TC1237

TC1235 TC1236 TC1237 Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown FEATURES s s s s s s s 10-Pin MSOP Package Operates from 1.8V to 5.5V Up to 5mA Output Current at –VIN Pin Up to 1mA Output Current at –2VIN Pin Power-Saving Shutdown Mode –VIN and –2VIN Outputs Available Low Active Supply Current .......................................... 120µA (MAX) for TC1235 .......................................... 360µA (MAX) for TC1236 .......................................... 1.5mA (MAX) for TC1237 Fully Compatible with 1.8V Logic Systems GENERAL DESCRIPTION The TC1235/1236/1237 are CMOS dual inverting charge pump voltage converters with a low power shutdown mode in MSOP 10-Pin packages. Only four external capacitors are required for full circuit implementation. Switching frequencies are 12kHz for the TC1235, 35kHz for the TC1236 and 125kHz for the TC1237. When the shutdown pin is held at a logic low, the device goes into a very low power mode of operation, consuming less than 1µA of supply current. These devices provide both a negative voltage inversion (available at the –VIN output), and a negative doubling voltage inversion (available at the –2 VIN output) with a low output impedance capable of providing output currents up to 5mA for the –VIN output and 1mA for the –2VIN output. The input voltage can range from +1.8V to +5.5V. s TYPICAL APPLICATIONS s s s s s LCD Panel Bias Cellular Phones PA Bias Pagers PDAs, Portable Dataloggers Battery Powered Devices ORDERING INFORMATION Part No. TC1235EUN TC1236EUN TC1237EUN Package Osc Freq (KHz) Temp Range 10-Pin MSOP 10-Pin MSOP 10-Pin MSOP 12 35 125 –40°C to +85°C –40°C to +85°C –40°C to +85°C PIN CONFIGURATION TYPICAL OPERATING CIRCUIT INPUT VIN OUTPUT 1 –VIN 10-Pin MSOP + C1 C1+ C1– C2+ C1– C2+ NC C2– –2 VIN Notes: 1 2 3 4 10 9 –VIN C1+ SHDN VIN GND + C2 + TC1235 TC1236 TC1237 SHDN –2 VIN COUT1 ON OFF C2– TC1235 TC1236 TC1237 8 7 GND NC OUTPUT 2 + COUT2 5 6 1) C1 and COUT1 must have a voltage rating greater than or equal to VIN 2) C2 and COUT2 must have a voltage rating greater than or equal to 2VIN DS21371A © 2001 Microchip Technology Inc. TC1235/6/7-1 3/24/00 TC1235 TC1236 TC1237 ABSOLUTE MAXIMUM RATINGS* Input Voltage (VIN to GND) ......................... +6.0V, – 0.3V Output Voltage (–VIN, –2VIN to GND) ........ –12.0V, + 0.3V Current at –VIN, –2VIN Pins ...................................... 10mA Short-Circuit Duration –VIN, –2VIN to GND ........ Indefinite Operating Temperature Range ............... – 40°C to +85°C Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown Power Dissipation (TA ≤ 70°C) MSOP-10 ............. 320mW Storage Temperature (Unbiased) ......... – 65°C to +150°C Lead Temperature (Soldering, 10sec) .................. +260°C *This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS: TA = –40°C to +85°C, VIN = +5V, C1 = 3.3µF, C2 = 1µF (TC1235); C1 = 1µF, C2 = 0.33µF (TC1236); C1 = 0.33µF, C2 = 0.1µF (TC1237), SHDN = VIN, unless otherwise noted. Typical values are at TA = +25°C. Symbol Parameter IDD Supply Current Device Test Conditions SHDN = VIN SHDN = VIN SHDN = VIN SHDN = GND, VIN = +5V RLOAD = 1kΩ for –VIN output RLOAD = 10kΩ for –2VIN output RLOAD = 1kΩ for –VIN output RLOAD = 10kΩ for –2VIN output Min — — — — 1.8 — 8.4 24.5 65 1.4 — 96 94 — — — — — — — — Typ 75 200 625 0.1 — — 12 35 125 — — 99.5 99 45 135 650 250 100 750 280 120 Max 120 360 1500 1 — 5.5 