93LC76A

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 8K Microwire Compatible Serial EEPROM Device Selection Table Part Number 93AA76A 93AA76B 93LC76A 93LC76B 93C76A 93C76B 93AA76C 93LC76C 93C76C VCC Range 1.8-5.5 1.8-5-5 2.5-5.5 2.5-5.5 4.5-5.5 4.5-5.5 1.8-5.5 2.5-5.5 4.5-5.5 ORG Pin No No No No No No Yes Yes Yes PE Pin No No No No No No Yes Yes Yes Word Size 8-bit 16-bit 8-bit 16-bit 8-bit 16-bit 8 or 16-bit 8 or 16-bit 8 or 16-bit Temp Ranges I I I, E I, E I, E I, E I I, E I, E Packages OT OT OT OT OT OT P, SN, ST, MS P, SN, ST, MS P, SN, ST, MS Features • • • • • • • • • • • • • • Low-power CMOS technology ORG pin to select word size for ‘76C’ version 1024 x 8-bit organization ‘A’ devices (no ORG) 512 x 16-bit organization ‘B’ devices (no ORG) Program Enable pin to write-protect the entire array (except on SOT-23 packages) Self-timed ERASE/WRITE cycles (including auto-erase) Automatic ERAL before WRAL Power-on/off data protection circuitry Industry standard 3-wire serial I/O Device Status signal (READY/BUSY) Sequential READ function 1,000,000 E/W cycles Data retention > 200 years Temperature ranges supported: - Industrial (I) - Automotive (E) -40°C to +85°C -40°C to +125°C Description The Microchip Technology Inc. 93XX76A/B/C devices are 8K bit, low-voltage, serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93XX76C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX76A devices are available, while the 93XX76B devices provide dedicated 16-bit communication, available on SOT-23 devices only. A Program Enable (PE) pin allows the user to write-protect the entire memory array. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, and 8-lead TSSOP. Pb-free (Pure Matte Sn) finish is also available. Package Types (not to scale) PDIP/SOIC (P, SN) CS CLK DI DO 1 2 3 4 8 7 6 5 VCC PE ORG VSS DO VSS DI 1 2 3 SOT-23 (OT) 6 5 4 Pin Function Table Name CS CLK DI DO VSS PE ORG VCC Chip Select Serial Data Clock Serial Data Input Serial Data Output Ground Program Enable Memory Configuration Power Supply VCC CS CLK Function TSSOP/MSOP (ST, MS) CS CLK DI DO 1 2 3 4 8 7 6 5 VCC PE ORG VSS  2004 Microchip Technology Inc. DS21796D-page 1 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC .............................................................................................................................................................................7.0V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ 4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS VCC = 1.8V to 5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Min 2.0 0.7 VCC -0.3 -0.3 — — 2.4 VCC - 0.2 — — — — — — — — — — Typ — — — — — — — — — — — — 500 — — 100 — — Max VCC +1 VCC +1 0.8 0.2 VCC 0.4 0.2 — — ±1 ±1 7 3 — 1 500 — 1 5 Units V V V V V V V V µA µA pF mA µA mA µA µA µA µA Conditions VCC ≥ 2.7V VCC < 2.7V VCC ≥ 2.7V VCC < 2.7V IOL = 2.1 mA, VCC = 4.5V IOL = 100 µA, VCC = 2.5V IOH = -400 µA, VCC = 4.5V IOH = -100 µA, VCC = 2.5V VIN = VSS to VCC VOUT = VSS to VCC VIN/VOUT = 0V (Note 1) TA = 25°C, FCLK = 1 MHz FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 2.5V FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 3.0V FCLK = 2 MHz, VCC = 2.5V I – Temp E – Temp CLK = Cs = 0V ORG = DI = VSS or VCC (Note 2) (Note 3) (Note 1) All parameters apply over the specified ranges unless otherwise noted. Param. Symbol No. D1 D2 D3 D4 D5 D6 D7 D8 D9 VIH1 VIH2 VIL1 VIL2 VOL1 VOL2 VOH1 VOH2 ILI ILO CIN, COUT Parameter High-level input voltage Low-level input voltage Low-level output voltage High-level output voltage Input leakage current Output leakage current Pin capacitance (all inputs/ outputs) ICC write Write current ICC read Read current D10 ICCS Standby current D11 VPOR VCC voltage detect 93AA76A/B/C, 93LC76A/B/C 93C76A/B/C — — 1.5V 3.8V — — V V Note 1: 2: 3: This parameter is periodically sampled and not 100% tested. ORG pin not available on ‘A’ or ‘B’ versions. READY/BUSY status must be cleared from DO, see Section 3.4 “Data Out (DO)”. DS21796D-page 2  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C TABLE 1-2: AC CHARACTERISTICS VCC = 1.8V to 5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Min — Max 3 2 1 — Units MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ms ms ms Conditions 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V 