PS700

PS700 Battery Monitor Features • Measures, maintains and reports all critical rechargeable battery parameters with high accuracy • Supports Lithium (1-cell and 2-cell) battery packs • Current measurement with 16-bit integrating A/D accurate to less than ±0.5% error • Temperature measurement accurate to within ±2°C absolute, using on-chip temperature sensor or external thermistor • Accumulation of charge current, discharge current, temperature and voltage in independent 32-bit registers • 512-byte nonvolatile EEPROM stores factory programmed, measured and user-defined parameters • In-system offset calibration compensates for offset error in current measurement • Industry standard SMBus/I2C™ compatible 2-wire communications interface • 8-pin TSSOP package • -20°C to +85°C operating temperature range • NTC pin can be configured as a thermistor input or GPIO • VC2 pin can be configured as a cell input or a GPIO • Flexible power operating modes allow low-power monitoring of battery conditions during system full operating and standby conditions: - Run: Continuous Conversion; 80 µA typ. - Sample: Sample interval from 0.5-64s @ 45 µA typ. - Sample-Sleep: Sample interval from 0.5-138s min. @ 20 µA typ. • Shelf-Sleep mode reduces power consumption during pack storage conditions to 300 nA typ., with automatic wake-up upon pack insertion Pin Description VC2/IO1 VC1 SCL SDA 1 2 3 4 PS700 8 7 6 5 SR GND NTC/IO0 ROSC 8-pin 150 mil TSSOP Package Pin Summary Pin Name VC2/IO1 Description Cell voltage input for cell 2 in a 2-series Li Ion pack or general purpose I/O #1 Cell voltage input for cell 1 SMBus clock line SMBus data l/O Oscillator bias resistor External thermistor connection or general purpose I/O #0 Power supply ground Sense resistor input VC1 SCL SDA ROSC NTC/IO0 GND SR  2004 Microchip Technology Inc. DS21760F-page 1 PS700 1.0 PRODUCT OVERVIEW The PS700 is a cost-effective, highly accurate IC that measures, stores and reports all of the critical parameters required for rechargeable battery monitoring with a minimum of external components. It precisely measures charge/discharge current as well as voltage and temperature of a battery pack. In addition, the PS700 accurately accumulates both charge and discharge current as independent parameters. Temperature history can also be maintained for calculating self-discharge effects. The PS700 integrates a highly accurate 16-bit integrating A/D converter that performs current measurement to within ±0.5% error. On-chip counters precisely track battery charge/discharge and temperature history. Also included are an on-chip voltage regulation circuit, noncrystal time base and on-chip temperature sensor. The operating voltage range of the PS700 is optimized to allow a direct interface to 1 or 2-series Li Ion/Li Poly battery packs. 512 bytes of general purpose nonvolatile EEPROM storage are provided to store factory programmed, measured and user defined parameters. Efficient communication is provided through an industry standard SMBus/I2C™ compatible 2-wire communications interface. This interface allows the host to determine accurate battery status for effective system power management and for communication to the end user. A battery management solution utilizing the PS700 delivers both space and total system component cost savings for a wide variety of battery operated applications. FIGURE 1-1: PS700 INTERNAL BLOCK DIAGRAM Digital Section Analog Section 512 512 EEPROM EEPROM 32-bit 32-bit Accumulators/ / Accumulators Timers Timers Voltage Voltage Reference and Reference and Temp Sensor Temp Sensor Voltage Voltage Regulator Regulator SDA Registers Registers Comm Comm Interface Interface Control and Status Control and Status SCL 16-Bit 16-Bit Sigma-Delta Sigma-Delta Integrating Integrating A/D Converter A/D Converter VC1 Analog Analog Input Mux Input Mux SR Run Run Oscillator Oscillator Sleep Sleep Oscillator Oscillator NTC/IO0 VC2/IO1 ROSC GND DS21760F-page 2  2004 Microchip Technology Inc. PS700 FIGURE 1-2: APPLICATION SCHEMATIC – PS700-BASED BATTERY PACK CELL POSITIVE (+) V1 470 R11 C11 100 nF 2 U2 VDD S8241A VM 1 DO VSS CO 3 C1 100 nF C3 1.0 nF NTC1 THERMISTOR CONNECTIONS CELL NEGATIVE (-) VR NTC2 R7 6.49K 221K U1 PS700 2 1 6 VCELL1 SMB-CLK VCELL2 SMB-DTA NTC ROSC GND SR 3 4 D1 CMSZDA5V6 680 680 R4 R5 B+ C PACK CONNECTION D B- 4 5 2 Q1 6 7 SI6880EDQ 4 5 R3 5 7 8 1 3 GROUND PLANE CONNECTION R8 0.020 2 3 R15 1.0K TABLE 1-1: Pin No. 1 2 PIN DESCRIPTIONS Pin Name VC2/IO1 VC1 Description Cell input connection for lowest cell in a 2-cell series Li Ion pack. Can also be configured as an open-drain general purpose input/output. Cell input connection for highest cell in a 2-cell series Li Ion pack. Connects to the positive terminal of 1-cell series packs. VC1 serves as the power supply input for the PS700. SMBus/I2C clock line connection. SMBus/I2C data line connection. External bias resistor. Input for an external temperature sensor using a 103ETB-type thermistor. Can also be configured as a general purpose input/output pin. Analog and digital ground. Current measurement A/D input from positive side of the current sense resistor. 3 4 5 6 7 8 SCL SDA ROSC NTC/IO0 GND SR  2004 Microchip Technology Inc. 1 8 DS21760F-page 3 PS700 2.0 ARCHITECTURAL OVERVIEW 2.4 EEPROM Memory The PS700 contains a complete analog “front-end” for battery monitoring as well as digital logic for control, measurement accumulation, timing and communications. Major functions within the PS700 include: • • • • • • • • Voltage Regulator Precision Time Base Temperature Sensor 512-Byte EEPROM Memory 32-Byte RAM Memory Analog-to-Digital (A/D) Converter 32-bit Accumulators/Timers SMBus/I2C Communications Interface 512 bytes of EEPROM memory are incorporated for storage of nonvolatile parameters, such as PowerSmart® 3D cell models for use with host driver firmware. An initialization block is reserved within the EEPROM array for values that are loaded into PS700 registers following a power-on condition. 2.5 RAM Memory 32 bytes of general purpose RAM memory are provided for storage of temporary parameters. 2.6 A/D Converter Figure 1-1 is a block diagram of the internal circuitry of the PS700. Figure 1-2 is a schematic diagram that depicts the PS700 in a typical single cell Lithium Ion application. The function of each of the blocks listed above is summarized in the following sections. 2.1 Internal Voltage Regulator The PS700 incorporates an integrating sigma-delta A/D converter together with an analog mux that has inputs for charge and discharge current, cell and pack voltages, the on-chip temperature sensor and an offchip thermistor. The converter can be programmed to perform a conversion with resolutions of 8 to 15 bits plus sign while utilizing either a ±340 mV or a ±170 mV reference. The PS700 incorporates an internal voltage regulator that supports 1 or 2-cell series lithium pack configurations. The internal regulator draws power directly from the VC1 input. No other external components are required to regulate internal supply voltage. 2.7 32-Bit Accumulators/Timers 2.2 Precision Time Base The integrated precision time base is a highly accurate RC oscillator that provides precise timing for the sigmadelta A/D and for the on-chip elapsed time counters without the need for an external crystal. This time base is trimmed during manufacturing to a nominal frequency of 131,072 Hz. 2.3 Temperature Sensor The PS700 incorporates four 32-bit accumulators and four 32-bit elapsed time counters. The Discharge Current Accumulator (DCA) and the Charge Current Accumulator (CCA) are intended to record discharge and charge capacity values. The Discharge Time Counter (DTC) and the Charge Time Counter (CTC) are intended to maintain the total discharge time and charge time. Accumulated charge and discharge values can be used to determine state of charge of the battery as well as cycle count information. With information provided by the elapsed time counters, average charge and discharge currents over an extended period of time can be calculated. An integrated temperature sensor is provided that can eliminate the need for an external thermistor. As an option, a connection is provided for an external thermistor for applications where the battery pack is physically located at a distance away from the PS700. 