MTE1122ISO

MTE1122 Energy Management Controller IC FEATURES • • • • • • • • • • • Energy Management Controller Based on 8-bit RISC Technology Proprietary Power Management Algorithm Reduces the power consumption of induction motor systems 5V Operation 18-pin PDIP and SOIC Packages 8-bit Analog-to-Digital (A/D) Converter Automatic Power-on Reset Power-up Timer Commercial and Industrial Temperature Range Operation Multiple parts can be slaved for three-phase operation PACKAGE TYPE 18-Lead PDIP/SOIC VSS1 P-Sense VSS RESET VSS ZC-Sense TTRIG NC NC •1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 VSS Gate Input OSC1 OSC2 VDD IND NC NC NC FIGURE 1: SYSTEM BLOCK DIAGRAM LINE IN LINE OUT TO MOTOR TRIAC MTE1122 INTRODUCTION The MTE1122 is an Energy Management Controller IC for single-phase induction motors. This CMOS device is based on Microchip Technology Inc’s RISC processor core and proprietary algorithms. When combined with some external analog components, it will provide an electronic system that economically reduces the operating costs of small induction motors by as much as 58%. It will also allow motors to run cooler and with less vibration. The system operates on single phase 110 or 220 VAC. VOLTAGE ZERO-CROSS VOLTAGE AMP CURRENT ZERO-CROSS VCC POWER NEUTRAL IN MTE1122 NEUTRAL OUT FIGURE 2: ENERGY SAVINGS 60.0 50.0 40.0 Percent Savings 30.0 20.0 10.0 0 .0 0 10 20 30 40 50 Percent Load 60 70 80 90 100 © 1995 Microchip Technology Inc. Preliminary DS21112B-page 1 MTE1122 FUNCTIONAL DESCRIPTION Single-phase induction motors run most efficiently at full load. As the applied load lessens, a greater portion of the energy consumed by the motor is wasted, mostly as heat. It is estimated by the EPA that 50% of the energy produced in the US is consumed by small electric motors, and that 20% of this energy does no useful work. There are perhaps three major reasons for this: 1. Over-specification -- sometimes its easier or costs no more to specify a larger motor than determine actual loads. Worst case design -- pumps, conveyers, fans, and the like must be able to operate properly with clogged filters, maximum heads, or specified loads. If filters are clean, or loads are lower, the motor will be running only partly loaded. Idle time -- many times, systems can’t be shut down conveniently when not in use. A 1/3 HP motor will typically see 85 VAC at no load when powered through the MTE1122, for an energy savings of as much as 58%. A system block diagram is shown in Figure 1. A graph of energy savings vs. motor load is shown in Figure 2. A graph of motor efficiency with and without an MTE1122-based energy management controller (EMC) is shown in Figure 3. The data for the graphs are shown in Table 1. These figures are based on a 1/3 HP induction motor coupled to a dynamometer. Actual savings may vary based on motor size, motor load and motor construction. 2. PINOUT DESCRIPTIONS P-Sense - analog input that is used by the device to measure the load voltage. Gate Enable - analog input that monitors the voltage across the triac. It is used as a current feedback mechanism. IND - TTL-compatible output that indicates that the system is operating normally. It is intended to control an LED or another indicator device. ZC-Sense - TTL-compatible input that is used to determine the zero crossing point of the AC voltage waveform. TTRIG - TTL-compatible output that is used to drive the triac. RESET - TTL-compatible input used to reset the device by holding this pin low. OSC1, OSC2 - Oscillator crystal or resonator connections. 