – WREG – (C) WREG = f – WREG – (C) Wn = Wn – lit10 – (C) Wd = Wb – Ws – (C) Wd = Wb – lit5 – (C) f = WREG – f WREG = WREG – f Wd = Ws – Wb Wd = lit5 – Wb f = WREG – f – (C) WREG = WREG – f – (C) Wd = Ws – Wb – (C) Wd = lit5 – Wb – (C) Wn = nibble swap Wn Wn = byte swap Wn Read Prog to Wd Read Prog to Wd Write Ws to Prog Write Ws to Prog Unlink Frame Pointer f = f .XOR. WREG WREG = f .XOR. WREG Wd = lit10 .XOR. Wd Wd = Wb .XOR. Ws Wd = Wb .XOR. lit5 Wnd = Zero-extend Ws # of # of Words Cycles 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 1 1 1 1 1 1 1 Status Flags Affected N,Z N,Z N,Z None None C,N,Z None None None OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB C,N,OV,Z C,N,OV,Z C,N,OV,Z N,Z N,Z OA,OB,OAB, SA,SB,SAB C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z None None None None None None None N,Z N,Z N,Z N,Z N,Z C,Z,N DS70291E-page 338 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 30.0 DEVELOPMENT SUPPORT 30.1 MPLAB Integrated Development Environment Software The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. © 2011 Microchip Technology Inc. DS70291E-page 339 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 30.2 MPLAB C Compilers for Various Device Families 30.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 30.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 30.6 MPLAB Assembler, Linker and Librarian for Various Device Families 30.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility DS70291E-page 340 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 30.7 MPLAB SIM Software Simulator 30.9 MPLAB ICD 3 In-Circuit Debugger System The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 30.8 MPLAB REAL ICE In-Circuit Emulator System 30.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. © 2011 Microchip Technology Inc. DS70291E-page 341 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 30.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 30.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. 30.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS70291E-page 342 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 31.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/ X04 family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(1) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +160°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant with respect to VSS(4) .................................................... -0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD ≥ 3.0V(4) .................................................. -0.3V to +5.6V Voltage on any 5V tolerant pin with respect to Vss when VDD < 3.0V(4) ...................................................... -0.3V to 3.6V Voltage on VCAP with respect to VSS ...................................................................................................... 2.25V to 2.75V Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin(2) ...........................................................................................................................250 mA Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA Maximum output current sourced by any I/O pin(3) ...................................................................................................4 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports(2) ...............................................................................................................200 mA Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 31-2). 3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx and PGEDx pins, which are able to sink/source 12 mA. 4: See the “Pin Diagrams” section for 5V tolerant pins. © 2011 Microchip Technology Inc. DS70291E-page 343 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 31.1 DC Characteristics OPERATING MIPS VS. VOLTAGE Max MIPS Characteristic VDD Range (in Volts) Temp Range (in °C) dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 40 40 TABLE 31-1: 3.0-3.6V 3.0-3.6V -40°C to +85°C -40°C to +125°C TABLE 31-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit Industrial Temperature Devices Operating Junction Temperature Range Operating Ambient Temperature Range Extended Temperature Devices Operating Junction Temperature Range Operating Ambient Temperature Range Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD – Σ IOH) I/O Pin Power Dissipation: I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W TJ TA -40 -40 — — +155 +125 °C °C TJ TA -40 -40 — — +125 +85 °C °C PD PINT + PI/O W TABLE 31-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol Typ 30 40 45 50 30 Max — — — — — Unit °C/W °C/W °C/W °C/W °C/W Notes 1 1 1 1 1 Package Thermal Resistance, 44-pin QFN Package Thermal Resistance, 44-pin TFQP Package Thermal Resistance, 28-pin SPDIP Package Thermal Resistance, 28-pin SOIC Package Thermal Resistance, 28-pin QFN-S Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations. θJA θJA θJA θJA θJA DS70291E-page 344 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. Operating Voltage DC10 DC12 DC16 Supply Voltage VDD VDR VPOR 3.0 RAM Data Retention Voltage(2) VDD Start Voltage to ensure internal Power-on Reset signal VDD Rise Rate to ensure internal Power-on Reset signal VDD Core(3) Internal regulator voltage 1.8 — — — — 3.6 — VSS V V V Industrial and Extended — — DC17 SVDD 0.03 — — V/ms 0-3.0V in 0.1s DC18 VCORE 2.25 — 2.75 V Voltage is dependent on load, temperature and VDD Note 1: 2: 3: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. This is the limit to which VDD may be lowered without losing RAM data. These parameters are characterized but not tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 345 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Max Units Conditions DC CHARACTERISTICS Parameter No. Typical(1) Operating Current (IDD)(2) DC20d DC20a DC20b DC20c DC21d DC21a DC21b DC21c DC22d DC22a DC22b DC22c DC23d DC23a DC23b DC23c DC24d DC24a DC24b DC24c Note 1: 2: 18 18 18 18 30 30 30 30 34 34 34 35 49 49 49 49 63 63 63 63 21 22 22 25 35 34 34 36 42 41 42 44 58 57 57 60 75 74 74 76 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C 3.3V 40 MIPS 3.3V 30 MIPS 3.3V 20 MIPS 3.3V 16 MIPS 3.3V 10 MIPS Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VSS. MCLR = VDD, WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are operational. No peripheral modules are operating; however, every peripheral is being clocked (PMD bits are all zeroed). DS70291E-page 346 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Max Units Conditions DC CHARACTERISTICS Parameter No. Typical(1) Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC40d DC40a DC40b DC40c DC41d DC41a DC41b DC41c DC42d DC42a DC42b DC42c DC43d DC43a DC43b DC43c DC44d DC44a DC44b DC44c Note 1: 2: 8 8 9 10 13 13 13 13 15 16 16 17 23 23 24 25 31 31 32 34 10 10 10 13 15 15 16 19 18 18 19 22 27 26 28 31 42 36 39 43 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C 3.3V 40 MIPS 3.3V 30 MIPS 3.3V 20 MIPS 3.3V 16 MIPS 3.3V 10 MIPS Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Base IIDLE current is measured with core off, clock on and all modules turned off. Peripheral Module Disable SFR registers are zeroed. All I/O pins are configured as inputs and pulled to VSS. © 2011 Microchip Technology Inc. DS70291E-page 347 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Max Units Conditions DC CHARACTERISTICS Parameter No. Typical(1) Power-Down Current (IPD)(2) DC60d DC60a DC60b DC60c DC61d DC61a DC61b DC61c Note 1: 2: 3: 4: 24 28 124 350 8 10 12 13 68 87 292 1000 13 15 20 25 μA μA μA μA μA μA μA μA -40°C +25°C +85°C +125°C -40°C +25°C +85°C +125°C 3.3V Watchdog Timer Current: ΔIWDT(3) 3.3V Base Power-Down Current(2,4) Data in the Typical column is at 3.3V, 25°C unless otherwise stated. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off and VREGS (RCON) = 1. The Δ current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. These currents are measured on the device containing the most memory in this family. TABLE 31-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Max 50 30 30 50 30 30 50 30 30 50 30 30 Doze Ratio 1:2 1:64 1:128 1:2 1:64 1:128 1:2 1:64 1:128 1:2 1:64 1:128 Units mA mA mA mA mA mA mA mA mA mA mA mA +125°C 3.3V 40 MIPS +85°C 3.3V 40 MIPS +25°C 3.3V 40 MIPS -40°C 3.3V 40 MIPS Conditions DC CHARACTERISTICS Parameter No. DC73a DC73f DC73g DC70a DC70f DC70g DC71a DC71f DC71g DC72a DC72f DC72g Note 1: Typical(1) 20 17 17 20 17 17 20 17 17 21 18 18 Data in the Typical column is at 3.3V, 25°C unless otherwise stated. DS70291E-page 348 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Input Low Voltage I/O pins PMP pins MCLR I/O Pins with OSC1 or SOSCI I/O Pins with SDAx, SCLx I/O Pins with SDAx, SCLx VIH DI20 DI21 Input High Voltage I/O Pins Not 5V Tolerant(4) I/O Pins 5V Tolerant(4) I/O Pins Not 5V Tolerant with PMP(4) I/O Pins 5V Tolerant with PMP(4) SDAx, SCLx SDAx, SCLx ICNPU DI30 Note 1: 2: 3: 4: 5: 6: 7: 8: 9: CNx Pull-up Current 50 250 400 μA VDD = 3.3V, VPIN = VSS 0.7 VDD 0.7 VDD 0.24 VDD + 0.8 0.24 VDD + 0.8 0.7 VDD 2.1 — — — — — — VDD 5.5 VDD 5.5 5.5 5.5 V V V V V V SMbus disabled SMbus enabled — VSS VSS VSS VSS VSS VSS — — — — — — 0.2 VDD 0.15 VDD 0.2 VDD 0.2 VDD 0.3 VDD 0.8 V V V V V V V SMbus disabled SMbus enabled PMPTTL = 1 Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. VIL DI10 DI11 DI15 DI16 DI18 DI19 DI28 DI29 Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current can be measured at different input voltages. Negative current is defined as current sourced by the pin. See “Pin Diagrams” for the 5V tolerant I/O pins. VIL source < (VSS – 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. © 2011 Microchip Technology Inc. DS70291E-page 349 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Input Leakage Current(2,3) I/O pins 5V Tolerant(4) I/O Pins Not 5V Tolerant(4) — — — — ±2 ±1 μA μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 40°C ≤ TA ≤ +85°C Shared with external reference pins, 40°C ≤ TA ≤ +85°C VSS ≤ VPIN ≤ VDD, Pin at high-impedance, -40°C ≤ TA ≤ +125°C Analog pins shared with external reference pins, -40°C ≤ TA ≤ +125°C VSS ≤ VPIN ≤ VDD VSS ≤ VPIN ≤ VDD, XT and HS modes Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. IIL DI50 DI51 DI51a I/O Pins Not 5V Tolerant(4) — — ±2 μA DI51b I/O Pins Not 5V Tolerant(4) — — ±3.5 μA DI51c I/O Pins Not 5V Tolerant(4) — — ±8 μA DI55 DI56 Note 1: 2: 3: 4: 5: 6: 7: 8: 9: MCLR OSC1 — — — — ±2 ±2 μA μA Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current can be measured at different input voltages. Negative current is defined as current sourced by the pin. See “Pin Diagrams” for the 5V tolerant I/O pins. VIL source < (VSS – 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. DS70291E-page 350 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Input Low Injection Current 0 — -5(5,8) mA All pins except VDD, VSS, AVDD, AVSS, MCLR, VCAP, SOSCI, SOSCO, and RB14 All pins except VDD, VSS, AVDD, AVSS, MCLR, VCAP, SOSCI, SOSCO, RB14, and digital 5V-tolerant designated pins Absolute instantaneous sum of all ± input injection currents from all I/O pins ( | IICL + | IICH | ) ≤ ∑ IICT Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. IICL DI60a IICH DI60b Input High Injection Current 0 — +5(6,7,8) mA ∑ IICT DI60c Total Input Injection Current (sum of all I/O and control pins) -20(9) — +20(9) mA Note 1: 2: 3: 4: 5: 6: 7: 8: 9: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current can be measured at different input voltages. Negative current is defined as current sourced by the pin. See “Pin Diagrams” for the 5V tolerant I/O pins. VIL source < (VSS – 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. © 2011 Microchip Technology Inc. DS70291E-page 351 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Output Low Voltage I/O ports OSC2/CLKO VOH DO20 DO26 Output High Voltage I/O ports OSC2/CLKO 2.40 2.41 — — — — V V IOH = -2.3 mA, VDD = 3.3V IOH = -1.3 mA, VDD = 3.3V — — — — 0.4 0.4 V V IOL = 2 mA, VDD = 3.3V IOL = 2 mA, VDD = 3.3V Min Typ Max Units Conditions Param Symbol No. VOL DO10 DO16 TABLE 31-11: ELECTRICAL CHARACTERISTICS: BOR DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic BOR Event on VDD transition high-to-low BOR event is tied to VDD core voltage decrease Min(1) 2.40 Typ — Max 2.55 Units V Conditions — Param No. BO10 Symbol VBOR Note 1: Parameters are for design guidance only and are not tested in manufacturing. DS70291E-page 352 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-12: DC CHARACTERISTICS: PROGRAM MEMORY DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Program Flash Memory D130 D131 D132B D134 D135 D136a D136b D137a D137b D138a D138b Note 1: 2: EP VPR VPEW TRETD IDDP TRW TRW TPE TPE TWW TWW Cell Endurance VDD for Read VDD for Self-Timed Write Characteristic Retention Supply Current during Programming Row Write Time Row Write Time Page Erase Time Page Erase Time Word Write Cycle Time Word Write Cycle Time 10,000 VMIN VMIN 20 — 1.32 1.28 20.1 19.5 42.3 41.1 — — — — 10 — — — — — — — 3.6 3.6 — — 1.74 1.79 26.5 27.3 55.9 57.6 E/W -40°C to +125°C V V VMIN = Minimum operating voltage VMIN = Minimum operating voltage Min Typ(1) Max Units Conditions Param Symbol No. Year Provided no other specifications are violated, -40°C to +125°C mA ms ms ms ms µs µs — TRW = 11064 FRC cycles, TA = +85°C, See Note 2 TRW = 11064 FRC cycles, TA = +125°C, See Note 2 TPE = 168517 FRC cycles, TA = +85°C, See Note 2 TPE = 168517 FRC cycles, TA = +125°C, See Note 2 TWW = 355 FRC cycles, TA = +85°C, See Note 2 TWW = 355 FRC cycles, TA = +125°C, See Note 2 Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Other conditions: FRC = 7.37 MHz, TUN = b'011111 (for Min), TUN = b'100000 (for Max). This parameter depends on the FRC accuracy (see Table 31-19) and the value of the FRC Oscillator Tuning register (see Register 9-4). For complete details on calculating the Minimum and Maximum time see Section 5.3 “Programming Operations”. TABLE 31-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS Standard Operating Conditions (unless otherwise stated): Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Param No. Symbol CEFC Characteristics External Filter Capacitor Value Min 4.7 Typ 10 Max — Units μF Comments Capacitor must be low series resistance (< 5 ohms) © 2011 Microchip Technology Inc. DS70291E-page 353 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 31.2 AC Characteristics and Timing Parameters This section defines dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 AC characteristics and timing parameters. TABLE 31-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Operating voltage VDD range as described in Table 31-1. AC CHARACTERISTICS FIGURE 31-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 2 – for OSC2 Load Condition 1 – for all pins except OSC2 VDD/2 RL Pin VSS CL Pin VSS CL RL = 464Ω CL = 50 pF for all pins except OSC2 15 pF for OSC2 output TABLE 31-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS Param Symbol No. DO50 COSCO Characteristic OSC2/SOSCO pin Min — Typ — Max 15 Units pF Conditions In XT and HS modes when external clock is used to drive OSC1 EC mode In I2C™ mode DO56 DO58 CIO CB All I/O pins and OSC2 SCLx, SDAx — — — — 50 400 pF pF DS70291E-page 354 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-2: EXTERNAL CLOCK TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 OS20 OS25 OS30 OS30 OS31 OS31 CLKO OS41 OS40 TABLE 31-16: EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic External CLKI Frequency (External clocks allowed only in EC and ECPLL modes) Oscillator Crystal Frequency Min DC Typ(1) — Max 40 Units MHz Conditions EC Param No. OS10 Symb FIN 3.5 10 12.5 — — — — — — — 5.2 5.2 16 10 40 33 DC DC 0.625 x TOSC 20 — — 18 MHz MHz kHz ns ns ns ns ns ns mA/V XT HS SOSC — — EC EC — — VDD = 3.3V TA = +25ºC OS20 OS25 OS30 OS31 OS40 OS41 OS42 Note 1: 2: TOSC TCY TosL, TosH TosR, TosF TckR TckF GM TOSC = 1/FOSC Instruction Cycle Time(2) External Clock in (OSC1) High or Low Time External Clock in (OSC1) Rise or Fall Time CLKO Rise Time(3) CLKO Fall Time(3) External Oscillator Transconductance(4) 25 0.375 x TOSC — — — 14 3: 4: Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices. Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin. Data for this parameter is Preliminary. This parameter is characterized, but not tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 355 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V) AC CHARACTERISTICS Param No. OS50 Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic PLL Voltage Controlled Oscillator (VCO) Input Frequency Range On-Chip VCO System Frequency PLL Start-up Time (Lock Time) CLKO Stability (Jitter)(2) Min 0.8 Typ(1) — Max 8 Units MHz Conditions ECPLL, XTPLL modes Symbol FPLLI OS51 OS52 OS53 Note 1: 2: FSYS TLOCK DCLK 100 0.9 -3 — 1.5 0.5 200 3.1 3 MHz mS % — — Measured over 100 ms period Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized by similarity, but are not tested in manufacturing. This specification is based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time bases or communication clocks use this formula:: D CLK Peripheral Clock Jitter = ----------------------------------------------------------------------F OSC ⎛ ------------------------------------------------------------- ⎞ ⎝ Peripheral Bit Rate Clock⎠ For example: Fosc = 32 MHz, DCLK = 3%, SPI bit rate clock, (i.e., SCK) is 2 MHz. D CLK 3%3% SPI SCK Jitter = ----------------------------- = --------- = ------- = 0.75% 4 16 32 M Hz⎞ ⎛ ------------------⎝ 2 M Hz ⎠ TABLE 31-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions Characteristic Internal FRC Accuracy @ FRC Frequency = 7.37 MHz(1) F20 Note 1: FRC FRC -2 -5 — — +2 +5 % % -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V VDD = 3.0-3.6V Frequency calibrated at 25°C and 3.3V. TUN bits can be used to compensate for temperature drift. TABLE 31-19: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions Characteristic LPRC @ 32.768 kHz(1) F21 Note 1: LPRC LPRC -20 -30 ±6 — +20 +30 % % -40°C ≤ TA ≤ +85°C -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V VDD = 3.0-3.6V Change of LPRC frequency as VDD changes. DS70291E-page 356 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-3: I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) Old Value DO31 DO32 Note: Refer to Figure 31-1 for load conditions. New Value TABLE 31-20: I/O TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Port Output Rise Time Port Output Fall Time INTx Pin High or Low Time (input) CNx High or Low Time (input) Min — — 20 2 Typ(1) 10 10 — — Max 25 25 — — Units ns ns ns TCY Conditions — — — — Param No. DO31 DO32 DI35 DI40 Note 1: Symbol TIOR TIOF TINP TRBP Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. © 2011 Microchip Technology Inc. DS70291E-page 357 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS VDD MCLR Internal POR SY12 SY10 SY11 PWRT Time-out OSC Time-out Internal Reset Watchdog Timer Reset SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 31-1 for load conditions. SY20 SY13 SY30 DS70291E-page 358 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min 2 — Typ(2) — 2 4 8 16 32 64 128 10 0.72 Max — — Units μs ms Conditions -40°C to +85°C -40°C to +85°C User programmable Param Symbol No. SY10 SY11 TMCL TPWRT Characteristic(1) MCLR Pulse Width (low) Power-up Timer Period SY12 SY13 TPOR TIOZ Power-on Reset Delay I/O High-Impedance from MCLR Low or Watchdog Timer Reset Watchdog Timer Time-out Period Oscillator Start-up Time Fail-Safe Clock Monitor Delay 3 0.68 30 1.2 μs μs -40°C to +85°C — SY20 TWDT1 — — — — See Section 28.4 “Watchdog Timer (WDT)” and LPRC specification F21 (Table 31-19) TOSC = OSC1 period -40°C to +85°C SY30 SY35 Note 1: 2: TOST TFSCM — — 1024 TOSC 500 — 900 — μs These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. © 2011 Microchip Technology Inc. DS70291E-page 359 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-5: TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx10 Tx15 OS60 TMRx Tx11 Tx20 Note: Refer to Figure 31-1 for load conditions. TABLE 31-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic TxCK High Time Synchronous, no prescaler Synchronous, with prescaler Asynchronous TA11 TTXL TxCK Low Time Synchronous, no prescaler Synchronous, with prescaler Asynchronous TA15 TTXP TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler Min TCY + 20 (TCY + 20)/N 20 (TCY + 20) (TCY + 20)/N 20 2 TCY + 40 Greater of: 40 ns or (2 TCY + 40)/ N 40 DC Typ — — — — — — — — Max — — — — — — — — Units ns ns ns ns ns ns ns — Conditions Must also meet parameter TA15. N = prescale value (1, 8, 64, 256) Must also meet parameter TA15. N = prescale value (1, 8, 64, 256) — N = prescale value (1, 8, 64, 256) — — Param No. TA10 Symbol TTXH Asynchronous OS60 Ft1 SOSCI/T1CK Oscillator Input frequency Range (oscillator enabled by setting bit TCS (T1CON)) — — — 50 ns kHz TA20 Note 1: TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Timer1 is a Type A. 0.75 TCY + 40 1.75 TCY + 40 — — DS70291E-page 360 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-23: TIMER2 AND TIMER 4 EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) TxCK High Synchronous mode Time Min Greater of: 20 or (TCY + 20)/N Typ — Max — Units ns Conditions Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) N = prescale value (1, 8, 64, 256) Param No. TB10 Symbol TtxH TB11 TtxL TxCK Low Synchronous Time mode Greater of: 20 or (TCY + 20)/N — — ns TB15 TtxP TxCK Input Period Synchronous mode Greater of: 40 or (2 TCY + 40)/N — — ns TB20 TCKEXTMRL Delay from External TxCK 0.75 TCY + 40 Clock Edge to Timer Increment — 1.75 TCY + 40 ns Note 1: These parameters are characterized, but are not tested in manufacturing. TABLE 31-24: TIMER3 AND TIMER 4 EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) TxCK High Time TxCK Low Time TxCK Input Period Synchronous Synchronous Synchronous, with prescaler Min TCY + 20 TCY + 20 2 TCY + 40 Typ — — — Max — — — Units ns ns ns Conditions Must also meet parameter TC15 Must also meet parameter TC15 N = prescale value (1, 8, 64, 256) Param No. TC10 TC11 TC15 Symbol TtxH TtxL TtxP TC20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment 0.75 TCY + 40 — 1.75 TCY + 40 ns Note 1: These parameters are characterized, but are not tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 361 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-6: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS QEB TQ10 TQ15 POSCNT TQ11 TQ20 TABLE 31-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) TQCK High Time TQCK Low Time TQCP Input Period Synchronous, with prescaler Synchronous, with prescaler Min TCY + 20 TCY + 20 Typ Max — — — 1.5 TCY Units ns ns ns — Conditions Must also meet parameter TQ15 Must also meet parameter TQ15 — — Param No. TQ10 TQ11 TQ15 TQ20 Note 1: Symbol TtQH TtQL TtQP Synchronous, 2 * TCY + 40 with prescaler 0.5 TCY TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment These parameters are characterized but not tested in manufacturing. DS70291E-page 362 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-7: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICx IC10 IC15 Note: Refer to Figure 31-1 for load conditions. IC11 TABLE 31-26: INPUT CAPTURE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) ICx Input Low Time ICx Input High Time ICx Input Period No Prescaler With Prescaler IC11 IC15 Note 1: TccH TccP No Prescaler With Prescaler Min 0.5 TCY + 20 10 0.5 TCY + 20 10 (TCY + 40)/N Max — — — — — Units ns ns ns ns ns N = prescale value (1, 4, 16) Conditions Param No. IC10 Symbol TccL These parameters are characterized but not tested in manufacturing. FIGURE 31-8: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC11 OC10 Note: Refer to Figure 31-1 for load conditions. TABLE 31-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min — — Typ — — Max — — Units ns ns Conditions See parameter D032 See parameter D031 Param Symbol No. OC10 OC11 Note 1: TccF TccR Characteristic(1) OCx Output Fall Time OCx Output Rise Time These parameters are characterized but not tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 363 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-9: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA OC15 OCx Active Tri-state TABLE 31-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Fault Input to PWM I/O Change Fault Input Pulse Width Min — TCY + 20 Typ — — Max TCY + 20 — Units ns ns Conditions — — Param No. OC15 OC20 Note 1: Symbol TFD TFLT These parameters are characterized but not tested in manufacturing. DS70291E-page 364 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-10: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS MP30 FLTA MP20 PWMx FIGURE 31-11: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS MP11 MP10 PWMx Note: Refer to Figure 31-1 for load conditions. TABLE 31-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) PWM Output Fall Time PWM Output Rise Time Fault Input ↓ to PWM I/O Change Minimum Pulse Width Min — — — 50 Typ — — — — Max — — 50 — Units ns ns ns ns Conditions See parameter D032 See