1.8V ≤ VCC < 5.5V 1.8V ≤ VCC < 5.5V 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V 4.5V ≤ VCC < 5.5V, CL = 100 pF 2.5V ≤ VCC < 4.5V, CL = 100 pF 1.8V ≤ VCC < 2.5V, CL = 100 pF 4.5V ≤ VCC < 5.5V, (Note 1) 1.8V ≤ VCC < 4.5V, (Note 1) 4.5V ≤ VCC < 5.5V, CL = 100 pF 2.5V ≤ VCC < 4.5V, CL = 100 pF 1.8V ≤ VCC < 2.5V, CL = 100 pF Erase/Write mode (AA and LC versions) Erase/Write mode (93C versions) ERAL mode, 4.5V ≤ VCC ≤ 5.5V WRAL mode, 4.5V ≤ VCC ≤ 5.5V All parameters apply over the specified ranges unless otherwise noted. Param. Symbol No. A1 FCLK Parameter Clock frequency A2 TCKH Clock high time 200 250 450 100 200 450 50 100 250 0 250 50 100 250 50 100 250 — A3 TCKL Clock low time — A4 TCSS Chip Select setup time — A5 A6 A7 TCSH TCSL TDIS Chip Select hold time Chip Select low time Data input setup time — — — A8 TDIH Data input hold time — A9 TPD Data output delay time 100 250 400 100 200 200 300 500 5 2 6 15 — A10 A11 TCZ TSV Data output disable time Status valid time — — A12 A13 A14 A15 A16 Note 1: 2: TWC TWC TEC TWL — Program cycle time — — — — Endurance 1M cycles 25°C, VCC = 5.0V, (Note 2) This parameter is periodically sampled and not 100% tested. This application is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which may be obtained from www.microchip.com.  2004 Microchip Technology Inc. DS21796D-page 3 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C FIGURE 1-1: CS VIH VIL VIH CLK VIL TDIS VIH DI VIL TPD DO (READ) VOH VOL TCZ TSV STATUS VALID TPD TCZ TDIH TCSS TCKH TCKL TCSH SYNCHRONOUS DATA TIMING DO VOH (PROGRAM) VOL Note: TSV is relative to CS. TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1) Instruction READ EWEN ERASE ERAL WRITE WRAL EWDS SB 1 1 1 1 1 1 1 Opcode 10 00 11 00 01 00 00 X 1 X 1 X 0 0 Address A8 A7 A6 A5 A4 A3 A2 A1 A0 1 X X X X X X X X Data In — — — — Data Out D15 – D0 HIGH-Z (RDY/BSY) (RDY/BSY) (RDY/BSY) (RDY/BSY) HIGH-Z Req. CLK Cycles 29 13 13 13 29 29 13 A8 A7 A6 A5 A4 A3 A2 A1 A0 0 X X X X X X X X A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 – D0 1 0 X X X X X X X X X X X X X X X X D15 – D0 — TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0) Instruction READ EWEN ERASE ERAL WRITE WRAL EWDS SB 1 1 1 1 1 1 1 Opcode 10 00 11 00 01 00 00 X 1 X 1 X 0 0 Address A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 X X X X X X X X X Data In — — — — D7 – D0 D7 – D0 — Data Out D7 – D0 HIGH-Z (RDY/BSY) (RDY/BSY) (RDY/BSY) (RDY/BSY) HIGH-Z Req. CLK Cycles 22 14 14 14 22 22 14 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 0 X X X X X X X X X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 0 X X X X X X X X X X X X X X X X X X DS21796D-page 4  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.0 FUNCTIONAL DESCRIPTION 2.2 Data In/Data Out (DI/DO) When the ORG* pin is connected to VCC, the (x16) organization is selected. When it is connected to ground, the (x8) organization is selected. Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a HIGH-Z state except when reading data from the device, or when checking the READY/ BUSY status during a programming operation. The READY/BUSY status can be verified during an Erase/ Write operation by polling the DO pin; DO low indicates that programming is still in progress, while DO high indicates the device is ready. DO will enter the HIGH-Z state on the falling edge of CS. It is possible to connect the Data In and Data Out pins together. However, with this configuration it is possible for a “bus conflict” to occur during the “dummy zero” that precedes the read operation, if A0 is a logic highlevel. Under such a condition the voltage level seen at Data Out is undefined and will depend upon the relative impedances of Data Out and the signal source driving A0. The higher the current sourcing capability of the driver, the higher the voltage at the Data Out pin. In order to limit this current, a resistor should be connected between DI and DO. 2.3 Data Protection 2.1 Start Condition The Start bit is detected by the device if CS and DI are both high with respect to the positive edge of CLK for the first time. Before a Start condition is detected, CS, CLK and DI may change in any combination (except to that of a Start condition), without resulting in any device operation (READ, WRITE, ERASE, EWEN, EWDS, ERAL