MCP4019

MCP4017/18/19 7-Bit Single I2C™ Digital POT with Volatile Memory in SC70 Features • Potentiometer or Rheostat configuration options • 7-bit: Resistor Network Resolution - 127 Resistors (128 Steps) • Zero Scale to Full Scale Wiper operation • RAB Resistances: 5 kΩ, 10 kΩ, 50 kΩ, or 100 kΩ • Low Wiper Resistance: 100Ω (typical) • Low Tempco: - Absolute (Rheostat): 50 ppm typical (0°C to 70°C) - Ratiometric (Potentiometer): 10 ppm typical • Simple I2C Protocol with read & write commands • Brown-out reset protection (1.5V typical) • Power-on Default Wiper Setting (Mid-scale) • Low-Power Operation: - 2.5 µA Static Current (typical) • Wide Operating Voltage Range: - 2.7V to 5.5V - Device Characteristics Specified - 1.8V to 5.5V - Device Operation Package Types Potentiometer MCP4018 SC70-6 VDD 1 VSS 2 SCL 3 B A W 6A 5W 4 SDA VDD 1 VSS 2 SCL 3 A Rheostat MCP4017 SC70-6 W B 6W 5B 4 SDA MCP4019 SC70-5 VDD 1 VSS 2 SCL 3 B W A 5W 4 SDA • Wide Bandwidth (-3 dB) Operation: - 2 MHz (typical) for 5.0 kΩ device • Extended temperature range (-40°C to +125°C) • Very small package (SC70) • Lead free (Pb-free) package Device Features # of Steps Control Interface Memory Type Resistance (typical) Options (kΩ) 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 Wiper (Ω) 75 75 75 VDD Operating Range (1) 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V Device MCP4017 MCP4018 MCP4019 Wiper Configuration Rheostat Potentiometer Rheostat Package SC70-6 SC70-6 SC70-5 I2C I2C I2C 128 128 128 RAM RAM RAM Note 1: Analog characteristics only tested from 2.7V to 5.5V © 2009 Microchip Technology Inc. DS22147A-page 1 MCP4017/18/19 Device Block Diagram VDD VSS Power-up/ Brown-out Control I2C Serial Interface Module, Control Logic, & Memory A (2) W Resistor Network 0 (Pot 0) Note 1 B (1, 2) Note 1: Some configurations will have this signal internally connected to ground. 2: In some configurations, this signal may not be connected externally (internally floating or grounded). SCL SDA Comparison of Similar Microchip Devices (1) # of Steps Resistance (typical) Wiper Configuration Rheostat Rheostat Rheostat Rheostat Rheostat Rheostat Rheostat Rheostat Rheostat Rheostat Rheostat Potentiometer Potentiometer Potentiometer Rheostat Rheostat Rheostat VDD Operating Range (2) 1.8V to 5.5V 1.8V to 5.5V 2.7V to 5.5V 1.8V to 5.5V 2.7V to 5.5V 1.8V to 5.5V 2.7V to 5.5V 1.8V to 5.5V 2.7V to 5.5V 1.8V to 5.5V 2.7V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 2.7V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 2.7V to 5.5V HV Interface Memory Type WiperLock Technology No No Yes No Yes No Yes No Yes No Yes No No Yes No No Yes SC70-6 SOT-23-6 SOT-23-6 SC70-5 SOT-23-5 SOT-23-5 Control Interface Device MCP4017 MCP4012 MCP4022 MCP4132 MCP4142 MCP4152 MCP4162 MCP4532 MCP4542 MCP4552 MCP4562 MCP4018 MCP4013 MCP4023 MCP4019 MCP4014 MCP4024 Note 1: Options (kΩ) 5.0, 10.0, 50.0, 100.0 2.1, 5.0, 10.0, 50.0 2.1, 5.0, 10.0, 50.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 5.0, 10.0, 50.0, 100.0 2.1, 5.0, 10.0, 50.0 2.1, 5.0, 10.0, 50.0 5.0, 10.0, 50.0, 100.0 2.1, 5.0, 10.0, 50.0 2.1, 5.0, 10.0, 50.0 Package SC70-6 SOT-23-6 SOT-23-6 PDIP-8, SOIC-8, MSOP-8, DFN-8 MSOP-8, DFN-8 I2C U/D U/D SPI SPI SPI SPI I2C I2C I2C I2C I2C U/D U/D I2C U/D U/D 128 64 64 129 129 257 257 129 129 257 257 128 64 64 128 64 64 RAM RAM EE RAM EE RAM EE RAM EE RAM EE RAM RAM EE RAM RAM EE No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No Yes Yes No Yes Yes 2: This table is broken into three groups by a thick line (and color coding). The unshaded devices in this table are the devices described in this data sheet, while the shaded devices offer a comparable resistor network configuration. Analog characteristics only tested from 2.7V to 5.5V DS22147A-page 2 © 2009 Microchip Technology Inc. MCP4017/18/19 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Voltage on VDD with respect to VSS ..... -0.6V to +7.0V Voltage on SCL, and SDA with respect to VSS ............................................................................. -0.6V to 12.5V Voltage on all other pins (A, W, and B) with respect to VSS ............................ -0.3V to VDD + 0.3V Input clamp current, IIK (VI < 0, VI > VDD, VI > VPP ON HV pins) ........... ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ....................................... ±20 mA Maximum output current sunk by any Output pin ........................................................................... 25 mA Maximum output current sourced by any Output pin ........................................................................... 25 mA Maximum current out of VSS pin ...................... 100 mA Maximum current into VDD pin ......................... 100 mA Maximum current into A, W and B pins........... ±2.5 mA Package power dissipation (TA = +50°C, TJ = +150°C) SC70-5 ............................................................ 302 mW SC70-6 .................................................................. TBD Storage temperature .......................... -65°C to +150°C Ambient temperature with power applied ........................................................... -40°C to +125°C ESD protection on all pins ........................≥ 4 kV (HBM) ........................................................................≥ 400V (MM) Maximum Junction Temperature (TJ) .............. +150°C © 2009 Microchip Technology Inc. DS22147A-page 3 MCP4017/18/19 AC/DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Sym VDD VBOR Min 2.7 1.8 VDD Start Voltage to ensure Wiper Reset VDD Rise Rate to ensure Power-on Reset Delay after device exits the reset state (VDD > VBOR) Supply Current (Note 8) — Typ — — — Max 5.5 5.5 1.65 Units V V V Conditions Analog Characteristics specified Digital Characteristics specified RAM retention voltage (VRAM) < VBOR Parameters Supply Voltage VDDRR (Note 7) V/ms TBORD — 10 20 µS IDD — 45 80 µA Serial Interface Active, Write all 0’s to Volatile Wiper VDD = 5.5V, FSCL = 400 kHz Serial Interface Inactive, (Stop condition, SCL = SDA = VIH), Wiper = 0, VDD = 5.5V — 2.5 5 µA Note 1: 2: 3: 4: 5: 6: 7: 8: Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network DS22147A-page 4 © 2009 Microchip Technology Inc. MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Sym RAB Min 4.0 8.0 40.0 80.0 Resolution Step Resistance Wiper Resistance Nominal Resistance Tempco Ratiometeric Tempco Resistor Terminal Input Voltage Range (Terminals A, B and W) Maximum current through Terminal (A, W or B) Note 5 N RS RW ΔRAB/ΔT — — — — — — ΔVWB/ΔT VA,VW,VB — Vss Typ 5 10 50 100 128 RAB / (127) 100 155 50 100 150 15 — — 170 325 — — — — VDD Max 6.0 12.0 60.0 120.0 Units kΩ kΩ kΩ kΩ Taps Ω Ω Ω Conditions -502 devices (Note 1) -103 devices (Note 1) -503 devices (Note 1) -104 devices (Note 1) No Missing Codes Note 5 VDD = 5.5 V, IW = 2.0 mA, code = 00h VDD = 2.7 V, IW = 2.0 mA, code = 00h Parameters Resistance (± 20%) ppm/°C TA = -20°C to +70°C ppm/°C TA = -40°C to +85°C ppm/°C TA = -40°C to +125°C ppm/°C Code = Midscale (3Fh) V Note 4, Note 5 IT — — — — — — — — — — — — — — 2.5 2.5 2.5 1.38 0.688 0.138 0.069 mA mA mA mA mA mA mA Terminal A Terminal B Terminal W IAW, W = Full Scale (FS) IBW, W = Zero Scale (ZS) IAW or IBW, W = FS or ZS IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 4000 Terminal A and Terminal B IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 8000 IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 40000 IAB, VB = 0V, VA = 5.5V, RAB(MIN) = 80000 Note 1: 2: 3: 4: 5: 6: 7: 8: Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network © 2009 Microchip Technology Inc. DS22147A-page 5 MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Sym VWFSE Min -3.0 -2.0 -0.5 -0.5 Zero Scale Error (MCP4018 only) (code = 00h) VWZSE — — — — Potentiometer Integral Non-linearity Potentiometer Differential Nonlinearity Bandwidth -3 dB (See Figure 2-83, load = 30 pF) INL -0.5 Typ -0.1 -0.1 -0.1 -0.1 +0.1 +0.1 +0.1 +0.1 ±0.25 Max — — — — +3.0 +2.0 +0.5 +0.5 +0.5 Units LSb LSb LSb LSb LSb LSb LSb LSb LSb 5 kΩ 10 kΩ 50 kΩ 5 kΩ 10 kΩ 50 kΩ Conditions 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V Parameters Full Scale Error (MCP4018 only) (code = 7Fh) 100 kΩ 2.7V ≤ VDD ≤ 5.5V 100 kΩ 2.7V ≤ VDD ≤ 5.5V 2.7V ≤ VDD ≤ 5.5V MCP4018 device only (Note 2) 2.7V ≤ VDD ≤ 5.5V MCP4018 device only (Note 2) 5 kΩ 10 kΩ 50 kΩ Code = 3Fh Code = 3Fh Code = 3Fh DNL -0.25 ±0.125 +0.25 LSb BW — — — — 2 1 260 100 — — — — MHz MHz kHz kHz 100 kΩ Code = 3Fh Note 1: 2: 3: 4: 5: 6: 7: 8: Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network DS22147A-page 6 © 2009 Microchip Technology Inc. MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Sym R-INL Min -2.0 -5.0 -2.0 -4.0 -1.125 -1.5 -0.8 -1.125 Rheostat Differential Nonlinearity MCP4018 (Note 3) MCP4017 and MCP4019 devices only (Note 3) R-DNL -0.5 -0.75 -0.5 -0.75 -0.375 -0.375 -0.375 -0.375 Capacitance (PA) Capacitance (Pw) Capacitance (PB) Note 1: 2: 3: 4: 5: 6: 7: 8: CAW CW CBW — — — Typ ±0.5 +3.5 ±0.5 +2.5 ±0.5 +1 ±0.5 +0.25 ±0.25 +0.5 ±0.25 +0.5 ±0.25 ±0.25 ±0.25 ±0.25 75 120 75 Max +2.0 +5.0 +2.0 +4.0 +1.125 +1.5 +0.8 +1.125 +0.5 +0.75 +0.5 +0.75 +0.375 +0.375 +0.375 +0.375 — — — Units LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb LSb pF pF pF 50 kΩ 10 kΩ 5 kΩ 50 kΩ 10 kΩ 5 kΩ Conditions 5.5V, IW = 900 µA 2.7V, IW = 430 µA (Note 6) 1.8V (Note 6) 5.5V, IW = 450 µA 2.7V, IW = 215 µA (Note 6) 1.8V (Note 6) 5.5V, IW = 90 µA 2.7V, IW = 43 µA (Note 6) 1.8V (Note 6) 100 kΩ 5.5V, IW = 45 µA 2.7V, IW = 21.5 µA (Note 6) 1.8V (Note 6) 5.5V, IW = 900 mA 2.7V, IW = 430 µA (Note 6) 1.8V (Note 6) 5.5V, IW = 450 µA 2.7V, IW = 215 µA (Note 6) 1.8V (Note 6) 5.5V, IW = 90 µA 2.7V, IW = 43 µA (Note 6) 1.8V (Note 6) 100 kΩ 5.5V, IW = 45 µA 2.7V, IW = 21.5 µA (Note 6) 1.8V (Note 6) f =1 MHz, Code = Full Scale f =1 MHz, Code = Full Scale f =1 MHz, Code = Full Scale Parameters Rheostat Integral Non-linearity MCP4018 (Note 3) MCP4017 and MCP4019 