TC1264-3.0VDBTR

TC1264 800 mA Fixed-Output CMOS LDO with Shutdown Features • • • • • Very Low Dropout Voltage 800 mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Overcurrent and Overtemperature Protection Description The TC1264 is a fixed output, high accuracy (typically ±0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1264’s CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80 µA at full load (20 to 60 times lower than in bipolar regulators). TC1264 key features include ultra low noise operation, very low dropout voltage (typically 450 mV at full load), and fast response to step changes in load. The TC1264 incorporates both over temperature and over current protection. The TC1264 is stable with an output capacitor of only 1μF and has a maximum output current of 800 mA. It is available in 3-Pin SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages. Applications • • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Typical Application VIN VIN VOUT Package Type 3-Pin TO-220 + C1 1 µF VOUT 3-Pin DDPAK FRONT VIEW TAB IS GND TC1264 GND TC1264 TC1264 12 3 12 3 GND VOUT FRONT VIEW TAB IS GND 3 VOUT 2 GND TC1264 1 VIN © 2006 Microchip Technology Inc. DS21375C-page 1 VOUT GND VIN VIN 3-Pin SOT-223 TC1264 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 8) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Input Operating Voltage Maximum Output Current Output Voltage Sym VIN IOUTMAX VOUT Min 2.7 800 VR – 2.5% V R – 2% V R – 7% VOUT Temperature Coefficient Line Regulation Load Regulation (Note 5) Dropout Voltage (Note 6) ΔVOUT/ΔT ΔVOUT/ΔVIN ΔVOUT/VOUT VIN–VOUT — — -0.01 — — — — — — — Supply Current Power Supply Rejection Ratio Output Short Circuit Current Note 1: IDD PSRR IOUTSC — — — Typ — — VR ± 0.5% — 40 0.007 0.002 20 50 150 260 450 1000 1200 80 64 1200 Max 6.0 — V R + 3% V R + 3% — 0.35 0 30 160 480 800 1300 1200 1400 130 — — µA db mA F ≤ 1 kHz VOUT = 0V ppm/°C % %/mA mV Units V mA V VR ≥ 2.5V VR = 1.8V IL = 0.1 mA to 800 mA (Note 3) Note 4 (VR + 1V) ≤ VIN ≤ 6V IL = 0.1 mA to IOUTMAX VR ≥ 2.5V, IL = 100 µA VR ≥ 2.5V, IL = 100 mA VR ≥ 2.5V, IL = 300 mA VR ≥ 2.5V, IL = 500 mA VR ≥ 2.5V, IL = 800 mA VR = 1.8V, IL = 500 mA IL = 800 mA SHDN = VIH, IL = 0 Note 2 Conditions VR ± 0.5% VR + 2.5% VR is the regulator output voltage setting. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX. This accuracy represents the worst-case over the entire output current and temperature range. 2: 3: 4: ( V OUTMAX – V OUTMIN ) – 10 TCV OUT = -----------------------------------------------------------------------V OUT × ΔT Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.. 6 5: 6: 7: 8: DS21375C-page 2 © 2006 Microchip Technology Inc. TC1264 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Thermal Regulation Output Noise Note 1: Sym ΔVOUT/ΔPD eN Min — — Typ 0.04 260 Max — — Units V/W nV/√Hz Note 7 IL = IOUTMAX, F = 10 kHZ Conditions VR is the regulator output voltage setting. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX. This accuracy represents the worst-case over the entire output current and temperature range. 2: 3: 4: TCV OUT 5: ( V OUTMAX – V OUTMIN ) – 10 = -----------------------------------------------------------------------V OUT × ΔT 6 6: 7: 8: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 3L-SOT-223 Thermal Resistance, 3L-DDPAK Thermal Resistance, 3L-TO-220 Note 1: θJA θJA θJA — — — 59 71 71 — — — °C/W °C/W °C/W TA TJ TA -40 -40 -65 — — — +125 +125 +150 °C °C °C (Note 1) Sym Min Typ Max Units Conditions Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C). © 2006 Microchip Technology Inc. DS21375C-page 3 TC1264 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 0.018 0.016 0.014 150 135 120 105 LINE REGULATION (%) IDD (mA) 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40°C 0°C 25°C 70°C 85°C 125°C 90 75 60 45 30 15 0 -40°C 0°C 25°C VOUT = 3V 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-1: Temperature. 