3. Number 1 above can be corrected by proper design. For example, in modern refrigerators, the compressor systems have been optimized quite effectively. Numbers 2 and 3 can not be improved using traditional approaches. This is where the MTE1122 provides a new, cost-effective solution. The MTE1122 calculates the amount of load on a motor connected to it, and adjusts the motor’s supply voltage to match that load. For example, if the load is lower than the motor’s rated load, the voltage to the motor can be reduced, thus decreasing the energy used by the motor. FIGURE 3: MOTOR EFFICIENCY 70.0 60.0 With E.M.C. 50.0 Efficiency 40.0 30.0 20.0 10.0 Without E.M.C. 0 .0 0 10 20 30 40 50 60 70 80 90 100 Percent Load DS21112B-page 2 Preliminary © 1995 Microchip Technology Inc. MTE1122 TABLE 1: OPERATING PARAMTER COMPARISONS 1/3 HP Motor without E.M.C. Load (%) 0 10 20 30 40 50 60 70 80 90 100 Load (Nm) 0.00 0.14 0.29 0.43 0.57 0.72 0.86 1.00 1.14 1.29 1.43 Irms (A) 5.7 5.7 5.7 5.7 5.7 5.8 5.8 6.0 6.1 6.3 6.5 Power Factor 0.18 0.20 0.24 0.29 0.35 0.37 0.42 0.46 0.49 0.53 0.57 Power In (W) 120 130 160 193 229 249 280 315 348 386 428 Power Out (W) 0 26 54 80 105 133 158 183 208 234 258 Power Out (HP) 0.00 0.04 0.07 0.11 0.14 0.18 0.21 0.25 0.28 0.31 0.35 Efficiency (%) 0.2 20.1 33.7 41.4 46.0 53.3 56.4 58.0 59.7 60.6 60.3 Vrms RPM 115 115 115 115 115 115 115 115 116 115 116 1791 1788 1781 1777 1768 1764 1758 1750 1744 1736 1727 1/3 HP Motor with E.M.C. Load (%) 0 10 20 30 40 50 60 70 80 90 100 Load (Nm) 0.00 0.14 0.29 0.43 0.57 0.72 0.86 1.00 1.14 1.29 1.43 Irms (A) 3.1 3.2 3.5 3.8 4.1 4.3 4.6 4.9 5.3 5.6 6.0 Power Factor 0.14 0.19 0.26 0.32 0.38 0.42 0.47 0.51 0.55 0.59 0.61 Power In (W) 50 68 104 138 178 206 243 281 329 371 406 Power Out (W) 0 26 54 79 104 132 156 181 205 231 255 Power Out (HP) 0.00 0.04 0.07 0.11 0.14 0.18 0.21 0.24 0.27 0.31 0.34 Efficiency (%) 0.4 38.4 51.7 57.4 58.7 63.8 64.3 64.3 62.3 62.2 62.7 Vrms RPM 113 113 113 113 113 113 112 112 112 112 111 1794 1786 1775 1764 1755 1749 1740 1730 1722 1713 1705 © 1995 Microchip Technology Inc. Preliminary DS21112B-page 3 MTE1122 ELECTRICAL CHARACTERISTICS Absolute Maximum Rating † Ambient temperature under bias .................................................................................................................-55 to +125°C Storage Temperature.............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD and RESET).................................................... -0.6V to VDD +0.6V Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V Voltage on RESET with respect to VSS (Note 1) ................................................................................................0 to +14V Total power Dissipation (Note 2) ...........................................................................................................................800mW Max. Current out of VSS pin ...................................................................................................................................150mA Max. Current into VDD pin ......................................................................................................................................100mA Input Clamping Current, IIK (VIVDD) .................................................................................................................. ±20mA Output Clamping Current, IOK (V0VDD) .......................................................................................................... ±20mA Max. Output Current sunk by any I/O pin .................................................................................................................25mA Max. Output Current sourced by any I/O pin............................................................................................................20mA Note 1: Voltage spikes below VSS at the RESET pin, inducing currents greater