or WRAL). As soon as CS is high, the device is no longer in Standby mode. An instruction following a Start condition will only be executed if the required opcode, address and data bits for any particular instruction are clocked in. All modes of operation are inhibited when VCC is below a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices or 3.8V for ‘93C’ devices. The EWEN and EWDS commands give additional protection against accidentally programming during normal operation. Note: For added protection, an EWDS command should be performed after every write operation. After power-up, the device is automatically in the EWDS mode. Therefore, an EWEN instruction must be performed before the initial ERASE or WRITE instruction can be executed. Block Diagram VCC VSS Address Decoder Memory Array Address Counter Data Register DI ORG* CS PE* CLK Clock Register Mode Decode Logic Output Buffer DO *ORG and PE inputs are not available on A/B devices.  2004 Microchip Technology Inc. DS21796D-page 5 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.4 ERASE The ERASE instruction forces all data bits of the specified address to the logical ‘1’ state. The rising edge of CLK before the last address bit initiates the write cycle. The DO pin indicates the READY/BUSY status of the device if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been erased and the device is ready for another instruction. Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. FIGURE 2-1: CS ERASE TIMING TCSL CHECK STATUS CLK DI 1 1 1 AN AN-1 AN-2 ••• A0 TSV TCZ READY HIGH-Z TWC DO HIGH-Z BUSY DS21796D-page 6  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.5 ERASE ALL (ERAL) The Erase All (ERAL) instruction will erase the entire memory array to the logical ‘1’ state. The ERAL cycle is identical to the ERASE cycle, except for the different opcode. The ERAL cycle is completely self-timed. The rising edge of CLK before the last data bit initiates the write cycle. Clocking of the CLK pin is not necessary after the device has entered the ERAL cycle. The DO pin indicates the READY/BUSY status of the device, if CS is brought high after a minimum of 250 ns low (TCSL). Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. VCC must be ≥ 4.5V for proper operation of ERAL. FIGURE 2-2: CS ERAL TIMING TCSL CHECK STATUS CLK DI 1 0 0 1 0 X ••• X TSV TCZ READY HIGH-Z TEC DO HIGH-Z BUSY  2004 Microchip Technology Inc. DS21796D-page 7 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.6 ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN) To protect against accidental data disturbance, the EWDS instruction can be used to disable all ERASE/ WRITE functions and should follow all programming operations. Execution of a READ instruction is independent of both the EWEN and EWDS instructions. The 93XX76A/B/C powers up in the ERASE/WRITE Disable (EWDS) state. All programming modes must be preceded by an ERASE/WRITE Enable (EWEN) instruction. Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is executed or VCC is removed from the device. FIGURE 2-3: CS EWDS TIMING TCSL CLK DI 1 0 0 0 0 X ••• X FIGURE 2-4: EWEN TIMING TCSL CS CLK DI 1 0 0 1 1 X ••• X 2.7 READ The READ instruction outputs the serial data of the addressed memory location on the DO pin. A dummy zero bit precedes the 8-bit (If ORG pin is low or A-Version devices) or 16-bit (If ORG pin is high or B-version devices) output string. The output data bits will toggle on the rising edge of the CLK and are stable after the specified time delay (TPD). Sequential read is possible when CS is held high. The memory data will automatically cycle to the next register and output sequentially. FIGURE 2-5: CS READ TIMING CLK DI 1 1 0 An ••• A0 DO HIGH-Z 0 Dx ••• D0 Dx ••• D0 Dx ••• D0 DS21796D-page 8  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.8 WRITE The WRITE instruction is followed by 8 bits (If ORG is low or A-version devices) or 16 bits (If ORG pin is high or B-version devices) of data which are written into the specified address. The self-timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. The DO pin indicates the READY/BUSY status of the device, if CS is brought high after a minimum of 250 ns low (TCSL). DO at logical ‘0’ indicates that programming is still in progress. DO at logical ‘1’ indicates that the register at the specified address has been written with the data specified and the device is ready for another instruction. Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. FIGURE 2-6: CS WRITE TIMINGS TCSL CLK DI 1 0 1 An ••• A0 Dx ••• D0 TSV TCZ READY DO HIGH-Z BUSY HIGH-Z Twc  2004 Microchip Technology Inc. DS21796D-page 9 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 2.9 WRITE ALL (WRAL) The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. The self-timed auto-erase and programming cycle is initiated by the rising edge of CLK on the last data bit. Clocking of the CLK pin is not necessary after the device has entered the WRAL cycle. The WRAL command does include an automatic ERAL cycle for the device. Therefore, the WRAL instruction does not require an ERAL instruction but the chip must be in the EWEN status. The DO pin indicates the READY/BUSY status of the device if CS is brought high after a minimum of 250 ns low (TCSL). Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. VCC must be ≥ 4.5V for proper operation of WRAL. FIGURE 2-7: CS WRAL TIMING TCSL CLK DI 1 0 0 0 1 X ••• X Dx ••• D0 TSV TCZ DO HIGH-Z BUSY READY HIGH-Z TWL DS21796D-page 10  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 3.0 PIN DESCRIPTIONS PIN DESCRIPTIONS SOIC/PDIP/MSOP/ TSSOP 1 2 3 4 5 6 7 8 SOT-23 5 4 3 1 2 N/A N/A 6 Chip Select Serial Clock Data In Data Out Ground Organization / 93XX76C Program Enable Power Supply Function TABLE 3-1: Name CS CLK DI DO VSS ORG PE VCC 3.1 Chip Select (CS) 3.3 Data In (DI) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle which is already in progress will be completed, regardless of the Chip Select (CS) input signal. If CS is brought low during a program cycle, the device will go into Standby mode as soon as the programming cycle is completed. CS must be low for 250 ns minimum (TCSL) between consecutive instructions. If CS is low, the internal control logic is held in a Reset status. Data In (DI) is used to clock in a Start bit, opcode, address and data synchronously with the CLK input. 3.4 Data Out (DO) Data Out (DO) is used in the Read mode to output data synchronously with the CLK input (TPD after the positive edge of CLK). This pin also provides READY/BUSY status information during ERASE and WRITE cycles. READY/BUSY status information is available on the DO pin if CS is brought high after being low for minimum Chip Select low time (TCSL) and an erase or write operation has been initiated. The Status signal is not available on DO, if CS is held low during the entire ERASE or WRITE cycle. In this case, DO is in the HIGH-Z mode. If status is checked after the ERASE/WRITE cycle, the data line will be high to indicate the device is ready. Note: Issuing a Start bit and then taking CS low will clear the READY/BUSY status from DO. 3.2 Serial Clock (CLK) The Serial Clock is used to synchronize the communication between a master device and the 93XX series device. Opcodes, address and data bits are clocked in on the positive edge of CLK. Data bits are also clocked out on the positive edge of CLK. CLK can be stopped anywhere in the transmission sequence (at high or low-level) and can be continued anytime with respect to clock high time (TCKH) and clock low time (TCKL). This gives the controlling master freedom in preparing opcode, address and data. CLK is a “don't care” if CS is low (device deselected). If CS is high, but the Start condition has not been detected (DI = 0), any number of clock cycles can be received by the device without changing its status (i.e., waiting for a Start condition). CLK cycles are not required during the self-timed WRITE (i.e., auto ERASE/WRITE) cycle. After detection of a Start condition the specified number of clock cycles (respectively low to high transitions of CLK) must be provided. These clock cycles are required to clock in all required opcode, address and data bits before an instruction is executed. CLK and DI then become don't care inputs waiting for a new Start condition to be detected. 3.5 Organization (ORG) When the ORG pin is connected to VCC or Logic HI, the (x16) memory organization is selected. When the ORG pin is tied to VSS or Logic LO, the (x8) memory organization is selected. For proper operation, ORG must be tied to a valid logic level. 