2.8 SMBus/I2C Communications Interface The communications port for the PS700 is a 2-wire industry standard SMBus/I2C interface. All commands, status and data are read or written from the host system via this interface. DS21760F-page 4  2004 Microchip Technology Inc. PS700 3.0 3.1 3.1.1 OPERATIONAL DESCRIPTION A/D and Accumulator/Timer Operation A/D CONVERSION CYCLE the next register. In this manner, the user can specify a sequence of conversions that will be performed during each A/D cycle. As stated above, the input source for each of the registers is programmable. The 3-bit mux field within each control register selects one of seven possible input sources for the A/D conversion. The list of input sources is as follows: • Charge/Discharge Current (voltage from SR pin to GND) • Internal Temperature Sensor • External Thermistor (constant current source on NTC pin) • Battery Pack Voltage • VC1 Voltage • VC2 Voltage • A/D Offset (conversion performed with input shorted internally to determine offset error associated with the converter) However, the accumulator/timer functions are “hard wired” to specific A/D Result registers. For this reason, the control/result registers are given names which indicate their primary intended usage (see Table 3-1). When the A/D converter is enabled and active, it repeatedly performs a cycle of 1 to 8 conversions as programmed by the user through 8 A/D Control registers. These registers determine the input source, resolution, reference voltage source and sequence of conversions during an A/D converter cycle. During the cycle, the A/D logic accesses each register in sequence and performs the conversion specified by the bits within the register. This register contains an enable bit, a resolution field, a select bit for a single-ended or differential reference and a select field for the analog input mux. The results from each conversion are stored in one of eight corresponding16-bit result registers. If the “enable” bit is set within a control register, a conversion will be performed. If it is disabled, that conversion will be skipped and the logic will move on to TABLE 3-1: A/D Register # 0 1 2 3 4 5 6 7 A/D CONTROL/RESULT REGISTERS Control Register Ictrl ITctrl ETctrl VPctrl VC1ctrl VC2ctrl OFFSctrl AUXctrl Result Register Ires ITres ETres VPres VC1res VC2res OFFSres AUXres Intended Input Source Battery Pack Current (via sense resistor) Internal Temperature Sensor External Temperature Sensor Battery Pack Voltage (VC1 to GND) Battery Cell Voltage (VC1 to VC2) Battery Cell Voltage (VC2 to GND) Internal A/D Offset Voltage (A/D input automatically internally shorted to GND) Any The 3-bit “resolution” field in each A/D Control register determines the resolution of the conversion, from a minimum of 9 bits (8 bits plus sign bit) to a maximum of 16 bits (15 bits plus sign bit). The time required to complete the conversion is a function of the number of bits of resolution (n) selected. The conversion time can be calculated as follows: TADC = 30.52 µs * 2n where: “n” is the number of bits of resolution selected The “Ref” bit selects the magnitude of the reference voltage. Either a ±340 mV or a ±170 mV reference is available. The ±170 mV reference is typically used for current readings and the ±340 mV reference for all other measurements. The value of the LSB can be expressed as a function of the resolution selected as follows: A/D LSB = 680/340 mV/2n where: “n” is the number of bits of resolution selected The result value is given in sign/magnitude format (i.e., a sign bit with a 15-bit magnitude). 15 S Magnitude 0  2004 Microchip Technology Inc. DS21760F-page 5 PS700 3.1.2 CURRENT MEASUREMENT Charge and discharge currents are measured using a 5 to 600 mΩ sense resistor that is connected between the SR and GND pins. The maximum input voltage at SR is ±150 mV. The sense resistor should be properly sized to accommodate the systems lowest and highest expected charge and discharge currents including suspend and/or standby currents. In order to perform charge and discharge current measurements, the Ictrl register must be programmed with the SR pin as the analog input source. If charge and discharge accumulation is desired, the Ictrl and corresponding Ires registers should be used to select current measurement since the DCA, DTC, CCA and DCA registers are updated by the measurement results from the Ires register. Ictrl programming in a typical application is as follows. The following table shows LSB values for 9-bit plus sign resolution, so n = 9. TABLE 3-3: Measurement VPACK VCELL LSB VALUES FOR 10-BIT RESOLUTION VR 340 340 Divider 1/30 1/18.33 Bits 9 + sign 9 + sign LSB 19.92 12.17 VPctrl programming in a typical application is as follows. TABLE 3-4: Bit(s) 7 6-4 3 2-0 Name En Res Ref Sel VPctrl PROGRAMMING Value 1 001 1 011 Function Enables A/D conversion Selects 10-bit resolution Selects ±340 mV reference Selects VSR as converter input TABLE 3-2: Bit(s) 7 6-4 3 2-0 Name En Res Ref Sel Ictrl PROGRAMMING Value 1 111 0 000 Function Enables A/D conversion Selects 16-bit resolution Selects ±170 mV reference Selects VSR as converter input The input source fields for the VPctrl, VC1ctrl and VC2ctrl registers must be programmed to select pack voltage (on VC1), VC1 cell voltage and VC2 cell voltage in order for these registers to control their intended measurements. Using the maximum resolution of 16 bits, the voltage value of the LSB is: A/D LSB = 340 mV/216 = 5.19 µV Using a sense resistor value of 20 mΩ, the value of the LSB in units of current is: 5.19 µV/20 mΩ = 259 µA 3.1.4 TEMPERATURE MEASUREMENTS A/D input channels are provided for temperature measurement using either the internal temperature sensor or an external thermistor. 3.1.4.1 Internal Temperature 3.1.3 VOLTAGE MEASUREMENTS Analog mux inputs are provided to support measurement of individual cell and battery pack voltages. A/D control registers VPctrl, VC1ctrl and VC2ctrl are used to specify the measurement to be made. In typical applications, voltage measurement at the cell or pack level is done using the +340 mV reference and a resolution of 10 bits plus sign bit. The value of the LSB in a pack voltage measurement using a 340 mV reference voltage is given by the formula: VPACK LSB = 10.2V/2n Where “n” is the resolution selected. For typical applications where n = 10: VPACK LSB = 10.2V/210 = 10.2V/1024 = 9.96 mV The value of the LSB in a cell voltage measurement using a 340 mV reference voltage is given by the formula: VCELL LSB = 6.23V/2n Where “n” is the resolution selected. For typical applications where n = 10: VCELL LSB = 6.23V/210 = 6.23V/1024 = 6.08 mV The output of the internal temperature sensor is a voltage range with limits that correspond to operating temperature limits as follows: -20°C → 239 mV +70°C → 312 mV The output voltage of the internal sensor as a function of temperature can be given as: VIT (mV) = 239 + 0.82 * (T + 20) Defined within the ITctrl registers are the settings for the reference utilized and the resolution desired for measurement of temperature using the internal temperature sensor. Because of input voltage range described above, the 340 mV reference should be selected. Typically, 10-bit plus sign of resolution are selected which results in the following temperature resolution: LSB (Voltage) = Full Scale Range/# of steps = 340 mV/210 = 332 µV/LSB LSB (°C) = 332 µV/LSB * (1 / 820) °C/µV = 0.404°C/LSB DS21760F-page 6  2004 Microchip Technology Inc. PS700 3.1.4.2 External Temperature TABLE 3-5: Abbr. DCA CCA TA VC2A ACCUMULATOR REGISTERS Accumulator Name Source Ires (Sign bit = 1) Ires (Sign bit = 0) ITres or ETres VC2res For temperature measurement using an external sensor, the NTC pin supplies a constant current source of 12.5 µA. For proper operation, an industry standard 10 kOhm at 25°C negative temperature coefficient (NTC) device of the 103ETBtype, should be connected between NTC and GND. The NTC reference output is only enabled during an external temperature measurement in order to minimize power consumption. The output of the current source, connected to the external thermistor, produces a voltage range with limits that correspond to operating temperature limits, as follows: -20°C → 263 mV +70°C → 317 mV The output voltage of the external sensor as a function of temperature can be given as: VEX (mV) = 263 + 0.6 * (T + 20) Defined within the ETctrl registers are the settings for the reference utilized and the resolution desired for measurement of temperature using the external temperature sensor. Again, the 340 mV reference should be selected. The following temperature results in a 10-bit conversion: LSB (Voltage) = Full Scale Range/# of steps = 340 mV/210 = 332 µV/LSB LSB (°C) = 332 µV/LSB * (1/600)°C/µV = 0.553°C/LSB Discharge Current Accumulator Charge Current Accumulator Temperature Accumulator VC2 Accumulator The resolution of the accumulated value is equal to the resolution selected for the associated conversion, up to a converter resolution of 15-bit plus sign. If a 15-bit plus sign A/D value is being accumulated, then the accumulator resolution in microvolt seconds is: Accumulator LSB (µVs) = (Full Scale Range/# of steps) * 0.5s = (340 mV/215) * 0.5s = 5.19 µVs 3.1.7 CHARGE/DISCHARGE ACCUMULATORS The DCA register is intended to accumulate discharge current and the CCA register is intended to accumulate charge current. Both use the Ires register as its source. For this reason, in most applications, current measurement defined in the A/D Control registers should be programmed to measure current by reading the voltage across the Sense Resistor pin (SR). During charging, a negative voltage will exist across the SR pin to ground. Following a conversion, a positive voltage measurement results in the sign bit = 0 in the Ires register. When the sign bit = 0, the measured result will be added to the CCA register contents and the sum is returned to CCA. In this way, the total charge current will be accumulated in CCA. Similarly, during discharge, a positive voltage will exist between the SR pin and ground. In this case, the conversion will result with sign bit = 1 in the Ires register, indicating a negative value or discharge current condition. Under this condition, the DCA register will be updated with the discharge current measured during that conversion. The value stored in the DCA or CCA register can be interpreted as illustrated in the following example. Using a 16-bit signed conversion for current measurement and a 20 mΩ sense resistor, the LSB can be expressed in units of capacity in micro amp seconds as follows: Accumulator LSB (µAs) = Voltage LSB/RSENSE = (2.59 µVs)/20 mΩ = 130 µAs The “Accum” bit in the Accumctrl register must be enabled for accumulation to occur in both the CCA and DCA registers. 3.1.5 OFFSET COMPENSATION The host software can perform offset compensation by using an offset measurement value read from the PS700. When the offset calibration is enabled within the OFFSctrl register, the converter inputs are internally shorted together and an A/D conversion is performed at the specified resolution. The offset value is stored in the OFFSres register. 