C1413NCPA

M Features TC1413/TC1413N General Description The TC1413/TC1413N are 3A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge. As MOSFET drivers, the TC1413/TC1413N can easily charge an 1800 pF gate capacitance in 20 nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET’s intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. 3A High-Speed MOSFET Drivers • Latch-Up Protected: Will Withstand 500 mA Reverse Current • Input Will Withstand Negative Inputs Up to 5V • ESD Protected: 4 kV • High Peak Output Current: 3A • Wide Input Supply Voltage Operating Range: - 4.5V to 16V • High Capacitive Load Drive Capability: - 1800 pF in 20 nsec • Short Delay Time: 35 nsec Typ • Matched Delay Times • Low Supply Current - With Logic ‘1’ Input: 500 µA - With Logic ‘0’ Input: 100 µA • Low Output Impedance: 2.7Ω • Available in Space-Saving 8-pin MSOP Package • Pinout Same as TC1410/TC1411/TC1412 Applications • • • • Switch Mode Power Supplies Line Drivers Pulse Transformer Drive Relay Driver Package Type 8-Pin MSOP/PDIP/SOIC VDD 1 IN 2 NC 3 GND 4 2 8 VDD OUT TC1413 7 6 OUT 5 GND 6,7 VDD 1 IN 2 NC 3 GND 4 2 8 VDD 7 OUT 6 OUT 5 GND 6,7 TC1413N Inverting NC = No Internal Connection Non-Inverting NOTE: Duplicate pins must be connected together for proper operation.  2003 Microchip Technology Inc. DS21392C-page 1 TC1413/TC1413N Functional Block Diagram VDD TC1413 Inverting Outputs 300 mV Output Input Effective Input C = 10 pF 4.7V Non-Inverting Outputs TC1413N GND DS21392C-page 2  2003 Microchip Technology Inc. TC1413/TC1413N 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE Symbol VDD INPUT Description Supply input, 4.5V to 16V Control input No connection Ground Ground CMOS push-pull output, common to pin 7 CMOS push-pull output, common to pin 6 Supply input, 4.5V to 16V Absolute Maximum Ratings† Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND – 5.0V Power Dissipation (TA ≤ 70°C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range.............. -65°C to +150°C Maximum Junction Temperature ...................... +150ºC † S tresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. NC GND GND OUTPUT OUTPUT VDD DC ELECTRICAL CHARACTERISTICS Electrical Specifications: U nless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance VOH VOL RO VDD – 0.025 — — — — Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time tR — — — Fall Time tF — — — Note 1: Switching times ensured by design. 20 22 24 20 22 24 28 33 33 28 33 33 nsec nsec TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 IPK IREV — — — — 2.7 3.3 3.3 3.0 0.5 — 0.025 4.0 5.0 5.0 — — A A V V Ω DC Test DC Test VDD = 16V, IO = 10 mA, TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C VDD = 16V Duty cycle ≤ 2%, t ≤ 300 µsec, VDD = 16V VIH VIL IIN 2.0 — -1.0 -10 — — — — — 0.8 1.0 10 V V µA 0V ≤ VIN ≤ VDD, TA = +25°C -40°C ≤ TA ≤ +85°C Sym Min Typ Max Units Conditions  2003 Microchip Technology Inc. DS21392C-page 3 TC1413/TC1413N DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: U nless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Delay Time Sym tD1 Min — — — Delay Time tD2 — — — Power Supply Power Supply Current Note 1: IS — — Switching times ensured by design. 0.5 0.1 1.0 0.15 mA VIN = 3V, VDD = 16V VIN = 0V Typ 35 40 40 35 40 40 Max 45 50 50 45 50 50 nsec Units nsec Conditions TA = +25°C, 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 TEMPERATURE CHARACTERISTICS Electrical Specifications: U nless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC θJA θJA θJA — — — 206 125 155 — — — ºC/W ºC/W ºC/W TA TA TJ TA 0 -40 — -65 — — — — +70 +85 +150 +150 ºC ºC ºC ºC Sym Min Typ Max Units Conditions DS21392C-page 4  2003 Microchip Technology Inc. TC1413/TC1413N 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 500 TA = +25°C 500 VSUPPLY = 16V VIN = 3V 400 400 ISUPPLY (µA) ISUPPLY (µA) VIN = 3V 300 300 200 200 100 VIN = 0V 100 VIN = 0V 0 0 4 6 8 10 12 14 16 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage. 1.6 FIGURE 2-4: vs. Temperature. 