10.0 Line Regulation vs. FIGURE 2-4: IDD vs. Temperature. RLOAD = 50 COUT = 1 μF DROPOUT VOLTAGE (V) NOISE (μV/ Hz) 1.0 0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000 85°C 70°C 25°C 125°C 0°C -40°C 0.1 0.0 0.01 0.01 1 10 100 1000 FREQUENCY (kHz) 0 100 200 300 400 500 600 700 800 ILOAD (mA) FIGURE 2-2: Output Noise vs. Frequency. FIGURE 2-5: ILOAD. 3.030 3.020 3.010 3.000 3.0V Dropout Voltage vs. 0.0100 0.0090 LOAD REGULATION (%/mA) 0.0080 0.0070 ILOAD = 0.1 mA ILOAD = 300 mA ILOAD = 500 mA VOUT (V) 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 -40°C 0°C 25°C 70°C 85°C 125°C VOUT = 3V 1 mA to 800 mA 2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 -40°C 0°C 25°C ILOAD = 800 mA 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-3: Temperature. Load Regulation vs. FIGURE 2-6: 3.0V VOUT vs.Temperature. DS21375C-page 4 © 2006 Microchip Technology Inc. TC1264 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. 3-Pin SOT-223 3-Pin TO-220 3-Pin DDPAK 1 2 3 PIN FUNCTION TABLE Symbol Description VIN GND VOUT Unregulated supply input Ground terminal Regulated voltage output. 3.1 Unregulated Supply (VIN) 3.3 Regulated Output Voltage (VOUT) Unregulated supply input. Regulated voltage output. 3.2 Ground (GND) Ground terminal. © 2006 Microchip Technology Inc. DS21375C-page 5 TC1264 4.0 DETAILED DESCRIPTION 4.1 Output Capacitor The TC1264 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1264’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to ILOADMAX load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 4-1 shows a typical application circuit. A 1 µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5Ω. A 1 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. FIGURE 4-1: TYPICAL APPLICATION CIRCUIT VIN VOUT VOUT VIN + TC1264 GND SHDN C1 1 µF DS21375C-page 6 © 2006 Microchip Technology Inc. TC1264 5.0 5.1 THERMAL CONSIDERATIONS Thermal Shutdown TABLE 5-2: Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. THERMAL RESISTANCE GUIDELINES FOR TC1264 IN 3-PIN DDPAK/TO-220 PACKAGE Copper Area (Backside) Board Area Thermal Resistance (θJA) 25°C/W 27°C/W 35°C/W Copper Area (Topside)* 5.2 Power Dissipation 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 125 sq mm 2500 sq mm 2500 sq mm The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst-case actual power dissipation: * Tab of device attached to topside copper Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V ± 10% VOUTMIN = 2.7V ± 0.5% ILOADMAX = 275 mA TJMAX = 125°C TAMAX = 95°C θJA = 59°C/W (SOT-223) Find: 1. Actual power dissipation. 