than 80mA, may cause latch-up. Thus, a series resistor of 50-100Ω should be used when applying a "low' level to the RESET pin rather than pulling this pin directly to VSS. Note 2: Total power dissipation should not exceed 800 mW for the package. Power dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL) †NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device or compliance to AC and DC parametric specifications at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 2: DC CHARACTERISTICS POWER SUPPLY PINS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for industrial, 0°C ≤ TA ≤ +70°C for commercial Operating voltage VDD = 4.0V to 6.0V Sym Min Typ Max Units Conditions (Note 1) 4.0 6.0 V VDD VPOR Vss V SVDD IDD 0.05 1.8 3.3 V/ms mA FOSC = 4 MHz, VDD = 5.5V Power Supply Pins Characteristic Supply Voltage VDD start voltage to guarantee power on reset VDD rise rate to guarantee Power-On Reset (Note 2) Supply Current (Note 3) Note 1: Data in the column labeled “Typical” is based on characterization results at 25°C. This data is for design guidance only and is not tested for, or guaranteed by Microchip Technology. 2: This parameter is characterized but not tested. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. DS21112B-page 4 Preliminary © 1995 Microchip Technology Inc. MTE1122 TABLE 3: DC CHARACTERISTICS: ALL PINS EXCEPT POWER SUPPLY Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for industrial, 0°C ≤ TA ≤ +70°C for commercial Operating voltage VDD = 4.0V to 6.0V Sym Min Typ Max Units Conditions VIL VIH VSS VSS 0.2 VDD 0.3 VDD V V All Pins Except Power Characteristic Input Low Voltage: All Input Pins (Except OSC1) RESET OSC1 Input High Voltage: All Input Pins (Except RESET, OSC1) RESET OSC1 Input Leakage Current: (Notes 1,2) IND, TTRIG, AC-Sense P-Sense, Gate Input RESET OSC1 Output Low Voltage: All Output Pins Output High Voltage: All Output Pins (Note 2) VIH VIH VIH 0.36 VDD 0.85 VDD 0.7 VDD VDD VDD VDD V V V 4.5V ≤ VDD ≤ 5.5V IIL ±1 ±1 ±1 ±1 µA µA µA µA V VSS ≤ VPIN ≤ VDD, Pin at hi-impedance VSS ≤ VPIN ≤ VDD, Pin at hi-impedance VSS ≤ VPIN ≤ VDD VSS ≤ VPIN ≤ VDD IOL = 8.5mA, VDD = 4.5V, -40°C to +85°C IOH 83.mA, VDD = 4.5V, -40°C to +85°C VOL 0.6 VOH 0.7 VDD V Note 1: The leakage current on the RESET pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 2: Negative current is defined as current coming out of the pin. TABLE 4: AC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ + 85°C for industrial, 0°C ≤ TA ≤ +70°C for commercial Operating voltage VDD = 4.0V to 6.0V Min Typ Max Units Conditions 4 4 MHz 50 25 200 ns ns ns Note 1 Note 1 Note 1 AC Characteristics Characteristic Oscillator Frequency Clock in (OSC1) High or Low Time Clock in (OSC1) Rise or Fall Time RESET Pulse Width (low) Sym FOSC TCKHLXT TCKRFXT TMCL © 1995 Microchip Technology Inc. Preliminary DS21112B-page 5 MTE1122 PACKAGING INFORMATION Package Type: 18-Lead Plastic Dual In-Line (300 mil) N α AAAAAAAAA AA AAAAAAAA A AA AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA A AAAA AAAAAAAA A AAAAAAAA AAAAAAAAA A AA AAAA AA AAAAAAAA AA AAAA AAAAAAAA AA AA AAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA AAAAAAAA A AAAAAAAA AAAAAAAA AAAAAAAA AA E1 Pin No. 1 Indicator Area D S Base Plane Seating Plane B1 B D1 S1 E C eA eB L e1 A1 A2 A Package Group: Plastic Dual In-Line (PLA) Millimeters Symbol α A A1 A2 B B1 C D D1 E E1 e1 eA eB L N S S1 Min 0° — 0.381 3.048 0.3556 1.524 0.203 22.479 20.320 7.620 6.096 2.4892 7.620 7.874 3.048 18 0.889 0.508 Max 10° 4.064 3.810 0.5588 1.524 0.381 23.495 20.320 8.255 7.112 2.5908 7.620 9.906 3.556 18 — — Notes Min 0° — 0.015 0.120 0.014 0.060 0.008 0.885 0.800 0.300 0.240 0.098 0.300 0.310 0.120 18 0.035 0.005 Inches Max 10° 