3.1.6 ACCUMULATION/TIMING The PS700 incorporates four 32-bit accumulators and four 32-bit elapsed time counters. The Discharge Current Accumulator (DCA) and the Charge Current Accumulator (CCA) are intended to record discharge and charge capacity values. The Discharge Time Counter (DTC) and the Charge Time Counter (CTC) are intended to maintain the total discharge time and charge time. Accumulated charge and discharge values can be used to determine state of charge of the battery as well as cycle count information. With information provided by the elapsed time counters, average charge and discharge currents over an extended period of time can be calculated. Each of the four 32-bit accumulator registers is assigned a fixed “source” A/D Result register. When the accumulator is enabled, it is updated every 500 ms by adding the contents of the assigned result register value to the previous accumulator value. The accumulators are listed in Table 3-5 with their assigned source registers.  2004 Microchip Technology Inc. DS21760F-page 7 PS700 3.1.8 CHARGE/DISCHARGE TIME COUNTERS 3.2.1 RUN MODE The Charge Time Counter (CTC) will increment at the rate of 2 counts every second as long as a negative voltage is measured at the SR pin. The CTC can thereby maintain a time count representing the total time that charge current has flowed into the battery. The Discharge Time Counter (DTC) will increment at the rate of 2 counts every second as long as a positive voltage is measured at the SR pin. The DTC can thereby maintain a time count representing the total time that discharge current has flowed from the battery. During Run mode, the PS700 performs continuous A/D conversion cycles per the programming of the A/D conversion cycle documented in Section 3.1.1 “A/D Conversion Cycle”. As described above, during each cycle, between 1 and 8 conversions are performed and the accumulators/time counters are updated as programmed by the user. Run mode is entered following a Power-on Reset when the pack voltage (VPACK) applied on the VC1 pin rises above the VPOR threshold. Run mode can also be entered from the Sample, Sample-Sleep and Shelf-Sleep modes as described below. The PS700 will remain in Run mode as long as the pack voltage is above the VPOR threshold and the Sample, Sample-Sleep and Shelf-Sleep modes are not active. 3.1.9 GENERAL PURPOSE ACCUMULATORS There are two general purpose accumulators, TA and VC2A. For typical applications, these accumulators have been assigned specific functions. The user can redefine the use of these accumulators to fit the design requirements. TA can be used to accumulate results from the ITres or ETres registers. Accumulation to TA must be enabled in the Accumctrl register bit “AccT”. The selection for accumulation of the values represented by the internal or external thermistor is also determined in the Accumctrl register bit “tsel”. VC2A can be used to accumulate results from VC2res. Accumulation in VC2A must be enabled in the Accumctrl register bit “AccV”. The value stored in VC2res corresponds to the measurement as defined in the A/D Control register VC2ctrl. This function is utilized if the VC2 pin is configured as an independent A/D input and not connected to the cell stack. The “Accum” bit in the Accumctrl register must be enabled for accumulation to occur in TA and VC2A. 3.2.2 SAMPLE MODE In Sample mode, A/D measurements are not continuously performed as in Run mode. Instead, they are performed at a user selectable rate. The purpose of Sample mode is to reduce power consumption during periods of low rate charge or discharge. The power advantage of Sample mode comes from the reduction in frequency of A/D measurements. Sample mode is entered by programming the “Samp” bit = 1 in the A/D Configuration register. The PS700 will remain in Sample mode as long as “Samp” bit = 1 and the VC1 voltage is above the VPOR threshold and the Sample-Sleep and Shelf-Sleep modes are not active. Run mode will be resumed when the Samp bit is cleared to ‘0’. The Sample mode rate is selected using the “SampDiv” bits within the A/D Configuration register. The sample interval is 2**(SampDiv) * 0.5 sec. The possible sample rate intervals are as follows. 3.1.10 GENERAL PURPOSE TIMERS TABLE 3-6: SAMPLE RATE INTERVALS Sample Interval 0.5s 1.0s 2.0s 4.0s 8.0s 16.0s 32.0s 64.0s “SampDiv” Value = 0 Value = 1 Value = 2 Value = 3 Value = 4 Value = 5 Value = 6 Value = 7 There are two general purpose timers that are enabled by accumulation in the TA and VC2A accumulators. TAT is used to maintain a time count during accumulation in the TA register. This timer increments at a frequency of 2 counts every second. VC2T is used to maintain a time count during accumulation in the VC2A register. This timer increments at a frequency of 2 counts every second. 3.2 Power Modes The PS700 has four operational power modes: Run, Sample, Sample-Sleep and Shelf-Sleep. Each consumes power according to the configuration settings as described in the following sections. In Sample mode, much of the analog circuitry remains on. Therefore, the power savings are not as great as in Sample-Sleep mode (described below). Refer to Section 6.0 “Electrical Characteristics” for a specification of the amount of current consumed in Sample mode. DS21760F-page 8  2004 Microchip Technology Inc. PS700 3.2.3 SAMPLE-SLEEP MODE 3.2.4 SHELF-SLEEP MODE In Sample-Sleep mode, the PS700 goes into the Sleep state and wakes up at user-programmed intervals to perform a set of conversions as programmed for the A/D cycle. The purpose of Sample-Sleep is to achieve the minimum power consumption possible while periodically measuring specified parameters. While the PS700 is in the Sleep portion of SampleSleep interval, all of the analog circuitry is shut off. The Sleep interval time is driven by an independent lowpower on-chip RC oscillator that is separate from the primary oscillator. The Sleep oscillator consumes much less power than the primary oscillator, but is less accurate. While in Sample-Sleep mode, the device consumes average current in the range of 20 µA. During the active portion of Sample-Sleep mode, a single set of conversions is performed and a Run mode current in the range of 85 µA will be consumed for the duration of the measurements. Sample-Sleep mode is invoked by one of the following actions: 1. Cell voltage on VC1 or VC2 drops below the trip point programmed in the VCtrip register with the corresponding “VC1ent” or “VC2ent” bit set in the TRIPctrl register. This action can be used to prevent excessive battery discharge in the event of a dangerously low cell voltage. Be aware that Sample-Sleep will not be entered if the “lex” bit is set, enabling wake-up based on charge current and the measured current is above the threshold set in the I+trip register. Setting the SSLP bit in the OpMode register. The host can take this action when the system is entering a low-power standby condition and it is desired to periodically measure and accumulate current, voltage, or temperature. Current less than the I-trip register value when “Ient” bit is set in the TRIPctrl register. Shelf-Sleep mode is the lowest power mode and is intended to preserve battery capacity when the battery pack is shipped or stored or if the battery voltage drops below a specified threshold. While in Shelf-Sleep mode, no measurements occur, no accumulation is performed and no SMBus communications are recognized. In addition, volatile memory is not maintained. Entry to Shelf-Sleep mode is enabled by programming the “SHent” bit = 1 or if VPACK is less than VPtrip. The Shelf-Sleep mode will then be entered when the SMBus pins (both SDA and SCL) drop from a high to a low level for a minimum time period specified by tSHELF. This action will also occur if the battery pack is physically disconnected from the system. Exit from the Shelf-Sleep mode back to Run mode will occur when the SMBus pins (both SDA and SCL) are both pulled from a low to high condition and remain high for a minimum time of tWAKE, signifying system activity or the connection of the pack to the host. 3.3 General Purpose Input/Outputs The NTC and VC2 pins have alternate functions of general purpose I/O; IO0 and IO1, respectively. These pins can be configured as digital general purpose inputs/outputs if their normal application functions of temperature and cell monitoring are not needed. Their configuration is controlled in the GPIOctrl register. The IO0 (NTC) pin may be configured as a push-pull output, an open-drain driver with internal pull-up, or as a tri-stated pin. When configured as a push-pull or open-drain output, the output high voltage is the 3.0V internally regulated supply. When the output function is disabled, an external circuit may drive the pin as an input with a voltage range of 0-3.0V. The input function may be used whether or not the pin is driven by the PS700. In addition, the input function may be disabled, in which case the input buffer is powered down, preventing current drain if the NTC pin rests at an intermediate level. The IO1 (VC2) pin is similar to that of NTC except it is an open-drain output only. IO1 has no explicit output enable control; therefore, if the output is set to a logic ‘1’, the internal pull-down is turned off which tri-states the pin. The input function is the same as IO0. Note: If the IO0 and/or IO1 pins are being used for their analog functions, their respective GPIO output and input functions must be disabled. The GPIO function may be totally disabled by clearing the appropriate GPIOctrl bit. 2. 