1.6 Quiescent Supply Current TA = +25°C VIH VSUPPLY = 16V 1.5 1.5 VTHRESHOLD (V) 1.4 VTHRESHOLD (V) VIH 1.4 1.3 1.3 1.2 1.1 4 VIL 1.2 VIL 6 8 10 12 14 16 1.1 -40 -20 0 20 40 60 80 VDD (V) TEMPERATURE (°C) FIGURE 2-2: Voltage. 9 8 7 RDS-ON (Ohms) 6 5 4 3 2 1 4 6 TA = -40°C TA = +85°C Input Threshold vs. Supply FIGURE 2-5: Temperature. 9 8 7 RDS-ON (Ohms) 6 5 4 3 2 1 TA = +85°C Input Threshold vs. TA = +25°C TA = +25°C TA = -40°C 4 6 8 10 VDD (V) 12 14 16 8 10 VDD (V) 12 14 16 FIGURE 2-3: High-State Output Resistance vs. Supply Voltage FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage.  2003 Microchip Technology Inc. DS21392C-page 5 TC1413/TC1413N Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 70 60 50 40 30 20 10 CLOAD = 1800 pF 70 CLOAD = 1800 pF 60 50 40 30 20 10 tRISE (nsec) TA = +85°C TA = +25°C tFALL (nsec) TA = +85°C TA = +25°C TA = -40°C 4 6 8 10 12 14 16 TA = -40°C 4 6 8 10 12 14 16 VDD (V) VDD (V) FIGURE 2-7: Voltage. 110 100 90 80 Rise Time vs. Supply FIGURE 2-10: Voltage. 100 Fall Time vs. Supply CLOAD = 1800 pF 90 80 CLOAD = 1800 pF TA = +85°C tD1 (nsec) 70 60 50 40 30 20 4 6 tD2 (nsec) 70 60 50 40 TA = +85°C TA = +25°C TA = +25°C TA = -40°C 8 10 VDD (V) 12 14 16 30 20 4 6 8 10 TA = -40°C 12 14 16 VDD (V) FIGURE 2-8: Supply Voltage. 40 Propagation Delay vs. FIGURE 2-11: Supply Voltage. 35 Propagation Delay vs. 30 tRISE, tFALL (nsec) tFALL Propagation Delays (nsec) TA = +25°C VDD = 16V tRISE 34 33 TA = +25°C VDD = 16V tD2 tD1 32 31 30 29 28 20 10 0 0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000 CLOAD (pF) CLOAD (pF) FIGURE 2-9: Capacitive Load. Rise and Fall Times vs. FIGURE 2-12: Capacitive Load. Propagation Delays vs. DS21392C-page 6  2003 Microchip Technology Inc. TC1413/TC1413N 3.0 PIN DESCRIPTIONS 3.3 The descriptions of the pins are listed in Table 3-1. CMOS Push-Pull Output (OUTPUT) TABLE 3-1: Pin No. 1 2 3 4 5 6 7 8 PIN FUNCTION TABLE Description Supply input, 4.5V to 16V Control input No connection Ground Ground The MOSFET driver output is a low-impedance, CMOS push-pull style output, capable of driving a capacitive load with 3A peak currents. Symbol VDD INPUT 3.4 Ground (GND) NC GND GND The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. OUTPUT CMOS push-pull output, common to pin 7 OUTPUT CMOS push-pull output, common to pin 6 VDD Supply input, 4.5V to 16V 3.5 No Connect (NC) No internal connection. 3.1 Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested. 3.2 Control Input (INPUT) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300 mV of hysteresis between the high and low thresholds which prevents output glitching even when the rise and fall time of the input signal is very slow.  2003 Microchip Technology Inc. DS21392C-page 7 TC1413/TC1413N 4.0 APPLICATION INFORMATION +5V Input VDD = 16V 0V 1.0 µF 1, 8 Input 2 6, 7 Output CL = 1800 pF 0.1 µF VDD Output 0V 10% 10% 10% tD1 tF 90% tD2 tR 90% 90% TC1413 TC1413N +5V Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 nsec 0V VDD Output 0V 10% Inverting Driver TC1413 90% tD1 90% tR 10% 90% tD2 10% tF Non-Inverting Driver TC1413N FIGURE 4-1: Switching Time Test Circuit. DS21392C-page 8  2003 Microchip Technology Inc. TC1413/TC1413N 5.0 5.1 PACKAGING INFORMATION Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: TC1413 CPA057 0347 8-Lead SOIC (150 mil) Example: TC1413 COA0347 057 XXXXXXXX XXXXYYWW NNN 8-Lead MSOP Example: XXXXXXX YWWNNN 1413NE 347057 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Note : In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.  