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MCP1407

MCP1407

  • 厂商:

    MICROCHIP

  • 封装:

  • 描述:

    MCP1407 - 6A High-Speed Power MOSFET Drivers - Microchip Technology

  • 数据手册
  • 价格&库存
MCP1407 数据手册
MCP1406/07 6A High-Speed Power MOSFET Drivers Features • High Peak Output Current: 6.0A (typ.) • Low Shoot-Through/Cross-Conduction Current in Output Stage • Wide Input Supply Voltage Operating Range: - 4.5V to 18V • High Capacitive Load Drive Capability: - 2500 pF in 20 ns - 6800 pF in 40 ns • Short Delay Times: 40 ns (typ.) • Matched Rise/Fall Times • Low Supply Current: - With Logic ‘1’ Input – 130 µA (typ.) - With Logic ‘0’ Input – 35 µA (typ.) • Latch-Up Protected: Will Withstand 1.5A Reverse Current • Logic Input Will Withstand Negative Swing Up To 5V • Pin compatible with the TC4420/TC4429 devices • Space-saving 8-Pin SOIC, PDIP and 8-Pin 6x5 DFN Packages General Description The MCP1406/07 devices are a family of buffers/MOSFET drivers that feature a single-output with 6A peak drive current capability, low shoot-through current, matched rise/fall times and propagation delay times. These devices are pin-compatible and are improved versions of the TC4420/TC4429 MOSFET drivers. The MCP1406/07 MOSFET drivers can easily charge and discharge 2500 pF gate capacitance in under 20 ns, provide low enough impedances in both the on and off states to ensure the MOSFETs intended state will not be affected, even by large transients. The input to the MCP1406/07 may be driven directly from either TTL or CMOS (3V to 18V). These devices are highly latch-up resistant under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. All terminals are fully protect against Electrostatic Discharge (ESD) up to 4 kV. The MCP1406/07 single-output 6A MOSFET driver family is offered in both surface-mount and pinthrough-hole packages with a -40°C to +125°C temperature rating, making it useful in any wide temperature range application. Applications • • • • Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Motor and Solenoid Drive Package Types MCP1407 MCP1406 MCP1406 MCP1407 5-Pin TO-220 Tab is Common to VDD 8-Pin PDIP/SOIC VDD 1 INPUT 2 NC 3 GND 4 8-Pin 6x5 DFN VDD INPUT NC GND 8 1 8 VDD VDD 7 OUT OUT 6 OUT OUT 5 GND GND VDD VDD 12345 OUT OUT OUT OUT GND GND INPUT GND VDD GND OUT Note 1: Duplicate pins must both be connected for proper operation. 2: Exposed pad of the DFN package is electrically isolated. 2 3 4 7 6 5 © 2006 Microchip Technology Inc. DS22019A-page 1 MCP1406/07 Functional Block Diagram(1) Inverting 130 µA 300 mV Output Output Non-inverting 4.7V MCP1406 Inverting MCP1407 Non-inverting VDD Input Effective Input C = 25 pF GND Note 1: Unused inputs should be grounded. DS22019A-page 2 © 2006 Microchip Technology Inc. MCP1406/07 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Supply Voltage ................................................................+20V Input Voltage ............................... (VDD + 0.3V) to (GND – 5V) Input Current (VIN>VDD)................................................50 mA DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Input Voltage Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Continuous Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Supply Voltage Power Supply Current Note 1: 2: 3: VDD IS IS 4.5 — — — 130 35 18.0 250 100 V µA µA VIN = 3V VIN = 0V tR tF tD1 tD2 — — — — 20 20 40 40 30 30 55 55 ns ns ns ns Figure 4-1, Figure 4-2 CL = 2500 pF Figure 4-1, Figure 4-2 CL = 2500 pF Figure 4-1, Figure 4-2 Figure 4-1, Figure 4-2 VOH VOL ROH ROL IPK IDC IREV VDD – 0.025 — — — — 1.3 — 1.5 — — — 2.1 1.5 6 — 0.025 2.8 2.5 — V V Ω Ω A A A DC Test DC Test IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VDD = 18V (Note 2) Note 2, Note 3 Duty cycle ≤ 2%, t ≤ 300 µsec. VIH VIL IIN VIN 2.4 — –10 -5 1.8 1.3 — — — 0.8 10 VDD+0.3 V V µA V 0V ≤ VIN ≤ VDD Sym Min Typ Max Units Conditions Switching times ensured by design. Tested during characterization, not production tested. Valid for AT and MF packages only. TA = +25°C © 2006 Microchip Technology Inc. DS22019A-page 3 MCP1406/07 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ VDD ≤ 18V. Parameters Input Logic ‘1’, High Input Voltage Logic ‘0’, Low Input Voltage Input Current Input Voltage Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Supply Voltage Power Supply Current Note 1: VDD IS 4.5 — — Switching times ensured by design. — 200 50 18.0 500 150 V µA VIN = 3V VIN = 0V tR tF tD1 tD2 — — — — 25 25 50 50 40 40 65 65 ns ns ns ns Figure 4-1, Figure 4-2 CL = 2500 pF Figure 4-1, Figure 4-2 CL = 2500 pF Figure 4-1, Figure 4-2 Figure 4-1, Figure 4-2 VOH VOL ROH ROL VDD – 0.025 — — — — — 3.0 2.3 — 0.025 5.0 5.0 V V Ω Ω DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL IIN VIN 2.4 — –10 -5 — — — — — 0.8 +10 VDD+0.3 V V µA V 0V ≤ VIN ≤ VDD Sym Min Typ Max Units Conditions TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V. Parameters Temperature Ranges Specified Temperature Range Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 5L-TO-220 θJA θJA θJA θJA — — — — 33.2 125 155 71 — — — — °C/W °C/W °C/W °C/W Typical four-layer board with vias to ground plane TA TJ TA –40 — –65 — — — +125 +150 +150 °C °C °C Sym Min Typ Max Units Conditions DS22019A-page 4 © 2006 Microchip Technology Inc. MCP1406/07 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25°C with 4.5V
MCP1407 价格&库存

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MCP1407-E/SN
  •  国内价格
  • 1+7.797

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