devices only (Note 3) See Section 2.0 See Section 2.0 See Section 2.0 See Section 2.0 See Section 2.0 See Section 2.0 See Section 2.0 See Section 2.0 Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network © 2009 Microchip Technology Inc. DS22147A-page 7 MCP4017/18/19 AC/DC CHARACTERISTICS (CONTINUED) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (extended) DC Characteristics All parameters apply across the specified operating ranges unless noted. VDD = +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. Typical specifications represent values for VDD = 5.5V, TA = +25°C. Sym VIH Min 0.7 VDD Typ — Max — Units V Conditions 1.8V ≤ VDD ≤ 5.5V Parameters Schmitt Trigger High Input Threshold Schmitt Trigger Low Input Threshold Hysteresis of Schmitt Trigger Inputs (Note 5) Digital Inputs/Outputs (SDA, SCK) VIL -0.5 — 0.3VDD V VHYS — N.A. N.A. 0.1 VDD 0.05 VDD 0.1VDD — — — — — — — 10 — 3Fh — — — — — 0.2VDD 0.4 1 — 7Fh V V V V V V V µA pF hex hex All inputs except SDA and SCL SDA and SCL 100 kHz 400 kHz VDD < 2.0V VDD ≥ 2.0V VDD < 2.0V VDD ≥ 2.0V Output Low Voltage (SDA) Input Leakage Current Pin Capacitance RAM (Wiper) Value Value Range Wiper POR/BOR Value Power Supply Sensitivity (MCP4018 only) Note 1: 2: 3: 4: 5: 6: 7: 8: VOL IIL CIN, COUT N NPOR/BOR VSS VSS -1 — 0h VDD < 2.0V, IOL = 1 mA VDD ≥ 2.0V, IOL = 3 mA VIN = VDD and VIN = VSS fC = 400 kHz Power Requirements PSS — 0.0005 0.0035 %/% VDD = 2.7V to 5.5V, VA = 2.7V, Code = 3Fh Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. MCP4018 device only, includes VWZSE and VWFSE. Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design. Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. POR/BOR is not rate dependent. Supply current is independent of current through the resistor network DS22147A-page 8 © 2009 Microchip Technology Inc. MCP4017/18/19 1.1 I2C Mode Timing Waveforms and Requirements SCL 90 SDA 91 92 93 START Condition STOP Condition FIGURE 1-1: TABLE 1-1: I2C Bus Start/Stop Bits Timing Waveforms. I2C BUS START/STOP BITS REQUIREMENTS Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (Extended) Operating Voltage VDD range is described in Section 2.0 “Typical Performance Curves” Characteristic Standard Mode Fast Mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode Min 0 0 — — 4700 600 4000 600 4000 600 4000 600 Max 100 400 400 400 — — — — — — — — Units kHz kHz pF pF ns ns ns ns ns ns ns ns Conditions Cb = 400 pF, 1.8V - 5.5V Cb = 400 pF, 2.7V - 5.5V I2C AC Characteristics Param. Symbol No. FSCL D102 90 91 92 93 Cb TSU:STA Bus capacitive loading START condition Setup time THD:STA START condition Hold time TSU:STO STOP condition Setup time THD:STO STOP condition Hold time Only relevant for repeated START condition After this period the first clock pulse is generated 103 SCL SDA In 109 SDA Out 90 100 106 102 101 107 109 92 110 91 Note 1: Refer to specification D102 (Cb) for load conditions. FIGURE 1-2: I2C Bus Data Timing. © 2009 Microchip Technology Inc. DS22147A-page 9 MCP4017/18/19 TABLE 1-2: I2C BUS DATA REQUIREMENTS (SLAVE MODE) Standard Operating Conditions (unless otherwise specified) Operating Temperature –40°C ≤ TA ≤ +125°C (Extended) Operating Voltage VDD range is described in AC/DC characteristics Min 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 106 107 109 110 THD:DAT Data input hold time TSU:DAT TAA TBUF Data input setup time Output valid from clock Bus free time 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode 100 kHz mode 400 kHz mode TSP 4000 600 4700 1300 — 20 + 0.1Cb — 20 + 0.1Cb — 20 + 0.1Cb — 20 + 0.1Cb (4) 0 0 250 100 — — 4700 1300 Max — — — — 1000 300 1000 300 300 40 300 300 — — — — 3450 900 — — Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Conditions 1.8V-5.5V 2.7V-5.5V 1.8V-5.5V 2.7V-5.5V Cb is specified to be from 10 to 400 pF Cb is specified to be from 10 to 400 pF Cb is specified to be from 10 to 400 pF Cb is specified to be from 10 to 400 pF 1.8V-5.5V, Note 6 2.7V-5.5V, Note 6 (2) I2C AC Characteristics Parameter No. 100 101 102A (5) 102B (5) 103A (5) 103B (5) Sym THIGH TLOW TRSCL TRSDA TFSCL TFSDA Characteristic Clock high time Clock low time SCL rise time SDA rise time SCL fall time SDA fall time (1) Note 1: 2: 3: 4: 5: 6: Input filter spike 100 kHz mode — 50 ns suppression 400 kHz mode — 50 ns (SDA and SCL) As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions. A fast-mode (400 kHz) I2C-bus device can be used in a standard-mode (100 kHz) I2C-bus system, but the requirement tsu; DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line TR max.+tsu;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C bus specification) before the SCL line is released. The MCP4018/MCP4019 device must provide a data hold time to bridge the undefined part between VIH and VIL of the falling edge of the SCL signal. This specification is not a part of the I2C specification, but must be tested in order to guarantee that the output data will meet the setup and hold specifications for the receiving device. Use Cb in pF for the calculations. Not Tested. A Master Transmitter must provide a delay to ensure that difference between SDA and SCL fall times do not unintentionally create a Start or Stop condition. Time the bus must be free before a new transmission can start Philips Spec states N.A. DS22147A-page 10 © 2009 Microchip Technology Inc. MCP4017/18/19 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC70 (Note 1) Thermal Resistance, 6L-SC70 Note 1: θJA θJA — — 331 TBD — — °C/W °C/W TA TA TA -40 -40 -65 — — — +125 +125 +150 °C °C °C Sym Min Typ Max Units Conditions Package Power Dissipation (PDIS) is calculated as follows: PDIS = (TJ - TA) / θJA, where: TJ = Junction Temperature, TA = Ambient Temperature. © 2009 Microchip Technology Inc. DS22147A-page 11 MCP4017/18/19 NOTES: DS22147A-page 12 © 2009 Microchip Technology Inc. MCP4017/18/19 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 60 IDD Interface Inactive (µA) 50 40 IDD (µA) 400 kHz, 5.5V 30 20 10 0 -40 0 40 80 Temperature (°C) 120 400 kHz, 2.7V 100 kHz, 5.5V 100 kHz, 2.7V 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -40 0 5.5V 2.7V 40 Temperature (°C) 80 120 FIGURE 2-1: Interface Active Current (IDD) vs. SCL Frequency (fSCL) and Temperature (VDD = 1.8V, 2.7V and 5.5V). FIGURE 2-2: Interface Inactive Current (ISHDN) vs. Temperature and VDD. (VDD = 1.8V, 2.7V and 5.5V). © 2009 Microchip Technology Inc. DS22147A-page 13 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 120 Wiper Resistance (RW) (ohms) 100 80 60 25°C 85°C 125°C DNL Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 -0.1 120 100 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) Error (LSb) Error (LSb) 0.1 0 85°C 125°C INL 80 60 40 20 0 32 64 96 Wiper Setting (decimal) -40°C 40 20 0 -40°C RW RW 25°C DNL INL -0.1 -0.2 -0.3 -0.2 -0.3 32 64 96 Wiper Setting (decimal) FIGURE 2-3: 5.0 kΩ : Pot Mode – RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). (A = VDD, B = VSS). 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) -40°C 25°C DNL RW FIGURE 2-6: 5.0 kΩ : Rheo Mode – RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V).(IW = 1.4mA, B = VSS) 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) -40°C -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 3 125°C 85° INL 85°C 25°C 125°C INL 2 1 RW -0.1 -0.2 -0.3 0 DNL -1 FIGURE 2-4: 5.0 kΩ : Pot Mode – RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). (A = VDD, B = VSS) 2500 Wiper Resistance (RW) (ohms) 2000 1500 1000 500 0 0 32 64 96 Wiper Setting (decimal) RW FIGURE 2-7: 5.0 kΩ : Rheo Mode – RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V).(IW = 450uA, B = VSS) 2500 Wiper Resistance (RW) (ohms) 2000 1500 1000 500 0 0 32 64 96 Wiper Setting (decimal) DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.35 0.25 44 39 34 29 24 19 14 9 4 -1 0.05 -0.05 -0.15 -0.25 -0.35 Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. Error (LSb) INL DNL 0.15 RW INL Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-5: 5.0 kΩ : Pot Mode – RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (A = VDD, B = VSS) FIGURE 2-8: 5.0 kΩ : Rheo Mode – RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) DS22147A-page 14 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 0.0 -0.2 RBW Tempco (PPM) -0.4 -0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -1.8 -40 0 40 80 Ambient Temperature (°C) 120 1.8V 2.7 5.5V 200 180 160 140 120 100 80 60 40 20 0 0 Full-Scale Error (FSE) (LSb) 2.7V 5.5V 32 64 96 Wiper Setting (decimal) FIGURE 2-9: 5.0 kΩ : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 1.8 ΔRWB / ΔT vs. Code. FIGURE 2-12: 5.0 kΩ : RBW Tempco Zero-Scale Error (ZSE) (LSb) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 Ambient Temperature (°C) 120 5.5V 1.8V 2.7 FIGURE 2-10: 5.0 kΩ : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 5200 5180 5160 5140 5120 5100 5080 5060 5040 5020 5000 -40 FIGURE 2-13: Response Time. 5.0 kΩ : Power-Up Wiper Nominal Resistance (RAB) (Ohms) Wiper 1.8V 2.7V VDD 5.5V 0 40 80 Ambient Temperature (°C) 120 FIGURE 2-11: 5.0 kΩ : Nominal Resistance (Ω) vs. Temperature and VDD. FIGURE 2-14: 5.0 kΩ : Digital Feedthrough (SCL signal coupling to Wiper pin). © 2009 Microchip Technology Inc. DS22147A-page 15 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-15: 5.0 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=5.5V). FIGURE 2-18: 5.0 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=5.5V). FIGURE 2-16: 5.0 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=2.7V). FIGURE 2-19: 5.0 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=2.7V). FIGURE 2-17: 5.0 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=1.8V). FIGURE 2-20: 5.0 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=1.8V). DS22147A-page 16 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 120 Wiper Resistance (RW) (ohms) 100 85°C Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 120 100 80 60 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) Error (LSb) Error (LSb) 0.1 0 125°C 85°C 125°C DNL 80 60 40 20 0 32 64 96 Wiper Setting (decimal) -40°C -0.1 DNL 25°C INL RW -40°C -0.2 -0.3 40 20 0 25°C RW INL -0.1 -0.2 -0.3 32 64 96 Wiper Setting (decimal) FIGURE 2-21: 10 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). (A = VDD, B = VSS) 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) 25°C -40°C DNL RW FIGURE 2-24: 10 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V).