15.6 45.5 170 — 0.4 — — 80 420 — — — — — Unit µA ISHDN VMIN VMAX FOSC TC1235 TC1236 TC1237 Shutdown Supply Current All Minimum Supply Voltage All Maximum Supply Voltage All Oscillator Frequency TC1235 TC1236 TC1237 All All All All All All TC1235 TC1236 TC1237 TC1235 TC1236 TC1237 µA V V kHz VIH VIL VEFF1 VEFF2 ROUT1 ROUT2 TWK1 TWK2 Shutdown Input Logic High Shutdown Input Logic low Voltage Conversion Efficiency (Stage 1) Voltage Conversion Efficiency (Stage 2) Output Resistance for –VIN output (Note 1) Output Resistance for –2VIN output (Note 1) Wake-Up Time From Shutdown Mode Stage 1 Wake-Up Time From Shutdown Mode Stage 2 VIN = VMIN to VMAX VIN = VMIN to VMAX RLOAD = ∞ for –VIN output RLOAD = ∞ for –2VIN output RLOAD = ∞ for –VIN output RLOAD = ∞ for –2VIN output ILOAD = 0.5mA to 5mA No Load at -VIN Output ILOAD = 0.1mA to 1mA No Load at -2VIN Output RLOAD = 1kΩ for -VIN Output RLOAD = 10kΩ for -2VIN Output RLOAD = 1kΩ for -VIN Output RLOAD = 10kΩ for -2VIN Output V V % % Ω Ω µsec µsec NOTES: 1. Capacitor contribution is approximately 20% of the output impedance [ESR = 1 / pump frequency x capacitance)]. PIN DESCRIPTION Pin Number 1 2 3 4 5 6 7 8 9 10 TC1235/6/7-1 3/24/00 Name C1– C2+ NC C2– –2VIN GND VIN SHDN C1+ –VIN Description C1 Commutation Capacitor Negative Terminal. C2 Commutation Capacitor Positive Terminal. No Connection. C2 Commutation Capacitor Negative Terminal. Doubling Inverting Charge Pump Output (–2 x VIN). Ground. Positive Power Supply Input. Shutdown Input (Active Low). C1 Commutation Capacitor Positive Terminal. Inverting Charge Pump Output (–1 x VIN). 2 © 2001 Microchip Technology Inc. DS21371A Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown TC1235 TC1236 TC1237 APPLICATIONS INFORMATION Output Voltage Considerations The TC1235/1236/1237 performs voltage conversions but does not provide any type of regulation. The two output voltage stages will droop in a linear manner with respect to their respective load currents. The value of the equivalent output resistance of the ‘-VIN’ output is approximately 50Ω nominal at +25°C and VIN = +5V. The value of the ‘-2VIN’ output and is approximately 140Ω nominal at +25°C and VIN = +5V. In this particular case, ‘-VIN’ is approximately – 5V and ‘–2VIN’ is approximately –10V at very light loads, and each stage will droop according to the equation below: VDROOP = IOUT x ROUT [-VIN OUTPUT] = VOUT1 = – (VIN – VDROOP1) [-2VIN OUTPUT] = VOUT2 = VOUT1 – (VIN – VDROOP2) where VDROOP1 is the output voltage droop contributed from stage 1 loading , and VDROOP2 is the output voltage droop from stage 2 loading. Charge Pump Efficiency The overall power efficiency of the two charge pump stages is affected by four factors: (1) Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). (2) I2R losses due to the on-resistance of the MOSFET switches on-board each charge pump. (3) Charge pump capacitor losses due to effective series resistance (ESR). DETAILED DESCRIPTION The TC1235/1236/1237 dual charge pump converters perform both a –1x and –2x multiply of the voltage applied to the VIN pin. Output ‘– VIN’ provides a negative voltage inversion of the VIN supply, while output ‘-2 VIN’ provides a negative doubling inversion of VIN. Conversion is performed using two synchronous switching matrices and four external capacitors. When the shutdown input is held at a logic low both stages go into a very low power