2. Maximum allowable dissipation Actual power dissipation: P D ≈ ( V INMAX – V OUTMIN ) I LOADMAX P D = ( 3.3 × 1.1 ) – ( 2.7 × .995 ) 275 × 10 P D = 260 mW Maximum allowable power dissipation: T JMAX – T AMAX P DMAX = -------------------------------------θ JA ( 125 – 95 ) P DMAX = ------------------------59 P DMAX = 508 mW In this example, the TC1264 dissipates a maximum of 260 mW; below the allowable limit of 508 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN, is found by substituting the maximum allowable power dissipation of 508mW into Equation 5-1, from which VINMAX = 4.6V. –3 EQUATION 5-1: P D = ( V INMAX – V OUTMIN ) I LOADMAX Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). EQUATION 5-2: PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. Table 5-1 and Table 5-2 show various values of θJA for the TC1264 packages. TABLE 5-1: THERMAL RESISTANCE GUIDELINES FOR TC1264 IN SOT-223 PACKAGE Copper Area (Backside) Board Area Thermal Resistance (θJA) 45°C/W 45°C/W 53°C/W 59°C/W 52°C/W 55°C/W Copper Area (Topside)* 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 225 sq mm 100 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 0 sq mm 1000 sq mm 1000 sq mm 1000 sq mm 1000 sq mm * Tab of device attached to topside copper © 2006 Microchip Technology Inc. DS21375C-page 7 TC1264 6.0 6.1 PACKAGING INFORMATION Package Marking Information 3-Lead DDPAK Example XXXXXXXXX XXXXXXXXX YYWWNNN TC1264 e3 1.8VEB^^ 0643256 3-Lead SOT-223 Example XXXXXXX XXXYYWW NNN 1264-25 VDB0643 256 3-Lead TO-220 Example XXXXXXXXX XXXXXXXXX YYWWNNN TC1264 e3 3.0VAB^^ 0643256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS21375C-page 8 © 2006 Microchip Technology Inc. TC1264 3-Lead Plastic (EB) (DDPAK) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E L3 E1 D2 D D1 1 b e TOP VIEW b1 BOTTOM VIEW α (5X) c2 φ A1 c Units Dimension Limits Number of Pins Pitch Overall Height Standoff Overall Width Exposed Pad Width Molded Package Length Overall Length Exposed Pad Length Lead Thickness Pad Thickness Lower Lead Width Upper Lead Width Foot Length Pad Length Foot Angle Mold Draft Angle § e A A1 E E1 D D1 D2 c c2 b b1 L L3 φ α .170 .000 .385 .330 .549 .014 .045 .026 .049 .068 .045 -3° MIN L INCHES* NOM 3 1.00 BSC .177 .005 .398 .256 REF .350 .577 .303 REF .020 -.032 .050 ----.026 .055 .037 .051 .110 .067 8° 7° 0.36 1.14 0.66 1.24 1.73 1.14 -3° .183 .010 .410 .370 .605 4.32 0.00 9.78 8.38 13.94 MAX MIN MILLIMETERS NOM 3 2.54 BSC 4.50 0.13 10.11 6.50 REF 8.89 14.66 7.70 REF 0.51 -0.81 1.27 ----0.66 1.40 0.94 1.30 2.79 1.70 8° 7° 4.65 0.25 10.41 9.40 15.37 MAX A * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically, exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M Revised 07-19-05 JEDEC equivalent: TO-252 Drawing No. C04-011 © 2006 Microchip Technology Inc. DS21375C-page 9 TC1264 3-Lead Plastic Small Outline Transistor (DB) (SOT-223) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D b2 E1 E 1 e e1 α A2 A c φ b Units Dimension Limits MIN e e1 A A1 A2 E E1 D c b b2 L φ α β – .001 .061 .264 .130 .248 .009 .026 .114 .035 0° 10° 10° A1 INCHES NOM .091 BSC .181 BSC – – .063 .276 .138 .256 .012 .030 .118 – – – – .071 .004 .065 .287 .146 .264 .014 .033 .124 – 10° 16° 16° – 0.02 1.55 6.70 3.30 6.30 0.23 0.65 2.90 0.90 – 10° 10° MAX MIN L MILLIMETERS* NOM 2.30 BSC 4.60 BSC – – 1.60 7.00 3.50 6.50 0.30 0.76 3.00 – 0.37 – – β MAX Pitch Outside lead pitch (basic) Overall Height Standoff Molded Package Height Overall Width Molded Package Width Overall Length Lead Thickness Lead Width Tab Lead Width Foot Length Lead Angle Mold Draft Angle, Top Mold Draft Angle, Bottom 1.80 0.10 1.65 7.30 3.70 6.70 0.35 0.85 3.15 – 10° 16° 16° * Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M JEDEC Equivalent TO-261 AA Revised 09-13-05 Drawing No. C04-032 DS21375C-page 10 © 2006 Microchip Technology Inc. TC1264 3-Lead Plastic Transistor Outline (AB) (TO-220) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E/2 Q H1 D D1 α 5X A φP A1 E1 E3 D3 D2 D4 L1 BOTTOM: VARIANT A L b2 PIN 1 