93XX76A devices are always x8 organization and 93XX76B devices are always x16 organization.  2004 Microchip Technology Inc. DS21796D-page 11 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 3.6 Program Enable (PE) This pin allows the user to enable or disable the ability to write data to the memory array. If the PE pin is tied to VCC, the device can be programmed. If the PE pin is tied to VSS, programming will be inhibited. PE is not available on 93XX76A or 93XX76B. On those devices, programming is always enabled. This pin cannot be floated, it must be tied to VCC or VSS. DS21796D-page 12  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 4.0 4.1 PACKAGING INFORMATION Package Marking Information 8-Lead MSOP (150 mil) Example: 3L76I 2281L7 MSOP 1st Line Marking Codes Device XXXXXXT YWWNNN 93AA76C 93LC76C 93C76C std mark 3A76CT 3L76CT 3C76CT Pb-free mark GA76CT GL76CT GC76CT T = blank for commercial, “I” for Industrial, “E” for Extended. 6-Lead SOT-23 XXNN Example: SOT23 Marking Codes 4EL7 Device 93AA76A 93AA76B 93LC76A 93LC76B 93C76A 93C76B I-temp 4BNN 4LNN 4ENN 4PNN 4HNN 4TNN E-temp – – 4FNN 4RNN 4JNN 4UNN 8-Lead PDIP XXXXXXXX XXXXXNNN YYWW Example: 93LC76 I/P 1L7 0228 Pb-free topside mark is same; Pb-free noted only on carton label. 8-Lead SOIC Example: XXXXXXXX XXXXYYWW NNN 93LC76 I/SN 0228 1L7 TSSOP 1st Line Marking Codes Device std mark A76C L76C C76C Pb-free mark GADC GLDC GCDC 8-Lead TSSOP XXXX TYWW NNN Legend: XX...X T Blank I E YY WW NNN Note: Example: L76 I228 1L7 93AA76C 93LC76C 93C76C Temperature grade is marked on line 2. Part number Temperature Commercial Industrial Extended Year code (last 2 digits of calendar year) except TSSOP and MSOP which use only the last 1 digit Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Custom marking available.  2004 Microchip Technology Inc. DS21796D-page 13 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A c φ A1 (F) β A2 L 8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .031 Foot Length Footprint (Reference) F .037 REF φ 0° 8° Foot Angle c .003 .006 .009 Lead Thickness B .009 .012 .016 Lead Width α 5° 15° Mold Draft Angle Top β 5° 15° Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Units Dimension Limits n p MIN INCHES NOM MAX MIN MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 15° 15° JEDEC Equivalent: MO-187 Drawing No. C04-111 DS21796D-page 14  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 6-Lead Plastic Small Outline Transistor (OT) (SOT-23) E E1 B p1 D n 1 α c A φ L A1 A2 β Number of Pins 6 Pitch .038 p1 Outside lead pitch (basic) .075 Overall Height A .035 .046 .057 Molded Package Thickness .035 .043 .051 A2 Standoff .000 .003 .006 A1 Overall Width E .102 .110 .118 Molded Package Width .059 .064 .069 E1 Overall Length D .110 .116 .122 Foot Length L .014 .018 .022 φ Foot Angle 0 5 10 c Lead Thickness .004 .006 .008 Lead Width B .014 .017 .020 α Mold Draft Angle Top 0 5 10 β Mold Draft Angle Bottom 0 5 10 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (formerly EIAJ) equivalent: SC-74A Drawing No. C04-120 Units Dimension Limits n p MIN INCHES* NOM MAX MIN MILLIMETERS NOM 6 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10  2004 Microchip Technology Inc. DS21796D-page 15 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 8-Lead Plastic Du8-Lead Plastic Small Outline (al In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 c L A1 β eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB α β MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN § .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21796D-page 16  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 45° h α c A A2 φ β L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057  2004 Microchip Technology Inc. DS21796D-page 17 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β L A1 A2 Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L φ c B α β MIN INCHES NOM 8 .026 MAX MIN .033 .002 .246 .169 .114 .020 0 .004 .007 0 0 .035 .004 .251 .173 .118 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 DS21796D-page 18  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C APPENDIX A: Revision C Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision D Corrections to Device Selection Table, Table 1-1, Table 1-2, Section 