mode of operation consuming less than 1uA of supply current. Figure 1 (below) is a block diagram representation of the TC1235/1236/1237 architecture. The first switching stage inverts the voltage present at VIN and the second stage uses the ‘–VIN’ output generated from the first stage to produce the ‘–2VIN’ output function from the second stage switching matrix. Each device contains an on-board oscillator that synchronously controls the operation of the charge pump switching matrices. The TC1235 synchronously switches at 12KHz, the TC1236 synchronously switches at 35KHz, and the TC1237 synchronously switches at 125KHz. The different oscillator frequencies for this device family allow the user to trade-off capacitor size versus supply current. Faster oscillators can use smaller external capacitors but will consume more supply current (see Electrical Characteristics Table). When the shutdown input is in a low state, the oscillator and both switch matrices are powered off placing the TC1235/ 1236/1237 in the shutdown mode. When the VIN supply input is powered from an external battery, the shutdown mode minimizes power consumption, which in turn will extend the life of the battery. VIN + C1 —VIN SWITCH MATRIX (1st STAGE) + ENABLE COUT1 (4) Losses that occur during charge transfer (from the commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exists. Most of the conversion losses are due to factor (2), (3) and (4) above. The losses for the first stage are given by Equation 1a and the losses for the second stage are given by Equation 1b. OSCILLATOR ENABLE + C2 —2VIN SWITCH MATRIX (2nd STAGE) + ENABLE COUT2 SHDN P1LOSS (2, 3, 4) = IOUT1 2 x ROUT1 where ROUT1 = [ 1 / [ fOSC(C1) ] + 8RSWITCH1 + 4ESRC1 + ESRCOUT1 ] Figure 1. Functional Block Diagram © 2001 Microchip Technology Inc. DS21371A 3 TC1235/6/7-1 3/24/00 TC1235 TC1236 TC1237 P2LOSS (2, 3, 4) = IOUT2 2 x ROUT2 where ROUT2 = [ 1 / [fOSC(C2) ] + 8RSWITCH2 + 4ESRC2 + ESRCOUT2 ] Equation 1b. The internal switch resistance for the first stage (i.e. RSWITCH1) is approximately 3Ω and the switch resistance for the second stage (i.e. RSWITCH2) is approximately 7Ω. The losses in the circuit due to factor (4) above are also shown in Equation 2a for stage 1 and Equation 2b for stage 2. The output voltage ripple for stage 1 is given by Equation 3a and the output voltage ripple for stage 2 is given by Equation 3b. PLOSS1 (4) = [ (0.5)(C1)(VIN – VOUT1 ) + (0.5) (COUT1) (VRIPPLE12 - 2VOUT1 VRIPPLE1) ] x fOSC Equation 2a. PLOSS2 (4) = [ (0.5) (C2) (VIN 2 – VOUT22 ) + (0.5) (COUT2) (VRIPPLE22 - 2VOUT2 VRIPPLE2) ] x fOSC Equation 2b. VRIPPLE1 = [ IOUT1 / (fOSC) (COUT1) ] + 2 (IOUT1) (ESRCOUT1) Equation 3a. VRIPPLE2 = [ IOUT2 / (fOSC) (COUT2) ] + 2 (IOUT2) (ESRCOUT2) Equation 3b. Capacitor Selection In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 and C2 will lower the output resistance and larger values of COUT1 and COUT2 will reduce output ripple. (See Equations 1a, 1b, 3a, and 3b). NOTE: For proper charge pump operation, C1 and COUT1 must have a voltage rating greater than or equal to VIN, while C2 and COUT2 must have a voltage rating greater than or equal to 2VIN. 2 2 Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown Table 1a shows various values of C1 and the corresponding output resistance values for VIN=5V @ +25°C for stage 1 and Table 1b shows various values of C2 and the corresponding output