parameter D031 — — Param No. MP10 MP11 MP20 MP30 Note 1: Symbol TFPWM TRPWM TFD TFH These parameters are characterized but not tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 365 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-12: QEA/QEB INPUT CHARACTERISTICS TQ36 QEA (input) TQ31 TQ35 TQ30 QEB (input) TQ41 TQ40 TQ31 TQ35 TQ30 QEB Internal TABLE 31-30: QUADRATURE DECODER TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Quadrature Input Low Time Quadrature Input High Time Quadrature Input Period Quadrature Phase Period Filter Time to Recognize Low, with Digital Filter Filter Time to Recognize High, with Digital Filter Typ(2) 6 TCY 6 TCY 12 TCY 3 TCY 3 * N * TCY 3 * N * TCY Max — — — — — — Units ns ns ns ns ns ns Conditions — — — — N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 3) N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 3) Param No. TQ30 TQ31 TQ35 TQ36 TQ40 TQ41 Note 1: 2: 3: Symbol TQUL TQUH TQUIN TQUP TQUFL TQUFH These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. N = Index Channel Digital Filter Clock Divide Select bits. Refer to Section 15. “Quadrature Encoder Interface (QEI)” in the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site for the latest dsPIC33F/PIC24H Family Reference Manual sections. DS70291E-page 366 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-13: QEA (input) QEI MODULE INDEX PULSE TIMING CHARACTERISTICS QEB (input) Ungated Index TQ51 Index Internal TQ50 TQ55 Position Counter Reset TABLE 31-31: QEI INDEX PULSE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Filter Time to Recognize Low, with Digital Filter Filter Time to Recognize High, with Digital Filter Index Pulse Recognized to Position Counter Reset (ungated index) Min 3 * N * TCY 3 * N * TCY 3 TCY Max — — — Units ns ns ns Conditions N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) — Param No. TQ50 TQ51 TQ55 Note 1: 2: Symbol TqIL TqiH Tqidxr These parameters are characterized but not tested in manufacturing. Alignment of index pulses to QEA and QEB is shown for position counter Reset timing only. Shown for forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but index pulse recognition occurs on falling edge. © 2011 Microchip Technology Inc. DS70291E-page 367 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-32: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Master Transmit/Receive (Full-Duplex) — Table 31-34 Table 31-35 — — — — Slave Transmit/Receive (Full-Duplex) — — — Table 31-36 Table 31-37 Table 31-38 Table 31-39 CKE 0,1 1 0 1 1 0 0 CKP 0, 1 0, 1 0, 1 0 1 1 0 SMP 0, 1 1 1 0 0 0 0 Maximum Data Rate 15 Mhz 9 Mhz 9 Mhz 15 Mhz 11 Mhz 15 Mhz 11 Mhz Master Transmit Only (Half-Duplex) Table 31-33 — — — — — — FIGURE 31-14: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx SP30, SP31 MSb Bit 14 - - - - - -1 LSb SP30, SP31 Note: Refer to Figure 31-1 for load conditions. FIGURE 31-15: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx MSb Bit 14 - - - - - -1 SP30, SP31 LSb Note: Refer to Figure 31-1 for load conditions. DS70291E-page 368 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-33: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Maximum SCK Frequency SCKx Output Fall Time SCKx Output Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time SDOx Data Output Valid after SCKx Edge SDOx Data Output Setup to First SCKx Edge Min — — — — — — 30 Typ(2) — — — — — 6 — Max 15 — — — — 20 — Units MHz ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 — — Param No. SP10 SP20 SP21 SP30 SP31 SP35 SP36 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, TscL2doV TdiV2scH, TdiV2scL These parameters are characterized, but are not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. © 2011 Microchip Technology Inc. DS70291E-page 369 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-16: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx MSb Bit 14 - - - - - -1 SP30, SP31 LSb SP40 SDIx MSb In SP41 Bit 14 - - - -1 LSb In Note: Refer to Figure 31-1 for load conditions. TABLE 31-34: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Maximum SCK Frequency SCKx Output Fall Time SCKx Output Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min — — — — — Typ(2) — — — — — Max 9 — — — — Units MHz ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 — Param No. SP10 SP20 SP21 SP30 SP31 SP35 SP36 SP40 SP41 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after — 6 20 ns TscL2doV SCKx Edge TdoV2sc, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge TdiV2scH, Setup Time of SDIx Data 30 — — ns — TdiV2scL Input to SCKx Edge TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge These parameters are characterized, but are not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. DS70291E-page 370 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-17: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx SP30, SP31 SDIx MSb Bit 14 - - - - - -1 LSb SP30, SP31 Bit 14 - - - -1 LSb In MSb In SP40 SP41 Note: Refer to Figure 31-1 for load conditions. TABLE 31-35: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Maximum SCK Frequency SCKx Output Fall Time SCKx Output Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min — — — — — Typ(2) — — — — — Max 9 — — — — Units MHz ns ns ns ns Conditions -40ºC to +125ºC and see Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 — Param No. SP10 SP20 SP21 SP30 SP31 SP35 SP36 SP40 SP41 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after — 6 20 ns TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to 30 — — ns — TdoV2scL First SCKx Edge TdiV2scH, Setup Time of SDIx Data 30 — — ns — TdiV2scL Input to SCKx Edge TscH2diL, Hold Time of SDIx Data Input 30 — — ns — TscL2diL to SCKx Edge These parameters are characterized, but are not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. © 2011 Microchip Technology Inc. DS70291E-page 371 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-18: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP50 SCKx (CKP = 0) SP70 SCKx (CKP = 1) SP35 SP72 MSb Bit 14 - - - - - -1 SP30,SP31 SDIx SDI MSb In SP41 SP40 Bit 14 - - - -1 LSb In LSb SP51 SP73 SP73 SP72 SP52 SDOx Note: Refer to Figure 31-1 for load conditions. DS70291E-page 372 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-36: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time SDOx Data Output Valid after SCKx Edge SDOx Data Output Setup to First SCKx Edge Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx ↓ to SCKx ↑ or SCKx Input SSx ↑ to SDOx Output High-Impedance(4) Min — — — — — — 30 30 30 120 10 1.5 TCY + 40 Typ(2) — — — — — 6 — — — — — — Max 15 — — — — 20 — — — — 50 — Units MHz ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 — — — — — — See Note 4 Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 SP60 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, TscL2doV TdoV2scH, TdoV2scL TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ TscH2ssH SSx after SCKx Edge TscL2ssH TssL2doV SDOx Data Output Valid after — — 50 ns — SSx Edge These parameters are characterized, but are not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. Assumes 50 pF load on all SPIx pins. © 2011 Microchip Technology Inc. DS70291E-page 373 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-19: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP50 SCKx (CKP = 0) SP70 SCKx (CKP = 1) SP35 SP52 SDOx MSb Bit 14 - - - - - -1 SP30,SP31 SDIx SDI MSb In SP41 SP40 Note: Refer to Figure 31-1 for load conditions. Bit 14 - - - -1 LSb In SP72 LSb SP51 SP73 SP73 SP72 SP52 DS70291E-page 374 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-37: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min — — — — — — 30 30 30 120 10 1.5 TCY + 40 — Typ(2) — — — — — 6 — — — — — — — Max 11 — — — — 20 — — — — 50 — 50 Units MHz ns ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 — — — — — — See Note 4 — Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 SP60 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx ↓ to SCKx ↑ or SCKx Input SSx ↑ to SDOx Output High-Impedance(4) TscH2ssH SSx after SCKx Edge TscL2ssH TssL2doV SDOx Data Output Valid after SSx Edge These parameters are characterized, but are not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. Assumes 50 pF load on all SPIx pins. © 2011 Microchip Technology Inc. DS70291E-page 375 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-20: SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SSX SP50 SCKX (CKP = 0) SP70 SCKX (CKP = 1) SP35 SDOX MSb SP72 SP73 SP73 SP72 SP52 Bit 14 - - - - - -1 SP30,SP31 LSb SP51 LSb In SDIX MSb In SP41 SP40 Bit 14 - - - -1 Note: Refer to Figure 31-1 for load conditions. DS70291E-page 376 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-38: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min — — — — — — 30 30 30 120 10 1.5 TCY + 40 Typ(2) — — — — — 6 — — — — — — Max 15 — — — — 20 — — — — 50 — Units MHz ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 — — — — — — See Note 4 Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx ↓ to SCKx ↑ or SCKx Input SSx ↑ to SDOx Output High-Impedance(4) TscH2ssH SSx after SCKx Edge TscL2ssH These parameters are characterized, but are not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. Assumes 50 pF load on all SPIx pins. © 2011 Microchip Technology Inc. DS70291E-page 377 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-21: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SSX SP50 SCKX (CKP = 0) SP70 SCKX (CKP = 1) SP35 SDOX MSb SP72 SP73 SP73 SP72 SP52 Bit 14 - - - - - -1 SP30,SP31 LSb SP51 LSb In SDIX MSb In SP41 SP40 Bit 14 - - - -1 Note: Refer to Figure 31-1 for load conditions. DS70291E-page 378 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-39: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min — — — — — — 30 30 30 120 10 1.5 TCY + 40 Typ(2) — — — — — 6 — — — — — — Max 11 — — — — 20 — — — — 50 — Units MHz ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 — — — — — — See Note 4 Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx ↓ to SCKx ↑ or SCKx Input SSx ↑ to SDOx Output High-Impedance(4) TscH2ssH SSx after SCKx Edge TscL2ssH These parameters are characterized, but are not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specificiation. Assumes 50 pF load on all SPIx pins. © 2011 Microchip Technology Inc. DS70291E-page 379 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-22: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCLx IM31 IM30 IM33 IM34 SDAx Start Condition Note: Refer to Figure 31-1 for load conditions. Stop Condition FIGURE 31-23: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM11 IM10 IM11 IM26 IM21 SCLx IM10 IM25 IM33 SDAx In IM40 IM40 IM45 SDAx Out Note: Refer to Figure 31-1 for load conditions. DS70291E-page 380 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-40: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Min(1) TCY/2 (BRG + 1) TCY/2 (BRG + 1) TCY/2 (BRG + 1) TCY/2 (BRG + 1) TCY/2 (BRG + 1) TCY/2 (BRG + 1) — 20 + 0.1 CB — — 20 + 0.1 CB — 250 100 Max — — — — — — 300 300 100 1000 300 300 — — Units μs μs μs μs μs μs ns ns ns ns ns ns ns ns Conditions — — — — — — CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF — Param Symbol No. IM10 IM11 IM20 IM21 IM25 IM26 IM30 IM31 IM33 IM34 IM40 IM45 IM50 IM51 Note 40 — ns THD:DAT Data Input 100 kHz mode 0 — μs — Hold Time 400 kHz mode 0 0.9 μs 1 MHz mode(2) 0.2 — μs TSU:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) — μs Only relevant for Setup Time Repeated Start 400 kHz mode TCY/2 (BRG + 1) — μs condition (2) 1 MHz mode TCY/2 (BRG + 1) — μs THD:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) — μs After this period the Hold Time first clock pulse is 400 kHz mode TCY/2 (BRG + 1) — μs generated 1 MHz mode(2) TCY/2 (BRG + 1) — μs TSU:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) — μs — Setup Time — μs 400 kHz mode TCY/2 (BRG + 1) 1 MHz mode(2) TCY/2 (BRG + 1) — μs THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) — ns — Hold Time 400 kHz mode TCY/2 (BRG + 1) — ns 1 MHz mode(2) TCY/2 (BRG + 1) — ns TAA:SCL Output Valid 100 kHz mode — 3500 ns — From Clock 400 kHz mode — 1000 ns — 1 MHz mode(2) — 400 ns — TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free before a new 400 kHz mode 1.3 — μs transmission can start (2) 1 MHz mode 0.5 — μs CB Bus Capacitive Loading — 400 pF — TPGD Pulse Gobbler Delay 65 390 ns See Note 3 1: BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. “Inter-Integrated Circuit™ (I2C™)” (DS70195) in the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site for the latest dsPIC33F/PIC24H Family Reference Manual sections. 