2.4, Section 2.5, Section 2.8 and Section 2.9. Added note to Figure 2-7. REVISION HISTORY  2004 Microchip Technology Inc. DS21796D-page 19 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C NOTES: DS21796D-page 20  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site. SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 042003 Connecting to the Microchip Internet Web Site The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events  2004 Microchip Technology Inc. DS21796D-page 21 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS21796D FAX: (______) _________ - _________ Device: 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21796D-page 22  2004 Microchip Technology Inc. 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X X /XX Package X Lead Finish Examples: a) b) c) 93AA76C-I/MS: 8K, 1024x8 or 512x16 Serial EEPROM, MSOP package, 1.8V 93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM, SOT-23 package, tape and reel, 1.8V 93AA76CT-I/MS: 8K, 1024x8 or 512x16 Serial EEPROM, MSOP package, tape and reel, 1.8V 93LC76C-I/MS: 8K, 1024x8 or 512x16 Serial EEPROM, MSOP package, 2.5V 93LC76BT-I/OT: 8K, 512x16 Serial EEPROM, SOT-23 package, tape and reel, 2.5V 93LC76CXT-I/SNG: 8K, 1024x8 or 512x16 Serial EEPROM, SOIC package, Industrial temperature, tape and reel, Pb-free finish, 2.5V 93C76C-I/MS: 8K, 1024x8 or 512x16 Serial EEPROM, MSOP package, 5.0V 93C76AT-I/OT: 8K, 1024x8 Serial EEPROM, SOT-23 package, tape and reel, 5.0V Tape & Reel Temperature Range Device 93AA76A: 8K 1.8V Microwire Serial EEPROM (x8) 93AA76B: 8K 1.8V Microwire Serial EEPROM (x16) 93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG 93LC76A: 8K 2.5V Microwire Serial EEPROM (x8) 93LC76B: 8K 2.5V Microwire Serial EEPROM (x16) 93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG 93C76A: 93C76B: 93C76C: 8K 5.0V Microwire Serial EEPROM (x8) 8K 5.0V Microwire Serial EEPROM (x16) 8K 5.0V Microwire Serial EEPROM w/ORG a) b) c) a) Tape & Reel: Blank = T = Standard pinout Tape & Reel b) Temperature Range I E = = -40°C to +85°C -40°C to +125°C Package MS OT P SN ST = = = = = Plastic MSOP (Micro Small outline, 8-lead) SOT-23, 6-lead (Tape & Reel only) Plastic DIP (300 mil body), 8-lead Plastic SOIC (150 mil body), 8-lead TSSOP, 8-lead Lead Finish: Blank = G = Standard 63% / 37% SnPb Pb-free (Matte Tin - Pure Sn) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2004 Microchip Technology Inc. DS21796D-page 23 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C NOTES: DS21796D-page 24  2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.  2004 Microchip Technology Inc. DS21796D-page 25 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com China - Beijing Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104 Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 China - Chengdu Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Taiwan Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4818 Fax: 886-7-536-4803 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 China - Fuzhou Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 Taiwan Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 China - Hong Kong SAR Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 EUROPE Austria Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 China - Shanghai Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Denmark Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 China - Shenzhen Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393 Kokomo 2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Shunde Room 401, Hongjian Building, No. 2 Fengxiangnan Road, Ronggui Town, Shunde District, Foshan City, Guangdong 528303, China Tel: 86-757-28395507 Fax: 86-757-28395571 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Germany Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 San Jose 1300 Terra Bella Avenue Mountain View, CA 94043 Tel: 650-215-1444 Fax: 650-961-0286 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Italy Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 Japan Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Netherlands P. A. De Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 ASIA/PACIFIC Australia Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 01/26/04 DS21796D-page 26  2004 Microchip Technology Inc.