3. The Sample-Sleep interval is determined by the programming of the “Sampdiv” bits within the A/D Configuration register, together with the “SSLPdiv” bits within the OpMode register. The sample interval is 2**(Sampdiv) * 2**(SSLPdiv) * 0.5 sec. The possible Sample-Sleep interval time, therefore, ranges from a minimum of 0.5 sec to over 136 minutes. Exit from Sample-Sleep mode to Run mode can be accomplished by clearing the “SSLP” bit or by programming a wake-up based on pack voltage or current. Wake-up based on charge current will occur when the “Iex” bit is set in the TRIPctrl register and the charging current value is above the threshold programmed in the I+trip register. Wake-up based on pack voltage will occur when the “VPex” bit is set in the TRIPctrl register and the pack voltage rises above the threshold programmed in the SStrip register.  2004 Microchip Technology Inc. DS21760F-page 9 PS700 3.4 SMBus/I2C Interface 3.4.2 SMBus DATA TRANSFERS The PS700 supports a 2-wire bidirectional bus and data transmission protocol that is fully compatible with the industry standard SMBus V1.1 based on the I2C interface. This interface is used to read and write data from/to the on-chip registers and EEPROM. The device responds to the same SMBus slave address for access to all functions. The following is a brief overview of the SMBus/I2C operational implementation in the PS700. Please refer to the SMBus v1.1 specification for complete operational details of this industry standard interface. This specification can be obtained at the SMBus Implementer’s Forum web site at www.smbus.org. A device that sends data onto the SMBus is defined as a transmitter and a device receiving data as a receiver. The device that controls the message is called a “master”. The devices that are controlled by the master are “slaves”. The SMBus must be controlled by a master device that generates the serial clock (SCL), controls the bus access and generates Start and Stop conditions. The PS700 operates as a slave on the twowire bus. Connections to the bus are made via the open-drain I/O lines SDA and SCL. SMBus operates according to the following bus protocol: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as control signals. The SMBus specification defines the following bus conditions: Bus Not Busy: Both data and clock lines remain high. Start Data Transfer: A change in the state of the data line from high to low, while the clock is high, defines a Start condition. Stop Data Transfer: A change in the state of the data line from low to high, while the clock line is high, defines the Stop condition. Data Valid: The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is not limited and is determined by the master device. The information is transferred byte-wise and each receiver Acknowledges with a ninth bit. Acknowledge: Each receiving device, when addressed, is obliged to generate an Acknowledge bit after the reception of each byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. A device that Acknowledges must pull down the SDA line during the Acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the Acknowledge related clock pulse. Of course, setup and hold times must be taken into account. A master must signal an end of data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave must leave the data line high to enable the master to generate the Stop condition. 3.4.1 SMBus OVERVIEW SMBus is a two-wire multi-master bus, meaning that more than one device capable of controlling the bus can be connected to it. A master device initiates a bus transfer and provides the clock signals. A slave device can receive data provided by the master or can in return provide data to the master. Since more than one device may attempt to take control of the bus as a master, SMBus provides an arbitration mechanism based on I2C and relying on the wired-AND connection of all SMBus devices residing on the bus. If two or more masters try to place information on the bus, the first to produce a “one” when the other(s) produce a “zero” loses arbitration and has to release the bus. The clock signals during arbitration are a wired-AND combination of all the clocks provided by SMBus masters. Bus clock signals from a master can only be altered by clock stretching or by other masters and only during a bus arbitration situation. In addition to bus arbitration, SMBus implements the I2C method of clock low extending in order to accommodate devices of different speeds on the same bus. SMBus version 1.1 can be implemented at any voltage between 3 and 5 Volts ±10%. Devices can be powered by the bus VDD or by their own power source (such as Smart Batteries) and they will interoperate flawlessly as long as they adhere to the SMBus electrical specifications. DS21760F-page 10  2004 Microchip Technology Inc. PS700 FIGURE 3-1: SMBus DATA TRANSFER Figure 3-1 details how data transfer is accomplished on the SMBus. Depending upon the state of the R/W bit, two types of data transfer are possible: 1. Data transfer from a master transmitter to a slave receiver: The first byte transmitted by the master is the slave address. Next follows a number of data bytes. The slave returns an Acknowledge bit after each received byte. Data transfer from a slave transmitter to a master receiver: The first byte (slave address) is transmitted by the master. The slave then returns an Acknowledge bit. Next follows a number of data bytes transmitted by the slave to the master. The master returns an Acknowledge bit after all received bytes other than the last byte. At the end of the last received byte, a ‘Not Acknowledge’ is returned. The PS700 may operate in the following two modes: 1. Slave Receiver mode: Serial data and clock are received through SDA and SCL. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions are recognized as the beginning and end of a serial transfer. Address recognition is performed by hardware after reception of the slave address and direction bit. Slave Transmitter mode: The first byte is received and handled as in the Slave Receiver mode. However, in this mode, the direction bit will indicate that the transfer direction is reversed. Serial data is transmitted on SDA by the PS700 while the serial clock is input on SCL. Start and Stop conditions are recognized as the beginning and end of a serial transfer. 2. 2. The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since a Repeated Start condition is also the beginning of the next serial transfer, the bus will not be released.  2004 Microchip Technology Inc. DS21760F-page 11 PS700 FIGURE 3-2: 7 PS700 SMBus WRITE TRANSACTION 1 0 7 6 4 3 2 1 0 S SMBus Address 0 A BT X Bank AH A 7 0 7 0 Address Low A # of Bytes (only if BT = 1) A 7 0 (Additional data bytes if BT = 1) Last Write Data Byte A P Master controls SDA PS700 controls SDA Legend: S P RS A A BT Bank - Start - Stop - Repeated Start - Acknowledge - Negative Acknowledge (terminates transaction) - Block mode indicator bit - Controls selection of bank: 00: EEPROM 01: RAM/Registers 10: Reserved 11: Reserved - High-order address bits (2) - Low-order address bits (8) AH Address low DS21760F-page 12  2004 Microchip Technology Inc. PS700 FIGURE 3-3: 7 PS700 SMBus READ TRANSACTION 1 0 7 6 4 3 2 1 0 S SMBus Address 0 A BT X Bank AH A 7 0 7 0 Address Low A # of Bytes (only if BT = 1) A 7 1 0 RS SMBus Address 1 A 7 0 (Additional data bytes if BT = 1) Last Read Data Byte A/A P Master controls SDA PS700 controls SDA Legend: S P RS A A BT Bank - Start - Stop - Repeated Start - Acknowledge - Negative Acknowledge (terminates transaction) - Block mode indicator bit - Controls selection of bank: 00: EEPROM 01: RAM/Registers 10: Test Mode Registers 11: Reserved - High-order address bits (2) - Low-order address bits (8) AH Address Low  2004 Microchip Technology Inc. DS21760F-page 13 PS700 4.0 4.1 MEMORY/OPERATIONAL REGISTER DESCRIPTION Memory/Register Map 4.4.1 DCA – DISCHARGE COUNT ACCUMULATOR The PS700 internal structure is accessible on a strict memory mapped basis. The only action directly taken by the PS700 in response to an SMBus command is to read or write registers, RAM or EEPROM. Any actions taken by PS700 happen as a result of values written to internal control registers. Addressing in PS700 consists of 10 bits plus two bank select bits. Therefore, there are a total of 4 Kbyte locations that are addressable within the PS700, organized as 4 banks of 1024 locations each. Bank 0 is dedicated to EEPROM, Bank 1 contains RAM/Registers, Bank 2 contains Test registers and Bank 3 is reserved. Table 4-1 describes the PS700 memory map. The notation is y:0xzzz, where ‘y’ is the bank and ‘zzz’ is the address in hex. The DCA is a 32-bit register that holds the total accumulated capacity discharged from the battery. Each time a conversion is performed with the sign bit of Ires = 1 and current accumulation is enabled, the measured value is added to DCA. As a result, the register is updated whenever a current measurement is performed with a negative voltage across the sense resistor (VSR < GND). The DCA register will rollover if it is allowed be updated beyond 0xFFFFFFFF, so proper register maintenance by the host system is necessary. The DCA register may be cleared using the ACCclr register bit, CLR0, described in Register 4-6. 