TC1683

M Features • • • • • • • TC1682/TC1683/TC1684 General Description The TC1682/TC1683/TC1684 are CMOS charge pump converters that provide an inverted doubled output from a single positive supply. An on-board oscillator provides the clock and only three external capacitors are required for full circuit implementation. Switching frequencies are 12kHz for the TC1682, 35kHz for the TC1683, and 125kHz for the TC1684. When the SHDN pin is held at a logic high, the device goes into a very low power mode of operation consuming less than 1µA (typ) of supply current. Low output source impedance (typically 120Ω), provides output current up to 10mA. The TC1682/ TC1683/TC1684 feature a 1.8V to 5.5V operating voltage range and high efficiency, which make them an ideal choice for a wide variety of applications requiring a negative doubled voltage derived from a single positive supply (for example: generation of -7.2V from a +3.6V lithium cell or -10V generated from a +5V logic supply). The minimum external part count, small physical size and shutdown mode feature make this family of products useful for a wide variety of negative bias power supply applications. Operating Temp. Range -40°C to +85°C -40°C to +85°C -40°C to +85°C + C2 C2– Inverting Charge Pump Voltage Doublers with Active High Shutdown Small 8-Pin MSOP Package Operates from 1.8V to 5.5V 120 Ohms (typ) Output Resistance 99% Voltage Conversion Efficiency Only 3 External Capacitors Required Power-Saving Shutdown Mode Low Active Supply Current - 95µA (typ) for TC1682 - 225µA (typ) for TC1683 - 700µA (typ) for TC1684 • Fully Compatible with 1.8V Logic Systems Applications • • • • • LCD Panel Bias Cellular Phones PA Bias Pagers PDAs, Portable Data Loggers Battery-Powered Devices Device Selection Table Part Number TC1682EUA TC1683EUA TC1684EUA Package 8-Pin MSOP 8-Pin MSOP 8-Pin MSOP Osc. Freq. (kHz) 12 35 125 Functional Block Diagram + C1 C1+ C1– C2+ VIN SHDN Input OFF ON Package Type 8-Pin MSOP C1– C2+ C2– VOUT 1 2 3 4 8 SHDN C1+ VIN GND TC1682 TC1683 TC1684 VOUT GND VOUT = -(2 x VIN) –C OUT + TC1682 TC1683 TC1684 7 6 5 C1 must have a voltage rating ≥ VIN C2 and COUT must have a voltage rating ≥ 2VIN  2002 Microchip Technology Inc. DS21537B-page 1 TC1682/TC1683/TC1684 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage (VIN to GND)....................... +6.0V, -0.3V Output Voltage (VOUT to GND)............... -12.0V, +0.3V Current at VOUT Pin.............................................20mA Short-Circuit Duration VOUT to GND ..............Indefinite Power Dissipation (TA ≤ 70°C) 8-Pin MSOP .............................................320mW Operating Temperature Range.............-40°C to +85°C Storage Temperature (Unbiased) .......-65°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1682/TC1683/TC1684 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = -40°C to +85°C, VIN = +5V, C1 = C2 = 3.3µF (TC1682), C1 = C2 = 1µF (TC1683), C1 = C2 = 0.33µF (TC1684), SHDN = GND, Typical values are at TA = +25°C Symbol IDD Parameter Supply Current Min — — — — 1.8 — 8.4 24.5 65 1.4 — 95 — — — — Typ 95 225 700 0.5 — — 12 35 125 — — 99 120 1800 600 200 Max 160 480 1500 2 — 5.5 15.6 45.5 170 — 0.4 — 170 — — — Units µA Device TC1682 TC1683 TC1684 All All All TC1682 TC1683 TC1684 All All All All TC1682 TC1683 TC1684 Test Conditions ISHDN VMIN VMAX FOSC Shutdown Supply Current Minimum Supply Voltage Maximum Supply Voltage Oscillator Frequency µA SHDN = VIN = +5V RLOAD = 1kΩ RLOAD = 1kΩ V V kHz VIH VIL VEFF ROUT TWK SHDN Input Logic High SHDN Input Logic Low Voltage Conversion Efficiency Output Resistance Wake-up Time From Shutdown Mode V V % Ω µsec VIN = VMIN to VMAX VIN = VMIN to VMAX RLOAD = ∞ ILOAD = 0.5mA to 10mA (Note 1) RLOAD = 2kΩ Note 1: Capacitor contribution is approximately 20% of the output impedance (ESR = 1/ pump frequency x capacitance). DS21537B-page 2  2002 Microchip Technology Inc. TC1682/TC1683/TC1684 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin MSOP) 1 2 3 4 5 6 7 8 PIN FUNCTION TABLE Symbol C1– C2+ C2– VOUT GND VIN C1+ SHDN Description C1 commutation capacitor negative terminal. C2 commutation capacitor positive terminal. C2 commutation capacitor negative terminal. Doubling inverting charge pump output (-2 x VIN). Ground. Positive power supply input. C1 commutation capacitor positive terminal. Shutdown input (active high).  