2: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). 3: Typical value for this parameter is 130 ns. TLO:SCL Clock Low Time 100 kHz mode 400 kHz mode 1 MHz mode(2) THI:SCL Clock High Time 100 kHz mode 400 kHz mode 1 MHz mode(2) TF:SCL SDAx and SCLx 100 kHz mode Fall Time 400 kHz mode 1 MHz mode(2) TR:SCL SDAx and SCLx 100 kHz mode Rise Time 400 kHz mode 1 MHz mode(2) TSU:DAT Data Input 100 kHz mode Setup Time 400 kHz mode 1 MHz mode(2) © 2011 Microchip Technology Inc. DS70291E-page 381 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-24: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCLx IS31 IS30 IS33 IS34 SDAx Start Condition Stop Condition FIGURE 31-25: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS11 IS10 IS30 IS26 IS21 SCLx IS31 IS25 IS33 SDAx In IS40 IS40 IS45 SDAx Out DS70291E-page 382 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-41: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic 100 kHz mode 400 kHz mode 1 MHz mode(1) IS11 THI:SCL Clock High Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS20 TF:SCL SDAx and SCLx Fall Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS21 TR:SCL SDAx and SCLx Rise Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS25 TSU:DAT Data Input Setup Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS26 THD:DAT Data Input Hold Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS30 TSU:STA Start Condition Setup Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS31 THD:STA Start Condition Hold Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS33 TSU:STO Stop Condition Setup Time 100 kHz mode 400 kHz mode 1 MHz mode(1) IS34 THD:ST O AC CHARACTERISTICS Param. Symbol IS10 Min 4.7 1.3 0.5 4.0 0.6 0.5 — 20 + 0.1 CB — — 20 + 0.1 CB — 250 100 100 0 0 0 4.7 0.6 0.25 4.0 0.6 0.25 4.7 0.6 0.6 4000 600 250 0 0 0 4.7 1.3 0.5 — Max — — — — — — 300 300 100 1000 300 300 — — — — 0.9 0.3 — — — — — — — — — — — 3500 1000 350 — — — 400 Units μs μs μs μs μs μs ns ns ns ns ns ns ns ns ns μs μs μs μs μs μs μs μs μs μs μs μs ns ns ns ns ns ns μs μs μs pF Conditions Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz — Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz — CB is specified to be from 10 to 400 pF TLO:SCL Clock Low Time CB is specified to be from 10 to 400 pF — — Only relevant for Repeated Start condition After this period, the first clock pulse is generated — Stop Condition Hold Time 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) — IS40 TAA:SCL Output Valid From Clock — IS45 TBF:SDA Bus Free Time Time the bus must be free before a new transmission can start — IS50 CB Bus Capacitive Loading Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). © 2011 Microchip Technology Inc. DS70291E-page 383 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 FIGURE 31-26: ECAN MODULE I/O TIMING CHARACTERISTICS CiTx Pin (output) Old Value CA10 CA11 New Value CiRx Pin (input) CA20 TABLE 31-42: ECAN MODULE I/O TIMING REQUIREMENTS AC CHARACTERISTICS Param No. CA10 CA11 CA20 Note 1: 2: Characteristic(1) Port Output Fall Time Port Output Rise Time Pulse Width to Trigger CAN Wake-up Filter Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C Min — — 120 Typ(2) — — — Max — — — Units ns ns ns Conditions See parameter D032 See parameter D031 — Symbol TioF TioR Tcwf These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70291E-page 384 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-43: ADC MODULE SPECIFICATIONS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min. Typ Max. Units Conditions Param Symbol No. Characteristic Device Supply AD01 AVDD Module VDD Supply Greater of VDD – 0.3 or 3.0 VSS – 0.3 AVSS + 2.5 3.0 VREFL Reference Voltage Low AVSS 0 VREF IREF IAD Absolute Reference Voltage Current Drain Operating Current 2.5 — — — — Lesser of VDD + 0.3 or 3.6 VSS + 0.3 AVDD 3.6 AVDD – 2.5 0 3.6 10 9.0 3.2 V — V V V V V V μA mA mA VREFH = AVDD VREFL = AVSS = 0 VREF = VREFH - VREFL ADC off ADC operating in 10-bit mode, see Note 1 ADC operating in 12-bit mode, see Note 1 This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), positive input This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), negative input 10-bit ADC 12-bit ADC VREFH = AVDD VREFL = AVSS = 0 — AD02 AD05 AD05a AD06 AD06a AD07 AD08 AD09 AVSS VREFH Module VSS Supply Reference Voltage High — — — — — — — 7.0 2.7 Reference Inputs Analog Input AD12 VINH Input Voltage Range VINH VINL — VREFH V AD13 VINL Input Voltage Range VINL VREFL — AVSS + 1V V AD17 RIN Recommended Impedance of Analog Voltage Source — — — — 200 200 Ω Ω Note 1: These parameters are not characterized or tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 385 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-44: ADC MODULE SPECIFICATIONS (12-BIT MODE) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Min. Typ Max. Units Conditions Param No. AD20a AD21a AD22a AD23a AD24a AD25a AD20a AD21a AD22a AD23a AD24a AD25a AD30a AD31a AD32a AD33a AD34a Note 1: Symbol ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREFNr INL DNL GERR EOFF — Nr INL DNL GERR EOFF — THD SINAD SFDR FNYQ ENOB Resolution(1) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Resolution(1) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Total Harmonic Distortion Signal to Noise and Distortion Spurious Free Dynamic Range Input Signal Bandwidth Effective Number of Bits -2 >-1 2 2 — — 68.5 80 — 11.09 -2 >-1 — — — 12 data bits — — 3.4 0.9 — 12 data bits — — 10.5 3.8 — — 69.5 — — 11.3 +2 (VDD + 0.3V) or VIL source < (VSS – 0.3V). DS70291E-page 386 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 31-45: ADC MODULE SPECIFICATIONS (10-BIT MODE) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Min. Typ Max. Units Conditions Param No. AD20b AD21b AD22b AD23b AD24b AD25b AD20b AD21b AD22b AD23b AD24b AD25b AD30b AD31b AD32b AD33b AD34b Note 1: Symbol ADC Accuracy (10-bit Mode) – Measurements with external VREF+/VREFNr INL DNL GERR EOFF — Nr INL DNL GERR EOFF — THD SINAD SFDR FNYQ ENOB Resolution(1) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Resolution(1) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Total Harmonic Distortion Signal to Noise and Distortion Spurious Free Dynamic Range Input Signal Bandwidth Effective Number of Bits -1 >-1 3 1.5 — — 57 72 — 9.16 -1.5 >-1 — — — 10 data bits — — 3 2 — 10 data bits — — 7 3 — — 58.5 — — 9.4 +1 -1 -2 -3 12 data bits — — — — +2 -1 2 2 — 12 data bits — — — — — +2 | 0 | can affect the ADC results by approximately 4-6 counts. © 2011 Microchip Technology Inc. DS70291E-page 403 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 32-16: ADC MODULE SPECIFICATIONS (10-BIT MODE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions ADC Accuracy (10-bit Mode) – Measurements with External VREF+/VREF-(1) HAD20b Nr HAD21b INL HAD22b DNL HAD23b GERR HAD24b EOFF Resolution(3) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error -3 > -1 -5 -1 10 data bits — — — — 3 -1 -5 -1.5 — 10 data bits — — — — — 2 | 0 | can affect the ADC results by approximately 4-6 counts. DS70291E-page 404 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE 32-17: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions Clock Parameters HAD50 HAD56 Note 1: TAD FCNV ADC Clock Period(1) 147 Conversion Rate Throughput Rate(1) — — 400 Ksps — These parameters are characterized but not tested in manufacturing. — — ns — TABLE 32-18: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40°C ≤ TA ≤ +150°C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions Clock Parameters HAD50 HAD56 Note 1: TAD FCNV ADC Clock Period(1) Throughput Rate(1) 104 — — — — 800 ns Ksps — — Conversion Rate These parameters are characterized but not tested in manufacturing. © 2011 Microchip Technology Inc. DS70291E-page 405 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 406 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 33.0 PACKAGING INFORMATION 28-Lead SPDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example dsPIC33FJ32MC 302-E/SP e3 0730235 28-Lead SOIC (.300”) XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example dsPIC33FJ32MC 302-E/SO e3 0730235 28-Lead QFN-S Example XXXXXXXX XXXXXXXX YYWWNNN 44-Lead QFN 33FJ32MC 302EMM e3 0730235 Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN 44-Lead TQFP dsPIC 33FJ32MC304 -E/ML e3 0730235 Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN * Note: dsPIC 33FJ32MC304 -I/PT e3 0730235 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. e3 If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2011 Microchip Technology Inc. DS70291E-page 407 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 33.1 Package Details 28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 3 D E A A2 L c eB A1 b1 b e Units Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing § N e A A2 A1 E E1 D L c b1 b eB – .120 .015 .290 .240 1.345 .110 .008 .040 .014 – MIN INCHES NOM 28 .100 BSC – .135 – .310 .285 1.365 .130 .010 .050 .018 – .200 .150 – .335 .295 1.400 .150 .015 .070 .022 MAX .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-070B DS70291E-page 408 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 123 e b h h φ c α A A2 L A1 L1 β Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Top Lead Thickness Lead Width Mold Draft Angle Top N e A A2 A1 E E1 D h L L1 φ c b α 0° 0.18 0.31 5° 0.25 0.40 – 2.05 0.10 MIN MILLMETERS NOM 28 1.27 BSC – – – 10.30 BSC 7.50 BSC 17.90 BSC – – 1.40 REF – – – – 8° 0.33 0.51 15° 0.75 1.27 2.65 – 0.30 MAX Mold Draft Angle Bottom β 5° – 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-052B © 2011 Microchip Technology Inc. DS70291E-page 409 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S] with 0.40 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D2 D EXPOSED PAD e E2 E b 2 1 2 1 N L TOP VIEW NOTE 1 BOTTOM VIEW K N A A3 A1 Units Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Width Exposed Pad Width Overall Length Exposed Pad Length Contact Width Contact Length Contact-to-Exposed Pad N e A A1 A3 E E2 D D2 b L K 3.65 0.23 0.30 0.20 3.65 0.80 0.00 MIN MILLIMETERS NOM 28 0.65 BSC 0.90 0.02 0.20 REF 6.00 BSC 3.70 6.00 BSC 3.70 0.38 0.40 – 4.70 0.43 0.50 – 4.70 1.00 0.05 MAX Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-124B DS70291E-page 410 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 /HDG 3ODVWLF 4XDG )ODW 1R /HDG 3DFNDJH 00 ± [[ PP %RG\ >4)16@ ZLWK  PP &RQWDFW /HQJWK 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ © 2011 Microchip Technology Inc. DS70291E-page 411 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 /HDG 3ODVWLF 7KLQ 4XDG )ODWSDFN 37 ± [[ PP %RG\  PP >74)3@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D D1 E e E1 N b NOTE 1 123 φ NOTE 2 A c α β A1 L L1 A2 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI /HDGV /HDG 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII )RRW /HQJWK )RRWSULQW )RRW $QJOH 2YHUDOO :LGWK 2YHUDOO /HQJWK 0ROGHG 3DFNDJH :LGWK 0ROGHG 3DFNDJH /HQJWK /HDG 7KLFNQHVV /HDG :LGWK 0ROG 'UDIW $QJOH 7RS 0ROG 'UDIW $QJOH %RWWRP 1 H $ $ $ / / I ( ' ( ' F E D E   ƒ ƒ ƒ ±    0,1 0,//,0(7(56 120   %6& ±  ±   5() ƒ  %6&  %6&  %6&  %6& ±  ƒ ƒ   ƒ ƒ ƒ     0$; 1RWHV  3LQ  YLVXDO LQGH[ IHDWXUH PD\ YDU\ EXW PXVW EH ORFDWHG ZLWKLQ WKH KDWFKHG DUHD  &KDPIHUV DW FRUQHUV DUH RSWLRQDO VL]H PD\ YDU\  'LPHQVLRQV ' DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG  PP SHU VLGH  'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( 4)1@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ © 2011 Microchip Technology Inc. DS70291E-page 415 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 416 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 APPENDIX A: REVISION HISTORY Revision A (August 2007) Initial release of this document. Revision B (March 2008) This revision includes minor typographical and formatting changes throughout the data sheet text. In addition, redundant information was removed that is now available in the respective chapters of the “dsPIC33F/PIC24H Family Reference Manual”, which can be obtained from the Microchip web site (www.microchip.com). The major changes are referenced by their respective section in the following table. TABLE A-1: MAJOR SECTION UPDATES Section Name Update Description Note 1 added to all pin diagrams (see “Pin Diagrams”) Add External Interrupts column and Note 4 to the “dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 and dsPIC33FJ128MCX02/X04 Controller Families” table Updated parameters PMA0, PMA1 and PMD0 through PMPD7 (Table 1-1) Updated FAEN bits