e e1 PIN n b c A2 BOTTOM: VARIANT B Number of Pins Pitch Overall Pin Pitch Overall Height Tab Thickness Base to Lead Overall Width Exposed Tab Width – (SEE BOTTOM VARIANT B) Hole Center to Tab Edge Overall Length Molded Package Length Exposed Tab Length – (SEE BOTTOM VARIANT B) – (SEE BOTTOM VARIANT B) Tab Length Mounting Hole Diameter Lead Length Lead Shoulder Foot Angle Lead Thickness Lead Width Shoulder Width *Controlling Parameter Notes: Units Dimension Limits n e e1 A A1 A2 E E1 E3 Q D D1 D2 D3 D4 H1 φP L L1 α c b b2 MIN .140 .020 .080 .380 .270 .251 .100 .560 .330 .480 .243 .303 .230 .139 .500 0 .012 .015 .045 INCHES* NOM 3 .100 BSC .200 BSC .256 .248 .308 .027 .057 MAX MIN .190 .055 .120 .420 .350 .261 .120 .650 .361 .507 .253 .313 .270 .156 .580 .250 8° .024 .040 .070 MILLIMETERS NOM 3 2.54 BSC 5.08 BSC 3.56 0.51 2.03 9.65 6.86 6.38 6.50 2.54 14.22 8.38 12.19 6.17 6.30 7.70 7.82 5.84 3.53 12.70 2.10 0 0.30 0.38 0.69 1.14 1.45 MAX 4.83 1.40 3.05 10.67 8.89 6.63 3.05 16.51 9.17 12.88 6.43 7.95 6.86 3.96 14.73 6.35 8° 0.61 1.02 1.78 Dimensions D1 and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M Drawing No. C04-158 © 2006 Microchip Technology Inc. DS21375C-page 11 TC1264 NOTES: DS21375C-page 12 © 2006 Microchip Technology Inc. TC1264 APPENDIX A: REVISION HISTORY Revision C (October 2006) • Section 1.0 “Electrical Characteristics”: Changed dropout voltage voltage typical value for IL = 500 mA from 700 to 1000 and maximum value from 1000 to 1200 for. Changed typical value for IL = 800 mA from 890 to 1200 • Section 6.0 “PackAging Information”: Added package marking information and package outline drawings • Added disclaimer to package outline drawings. Revision B (May 2002) • Not Documented Revision A (March 2002) • Original Release of this Document. © 2006 Microchip Technology Inc. DS21375C-page 13 TC1264 NOTES: DS21375C-page 14 © 2006 Microchip Technology Inc. TC1264 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X.XX Voltage Option XX Package XX Tape and Reel Examples: a) b) c) d) a) b) Voltage Option:* 1.8V 2.5V 3.0V 3.3V = = = = 1.8V 2.5V 3.0V 3.3V c) d) a) b) c) d) e) f) g) h) TC1264-1.8VAB TC1264-2.5VAB TC1264-3.0VAB TC1264-3.3VAB 1.8V LDO, TO-220-3 pkg. 2.5V LDO, TO-220-3 pkg. 3.0V LDO, TO-220-3 pkg. 3.3V LDO, TO-220-3 pkg. Device TC1264 Fixed Output CMOS LDO * Other output voltages are available. Please contact your local Microchip sales office for details. Package AB = DB = DBTR = EB = EBTR = Plastic (TO-220), 3-Lead Plastic (SOT-223), 3-lead Plastic (SOT-223), 3-lead, Tape and Reel Plastic Transistor Outline (DDPAK), 3-Lead Plastic Transistor Outline (DDPAK), 3-Lead, Tape and Reel TC1264-1.8VEBTR 1.8V LDO, DDPAK-3 pkg., Tape and Reel TC1264-2.5VEBTR 2.5V LDO, DDPAK-3 pkg., Tape and Reel TC1264-3.0VEBTR 3.0V LDO, DDPAK-3 pkg., Tape and Reel TC1264-3.3VEBTR 3.3V LDO, DDPAK-3 pkg., Tape and Reel TC1264-1.8VDB 1.8V LDO, SOT-223 pkg. TC1264-1.8VDBTR 1.8V LDO, SOT-223 pkg., Tape and Reel TC1264-2.5VDB 2.5V LDO, SOT-223 pkg. TC1264-2.5VDBTR 2.5V LDO, SOT-223 pkg., Tape and Reel TC1264-3.0VDB 3.0V LDO, SOT-223 pkg. TC1264-3.0VDBTR 3.0V LDO, SOT-223 pkg., Tape and Reel TC1264-3.3VDB 3.3V LDO, SOT-223 pkg. TC1264-3.3VDBTR 3.3V LDO, SOT-223 pkg., Tape and Reel © 2006 Microchip Technology Inc. DS21375C-page 15 TC1264 NOTES: DS21375C-page 16 © 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” • • Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2006 Microchip Technology Inc. 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