2003 Microchip Technology Inc. DS21392C-page 9 TC1413/TC1413N 8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP) E1 D 2 n 1 α E A A2 c L A1 β eB B1 p B Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB α β MIN INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10 MAX MIN § .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 .170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21392C-page 10  2003 Microchip Technology Inc. TC1413/TC1413N 8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 45° h α c A A2 φ β L A1 Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX MIN .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057  2003 Microchip Technology Inc. DS21392C-page 11 TC1413/TC1413N 8-Lead Plastic Micro Small Outline Package (UA) (MSOP) E E1 p D 2 B n 1 A c A1 (F ) A2 L Number of P ins 8 P itch .026 B S C Overall Height A .043 .030 .033 .037 Molded P ackage T hicknes s A2 .000 .006 S tandoff A1 Overall Width .193 B S C E Molded P ackage Width E1 .118 B S C Overall Length .118 B S C D .016 .024 .031 F oot Length L F ootprint (R eference) F .037 R E F F oot Angle 0˚ 8˚ c Lead T hicknes s .003 .006 .009 B Lead Width .009 .012 .016 Mold Draft Angle T op 5˚ 15˚ Mold Draft Angle B ottom 5˚ 15˚ *C ontrolling P arameter Notes : D imens ions D and E 1 do not include mold flas h or protrus ions . Mold flas h or protrus ions s hall not exceed .010" (0.254mm) per s ide. J E DE C E quivalent: MO-187 Drawing N o. C 04-111 Units Dimens ion Limits n p MIN INC HE S NOM MAX MIN MILLIME T E R S * NOM 8 0.65 B S C 0.75 0.85 0.00 4.90 B S C 3.00 B S C 3.00 B S C 0.40 0.60 0.95 R E F 0˚ 0.08 0.22 5˚ 5˚ - MAX 1.10 0.95 0.15 0.80 8˚ 0.23 0.40 15˚ 15˚ DS21392C-page 12  2003 Microchip Technology Inc. TC1413/TC1413N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) b) c) TC1413COA: 3A Single MOSFET driver, SOIC package, 0°C to +70°C. TC1413CPA: 3A Single MOSFET driver, PDIP package, 0°C to +70°C. TC1413EUA713: Tape and Reel, 3A Single MOSFET driver, MSOP package, -40°C to +85°C. Device: TC1413: 3 A Single MOSFET Driver, Inverting TC1413N: 3 A Single MOSFET Driver, Non-Inverting C E = = 0°C to +70°C -40°C to +85°C Temperature Range: a) Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead * MSOP package is only available in E-Temp. b) c) TC1413NCPA: 3A Single MOSFET driver, PDIP package, 0°C to +70°C. TC1413NEPA: 3A Single MOSFET driver, PDIP package, -40°C to +85°C. TC1413NEUA: 3A Single MOSFET driver, MSOP package, -40°C to +85°C. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2003 Microchip Technology Inc. DS21392C-page 13 TC1413/TC1413N NOTES: DS21392C-page 14  2003 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8 -bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2003 Microchip Technology Inc. DS21392C-page 15 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Marketing Support Division Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. 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B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 Italy Microchip Technology SRL Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 India Microchip Technology Inc. India Liaison Office Marketing Support Division Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 03/25/03 DS21392C-page 16  2003 Microchip Technology Inc.