in Table 4-8 IFS0-IFSO4 changed to IFSX (see Section 6.3.2 “IFSx”) IEC0-IEC4 changed to IECX (see Section 6.3.3 “IECx”) IPC0-IPC19 changed to IPCx (see Section 6.3.4 “IPCx”) “High-Performance, 16-bit Digital Signal Controllers” Section 1.0 “Device Overview” Section 3.0 “Memory Organization” Section 6.0 “Interrupt Controller” Section 7.0 “Direct Memory Access (DMA)” Section 8.0 “Oscillator Configuration” Updated parameter PMP (see Table 8-1) Updated the third clock source item (External Clock) in Section 8.1.1 “System Clock Sources” Updated TUN (OSCTUN) bit description (see Register 8-4) Section 21.0 “10-bit/12-bit Analog-to-Digital Converter (ADC1)” Section 27.0 “Special Features” Added Note 2 to Figure 21-3 Added Note 2 to Figure 27-1 Added parameter FICD in Table 27-1 Added parameters BKBUG, COE, JTAGEN and ICS in Table 27-2 Added Note after second paragraph in Section 27.2 “On-Chip Voltage Regulator” © 2011 Microchip Technology Inc. DS70291E-page 417 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE A-1: MAJOR SECTION UPDATES (CONTINUED) Section Name Section 30.0 “Electrical Characteristics” Update Description Updated Max MIPS for temperature range of -40ºC to +125ºC in Table 30-1 Updated typical values in Thermal Packaging Characteristics in Table 30-3 Added parameters DI11 and DI12 to Table 30-9 Updated minimum values for parameters D136 (TRW) and D137 (TPE) and removed typical values in Table 30-12 Added Extended temperature range to Table 30-13 Updated Note 2 in Table 30-38 Updated parameter AD63 and added Note 3 to Table 30-42 and Table 30-43 DS70291E-page 418 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Revision C (May 2009) This revision includes minor typographical and formatting changes throughout the data sheet text. Global changes include: • Changed all instances of OSCI to OSC1 and OSCO to OSC2 • Changed all instances of VDDCORE and VDDCORE/ VCAP to VCAP/VDDCORE The other changes are referenced by their respective section in the following table. TABLE A-2: MAJOR SECTION UPDATES Update Description Updated all pin diagrams to denote the pin voltage tolerance (see “Pin Diagrams”). Added Note 2 to the 28-Pin QFN-S and 44-Pin QFN pin diagrams, which references pin connections to VSS. Section Name “High-Performance, 16-bit Digital Signal Controllers” Section 1.0 “Device Overview” Section 2.0 “Guidelines for Getting Started with 16-bit Digital Signal Controllers” Section 3.0 “CPU” Updated AVDD in the PINOUT I/O Descriptions (see Table 1-1). Added new section to the data sheet that provides guidelines on getting started with 16-bit Digital Signal Controllers. Updated CPU Core Block Diagram with a connection from the DSP Engine to the Y Data Bus (see Figure 3-1). Vertically extended the X and Y Data Bus lines in the DSP Engine Block Diagram (see Figure 3-3). Section 4.0 “Memory Organization” Updated Reset value for CORCON in the CPU Core Register Map (see Table 4-1). Removed the FLTA1IE bit (IEC3) from the Interrupt Controller Register Map (see Table 4-4). Updated bit locations for RPINR25 in the Peripheral Pin Select Input Register Map (see Table 4-24). Updated the Reset value for CLKDIV in the System Control Register Map (see Table 4-36). Section 5.0 “Flash Program Memory” Section 9.0 “Oscillator Configuration” Updated Section 5.3 “Programming Operations” with programming time formula. Updated the Oscillator System Diagram and added Note 2 (see Figure 9-1). Updated default bit values for DOZE and FRCDIV in the Clock Divisor (CLKDIV) Register (see Register 9-2). Added a paragraph regarding FRC accuracy at the end of Section 9.1.1 “System Clock Sources”. Added Note 3 to Section 9.2.2 “Oscillator Switching Sequence”. Added Note 1 to the FRC Oscillator Tuning (OSCTUN) Register (see Register 9-4). Section 10.0 “Power-Saving Features” Added the following registers: • PMD1: Peripheral Module Disable Control Register 1 (Register 10-1) • PMD2: Peripheral Module Disable Control Register 2 (Register 10-2) • PMD3: Peripheral Module Disable Control Register 3 (Register 10-3) © 2011 Microchip Technology Inc. DS70291E-page 419 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE A-2: MAJOR SECTION UPDATES (CONTINUED) Update Description Removed Table 11-1 and added reference to pin diagrams for I/O pin availability and functionality. Added paragraph on ADPCFG register default values to Section 11.3 “Configuring Analog Port Pins”. Added Note box regarding PPS functionality with input mapping to Section 11.6.2.1 “Input Mapping”. Section 18.0 “Serial Peripheral Interface (SPI)” Added Note 2 and 3 to the SPIxCON1 register (see Register 18-2). Section Name Section 11.0 “I/O Ports” Section 20.0 “Universal Updated the Notes in the UxMode register (see Register 20-1). Asynchronous Receiver Transmitter Updated the UTXINV bit settings in the UxSTA register and added Note 1 (UART)” (see Register 20-2). Section 21.0 “Enhanced CAN (ECAN™) Module” Section 22.0 “10-bit/12-bit Analogto-Digital Converter (ADC1)” Changed bit 11 in the ECAN Control Register 1 (CiCTRL1) to Reserved (see Register 21-1). Replaced the ADC1 Module Block Diagrams with new diagrams (see Figure 22-1 and Figure 22-2). Updated bit values for ADCS and added Notes 1 and 2 to the ADC1 Control Register 3 (AD1CON3) (see Register 22-3). Added Note 2 to the ADC1 Input Scan Select Register Low (AD1CSSL) (see Register 22-7). Added Note 2 to the ADC1 Port Configuration Register Low (AD1PCFGL) (see Register 22-8). Section 23.0 “Audio Digital-toAnalog Converter (DAC)” Updated the midpoint voltage in the last sentence of the first paragraph. Updated the voltage swing values in the last sentence of the last paragraph in Section 23.3 “DAC Output Format”. Updated the Comparator Voltage Reference Block Diagram (see Figure 24-2). Updated the minimum positive adjust value for CAL in the RTCC Calibration and Configuration (RCFGCAL) Register (see Register 25-1). Added Note 1 to the Device Configuration Register Map (see Table 28-1). Updated Note 1 in the dsPIC33F Configuration Bits Description (see Table 28-2). Section 24.0 “Comparator Module” Section 25.0 “Real-Time Clock and Calendar (RTCC)” Section 28.0 “Special Features” DS70291E-page 420 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE A-2: MAJOR SECTION UPDATES (CONTINUED) Update Description Updated Typical values for Thermal Packaging Characteristics (see Table 31-3). Updated Min and Max values for parameter DC12 (RAM Data Retention Voltage) and added Note 4 (see Table 31-4). Updated Power-Down Current Max values for parameters DC60b and DC60c (see Table 31-7). Updated Characteristics for I/O Pin Input Specifications (see Table 31-9). Updated Program Memory values for parameters 136, 137 and 138 (renamed to 136a, 137a and 138a), added parameters 136b, 137b and 138b, and added Note 2 (see Table 31-12). Added parameter OS42 (GM) to the External Clock Timing Requirements (see Table 31-16). Updated Watchdog Timer Time-out Period parameter SY20 (see Table 31-21). Removed VOMIN, renamed VOMAX to VO, and updated the Min and Max values in the Audio DAC Module Specifications (see Table 31-44). Section Name Section 31.0 “Electrical Characteristics” © 2011 Microchip Technology Inc. DS70291E-page 421 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Revision D (November 2009) The revision includes the following global update: • Added Note 2 to the shaded table that appears at the beginning of each chapter. This new note provides information regarding the availability of registers and their associated bits This revision also includes minor typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE A-3: MAJOR SECTION UPDATES Section Name Update Description Added information on high temperature operation (see “Operating Range:”). Changed the reference to digital-only pins to 5V tolerant pins in the second paragraph of Section 11.2 “Open-Drain Configuration”. Updated the two baud rate range features to: 10 Mbps to 38 bps at 40 MIPS. “High-Performance, 16-bit Digital Signal Controllers” Section 11.0 “I/O Ports” Section 20.0 “Universal Asynchronous Receiver Transmitter (UART)” Section 22.0 “10-bit/12-bit Analog-to-Digital Updated the ADC block diagrams (see Figure 22-1 and Figure 22-2). Converter (ADC1)” Section 23.0 “Audio Digital-to-Analog Converter (DAC)” Removed last sentence of the first paragraph in the section. Added a shaded note to Section 23.2 “DAC Module Operation”. Updated Figure 23-2: “Audio DAC Output for Ramp Input (Unsigned)”. Section 28.0 “Special Features” Updated the second paragraph and removed the fourth paragraph in Section 28.1 “Configuration Bits”. Updated the Device Configuration Register Map (see Table 28-1). Section 31.0 “Electrical Characteristics” Updated the Absolute Maximum Ratings for high temperature and added Note 4. Removed parameters DI26, DI28 and DI29 from the I/O Pin Input Specifications (see Table 31-9). Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics (see Figure 31-17). Removed Table 31-45: Audio DAC Module Specifications. Original contents were updated and combined with Table 31-44 of the same name. Section 32.0 “High Temperature Electrical Characteristics” “Product Identification System” Added new chapter with high temperature specifications. Added the “H” definition for high temperature. DS70291E-page 422 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Revision E (January 2011) This revision includes typographical and formatting changes throughout the data sheet text. In addition, the Preliminary marking in the footer was removed. All instances of VDDCORE have been removed. All other major changes are referenced by their respective section in the following table. TABLE A-4: MAJOR SECTION UPDATES Section Name Update Description The high temperature end range was updated to +150ºC (see “Operating Range:”). Updated the title of Section 2.3 “CPU Logic Filter Capacitor Connection (VCAP)”. The frequency limitation for device PLL start-up conditions was updated in Section 2.7 “Oscillator Value Conditions on Device Start-up”. The second paragraph in Section 2.9 “Unused I/Os” was updated. “High-Performance, 16-Bit Digital Signal Controllers” Section 2.0 “Guidelines for Getting Started with 16-bit Digital Signal Controllers” Section 4.0 “Memory Organization” The All Resets values for the following SFRs in the Timer Register Map were changed (see Table 4-5): • TMR1 • TMR2 • TMR3 • TMR4 • TMR5 Added Note 3 to the OSCCON: Oscillator Control Register (see Register 9-1). Added Note 2 to the CLKDIV: Clock Divisor Register (see Register 9-2). Added Note 1 to the PLLFBD: PLL Feedback Divisor Register (see Register 9-3). Added Note 2 to the OSCTUN: FRC Oscillator Tuning Register (see Register 9-4). Added Note 1 to the ACLKCON: Auxiliary Control Register (see Register 9-5). Section 9.0 “Oscillator Configuration” Section 22.0 “10-bit/12-bit Analog-to-Digital Updated the VREFL references in the ADC1 module block diagrams Converter (ADC1)” (see Figure 22-1 and Figure 22-2). Section 28.0 “Special Features” Added a new paragraph and removed the third paragraph in Section 28.1 “Configuration Bits”. Added the column “RTSP Effects” to the dsPIC33F Configuration Bits Descriptions (see Table 28-2). © 2011 Microchip Technology Inc. DS70291E-page 423 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE A-4: MAJOR SECTION UPDATES (CONTINUED) Section Name Section 31.0 “Electrical Characteristics” Update Description Updated the maximum value for Extended Temperature Devices in the Thermal Operating Conditions (see Table 31-2). Removed Note 4 from the DC Temperature and Voltage Specifications (see Table 31-4). Updated all typical and maximum Operating Current (IDD) values (see Table 31-5). Updated all typical and maximum Idle Current (IIDLE) values (see Table 31-6). Updated the maximum Power-Down Current (IPD) values for parameters DC60d, DC60a, and DC60b (see Table 31-7). Updated all typical Doze Current (Idoze) values (see Table 31-8). Updated the maximum value for parameter DI19 and added parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input Specifications (see Table 31-9). Added Note 2 to the PLL Clock Timing Specifications (see Table 31-17) Removed Note 2 from the AC Characteristics: Internal RC Accuracy (see Table 31-18). Updated the Internal RC Accuracy minimum and maximum values for parameter F21b (see Table 31-19). Updated the characteristic description for parameter DI35 in the I/O Timing Requirements (see Table 31-20). Updated all SPI specifications (see Table 31-32 through Table 31-39 and Figure 31-14 through Figure 31-21) Updated the ADC Module Specification minimum values for parameters AD05 and AD07, and updated the maximum value for parameter AD06 (see Table 31-43). Updated the ADC Module Specifications (12-bit Mode) minimum and maximum values for parameter AD21a (see Table 31-44). Updated all ADC Module Specifications (10-bit Mode) values, with the exception of Dynamic Performance (see Table 31-45). Updated the minimum value for parameter PM6 and the maximum value for parameter PM7 in the Parallel Master Port Read Timing Requirements (see Table 31-54). Added DMA Read/Write Timing Requirements (see Table 31-56). DS70291E-page 424 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 TABLE A-4: MAJOR SECTION UPDATES (CONTINUED) Section Name Section 32.0 “High Temperature Electrical Characteristics” Update Description Updated all ambient temperature end range values to +150ºC throughout the chapter. Updated the storage temperature end range to +160ºC. Updated the maximum junction temperature from +145ºC to +155ºC. Updated the maximum values for High Temperature Devices in the Thermal Operating Conditions (see Table 32-2). Updated the ADC Module Specifications (12-bit Mode) (see Table 32-14). Updated the ADC Module Specifications (10-bit Mode) (see Table 32-15). “Product Identification System” Updated the end range temperature value for H (High) devices. © 2011 Microchip Technology Inc. DS70291E-page 425 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 426 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 INDEX A A/D Converter ................................................................... 