0.160 — 0.150 0.022 0.060 0.015 0.925 0.800 0.325 0.280 0.102 0.300 0.390 0.140 18 — — Notes Reference Typical Reference Reference Typical Reference Typical Reference Typical Reference DS21112B-page 6 Preliminary © 1995 Microchip Technology Inc. MTE1122 Package Type: 18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body) B e N Index Area E Chamfer h x 45° 1 23 α C H h x 45° L D Seating Plane CP Base Plane A1 A Package Group: Plastic SOIC (SO) Millimeters Symbol α A A1 B C D E e H h L N CP Min 0° 2.3622 0.1016 0.3556 0.2413 11.3538 7.4168 1.270 10.0076 0.381 0.4064 18 — Max 8° 2.6416 0.29972 0.4826 0.3175 11.7348 7.5946 1.270 10.6426 0.762 1.143 18 0.1016 Notes Min 0° 0.093 0.004 0.014 0.0095 0.447 0.292 0.050 0.394 0.015 0.016 18 — Inches Max 8° 0.104 0.0118 0.019 0.0125 0.462 0.299 0.050 0.419 0.030 0.045 18 0.004 Notes Reference Reference © 1995 Microchip Technology Inc. Preliminary DS21112B-page 7 MTE1122 MTE1122 Product Identification System To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed sales offices. PART NO. X /XX Package: P SO = = Plastic Dual In-line Plastic SOIC Temperature Range: I = = 0°C to +70°C –40°C to +85°C Device: MTE1122 AMERICAS Corporate Office Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602 786-7200 Fax: 602 786-7277 Technical Support: 602 786-7627 Web: http://www.mchip.com/biz/mchip Atlanta Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770 640-0034 Fax: 770 640-0307 Boston Microchip Technology Inc. 5 Mount Royal Avenue Marlborough, MA 01752 Tel: 508 480-9990 Fax: 508 480-8575 Chicago Microchip Technology Inc. 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 708 285-0071 Fax: 708 285-0075 Dallas Microchip Technology Inc. 14651 Dallas Parkway, Suite 816 Dallas, TX 75240-8809 Tel: 214 991-7177 Fax: 214 991-8588 Dayton Microchip Technology Inc. 35 Rockridge Road Englewood, OH 45322 Tel: 513 832-2543 Fax: 513 832-2841 Los Angeles Microchip Technology Inc. 18201 Von Karman, Suite 455 Irvine, CA 92715 Tel: 714 263-1888 Fax: 714 263-1338 New York Microchip Technology Inc. 150 Motor Parkway, Suite 416 Hauppauge, NY 11788 Tel: 516 273-5305 Fax: 516 273-5335 AMERICAS (continued) San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408 436-7950 Fax: 408 436-7955 EUROPE United Kingdom Arizona Microchip Technology Ltd. Unit 6, The Courtyard Meadow Bank, Furlong Road Bourne End, Buckinghamshire SL8 5AJ Tel: 44 0 1628 851077 Fax: 44 0 1628 850259 France Arizona Microchip Technology SARL 2 Rue du Buisson aux Fraises 91300 Massy - France Tel: 33 1 69 53 63 20 Fax: 33 1 69 30 90 79 Germany Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Muenchen, Germany Tel: 49 89 627 144 0 Fax: 49 89 627 144 44 Italy Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Pegaso Ingresso No. 2 Via Paracelso 23, 20041 Agrate Brianza (MI) Italy Tel: 39 039 689 9939 Fax: 39 039 689 9883 ASIA/PACIFIC Hong Kong Microchip Technology Unit No. 3002-3004, Tower 1 Metroplaza 223 Hing Fong Road Kwai Fong, N.T. Hong Kong Tel: 852 2 401 1200 Fax: 852 2 401 3431 Korea Microchip Technology 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku, Seoul, Korea Tel: 82 2 554 7200 Fax: 82 2 558 5934 Singapore Microchip Technology 200 Middle Road #10-03 Prime Centre Singapore 188980 Tel: 65 334 8870 Fax: 65 334 8850 Taiwan Microchip Technology 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886 2 717 7175 Fax: 886 2 545 0139 JAPAN Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shin Yokohama Kohoku-Ku, Yokohama Kanagawa 222 Japan Tel: 81 45 471 6166 Fax: 81 45 471 6122 9/95 All rights reserved. © 1995, Microchip Technology Inc.,USA. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. DS21112B-page 8 Preliminary © 1995 Microchip Technology Inc.