(IW = 450uA, B = VSS) 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) -40°C 25°C -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 3 INL 85° 125°C 85°C 125°C RW 2 1 -0.1 -0.2 -0.3 0 DNL INL -1 FIGURE 2-22: 10 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). (A = VDD, B = VSS) 0.35 FIGURE 2-25: 10 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V).(IW = 210uA, B = VSS) -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL Wiper Resistance (RW) (ohms) Wiper Resistance (RW) (ohms) 3000 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 39 34 29 0.25 3000 Error (LSb) DNL 0.15 0.05 2000 2000 INL 24 19 14 9 4 -1 0 32 64 96 Wiper Setting (decimal) -0.05 1000 RW INL -0.15 -0.25 1000 RW DNL 0 0 32 64 96 Wiper Setting (decimal) -0.35 0 Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-23: 10 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (A = VDD, B = VSS) FIGURE 2-26: 10 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) © 2009 Microchip Technology Inc. DS22147A-page 17 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 0.0 -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 -40 100 RBW Tempco (PPM) 80 60 40 5.5V 2.7V Full-Scale Error (FSE) (LSb) 5.5V 2.7 1.8V 20 0 0 40 80 Ambient Temperature (°C) 120 0 32 64 96 Wiper Setting (decimal) FIGURE 2-27: 10 kΩ : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 0.9 ΔRWB / ΔT vs. Code. FIGURE 2-30: 10 kΩ : RBW Tempco Zero-Scale Error (ZSE) (LSb) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -40 0 40 80 Ambient Temperature (°C) 120 5.5V 1.8V 2.7 FIGURE 2-28: 10 kΩ : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 10200 FIGURE 2-31: Response Time. 10 kΩ : Power-Up Wiper Nominal Resistance (RAB) (Ohms) 10150 10100 10050 10000 9950 5.5V 2.7 1.8V Wiper VDD 9900 -40 0 40 80 Ambient Temperature (°C) 120 FIGURE 2-29: 10 kΩ : Nominal Resistance (Ω) vs. Temperature and VDD. FIGURE 2-32: 10 kΩ : Digital Feedthrough (SCL signal coupling to Wiper pin). DS22147A-page 18 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-33: 10 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=5.5V). FIGURE 2-36: 10 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=5.5V). FIGURE 2-34: 10 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=2.7V). FIGURE 2-37: 10 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=2.7V). FIGURE 2-35: 10 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=1.8V). FIGURE 2-38: 10 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=1.8V). © 2009 Microchip Technology Inc. DS22147A-page 19 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 120 Wiper Resistance (RW) (ohms) 100 80 60 40 20 0 32 64 96 Wiper Setting (decimal) -40°C 85°C 125°C Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 120 100 80 60 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) Error (LSb) Error (LSb) 0.1 0 85°C 125°C DNL INL 25°C -0.1 RW DNL -40°C 25°C INL RW -0.1 -0.2 -0.3 -0.2 -0.3 40 20 0 32 64 96 Wiper Setting (decimal) FIGURE 2-39: 50 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) 25°C -40°C DNL INL RW FIGURE 2-42: 50 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V).(IW = 90uA, B = VSS) 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) -40°C -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 0.3 0.2 0.1 0 85° 125°C 85°C 25°C 125°C INL -0.1 -0.2 -0.3 DNL RW -0.1 -0.2 -0.3 FIGURE 2-40: 50 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). 10000 Wiper Resistance (RW) (ohms) 8000 6000 4000 INL FIGURE 2-43: 50 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V).(IW = 45uA, B = VSS) 10000 Wiper Resistance (RW) (ohms) 8000 6000 4000 DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.35 0.25 Error (LSb) DNL 0.15 0.05 RW INL -0.05 -0.15 RW 2000 0 0 -0.25 -0.35 2000 0 0 32 64 96 Wiper Setting (decimal) 23 21 19 17 15 13 11 9 7 5 3 1 -1 32 64 96 Wiper Setting (decimal) Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-41: 50 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). FIGURE 2-44: 50 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) DS22147A-page 20 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 0.00 Full-Scale Error (FSE) (LSb) 100 RBW Tempco (PPM) 80 60 2.7V -0.04 -0.08 2.7 5.5V 40 5.5V -0.12 1.8V 20 0 -0.16 -40 0 40 80 Ambient Temperature (°C) 120 0 32 64 96 Wiper Setting (decimal) FIGURE 2-45: 50 kΩ : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 0.20 ΔRWB / ΔT vs. Code. FIGURE 2-48: 50 kΩ : RBW Tempco Zero-Scale Error (ZSE) (LSb) 0.16 0.12 0.08 0.04 0.00 -40 0 40 80 Ambient Temperature (°C) 120 1.8V 2.7 5.5V FIGURE 2-46: 50 kΩ : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 49800 FIGURE 2-49: Response Time. 50 kΩ : Power-Up Wiper Nominal Resistance (RAB) (Ohms) 49600 49400 49200 49000 48800 -40 0 40 80 Ambient Temperature (°C) 120 1.8V 2.7V 5.5V Wiper VDD FIGURE 2-47: 50 kΩ : Nominal Resistance (Ω) vs. Temperature and VDD. FIGURE 2-50: 50 kΩ : Digital Feedthrough (SCL signal coupling to Wiper pin). © 2009 Microchip Technology Inc. DS22147A-page 21 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-51: 50 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=5.5V). FIGURE 2-54: 50 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=5.5V). FIGURE 2-52: 50 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=2.7V). FIGURE 2-55: 50 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=2.7V). FIGURE 2-53: 50 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD=1.8V). FIGURE 2-56: 50 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD=1.8V). DS22147A-page 22 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 120 Wiper Resistance (RW) (ohms) 100 80 60 40 20 0 32 64 96 Wiper Setting (decimal) -40°C Wiper Resistance (RW) (ohms) -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 120 100 80 60 40 20 0 -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) Error (LSb) Error (LSb) 0.1 0 85°C 125°C DNL 85°C 125°C DNL INL RW 25°C -0.1 -0.2 -0.3 -0.1 -40°C 25°C INL RW -0.2 -0.3 32 64 96 Wiper Setting (decimal) FIGURE 2-57: 100 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) 25°C -40°C INL RW FIGURE 2-60: 100 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 5.5V). (IW = 45uA, B = VSS) 300 Wiper Resistance (RW) (ohms) 260 220 180 140 100 60 20 0 32 64 96 Wiper Setting (decimal) -40°C 25°C -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.3 0.2 Error (LSb) 0.1 0 0.3 0.2 0.1 0 DNL 85° 125°C INL 85°C 125°C -0.1 -0.2 -0.3 DNL RW -0.1 -0.2 -0.3 FIGURE 2-58: 100 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). 15000 Wiper Resistance (RW) (ohms) 12500 10000 7500 5000 2500 0 0 32 64 96 Wiper Setting (decimal) RW INL FIGURE 2-61: 100 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 2.7V). (IW = 21uA, B = VSS) 15000 Wiper Resistance (RW) (ohms) 12500 10000 7500 5000 2500 0 0 32 64 96 Wiper Setting (decimal) DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0.35 0.25 Error (LSb) DNL 0.15 0.05 RW INL -0.05 -0.15 -0.25 -0.35 19 17 15 13 11 9 7 5 3 1 -1 Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. Note: Refer to AN1080 for additional information on the characteristics of the wiper resistance (RW) with respect to device voltage and wiper setting value. FIGURE 2-59: 100 kΩ Pot Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). FIGURE 2-62: 100 kΩ Rheo Mode : RW (Ω), INL (LSb), DNL (LSb) vs. Wiper Setting and Temperature (VDD = 1.8V). (IW = TBD, B = VSS) © 2009 Microchip Technology Inc. DS22147A-page 23 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 0.00 Full-Scale Error (FSE) (LSb) 100 RBW Tempco (PPM) 80 60 40 20 5.5V 2.7V -0.02 5.5V 2.7 -0.04 -0.06 1.8V -0.08 -40 0 40 80 Ambient Temperature (°C) 120 0 0 32 64 96 Wiper Setting (decimal) FIGURE 2-63: 100 kΩ : Full Scale Error (FSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 0.12 FIGURE 2-66: 100 kΩ : RBW Tempco ΔRWB / ΔT vs. Code. Zero-Scale Error (ZSE) (LSb) 0.08 1.8V 0.04 5.5V 2.7 0.00 -40 0 40 80 Ambient Temperature (°C) 120 FIGURE 2-64: 100 kΩ : Zero Scale Error (ZSE) vs. Temperature (VDD = 5.5V, 2.7V, 1.8V). 99800 99600 99400 99200 99000 98800 98600 98400 98200 98000 97800 -40 FIGURE 2-67: Response Time. 100 kΩ : Power-Up Wiper Nominal Resistance (RAB) (Ohms) 1.8V 2.7V Wiper VDD 5.5V 0 40 80 Ambient Temperature (°C) 120 FIGURE 2-65: 100 kΩ : Nominal Resistance (Ω) vs. Temperature and VDD. FIGURE 2-68: 100 kΩ : Digital Feedthrough (SCL signal coupling to Wiper pin). DS22147A-page 24 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. FIGURE 2-69: 100 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD = 5.5V). FIGURE 2-72: 100 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD = 5.5V). FIGURE 2-70: 100 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD = 2.7V). FIGURE 2-73: 100 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD = 2.7V). FIGURE 2-71: 100 kΩ : Write Wiper (40h → 3Fh) Settling Time (VDD = 1.8V). FIGURE 2-74: 100 kΩ : Write Wiper (FFh → 00h) Settling Time (VDD = 1.8V). © 2009 Microchip Technology Inc. DS22147A-page 25 MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 4 3.5 3 VIH (V) 2.5 2 1.5 1 0.5 0 -40 0 40 Temperature (°C) 1.8V 5.5V 0.3 0.25 VOL (mV) 0.2 0.15 0.1 0.05 0 120 -40 0 40 Temperature (°C) 80 120 1.8V (@ 1mA) 2.7V (@ 3mA) 2.7V 5.5V (@ 3mA) 80 FIGURE 2-75: Temperature. 2 1.5 VIL (V) 1 VIH (SCL, SDA) vs. VDD and FIGURE 2-77: Temperature. 