273 DMA .......................................................................... 273 Initialization ............................................................... 273 Key Features............................................................. 273 AC Characteristics .................................................... 354, 394 ADC Module.............................................................. 397 ADC Module (10-bit Mode) ....................................... 397 ADC Module (12-bit Mode) ....................................... 397 Internal RC Accuracy ................................................ 356 Load Conditions ................................................ 354, 394 ADC Module ADC11 Register Map ............................................ 54, 55 Alternate Interrupt Vector Table (AIVT) .............................. 91 Arithmetic Logic Unit (ALU)................................................. 33 Assembler MPASM Assembler................................................... 340 Control Register.......................................................... 29 CPU Clocking System ...................................................... 146 PLL Configuration..................................................... 147 Selection................................................................... 146 Sources .................................................................... 146 Customer Change Notification Service............................. 423 Customer Notification Service .......................................... 423 Customer Support............................................................. 423 D Data Accumulators and Adder/Subtracter .......................... 35 Data Space Write Saturation ...................................... 37 Overflow and Saturation ............................................. 35 Round Logic ............................................................... 36 Write Back .................................................................. 36 Data Address Space........................................................... 41 Alignment.................................................................... 41 Memory Map for dsPIC33FJ128MC202/204 and dsPIC33FJ64MC202/204 Devices with 8 KB RAM ................................................... 43 Memory Map for dsPIC33FJ128MC802/804 and dsPIC33FJ64MC802/804 Devices with 16 KB RAM ................................................. 44 Memory Map for dsPIC33FJ32MC302/304 Devices with 4 KB RAM........................................................... 42 Near Data Space ........................................................ 41 Software Stack ........................................................... 67 Width .......................................................................... 41 DC Characteristics............................................................ 344 Doze Current (IDOZE)................................................ 393 High Temperature..................................................... 392 I/O Pin Input Specifications ...................................... 349 I/O Pin Output........................................................... 393 I/O Pin Output Specifications.................................... 352 Idle Current (IDOZE) .................................................. 348 Idle Current (IIDLE) .................................................... 347 Operating Current (IDD) ............................................ 346 Operating MIPS vs. Voltage ..................................... 392 Power-Down Current (IPD)........................................ 348 Power-down Current (IPD) ........................................ 392 Program Memory.............................................. 353, 393 Temperature and Voltage......................................... 392 Temperature and Voltage Specifications.................. 345 Thermal Operating Conditions.................................. 392 Development Support ....................................................... 339 DMA Module DMA Register Map ..................................................... 56 DMAC Registers ............................................................... 135 DMAxCNT ................................................................ 135 DMAxCON................................................................ 135 DMAxPAD ................................................................ 135 DMAxREQ ................................................................ 135 DMAxSTA................................................................. 135 DMAxSTB................................................................. 135 Doze Mode ....................................................................... 158 DSP Engine ........................................................................ 33 Multiplier ..................................................................... 35 B Barrel Shifter ....................................................................... 37 Bit-Reversed Addressing .................................................... 70 Example ...................................................................... 71 Implementation ........................................................... 70 Sequence Table (16-Entry)......................................... 71 Block Diagrams 16-bit Timer1 Module ................................................ 195 A/D Module ....................................................... 274, 275 Connections for On-Chip Voltage Regulator............. 325 Device Clock ..................................................... 145, 147 DSP Engine ................................................................ 34 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04, and dsPIC33FJ128MCX02/X04.......................... 16 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04, and dsPIC33FJ128MCX02/X04 CPU Core ........ 27 ECAN Module ........................................................... 248 Input Capture ............................................................ 203 Output Compare ....................................................... 205 PLL............................................................................ 147 PWM Module .................................................... 210, 211 Quadrature Encoder Interface .................................. 223 Reset System.............................................................. 83 Shared Port Structure ............................................... 163 SPI ............................................................................ 227 Timer2 (16-bit) .......................................................... 197 Timer2/3 (32-bit) ....................................................... 199 UART ........................................................................ 241 Watchdog Timer (WDT) ............................................ 326 C C Compilers MPLAB C18 .............................................................. 340 Clock Switching................................................................. 155 Enabling .................................................................... 155 Sequence.................................................................. 155 Code Examples Erasing a Program Memory Page............................... 81 Initiating a Programming Sequence............................ 82 Loading Write Buffers ................................................. 82 Port Write/Read ........................................................ 164 PWRSAV Instruction Syntax..................................... 157 Code Protection ........................................................ 321, 327 Comparator Module .......................................................... 287 Configuration Bits.............................................................. 321 Configuration Register Map .............................................. 321 Configuring Analog Port Pins ............................................ 164 CPU E ECAN Module CiBUFPNT1 register................................................. 259 CiBUFPNT2 register................................................. 260 CiBUFPNT3 register................................................. 260 CiBUFPNT4 register................................................. 261 CiCFG1 register........................................................ 257 CiCFG2 register........................................................ 258 © 2011 Microchip Technology Inc. DS70291E-page 427 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 CiCTRL1 register ...................................................... 250 CiCTRL2 register ...................................................... 251 CiEC register............................................................. 257 CiFCTRL register ...................................................... 253 CiFEN1 register ........................................................ 259 CiFIFO register ......................................................... 254 CiFMSKSEL1 register ............................................... 263 CiFMSKSEL2 register ............................................... 264 CiINTE register ......................................................... 256 CiINTF register.......................................................... 255 CiRXFnEID register .................................................. 263 CiRXFnSID register .................................................. 262 CiRXFUL1 register .................................................... 266 CiRXFUL2 register .................................................... 266 CiRXMnEID register.................................................. 265 CiRXMnSID register.................................................. 265 CiRXOVF1 register ................................................... 267 CiRXOVF2 register ................................................... 267 CiTRmnCON register ................................................ 268 CiVEC register .......................................................... 252 ECAN1 Register Map (C1CTRL1.WIN = 0 or 1) ......... 58 ECAN1 Register Map (C1CTRL1.WIN = 0) ................ 58 ECAN1 Register Map (C1CTRL1.WIN = 1) ................ 59 Frame Types ............................................................. 247 Modes of Operation .................................................. 249 Overview ................................................................... 247 ECAN Registers Acceptance Filter Enable Register (CiFEN1)............ 259 Acceptance Filter Extended Identifier Register n (CiRXFnEID)................................................................. 263 Acceptance Filter Mask Extended Identifier Register n (CiRXMnEID) .................................................... 265 Acceptance Filter Mask Standard Identifier Register n (CiRXMnSID) .................................................... 