resistance values for VIN=5V @ +25°C for stage 2. It assumes a 0.1Ω ESRC1, a 0.1Ω ESRC2, a 3Ω RSWITCH1, and a 7Ω RSWITCH2. Table 2a shows the output voltage ripple for various values of COUT1 and Table 2b shows the output voltage ripple for various values of COUT2 (again assuming VIN = 5V @ +25oC). The VRIPPLE1 values assume a 3mA output load current for stage 1 and a 0.1Ω ESRCOUT1. The VRIPPLE2 values assume a 200µA output load current for stage 2 and a 0.1Ω ESRCOUT1. Table 1a. Output Resistance vs. C1 (ESR = 0.1Ω). For Stage 1 C1 (µF) 0.47 1 3.3 TC1235 ROUT (Ω) TC1236 ROUT (Ω) 202 108 50 85 53 33 TC1237 ROUT (Ω) 42 33 27 Table 1b. Output Resistance vs. C2 (ESR = 0.1Ω). For Stage 2 C2 (µF) 0.1 0.47 1 TC1235 ROUT (Ω) TC1236 ROUT (Ω) 890 239 140 342 117 85 TC1237 ROUT (Ω) 137 74 65 Table 2a. Output Voltage Ripple vs. COUT1 (ESR = 0.1Ω) For Stage 1 (IOUT1 = 3mA) COUT1 (µF) 0.47 1 3.3 TC1235 VRIPPLE1 (mV) 533 251 76 TC1236 VRIPPLE1 (mV) 183 86 27 TC1237 VRIPPLE1 (mV) 52 25 8 Table 2b. Output Voltage Ripple vs. COUT2 (ESR = 0.1Ω) For Stage 2 (IOUT2 = 200µA) COUT2 (µF) 0.1 0.47 1 TC1235 VRIPPLE2 (mV) 167 36 17 TC1236 VRIPPLE2 (mV) 57 12 5.8 TC1237 VRIPPLE2 (mV) 16 3.4 1.6 TC1235/6/7-1 3/24/00 4 © 2001 Microchip Technology Inc. DS21371A Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown TC1235 TC1236 TC1237 Layout Considerations As with any switching power supply circuit good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. TC1235 DEMO Card The TC1235 DEMO Card is a 2.0” x 2.0” card containing both a TC1235 and two cascaded TC1219s that allow the user to compare the operation of each approach for generating a –1X and –2X function. Each circuit is fully assembled with the required external capacitors along with variable load resistors that allow the user to vary the output load current of each stage. For convenience, several test points and jumpers are available for measuring various voltages and currents on the demo board. Figure 3 is a schematic of the TC1235 DEMO Card, and Figure 4 shows the assembly drawing and artwork for the board. Table 3 lists the voltages that are monitored by the test points and Table 4 lists the currents that can be measured using the jumpers. Table 3. TC1235 DEMO Card Test Points Input Supply Bypassing TheVIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. It is recommended that a large value capacitor (at least equal to C1) be connected from VIN to GND for optimal circuit performance. Shutdown Input The TC12351/1236/1237 is enabled when /SHDN is high, and disabled when /SHDN is low. This input cannot be allowed to float. (If /SHDN is not required, see the TC1225/ 1226/1227 data sheet.) The /SHDN input should be limited to 0.3V above VIN to avoid significant current flows. Dual Voltage Inverter The most common application for the TC1235/1236/ 1237 devices is the dual voltage inverter (Figure 2). This application uses four external capacitors: C1, C2, COUT1, and COUT2 (NOTE: a power supply bypass capacitor is recommended). The outputs are equal to – VIN and –2VIN plus any voltage drops due to loading. Refer to Tables 1a, 1b, 2a, and 2b for capacitor selection guidelines. TEST POINT Device TC1235 TC1236 TC1237 CIN C1 C2 3.3µF 3.3µF 1µF 1µF 1µF 0.33µF 0.33µF 0.33µF 0.1µF COUT1 3.3µF 1µF 0.33µF COUT2 1µF 0.33µF 0.1µF TP1 TP2 TP3 TP4 TP5 TP6 TP7 TP8 TP9 TP10 VOLTAGE MEASUREMENT VIN [+5V] GROUND GROUND TC1219 U1 