1.2 VOL (SDA) vs. VDD and 5.5V 2.7V 1 0.8 VDD (V) 0.6 0.4 2.7V 5.5 V 0.5 0 -40 0 40 1.8V 0.2 0 80 120 -40 0 40 Temperature (°C) 80 120 Temperature (°C) FIGURE 2-76: Temperature. VIL (SCL, SDA) vs. VDD and FIGURE 2-78: and Temperature. POR/BOR Trip point vs. VDD DS22147A-page 26 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 10 Code = 7Fh 10 0 -10 dB -20 -30 -40 -50 1,000 Frequency (kHz) 10,000 -60 100 1,000 Code = 01h Code = 0Fh Code = 3Fh Code = 7Fh Code = 3Fh Code = 1Fh 0 -10 dB -20 -30 -40 -50 100 Code = 0Fh Code = 01h Code = 1Fh 10,000 Frequency (kHz) FIGURE 2-79: (-3dB). 10 0 -10 dB -20 -30 -40 -50 -60 100 5 kΩ – Gain vs. Frequency FIGURE 2-82: 100 kΩ – Gain vs. Frequency (-3dB). 2.1 Code = 7Fh Code = 3Fh Test Circuits +5V VIN A B W +5V + VOUT Code = 0Fh Code = 1Fh Code = 01h 1,000 Frequency (kHz) 10,000 FIGURE 2-80: (-3dB). 10 0 -10 dB -20 -30 -40 -50 -60 100 10 kΩ – Gain vs. Frequency FIGURE 2-83: (-3dB). Code = 7Fh Code = 3Fh Code = 1Fh Code = 0Fh Gain vs. Frequency Test Code = 01h 1,000 Frequency (kHz) 10,000 FIGURE 2-81: (-3dB). 50 kΩ – Gain vs. Frequency © 2009 Microchip Technology Inc. DS22147A-page 27 MCP4017/18/19 NOTES: DS22147A-page 28 © 2009 Microchip Technology Inc. MCP4017/18/19 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. Additional descriptions of the device pins follow. TABLE 3-1: Pin Name VDD VSS SCL SDA B W A PINOUT DESCRIPTION FOR THE MCP4017/18/19 Pin Number Pin Type P P I/O I/O I/O I/O I/O Buffer Type — — Function Positive Power Supply Input Ground MCP4017 MCP4018 MCP4019 (SC70-6) (SC70-6) (SC70-5) 1 2 3 4 5 6 — 1 2 3 4 — 5 6 1 2 3 4 — 5 — ST (OD) I2C Serial Clock pin ST (OD) I2C Serial Data pin A A A Potentiometer Terminal B Potentiometer Wiper Terminal Potentiometer Terminal A P = Power Legend: A = Analog input I = Input ST (OD) = Schmitt Trigger with Open Drain O = Output I/O = Input/Output © 2009 Microchip Technology Inc. DS22147A-page 29 MCP4017/18/19 3.1 Positive Power Supply Input (VDD) The VDD pin is the device’s positive power supply input. The input power supply is relative to VSS and can range from 1.8V to 5.5V. A de-coupling capacitor on VDD (to VSS) is recommended to achieve maximum performance. While the device’s voltage is in the range of 1.8V ≤ VDD < 2.7V, the Resistor Network’s electrical performance of the device may not meet the data sheet specifications. W pin can support both positive and negative current. The voltage on terminal W must be between VSS and VDD. 3.7 Potentiometer Terminal A The terminal A pin (available on some devices) is connected to the internal potentiometer’s terminal A. The potentiometer’s terminal A is the fixed connection to the Full Scale (0x7F tap) wiper value of the digital potentiometer. The terminal A pin is available on the MCP4018 devices. The terminal A pin does not have a polarity relative to the terminal W pin. The terminal A pin can support both positive and negative current. The voltage on Terminal A must be between VSS and VDD. The terminal A pin is not available on the MCP4017 and MCP4019 devices. For these devices, the potentiometer’s terminal A is internally floating. 3.2 Ground (VSS) I2C Serial Clock (SCL) The VSS pin is the device ground reference. 3.3 The SCL pin is the serial clock pin of the I2C interface. The MCP401X acts only as a slave and the SCL pin accepts only external serial clocks. The SCL pin is an open-drain output. Refer to Section 5.0 “Serial Interface - I2C Module” for more details of I2C Serial Interface communication. 3.4 I2C Serial Data (SDA) The SDA pin is the serial data pin of the I2C interface. The SDA pin has a Schmitt trigger input and an open-drain output. Refer to Section 5.0 “Serial Interface - I2C Module” for more details of I2C Serial Interface communication. 3.5 Potentiometer Terminal B The terminal B pin (available on some devices) is connected to the internal potentiometer’s terminal B. The potentiometer’s terminal B is the fixed connection to the Zero Scale (0x00 tap) wiper value of the digital potentiometer. The terminal B pin is available on the MCP4017 device. The terminal B pin does not have a polarity relative to the terminal W pin. The terminal B pin can support both positive and negative current. The voltage on terminal B must be between VSS and VDD. The terminal B pin is not available on the MCP4018 and MCP4019 devices. For these devices, the potentiometer’s terminal B is internally connected to VSS. 3.6 Potentiometer Wiper (W) Terminal The terminal W pin is connected to the internal potentiometer’s terminal W (the wiper). The wiper terminal is the adjustable terminal of the digital potentiometer. The terminal W pin does not have a polarity relative to terminals A or B pins. The terminal DS22147A-page 30 © 2009 Microchip Technology Inc. MCP4017/18/19 4.0 GENERAL OVERVIEW 4.1.2 BROWN-OUT RESET The MCP4017/18/19 devices are general purpose digital potentiometers intended to be used in applications where a programmable resistance with moderate bandwidth is desired. This Data Sheet covers a family of three Digital Potentiometer and Rheostat devices. The MCP4018 device is the Potentiometer configuration, while the MCP4017 and MCP4019 devices are the Rheostat configuration. Applications generally suited for the MCP401X devices include: • • • • Set point or offset trimming Sensor calibration Selectable gain and offset amplifier designs Cost-sensitive mechanical trim pot replacement When the device powers down, the device VDD will cross the VPOR/VBOR voltage. Once the VDD voltage decreases below the VPOR/VBOR voltage the following happens: • Serial Interface is disabled If the VDD voltage decreases below the VRAM voltage the following happens: • Volatile wiper registers may become corrupted As the voltage recovers above the VPOR/VBOR voltage see Section 4.1.1 “Power-on Reset”. Serial commands not completed due to a Brown-out condition may cause the memory location to become corrupted. 4.1.3 WIPER REGISTER (RAM) As the Device Block Diagram shows, there are four main functional blocks. These are: • POR/BOR Operation • Serial Interface - I2C Module • Resistor Network The POR/BOR operation and the Memory Map are discussed in this section and the I2C and Resistor Network operation are described in their own sections. The Serial Commands commands are discussed in Section 5.4. The Wiper Register is volatile memory that starts functioning at the RAM retention voltage (VRAM). The Wiper Register will be loaded with the default wiper value when VDD will rise above the VPOR/VBOR voltage. 4.1.4 DEVICE CURRENTS The current of the device can be classified into two modes of the device operation. These are: • Serial Interface Inactive (Static Operation) • Serial Interface Active Static Operation occurs when a Stop condition is received. Static Operation is exited when a Start condition is received. 4.1 POR/BOR Operation The Power-on Reset is the case where the device is having power applied to it from VSS. The Brown-out Reset occurs when a device had power applied to it, and that power (voltage) drops below the specified range. The devices RAM retention voltage (VRAM) is lower than the POR/BOR voltage trip point (VPOR/VBOR). The maximum VPOR/VBOR voltage is less then 1.8V. When VPOR/VBOR < VDD < 2.7V, the Resistor Network’s electrical performance may not meet the data sheet specifications. In this region, the device is capable of reading and writing to its volatile memory if the proper serial command is executed. Table 4-1 shows the digital pot’s level of functionality across the entire VDD range, while Figure 4-1 illustrates the Power-up and Brown-out functionality. 4.1.1 POWER-ON RESET When the device powers up, the device VDD will cross the VPOR/VBOR voltage. Once the VDD voltage crosses the VPOR/VBOR voltage, the following happens: • Volatile wiper register is loaded with the default wiper value (3Fh) • The device is capable of digital operation © 2009 Microchip Technology Inc. DS22147A-page 31 MCP4017/18/19 TABLE 4-1: VDD Level DEVICE FUNCTIONALITY AT EACH VDD REGION (NOTE 1) Serial Interface Potentiometer Terminals Wiper Setting Unknown Wiper Register loaded with POR/BOR value Comment “unknown” VDD < VBOR < 1.8V Ignored VBOR ≤ VDD < 1.8V “Unknown” Operational with reduced electrical specs 1.8V ≤ VDD < 2.7V Accepted Operational with reduced electrical specs 2.7V ≤ VDD ≤ 5.5V Accepted Operational Note 1: Wiper Register Electrical performance may not determines Wiper meet the data sheet specifications. Setting Wiper Register Meets the data sheet specifications determines Wiper Setting For system voltages below the minimum operating voltage, the customer will be recommended to use a voltage supervisor to hold the system in reset. This will ensure that MCP4017/18/19 commands are not attempted out of the operating range of the device. Normal Operation Range Normal Operation Range VDD Outside Specified AC/DC Range 2.7V 1.8V VPOR/BOR VRAM VSS Analog Characteristics not specified Analog Characteristics not specified Device’s Serial Interface is “Not Operational” VBOR Delay Wiper Forced to Default POR/BOR setting FIGURE 4-1: Power-up and Brown-out. DS22147A-page 32 © 2009 Microchip Technology Inc. MCP4017/18/19 5.0 SERIAL INTERFACE I2C MODULE 5.1 I2C I/O Considerations I2C specifications require active low, passive high functionality on devices interfacing to the bus. Since devices may be operating on separate power supply sources, ESD clamping diodes are not permitted. The specification recommends using open drain transistors tied to VSS (common) with a pull-up resistor. The specification makes some general recommendations on the size of this pull-up, but does not specify the exact value since bus speeds and bus capacitance impacts the pull-up value for optimum system performance. Common pull-up values range from 1 kΩ to a max of ~10 kΩ. Power sensitive applications tend to choose higher values to minimize current losses during communication but these applications also typically utilize lower VDD. The SDA and SCL float (are not driving) when the device is powered down. A "glitch" filter