265 Acceptance Filter Standard Identifier Register n (CiRXFnSID)................................................................. 262 Baud Rate Configuration Register 1 (CiCFG1) ......... 257 Baud Rate Configuration Register 2 (CiCFG2) ......... 258 Control Register 1 (CiCTRL1) ................................... 250 Control Register 2 (CiCTRL2) ................................... 251 FIFO Control Register (CiFCTRL) ............................ 253 FIFO Status Register (CiFIFO) ................................. 254 Filter 0-3 Buffer Pointer Register (CiBUFPNT1) ....... 259 Filter 12-15 Buffer Pointer Register (CiBUFPNT4) ... 261 Filter 15-8 Mask Selection Register (CiFMSKSEL2). 264 Filter 4-7 Buffer Pointer Register (CiBUFPNT2) ....... 260 Filter 7-0 Mask Selection Register (CiFMSKSEL1)... 263 Filter 8-11 Buffer Pointer Register (CiBUFPNT3) ..... 260 Interrupt Code Register (CiVEC) .............................. 252 Interrupt Enable Register (CiINTE) ........................... 256 Interrupt Flag Register (CiINTF) ............................... 255 Receive Buffer Full Register 1 (CiRXFUL1).............. 266 Receive Buffer Full Register 2 (CiRXFUL2).............. 266 Receive Buffer Overflow Register 2 (CiRXOVF2)..... 267 Receive Overflow Register (CiRXOVF1) .................. 267 ECAN Transmit/Receive Error Count Register (CiEC) ..... 257 ECAN TX/RX Buffer m Control Register (CiTRmnCON) .. 268 Electrical Characteristics................................................... 343 AC ..................................................................... 354, 394 Enhanced CAN Module..................................................... 247 Equations Device Operating Frequency .................................... 146 Errata .................................................................................. 13 Programming Algorithm .............................................. 81 RTSP Operation ......................................................... 78 Table Instructions ....................................................... 77 Flexible Configuration ....................................................... 321 H High Temperature Electrical Characteristics .................... 391 I I/O Ports............................................................................ 163 Parallel I/O (PIO) ...................................................... 163 Write/Read Timing .................................................... 164 I2 C Operating Modes ...................................................... 233 Registers .................................................................. 233 In-Circuit Debugger........................................................... 327 In-Circuit Emulation .......................................................... 321 In-Circuit Serial Programming (ICSP)....................... 321, 327 Input Capture .................................................................... 203 Registers .................................................................. 204 Input Change Notification ................................................. 164 Instruction Addressing Modes ............................................ 67 File Register Instructions ............................................ 67 Fundamental Modes Supported ................................. 68 MAC Instructions ........................................................ 68 MCU Instructions ........................................................ 67 Move and Accumulator Instructions............................ 68 Other Instructions ....................................................... 68 Instruction Set Overview................................................................... 334 Summary .................................................................. 331 Instruction-Based Power-Saving Modes........................... 157 Idle ............................................................................ 158 Sleep ........................................................................ 157 Internal RC Oscillator Use with WDT........................................................... 326 Internet Address ............................................................... 423 Interrupt Control and Status Registers ............................... 95 IECx ............................................................................ 95 IFSx ............................................................................ 95 INTCON1 .................................................................... 95 INTCON2 .................................................................... 95 IPCx ............................................................................ 95 Interrupt Setup Procedures............................................... 132 Initialization ............................................................... 132 Interrupt Disable ....................................................... 132 Interrupt Service Routine .......................................... 132 Trap Service Routine ................................................ 132 Interrupt Vector Table (IVT) ................................................ 91 Interrupts Coincident with Power Save Instructions ......... 158 J JTAG Boundary Scan Interface ........................................ 321 JTAG Interface.................................................................. 327 M Memory Organization ......................................................... 39 Microchip Internet Web Site.............................................. 423 Modes of Operation Disable...................................................................... 249 Initialization ............................................................... 249 Listen All Messages.................................................. 249 Listen Only................................................................ 249 Loopback .................................................................. 249 Normal Operation ..................................................... 249 Modulo Addressing ............................................................. 69 Applicability................................................................. 70 Operation Example ..................................................... 69 F Flash Program Memory....................................................... 77 Control Registers ........................................................ 78 Operations .................................................................. 78 DS70291E-page 428 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Start and End Address................................................ 69 W Address Register Selection .................................... 69 Motor Control PWM .......................................................... 209 Motor Control PWM Module 2-Output Register Map................................................ 52 6-Output Register Map................................................ 51 MPLAB ASM30 Assembler, Linker, Librarian ................... 340 MPLAB Integrated Development Environment Software .. 339 MPLAB PM3 Device Programmer .................................... 342 MPLAB REAL ICE In-Circuit Emulator System................. 341 MPLINK Object Linker/MPLIB Object Librarian ................ 340 AD1CON2 (ADC1 Control 2) .................................... 279 AD1CON3 (ADC1 Control 3) .................................... 280 AD1CON4 (ADC1 Control 4) .................................... 281 AD1CSSL (ADC1 Input Scan Select Low) ............... 286 AD1PCFGL (ADC1 Port Configuration Low) ............ 286 CiBUFPNT1 (ECAN Filter 0-3 Buffer Pointer) .......... 259 CiBUFPNT2 (ECAN Filter 4-7 Buffer Pointer) .......... 260 CiBUFPNT3 (ECAN Filter 8-11 Buffer Pointer) ........ 260 CiBUFPNT4 (ECAN Filter 12-15 Buffer Pointer) ...... 261 CiCFG1 (ECAN Baud Rate Configuration 1)............ 257 CiCFG2 (ECAN Baud Rate Configuration 2)............ 258 CiCTRL1 (ECAN Control 1)...................................... 250 CiCTRL2 (ECAN Control 2)...................................... 251 CiEC (ECAN Transmit/Receive Error Count) ........... 257 CiFCTRL (ECAN FIFO Control) ............................... 253 CiFEN1 (ECAN Acceptance Filter Enable)............... 259 CiFIFO (ECAN FIFO Status) .................................... 254 CiFMSKSEL1 (ECAN Filter 7-0 Mask Selection) .... 263, 264 CiINTE (ECAN Interrupt Enable) .............................. 256 CiINTF (ECAN Interrupt Flag) .................................. 255 CiRXFnEID (ECAN Acceptance Filter n Extended Identifier) ................................................................... 263 CiRXFnSID (ECAN Acceptance Filter n Standard Identifier) ................................................................... 262 CiRXFUL1 (ECAN Receive Buffer Full 1)................. 266 CiRXFUL2 (ECAN Receive Buffer Full 2)................. 266 CiRXMnEID (ECAN Acceptance Filter Mask n Extended Identifier) .......................................................... 265 CiRXMnSID (ECAN Acceptance Filter Mask n Standard Identifier) .......................................................... 265 CiRXOVF1 (ECAN Receive Buffer Overflow 1)........ 267 CiRXOVF2 (ECAN Receive Buffer Overflow 2)........ 267 CiTRBnSID (ECAN Buffer n Standard Identifier)..... 269, 270, 272 CiTRmnCON (ECAN TX/RX Buffer m Control) ........ 268 CiVEC (ECAN Interrupt Code) ................................. 252 CLKDIV (Clock Divisor) ............................................ 151 CORCON (Core Control)...................................... 31, 96 DFLTCON (QEI Control) .......................................... 226 DMACS0 (DMA Controller Status 0) ........................ 140 DMACS1 (DMA Controller Status 1) ........................ 142 DMAxCNT (DMA Channel x Transfer Count)........... 139 DMAxCON (DMA Channel x Control)....................... 136 DMAxPAD (DMA Channel x Peripheral Address) .... 139 DMAxREQ (DMA Channel x IRQ Select) ................. 137 DMAxSTA (DMA Channel x RAM Start Address A) . 138 DMAxSTB (DMA Channel x RAM Start Address B) . 138 DSADR (Most Recent DMA RAM Address) ............. 143 I2CxCON (I2Cx Control)........................................... 235 I2CxMSK (I2Cx Slave Mode Address Mask)............ 239 I2CxSTAT (I2Cx Status) ........................................... 237 IFS0 (Interrupt Flag Status 0) ........................... 100, 107 IFS1 (Interrupt Flag Status 1) ........................... 102, 109 IFS2 (Interrupt Flag Status 2) ........................... 104, 111 IFS3 (Interrupt Flag Status 3) ........................... 105, 112 IFS4 (Interrupt Flag Status 4) ........................... 106, 113 INTCON1 (Interrupt Control 1) ................................... 97 INTCON2 (Interrupt Control 2) ................................... 99 INTTREG Interrupt Control and Status Register ...... 131 IPC0 (Interrupt Priority Control 0) ............................. 114 IPC1 (Interrupt Priority Control 1) ............................. 115 IPC11 (Interrupt Priority Control 11) ......................... 124 IPC14 (Interrupt Priority Control 14) ......................... 125 IPC15 (Interrupt Priority Control 15) ......................... 126 IPC16 (Interrupt Priority Control 16) ......................... 127 IPC17 (Interrupt Priority Control 17) ......................... 128 IPC18 (Interrupt Priority Control 18) ................. 129, 130 N NVM Module Register Map............................................................... 66 O Open-Drain Configuration ................................................. 164 Output Compare ............................................................... 205 P Packaging ......................................................................... 399 Details ....................................................................... 400 Marking ..................................................................... 399 Peripheral Module Disable (PMD) .................................... 158 Pinout I/O Descriptions (table) ............................................ 17 PMD Module Register Map............................................................... 66 PORTA Register Map......................................................... 64, 65 PORTB Register Map............................................................... 65 Power-on Reset (POR) ....................................................... 88 Power-Saving Features .................................................... 