OUTPUT [-5V(1)] TC1219 U2 OUTPUT [-10V(1)] TC1235 STAGE 1 OUTPUT [-5V(2)] TC1235 STAGE 2 OUTPUT [-10V(2)] EXTERNAL /SHDN INPUT TC1219 U1 /SHDN INPUT TC1235 U3 /SHDN INPUT VIN CIN 9 C1 1 2 C2 4 C2– C1– C2+ TC1235 TC1236 TC1237 –2VIN GND 6 C1+ 7 VIN 8 SHDN –VIN 10 COUT1 RL1 VOUT1 Table 4. TC1235 DEMO Card Jumpers JUMPER J1 J2 J3 J4 J5 J6 J7 J8 J9 5 CURRENT MEASUREMNT DUAL TC1219 QUIESCENT CURRENT TC1235 QUIESCENT CURRENT TC1219 U1 [-5V(1)] LOAD CURRENT TC1219 U2 [-10V(1)] LOAD CURRENT TC1235 STAGE 1 [-5V(2)] LOAD CURRENT TC1235 STAGE 2 [-10V(2)] LOAD CURRENT TC1219 U1 /SHDN INPUT CURRENT TC1235 U3 /SHDN INPUT CURRENT GROUND EXTERNAL /SHDN INPUT TC1235/6/7-1 3/24/00 5 COUT2 VOUT2 RL2 Figure 2. Dual Voltage Inverter Test Circuit © 2001 Microchip Technology Inc. DS21371A TC1235 TC1236 TC1237 Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown Figure 3. TC1235 DEMO Card Schematic Figure 4. TC1235 DEMO Card Assembly Drawing and Artwork TC1235/6/7-1 3/24/00 6 © 2001 Microchip Technology Inc. DS21371A Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown TC1235 TC1236 TC1237 TYPICAL RIPPLE WAVEFORMS © 2001 Microchip Technology Inc. DS21371A 7 TC1235/6/7-1 3/24/00 TC1235 TC1236 TC1237 TYPICAL RIPPLE WAVEFORMS TC1235 TURN OFF TIME Shutdown Input 1V/DIV 2V/DIV VOUT 1 Out 1 Turn Off Time 10% to 90% 7.53ms VOUT 1 Shutdown Input Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown TC1235 WAKE-UP TIME FROM SHUTDOWN 1V/DIV Output 1 Wake-Up Time 90% to 10% 669µs 2V/DIV Output 2 Wake-Up Time 90% to 10% 754µs 5V/DIV VOUT 2 5V/DIV VOUT 2 Output 2 Off Time 10% to 90% 32.86ms HORIZ = 10ms/DIV Conditions: C1, COUT 1 = 3.3µf ,C2, COUT 2 = 1µf ,VIN = 5V HORIZ = 500µs/DIV Conditions: C1, COUT 1 = 3.3µf ,C2, COUT 2 = 1µf ,VIN = 5V TAPING FORM Component Taping Orientation for 10-Pin MSOP Devices User Direction of Feed PIN 1 User Direction of Feed W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 10-Pin MSOP 12 mm 8 mm 2500 13 in TC1235/6/7-1 3/24/00 8 © 2001 Microchip Technology Inc. DS21371A Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown TC1235 TC1236 TC1237 PACKAGE DIMENSIONS 10-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .201 (5.10) .183 (4.65) .012 (0.30) .006 (0.15) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .020 (0.50) .006 (0.15) .002 (0.05) 6° MAX. .028 (0.70) .016 (0.40) .009 (0.23) .005 (0.13) Dimensions: inches (mm) © 2001 Microchip Technology Inc. DS21371A 9 TC1235/6/7-1 3/24/00 TC1235 TC1236 TC1237 Inverting Dual (–VIN, –2VIN) Charge Pump Voltage Converters with Shutdown WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 ASIA/PACIFIC (continued) Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-334-8870 Fax: 65-334-8850 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 ASIA/PACIFIC China - Beijing Microchip Technology Beijing Office Unit 915 New China Hong Kong Manhattan Bldg. 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Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 Printed on recycled paper. 01/09/01 Mountain View Analog Product Sales 1300 Terra Bella Avenue Mountain View, CA 94043-1836 Tel: 650-968-9241 Fax: 650-967-1590 All rights reserved. © 2001 Microchip Technology Incorporated. Printed in the USA. 1/01 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchipís products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. TC1235/6/7-1 3/24/00 10 © 2001 Microchip Technology Inc. DS21371A