is on the SCL and SDA pins when the pin is an input. When these pins are an output, there is a slew rate control of the pin that is independent of device frequency. A 2-wire I2C serial protocol is used to write or read the digital potentiometer’s wiper register. The I2C protocol utilizes the SCL input pin and SDA input/output pin. The I2C serial interface supports the following features. • Slave mode of operation • 7-bit addressing • The following clock rate modes are supported: - Standard mode, bit rates up to 100 kb/s - Fast mode, bit rates up to 400 kb/s • Support Multi-Master Applications The serial clock is generated by the Master. The I2C Module is compatible with the Phillips I2C specification. Phillips only defines the field types, field lengths, timings, etc. of a frame. The frame content defines the behavior of the device. The frame content for the MCP4017, MCP4018, and MCP4019 devices are defined in this section of the Data Sheet. Figure 5-1 shows a typical I2C bus configurations. Single I2C Bus Configuration Device 1 Host Controller Device 2 Device 4 Device 3 Device n 5.1.1 SLOPE CONTROL The device implements slope control on the SDA output. The slope control is defined by the fast mode specifications. For Fast (FS) mode, the device has spike suppression and Schmidt trigger inputs on the SDA and SCL pins. FIGURE 5-1: Configurations. Typical Application I2C Bus Refer to Section 2.0 “Typical Performance Curves”, AC/DC Electrical Characteristics table for detailed input threshold and timing specifications. © 2009 Microchip Technology Inc. DS22147A-page 33 MCP4017/18/19 5.2 • • • • • • I2C Bit Definitions I2C bit definitions include: Start Bit Data Bit Acknowledge (A) Bit Repeated Start Bit Stop Bit Clock Stretching If the Slave Address is not valid, the Slave Device will issue a Not A (A). The A bit will have the SDA signal high. If an error condition occurs (such as an A instead of A) then an START bit must be issued to reset the command state machine. TABLE 5-1: Event General Call MCP4017/18/19 A / A RESPONSES Acknowledge Bit Response A Comment Figure 5-8 shows the waveform for these states. 5.2.1 START BIT The Start bit (see Figure 5-2) indicates the beginning of a data transfer sequence. The Start bit is defined as the SDA signal falling when the SCL signal is “High”. Slave Address A valid Slave Address A not valid Bus Collision N.A. I2C Module Resets, or a “Don’t Care” if the collision occurs on the Masters “Start bit”. SDA SCL S 1st Bit 2nd Bit FIGURE 5-2: 5.2.2 Start Bit. 5.2.4 DATA BIT The SDA signal may change state while the SCL signal is Low. While the SCL signal is High, the SDA signal MUST be stable (see Figure 5-3). REPEATED START BIT SDA SCL S 1st Bit 2nd Bit The Repeated Start bit (see Figure 5-5) indicates the current Master Device wishes to continue communicating with the current Slave Device without releasing the I2C bus. The Repeated Start condition is the same as the Start condition, except that the Repeated Start bit follows a Start bit (with the Data bits + A bit) and not a Stop bit. The Start bit is the beginning of a data transfer sequence and is defined as the SDA signal falling when the SCL signal is “High”. Note 1: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low to high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data "1". FIGURE 5-3: 5.2.3 Data Bit. ACKNOWLEDGE (A) BIT The A bit (see Figure 5-4) is a response from the Slave device to the Master device. Depending on the context of the transfer sequence, the A bit may indicate different things. Typically the Slave device will supply an A response after the Start bit and 8 “data” bits have been received. The A bit will have the SDA signal low. SDA SCL D0 8 A 9 SDA 1st Bit FIGURE 5-4: Acknowledge Waveform. SCL Sr = Repeated Start FIGURE 5-5: Waveform. Repeat Start Condition DS22147A-page 34 © 2009 Microchip Technology Inc. MCP4017/18/19 5.2.5 STOP BIT 5.2.7 ABORTING A TRANSMISSION The Stop bit (see Figure 5-6) Indicates the end of the I2C Data Transfer Sequence. The Stop bit is defined as the SDA signal rising when the SCL signal is “High”. A Stop bit resets the I2C interface of the other devices. SDA A / A SCL P If any part of the I2C transmission does not meet the command format, it is aborted. This can be intentionally accomplished with a START or STOP condition. This is done so that noisy transmissions (usually an extra START or STOP condition) are aborted before they corrupt the device. 5.2.8 IGNORING AN I2C TRANSMISSION AND “FALLING OFF” THE BUS FIGURE 5-6: Transmit Mode. 5.2.6 Stop Condition Receive or CLOCK STRETCHING The MCP4017/18/19 expects to receive entire, valid I2C commands and will assume any command not defined as a valid command is due to a bus corruption and will enter a passive high condition on the SDA signal. All signals will be ignored until the next valid START condition and CONTROL BYTE are received. “Clock Stretching” is something that the Secondary Device can do, to allow additional time to “respond” to the “data” that has been received. The MCP4017/18/19 will not strech the clock signal (SCL) since memory read accesses occur fast enough. SDA SCL S 1st 2nd 3rd 4th 5th 6th 7th 8th A/A 1st 2nd 3rd 4th 5th 6th 7th 8th A/A Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit Bit P FIGURE 5-7: SDA Typical 16-bit I2C Waveform Format. SCL START Condition Data allowed to change Data or A valid STOP Condition FIGURE 5-8: I2C Data States and Bit Sequence. © 2009 Microchip Technology Inc. DS22147A-page 35 MCP4017/18/19 5.2.9 I2C COMMAND PROTOCOL TABLE 5-2: Device MCP4017 MCP4018 MCP4019 DEVICE I2C ADDRESS I2C Address ‘0101111’ ‘0101111’ ‘0101111’ Comment The MCP4017/18/19 is a slave I2C device which supports 7-bit slave addressing. The slave address contains seven fixed bits. Figure 5-9 shows the control byte format. 5.2.9.1 Control Byte (Slave Address) 5.2.9.2 Hardware Address Pins The MCP4017/MCP4018/MCP4019 does not support hardware address bits. The Control Byte is always preceded by a START condition. The Control Byte contains the slave address consisting of seven fixed bits and the R/W bit. Figure 59 shows the control byte format and Table 5-2 shows the I2C address for the devices. Slave Address S A6 A5 A4 A3 A2 A1 A0 R/W “0” “1” “0” “1” “1” “1” “1” Start bit R/W bit R/W = 0 = write R/W = 1 = read A/A 5.2.10 GENERAL CALL The General Call is a method that the Master device can communicate with all other Slave devices. The MCP4017/18/19 devices do not respond to General Call address and commands, and therefore the communications are Not Acknowledged. A bit (controlled by slave device) A = 0 = Slave Device Acknowledges byte A = 1 = Slave Device does not Acknowledge byte FIGURE 5-9: I2C Control Byte. Slave Address Bits in the Second Byte S00 00 000 0Ax x x x X x x 0 AP General Call Address “7-bit Command” Reserved 7-bit Commands (By I2C Specification - Philips # 9398 393 40011, Ver. 2.1 January 2000) ‘0000 011’b - Reset and write programmable part of slave address by hardware. ‘0000 010’b - Write programmable part of slave address by hardware. ‘0000 000’b - NOT Allowed The Following is a “Hardware General Call” Format Second Byte S000 0 0000 Ax x x x X x x n occurrences of (Data + A / A) 1 Ax x x x Xx x XAP General Call Address “7-bit Command” This indicates a “Hardware General Call” MCP4016/7/8/9 will ignore this byte and all following bytes (and A), until a Stop bit (P) is encountered. FIGURE 5-10: General Call Formats. DS22147A-page 36 © 2009 Microchip Technology Inc. MCP4017/18/19 5.3 Note: Software Reset Sequence This technique should be supported by any I2C compliant device. The 24xxxx I2C Serial EEPROM devices support this technique, which is documented in AN1028. The Stop bit terminates the current I2C bus activity. The MCP4017/18/19 wait to detect the next Start condition. This sequence does not effect any other I2C devices which may be on the bus, as they should disregard this as an invalid command. At times it may become necessary to perform a Software Reset Sequence to ensure the MCP4017/18/ 19 device is in a correct and known I2C Interface state. This only resets the I2C state machine. This is useful if the MCP4017/18/19 device powers up in an incorrect state (due to excessive bus noise, etc), or if the Master Device is reset during communication. Figure 5-11 shows the communication sequence to software reset the device. 5.4 Serial Commands 2 serial The MCP4017/18/19 devices support commands. These commands are: • Write Operation • Read Operations S ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ ‘1’ Nine bits of ‘1’ S P Start bit Start bit Stop bit FIGURE 5-11: Format. Software Reset Sequence The 1st Start bit will cause the device to reset from a state in which it is expecting to receive data from the Master Device.In this mode, the device is monitoring the data bus in Receive mode and can detect the Start bit forces an internal Reset. The nine bits of ‘1’ are used to force a Reset of those devices that could not be reset by the previous Start bit. This occurs only if the MCP4017/18/19 is driving an A on the I2C bus, or is in output mode (from a Read command) and is driving a data bit of ‘0’ onto the I2C bus. In both of these cases, the previous Start bit could not be generated due to the MCP4017/18/19 holding the bus low. By sending out nine ‘1’ bits, it is ensured that the device will see a A (the Master Device does not drive the I2C bus low to acknowledge the data sent by the MCP4017/18/19), which also forces the MCP4017/ 18/19 to reset. The 2nd Start bit is sent to address the rare possibility of an erroneous write. This could occur if the Master Device was reset while sending a Write command to the MCP4017/18/19, AND then as the Master Device returns to normal operation and issues a Start condition while the MCP4017/18/19 is issuing an A. In this case if the 2nd Start bit is not sent (and the Stop bit was sent) the