157 Clock Frequency and Switching................................ 157 Program Address Space ..................................................... 39 Construction................................................................ 72 Data Access from Program Memory Using Program Space Visibility.................................................... 75 Data Access from Program Memory Using Table Instructions .................................................................... 74 Data Access from, Address Generation...................... 73 Memory Map ............................................................... 39 Table Read Instructions TBLRDH ............................................................. 74 TBLRDL .............................................................. 74 Visibility Operation ...................................................... 75 Program Memory Interrupt Vector ........................................................... 40 Organization................................................................ 40 Reset Vector ............................................................... 40 Q Quadrature Encoder Interface (QEI) ................................. 223 Quadrature Encoder Interface (QEI) Module Register Map............................................................... 52 R Reader Response ............................................................. 424 Register Map CRC ............................................................................ 64 Dual Comparator......................................................... 64 Parallel Master/Slave Port .......................................... 63 Real-Time Clock and Calendar................................... 64 Registers AD1CHS0 (ADC1 Input Channel 0 Select ................ 284 AD1CHS123 (ADC1 Input Channel 1, 2, 3 Select) ... 282 AD1CON1 (ADC1 Control 1) .................................... 277 © 2011 Microchip Technology Inc. DS70291E-page 429 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 IPC2 (Interrupt Priority Control 2) ............................. 116 IPC3 (Interrupt Priority Control 3) ............................. 117 IPC4 (Interrupt Priority Control 4) ............................. 118 IPC5 (Interrupt Priority Control 5) ............................. 119 IPC6 (Interrupt Priority Control 6) ............................. 120 IPC7 (Interrupt Priority Control 7) ............................. 121 IPC8 (Interrupt Priority Control 8) ............................. 122 IPC9 (Interrupt Priority Control 9) ............................. 123 NVMCON (Flash Memory Control) ............................. 79 NVMKEY (Nonvolatile Memory Key) .......................... 80 OCxCON (Output Compare x Control) ..................... 207 OSCCON (Oscillator Control) ................................... 149 OSCTUN (FRC Oscillator Tuning) ............................ 153 P1DC3 (PWM Duty Cycle 3) ..................................... 221 PLLFBD (PLL Feedback Divisor) .............................. 152 PMD1 (Peripheral Module Disable Control Register 1)... 159 PMD2 (Peripheral Module Disable Control Register 2)... 161 PMD3 (Peripheral Module Disable Control Register 3)... 162 PWMxCON1 (PWM Control 1).................................. 215 PWMxCON2 (PWM Control 2).................................. 216 PxDC1 (PWM Duty Cycle 1) ..................................... 221 PxDC2 (PWM Duty Cycle 2) ..................................... 221 PxDTCON1 (Dead-Time Control 1) .......................... 217 PxDTCON2 (Dead-Time Control 2) .......................... 218 PxFLTACON (Fault A Control).................................. 219 PxOVDCON (Override Control) ................................ 220 PxSECMP (Special Event Compare) ........................ 214 PxTCON (PWM Time Base Control). 212, 289, 290, 291 PxTMR (PWM Timer Count Value) ........................... 213 PxTPER (PWM Time Base Period) .......................... 213 QEICON (QEI Control).............................................. 224 RCON (Reset Control) ................................................ 84 SPIxCON1 (SPIx Control 1) ...................................... 229 SPIxCON2 (SPIx Control 2) ...................................... 231 SPIxSTAT (SPIx Status and Control) ....................... 228 SR (CPU Status) ................................................... 29, 96 T1CON (Timer1 Control)........................................... 196 TCxCON (Input Capture x Control) ........................... 204 TxCON (Type B Time Base Control) ........................ 200 TyCON (Type C Time Base Control) ........................ 201 UxMODE (UARTx Mode) .......................................... 242 UxSTA (UARTx Status and Control) ......................... 244 Reset Illegal Opcode ....................................................... 83, 90 Trap Conflict.......................................................... 89, 90 Uninitialized W Register ........................................ 83, 90 Reset Sequence.................................................................. 91 Resets ................................................................................. 83 Timer1............................................................................... 195 Timer2/3............................................................................ 197 Timing Characteristics CLKO and I/O ........................................................... 357 Timing Diagrams 10-bit ADC Conversion (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000)......................... 383 10-bit ADC Conversion (CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)....................................... 383 10-bit ADC Conversion (CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001) .............................................................. 383 12-bit ADC Conversion (ASAM = 0, SSRC = 000) 381 Brown-out Situations................................................... 89 ECAN I/O .................................................................. 377 External Clock........................................................... 355 I2Cx Bus Data (Master Mode) .................................. 373 I2Cx Bus Data (Slave Mode) .................................... 375 I2Cx Bus Start/Stop Bits (Master Mode)................... 373 I2Cx Bus Start/Stop Bits (Slave Mode)..................... 375 Input Capture (CAPx) ............................................... 363 Motor Control PWM .................................................. 365 Motor Control PWM Fault ......................................... 365 OC/PWM................................................................... 364 Output Compare (OCx)............................................. 363 QEA/QEB Input ........................................................ 366 QEI Module Index Pulse ........................................... 367 Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer ......................................... 358 SPIx Master Mode (CKE = 0) ................................... 368 SPIx Master Mode (CKE = 1) ................................... 369 SPIx Slave Mode (CKE = 0) ..................................... 370 SPIx Slave Mode (CKE = 1) ..................................... 371 Timer1, 2, 3 External Clock ...................................... 360 TimerQ (QEI Module) External Clock ....................... 362 Timing Requirements ADC Conversion (10-bit mode)................................. 398 ADC Conversion (12-bit Mode)................................. 397 CLKO and I/O ........................................................... 357 External Clock........................................................... 355 Input Capture ............................................................ 363 SPIx Master Mode (CKE = 0) ................................... 395 SPIx Module Master Mode (CKE = 1) ...................... 395 SPIx Module Slave Mode (CKE = 0) ........................ 396 SPIx Module Slave Mode (CKE = 1) ........................ 396 Timing Specifications 10-bit ADC Conversion Requirements...................... 384 12-bit ADC Conversion Requirements...................... 382 CAN I/O Requirements ............................................. 377 I2Cx Bus Data Requirements (Master Mode)........... 374 I2Cx Bus Data Requirements (Slave Mode)............. 376 Motor Control PWM Requirements........................... 365 Output Compare Requirements................................ 363 PLL Clock ......................................................... 356, 394 QEI External Clock Requirements ............................ 362 QEI Index Pulse Requirements ................................ 367 Quadrature Decoder Requirements.......................... 366 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements ................................................... 359 Simple OC/PWM Mode Requirements ..................... 364 SPIx Master Mode (CKE = 0) Requirements............ 368 SPIx Master Mode (CKE = 1) Requirements............ 369 SPIx Slave Mode (CKE = 0) Requirements.............. 370 SPIx Slave Mode (CKE = 1) Requirements.............. 372 Timer1 External Clock Requirements ....................... 360 S Serial Peripheral Interface (SPI) ....................................... 227 Software Reset Instruction (SWR) ...................................... 89 Software Simulator (MPLAB SIM)..................................... 341 Software Stack Pointer, Frame Pointer CALLL Stack Frame.................................................... 67 Special Features of the CPU............................................. 321 SPI Module SPI1 Register Map ...................................................... 54 Symbols Used in Opcode Descriptions............................. 332 System Control Register Map......................................................... 65, 66 T Temperature and Voltage Specifications AC ..................................................................... 354, 394 DS70291E-page 430 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 Timer2 External Clock Requirements ....................... 361 Timer3 External Clock Requirements ....................... 361 U UART Module UART1 Register Map.................................................. 53 Universal Asynchronous Receiver Transmitter (UART).... 241 Using the RCON Status Bits ............................................... 90 V Voltage Regulator (On-Chip) ............................................ 325 W Watchdog Time-out Reset (WDTR) .................................... 89 Watchdog Timer (WDT) ............................................ 321, 326 Programming Considerations ................................... 326 WWW Address.................................................................. 423 WWW, On-Line Support ..................................................... 13 © 2011 Microchip Technology Inc. DS70291E-page 431 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 NOTES: DS70291E-page 432 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. © 2011 Microchip Technology Inc. DS70291E-page 433 dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N dsPIC33FJ64MCX02/X04 and Literature Number: DS70291E FAX: (______) _________ - _________ Device: dsPIC33FJ32MC302/304, dsPIC33FJ128MCX02/X04 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70291E-page 434 © 2011 Microchip Technology Inc. dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. dsPIC 33 FJ 32 MC3 02 T E / SP - XXX Microchip Trademark Architecture Flash Memory Family Program Memory Size (KB) Product Group Pin Count Tape and Reel Flag (if applicable) Temperature Range Package Pattern Examples: a) dsPIC33FJ32MC302-E/SP: Motor Control dsPIC33, 32 KB program memory, 28-pin, Extended temperature, SPDIP package. Architecture: 33 = 16-bit Digital Signal Controller Flash Memory Family: FJ = Flash program memory, 3.3V Product Group: MC2 MC3 MC8 = = = Motor Control family Motor Control family Motor Control family Pin Count: 02 04 = = 28-pin 44-pin -40°C to+85°C (Industrial) -40°C to+125°C (Extended) -40°C to+150°C (High) Temperature Range: I E H = = = Package: SP SO ML MM PT = = = = = Skinny Plastic Dual In-Line - 300 mil body (SPDIP) Plastic Small Outline - Wide - 300 mil body (SOIC) Plastic Quad, No Lead Package - 8x8 mm body (QFN) Plastic Quad, No Lead Package - 6x6x0.9 body (QFN-S) Plastic Thin Quad Flatpack - 10x10x1 mm body (TQFP) © 2011 Microchip Technology Inc. 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