4.4.2 DTC – DISCHARGE TIME COUNT REGISTER 4.2 EEPROM The 512-byte EEPROM is located in Bank 0 and occupies addresses 0:0x000 to 0:0x1FF. All critical PS700 parameters, calibration factors and learned data are stored in the PS700 integrated EEPROM. See Table 4-2 for the PS700 EEPROM map. The EEPROM can be read using Byte or Block Transfer modes, but can only be written a byte at a time. Writing the EEPROM takes approximately 4 ms/byte. An EEPROM write cycle command from the SMBus is immediately Acknowledged by the PS700 if no other EEPROM write cycles are in progress. If a EEPROM write cycle is attempted while a previous request to write is in progress, a negative Acknowledge will be returned until the previous write cycle is completed. A EEPROM read cycle also results in a negative Acknowledge or an Acknowledge depending on whether or not a EEPROM write cycle is in progress The data EEPROM does not write reliably at temperatures less than 0°C and supply voltages less than 3.3V. A read or write to a register or RAM location will not be affected by an EEPROM write cycle in progress. The DTC records the length of accumulated time that the battery is in a discharge condition as indicated by a negative voltage on the SR pin. This register is incremented using a 2 Hz internal clock rate; therefore, the DTC is incremented at the rate of 2 counts per second or 7200 counts per hour so long as current accumulation is enabled and the Ires register returns a ‘1’ in the sign bit following a current conversion. The DTC register will rollover if it is allowed to count beyond 0xFFFFFFFF; therefore, proper register maintenance by the host system is necessary. The DTC register may be cleared using the ACCclr register bit, CLR1, described in Register 4-6. 4.4.3 CCA – CHARGE COUNT ACCUMULATOR The CCA is a 32-bit register that holds the total accumulated current delivered as charge into the battery. Each time a current conversion is performed with the sign bit of Ires = 0 and current accumulation is enabled, the measured value is added to CCA. As a result, the register is updated whenever a current measurement is performed with a positive voltage across the sense resistor (VSR > GND). The CCA register will rollover if it is allowed to be updated beyond 0xFFFFFFFF; therefore, proper register maintenance by the host system is necessary. The CCA register may be cleared using the ACCclr register bit, CLR2, described below. 4.3 General Purpose RAM 32 bytes of general purpose RAM are provided as temporary storage and are located in Bank 1 at 1:0x000 through 1:0x01F. The RAM may be read or written using either the Byte or Block Transfer modes. 4.4 Operational Registers The following is a detailed description of all operational registers within the PS700 and all control, status, result bits and fields that are contained therein. DS21760F-page 14  2004 Microchip Technology Inc. PS700 TABLE 4-1: Function PS700 MEMORY MAP Byte 3 Byte 2 Byte 1 Byte 0 Bank:Address (Byte 0) 0:0x000 0:0x004 ↓ ↓ ↓ ↓ 0:0x00C 0:0x020 0:0x084 0:0x088 0:0x1F8 0:0x1FC 0:0x201 ↓ Reserved ↓ 0:0x3FC 1:0x000 1:0x004 1:0x008 ↓ ↓ 1:0x018 1:0x01C 1:0x020 1:0x024 1:0x028 1:0x02C 1:0x030 1:0x034 1:0x038 1:0x03C 1:0x040 1:0x044 1:0x048 1:0x04C 1:0x050 1:0x054 1:0x058 1:0x05C 1:0x060 1:0x064 1:0x068 1:0x06C 1:0x070 1:0x074 1:0x078 1:0x07C 2:0x004 2:0x0FC 2:0x080 2:0x084 2:0x088 2:0x3FC 3:0x000 3:0x3FC EEPROM Register Initialization Values (Reserved Locations must = 0x00) ↓ ↓ ↓ ↓ Register Initialization Values (Reserved Locations must = 0x00) ↓ ↓ ↓ ↓ Reserved Reserved ↓ General Purpose RAM ↓ ↓ ADconfig Operational Registers: Accumulators/ Timers, A/D Registers, Mode Control Reserved GPIOctrl Reserved ACCcontrol DCA DTC CCA CTC TA TAT VC2A VC2T Ictrl (ADc0) ITctrl (ADc1) ETctrl (ADc2) VPctrl (ADc3) VC1ctrl (ADc4) VC2ctrl (ADc5) OFFSctrl (ADc6) AUXctrl (ADc7) ACCclr Reserved Reserved Ires (ADr0) ITres (ADr1) ETres (ADr2) VPres (ADr3) VC1res (ADr4) VC2res (ADr5) OFFSres (ADr6) AUXres (ADr7) I+trip I-trip VPtrip VCtrip SStrip Reserved Cal/Setup Registers Reserved ↓ MOsct Reserved ↓ Reserved ↓ TRIPctrl Reserved OpMode Reserved Reserved ↓ ↓ ↓ Reserved VREFT VBGT SMBAdd AOsct Reserved Reserved Reserved ↓ ↓ ↓ Reserved Reserved ↓ ↓ ↓ Reserved  2004 Microchip Technology Inc. DS21760F-page 15 PS700 TABLE 4-2: ADR Unused 0x00 Factory 0x88 0x8A PATTERN TESTER_ID 2 2 1 2 1 2 2 2 1 1 1 2 2 2 2 4 TOTAL Fuel Gauge 0xA5 0xA7 0xA9 VERSION VEOD VEOC 2 2 2 2 2 1 2 2 2 3 7 32 7 8 TOTAL Unused 0xEF (available) (17) (not used) 74 N/A mV mV mA mAh bits N/A mAh cycles XmA XdegC XmV XdegC XmAh 0x0101 Fuel Gauge Version Number EOD Voltage Threshold EOC Voltage Threshold EOC Current Threshold EOD Capacity Fuel Gauge Mode Bits Serial Number – Battery ID Full Charge Capacity Cycle Count VEOD LUT Current Axis VEOD LUT Temperature Axis VEOD Voltage Threshold(s) RCAP LUT – Residual Capacity Temperature Axis Residual Capacity 29 — — — — A/D — — — A/D A/D A/D — — — — — 0 EEPROM Pattern ID Tester Program ID/Version Bit Flags – Calibration Status Calibration Factor – Gain – Current Calibration Factor – Offset – Current Calibration Factor – Gain – Pack Calibration Factor – Gain – VCELL1 Calibration Factor – Gain – VCELL2 Calibration Factor – Offset – Pack Calibration Factor – Offset – VCELL1 Calibration Factor – Offset – VCELL2 Calibration Factor – Gain – Internal Temperature Calibration Factor – Offset – Internal Temperature Calibration Factor – Gain – External Temperature Calibration Factor – Offset – External Temperature Reserved (available) (32) — (not used) P7 EEPROM Name LEN Units DFLT Description 0x8C CAL_STATUS 0x8D CF_CURR 0x8F 0x90 0x92 0x94 0x96 0x97 0x98 0x99 0x9B 0x9F 0xA1 CO_CURR CF_PACK CF_VCELL1 CF_VCELL2 CO_PACK CO_VCELL1 CO_VCELL2 CF_TEMPI CO_TEMPI CO_TEMPE RESERVED 0x9D CF_TEMPE 0xAB IEOC 0xAD EOD_CAP 0xAF 0xB0 0xB2 0xB4 0xB6 0xB9 0xC0 0xE0 0xE7 MODE SERIAL_NO CAP_FULL CYCLES VEOD_C VEOD_T VEOD RCAP_T RCAP DS21760F-page 16  2004 Microchip Technology Inc. PS700 4.4.4 CTC – CHARGE TIME COUNT REGISTER CTC records the length of accumulated time that the battery is in a charge condition as indicated by a positive voltage on the SR pin. This register is incremented using a 2 Hz internal clock rate; therefore, the CTC is incremented at the rate of 2 counts per second or 7200 counts per hour so long as current accumulation is enabled and the Ires register returns a ‘0’ in the sign bit following a current conversion. The CTC register will rollover if it is allowed to count beyond 0xFFFFFFFF; therefore, proper register maintenance by the host system is necessary. The CTC register may be cleared using the ACCclr register bit, CLR3, described below. The TAT register will rollover if it is allowed to count beyond 0xFFFFFFFF; therefore, proper register maintenance by the host system is necessary. The TAT register may be cleared using the ACCclr register bit, CLR5, described below. 4.4.7 VC2A – VC2 ACCUMULATOR VC2A is a 32-bit register that holds the total accumulated value measured on the VC2 pin. At the completion of each measurement, VC2A is incremented by the value of VC2res. This function is enabled when the Accumctrl register, bit AccV is a ‘1’. The VC2A register will rollover if it is allowed to count beyond 0xFFFFFFFF; therefore, proper register maintenance by the host system is necessary. The VC2A register may be cleared using the ACCclr register bit, CLR6, described below. 4.4.5 TA – TEMPERATURE ACCUMULATOR TA is the accumulated 32-bit value of temperature measurements from the internal or external temperature sensor. TA is updated by the Itres or ETres registers. Selection of the internal temperature sensor, or external thermistor connected to the NTC pin, is made in the Accumctrl register, bit tsel. The TA register will rollover if it is allowed be updated beyond 0xFFFFFFFF; therefore, proper register maintenance by the host system is necessary. The TA register may be cleared using the ACCclr register bit, CLR4, described below. 4.4.8 VC2T – VC2 TIME COUNT REGISTER VC2T records accumulated time for which measurements are taken on the VC2 pin. This register is incremented using a 2 Hz internal clock rate; therefore, VC2T is incremented at the rate of 2 counts per second or 7200 counts per hour. The VC2T register will rollover if it is allowed to count beyond 0xFFFFFFFF; therefore, proper register maintenance by the host system is necessary. The VC2T register may be cleared using the ACCclr register bit, CLR7, described below. 4.4.6 TAT – TEMPERATURE TIME COUNT REGISTER The TAT register records the length of accumulated time that the PS700 is sensing temperature and accumulating the value in register TA. TAT is incremented using a 2 Hz internal clock rate and is incremented at the rate of 2 counts per second, or 7200 counts per hour, as long as temperature accumulation is enabled.  2004 Microchip Technology Inc. DS21760F-page 17 PS700 4.4.9 ADCONFIG – A/D CONFIGURATION REGISTER ADCONFIG: A/D CONFIGURATION REGISTER (ADDRESS 43 HEX/67 DECIMAL) ADEN bit 7 bit 7 ADEN: Master A/D Enable bit If no conversions are desired, the A/D converter must be disabled using this bit. 1 = A/D conversions enabled 0 = A/D conversions disabled Samp: Sample Mode Enable bit This bit controls the enabling of Sample mode when the PS700 is not in a Power-on Reset, Sample-Sleep or Shelf-Sleep mode. When set to ‘1’, Sample mode is enabled and conversions will be performed at a periodic rate determined by the programming of the SampDiv bits. When cleared, Sample mode is disabled and the PS700 will operate in Run mode. 1 = Sample mode enabled 0 = Sample mode disabled Reserved: Reserved bit location SampDiv: Sample Period Interval bits The SampDiv bits determine the interval between sample periods when the PS700 is operating in Sample mode. The programmed interval will be 2**(SampDiv) * 0.5 sec. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit Samp Reserved SampDiv bit 0 REGISTER 4-1: bit 6 bit 5-3 bit 2-0 DS21760F-page 18  2004 Microchip Technology Inc. PS700 4.4.10 Accumctrl – ACCUMULATOR CONTROL REGISTER Accumctrl: ACCUMULATOR CONTROL REGISTER (ADDRESS 63 HEX/99 DECIMAL) Accum bit 7 bit 7 Accl AccT AccV tsel Reserved bit 0 REGISTER 4-2: Accum: Accumulator Master Enable bit “Accum” is a master enable for Accl, AccT and AccV. If any combination of “Accl”, “AccT” and “AccV” are enabled, Accum must also be enabled to permit accumulation. If “Accum” is ‘0’, no accumulation will occur regardless of the settings in “Accl”, “AccT” and “AccV”. 1 = Accumulation enabled 0 = Accumulation disabled Accl: Current Accumulation Enable bit When “AccI” is set to a ‘1’, current accumulation is enabled. The DCA and CCA registers will periodically add the value of the Ires register. Also, the DCT and CCT elapsed time counter registers will count during discharge and charge, respectively. When “AccI” is cleared to ‘0’, current accumulation is disabled. 1 = Current accumulation enabled 0 = Current accumulation disabled bit 6 bit 5 AccT: Accumulate Temperature Enable bit When “Acct” is set to a ‘1’, accumulation will be enabled in TA. TA will accumulate results from the AD5 Result register and the TAT elapsed time counter will increment. When “Acct” is cleared to ‘0’, TA accumulation will be disabled. 1 = Accumulate temperature enabled 0 = Accumulate temperature disabled bit 4 AccV: Accumulate Voltage from VC2 Enable bit When “AccV” is ‘0’, accumulation in TA will be updated by the VC1res register. When “AccV” is ‘1’, accumulation in TA will be updated by the VC2res register. bit 3 tsel: Temperature Selection bit When “tsel” is ‘0’, the internal temperature sensor is used for accumulation. When “tsel” is ‘1’, the external temperature sensor is used for accumulation. 1 = External temperature sensor selected 0 = Internal temperature sensor selected bit 2-0 Reserved: Reserved bit location Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit  2004 Microchip Technology Inc. DS21760F-page 19 PS700 4.4.11 A/D CONTROL REGISTERS The eight A/D Control registers are defined as follows. TABLE 4-3: A/D Reg. # ADc0 ADc1 ADc2 ADc3 ADc4 ADc5 ADc6 ADc7 A/D CONTROL REGISTERS Name Ictrl ITctrl ETctrl VPctrl VC1ctrl VC2ctrl OFFSctrl AUXctrl Function Current measurement control Internal temperature measurement control External temperature measurement control Pack voltage measurement control VC1 voltage measurement control VC2 voltage measurement control Offset measurement control Auxiliary measurement control Location (HEX) 42 46 4A 4E 52 56 5A 5E The following register defines the bits contained in the eight A/D Control registers. REGISTER 4-3: A/D CONTROL REGISTERS Enable bit 7 Resolution Reference Select bit 0 bit 7 bit 6-4 bit 3 bit 2-0 Enable: A/D Measurement Enable bit A ‘1’ in this bit enables the measurement defined by bits 0-6. Resolution: A/D Resolution Selection bits These three bits control the resolution of the conversion performed for the corresponding A/D Result register as follows: Resolution = 0: 8-bit + sign conversion Resolution = 1: 9-bit + sign conversion Resolution = 2: 10-bit + sign conversion Resolution = 3: 11-bit + sign conversion Resolution = 4: 12-bit + sign conversion Resolution = 5: 13-bit + sign conversion Resolution = 6: 14-bit + sign conversion Resolution = 7: 15-bit + sign conversion Reference: A/D Reference Selection bit Reference = 0: VR = 170 mV Reference = 1: VR = 340 mV Select: A/D Input Selection bits Selects the analog mux input for the pending conversion as follows: Select = 0: Current (SR pin voltage) Select = 1: Internal temperature sensor Select = 2: External temperature sensor (NTC pin voltage) Select = 3: VPACK (pack voltage) Select = 4: VC1 voltage Select = 5: VC2 voltage Select = 6: Offset voltage Select = 7: Offset voltage Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit DS21760F-page 20  2004 Microchip Technology Inc. PS700 In order for the A/D control registers to function according to their names, their select fields should be programmed as follows. TABLE 4-4: A/D CONTROL REGISTER FUNCTIONS Name Ictrl ITctrl ETctrl VPctrl VC1ctrl VC2ctrl OFFSctrl AUXctrl Select Value 0 1 2 3 4 5 6 X ADc0 ADc1 ADc2 ADc3 ADc4 ADc5 ADc6 ADc7 A/D Reg. # 4.4.12 A/D RESULT REGISTERS The eight 16-bit ADres registers are defined as follows. TABLE 4-5: A/D Reg. # ADr0 ADr1 ADr2 ADr3 ADr4 ADr5 ADr6 ADr7 A/D RESULT REGISTERS Name Ictrl ITctrl ETctrl VPctrl VC1ctrl VC2ctrl OFFSctrl AUXctrl Function Current measurement result Internal temperature measurement result External temperature measurement result Pack voltage measurement result VC1 voltage measurement result VC2 voltage measurement result Offset measurement result Auxiliary measurement result Location (HEX) 40 44 48 4C 50 54 58 5C The following register defines the bits contained in the eight 16-bit ADres registers. REGISTER 4-4: Sign bit 15 bit 15 ADres REGISTERS Magnitude bit 0 Sign: Polarity of the A/D Measurement bit The Sign bit shows the polarity of the given result where: 1 = The value is negative 0 = The value is positive Magnitude: Magnitude of A/D Output bits Magnitude reports the value of the A/D measurement, with all ‘0’s representing a 0 value and all ‘1’s representing full scale. Legend: ‘1’ = Bit is set bit 14-0 ‘0’ = Bit is cleared R = Reserved bit Note: The resolution bits, as defined in the ADctrl register, specify the measurement resolution and therefore, number of bits stored in the ADres registers. The value stored in the ADres registers is left justified. Bits beyond the selected resolution should be ignored.  2004 Microchip Technology Inc. DS21760F-page 21 PS700 4.4.13 GPIOctrl – GPIO CONTROL REGISTER GPIOctrl: GPIO CONTROL REGISTER (ADDRESS 53 HEX/83 DECIMAL) pp0 bit 7 bit 7 OE0 IE1 IE0 OUT1 OUT0 IN1 IN0 bit 0 REGISTER 4-5: bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 pp0: Push-Pull Output IO0 bit Setting this bit to a ‘1’, with bit OE0 set to a ‘1’, will configure the IO0 (NTC) pin as a push-pull digital output. If pp0 is a ‘0’, with OE0 set to ‘1’, the IE0 is an open-drain output with a 300 kOhm pull-up to internal VDD. OE0: Output Enable IO0 bit Setting this bit to a ‘1’ will allow the PS700 to control NTC as either a push-pull (pp0 = 1) or open-drain (pp0 = 0) output. If OE0 is a ‘0’, the NTC pin is tri-state (pp0 = 1) or pulled up to internal VDD with a 300 kOhm resistor (pp0 = 0). IE1: Input Enable IO1 bit Setting this bit to a ‘1’ will enable IO1 (VC2) as a digital input. If IE1 is a ‘0’, the digital input buffer on IO1 is powered down and IN1 will always read logic ‘0’. IE0: Input Enable IO0 bit Setting this bit to a ‘1’ will enable IO0 (NTC) as a digital input. If IE0 is a ‘0’ the digital input buffer on IO0 is powered down and IN0 will always read logic ‘0’. OUT1: Output Data GPIO1 bit Setting this bit to a ‘0’ turns on the open-drain pull-down on IO1 (VC2) (forcing a logic ‘0’ on the output). Setting this bit to a ‘1’ turns off the pull-down resistor. OUT0: Output Data GPIO0 bit If OE0 is a ‘1’, the logic value of OUT0 is driven onto the IO0 (NTC) pin by the PS700. IN1: Input Data GPIO1 bit Current logic state of the IO1 (VC2) pin (read-only). IN0: Input Data GPIO0 bit Current logic state of the IO0 (NTC) (read-only). Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit DS21760F-page 22  2004 Microchip Technology Inc. PS700 4.4.14 ACCclr – ACCUMULATOR CLEAR REGISTER A ‘1’ in any ACCclr bits will clear the associated accumulator. Following the clear operation, all of the bits in ACCclr will be cleared to ‘0’. REGISTER 4-6: ACCclr: ACCUMULATOR CLEAR REGISTER (ADDRESS 62 HEX/98 DECIMAL) CLR7 bit 7 CLR6 CLR5 CLR4 CLR3 CLR2 CLR1 CLR0 bit 0 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 CLR7: Clear Accumulator 7 bit A ‘1’ in this register will clear the VC2T accumulator. CLR6: Clear Accumulator 6 bit A ‘1’ in this register will clear the VC2A accumulator. CLR5: Clear Accumulator 5 bit A ‘1’ in this register will clear the TAT accumulator. CLR4: Clear Accumulator 4 bit A ‘1’ in this register will clear the TA accumulator. CLR3: Clear Accumulator 3 bit A ‘1’ in this register will clear the CTC accumulator. CLR2: Clear Accumulator 2 bit A ‘1’ in this register will clear the CCA accumulator. CLR1: Clear Accumulator 1 bit A ‘1’ in this register will clear the DTC accumulator. CLR0: Clear Accumulator 0 bit A ‘1’ in this register will clear the DCA accumulator. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit  2004 Microchip Technology Inc. DS21760F-page 23 PS700 4.4.15 TPV – TRIP POINT VALUE REGISTERS VPtrip, VCtrip and SHtrip are used as voltage values to be compared to VPres, VC1res or VC2res and VPres, respectively, for transition in and out of various power modes. I+trip and I-trip are used as current values to be compared to Ires for transition in and out of various power modes. The format for data in these registers is left justified. For the purpose of this trip point, only magnitude is compared, the sign is ignored. There are 5 registers that are utilized to set up Trip Point Values. These registers are used when enabled by the TRIPctrl register to enter or exit various power modes. Three of these Trip Point Value registers contain voltage values and two contain current values. The Trip Point Value registers, their corresponding Compare registers and their enable locations are listed below: TPV Register I+trip I-trip VPtrip VCtrip SHtrip Location (HEX) 60 64 68 6C 70 Comparison Register Ires Ires VPres VC1res or VC2res VPres Enable Bit Iex Ient VPex VC1ent or VC2ent SHent REGISTER 4-7: Sign bit 15 TPV: TRIP POINT VALUE REGISTERS Magnitude bit 0 DS21760F-page 24  2004 Microchip Technology Inc. PS700 4.4.16 OpMode – OPERATION MODE CONTROL REGISTER OpMode: OPERATION MODE CONTROL REGISTER (ADDRESS 7A HEX/DECIMAL 122) SSLP bit 7 bit 7 Reserved SSLPdiv Shelf POR sPOR bit 0 REGISTER 4-8: bit 6 bit 5-3 bit 2 bit 1 bit 0 SSLP: Sample-Sleep Enable bit Setting this bit to a ‘1’ immediately enables Sample-Sleep mode. The low-power oscillator is enabled and the A/D sampling rate is reduced. Clearing this bit to ‘0’ disables Sample-Sleep mode. 1 = Sample-Sleep mode enabled 0 = Sample-Sleep mode disabled Reserved: Reserved bit location SSLPdiv: Sample-Sleep Divider bits These bits set the interval between sampling of the A/D during Sample-Sleep. The timing is set as: Sampling Interval = (.5 sec * 2 ** Sampdiv * 2 ** SSLPdiv) SHELF: Shelf-Sleep Enable bit Writing a ‘1’ to this register will place the device in Shelf-Sleep mode. Volatile memory will not be maintained. The Shelf-Sleep mode will not actually be entered until a SMBus Stop condition occurs and then SDA and SCL go low. POR: Power-on Reset bit A ‘1’ in this register indicates that a Power-on Reset has occurred. Write this register to ‘0’ to clear this indicator. sPOR: Soft Power-on Reset bit Writing a ‘1’ to this register will cause the device to re-initialize by writing the contents of the EEPROM into all working registers. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit  2004 Microchip Technology Inc. DS21760F-page 25 PS700 4.4.17 TRIPctrl – TRIP CONTROL REGISTERS TRIPctrl: TRIP CONTROL REGISTERS (ADDRESS 76 HEX/118 DECIMAL) lex bit 7 bit 7 lent VPex VC1ent VC2ent SHent Reserved OV bit 0 REGISTER 4-9: bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Iex: Current Exit from Sample-Sleep Mode bit A ‘1’ in this register will enable an exit from Sample-Sleep mode upon the following condition: |current| > I+trip. Ient: Enter Sample-Sleep Mode on Current bit A ‘1’ in this register will enable entry to Sample-Sleep mode under the following condition: |current| < I-trip. VPex: Pack Voltage Exit from Sample-Sleep Mode bit A ‘1’ in this register will enable an exit from Sample-Sleep mode upon the following condition: Pack Voltage > VPtrip. VC1ent: Enter Sample-Sleep Mode on VC1 Voltage bit A ‘1’ in this register will enable entry to Sample-Sleep mode upon the following condition: VC1 < VCtrip. VC2ent: Enter Sample-Sleep Mode on VC2 Voltage bit A ‘1’ in this register will enable entry to Sample-Sleep mode upon the following condition: VC2 < VCtrip. SHent: Enter Shelf-Sleep Mode on Pack Voltage bit A ‘1’ in this register will enable entry to Shelf-Sleep mode upon the following condition: VPACK < VSHENT Reserved: Reserved bit location OV: Overflow bit PS700 sets this bit when the input voltage is greater than the maximum value of the voltage range for an A/D conversion. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit DS21760F-page 26  2004 Microchip Technology Inc. PS700 4.5 Power-on Reset 4.6 Factory Register Initialization When power is first applied to the VC1 input, the PS700 automatically executes a Power-on Reset sequence. The device is held in a Reset state while the voltage is below the minimum operating threshold, VPOR. When the voltage on the VC1 input rises above the VPOR threshold, the PS700 will initialize itself as described below. When initialization is complete, the PS700 will enter Run mode. During the Power-on Reset sequence, the registers are loaded with initial values from EEPROM locations 0x020-0x087. These locations are reserved to contain register initialization values. In a battery pack application, a Power-on Reset typically happens only at the time of pack manufacture, when the cells are first connected to the battery monitoring pcb containing the PS700. Data in the EEPROM locations, (Bank 0) 0:0x0200:0x07F, will be loaded into the corresponding register locations in (Bank 1) 1:0x020-1:0x07F. Data in the EEPROM locations, (Bank 1) 0:0x080-0:0x084, will be loaded into the corresponding Cal/Setup register locations in (Bank 2) 2:0x080-2:0x084. In all cases, EEPROM register initialization locations corresponding to “Reserved” register locations must contain the value of 0x00h in order to insure proper operation following a Power-on Reset. Note: Do not overwrite the factory trimmed values. The EEPROM register initialization locations are programmed with a set of default values at the time that the PS700 is manufactured. This programming results in the following general operational state of a PS700 following a Power-on Reset: • All accumulators and time counters disabled and reset to ‘0’ • All A/D conversion disabled • A/D registers programmed with their anticipated input source, resolution and input reference • Sample and Shelf-Sleep modes disabled • All Sample-Sleep mode entry methods disabled and trip point values zeroed • GPIO inputs on VC2 and NTC disabled • SMBus address = 0x16 • Factory calibrated trim values for band gap, voltage reference, auxiliary oscillator and main oscillator Table 4-6 lists in detail the values that are programmed into the EEPROM register initialization locations.  2004 Microchip Technology Inc. DS21760F-page 27 PS700 TABLE 4-6: Function PS700 FACTORY REGISTER INITIALIZATION Byte 3 Byte 2 Byte 1 Byte 0 Bank:Address (Byte 0) 1:0x020 1:0x024 1:0x028 1:0x02C 1:0x030 1:0x034 1:0x038 1:0x03C Ires (ADr0): 0x0000 ITres (ADr1): 0x0000 ETres (ADr2): 0x0000 VPres (ADr3): 0x0000 VC1res (ADr4): 0x0000 VC2res (ADr5): 0x0000 OFFSres (ADr6): 0x0000 AUXres (ADr7): 0x0000 I+trip: 0x0000 I-trip: 0x0000 Reserved: 0x00 Reserved: 0x00 TRIPctrl: 00000000b = 0x00 OpMode: 00000000b = 0x00 Reserved: 00000000b = 0x00 MOsct: 0xxxxxxxb (‘xxxxxxx’ = factory trim value) Reserved: 0x00 VREFT: 0xxxxxxxb (‘xxxxxxx’ = factory trim value) AOsct: 000xxxxxb (‘xxxxxxx’ = factory trim value) VBGT: 0000xxxxb (‘xxxx’ = factory trim value) Reserved: 0x00 SMBAdd: 00010110b Reserved: 0x00 VPtrip: 0x0000 VCtrip: 0x0000 SStrip: 0x0000 1:0x040 1:0x044 1:0x048 1:0x04C 1:0x050 1:0x054 1:0x058 1:0x05C 1:0x060 1:0x064 1:0x068 1:0x06C 1:0x070 1:0x074 1:0x078 1:0x07C 2:0x080 DCA: 0x00000000 DTC: 0x00000000 CCA: 0x00000000 CTC: 0x00000000 TA: 0x00000000 TAT: 0x00000000 VC2A: 0x00000000 VC2T: 0x00000000 ADCONFIG: 00000000b = 0x00 Ictrl (ADc0): 01110000b = 0x70 ITctrl (ADc1): 00101001b = 0x29 Reserved 0x00 ETctrl (Adc2): 00101010b = 0x2A VPctrl (ADc3): 00101011b = 0x2B Operational Registers: Accumulators/ Timers A/D Registers Mode Control GPIOctrl VC1ctrl (ADc4): 00100100b = 0x24 VC2ctrl (ADc5): 00100101b = 0x25 Reserved: 0x00 OFFSctrl (ADc6): 01110110b = 0x76 AUXctrl (ADc7): 00000110b = 0x06 Accumctrl: 00000000b = 0x00 ACCclr: 00000000b = 0x00 Cal/Setup Registers Reserved: 0x00 2:0x084 DS21760F-page 28  2004 Microchip Technology Inc. PS700 5.0 CAL/SETUP MODE AND REGISTERS After each address is sent, the PS700 will NACK the address. Once the sequence is complete, the PS700 will enter Cal/Setup mode and allow access to the Cal/Setup registers located in memory Bank 2. To exit Cal/Setup mode, re-enter the same address sequence or power-down the part. The PS700 will always power-up with Cal/Setup mode disabled. The following registers are only available in Cal/Setup mode. Cal/Setup mode allows the designer to reprogram the default SMBus address and/or change the calibration parameters programmed at the factory for band gap, voltage reference and main oscillator trim values. Entering Cal/Setup mode requires the host to request three consecutive and specific incorrect SMBus addresses with no interruptions between requests. These addresses are: Addr1 HEX 50 Addr2 HEX 52 Addr3 HEX 74 5.1 Cal/Setup Mode Registers SMBAdd: SMBus ADDRESS REGISTERS (ADDRESS 80 HEX/128 DECIMAL) SMBAdd bit 7 bit 7-1 bit 0 Reserved bit 0 REGISTER 5-1: SMBAdd: SMBus Address Register bits The value placed in bits of this register defines the SMBus address for this device. Reserved: Reserved bit location Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit REGISTER 5-2: VBGT: BAND GAP TRIM REGISTER (ADDRESS 81 HEX/129 DECIMAL) Reserved bit 7 VBGT bit 0 bit 7-4 bit 3-0 Reserved: Reserved bit location VBGT: Band Gap Voltage Trim bits This value is set by the factory. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit  2004 Microchip Technology Inc. DS21760F-page 29 PS700 REGISTER 5-3: VREFT: VOLTAGE REFERENCE TRIM REGISTER (ADDRESS 82 HEX/130 DECIMAL) GPIOen1 bit 7 bit 7 GPIOen0 VREFT bit 0 bit 6 bit 5-0 GPIOen1: Enable VCELL2 as GPIO bit Writing this bit to a ‘1’ will configure the VCELL2 pin as a GPIO. If enabled as GPIO, the accumulation function in the Accumctrl register and the trip function in the TRIPctrl register should be disabled. GPIOen0: Enable NTC as GPIO bit Writing this register to a ‘1’ will configure the NTC pin as a GPIO. If enabled as GPIO, the accumulation function in the Accumctrl register should be disabled. VREFT: Voltage Reference Trim bits Bits 5-0 of this register store the trim value for both the +340 mV and +170 mV references. This value is factory programmed. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit REGISTER 5-4: MOsct: MAIN OSCILLATOR TRIM REGISTER (ADDRESS 83 HEX/131 DECIMAL) ROSC_sel bit 7 MOsct bit 0 bit 7 bit 6-0 ROSC_sel: Resistor Oscillator Select bit Writing this register to a ‘1’ requires the use of a low temperature coefficient 221 kΩ resistor on the ROSC pin. Writing this register to a ‘0’ will allow the use of an internal 221 kΩ resistor. (The precision of the internal time base will be affected by the selection of the resistor with the lowest variance of resistance over the systems operating range.) MOsct: Main Oscillator Trim bits Bits 0-6 of this register are used to trim the internal time base. This value is factory programmed. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit REGISTER 5-5: AOsct: AUXILIARY OSCILLATOR TRIM REGISTER (ADDRESS 86 HEX/134 DECIMAL) Reserved bit 7 AOsct bit 0 bit 7-5 bit 4-0 Reserved: Reserved bit location AOsct: Auxiliary Oscillator Trim bits Trim bits for the secondary oscillator used in low-power modes. Legend: ‘1’ = Bit is set ‘0’ = Bit is cleared R = Reserved bit DS21760F-page 30  2004 Microchip Technology Inc. PS700 6.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS Description Voltage at any VC(x) pin Voltage directly at any pin (except VCELLX) Temperature under bias Storage temperature (package dependent) Min -0.5 -0.5 -20 -35 Max 10.0 7.0 85 120 Units V V °C °C TABLE 6-1: Symbol VCx VPIN TBIAS TSTORAGE Note: These are stress ratings only. Stress greater than the listed ratings may cause permanent damage to the device. Exposure to absolute maximum ratings for an extended period may affect device reliability. Functional operation is implied only at the listed operating conditions below. TABLE 6-2: Symbol VC1 VDD IDD IDDINS IDDSLP IDDSSLP VIL VIH IIL-IOPU IL-IO VOL-IO VOH-IO VSR INTC VIL-SMB VIH-SMB VOL-SMB VOH-SMB DC CHARACTERISTICS (TA = -20°C TO +85°C; VDD (INTERNAL) = +3.3V ±10%) Description Supply Voltage Internal Regulated Supply Voltage Supply Current – Run mode Supply Current – Sample mode Supply Current – Sample-Sleep mode Supply Current – Shelf-Sleep mode Input Low Voltage – IO0, IO1 Input High Voltage – IO0, IO1 GPIO Input Low Current – Pull-up mode Leakage Current – IO pins programmed as outputs or inputs without pull-up Output Low Voltage for IO1, IO0 Output High Voltage for IO1 configured as push-pull Sense Resistor Input Voltage Range Thermistor Output Current Input Low Voltage for SMBus pins Input High Voltage for SMBus pins Output Low Voltage for SMBus pins Output High Voltage for SMBus pins Min 2.7 — — — — — — 0.8 * VDD — — — 2.0 -150 — -0.5 2.0 — 2.1 100 — Typ. — 3.3 80 45 20 300 — — 7 1 — — — 12.5 — — — — — — Max 9.0 — 190 — — — 0.2 * VDD — — 2 0.4 — 150 — 0.8 5.5 0.4 5.5 350 ±8 Units V V µA µA µA nA V V µA µA V V mV µA V V V V µA µA IPULLUP = 350 µA IOL = 0.5 mA IOH = 100 µA VR = 170 mV A/D active (Note 1) A/D inactive (Note 1, 2) Sample-Sleep mode (Note 1) Shelf-Sleep mode (Note 1) Condition IPULLUP-SMB Current through Pull-up Resistor or Current Source for SMBus pins ILEAK-SMB Note 1: 2: Input Leakage Current – SMBus pins Does not include current consumption due to external loading on pins. Sample mode current is specified during an A/D inactive cycle. Sample mode average current can be calculated using the formula: Average Sample Mode Supply Current = (IDDRUN + (n – 1) * IDDINS)/n; where “n” is the programmed sample rate.  2004 Microchip Technology Inc. DS21760F-page 31 PS700 TABLE 6-3: Symbol fRC fA/D tPOR tSHELF tWAKE AC CHARACTERISTICS (TA = -20°C TO +85°C; VDD (INTERNAL) = +3.3V ± 10%) Description Min 130,613 — — 1 1 Typ. 131,072 fRC/4 2 — — Max 131,530 — 10 — — Units Hz Hz ms ms ms Delay from time when VC1 voltage exceeds 2.7V (SHent = 1 or VPACK < VPtrip) and (SDA and SCL go low) SDA and SCL go high Condition Internal RC Oscillator Frequency Internal A/D Operating Clock Power-on Reset Delay Delay to entry of Shelf-Sleep mode Delay to exit of Shelf-Sleep mode TABLE 6-4: Symbol fSMB tBUF tSHLD tSU:STA tSU:STOP tHLD tSETUP tLOW tHIGH tLOW:SEXT tHIGH:MEXT tF tR Note 1: 2: 3: 4: AC CHARACTERISTICS – SMBus (TA = -20°C TO +85°C; VDD (INTERNAL) = +3.3V ± 10%) Description SMBus Clock Operating Frequency Bus Free Time between Start and Stop Bus Hold Time after Repeated Start Setup Time before Repeated Start Stop Setup Time Data Hold Time Data Setup Time Clock Low Period Clock High Period Message Buffering Time Message Buffering Time Clock/Data Fall Time Clock/Data Rise Time Min 10 4.7 4.0 4.7 4.0 0 250 4.7 4.0 — — — — Typ. — — — — — — — — — — — — — Max 100 — — — — — — — 50 10 10 300 1000 Units kHz µs µs µs µs ns ns µs µs ms ms ns ns (Note 1) (Note 2) (Note 3) (Note 4) (Note 4) Condition Slave mode tHIGH max. provides a simple, ensured method for devices to detect bus Idle conditions. tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from the initial start to the stop. tLOW:MEXT is the cumulative time a master device is allowed to extend its clock cycles within each byte of a message as defined from Start-to-Ack, Ack-to-Ack or Ack-to-Stop. Rise and fall time is defined as follows: tR = (VILMAX – 0.15) to (VIHMIN + 0.15) tF = 0.9VDD to (VILMAX – 0.15) TABLE 6-5: Symbol ADRES tCONV VADIN EVGAIN ETEMP EINL Note 1: A/D CONVERTER CHARACTERISTICS (TA = -20°C TO +85°C; VREG (INTERNAL) = +3.3V ±10%) Description Min 9 — -152 0 — — — — Typ. — 2(n + 1)/fA/D — — — — — — Max 16 — 152 309 0.100 0.100 0.100 0.004 Units bits s mV mV % % % % VR = 170 mV VR = 340 mV Condition (Note 1) A/D Converter Resolution A/D Conversion Measurement Time, n-bit A/D Converter Input Voltage Range (internal) Supply Voltage Gain Error Temperature Gain Error Integrated Nonlinearity Error EVOFFSET Compensated Offset Error Voltage is internal at A/D converter inputs. VSR and VNTC are measured directly. VC(x) inputs are measured using internal level translation circuitry that scales the input voltage range appropriately for the converter. DS21760F-page 32  2004 Microchip Technology Inc. PS700 FIGURE 6-1: SMBus AC TIMING DIAGRAMS tR tLOW tF tHIGH tSU:STA SCL tHD:STA tHD:STA tSU:DAT tSU:STA tSU:STO SDA tBUF P S S P tLOW:SEXT SCLACK tLOW:MEXT tLOW:MEXT SCLACK tLOW:MEXT SCL SDA Note: SCLACK is the Acknowledge related clock pulse generated by the master. TABLE 6-6: Symbol ETIME SILICON TIME BASE CHARACTERISTICS (TA = -20°C TO +85°C; VREG (INTERNAL) = +3.3V ±10%) Description Min Typ. Max 0.35 Units % Condition Bias resistor ROSC tolerance = 1%, TL = ±25 ppm Silicon Time Base Error TABLE 6-7: Symbol TRES TACC TDRIFT TEMPERATURE MEASUREMENT ACCURACY (TA = -20°C TO +85°C; VREG (INTERNAL) = +3.3V ±10%) Description Reported Temperature Resolution Reported Temperature Accuracy Reported Temperature Drift Min — -3 — Typ. 1 — -2 Max — 3 — Units °K °K °K/V Condition  2004 Microchip Technology Inc. DS21760F-page 33 PS700 7.0 PACKAGING INFORMATION 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β L A1 A2 Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Units Dimension Limits n p A A2 A1 E E1 D L φ c B α β MIN INCHES NOM 8 .026 MAX MIN .033 .002 .246 .169 .114 .020 0 .004 .007 0 0 .035 .004 .251 .173 .118 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 DS21760F-page 34  2004 Microchip Technology Inc. PS700 APPENDIX A: PS700 DATA SHEET REVISION HISTORY Revision A-B (July 2003) Removed Preliminary condition tag. Updated Figure 3-3 (page 13). Changed format of all operational registers in Section 4.4 “Operational Registers”. Revision B-C (April 2004) Removed PEC – pages 1, 10, 12 (Figure 3-2) and 13 (Figure 3-3). Removed NiMH 3-6 cell – pages 1, 2 and 4. Updated Figure 1-2 – page 3. Removed independent A/D input on pin 1 – page 3. Changed resolution nomenclature to bit + sign – pages 5 and 20 (Register 4-3). Added Table 3-3 – page 6. Added Section 3.1.4.1 “Internal Temperature” and Section 3.1.4.2 “External Temperature”. In Section 3.2.2 “Sample Mode”, added Sample-Sleep entry exception – page 9. Updated memory map, Table 4-1 – page 15. Added Table 4-2: PS700 EEPROM Map – page 16. Changed SMBus address factory default from 0x06 to 0x16 – pages 27 and 28. Revision C-D (May 2004) Operating temperature typo correction, 70°C to 85°C – pages 32 and 33. Revision D-E (July 2004) Corrected errors in S ection 3.1.4.2 “External Temperature” . Changed internal to external and corrected VEX equation. Added Appendix A “Revision History”. Changed value of Bits column in Table 3-3 from “10” to “9 + sign”. Changed reference to “10 bits of resolution” in Section 3.1.4.1 “Internal Temperature” to “10-bit plus sign of resolution”. Changed references to “16 bits of resolution” in Section 3.1.6 “Accumulation/ Timing” to “15-bit plus sign”. Added information to Section 4.2 “EEPROM” about temperature and voltage limits for data EEPROM writes. Revision F (August 2004) Corrected errors in Features section, Shelf-Sleep mode. Corrected errors in Section 2.6 “A/D Converter” and Section 3.1.1 “A/D Conversion Cycle”. Updated accumulator equation in Section 3.1.6 “Accumulation/ Timing”. Changed VSR values in Table 6-2.  2004 Microchip Technology Inc. DS21760F-page 35 PS700 NOTES: DS21760F-page 36  2004 Microchip Technology Inc. PS700 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, PIC, PICmicro, PowerSmart and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SmartSensor is a registered trademark of Microchip Technology Incorporated in the U.S.A. PowerCal, PowerInfo, PowerMate, PowerTool and SmartTel are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated. Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.  2004 Microchip Technology Inc. DS21760F-page 37 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westford, MA Tel: 978-692-3848 Fax: 978-692-3821 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 San Jose Mountain View, CA Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China - Fuzhou Tel: 86-591-750-3506 Fax: 86-591-750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Shanghai Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 China - Shenzhen Tel: 86-755-8290-1380 Fax: 86-755-8295-1393 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205 ASIA/PACIFIC India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8632 Fax: 91-11-5160-8632 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4816 Fax: 886-7-536-4817 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 EUROPE Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4420-9895 Fax: 45-4420-9910 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820 08/24/04 DS21760F-page 38  2004 Microchip Technology Inc.