MCP4017/18/19 could initiate a write cycle. Note: The potential for this erroneous write ONLY occurs if the Master Device is reset while sending a Write command to the MCP4017/18/19. © 2009 Microchip Technology Inc. DS22147A-page 37 MCP4017/18/19 5.4.1 WRITE OPERATION 5.4.2 READ OPERATIONS The write operation requires the START condition, Control Byte, Acknowledge, Data Byte, Acknowledge and STOP (or RESTART) condition. The Control (Slave Address) Byte requires the R/W bit equal to a logic zero (R/W = “0”) to generate a write sequence. The MCP4017/18/19 is responsible for generating the Acknowledge (A) bits. Data is written to the MCP4017/18/19 after every byte transfer (during the A bit). If a STOP or RESTART condition is generated during a data transfer (before the A bit), the data will not be written to MCP4017/18/ 19. Data bytes may be written after each Acknowledge. The command is terminated once a Stop (P) condition occurs. Refer to Figure 5-12 for the write sequence. For a single byte write, the master sends a STOP or RESTART condition after the 1st data byte is sent. The MSb of each Data Byte is a don’t care, since the wiper register is only 7-bits wide. Figure 5-14 shows the I2C communication behavior of the Master Device and the MCP4017/18/19 device and the resultant I2C bus values. Fixed Address S010 1 1 11 0A The read operation requires the START condition, Control Byte, Acknowledge, Data Byte, the master generating the A and STOP condition. The Control Byte requires the R/W bit equal to a logic one (R/W = 1) to generate a read sequence. The MCP4017/18/19 will A the Slave Address Byte and A all the Data Bytes. The I2C Master will A the Slave Address Byte and the last Data Byte. If there are multiple Data Bytes, the I2C Master will A all Data Bytes except the last Data Byte (which it will A). The MCP4017/18/19 maintains control of the SDA signal until all data bits have been clocked out. The command is terminated once a Stop (P) condition occurs. Refer to Figure 5-13 for the read command sequence. For a single read, the master sends a STOP or RESTART condition after the 1st data byte (and A bit) is sent from the slave. Figure 5-14 shows the I2C communication behavior of the Master Device and the MCP4017/18/19 device and the resultant I2C bus values. Read/Write bit (“0” = Write) x D6 D5 D4 D3 D2 D1 D0 A x D6 D5 D4 D3 D2 D1 D0 A Data Byte Data Byte STOP bit Slave Address Byte x D6 D5 D4 D3 D2 D1 D0 A x D6 D5 D4 D3 D2 D1 D0 A P Data Byte Legend S = Start Condition P = Stop Condition A = Acknowledge X = Don’t Care R/W = Read/Write bit D6, D5, D4, D3, D2, D1, D0 = Data bits Data Byte FIGURE 5-12: I2C Write Command Format. DS22147A-page 38 © 2009 Microchip Technology Inc. MCP4017/18/19 Fixed Address S010 1 1 11 1A Read/Write bit (“1” = Read) 0 D6 D5 D4 D3 D2 D1 D0 A(1) 0 D6 D5 D4 D3 D2 D1 D0 A(1) Data Byte Data Byte STOP bit Slave Address Byte 0 D6 D5 D4 D3 D2 D1 D0 A(1)0 D6 D5 D4 D3 D2 D1 D0 A Data Byte Legend S = Start Condition P = Stop Condition A = Acknowledge X = Don’t Care R/W = Read/Write bit Note 1 = Data bits Data Byte (2) P Note 1: Master Device is responsible for A / A signal. If a A signal occurs, the MCP4017/18/19 will abort this transfer and release the bus. 2: The Master Device will A, and the MCP4017/18/19 will release the bus so the Master Device can generate a Stop or Repeated Start condition. FIGURE 5-13: I2C Read Command Format. © 2009 Microchip Technology Inc. DS22147A-page 39 MCP4017/18/19 Write 1 Byte R / W A Data Byte (1) S Slave Address Master MCP4017/18/19 I2C Bus Write 2 Bytes AP S010111101x ddddddd1P 0 0 S010111100x ddddddd0P S Slave Address Master MCP4017/18/19 I2C Bus Read 1 Byte R / W A Data Byte (1) A Data Byte (1) AP S010111101x ddddddd1x ddddddd1P 0 0 0 S010111100x ddddddd0x ddddddd1P S Slave Address Master MCP4017/18/19 I2C Bus Read 2 Bytes R / W A Data Byte AP 1P S010111111 00ddddddd1 S0101111100ddddddd1P S Slave Address Master MCP4017/18/19 I2C Bus R / W A Data Byte A Data Byte 0 AP 1P S010111111 00ddddddd10ddddddd1 S0101111100ddddddd00ddddddd1P Note 1: For Write Commands, the MSb of the Data Byte is a don’t care since the wiper register is only 7-bits wide. FIGURE 5-14: I2C Communication Behavior. DS22147A-page 40 © 2009 Microchip Technology Inc. MCP4017/18/19 6.0 RESISTOR NETWORK The Resistor Network is made up of two parts. These are: • Resistor Ladder • Wiper Figure 6-1 shows a block diagram for the resistive network. Digital potentiometer applications can be divided into two resistor network categories: • Rheostat configuration • Potentiometer (or voltage divider) configuration The MCP4017 is a true rheostat, with terminal B and the wiper (W) of the variable resistor available on pins. The MCP4018 device offers a voltage divider (potentiometer) with terminal B internally connected to ground. The MCP4019 device is a Rheostat device with terminal A of the resistor floating, terminal B internally connected to ground, and the wiper (W) available on pin. RS N=0 B RW RS N = 126 RS N = 125 RS RW RW A N = 127 RW 7Fh (1) 7Eh (1) 7Dh (1) W N=1 RW 01h (1) 00h (1) Analog Mux 6.1 Resistor Ladder Module The resistor ladder is a series of equal value resistors (RS) with a connection point (tap) between the two resistors. The total number of resistors in the series (ladder) determines the RAB resistance (see Figure 61). The end points of the resistor ladder are connected to the device Terminal A and Terminal B pins. The RAB (and RS) resistance has small variations over voltage and temperature. The Resistor Network has 127 resistors in a string between terminal A and terminal B. This gives 7-bits of resolution. The wiper can be set to tap onto any of these 127 resistors thus providing 128 possible settings (including terminal A and terminal B). This allows zero scale to full scale connections. A wiper setting of 00h connects the Terminal W (wiper) to Terminal B (Zero Scale). A wiper setting of 3Fh is the Mid scale setting. A wiper setting of 7Fh connects the Terminal W (wiper) to Terminal A (Full Scale). Table 61 illustrates the full wiper setting map. Terminal A and B as well as the wiper W do not have a polarity. These terminals can support both positive and negative current. Note 1: The wiper resistance is tap dependent. That is, each tap selection resistance has a small variation. This variation has more effect on devices with smaller RAB resistance (5.0 kΩ). FIGURE 6-1: Diagram. TABLE 6-1: Wiper Setting 07Fh 07Eh - 040h 03Fh 03Eh - 001h 000h Resistor Network Block WIPER SETTING MAP Properties Full Scale (W = A) W=N W = N (Mid Scale) W=N Zero Scale (W = B) © 2009 Microchip Technology Inc. DS22147A-page 41 MCP4017/18/19 Step resistance (RS) is the resistance from one tap setting to the next. This value will be dependent on the RAB value that has been selected. Equation 6-1 shows the calculation for the step resistance while Table 6-2 shows the typical step resistances for each device. A POR/BOR event will load the Volatile Wiper register value with the default value. Table 6-3 shows the default values offered. TABLE 6-3: EQUATION 6-1: RS CALCULATION R AB R S = --------127 DEFAULT FACTORY SETTINGS SELECTION Default POR Wiper Setting Mid-scale Mid-scale Mid-scale Mid-scale Code (1) 3Fh 3Fh 3Fh 3Fh Resistance Typical Code RAB Value -502 -103 -503 -104 5.0 kΩ 10.0 kΩ 50.0 kΩ 100.0 kΩ Equation 6-2 illustrates the calculation used to determine the resistance between the wiper and terminal B. EQUATION 6-2: RWB CALCULATION R AB N R WB = ------------- + R W 127 N = 0 to 127 (decimal) The digital potentiometer is available in four nominal resistances (RAB) where the nominal resistance is defined as the resistance between terminal A and terminal B. The four nominal resistances are 5 kΩ, 10 kΩ, 50 kΩ, and 100 kΩ. The total resistance of the device has minimal variation due to operating voltage (see Figure 2-11, Figure 2-29, Figure 2-47, or Figure 2-65). Note 1: Custom POR/BOR Wiper Setting options are available, contact the local Microchip Sales Office for additional information. Custom options have minimum volume requirements. TABLE 6-2: STEP RESISTANCES Resistance (Ω) Total (RAB) 4000 6000 8000 12000 40000 60000 80000 120000 Part Number Case Min. Max. Min. Max. Min. Max. Min. Max. Step (RS) 31.496 39.370 47.244 62.992 78.740 94.488 314.961 393.701 472.441 629.921 787.402 944.882 MCP4017/18/19-502E Typical 5000 MCP4017/18/19-103E Typical 10000 MCP4017/18/19-503E Typical 50000 MCP4017/18/19-104E Typical 100000 DS22147A-page 42 © 2009 Microchip Technology Inc. MCP4017/18/19 6.2 6.2.1 Resistor Configurations RHEOSTAT CONFIGURATION 6.2.2 POTENTIOMETER CONFIGURATION When used as a rheostat, two of the three digital potentiometer’s terminals are used as a resistive element in the circuit. With terminal W (wiper) and either terminal A or terminal B, a variable resistor is created. The resistance will depend on the tap setting of the wiper (and the wiper’s resistance). The resistance is controlled by changing the wiper setting The unused terminal (B or A) should be left floating. Figure 6-2 shows the two possible resistors that can be used. Reversing the polarity of the A and B terminals will not affect operation. When used as a potentiometer, all three terminals of the device are tied to different nodes in the circuit. This allows the potentiometer to output a voltage proportional to the input voltage. This configuration is sometimes called voltage divider mode. The potentiometer is used to provide a variable voltage by adjusting the wiper position between the two endpoints as shown in Figure 6-3. Reversing the polarity of the A and B terminals will not affect operation. V1 A A B W B Resistor RAW or RBW V2 W V3 FIGURE 6-3: Configuration. Potentiometer FIGURE 6-2: Rheostat Configuration. This allows the control of the total resistance between the two nodes. The total resistance depends on the “starting” terminal to the Wiper terminal. So at the