2002 Microchip Technology Inc. DS21537B-page 3 TC1682/TC1683/TC1684 3.0 DETAILED DESCRIPTION The TC1682/TC1683/TC1684 inverting charge pump converters perform a -2x multiplication of the voltage applied to the VIN pin. Conversion is performed using two synchronous switching matrices and three external capacitors. When the shutdown input is held at a logic high, the device goes into a very low power mode of operation consuming less than 1µA of supply current. Figure 3-1 is a block diagram representation of the TC1682/TC1683/TC1684 architecture. The first switching stage inverts the voltage present at VIN and the second stage uses the ‘-VIN’ output generated from the first stage to produce the ‘-2X’ output function from the second stage switching matrix. Each device contains an on-board oscillator that synchronously controls the operation of the charge pump switching matrices. The TC1682 synchronously switches at 12kHz, the TC1683 synchronously switches at 35kHz, and the TC1684 synchronously switches at 125kHz. The different oscillator frequencies for this device family allow the user to trade-off capacitor size versus supply current. Faster oscillators can use smaller external capacitors, but will consume more supply current (see Section 1.0 Electrical Characteristics). When the shutdown input is in a high state, the oscillator and both switch matrices are powered off placing the TC1682/TC1683/TC1684 in the shutdown mode. When the VIN supply input is powered from an external battery, the shutdown mode minimizes power consumption, which in turn will extend the life of the battery. FIGURE 3-1: TC1682/TC1683/TC1684 ARCHITECTURE VIN + C1 Switch Matrix (1st Stage) ENABLE -VIN Oscillator ENABLE + C2 Switch Matrix (2nd Stage) VOUT = -2VIN COUT + ENABLE SHDN DS21537B-page 4  2002 Microchip Technology Inc. TC1682/TC1683/TC1684 4.0 4.1 APPLICATIONS INFORMATION Output Voltage Considerations 4.3 Input Supply Bypassing The TC1682/TC1683/TC1684 perform inverting voltage conversions but do not provide any type of regulation. The output voltage will droop in a linear manner with respect to the output load current. The value of the equivalent output resistance is approximately 120Ω nominal at +25°C and VIN = +5V. In this particular case, the output is approximately -10V at very light loads and will droop according to the equation below: VDROOP = IOUT x ROUT The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. It is recommended that a large value capacitor (at least equal to C1) be connected from VIN to GND for optimal circuit performance. 4.4 Shutdown Input 4.2 Capacitor Selection The TC1682/TC1683/TC1684 is enabled when SHDN is low, and disabled when SHDN is high. This input cannot be allowed to float. (If SHDN is not required, see the TC2682/TC2683/TC2684 data sheet.) The SHDN input should be limited to 0.3V above VIN. In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 and C2 will lower the output resistance and larger values of COUT will reduce output ripple. Note: For proper charge pump operation, C1 must have a voltage rating greater than or equal to VIN, while C2 and COUT must have a voltage rating greater than or equal to 2VIN. 4.5 Inverting Voltage Doubler The most common application for the TC1682/TC1683/ TC1684 devices is the inverting voltage doubler (Figure 4-1). This application uses three external capacitors: C1, C2 and COUT. Note: A power supply bypass capacitor is recommended. The output is equal to -2VIN plus any voltage drops due to loading. Refer to Table 4-1 and Table 4-2 for capacitor selection guidelines. Table 4-1 shows various values of C1/C2 and the corresponding output resistance values for VIN = 5V @ +25°C. Table 4-2 shows the output voltage ripple for various values of COUT (again assuming VIN = 5V @ +25°C). The VRIPPLE values assume a 1mA output load current and a 0.1Ω ESRCOUT. FIGURE 4-1: VIN CIN INVERTING VOLTAGE DOUBLER TEST CIRCUIT + 6 VIN 8 SHDN + 7 C1+ TABLE 4-1: C1, C2 (µF) 0.33 1 3.3 OUTPUT RESISTANCE VS. C1/C2 (ESR = 0.1Ω) TC1682 ROUT(Ω) 633 262 120 TC1683 ROUT(Ω) 184 120 95 TC1684 ROUT(Ω) 120 102 84 C1 1 + C2 3 C2– 2 C1– C2+ TC1682 TC1683 TC1684 VOUT GND 5 4 COUT + RL VOUT TABLE 4-2: OUTPUT VOLTAGE RIPPLE VS. COUT2 (ESR = 0.1Ω) IOUT = 1mA TC1682 VRIPPLE (mV) 192 63 17 TC1683 VRIPPLE (mV) 60 21 8 TC1684 VRIPPLE (mV) 27 16 7 Device TC1682 TC1683 TC1684 CIN 3.3µF 1µF 0.33µF C1 3.3µF 1µF 0.33µF C2 3.3µF 1µF 0.33µF COUT 3.3µF 1µF 0.33µF 4.6 Layout Considerations COUT (µF) 0.33 1 3.3 As with any switching power supply circuit, good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry.  2002 Microchip Technology Inc. DS21537B-page 5 TC1682/TC1683/TC1684 5.0 5.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in 5.3 Package Dimensions 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) 6° MAX. .028 (0.70) .016 (0.40) .008 (0.20) .005 (0.13) Dimensions: inches (mm) DS21537B-page 6  2002 Microchip Technology Inc. TC1682/TC1683/TC1684 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002 Microchip Technology Inc. DS21537B-page7 TC1682/TC1683/TC1684 NOTES: DS21537B-page8  2002 Microchip Technology Inc. TC1682/TC1683/TC1684 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.  2002 Microchip Technology Inc. DS21537B-page 9 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Hong Kong Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/01/02 ' " $ ' DS21537B-page 10  2002 Microchip Technology Inc.