TC1264

TC1264 800mA Fixed Output CMOS LDO Features • • • • • Very Low Dropout Voltage 800mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Over Current and Over Temperature Protection Package Type 3-Pin TO-220 TAB IS GND 3-Pin DDPAK FRONT VIEW TAB IS GND TC1264 TC1264 Applications • • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers 1 2 3 1 2 3 VOUT VIN GND 3-Pin SOT-223 FRONT VIEW 3 TAB IS GND VOUT 2 GND Device Selection Table Part Number TC1264-xxVDB TC1264-xxVAB TC1264-xxVEB Package 3-Pin SOT-223 3-Pin TO-220 3-Pin DDPAK Junction Temp. Range -40°C to +125°C -40°C to +125°C -40°C to +125°C 1 VIN TC1264 General Description The TC1264 is a fixed output, high accuracy (typically ±0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1264’s CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80µA at full load (20 to 60 times lower than in bipolar regulators). TC1264 key features include ultra low noise operation, very low dropout voltage (typically 450mV at full load), and fast response to step changes in load. The TC1264 incorporates both over temperature and over current protection. The TC1264 is stable with an output capacitor of only 1µF and has a maximum output current of 800mA. It is available in 3-Pin SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages. NOTE: xx indicates output voltages. Available Output Voltages: 1.8, 2.5, 3.0, 3.3. Other output voltages are available. Please contact Microchip Technology Inc. for details. Typical Application VIN VIN VOUT C1 1µF VOUT TC1264 GND 2002 Microchip Technology Inc. DS21375B-page 1 VOUT VIN GND © TC1264 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 8) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature.......................... -65°C to +150°C TC1264 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VR + 1.5V, (Note 1), IL = 100µ A, CL = 3.3µ F, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol VIN IOUTMAX VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage Min 2.7 800 Typ — — Max 6.0 — Units V mA V V ppm/°C % %/mA mV VR ≥ 2.5V VR = 1.8V IL = 0.1mA to 800mA (Note 3) Note 4 (VR + 1V) ≤ VIN ≤ 6V IL = 0.1mA to IOUTMAX (Note 5) VR ≥ 2.5V, IL = 100µA IL = 100mA IL = 300mA IL = 500mA IL = 800mA VR = 1.8V, IL = 500mA IL = 800mA (Note 6) IL = 0 F ≤ 1kHz VOUT = 0V Note 7 IL = IOUTMAX, F = 10kHz Test Conditions Note 2 VR – 2.5% VR ± 0.5% VR + 2.5% VR – 2% VR ± 0.5% VR + 3% VR – 7% — 40 0.007 0.002 20 50 150 260 450 700 890 80 64 1200 0.04 260 VR + 3% — 0.35 0 30 160 480 800 1300 1000 1400 130 — — — — — — -0.01 — — — — — — — — — — — — ∆VOUT/∆T ∆VOUT/∆VIN ∆VOUT/VOUT VIN-VOUT VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage IDD PSRR IOUTSC ∆VOUT/∆PD eN Note 1: 2: 3: 4: 5: Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise µA dB mA V/W nV/√Hz 6: 7: 8: VR is the regulator output voltage setting. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX. This accuracy represents the worst case over the entire output current and temperature range. TC VOUT = (VOUT MAX – VOUT MIN) x 10 6 VOUT x ∆T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θ JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. © DS21375B-page 2 2002 Microchip Technology Inc. TC1264 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (3-Pin SOT-223) (3-Pin TO-220) (3-Pin DDPAK) 1 2 3 PIN FUNCTION TABLE Symbol Description VIN GND VOUT Unregulated supply input. Ground terminal. Regulated voltage output. 3.0 DETAILED DESCRIPTION 3.1 Output Capacitor The TC1264 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1264’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to ILOADMAX load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT + VIN C1 1µF VOUT + VOUT C2 1µF + Battery – TC1264 GND A 1µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5Ω. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 2002 Microchip Technology Inc. DS21375B-page 3 © TC1264 4.0 4.1 THERMAL CONSIDERATIONS Thermal Shutdown TABLE 4-2: Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. THERMAL RESISTANCE GUIDELINES FOR TC1264 IN 3-PIN DDPAK/TO-220 PACKAGE Copper Area (Backside) Board Area Thermal Resistance (θJA) 25°C/W 27°C/W 35°C/W Copper Area (Topside)* 4.2 Power Dissipation 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 125 sq mm 2500 sq mm 2500 sq mm The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: *Tab of device attached to topside copper Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V ± 10% VOUTMIN = 2.7V ± 0.5% ILOADMAX = 275mA TJMAX TAMAX θJA = 125°C = 95°C = 59°C/W (SOT-223) EQUATION 4-1: PD ≈ (VINMAX – VOUTMIN)ILOADMAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.3 x 1.1) – (2.7 x .995)]275 x 10 –3 = 260mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) θJA = (125 – 95) 59 = 508mW In this example, the TC1264 dissipates a maximum of 260mW; below the allowable limit of 508mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN, is found by substituting the maximum allowable power dissipation of 508mW into Equation 4-1, from which VINMAX = 4.6V. EQUATION 4-2: PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. Table 4-1 and Table 4-2 show various values of θJA for the TC1264 packages. TABLE 4-1: THERMAL RESISTANCE GUIDELINES FOR TC1264 IN SOT-223 PACKAGE Copper Area (Backside) Board Area Thermal Resistance (θJA) 45°C/W 45°C/W 53°C/W 59°C/W 52°C/W 55°C/W Copper Area (Topside)* 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 225 sq mm 100 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 0 sq mm 1000 sq mm 1000 sq mm 1000 sq mm 1000 sq mm *Tab of device attached to topside copper © DS21375B-page 4 2002 Microchip Technology Inc. TC1264 5.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Line Regulation vs. Temperature 0.020 0.018 LINE REGULATION (%) Output Noise vs. Frequency 10.0 LOAD REGULATION (%/mA) Load Regulation vs. Temperature 0.0100 0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 VOUT = 3V 1mA to 800mA RLOAD = 50µΩ COUT = 1µF 0.016 NOISE (µV/√Hz) 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40°C 0°C 25°C 70°C 85°C 125°C 1.0 0.1 0.0 0.01 0.01 1 10 100 1000 0.0100 -40°C 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) FREQUENCY (kHz) TEMPERATURE (°C) IDD vs. Temperature 150 135 120 105 0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0°C 25°C 70°C 85°C 125°C 0.000 -40°C 125°C LOAD 3.030 3.020 3.010 3.000 3.0V VOUT vs. Temperature ILOAD = 0.1mA DROPOUT VOLTAGE (V) 90 75 60 45 30 15 0 -40°C VOUT (V) 2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 -40°C ILOAD = 300mA ILOAD = 500mA IDD (µA) VOUT = 3V 0°C ILOAD = 800mA 0 100 200 300 400 500 600 700 800 ILOAD (mA) 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C) 2002 Microchip Technology Inc. DS21375B-page 5 © TC1264 6.0 6.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 3-Pin SOT-223 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 3-Pin SOT-223 12 mm 8 mm 4000 13 in Component Taping Orientation for 3-Pin DDPAK Devices PIN 1 User Direction of Feed Device Marking W P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 3-Pin DDPAK 24 mm 16 mm 750 13 in © DS21375B-page 6 2002 Microchip Technology Inc. TC1264 6.3 Package Dimensions 3-Pin SOT-223 .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30) PIN 1 .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) MAX. .004 (0.10) .001 (0.02) .181 (4.60) TYP. .041 (1.04) .033 (0.84) 10° MAX. .036 (0.91) MIN. .013 (0.33) .009 (0.24) Dimensions: inches (mm) 3-Pin TO-220 .185 (4.70) .165 (4.19) .113 (2.87) .103 (2.62) .410 (10.41) .357 (9.06) .156 (3.96) .146 (3.71) DIA. .055 (1.40) .045 (1.14) .258 (6.55) .230 (5.84) .594 (15.09) .569 (14.45) 3° - 7.5° 5 PLCS. .244 (6.20) .234 (5.94) .560 (14.22) .518 (13.16) .055 (1.40) .045 (1.14) .037 (0.94) .027 (0.69) PIN 1 .105 (2.67) .095 (2.41) .205 (5.21) .195 (4.95) Dimensions: inches (mm) .020 (0.51) .012 (0.30) .115 (2.92) .095 (2.41) 2002 Microchip Technology Inc. DS21375B-page 7 © TC1264 6.3 Package Dimensions (Continued) 3-Pin DDPAK .410 (10.41) .385 (9.78) .067 (1.70) .045 (1.14) 3° - 7° (5x) .010 (0.25) .000 (0.00) .051 (1.30) .049 (1.24) .037 (0.94) .026 (0.66) .100 (2.54) TYP. 8° MAX. Dimensions: inches (mm) .026 (0.66) .014 (0.36) .110 (2.79) .068 (1.72) .183 (4.65) .170 (4.32) .055 (1.40) .045 (1.14) .370 (9.40) .330 (8.38) .605 (15.37) .549 (13.95) PIN 1 © DS21375B-page 8 2002 Microchip Technology Inc. TC1264 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002 Microchip Technology Inc. DS21375B-page 9 TC1264 NOTES: DS21375B-page 10  2002 Microchip Technology Inc. TC1264 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. 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