code 00h, the RBW resistance is minimal (RW), but the RAW resistance in maximized (RAB + RW). Conversely, at the code 3Fh, the RAW resistance is minimal (RW), but the RBW resistance in maximized (RAB + RW). The resistance Step size (RS) equates to one LSb of the resistor. Note: To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. The temperature coefficient of the RAB resistors is minimal by design. In this configuration, the resistors all change uniformly, so minimal variation should be seen. The Wiper resistor temperature coefficient is different to the RAB temperature coefficient. The voltage at node V3 (Figure 6-3) is not dependent on this Wiper resistance, just the ratio of the RAB resistors, so this temperature coefficient in most cases can be ignored. Note: To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. The pinout for the rheostat devices is such that as the wiper register is incremented, the resistance of the resistor will increase (as measured from Terminal B to the W Terminal). © 2009 Microchip Technology Inc. DS22147A-page 43 MCP4017/18/19 6.3 Wiper Resistance Wiper resistance is the series resistance of the analog switch that connects the selected resistor ladder node to the Wiper Terminal common signal (see Figure 6-1). A value in the volatile wiper register selects which analog switch to close, connecting the W terminal to the selected node of the resistor ladder. The resistance is dependent on the voltages on the analog switch source, gate, and drain nodes, as well as the device’s wiper code, temperature, and the current through the switch. As the device voltage decreases, the wiper resistance increases (see Figure 6-4 and Table 6-4). The wiper can connect directly to Terminal B or to Terminal A. A zero scale connections, connects the Terminal W (wiper) to Terminal B (wiper setting of 000h). A full scale connections, connects the Terminal W (wiper) to Terminal A (wiper setting of 7Fh). In these configurations the only resistance between the Terminal W and the other Terminal (A or B) is that of the analog switches. The wiper resistance is typically measured when the wiper is positioned at either zero scale (00h) or full scale (3Fh). The wiper resistance in potentiometer-generated voltage divider applications is not a significant source of error. The wiper resistance in rheostat applications can create significant nonlinearity as the wiper is moved toward zero scale (00h). The lower the nominal resistance, the greater the possible error. In a rheostat configuration, this change in voltage needs to be taken into account. Particularly for the lower resistance devices. For the 5.0 kΩ device the maximum wiper resistance at 5.5V is approximately 3.2% of the total resistance, while at 2.7V it is approximately 6.5% of the total resistance. In a potentiometer configuration, the wiper resistance variation does not effect the output voltage seen on the W pin. The slope of the resistance has a linear area (at the higher voltages) and a non-linear area (at the lower voltages). In where resistance increases faster then the voltage drop (at low voltages). RW VDD Note: The slope of the resistance has a linear area (at the higher voltages) and a non-linear area (at the lower voltages). FIGURE 6-4: Relationship of Wiper Resistance (RW) to Voltage. Since there is minimal variation of the total device resistance over voltage, at a constant temperature (see Figure 2-11, Figure 2-29, Figure 2-47, or Figure 2-65), the change in wiper resistance over voltage can have a significant impact on the INL and DNL error. TABLE 6-4: Typical Total (RAB) 5000 10000 50000 100000 Note 1: 2: Step (RS) 39.37 78.74 TYPICAL STEP RESISTANCES AND RELATIONSHIP TO WIPER RESISTANCE Resistance (Ω) Wiper (RW) Typical 100 100 100 100 Max @ Max @ 5.5V 2.7V 170 170 170 170 325 325 325 325 RW = Typical 254.00% 127.00% 25.40% 12.70% RW / RS (%) (1) RW = Max RW = Max @ 5.5V @ 2.7V 431.80% 215.90% 43.18% 21.59% 825.5% 412.75% 82.55% 41.28% RW / RAB (%) (2) RW = Typical 2.00% 1.00% 0.20% 0.10% RW = Max RW = Max @ 5.5V @ 2.7V 3.40% 1.70% 0.34% 0.17% 6.50% 3.25% 0.65% 0.325% 393.70 787.40 RS is the typical value. The variation of this resistance is minimal over voltage. RAB is the typical value. The variation of this resistance is minimal over voltage. DS22147A-page 44 © 2009 Microchip Technology Inc. MCP4017/18/19 6.4 Operational Characteristics 6.4.1.2 Differential Non-linearity (DNL) Understanding the operational characteristics of the device’s resistor components is important to the system design. DNL error is the measure of variations in code widths from the ideal code width. A DNL error of zero would imply that every code is exactly 1 LSb wide. 6.4.1 6.4.1.1 ACCURACY Integral Non-linearity (INL) 111 110 101 Digital 100 Input Code 011 010 001 INL < 0 111 110 101 Actual transfer function 000 Narrow code < 1 LSb Digital Pot Output Actual transfer function Ideal transfer function Wide code, > 1 LSb INL error for these devices is the maximum deviation between an actual code transition point and its corresponding ideal transition point after offset and gain errors have been removed. These endpoints are from 0x00 to 0x7F. Refer to Figure 6-5. Positive INL means higher resistance than ideal. Negative INL means lower resistance than ideal. FIGURE 6-6: 6.4.1.3 Ideal transfer function DNL Accuracy. Digital Input Code 100 011 010 001 000 INL < 0 Digital Pot Output Ratiometric temperature coefficient The ratiometric temperature coefficient quantifies the error in the ratio RAW/RWB due to temperature drift. This is typically the critical error when using a potentiometer device (MCP4018) in a voltage divider configuration. 6.4.1.4 Absolute temperature coefficient FIGURE 6-5: INL Accuracy. The absolute temperature coefficient quantifies the error in the end-to-end resistance (Nominal resistance RAB) due to temperature drift. This is typically the critical error when using a rheostat device (MCP4017 and MCP4019) in an adjustable resistor configuration. © 2009 Microchip Technology Inc. DS22147A-page 45 MCP4017/18/19 6.4.2 MONOTONIC OPERATION Monotonic operation means that the device’s resistance increases with every step change (from terminal A to terminal B or terminal B to terminal A). The wiper resistances difference at each tap location. When changing from one tap position to the next (either increasing or decreasing), the ΔRW is less then the ΔRS. When this change occurs, the device voltage and temperature are “the same” for the two tap positions. 0x3F 0x3E Digital Input Code 0x3D RS62 RS63 0x03 0x02 0x01 0x00 RS0 RS1 RS3 RW (@ tap) n=? RBW = RSn + RW(@ Tap n) n=0 Resistance (RBW) FIGURE 6-7: RBW. DS22147A-page 46 © 2009 Microchip Technology Inc. MCP4017/18/19 7.0 DESIGN CONSIDERATIONS 7.2 Layout Considerations In the design of a system with the MCP4017/18/19 devices, the following considerations should be taken into account. These are: • The Power Supply • The Layout In the design of a system with the MCP4017/18/19 devices, the following considerations should be taken into account: • Power Supply Considerations • Layout Considerations Inductively-coupled AC transients and digital switching noise can degrade the input and output signal integrity, potentially masking the MCP4017/18/19’s performance. Careful board layout will minimize these effects and increase the Signal-to-Noise Ratio (SNR). Bench testing has shown that a multi-layer board utilizing a low-inductance ground plane, isolated inputs, isolated outputs and proper decoupling are critical to achieving the performance that the silicon is capable of providing. Particularly harsh environments may require shielding of critical signals. If low noise is desired, breadboards and wire-wrapped boards are not recommended. 7.1 Power Supply Considerations The typical application will require a bypass capacitor in order to filter high-frequency noise, which can be induced onto the power supply's traces. The bypass capacitor helps to minimize the effect of these noise sources on signal integrity. Figure 7-1 illustrates an appropriate bypass strategy. In this example, the recommended bypass capacitor value is 0.1 µF. This capacitor should be placed as close to the device power pin (VDD) as possible (within 4 mm). The power source supplying these devices should be as clean as possible. If the application circuit has separate digital and analog power supplies, VDD and VSS should reside on the analog plane. VDD 0.1 µF VDD 0.1 µF PICmicro® Microcontroller 7.2.1 RESISTOR TEMPCO Characterization curves of the resistor temperature coefficient (Tempco) are shown in Figure 2-11, Figure 2-29, Figure 2-47, and Figure 2-65. These curves show that the resistor network is designed to correct for the change in resistance as temperature increases. This technique reduces the end to end change is RAB resistance. MCP4017/18/19 A W SCL B SDA VSS VSS FIGURE 7-1: Connections. Typical Microcontroller © 2009 Microchip Technology Inc. DS22147A-page 47 MCP4017/18/19 NOTES: DS22147A-page 48 © 2009 Microchip Technology Inc. MCP4017/18/19 8.0 APPLICATIONS EXAMPLES Digital potentiometers have a multitude of practical uses in modern electronic circuits. The most popular uses include precision calibration of set point thresholds, sensor trimming, LCD bias trimming, audio attenuation, adjustable power supplies, motor control overcurrent trip setting, adjustable gain amplifiers and offset trimming. The MCP4017/18/19 devices can be used to replace the common mechanical trim pot in applications where the operating and terminal voltages are within CMOS process limitations (VDD = 2.7V to 5.5V). VDD R1 MCP4018 SDA SCL B A W VOUT 8.1 Set Point Threshold Trimming FIGURE 8-1: Using the Digital Potentiometer to Set a Precise Output Voltage. 8.1.1 TRIMMING A THRESHOLD FOR AN OPTICAL SENSOR Applications that need accurate detection of an input threshold event often need several sources of error eliminated. Use of comparators and operational amplifiers (op amps) with low offset and gain error can help achieve the desired accuracy, but in many applications, the input source variation is beyond the designer’s control. If the entire system can be calibrated after assembly in a controlled environment (like factory test), these sources of error are minimized if not entirely eliminated. Figure 8-1 illustrates a common digital potentiometer configuration. This configuration is often referred to as a “windowed voltage divider”. Note that R1 is not necessary to create the voltage divider, but its presence is useful when the desired threshold has limited range. It is “windowed” because R1 can narrow the adjustable range of VTRIP to a value much less than VDD – VSS. If the output range is reduced, the magnitude of each output step is reduced. This effectively increases the trimming resolution for a fixed digital potentiometer resolution. This technique may allow a lower-cost digital potentiometer to be utilized (64 steps instead of 256 steps). The MCP4018’s low DNL performance is critical to meeting calibration accuracy in production without having to use a higher precision digital potentiometer. If the application has to calibrate the threshold of a diode, transistor or resistor, a variation range of 0.1V is common. Often, the desired a resolution of 2 mV or better is adequate to accurately detect the presence of a precise signal. A “windowed” voltage divider, utilizing the MCP4018, would be a potential solution. Figure 82 illustrates this example application. VDD VDD Rsense R1 VCC+ Comparator MCP4018 A VTRIP SDA W MCP6021 SCL B VCC– 0.1 µF EQUATION 8-1: CALCULATING THE WIPER SETTING FROM THE DESIRED VTRIP FIGURE 8-2: Calibration. Set Point or Threshold R WB V TRIP = V DD ⎛ ------------------⎞ ⎝ R 1 + R 2⎠ RAB = RNominal RWB = RAB • D 127 D= VTRIP VDD • (R1 + RAB ) • 127 D = Digital Potentiometer Wiper Setting (0-127) © 2009 Microchip Technology Inc. DS22147A-page 49 MCP4017/18/19 8.2 Operational Amplifier Applications Figure 8-3 and Figure 8-4 illustrate typical amplifier circuits that could replace fixed resistors with the MCP4017/18/19 to achieve digitally-adjustable analog solutions. VIN VDD R1 A B R3 + MCP6291 VOUT Op Amp – W MCP4018 MCP4017 FIGURE 8-3: Trimming Offset and Gain in a Non-Inverting Amplifier. MCP4018 B W VDD R1 A B – Op Amp VIN W + VOUT A R4 MCP6021 2 π ⋅ R Eq ⋅ C 1 fc = ----------------------------- MCP4018 Thevenin R = ( R 1 + R AB – R WB ) || ( R 2 + R WB ) + R w Equivalent Eq FIGURE 8-4: Programmable Filter. DS22147A-page 50 © 2009 Microchip Technology Inc. MCP4017/18/19 8.3 Temperature Sensor Applications Thermistors are resistors with very predictable variation with temperature. Thermistors are a popular sensor choice when a low-cost temperature-sensing solution is desired. Unfortunately, thermistors have non-linear characteristics that are undesirable, typically requiring trimming in an application to achieve greater accuracy. There are several common solutions to trim & linearize thermistors. Figure 8-5 and Figure 8-6 are simple methods for linearizing a 3-terminal NTC thermistor. Both are simple voltage dividers using a Positive Temperature Coefficient (PTC) resistor (R1) with a transfer function capable of compensating for the linearity error in the Negative Temperature Coefficient (NTC) thermistor. The circuit, illustrated by Figure 8-5, utilizes a digital rheostat for trimming the offset error caused by the thermistor’s part-to-part variation. This solution puts the digital potentiometer’s RW into the voltage divider calculation. The MCP4017/18/19’s RAB temperature coefficient is a low 50 ppm (-20°C to +70°C). RW’s error is substantially greater than RAB’s error because RW varies with VDD, wiper setting and temperature. For the 50 kΩ devices, the error introduced by RW is, in most cases, insignificant as long as the wiper setting is > 6. For the 2 kΩ devices, the error introduced by RW is significant because it is a higher percentage of RWB. For these reasons, the circuit illustrated in Figure 8-5 is not the most optimum method for “exciting” and linearizing a thermistor. VDD The circuit illustrated by Figure 8-6 utilizes a digital potentiometer for trimming the offset error. This solution removes RW from the trimming equation along with the error associated with RW. R2 is not required, but can be utilized to reduce the trimming “window” and reduce variation due to the digital pot’s RAB part-to-part variability. VDD R1 NTC Thermistor VOUT MCP4018 FIGURE 8-6: Thermistor Calibration using a Digital Potentiometer in a Potentiometer Configuration. R1 NTC Thermistor VOUT R2 MCP4017 FIGURE 8-5: Thermistor Calibration using a Digital Potentiometer in a Rheostat Configuration. © 2009 Microchip Technology Inc. DS22147A-page 51 MCP4017/18/19 8.4 Wheatstone Bridge Trimming Another common configuration to “excite” a sensor (such as a strain gauge, pressure sensor or thermistor) is the wheatstone bridge configuration. The wheatstone bridge provides a differential output instead of a single-ended output. Figure 8-7 illustrates a wheatstone bridge utilizing one to three digital potentiometers. The digital potentiometers in this example are used to trim the offset and gain of the wheatstone bridge. VDD 5 kΩ MCP4017 VOUT MCP4017 50 kΩ MCP4017 50 kΩ FIGURE 8-7: Trimming. Wheatstone Bridge DS22147A-page 52 © 2009 Microchip Technology Inc. MCP4017/18/19 9.0 9.1 DEVELOPMENT SUPPORT Development Tools 9.2 Technical Documentation To assist in your design and evaluation of the MCP4017/18/19 devices, a Demo board using the MCP4017 device is in development. Please check the Microchip web site for the release of this board. The board part number is tentatively MCP4XXXDM-PGA, and is expected to be available in the summer of 2009. Several additional technical documents are available to assist you in your design and development. These technical documents include Application Notes, Technical Briefs, and Design Guides. Table 9-1 shows some of these documents. TABLE 9-1: Application Note Number AN1080 AN737 AN692 AN691 AN219 — — TECHNICAL DOCUMENTATION Title Understanding Digital Potentiometers Resistor Variations Using Digital Potentiometers to Design Low Pass Adjustable Filters Using a Digital Potentiometer to Optimize a Precision Single Supply Photo Detect Optimizing the Digital Potentiometer in Precision Circuits Comparing Digital Potentiometers to Mechanical Potentiometers Digital Potentiometer Design Guide Signal Chain Design Guide Literature # DS01080 DS00737 DS00692 DS00691 DS00219 DS22017 DS21825 © 2009 Microchip Technology Inc. DS22147A-page 53 MCP4017/18/19 NOTES: DS22147A-page 54 © 2009 Microchip Technology Inc. MCP4017/18/19 10.0 10.1 PACKAGING INFORMATION Package Marking Information Example: Part Number Code BENN BFNN BGNN BHNN 5-Lead SC70 XXNN MCP4019T-502E/LT MCP4019T-103E/LT MCP4019T-503E/LT MCP4019T-104E/LT BENN 6-Lead SC70 Part Number Code AENN AFNN AGNN AHNN Part Number MCP4018T-502E/LT MCP4018T-103E/LT MCP4018T-503E/LT MCP4018T-104E/LT Code AANN ABNN ACNN ADNN Example: XXNN MCP4017T-502E/LT MCP4017T-103E/LT MCP4017T-503E/LT MCP4017T-104E/LT AANN Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2009 Microchip Technology Inc. DS22147A-page 55 MCP4017/18/19 /HDG 3ODVWLF 6PDOO 2XWOLQH 7UDQVLVWRU /7 >6& 1RWH @ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ D b 3 2 1 E1 E 4 e e 5 A A2 c A1 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK /HDG 7KLFNQHVV /HDG :LGWK 1 H $ $ $ ( ( ' / F E ± ± %6& ± ± ± 0,1 0,//,0(7(56 120 0$; L 1RWHV 'LPHQVLRQV ' DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG 'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( < 0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV PP SHU VLGH 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ & % DS22147A-page 56 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2009 Microchip Technology Inc. DS22147A-page 57 MCP4017/18/19 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22147A-page 58 © 2009 Microchip Technology Inc. MCP4017/18/19 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2009 Microchip Technology Inc. DS22147A-page 59 MCP4017/18/19 NOTES: DS22147A-page 60 © 2009 Microchip Technology Inc. MCP4017/18/19 APPENDIX A: REVISION HISTORY Revision A (March 2009) • Original Release of this Document. © 2009 Microchip Technology Inc. DS22147A-page 61 MCP4017/18/19 NOTES: DS22147A-page 62 © 2009 Microchip Technology Inc. MCP4017/18/19 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XXX X /XX Examples: a) b) c) d) MCP4017T-502E/LT: 5 kΩ, 6-LD SC-70. MCP4017T-103E/LT: 10 kΩ, 6-LD SC-70. MCP4017T-503E/LT: 50 kΩ, 6-LD SC-70. MCP4017T-104E/LT: 100 kΩ, 6-LD SC-70. MCP4018T-502E/LT: 5 kΩ, 6-LD SC-70. MCP4018T-103E/LT: 10 kΩ, 6-LD SC-70. MCP4018T-503E/LT: 50 kΩ, 6-LD SC-70. MCP4018T-104E/LT: 100 kΩ, 6-LD SC-70. MCP4019T-502E/LT: 5 kΩ, 5-LD SC-70. MCP4019T-103E/LT: 10 kΩ, 5-LD SC-70. MCP4019T-503E/LT: 50 kΩ, 5-LD SC-70. MCP4019T-104E/LT: 100 kΩ, 5-LD SC-70. Resistance Temperature Package Version Range Device: MCP4017: Single Rheostat with I2C interface MCP4017T: Single Rheostat with I2C interface (Tape and Reel) MCP4018: Single Potentiometer to GND with I2C Interface MCP4018T: Single Potentiometer to GND with I2C Interface (Tape and Reel) MCP4019: Single Rheostat to GND with I2C Interface MCP4019T: Single Rheostat to GND with I2C Interface (Tape and Reel) = = = = 5 kΩ 10 kΩ 50 kΩ 100 kΩ a) b) c) d) Resistance Version: 502 103 503 104 E a) b) c) d) Temperature Range: Package: = -40°C to +125°C LT = Plastic Small Outline Transistor (SC70), 5-lead, 6-lead © 2009 Microchip Technology Inc. DS22147A-page 63 MCP4017/18/19 NOTES: DS22147A-page 64 © 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. 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Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. 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